Packaging substrate and communication equipment

Abstract

The present application provides a packaging substrate and a communication device. The packaging substrate includes a packaging body, a first circuit layer, a second circuit layer, an electronic component and a moisture-proof structure. The packaging body includes a top surface and a bottom surface arranged opposite to each other, the first circuit layer is arranged on the top surface of the packaging body, and the second circuit layer is arranged on the bottom surface of the packaging body. The electronic component is packaged inside the packaging body. The moisture-proof structure is arranged in the packaging body and connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. The technical solution of the present application can prevent external water vapor from entering the interior of the packaging substrate from the peripheral side of the packaging substrate, and effectively prevent the failure of the packaging substrate due to moisture absorption.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to a packaging substrate and communication equipment. Background Art

[0002] As electronic products develop towards miniaturization, lightness and multifunctionality, chip embedded packaging substrates have become a research hotspot in the field of electronic component packaging technology. After the existing chip is embedded in the substrate, external water vapor can easily enter the inside of the packaging substrate from the peripheral side of the packaging substrate, causing the packaging substrate to fail due to moisture absorption. Summary of the invention

[0003] The embodiments of the present application provide a packaging substrate and a communication device, which can prevent external water vapor from entering the interior of the packaging substrate from the peripheral side of the packaging substrate, and effectively prevent the failure of the packaging substrate due to moisture absorption.

[0004] In a first aspect, the present application provides a packaging substrate, including:

[0005] A package body, the package body comprising a top surface and a bottom surface disposed opposite to each other;

[0006] A first circuit layer and a second circuit layer, wherein the first circuit layer is arranged on the top surface of the package body, and the second circuit layer is arranged on the bottom surface of the package body;

[0007] An electronic component, wherein the electronic component is packaged inside the packaging body;

[0008] A moisture-proof structure is provided in the packaging body and connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component.

[0009] It is understandable that the package body made of packaging materials has a certain degree of hygroscopicity, which may absorb moisture from the external environment. The electronic component is a structure encapsulated in the package body. At the junction of the pins of the electronic component and the package body, it is easy to produce fine stratification. After absorbing moisture, these fine stratifications are easy to form leakage channels and make the package substrate fail when powered on. Therefore, a moisture-proof structure is set and the moisture-proof structure can be arranged in an enclosing structure on the periphery of the electronic component, so that the electronic component can be within the protection range of the moisture-proof structure, that is, the electronic component is located on the inner side of the moisture-proof structure, and can have good moisture-proof performance due to the protection of the moisture-proof structure, which is conducive to better guaranteeing its electrical performance. In addition, the enclosing structure can give full play to its characteristics of blocking external moisture from all directions, and maximize the moisture-proof protection effect. Because the moisture-proof structure is also connected between the first circuit layer and the second circuit layer, the height of the moisture-proof structure can completely occupy the height range between the first circuit layer and the second circuit layer, that is, the height of the moisture-proof structure can completely adapt to the height range of the package, playing a strict blocking role, and reducing the possibility of external moisture passing through the moisture-proof structure and further penetrating into the interior of the package to a minimum.

[0010] In other words, the setting of the moisture-proof structure, on the one hand, defines the inner side of the moisture-proof structure as an area that moisture cannot enter, so that even if moisture gathers from the outer side of the moisture-proof structure to the position of the moisture-proof structure, due to the moisture-proof characteristics of the moisture-proof structure, it cannot pass through the protection of the moisture-proof structure and enter the area defined by the moisture-proof structure for protection, which can effectively prevent external moisture from entering the inside of the packaging substrate from the side of the packaging substrate, and prevent the packaging substrate from failing due to moisture absorption, and has excellent moisture-proof performance. On the other hand, it can make the packaging substrate as a whole have better environmental adaptability and can cope with complex and changeable environmental changes, so that even in a humid and hot external environment, the packaging substrate can have good moisture-proof performance and effectively isolate external moisture, dust, etc., with strong reliability and good practicality.

[0011] In a possible implementation manner, the moisture-proof structure is a continuously extending closed ring structure.

[0012] Thus, the moisture-proof structure can present a continuous surrounding structure, and the continuous surrounding structure can give full play to its sealing performance, and strictly block the external moisture from the outside, which is beneficial to ensure the overall electrical performance of the packaging substrate.

[0013] Alternatively, the moisture-proof structure comprises a plurality of sub-moisture-proof structures, the plurality of sub-moisture-proof structures are staggered, and two adjacent sub-moisture-proof structures are at least partially overlapped.

[0014] Exemplarily, the arrangement of multiple sub-moisture-proof structures may present a four-sided staggered form. It should be understood that the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures located on the same side may be understood as, on a reference plane parallel to the same side, the orthographic projection of one sub-moisture-proof structure on this reference plane at least partially falls within the orthographic projection range of another sub-moisture-proof structure on this reference plane. The at least partial overlapping arrangement of two adjacent sub-moisture-proof structures may refer not only to the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures located on the same side, but also to the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures located at a corner.

[0015] Thus, the multiple sub-moisture-proof structures can present a discontinuous surrounding structure, and there is no direct connection between two adjacent sub-moisture-proof structures, and they can be arranged in a staggered manner. The at least partial overlapping arrangement of two adjacent sub-moisture-proof structures can make the outer contour formed by the multiple sub-moisture-proof structures generally present a ring-shaped surrounding form, that is, the multiple sub-moisture-proof structures can present a staggered blocking form, which is conducive to minimizing the possibility of moisture absorption failure of the packaging substrate caused by external moisture infiltration.

[0016] It should be noted that the arrangement of multiple sub-moisture-proof structures is not limited to the possibilities described above. It can also be one side continuous and three sides staggered, two sides continuous and two sides staggered, or three sides continuous and one side staggered. The staggered and continuous arrangement combinations are not listed here, but it should be understood that they are not limited to this.

[0017] In a possible implementation, the moisture-proof structure is embedded in the package. It should be understood that being embedded in the package can be understood as the moisture-proof structure being completely disposed inside the package. That is, the inside of the moisture-proof structure is the electronic component, and the outside of the moisture-proof structure is still provided with a circle of packaging material of the package. In other words, the moisture-proof structure is still at a certain distance from the surrounding side of the package.

[0018] Therefore, the moisture-proof structure is completely arranged inside the package, so that even if moisture gathers from the part of the package arranged outside the moisture-proof structure to the position of the moisture-proof structure, due to the moisture-proof characteristics of the moisture-proof structure, it cannot pass through the protection of the moisture-proof structure and enter the pins of the electronic components and the fine stratification of the package, which can effectively prevent the failure of the package substrate due to moisture absorption and has excellent moisture-proof performance.

[0019] Alternatively, at least a portion of the moisture-proof structure is exposed on a side of the packaging body.

[0020] Therefore, the moisture-proof structure can strictly block the moisture of the external environment outside the package body, further preventing the moisture of the external environment from entering the interior of the package body, which is beneficial to ensuring the electrical performance of the package substrate.

[0021] In a possible implementation, the packaging body includes a frame and a packaging layer, the frame is provided with a cavity, the electronic component is accommodated in the cavity, the frame further includes a first surface and a second surface disposed opposite to each other, the packaging layer is filled in the cavity to encapsulate the electronic component and cover the first surface and the second surface, and the surface of the packaging layer away from the frame forms the top surface and the bottom surface;

[0022] The moisture-proof structure comprises a frame retaining wall and a packaging retaining wall, wherein the frame retaining wall is arranged on the frame, and the packaging retaining wall is arranged on the packaging layer;

[0023] The encapsulation retaining wall is connected between the frame retaining wall and the first circuit layer and between the frame retaining wall and the second circuit layer, and the orthographic projection of the encapsulation retaining wall on the first surface at least partially falls within the range of the orthographic projection of the frame retaining wall on the first surface; or,

[0024] The packaging retaining wall is connected between the first surface and the first circuit layer and between the second surface and the second circuit layer, and the packaging retaining wall and the frame retaining wall are staggered; or,

[0025] The packaging retaining wall is connected between the first surface and the first circuit layer and between the second surface and the second circuit layer, and the packaging retaining wall is adjacent to the frame retaining wall.

[0026] It can be understood that the frame retaining wall and the packaging retaining wall together constitute a moisture-proof structure. Since the moisture-proof structure may only have a moisture-proof function but not a function of electrically connecting the first circuit layer and the second circuit layer, the specific locations of the frame retaining wall and the packaging retaining wall can have various possibilities. This setting can further increase the manufacturing freedom of the moisture-proof structure, which is beneficial to reduce the difficulty of manufacturing the packaging substrate.

[0027] Thus, on the one hand, it can ensure that the moisture-proof structure can be tightly arranged between the first circuit layer and the second circuit layer, and the possibility of the problem of failure of the packaging substrate due to moisture absorption can be minimized because the moisture-proof structure is not tightly connected to the first circuit layer and the second circuit layer, which causes external moisture to penetrate into the packaging substrate from the place where the connection is not tight, and on the other hand, each side of the side of the packaging body can effectively block moisture from all directions due to the moisture-proof structure, further improving the moisture-proof performance of the packaging substrate.

[0028] In a possible implementation, the electronic component is a chip, and the packaging substrate further includes a signal shielding structure provided on the frame, wherein the signal shielding structure is located between the packaging retaining wall and the chamber and surrounds the chamber.

[0029] It can be understood that setting up a signal shielding structure can avoid signal interference, ensure the accuracy of chip signal transmission, and improve the stability of the chip during operation, thereby minimizing the possibility of abnormalities during operation of the packaging substrate and fully ensuring the stability of the packaging substrate operation.

[0030] In a possible implementation manner, the signal shielding structure is a continuously extending closed ring structure.

[0031] Therefore, the signal shielding structure can be arranged around the periphery of the cavity where the chip is provided to present a continuous surrounding structure. The continuous surrounding structure can give full play to its sealing performance, play a good role in shielding signal interference, and is conducive to ensuring the overall electrical performance of the packaging substrate.

[0032] Alternatively, the signal shielding structure includes a shielding baffle wall and a shielding top cover, wherein the shielding baffle wall is arranged outside the chamber, and at least a portion of the shielding top cover is located inside the chamber and connected to one end of the shielding baffle wall.

[0033] Exemplarily, the arrangement of multiple sub-signal shielding structures may present a four-sided staggered form. It should be understood that the at least partial overlapping arrangement of two adjacent sub-signal shielding structures located on the same side may be understood as, on a reference plane parallel to the same side, the orthographic projection of one sub-signal shielding structure on this reference plane at least partially falls within the orthographic projection range of another sub-signal shielding structure on this reference plane. The at least partial overlapping arrangement of two adjacent sub-signal shielding structures may refer not only to the at least partial overlapping arrangement of two adjacent sub-signal shielding structures located on the same side, but also to the at least partial overlapping arrangement of two adjacent sub-signal shielding structures located at a corner.

[0034] Thus, multiple sub-signal shielding structures can be arranged around the periphery of the chamber where the chip is arranged to present an intermittent surrounding structure, and there is no direct connection between two adjacent sub-signal shielding structures, and they can be arranged in a staggered position. The at least partial overlapping arrangement of two adjacent sub-signal shielding structures can make the outer contour formed by the multiple sub-signal shielding structures generally present an annular surrounding form, that is, the multiple sub-signal shielding structures can present a staggered blocking form, which is conducive to minimizing the possibility of moisture infiltration from the outside and causing moisture absorption failure of the packaging substrate.

[0035] It should be noted that the arrangement of multiple sub-signal shielding structures is not limited to the possibilities described above. It can also be one side continuous and three sides staggered, two sides continuous and two sides staggered, or three sides continuous and one side staggered. The staggered and continuous arrangement combinations are not listed here, but it should be understood that they are not limited to this.

[0036] In a possible implementation manner, the packaging substrate further includes a conductive column disposed on the frame, and the frame further includes a peripheral side surface connecting the first surface and the second surface;

[0037] The conductive post is located outside the cavity and is electrically connected between the first circuit layer and the second circuit layer. The distance between the conductive post and the peripheral side surface of the frame is greater than the distance between the moisture-proof retaining wall and the frame.

[0038] It is understandable that the conductive posts can form an electrical connection relationship between the first circuit layer and the second circuit layer, so the electronic components can be interconnected on both sides through the conductive posts.

[0039] Therefore, setting up the conductive posts can realize double-sided interconnection of electronic components, which is beneficial to shorten the wiring distance and maximize the short-distance transmission path. It can effectively carry better power with a smaller area or volume, and can improve the overall power density, arrangement density and integration level of the packaging substrate.

[0040] In a possible implementation manner, the package body further includes a metal layer, the metal layer is embedded in a middle position of the frame in a thickness direction, and the metal layer extends in a direction parallel to the package substrate.

[0041] Therefore, by adding an extra metal layer in the middle position of the frame in the thickness direction, the structural characteristics of the metal layer can, on the one hand, make the frame as a whole have good heat dissipation performance, thereby significantly improving the overall heat dissipation performance and stability of the packaging substrate; on the other hand, it can increase the overall mechanical strength of the frame, making the frame less likely to be deformed by external forces, thereby improving the overall mechanical strength of the packaging substrate.

[0042] In a possible implementation manner, the metal layer intersects with the conductive pillar, and the metal layer is electrically connected to the conductive pillar.

[0043] It is understandable that the metal layer can be arranged as a circuit layer and provide a certain routing design. Since the metal layer is connected to the conductive posts that can achieve double-sided interconnection, the metal layer can be made into an interconnection circuit according to actual design needs and form a signal shielding layer on the upper and lower surfaces (first surface and second surface). As a result, the metal layer can take into account the improvement of heat dissipation performance, mechanical strength and routing design, with multiple performance, strong flexibility and a wide range of applications.

[0044] It should be noted that when the metal layer is arranged as a circuit layer, it can be designed as a non-continuously extended layer structure, that is, a discontinuous layer structure design. The discontinuous structure design can leave a certain loop for double-sided interconnection, thereby ensuring the reliability of double-sided interconnection.

[0045] In a possible implementation manner, the package substrate further includes a first solder mask layer and a second solder mask layer;

[0046] The first solder resist layer is disposed on a surface of the first circuit layer away from the package body and covers a top surface of the package body not covered by the first circuit layer, the first solder resist layer is provided with a first opening, and the first opening exposes a portion of the first circuit layer so that the exposed portion of the first circuit layer forms a first pad of the package substrate;

[0047] The second solder resist layer is arranged on the surface of the second circuit layer facing away from the package body and covers the bottom surface of the package body not covered by the second circuit layer. The second solder resist layer is provided with a second window, and the second window exposes a portion of the second circuit layer so that the exposed portion of the second circuit layer forms a second solder pad of the package substrate.

[0048] By setting the first circuit layer and the second circuit layer, on the one hand, the first circuit layer can cover part of the top surface of the package body, and the second circuit layer can cover part of the bottom surface of the package body, thereby preventing external moisture from entering the package body. On the other hand, both sides (top surface and bottom surface) of the package body can have circuit layers that can serve as electrical connections, which can provide a good foundation for the subsequent double-sided interconnection of electronic components encapsulated in the package body, and is conducive to realizing the shortest interconnection path in a localized spatial layout and realizing thin packaging of the package substrate, with strong practicality and good reliability.

[0049] By providing a first solder mask layer and a second cold-proof layer, and providing a first window on the first solder mask layer, and providing a second window on the second solder mask layer, the circuits and substrates that need to be welded in the package substrate can be exposed to form a first pad and a second pad, and the circuits and substrates that do not need to be welded in the package substrate can be shielded due to the solder resistance of the first solder mask layer and the second solder mask layer. On the one hand, it can avoid solder waste and prevent electrical short circuit problems caused by solder bridging in the welding process, which is beneficial to long-term protection of the formed circuit graphics. On the other hand, because the first solder mask layer and the second solder mask layer have good insulation properties, it is beneficial to prevent the occurrence of insulation deterioration, corrosion and other problems caused by external environmental factors such as dust and water vapor, and it can make the high density of the circuit possible.

[0050] Based on the above description, it should be understood that the top surface of the package body can be covered by the first circuit layer and the first solder mask to block external moisture. The bottom surface of the package body can also be covered by the second circuit layer and the second solder mask to block external moisture. Thus, the top surface and the bottom surface of the package substrate can have better moisture-proof performance because they can effectively block external moisture.

[0051] In a second aspect, the present application further provides a communication device, comprising a circuit board and a packaging substrate as described above, wherein the packaging substrate is arranged on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 is a schematic diagram of a communication device provided in an embodiment of the present application;

[0053] Figure 2 is a first cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0054] Figure 3 is a second cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0055] Figure 4 is a third cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0056] Figure 5 is a fourth cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0057] Figure 6 is a fifth cross-sectional schematic diagram of the packaging substrate provided in the embodiment of the present application;

[0058] Figure 7 is a sixth cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0059] Figure 8 is a cross-sectional schematic diagram of a moisture-proof structure of a packaging substrate provided in an embodiment of the present application;

[0060] Fig. 9 is another cross-sectional schematic diagram of the moisture-proof structure of the packaging substrate provided in an embodiment of the present application;

[0061] Fig.10 is another cross-sectional schematic diagram of the moisture-proof structure of the packaging substrate provided in an embodiment of the present application;

[0062] Fig.11 is another cross-sectional schematic diagram of the moisture-proof structure of the packaging substrate provided in an embodiment of the present application;

[0063] Fig.12 is a fifth cross-sectional schematic diagram of the moisture-proof structure of the packaging substrate provided in an embodiment of the present application;

[0064] Fig.13 is a seventh cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0065] Fig.14 is an eighth cross-sectional schematic diagram of a packaging substrate provided in an embodiment of the present application;

[0066] Fig.15 is a cross-sectional schematic diagram of a signal shielding structure of a packaging substrate provided in an embodiment of the present application;

[0067] Fig.16 It is another cross-sectional schematic diagram of the signal shielding structure of the packaging substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0068] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0069] An embodiment of the present application provides a communication device 200, which may be, but is not limited to, a power supply module, a communication signal transmitting base station, an outdoor network switching device, and the like.

[0070] See also Figure 1 The communication device 200 includes a circuit board 210 and a package substrate 100. The circuit board 210 can be understood as a carrier of the package substrate 100, which can carry the package substrate 100 and be assembled with the package substrate 100, thereby realizing electrical interconnection with the package substrate 100. The package substrate 100 can be understood as a carrier of semiconductor chip packaging, which can provide electrical connection, protection, support, heat dissipation, assembly and other functions for electronic components such as chips, resistors and capacitors.

[0071] It should be noted that Figure 1 The purpose is only to schematically describe the connection relationship between the circuit board 210 and the packaging substrate 100, and it is not to specifically limit the connection position, specific structure and quantity of each device. The structure shown in the embodiment of the present application does not constitute a specific limitation on the communication device 200. In other embodiments of the present application, the communication device 200 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure can be implemented in hardware, software, or a combination of software and hardware.

[0072] In the embodiment of the present application, the package substrate 100 will be specifically described by taking an embedded substrate as an example. It is understandable that the embedded substrate can be understood as a package architecture in which a chip is mounted inside the substrate, and then the chip is double-sided packaged by a packaging material and then interconnected on both sides by a related process.

[0073] It is understandable that there may be fine stratification between the packaging material and the pins of the electronic components such as chips, resistors and capacitors encapsulated therein, and because the packaging material also has a certain degree of moisture absorption (also known as hygroscopicity, which means that the packaging material has a certain ability to absorb external water vapor / moisture), when external moisture enters the interior of the packaging substrate 100, it is easy to form a leakage channel at the fine stratification, and the leakage channel will cause the packaging substrate 100 to fail when powered on. For the packaging substrate 100 as a whole, it is relatively difficult for external moisture to enter the interior of the packaging substrate 100 from the upper and lower surfaces of the packaging substrate 100, but it is easier to enter the interior of the packaging substrate 100 from the side of the packaging substrate 100, that is, the moisture-proof performance of the side of the packaging substrate 100 is relatively poor. Among them, the upper and lower surfaces of the packaging substrate 100 can be understood as the outer surface parallel to the plane when the packaging substrate 100 is placed on a plane, and the side of the packaging substrate 100 can be understood as the outer surface perpendicular to the reference surface when the packaging substrate 100 is placed on a reference surface. Based on the above description, a corresponding structural design needs to be made for the packaging substrate 100 to ensure that the packaging substrate 100 as a whole can have better moisture-proof performance.

[0074] Therefore, the packaging substrate 100 provided in the embodiment of the present application can prevent external moisture from entering the interior of the packaging substrate 100 from the peripheral side of the packaging substrate 100, effectively prevent the failure of the packaging substrate 100 due to moisture absorption, and ensure the high reliability and high stability of the circuit system of the packaging substrate 100 during normal operation, which will be further described below.

[0075] Please refer to Figure 2-Figure 7 The packaging substrate 100 includes a packaging body 10, a first circuit layer 21, a first solder mask layer 31, a first connecting column 61, a second circuit layer 22, a second solder mask layer 32, a second connecting column 62, an electronic component 40, a moisture-proof structure 50, a conductive column 70 and a metal layer 80.

[0076] The package body 10 includes a top surface 101, a bottom surface 102, and a peripheral side surface 103 connected between the top surface 101 and the bottom surface 102. The top surface 101, the bottom surface 102, and the peripheral side surface 103 of the package body 10 are connected to each other to jointly constitute the appearance structure of the package body 10. It can be understood that when the package body 10 is placed on a reference surface, the top surface 101 of the package body 10 is a surface away from the reference surface, the bottom surface 102 of the package body 10 is a surface in contact with the reference surface, and the peripheral side surface 103 of the package body 10 is a surface perpendicular to the reference surface.

[0077] Since the top surface 101, the bottom surface 102 and the peripheral side surface 103 of the package body 10 are the appearance structures of the package body 10 that may be exposed to the outside, in order to prevent external moisture from entering the interior of the package body 10 from their respective positions and affecting the electrical performance of the interior of the package body 10, corresponding structural design is required to block the moisture that may enter the interior of the package body 10 from the top surface 101, the bottom surface 102 and the peripheral side surface 103 of the package body 10, so as to achieve good moisture-proof performance of the package body 10.

[0078] The first circuit layer 21 is arranged on the top surface 101 of the package body 10, and the second circuit layer 22 is arranged on the bottom surface 102 of the package body 10. It can be understood that the pattern design of the first circuit layer 21 can be set according to the needs of the electronic components 40 packaged in the package body 10, and the pattern design of the second circuit layer 22 can also be set according to the needs of the electronic components 40 packaged in the package body 10. In addition, the pattern designs of the first circuit layer 21 and the second circuit layer 22 may be differentiated, that is, the pattern designs of the first circuit layer 21 and the second circuit layer 22 may be different, and the embodiments of the present application do not strictly limit this. Exemplarily, the material of the first circuit layer 21 and the second circuit layer 22 can be copper.

[0079] By providing the first circuit layer 21 and the second circuit layer 22, on the one hand, the first circuit layer 21 can cover part of the top surface 101 of the package body 10, and the second circuit layer 22 can cover part of the bottom surface 102 of the package body 10, thereby preventing external moisture from entering the package body 10. On the other hand, both sides (the top surface 101 and the bottom surface 102) of the package body 10 can have circuit layers that can serve as electrical connections, which can provide a good foundation for the subsequent double-sided interconnection of the electronic components 40 packaged in the package body 10, and is conducive to realizing the shortest interconnection path in a localized spatial layout and realizing the thin packaging of the packaging substrate 100, with strong practicality and good reliability.

[0080] The first solder mask 31 is disposed on the surface of the first circuit layer 21 facing away from the package body 10, and covers the top surface 101 of the package body 10 not covered by the first circuit layer 21. The first solder mask 31 is provided with a first opening 33, and the first opening 33 exposes a portion of the first circuit layer 21, so that the exposed portion of the first circuit layer 21 forms a first pad 35 of the package substrate 100.

[0081] By providing a first solder mask layer 31 and providing a first window 33 on the first solder mask layer 31, the circuits and substrates that need to be soldered in the package substrate 100 can be exposed to form a first solder pad 35, and the circuits and substrates that do not need to be soldered in the package substrate 100 can be shielded due to the solder resistance of the first solder mask layer 31. On the one hand, it can avoid solder waste and prevent electrical short circuit problems caused by solder bridging in the welding process, which is beneficial to long-term protection of the formed circuit pattern. On the other hand, because the first solder mask layer 31 has good insulation performance, it is beneficial to prevent the occurrence of insulation deterioration, corrosion and other problems caused by external environmental factors such as dust and water vapor, and it can make the high density of the circuit possible.

[0082] It should be noted that the number, shape and size of the first openings 33 can be designed according to the actual welding conditions of the package substrate 100, and the number can be one, two or more, and the shape can be rectangular, circular or polygonal, etc., and the embodiments of the present application do not impose strict restrictions on this. Exemplarily, when the number of the first openings 33 is multiple, the number of the first pads 35 formed is also multiple, the sizes of the multiple first pads 35 can be different, and the shapes of the multiple first pads 35 can also be a combination of one or more of rectangular, circular or polygonal.

[0083] The second solder mask 32 is disposed on the surface of the second circuit layer 22 facing away from the package body 10, and covers the top surface 101 of the package body 10 not covered by the second circuit layer 22. The second solder mask 32 is provided with a second opening 34, and the second opening 34 exposes a portion of the second circuit layer 22, so that the exposed portion of the second circuit layer 22 forms a second pad 36 of the package substrate 100.

[0084] By providing a second solder mask 32 and providing a second window 34 on the second solder mask 32, the circuits and substrates that need to be soldered in the package substrate 100 can be exposed to form a second solder pad 36, and the circuits and substrates that do not need to be soldered in the package substrate 100 can be shielded due to the solder resistance of the second solder mask 32. On the one hand, it can avoid solder waste and prevent electrical short circuit problems caused by solder bridging in the welding process, which is beneficial to long-term protection of the formed circuit pattern. On the other hand, because the second solder mask 32 has good insulation performance, it is beneficial to prevent the occurrence of insulation deterioration, corrosion and other problems caused by external environmental factors such as dust and water vapor, and it can make the high density of the circuit possible.

[0085] It should be noted that the number, shape and size of the second openings 34 can be designed according to the actual welding conditions of the package substrate 100, and the number can be one, two or more, and the shape can be rectangular, circular or polygonal, etc., and the embodiments of the present application do not impose strict restrictions on this. Exemplarily, when the number of the second openings 34 is multiple, the number of the second pads 36 formed is also multiple, the sizes of the multiple second pads 36 can be different, and the shapes of the multiple second pads 36 can also be a combination of one or more of rectangular, circular or polygonal.

[0086] Based on the above description, it should be understood that the top surface 101 of the package body 10 can be covered by the first circuit layer 21 and the first solder mask 31 to block external moisture. The bottom surface 102 of the package body 10 can also be covered by the second circuit layer 22 and the second solder mask 32 to block external moisture. Thus, the top surface 101 and the bottom surface 102 of the package substrate 100 can have better moisture-proof performance because they can effectively block external moisture.

[0087] Please refer to Figure 2 , Figure 3 and Figure 4 , the electronic component 40 is packaged inside the package body 10, the moisture-proof structure 50 is arranged inside the package body 10 and connected between the first circuit layer 21 and the second circuit layer 22, and the moisture-proof structure 50 surrounds the electronic component 40. That is, the distance between the moisture-proof structure 50 and the peripheral side surface 103 of the package body 10 is smaller than the distance between the electronic component 40 and the peripheral side surface 103 of the package body 10. The moisture-proof structure 50 can present an enclosing structure surrounding the electronic component 40 and be arranged in the package body 10, and one end of the moisture-proof structure 50 is connected to the first circuit layer 21, and the other end of the moisture-proof structure 50 is connected to the second circuit layer 22.

[0088] For example, the package body 10 may be made of a resin material having a certain hygroscopicity, and the moisture-proof structure 50 may be made of a copper material.

[0089] It is understandable that the package body 10 made of packaging materials has a certain degree of hygroscopicity, and it may absorb moisture in the external environment. The electronic component 40 is a structure encapsulated in the package body 10. At the junction of the pins of the electronic component 40 and the package body 10, it is easy to produce fine stratification. After absorbing moisture, these fine stratifications are easy to form leakage channels and make the package substrate 100 fail when powered on. Therefore, a moisture-proof structure 50 is set and the moisture-proof structure 50 can be arranged on the periphery of the electronic component 40 in an enclosing structure, so that the electronic component 40 can be within the protection range of the moisture-proof structure 50, that is, the electronic component 40 is located on the inner side of the moisture-proof structure 50, and can have good moisture-proof performance due to the protection of the moisture-proof structure 50, which is conducive to better ensuring its electrical performance. In addition, the enclosing structure can give full play to its characteristics of blocking external moisture from multiple directions, and play a moisture-proof protection role to the maximum extent. Because the moisture-proof structure 50 is also connected between the first circuit layer 21 and the second circuit layer 22, the height of the moisture-proof structure 50 can completely occupy the height range between the first circuit layer 21 and the second circuit layer 22, that is, the height of the moisture-proof structure 50 can completely adapt to the height range of the package body 10, playing a strict blocking role, and reducing the possibility of external moisture passing through the moisture-proof structure 50 and further penetrating into the interior of the package body 10 to a minimum.

[0090] In other words, the setting of the moisture-proof structure 50, on the one hand, defines the inner side of the moisture-proof structure 50 as an area that moisture cannot enter, so that even if moisture gathers from the outer side of the moisture-proof structure 50 to the position of the moisture-proof structure 50, due to the moisture-proof characteristics of the moisture-proof structure 50, it cannot pass through the protection of the moisture-proof structure 50 and enter the area defined and protected by the moisture-proof structure 50, which can effectively prevent external moisture from entering the inside of the packaging substrate 100 from the side of the packaging substrate 100, and prevent the packaging substrate 100 from failing due to moisture absorption, and has excellent moisture-proof performance. On the other hand, it can make the packaging substrate 100 as a whole have better environmental adaptability and can cope with complex and changeable environmental changes, so that even in a humid and hot external environment, the packaging substrate 100 can have good moisture-proof performance and effectively isolate external moisture, dust, etc., with strong reliability and good practicality.

[0091] Since the moisture-proof structure 50 needs to be disposed in the package body 10 and surround the electronic component 40 , the position of the moisture-proof structure 50 has various possibilities. The following will describe the possible positions of the moisture-proof structure 50 in conjunction with the accompanying drawings.

[0092] In a possible implementation, the moisture-proof structure 50 is embedded in the package body 10. It should be understood that being embedded in the package body 10 can be understood as the moisture-proof structure 50 being completely disposed inside the package body 10. That is, the inside of the moisture-proof structure 50 is the electronic component 40, and the outside of the moisture-proof structure 50 is still provided with a circle of packaging material of the package body 10. That is, the moisture-proof structure 50 is still at a certain distance from the peripheral side surface 103 of the package body 10. Exemplarily, the moisture-proof structure 50 can be as follows: Figure 2 Inline form shown.

[0093] Therefore, the moisture-proof structure 50 is completely arranged inside the package body 10, so that even if moisture gathers from the part of the package body 10 arranged outside the moisture-proof structure 50 to the position of the moisture-proof structure 50, due to the moisture-proof characteristics of the moisture-proof structure 50, it cannot pass through the protection of the moisture-proof structure 50 and enter the pins of the electronic component 40 and the fine layering of the package body 10, which can effectively prevent the failure of the package substrate 100 due to moisture absorption and has excellent moisture-proof performance.

[0094] In another possible implementation, part of the moisture-proof structure 50 is exposed on the side of the package body 10 , wherein the side may be understood as the peripheral side of the package body 10 , that is, the edge area of ​​the package body 10 sequentially surrounded by four sides.

[0095] For example, Figure 3 As shown, the outer surface of the moisture-proof structure 50 can be just exposed to form the peripheral side surface 103 of the package body 10. Alternatively, a portion of the moisture-proof structure 50 can be disposed inside the package body 10, and another portion can be disposed outside the package body 10.

[0096] Therefore, on the one hand, the moisture-proof structure 50 can strictly block the moisture of the external environment from the outside of the package 10, and further prevent the moisture of the external environment from entering the inside of the package 10, which is conducive to ensuring the electrical performance of the package substrate 100. On the other hand, in the preparation process of the package 10, multiple packages 10 can be arranged in an array, and two adjacent packages 10 can share a moisture-proof structure 50. Therefore, in the subsequent process, the moisture-proof structure 50 of each package 10 can be partially exposed on the side of the package 10, which is conducive to saving materials and production management costs on the basis of ensuring moisture-proof performance, and improving the production efficiency of the package substrate 100.

[0097] In another possible implementation, the moisture-proof structure 50 is connected to the peripheral side surface 103 of the package body 10, and presents a structural form that is entirely disposed outside the package body 10. For example, the moisture-proof structure 50 may present a structure as follows: Figure 4 Exposed form shown.

[0098] Therefore, the moisture-proof structure 50 can strictly block the moisture from the external environment from outside the package body 10 , and further prevent the moisture from the external environment from entering the interior of the package body 10 , which is beneficial to ensuring the electrical performance of the package substrate 100 .

[0099] It should be noted that the location of the moisture-proof structure 50 is not limited to the possibilities described above, as long as it can be connected between the first circuit layer 21 and the second circuit layer 22 and surround the electronic component 40. The embodiments of the present application do not impose strict restrictions on this.

[0100] As described above, the possible positions of the moisture-proof structure 50 are described below. Figure 8-Figure 12 The structural possibilities of the moisture-proof structure 50 are described.

[0101] In a possible implementation manner, the moisture-proof structure 50 is a continuously extending closed ring structure.

[0102] For example, the arrangement of the moisture-proof structure 50 may be as follows: Figure 8 The four-sided closed form shown in Figure 1 is Figure 8 The cross section shown is a cross section cut along a direction parallel to the package substrate 100 .

[0103] Therefore, the moisture-proof structure 50 can present a continuous surrounding structure, and the continuous surrounding structure can give full play to its sealing performance, and strictly block the external moisture from the outside, which is beneficial to ensure the overall electrical performance of the packaging substrate 100.

[0104] In another possible implementation, the moisture-proof structure 50 includes a plurality of sub-moisture-proof structures 53, the plurality of sub-moisture-proof structures 53 are staggered, and at least parts of two adjacent sub-moisture-proof structures 53 are overlapped. That is, the plurality of sub-moisture-proof structures 53 are staggered in the peripheral side portion.

[0105] For example, the arrangement of the plurality of sub-moisture-proof structures 53 may be as follows: Fig. 9 The four-sided staggered form shown in the figure, Fig. 9 The cross section shown is a cross section cut along a direction parallel to the package substrate 100. It should be understood that the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures 53 located on the same side can be understood as that on a reference plane parallel to the sub-moisture-proof structure 53, the orthographic projection of one sub-moisture-proof structure 53 on this reference plane at least partially falls within the orthographic projection range of another sub-moisture-proof structure 53 on this reference plane. The at least partial overlapping arrangement of two adjacent sub-moisture-proof structures 53 can refer not only to the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures 53 located on the same side, but also to the at least partial overlapping arrangement of two adjacent sub-moisture-proof structures 53 located at a corner.

[0106] Thus, the plurality of sub-moisture-proof structures 53 can present a discontinuous surrounding structure, and there is no direct connection between two adjacent sub-moisture-proof structures 53, and they can be arranged in a staggered manner. The at least partial overlapping arrangement of two adjacent sub-moisture-proof structures 53 can make the outer contour formed by the plurality of sub-moisture-proof structures 53 generally present a ring-shaped surrounding form, that is, the plurality of sub-moisture-proof structures 53 can present a staggered blocking form, which is conducive to minimizing the possibility of moisture absorption failure of the packaging substrate 100 caused by external moisture infiltration.

[0107] It should be noted that the arrangement of the plurality of moisture-proof sub-structures 53 is not limited to the possibilities described above, and may also be as follows: Fig.10 The one side is continuous and the three sides are staggered, or it can be as follows Fig.11 The two sides are continuous and staggered as shown, or Fig.12 As shown, three sides are continuous and one side is staggered. The staggered and continuous arrangement and combination forms are not listed here again, but it should be understood that the embodiments of the present application are not limited to this.

[0108] As mentioned above, the position and structural possibilities of the moisture-proof structure 50 are introduced. Now, in combination with the specific structure of the package body 10, the structure, position and connection form of the electronic component 40, the first connecting column 61, the second connecting column 62, the conductive column 70, the moisture-proof structure 50 and the metal layer 80 will be described in detail.

[0109] Please refer to Figure 2-Figure 7 The package body 10 includes a frame 11 and a packaging layer 12. By dividing the package body 10 into the frame 11 and the packaging layer 12, the structure disposed in the package body 10 can be arranged in a targeted manner, thereby ensuring that the moisture-proof substrate can achieve good moisture-proof performance, which will be described in detail below.

[0110] The frame 11 includes a first surface 111, a second surface 112 and a peripheral side surface 113 which are arranged opposite to each other, and the first surface 111, the second surface 112 and the peripheral side surface 113 of the frame 11 together form the appearance structure of the frame 11. The frame 11 is also provided with a cavity 114 capable of accommodating the electronic component 40. By providing the cavity 114 in the frame 11, it is possible to realize a packaging form in which the electronic component 40 is embedded in the electronic substrate, thereby improving the arrangement density and integration degree of the packaging substrate 100.

[0111] Exemplarily, the frame 11 may be made of an insulating resin material, and the resin material may be phenolic resin, epoxy resin, bismaleimide triazine resin, epoxy acrylate, polypropylene glycol (PPG), epoxy resin containing glass fiber, or epoxy acrylate containing glass fiber.

[0112] It should be noted that the chamber 114 may be recessed in the first surface 111, or recessed in the second surface 112, or may pass through the first surface 111 and the second surface 112. The number of chambers 114 may be one, two, or more, as long as one chamber 114 can accommodate one electronic component 40. The embodiments of the present application do not impose strict restrictions on this.

[0113] It is understandable that the electronic component 40 may be an active electronic component 40 such as a chip (e.g., a CPU chip, a radio frequency driver chip, or a chip of another processor), a diode, or a transistor. It may also be a passive electronic component 40 such as a resistor, an inductor, or a capacitor. It may also be a combination of at least two of a chip, a diode, a transistor, a resistor, an inductor, and a capacitor.

[0114] The electronic component 40 is contained in the cavity 114 and is encapsulated by the encapsulation layer 12. Specifically, the encapsulation layer 12 fills the cavity 114 and covers the electronic component 40, and covers the first surface 111 of the frame 11 and the second surface 112 of the frame 11. Thus, the encapsulation layer 12 can constitute the encapsulation body 10 together with the frame 11. That is, the surface of the encapsulation layer 12 away from the frame 11 respectively forms the top surface 101 and the bottom surface 102 of the encapsulation body 10, and the encapsulation layer 12 and the peripheral side surface 113 of the frame 11 together constitute the peripheral side surface 103 of the encapsulation body 10.

[0115] Exemplarily, the encapsulation layer 12 may be made of an insulating resin material, and the resin material may be phenolic resin, epoxy resin, bismaleimide triazine resin, epoxy acrylate, polypropylene glycol (PPG), epoxy resin containing glass fiber, or epoxy acrylate containing glass fiber.

[0116] In a possible implementation, the packaging layer 12 is made of the same material as the frame 11 , and the cavity 114 is filled with the same material as the frame 11 , so that the formed packaging layer 12 and the frame 11 have better bonding strength, thereby improving the packaging effect of the electronic component 40 .

[0117] In another possible implementation manner, the packaging layer 12 and the frame 11 may also be made of different materials.

[0118] It is understandable that, since the materials used to make the frame 11 and the encapsulation layer 12 have a certain degree of hygroscopicity, the frame 11 and the encapsulation layer 12 may absorb external moisture, resulting in the formation of a leakage path at the fine layer between the pins of the electronic component 40 and the encapsulation layer 12. Therefore, by providing a moisture-proof structure 50 and surrounding the electronic component 40, external moisture can be blocked outside the moisture-proof structure 50, so that the fine layer between the encapsulation layer 12 and the pins of the electronic component 40 is not prone to form a leakage path due to moisture absorption, and the possibility of failure of the encapsulation substrate 100 due to the generation of the leakage path is reduced to a minimum, fully ensuring the high reliability and high stability of the encapsulation substrate 100 when it is powered on.

[0119] The embodiment of the present application is described by taking the number of chambers 114 and electronic components 40 as two, where the two electronic components 40 are a chip and a resistor and capacitor device (referring to resistor and capacitor type components) as an example, but it should be understood that this is not limiting.

[0120] Specifically, the chip and the resistor and capacitor components are respectively contained in two chambers 114 and packaged by the packaging layer 12 ( Figure 2-Figure 7 The left side of the figure shows a chip, and the right side shows a resistor and capacitor. The first connecting column 61 is disposed in the packaging layer 12 and connected between the pin of the chip and the second circuit layer 22 to conduct the chip and the second circuit layer 22. The second connecting column 62 is disposed in the packaging layer 12 and connected between the pin of the resistor and capacitor and the second circuit layer 22 to conduct the resistor and capacitor and the second circuit layer 22.

[0121] In other words, the chip can be electrically connected to the second circuit layer 22 through the first connecting pillars 61, and the resistor and capacitor device can be electrically connected to the second circuit layer 22 through the second connecting pillars 62. It should be noted that the number of the first connecting pillars 61 can correspond to the number of pins of the chip, and the number of the second connecting pillars 62 can correspond to the number of pins of the resistor and capacitor device, and the embodiments of the present application do not impose strict restrictions on this.

[0122] In the embodiment of the present application, the conductive post 70 is located at the periphery of the chamber 114 and is electrically connected between the first circuit layer 21 and the second circuit layer 22. The distance between the conductive post 70 and the peripheral side surface 113 of the frame 11 is greater than the distance between the moisture-proof structure 50 and the frame 11. In other words, the conductive post 70 can conduct the first circuit layer 21 and the second circuit layer 22, and the conductive post 70 is within the protection range of the moisture-proof structure 50, that is, the conductive post 70 is located on the inner side of the moisture-proof structure 50, and can have good moisture-proof performance due to the protection of the moisture-proof structure 50, which is conducive to better ensuring its electrical performance.

[0123] It can be understood that the electronic components 40 (chips and resistors and capacitors) can be electrically connected to the second circuit layer 22, and the conductive posts 70 can form an electrical connection between the first circuit layer 21 and the second circuit layer 22, so the electronic components 40 can achieve double-sided interconnection through the conductive posts 70.

[0124] Therefore, setting the conductive posts 70 can realize double-sided interconnection of the electronic components 40, which is beneficial to shorten the wiring distance, maximize the short-distance transmission path, and can effectively carry better power with a smaller area or volume, thereby improving the overall power density, arrangement density and integration level of the packaging substrate 100.

[0125] It is understandable that the conductive post 70 is not only electrically connected between the first circuit layer 21 and the second circuit layer 22, but also physically connected between the first circuit layer 21 and the second circuit layer 22. That is, the conductive post 70 is located inside the frame 11 and the packaging layer 12.

[0126] Specifically, the conductive post 70 includes a first portion 71 and a second portion 72. The first portion 71 is disposed in the frame 11, and the second portion 72 is disposed in the packaging layer 12 and connected between the first portion 71 and the first circuit layer 21 and between the first portion 71 and the second circuit layer 22. Specifically, a portion of the second portion 72 is disposed in the packaging layer 12 located on the first surface 111 and connected between one end of the first portion 71 and the first circuit layer 21, and another portion of the second portion 72 is disposed in the packaging layer 12 located on the second surface 112 and connected between the other end of the first portion 71 and the second circuit layer 22.

[0127] Therefore, it can be fully ensured that the circuits of the packaging substrate 100 pass through the frame 11 and the packaging layer 12, so that the first circuit layer 21 and the second circuit layer 22 can achieve reliable electrical connection with a shorter wiring distance.

[0128] Exemplarily, the first portion 71 and the second portion 72 may be manufactured using different process technologies. For example, the first portion 71 may be manufactured using an additive plating process, and the second portion 72 may be manufactured using a via-filling plating process.

[0129] It should be noted that the position of the conductive column 70 can be designed according to actual conditions. It only needs to be located outside the chamber 114, be able to conduct the first circuit layer 21 and the second circuit layer 22, and be on the inner side of the moisture-proof structure 50. The embodiments of the present application do not impose strict restrictions on this.

[0130] Please refer to Figure 5 , Figure 6 and Figure 7The moisture-proof structure 50 may further include a frame retaining wall 51 and a packaging retaining wall 52, wherein the frame retaining wall 51 is disposed on the frame 11 and the packaging retaining wall 52 is disposed on the packaging layer 12. In other words, the frame retaining wall 51 and the packaging retaining wall 52 together constitute the moisture-proof structure 50 to prevent moisture from the external environment from entering the packaging body 10.

[0131] It can be understood that the frame retaining wall 51 and the packaging retaining wall 52 together constitute a moisture-proof structure 50. Since the moisture-proof structure 50 may only have a moisture-proof function but not a function of electrically connecting the first circuit layer 21 and the second circuit layer 22, the specific locations of the frame retaining wall 51 and the packaging retaining wall 52 may have various possibilities. This setting can further increase the manufacturing freedom of the moisture-proof structure 50, which is beneficial to reducing the manufacturing difficulty of the packaging substrate 100.

[0132] In a possible implementation, the encapsulation retaining wall 52 is connected between the frame retaining wall 51 and the first circuit layer 21 and between the frame retaining wall 51 and the second circuit layer 22, and the orthographic projection of the encapsulation retaining wall 52 on the first surface 111 at least partially falls within the range of the orthographic projection of the frame retaining wall 51 on the first surface 111. That is, at least a portion of the encapsulation retaining wall 52 is overlapped with the frame retaining wall 51. A portion of the encapsulation retaining wall 52 is disposed in the encapsulation layer 12 located on the first surface 111 and connected between one end of the frame 11 and the first circuit layer 21, and another portion of the encapsulation retaining wall 52 is disposed in the encapsulation layer 12 located on the second surface 112 and connected between the other end of the frame 11 and the second circuit layer 22. Exemplarily, the frame retaining wall 51 and the encapsulation retaining wall 52 may be as follows: Figure 5 The structural form shown.

[0133] It should be understood that the orthographic projection of the encapsulation retaining wall 52 on the first surface 111 at least partially falls within the range of the orthographic projection of the frame retaining wall 51 on the first surface 111, and the orthographic projection of the encapsulation retaining wall 52 on the first surface 111 may partially fall within the range of the orthographic projection of the frame retaining wall 51 on the first surface 111, or the orthographic projection of the encapsulation retaining wall 52 on the first surface 111 may completely fall within the range of the orthographic projection of the frame retaining wall 51 on the first surface 111. The design can be carried out according to actual conditions and is not strictly required.

[0134] In another possible implementation, the encapsulation retaining wall 52 is connected between the first surface 111 and the first circuit layer 21 and between the second surface 112 and the second circuit layer 22, and the encapsulation retaining wall 52 is staggered with the frame retaining wall 51. That is, the orthographic projection of the encapsulation retaining wall 52 on the first surface 111 does not overlap with the orthographic projection of the frame retaining wall 51 on the first surface 111. A portion of the encapsulation retaining wall 52 is disposed in the encapsulation layer 12 located on the first surface 111 and connected between one end of the frame 11 and the first circuit layer 21, and another portion of the encapsulation retaining wall 52 is disposed in the encapsulation layer 12 located on the second surface 112 and connected between the other end of the frame 11 and the second circuit layer 22. Exemplarily, the frame retaining wall 51 and the encapsulation retaining wall 52 may be as follows: Figure 6 The structural form shown.

[0135] In another possible implementation, the packaging retaining wall 52 is connected between the first surface 111 and the first circuit layer 21 and between the second surface 112 and the second circuit layer 22, and the packaging retaining wall 52 is adjacent to the frame retaining wall 51. That is, the relationship between the packaging retaining wall 52 and the frame retaining wall 51 is a critical contact relationship. A portion of the packaging retaining wall 52 is disposed in the packaging layer 12 located on the first surface 111 and connected between one end of the frame 11 and the first circuit layer 21, and another portion of the packaging retaining wall 52 is disposed in the packaging layer 12 located on the second surface 112 and connected between the other end of the frame 11 and the second circuit layer 22. Exemplarily, the frame retaining wall 51 and the packaging retaining wall 52 may be as follows: Figure 7 The structural form shown.

[0136] It should be noted that the position possibilities and arrangement forms of the encapsulation retaining wall 52 and the frame retaining wall 51 can refer to the position possibilities and arrangement forms of the moisture-proof structure 50 described above. For example, the frame retaining wall 51 can be embedded in the frame 11 or exposed on the side of the frame 11. It can be a continuous ring structure or a discontinuous surrounding structure. The frame retaining wall 51 can be embedded in the encapsulation layer 12 or exposed on the side of the frame 11. It can be a continuous ring structure or a discontinuous surrounding structure. The arrangement and combination forms between the two can have various possibilities, which will not be repeated here.

[0137] Thus, on the one hand, it can ensure that the moisture-proof structure 50 can be tightly arranged between the first circuit layer 21 and the second circuit layer 22, and the possibility of the problem of failure of the packaging substrate 100 due to moisture absorption can be minimized because the moisture-proof structure 50 is not tightly connected to the first circuit layer 21 and the second circuit layer 22, thereby minimizing the possibility of the packaging substrate 100 failing due to moisture absorption. On the other hand, each side of the side of the packaging body 10 can effectively block moisture from all directions due to the moisture-proof structure 50, further improving the moisture-proof performance of the packaging substrate 100.

[0138] It can be understood that the packaging retaining wall 52 and the frame retaining wall 51 can be made of the same metal material, or the packaging retaining wall 52 and the frame retaining wall 51 can be made of different metal materials. The packaging retaining wall 52 and the frame retaining wall 51 made of metal can further improve the mechanical strength of the packaging body 10, which is beneficial to ensure that the packaging substrate 100 is not easily deformed when subjected to external force.

[0139] For example, both the package retaining wall 52 and the frame retaining wall 51 can be made of metal materials, such as copper. The frame retaining wall 51 and the package retaining wall 52 can also be made using different process technologies. For example, the frame retaining wall 51 can be made by an additive plating process, and the package retaining wall 52 can be made by a hole-filling plating process.

[0140] See also Figure 5 The metal layer 80 is embedded in the middle of the thickness direction of the frame 11, and the metal layer 80 extends in a direction parallel to the package substrate 100. The thickness direction of the frame 11 can be understood as a direction perpendicular to the frame 11, that is, perpendicular to the package body 10, that is, perpendicular to the package substrate 100. It should be understood that the metal layer 80 is not disposed inside the cavity 114.

[0141] Therefore, by adding an extra metal layer 80 in the middle position of the frame 11 in the thickness direction, the structural characteristics of the metal layer 80 can, on the one hand, enable the frame 11 as a whole to have good heat dissipation performance, thereby significantly improving the overall heat dissipation performance and stability of the packaging substrate 100; on the other hand, it can increase the overall mechanical strength of the frame 11, making it less likely for the frame 11 to be deformed by external forces, thereby improving the overall mechanical strength of the packaging substrate 100.

[0142] It should be noted that the size of the metal layer 80 along the thickness direction of the frame 11 can be designed according to actual conditions. While ensuring the overall performance of the frame 11 and the processable range of the metal layer 80, the larger the size of the metal layer 80 along the thickness direction of the frame 11, the better the heat dissipation performance of the frame 11.

[0143] In a possible implementation, Figure 5 As shown, the metal layer 80 intersects with the conductive pillar 70, and the metal layer 80 is electrically connected to the conductive pillar 70. Exemplarily, the metal layer 80 is perpendicular to the conductive pillar 70.

[0144] It is understandable that the metal layer 80 can be arranged as a circuit layer and provide a certain routing design. Since the metal layer 80 is connected to the conductive column 70 that can achieve double-sided interconnection, the metal layer 80 can be made into an interconnection circuit according to actual design needs and form a signal shielding layer on the upper and lower surfaces (the first surface 111 and the second surface 112). Therefore, the metal layer 80 can take into account the improvement of heat dissipation performance, mechanical strength and routing design, with multiple performance, strong flexibility and a wide range of applications.

[0145] It should be noted that when the metal layer 80 is arranged as a circuit layer, it can be designed as a non-continuously extended layer structure, that is, a discontinuous layer structure design. The discontinuous structure design can leave a certain loop for double-sided interconnection, thereby ensuring the reliability of double-sided interconnection.

[0146] Please refer to Fig.13 and Fig.14 In the embodiment of the present application, the package substrate 100 may further include a signal shielding structure 90 disposed on the frame 11, and the signal shielding structure 90 is located between the package retaining wall 52 and the cavity 114 where the chip is disposed and surrounds the cavity 114 where the chip is disposed. The distance between the signal shielding structure 90 and the peripheral side surface 113 of the frame 11 is greater than the distance between the conductive pillar 70 and the frame 11. In other words, the signal shielding structure 90, the conductive pillar 70 and the moisture-proof structure 50 are disposed in sequence at the periphery of the cavity 114 where the chip is disposed. The metal layer 80 may be connected to the signal shielding structure 90, the conductive pillar 70 and the moisture-proof structure 50.

[0147] It can be understood that setting up the signal shielding structure 90 can avoid signal interference, ensure the accuracy of chip signal transmission, and improve the stability of the chip during operation, thereby minimizing the possibility of abnormalities occurring during operation of the packaging substrate 100 and fully ensuring the stability of the packaging substrate 100 during operation.

[0148] In a possible implementation manner, the signal shielding structure 90 is a continuously extending closed ring structure.

[0149] For example, the arrangement of the signal shielding structure 90 may be as follows: Fig.15 The four-sided closed form shown in Figure 1 is Fig.15 The cross section shown is a cross section cut along a direction parallel to the package substrate 100 .

[0150] Therefore, the signal shielding structure 90 can be arranged around the periphery of the cavity 114 where the chip is installed to present a continuous surrounding structure. The continuous surrounding structure can give full play to its sealing performance and play a good role in shielding signal interference, which is beneficial to ensure the overall electrical performance of the packaging substrate 100.

[0151] In another possible implementation, the signal shielding structure 90 includes a plurality of sub-signal shielding structures 91, and the plurality of sub-signal shielding structures 91 are staggeredly distributed in the peripheral side portion, and at least parts of two adjacent sub-signal shielding structures 91 are overlapped. That is, the plurality of sub-signal shielding structures 91 are staggeredly distributed in the peripheral side portion.

[0152] For example, the arrangement of the plurality of sub-signal shielding structures 91 may be as follows: Fig.16 The four sides shown are staggered, where Fig.16 The cross section shown is a cross section cut along a direction parallel to the package substrate 100. It should be understood that the at least partial overlapping arrangement of two adjacent sub-signal shielding structures 91 located on the same side can be understood as, on a reference plane parallel to the same, the orthographic projection of one sub-signal shielding structure 91 on this reference plane at least partially falls within the orthographic projection range of another sub-signal shielding structure 91 on this reference plane. The at least partial overlapping arrangement of two adjacent sub-signal shielding structures 91 can refer not only to the at least partial overlapping arrangement of two adjacent sub-signal shielding structures 91 located on the same side, but also to the at least partial overlapping arrangement of two adjacent sub-signal shielding structures 91 located at a corner.

[0153] Thus, the plurality of sub-signal shielding structures 91 can be arranged around the periphery of the chamber 114 where the chip is arranged to present an intermittent surrounding structure, and there is no direct connection between two adjacent sub-signal shielding structures 91, and they can be arranged in a staggered manner. The at least partial overlapping arrangement of two adjacent sub-signal shielding structures 91 can make the outer contour formed by the plurality of sub-signal shielding structures 91 generally present an annular surrounding form, that is, the plurality of sub-signal shielding structures 91 can present an interlaced blocking form, which is conducive to minimizing the possibility of moisture infiltration from the outside and causing the packaging substrate 100 to fail due to moisture absorption.

[0154] It should be noted that the structural form of the signal shielding structure 90 is not limited to the possibilities described above, and it can also be one side continuous and three sides staggered, or two sides continuous and two sides staggered, or three sides continuous and one staggered. The staggered and continuous permutation and combination forms are not listed here, but it should be understood that the embodiments of the present application are not limited to this. In another possible implementation manner, as Fig.14 As shown, the signal shielding structure 90 includes a shielding baffle 92 and a shielding top cover 93. The shielding baffle 92 is arranged around the periphery of the chamber 114 where the chip is arranged, and at least a portion of the shielding top cover 93 is located in the chamber 114 where the chip is arranged and connected to one end of the shielding baffle 92. It should be understood that the shielding baffle 92 can be a continuously extending closed ring structure, or can be a discontinuous surrounding form with a staggered arrangement as in the aforementioned embodiment.

[0155] Thus, the signal shielding structure 90 can be formed into a box-like shape without a cover, which is beneficial to further ensure its signal shielding performance.

[0156] It should be noted that the structural form of the signal shielding structure 90 is not limited to the possibilities described above. It can also be a rectangular hexahedron embedded in the frame 11 and wrapping the cavity 114 where the chip is installed, wherein a hole for the first connecting column 61 to pass through is opened only on one side close to the second circuit layer 22. The embodiments of the present application do not impose specific restrictions on this.

[0157] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging substrate, characterized in that: include: A package body, the package body comprising a top surface and a bottom surface disposed opposite to each other, the package body comprising a frame and a packaging layer, the frame being provided with a cavity, the frame further comprising a first surface and a second surface disposed opposite to each other, the packaging layer filling the cavity to encapsulate the electronic component and covering the first surface and the second surface, and the surface of the packaging layer away from the frame forming the top surface and the bottom surface; A first circuit layer and a second circuit layer, wherein the first circuit layer is arranged on the top surface of the package body, and the second circuit layer is arranged on the bottom surface of the package body; An electronic component, wherein the electronic component is packaged inside the packaging body and accommodated in the cavity; a moisture-proof structure, the moisture-proof structure being arranged in the packaging body and connected between the first circuit layer and the second circuit layer, the moisture-proof structure surrounding the electronic component, the moisture-proof structure comprising a frame retaining wall and a packaging retaining wall, the frame retaining wall being arranged in the frame, and the packaging retaining wall being arranged in the packaging layer; and A conductive post is provided on the frame, the conductive post is located outside the cavity and is electrically connected between the first circuit layer and the second circuit layer, and the distance between the conductive post and the peripheral side surface of the frame is greater than the distance between the moisture-proof structure and the frame.

2. The packaging substrate according to claim 1, wherein: The moisture-proof structure is a continuously extending closed ring structure; or, The moisture-proof structure comprises a plurality of sub-moisture-proof structures, the plurality of sub-moisture-proof structures are staggered, and two adjacent sub-moisture-proof structures are at least partially overlapped.

3. The packaging substrate according to claim 1, wherein: The moisture-proof structure is embedded in the packaging body; or, At least a portion of the moisture-proof structure is exposed on a side of the packaging body.

4. The packaging substrate according to any one of claims 1 to 3, characterized in that: The encapsulation retaining wall is connected between the frame retaining wall and the first circuit layer and between the frame retaining wall and the second circuit layer, and the orthographic projection of the encapsulation retaining wall on the first surface at least partially falls within the range of the orthographic projection of the frame retaining wall on the first surface; or, The packaging retaining wall is connected between the first surface and the first circuit layer and between the second surface and the second circuit layer, and the packaging retaining wall and the frame retaining wall are staggered; or, The packaging retaining wall is connected between the first surface and the first circuit layer and between the second surface and the second circuit layer, and the packaging retaining wall is adjacent to the frame retaining wall.

5. The packaging substrate according to claim 4, characterized in that The electronic component is a chip, and the packaging substrate further comprises a signal shielding structure arranged on the frame, wherein the signal shielding structure is located between the packaging retaining wall and the chamber and surrounds the chamber.

6. The packaging substrate according to claim 5, characterized in that The signal shielding structure is a continuously extending closed ring structure; or, The signal shielding structure comprises a shielding baffle wall and a shielding top cover, wherein the shielding baffle wall is arranged outside the chamber, and at least a part of the shielding top cover is located inside the chamber and connected to one end of the shielding baffle wall.

7. The packaging substrate according to any one of claims 1 to 3, 5 or 6, characterized in that: The package body further includes a metal layer, which is embedded in the middle of the frame in the thickness direction and extends in a direction parallel to the package substrate.

8. The packaging substrate according to claim 7, wherein: The metal layer intersects the conductive pillar, and the metal layer is electrically connected to the conductive pillar.

9. The packaging substrate according to claim 1, wherein: The packaging substrate also includes a first solder mask and a second solder mask; The first solder resist layer is disposed on a surface of the first circuit layer away from the package body and covers a top surface of the package body not covered by the first circuit layer, the first solder resist layer is provided with a first opening, and the first opening exposes a portion of the first circuit layer so that the exposed portion of the first circuit layer forms a first pad of the package substrate; The second solder resist layer is arranged on the surface of the second circuit layer facing away from the package body and covers the bottom surface of the package body not covered by the second circuit layer. The second solder resist layer is provided with a second window, and the second window exposes a portion of the second circuit layer so that the exposed portion of the second circuit layer forms a second solder pad of the package substrate.

10. A communication device, characterized in that: The communication device comprises a circuit board and a packaging substrate as claimed in any one of claims 1 to 9, wherein the packaging substrate is arranged on the circuit board.

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