A non-contact IC substrate surface treatment system and method

Abstract

The present invention provides a non-contact IC carrier surface treatment system and method, belonging to the field of printed circuit boards, and the present invention comprises: a surface treatment body and a surface treatment industrial control computer; a horizontal moving device is installed on the upper surface of the surface treatment body; the first end of the surface treatment body is a feed end, and a conveying carrier adapted to the horizontal moving device is provided at the feed end; the IC carrier to be processed is placed on the conveying carrier and horizontally moved on the horizontal moving device; the second end of the surface treatment body is a discharge end, and a surface treatment device, a surface dust sticking device, a preheating device and a surface film sticking device are sequentially installed from the first end to the second end of the surface treatment body; the present invention utilizes various chemical liquids to remove oil, roughen the copper surface, pickle, wash, dry and other treatments on the surface of the IC carrier during processing. Magnetic conveying provides a zero-friction conveying force to avoid dust and foreign matter generated by friction. It meets the production efficiency requirements and improves the processing efficiency.

Description

Technical Field

[0001] The invention belongs to the field of printed circuit boards, and in particular relates to a non-contact IC carrier surface processing system and method. Background Art

[0002] With the continuous advancement of semiconductor packaging technology, IC substrates have been widely developed. IC substrates are relatively high-end PCB boards with the characteristics of high density, high precision, miniaturization and thinness. IC substrates are developed on the basis of HDI boards and are key components in packaging. They have lower costs in low-end packaging. In the field of high-end packaging, IC substrates have replaced traditional lead frames and become an indispensable part of chip packaging.

[0003] The main function of the IC substrate is to provide electrical signal extraction, support, heat dissipation and protection for the chip, and also to provide electrical connection and physical support between the chip and the PCB motherboard. It is a carrier that connects and transmits signals between the bare chip (DIE) and the printed circuit board (PCB), playing a connecting role. In addition, the IC substrate can be embedded with passive and active devices to achieve certain system functions.

[0004] In the process of printed circuit board processing, especially high-precision IC substrates, the film pasting process before pattern formation (including surface treatment, preheating, film pasting) requires zero damage contact on the surface of the key area of ​​the printed circuit board to prevent the surface from being contaminated by foreign matter, scratched to produce pits and protrusions, and further cause open circuits and short circuits between circuit patterns. In the prior art, the surface treatment section, surface dust collection section, preheating section, and film pasting section are respectively produced by various equipment manufacturers and then spliced. The transmission method is horizontal roller transmission at the same height. The disadvantage of roller transmission is that it will rub the surface of the key area of ​​the printed circuit board to produce pits and protrusions, and foreign matter will remain on the surface when the roller is dirty.

[0005] Moreover, the prior art lacks an automated control method for the surface treatment of the IC substrate, and is unable to effectively identify the entire process status of the surface treatment of the IC substrate. If an abnormality is not discovered in time, the problem will expand and affect the quality of the surface treatment of the IC substrate. Summary of the invention

[0006] The non-contact IC substrate surface treatment system provided by the present invention at least solves the problems of horizontal roller transmission in the prior art, the shortcomings of roller transmission and the lack of automated control method for IC substrate surface treatment in the prior art, and the inability to effectively identify the entire process status of IC substrate surface treatment.

[0007] According to one embodiment of the present application, a non-contact IC substrate surface treatment system is provided, the system comprising: a surface treatment body and a surface treatment industrial computer; a horizontal moving device is installed on the upper surface of the surface treatment body;

[0008] The first end of the surface treatment machine body is a feed end, and a transport carrier adapted to the horizontal moving device is provided at the feed end; the IC substrate to be processed is placed on the transport carrier and horizontally moved on the horizontal moving device;

[0009] The second end of the surface treatment body is a discharging end, and a surface treatment device, a surface dust sticking device, a preheating device and a surface film sticking device are sequentially installed from the first end to the second end of the surface treatment body;

[0010] The surface treatment industrial computer is respectively communicated with the horizontal moving device, the surface treatment device, the surface dust sticking device, the preheating device and the surface film sticking device, and based on the preset substrate surface treatment process, the horizontal moving device, the surface treatment device, the surface dust sticking device, the preheating device and the surface film sticking device are respectively controlled to operate, so as to realize the surface treatment operation of the IC substrate.

[0011] It should be further explained that the horizontal moving device is provided with an electromagnetic track coil, and the transport carrier is provided with multiple permanent magnets. When the electromagnetic track is energized, a magnetic field is generated. By utilizing the principle that like-sense magnets repel each other, the electromagnetic track can push the transport carrier to carry the IC carrier horizontally.

[0012] The surface treatment industrial computer is connected to the electromagnetic track coil for communication to control the operation of the electromagnetic track coil.

[0013] It should be further explained that a first position sensor is arranged near the surface treatment device; a second position sensor is arranged near the surface dust sticking device; a third position sensor is arranged near the preheating device; and a fourth position sensor is arranged near the surface film sticking device.

[0014] The first position sensor, the second position sensor, the third position sensor and the fourth position sensor are respectively connected to the surface treatment industrial computer for communication. The surface treatment industrial computer obtains the moving position of the IC carrier based on the above position sensors and triggers the operation of corresponding devices.

[0015] It should be further explained that the surface treatment device is provided with a liquid medicine flow meter, a liquid medicine control valve, a liquid medicine flow control valve, a flushing and drying timing module and a drying temperature sensor;

[0016] The surface treatment industrial computer is respectively connected to the liquid flow meter, the liquid control valve, the liquid flow control valve, the flushing and drying timing module and the drying temperature sensor to obtain the liquid flow information, flushing and drying time information and drying temperature information during the operation of the surface treatment device;

[0017] The surface dust sticking device is equipped with a silicone straight roller and a rubber rolling pressure sensor;

[0018] The surface treatment industrial control computer is respectively connected to the rubber rolling pressure sensor for communication to obtain the rolling pressure information of the silicone straight roller.

[0019] It should be further explained that the preheating device is provided with a heating mechanism and a heating temperature sensor;

[0020] The surface treatment industrial computer is respectively connected to the heating mechanism and the heating temperature sensor for communication, obtains the heating temperature information, and controls the operation of the heating mechanism;

[0021] The surface film sticking device is provided with a film pressing pressure sensor;

[0022] The surface treatment industrial control computer is respectively connected to the film pressing pressure sensor for communication to obtain the pressure information of the film pressing wheel.

[0023] It should be further explained that the system also includes: a surface treatment server, a plurality of surface treatment bodies and a surface treatment industrial computer matched therewith;

[0024] The surface treatment server obtains surface treatment information of multiple IC substrates uploaded by the same surface treatment industrial computer in the system, analyzes the surface treatment information of the IC substrate, and determines whether there is abnormal information. If so, configures the surface treatment abnormal sequence of the IC substrate according to the abnormal state of the surface treatment;

[0025] Configure the abnormal indicators of each device according to the abnormal sequence of IC substrate surface treatment;

[0026] Configure abnormal situations according to node abnormality indicators and abnormal thresholds corresponding to different surface treatment industrial computers.

[0027] It should be further explained that the surface treatment server obtains the surface treatment information of the IC substrate uploaded by the plurality of surface treatment industrial computers at a preset time interval;

[0028] The surface treatment information of each IC substrate is configured to the neural network model according to the acquisition time, so as to configure the feature sequence of the surface treatment information of the IC substrate corresponding to different acquisition times; the feature sequence of the surface treatment information of the IC substrate is processed into the substrate surface treatment process sequence by using the variational autoencoder;

[0029] The surface treatment process sequences of each substrate are sorted according to the surface treatment process as an abnormal surface treatment sequence of the IC substrate;

[0030] The surface treatment server analyzes the substrate surface treatment process sequence uploaded by the surface treatment industrial computer to determine whether there is abnormal information. If so, the substrate surface treatment process sequence is configured as an IC substrate surface treatment abnormal sequence.

[0031] It should be further explained that the surface treatment server scores each IC substrate surface treatment information in the substrate surface treatment process sequence, gives a standard score under normal circumstances, and deducts points if an abnormality occurs; and sorts each IC substrate surface treatment information in the IC substrate surface treatment abnormality sequence according to the score;

[0032] The sorting numbers of the surface treatment information of each IC substrate in the surface treatment abnormal sequence of the IC substrate are extracted as the abnormality scores corresponding to the surface treatment information of each IC substrate; the sum of the scores corresponding to the surface treatment information of the IC substrate uploaded by each surface treatment industrial computer is used as the abnormality index of the corresponding surface treatment industrial computer.

[0033] According to another embodiment of the present application, a non-contact IC substrate surface treatment method is provided, the method comprising:

[0034] Step 1: Place the IC carrier with preset length, width and thickness on the transport carrier and fix it;

[0035] Step 2: placing the transport carrier with the IC carrier on the horizontal moving device, or installing the transport carrier on the horizontal moving device;

[0036] Step 3: Start the horizontal moving device to make the transport carrier transport the IC substrate at a set speed;

[0037] Step 4: The IC substrate is moved to a surface treatment device, and the surface treatment device sprays a chemical solution onto the IC substrate to rinse the IC substrate in sequence, and then dries the IC substrate after rinsing;

[0038] Step 5: transport the IC substrate to a surface dust sticking device, and use a silicone straight roller of the surface dust sticking device to stick dust to the surface of the IC substrate;

[0039] Step 6: transport the IC carrier to the preheating section device, and the hot air in the preheating section device heats the IC carrier to a set temperature;

[0040] Step 7: transport the IC substrate to a surface mount device, and the surface mount device performs surface mount film on the IC substrate.

[0041] It can be seen from the above technical solutions that the present invention has the following advantages:

[0042] In the non-contact IC carrier surface treatment system provided by the present invention, various chemical liquids are used to remove oil, roughen the copper surface, pickle, wash, dry, etc. on the surface of the IC carrier during processing. The transport carrier can lift the IC carrier and transport it through a horizontal moving device, and the transport carrier has the characteristic of non-contact with the key area of ​​the IC carrier.

[0043] The system of the present invention lifts the IC carrier through the conveying carrier, provides support and avoids contact with key areas, and then magnetically conveys the conveying carrier with the IC carrier through the conveying track, and sequentially goes through the process stages of surface treatment, surface dust adhesion, preheating, surface film lamination, etc. The magnetic conveying provides zero-friction conveying force to avoid dust and foreign matter generated by friction. It meets the production efficiency requirements and improves the processing efficiency.

[0044] The non-contact IC substrate surface treatment system provided by the present invention compares the IC substrate surface treatment information feature sequence with the abnormal threshold for different surface treatment industrial computers, and obtains the status information of the IC substrate surface treatment information feature sequence. The IC substrate surface treatment information feature sequence with abnormal conditions is used as the IC substrate surface treatment abnormal sequence, and the surface treatment industrial computer is set to an abnormal state. In this way, according to the comparison result with the abnormal threshold, the IC substrate surface treatment information feature sequence with abnormal conditions can be used as the IC substrate surface treatment abnormal sequence, and the surface treatment industrial computer is set to an abnormal state, which is convenient for identifying and analyzing the abnormality and improving the stability of the IC substrate surface treatment process. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0046] Figure 1 It is a schematic diagram of a non-contact IC substrate surface treatment system;

[0047] Figure 2 It is a schematic diagram of an embodiment of a non-contact IC substrate surface treatment system. DETAILED DESCRIPTION

[0048] like Figure 1 As shown, the diagram provided in the non-contact IC substrate surface treatment system provided by the present invention only illustrates the basic concept of the present invention in a schematic manner. The diagram only shows the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout type may also be more complicated.

[0049] In the non-contact IC carrier surface treatment system provided by the present invention, various embodiments of the present disclosure will be described more comprehensively. The present disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present disclosure to the specific embodiments disclosed herein, but the present disclosure should be understood to cover all adjustments, equivalents and / or alternatives that fall within the spirit and scope of the various embodiments of the present disclosure.

[0050] In the non-contact IC carrier surface treatment system provided by the present invention, the terms "include" or "may include" used in various embodiments of the present disclosure indicate the existence of the disclosed functions, operations or elements, and do not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present disclosure, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0051] In various embodiments of the present disclosure, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0052] The expressions (such as "first", "second", etc.) used in the various embodiments of the present disclosure may modify the various constituent elements in the various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0053] It should be noted that if it is described that one component element is “connected” to another component element, the first component element may be directly connected to the second component element, and a third component element may be “connected” between the first component element and the second component element. Conversely, when one component element is “directly connected” to another component element, it can be understood that there is no third component element between the first component element and the second component element.

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] See also Figure 1 The non-contact IC carrier surface treatment system in a specific embodiment includes: a surface treatment body and a surface treatment industrial computer; the surface treatment body is a mechanism for setting the surface treatment of the IC carrier. The surface treatment industrial computer can be implemented in various forms. For example, the terminal described in the embodiment of the present invention may include a notebook computer, a tablet computer (PAD), etc. and a fixed terminal such as a digital TV, a desktop computer, etc. It will be understood by those skilled in the art that, in addition to components specifically used for mobile purposes, the construction according to the embodiment of the present invention can also be applied to a fixed type of terminal.

[0056] According to the embodiment of the present application, a horizontal moving device is installed on the upper surface of the surface treatment machine body. The horizontal moving device of this embodiment is implemented by using magnetic levitation to transport the IC carrier, which can achieve non-contact and good surface treatment effect.

[0057] Specifically, the horizontal moving device is provided with an electromagnetic track coil 1 that passes through both ends of the upper surface of the surface treatment body, and the transport carrier 6 is provided with a plurality of permanent magnets. When the electromagnetic track coil 1 is energized, a magnetic field is generated. By utilizing the principle that magnets of the same polarity repel each other, the electromagnetic track can push the transport carrier to carry the IC carrier to move horizontally. The surface treatment industrial computer is connected to the electromagnetic track coil 1 for communication and controls the operation of the electromagnetic track coil 1. In this way, the surface treatment industrial computer can control the transport carrier 6 to carry the IC carrier to move horizontally according to the preset carrier surface treatment process requirements.

[0058] In one embodiment of the present invention, based on the above non-contact IC carrier surface treatment system, a possible embodiment is given below to illustrate its specific implementation scheme in a non-limiting manner. The following embodiment is described by taking the IC carrier moving in a magnetic levitation manner as an example.

[0059] According to an embodiment of the present application, the first end of the surface treatment body is a feed end, and a conveying carrier 6 compatible with the horizontal moving device is provided at the feed end; the IC carrier to be processed is placed on the conveying carrier 6 and moved horizontally on the horizontal moving device; the second end of the surface treatment body is a discharge end, and a surface treatment device 2, a surface dust sticking device 3, a preheating device 4 and a surface film pasting device 5 are sequentially installed from the first end to the second end of the surface treatment body; the surface treatment industrial control computer is respectively communicated with the horizontal moving device, the surface treatment device 2, the surface dust sticking device 3, the preheating device 4 and the surface film pasting device 5, and based on the preset carrier surface treatment process, the horizontal moving device, the surface treatment device 2, the surface dust sticking device 3, the preheating device 4 and the surface film pasting device 5 are respectively controlled to operate, so as to realize the surface treatment operation of the IC carrier.

[0060] In an exemplary embodiment, the surface treatment device 2 is provided with a liquid medicine flow meter, a liquid medicine control valve, a liquid medicine flow control valve, a flushing and drying timing module and a drying temperature sensor; the surface treatment industrial computer is respectively communicated with the liquid medicine flow meter, the liquid medicine control valve, the liquid medicine flow control valve, the flushing and drying timing module and the drying temperature sensor to obtain the liquid medicine flow information, the flushing and drying time information and the drying temperature information during the operation of the surface treatment device 2; the surface dust-binding device 3 is provided with a silicone straight roller and a rubber roller pressure sensor.

[0061] In this embodiment, the surface treatment industrial computer is connected to the rubber rolling pressure sensor for communication to obtain the rolling pressure information of the silicone straight roller.

[0062] The preheating device 4 of this embodiment is provided with a heating mechanism and a heating temperature sensor; the surface treatment industrial computer is respectively connected to the heating mechanism and the heating temperature sensor for communication, obtains the heating temperature information, and controls the operation of the heating mechanism.

[0063] The surface laminating device 5 of the present embodiment is provided with a laminating pressure sensor; the surface treatment industrial control computer is respectively connected to the laminating pressure sensor for communication to obtain the pressure information of the laminating wheel.

[0064] In order to be able to identify the moving position of the transport carrier 6, when the transport carrier 6 moves to the surface treatment device 2, the surface dust removal device 3, the preheating device 4 and the surface film pasting device 5, the surface treatment industrial computer can control the corresponding devices to realize intelligent and automatic IC substrate surface treatment.

[0065] In this embodiment, a first position sensor is arranged near the surface treatment device 2; a second position sensor is arranged near the surface dust sticking device 3; a third position sensor is arranged near the preheating section device 4; and a fourth position sensor is arranged near the surface film pasting device 5; the first position sensor, the second position sensor, the third position sensor and the fourth position sensor are respectively communicated with the surface treatment industrial computer, and the surface treatment industrial computer obtains the moving position of the IC carrier based on the above position sensors and triggers the operation of the corresponding device.

[0066] It should be noted that the first position sensor, the second position sensor, the third position sensor and the fourth position sensor can adopt photoelectric sensors, or related sensors such as travel switches, to send position signals to the surface treatment industrial computer, so that the surface treatment industrial computer controls the operation of corresponding devices to achieve surface treatment of the IC substrate.

[0067] On the basis of the above embodiments, in order to further improve the reliability of the non-contact IC substrate surface treatment provided by the above embodiments, an practicable method is provided. In one embodiment, according to actual needs, such as Figure 2 As shown, a surface treatment server, a plurality of surface treatment bodies and a surface treatment industrial computer matched therewith are configured.

[0068] In this embodiment, the surface treatment server obtains surface treatment information of multiple IC substrates uploaded by the same surface treatment industrial computer in the system, analyzes the surface treatment information of the IC substrate, determines whether there is abnormal information, and if so, configures the IC substrate surface treatment abnormal sequence according to the surface treatment abnormal status.

[0069] In an embodiment of the present invention, the surface treatment information of the IC substrate may include but is not limited to liquid medicine flow information, rinsing and drying time information, drying temperature information, liquid medicine control valve operating status information, liquid medicine flow control valve operating status information, horizontal moving device operating status information, rolling pressure information, heating temperature information, and pressure information of the film pressing wheel.

[0070] The device described in this embodiment refers to any one or more of the horizontal moving device, the surface treatment device 2, the surface dust sticking device 3, the preheating device 4 and the surface film sticking device 5.

[0071] The abnormal state determination method in this embodiment may be to compare with preset substrate surface treatment process parameters, or to compare with threshold values ​​of corresponding parameters, or to compare with previous data.

[0072] In this embodiment, the abnormality index of each device is configured according to the abnormal sequence of the surface treatment of the IC substrate.

[0073] The surface treatment information of the IC substrate in the embodiment of the present invention is generated based on the horizontal moving device, the surface treatment device 2, the surface dust sticking device 3, the preheating section device 4 and the surface film sticking device 5. According to the preset substrate surface treatment process or the operating status of each device, the abnormal indicators of each device are configured. For example, the abnormal indicator of the liquid medicine flow information can be that the liquid medicine flow is too large or too small. The liquid medicine control valve fails to open in time, the pressure value of the rolling pressure information is insufficient, the heating temperature is too high or too low, etc.

[0074] Specifically, the IC substrate surface treatment anomaly sequence obtained above can provide surface treatment anomaly status of different IC substrate surface treatment information, and can be summarized by the surface treatment anomaly status of the IC substrate surface treatment information, and the surface treatment anomaly status corresponding to the IC substrate surface treatment information of different devices can be counted in turn as a node anomaly indicator.

[0075] In this embodiment, the abnormal situation is configured according to the node abnormality index and the abnormality thresholds corresponding to different surface treatment industrial computers.

[0076] It should be noted that the abnormality threshold may be a critical value for determining whether each device is abnormal. If the critical value is exceeded, it may be determined that an abnormality exists. The abnormality threshold may be set based on the operating status of each device.

[0077] The embodiments of the present invention can obtain the abnormal indicators and abnormal thresholds of each device, and can compare the abnormal indicators of each device with the abnormal thresholds, so as to determine the relationship between the abnormal indicators and the abnormal thresholds of each device, and the relationship can be used to determine whether each device has an abnormality, so as to clarify the abnormality of the entire system through the abnormality of each device. The problem that the existing indicator abnormality detection does not consider the indicator characteristics and the data information correlation characteristics between each device is solved, and the integrated abnormality detection of the indicators of each device is realized, and the starting boundary of the abnormal event is clarified, which helps to improve the processing efficiency of the abnormal indicators and enhance the stability of the surface treatment of the non-contact IC substrate.

[0078] On the basis of the above-mentioned embodiment, the indicator anomaly detection also includes: extracting the IC substrate surface treatment process characteristics of the IC substrate surface treatment information, and configuring the characteristics of the device according to the device to which each IC substrate surface treatment information belongs, wherein the IC substrate surface treatment process characteristics at least include the fluctuation characteristics of the IC substrate surface treatment information, the median characteristics of the IC substrate surface treatment information and the variation characteristics of the IC substrate surface treatment information; clustering the operating status of the device, which can be divided into a normal surface treatment state or an abnormal surface treatment state; for the device belonging to the abnormal surface treatment state, calling the preset automatic threshold division rule with abnormal assumption conditions to set the abnormal threshold; for the device belonging to the normal surface treatment state, calling the preset automatic threshold division rule without abnormal assumption conditions to set the abnormal threshold.

[0079] In the embodiment of the present invention, the surface treatment process features of the IC substrate can be extracted to analyze the surface treatment information of the IC substrate in an integrated and comprehensive manner. The surface treatment process feature extraction method of the IC substrate may include feature extraction based on basic statistical methods, feature extraction based on models, etc. The surface treatment information of the IC substrate can be clustered according to the characteristics of each device, and the surface treatment information of the IC substrate can be clustered into two categories through the clustering results, namely, the normal state of surface treatment or the abnormal state of surface treatment. It can also be understood that the surface treatment information of the IC substrate corresponding to the surface treatment industrial computer is divided into the normal state of surface treatment or the abnormal state of surface treatment. The clustering method may include the K-means clustering algorithm and the hierarchical clustering algorithm, etc. For the device belonging to the abnormal state of surface treatment, the preset automatic threshold division rule with abnormal assumption conditions can be called to set the abnormal threshold, and the abnormal threshold is set for subsequent extraction.

[0080] In the embodiment, based on the above embodiments, the surface treatment server simultaneously obtains the surface treatment information of the IC substrate uploaded by multiple surface treatment industrial computers, and configures it as a characteristic sequence of the surface treatment information of the IC substrate.

[0081] In this embodiment, the surface treatment server collects the surface treatment information of the IC substrate uploaded by a plurality of surface treatment industrial computers at a preset time interval.

[0082] In the embodiment of the present invention, the preset time interval can be understood as an IC substrate surface treatment information collection interval preset according to the actual operation status of the IC substrate surface treatment.

[0083] The surface treatment server configures the surface treatment information of each IC substrate to the neural network model according to the collection time, so as to configure the feature sequence of the surface treatment information of the IC substrate corresponding to the different collection times.

[0084] In an embodiment of the present invention, the neural network model can process the situation where the input is a continuous sequence with different lengths, and the preset recurrent neural network model can include a neural network GateRecurrentUnit, GRU.

[0085] It should be noted that the collected IC substrate surface treatment information can be configured into the neural network model according to the collection time, so as to obtain the correlation and time characteristics of each IC substrate surface treatment information, and configure the IC substrate surface treatment information feature sequence corresponding to different collection times, so as to perform analysis based on the characteristics of each IC substrate surface treatment information.

[0086] The surface treatment server uses a variational autoencoder to process the IC substrate surface treatment information feature sequence into a substrate surface treatment process sequence.

[0087] In the embodiment of the present invention, the variational autoencoder is a preset deep configuration model, which can be used to detect anomalies in the surface treatment information of IC substrates uploaded by multiple surface treatment industrial computers.

[0088] Specifically, the feature sequence of the surface treatment information of each IC substrate can be trained and learned according to the variational autoencoder to obtain important features in the surface treatment information of the IC substrate, and used for subsequent tasks such as classification and clustering.

[0089] The surface treatment server sorts the surface treatment process sequences of each substrate according to the surface treatment process as an abnormal surface treatment sequence of the IC substrate.

[0090] The substrate surface treatment process sequence uploaded by the surface treatment industrial computer is analyzed to determine whether there is abnormal information. If so, the substrate surface treatment process sequence is configured as an IC substrate surface treatment abnormal sequence.

[0091] This embodiment also scores each IC substrate surface treatment information in the substrate surface treatment process sequence, and gives a standard score under normal circumstances. If an abnormality occurs, a score is deducted. Each IC substrate surface treatment information in the IC substrate surface treatment abnormality sequence is sorted according to the score. The smaller the score of each IC substrate surface treatment information in the IC substrate surface treatment abnormality sequence, the more abnormal the corresponding IC substrate surface treatment information is.

[0092] The surface treatment server extracts the sorting sequence number of each IC substrate surface treatment information in the IC substrate surface treatment abnormal sequence as the abnormality score corresponding to each IC substrate surface treatment information.

[0093] Specifically, the smaller the sorting number of the IC substrate surface treatment abnormality sequence, the more abnormal the corresponding IC substrate surface treatment information is. The sorting number of each IC substrate surface treatment information in the IC substrate surface treatment abnormality sequence can be extracted as the abnormality score corresponding to the IC substrate surface treatment information. The abnormality score can reflect the surface treatment abnormality status of the IC substrate surface treatment information.

[0094] The surface treatment server uses the sum of scores corresponding to the surface treatment information of the IC substrate uploaded by each surface treatment industrial computer as the abnormality indicator of the corresponding surface treatment industrial computer. It can be understood that under normal circumstances, the sum of scores corresponding to the surface treatment information of the IC substrate uploaded by the surface treatment industrial computer is a value within the preset score range. If an abnormality occurs, it will be lower than the preset score range. A too low score can be judged as a serious abnormality.

[0095] In this embodiment, an abnormal threshold can be set based on the substrate surface treatment process configured by the surface treatment industrial computer. The substrate surface treatment process is to set different substrate surface treatment processes according to different models of IC substrates, or based on preset processing conditions to meet the requirements. In this way, different substrate surface treatment processes can match different abnormal thresholds. When configuring the substrate surface treatment process for the surface treatment industrial computer, a matching abnormal threshold is also configured at the same time.

[0096] For different surface treatment industrial computers, the IC substrate surface treatment information feature sequence is compared with the abnormal threshold to obtain the status information of the IC substrate surface treatment information feature sequence. The IC substrate surface treatment information feature sequence with abnormal conditions is used as the IC substrate surface treatment abnormal sequence, and the surface treatment industrial computer is set to an abnormal state. In this way, according to the comparison result with the abnormal threshold, the IC substrate surface treatment information feature sequence with abnormal conditions can be used as the IC substrate surface treatment abnormal sequence, and the surface treatment industrial computer is set to an abnormal state, which is convenient for identifying and analyzing the abnormality and improving the stability of the IC substrate surface treatment process.

[0097] Based on the above-mentioned non-contact IC carrier surface treatment system, various chemical liquids are used to remove oil, roughen the copper surface, pickle, wash, dry and other treatments on the surface of the IC carrier during the processing. Among them, surface dust adhesion is to use a silicone straight roller to carry out dust adhesion treatment on the environmental drops on the surface of the IC carrier. Preheating is to use a heater to heat the IC carrier to reach the temperature required for surface film pasting. Surface film pasting is to attach a photosensitive dry film to the surface of the IC carrier. The horizontal moving device can make the transport carrier of the IC carrier pass through the surface treatment device 2, the surface dust adhesion device 3, the preheating device 4 and the surface film pasting device 5 in sequence before the surface treatment, and the horizontal moving device has the function of magnetic transport. The transport carrier can lift the IC carrier and transport it through the horizontal moving device, and the transport carrier has the characteristic of non-contact with the key area of ​​the IC carrier. The system of the present invention lifts the IC carrier through the conveying carrier, provides support while avoiding contact with key areas, and then magnetically conveys the conveying carrier with the IC carrier through the conveying track, and sequentially goes through the process stages of surface treatment, surface dust adhesion, preheating, surface film lamination, etc. The magnetic conveying provides zero-friction conveying force to avoid dust and foreign matter generated by friction. It meets the production efficiency requirements and improves the processing efficiency.

[0098] The following is an embodiment of a non-contact IC carrier surface treatment method provided by an embodiment of the present disclosure. This method and the non-contact IC carrier surface treatment system of the above-mentioned embodiments belong to the same inventive concept. For details not described in detail in the embodiment of the non-contact IC carrier surface treatment method, reference can be made to the above-mentioned embodiment of the non-contact IC carrier surface treatment system.

[0099] Methods include:

[0100] Step 1: Place the IC carrier with preset length, width and thickness on the transport carrier 6 and fix it;

[0101] Step 2: placing the transport carrier 6 with the IC carrier on the horizontal moving device, or installing the transport carrier on the horizontal moving device;

[0102] Step 3: Start the horizontal moving device to make the transport carrier 6 transport the IC carrier at a set speed;

[0103] Step 4: The IC substrate is moved to the surface treatment device 2, and the surface treatment device 2 sprays a liquid medicine onto the IC substrate to rinse the IC substrate in sequence, and then dries the IC substrate after rinsing;

[0104] Step 5: transport the IC carrier to the surface dust sticking device 3, and the silicone straight roller of the surface dust sticking device 3 sticks dust to the surface of the IC carrier;

[0105] Step 6: transport the IC carrier to the preheating device 4, and the hot air in the preheating device 4 heats the IC carrier to a set temperature;

[0106] Step 7: transport the IC substrate to the surface film mounting device 5 , and the surface film mounting device 5 performs surface film mounting on the IC substrate.

[0107] After placing the IC carrier on the horizontal moving device in combination with the above-mentioned non-contact IC carrier surface treatment method, the key areas of the IC carrier do not contact any transport components except for the liquid medicine, silicone straight roller, and photosensitive dry film during the entire process, thus achieving non-contact transport of the key areas of the IC carrier and avoiding the problem of friction pits and protrusions; the application of magnetic transport of the horizontal moving device ensures zero friction between the transport and the transport fixture, avoiding the problem of dust and foreign matter generated by friction. While improving quality, it also ensures production efficiency.

[0108] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A non-contact IC substrate surface treatment system, characterized in that: include: Surface treatment body and surface treatment industrial computer; A horizontal moving device is installed on the upper surface of the surface treatment machine body; The first end of the surface treatment machine body is a feed end, and a transport carrier (6) adapted to the horizontal moving device is provided at the feed end; the IC substrate to be processed is placed on the transport carrier (6) and moves horizontally on the horizontal moving device; The second end of the surface treatment body is a discharge end, and a surface treatment device (2), a surface dust sticking device (3), a preheating device (4) and a surface film sticking device (5) are sequentially installed from the first end to the second end of the surface treatment body; The surface treatment industrial control computer is respectively connected to the horizontal moving device, the surface treatment device (2), the surface dust sticking device (3), the preheating device (4) and the surface film sticking device (5) for communication, and controls the operation of the horizontal moving device, the surface treatment device (2), the surface dust sticking device (3), the preheating device (4) and the surface film sticking device (5) based on a preset substrate surface treatment process, so as to achieve surface treatment of the IC substrate; The horizontal moving device is provided with an electromagnetic track coil penetrating through both ends of the upper surface of the surface treatment body, and the transport carrier is provided with a plurality of permanent magnets. When the electromagnetic track coil is energized, a magnetic field is generated. By utilizing the principle that like-sex magnets repel each other, the electromagnetic track coil pushes the transport carrier to carry the IC carrier to move horizontally; The surface treatment industrial computer is connected to the electromagnetic track coil for communication to control the operation of the electromagnetic track coil.

2. The non-contact IC substrate surface treatment system according to claim 1, characterized in that: A first position sensor is arranged near the surface treatment device (2); a second position sensor is arranged near the surface dust sticking device (3); a third position sensor is arranged near the preheating device (4); and a fourth position sensor is arranged near the surface film sticking device (5); The first position sensor, the second position sensor, the third position sensor and the fourth position sensor are respectively connected to the surface treatment industrial computer for communication. The surface treatment industrial computer obtains the moving position of the IC carrier based on the above position sensors and triggers the operation of corresponding devices.

3. The non-contact IC substrate surface treatment system according to claim 2, characterized in that: The surface treatment device (2) is provided with a liquid medicine flow meter, a liquid medicine control valve, a liquid medicine flow control valve, and a drying temperature sensor; The surface treatment industrial computer is respectively connected to the liquid medicine flow meter, the liquid medicine control valve, the liquid medicine flow control valve, and the drying temperature sensor to obtain liquid medicine flow information and drying temperature information during the operation of the surface treatment device (2); The surface dust sticking device (3) is provided with a silicone straight roller and a rubber rolling pressure sensor; The surface treatment industrial computer is connected to the rubber rolling pressure sensor for communication to obtain the rolling pressure information of the silicone straight roller.

4. The non-contact IC substrate surface treatment system according to claim 2, characterized in that: The preheating device (4) is provided with a heating mechanism and a heating temperature sensor; The surface treatment industrial computer is respectively connected to the heating mechanism and the heating temperature sensor for communication, obtains the heating temperature information, and controls the operation of the heating mechanism; The surface film sticking device (5) is provided with a film pressing pressure sensor; The surface treatment industrial computer is connected to the lamination pressure sensor for communication to obtain the pressure information of the lamination wheel.

5. The non-contact IC substrate surface treatment system according to claim 2, characterized in that: The system also includes: a surface treatment server, a plurality of surface treatment bodies and a surface treatment industrial computer matched therewith; The surface treatment server obtains surface treatment information of multiple IC substrates uploaded by the same surface treatment industrial computer in the system, analyzes the surface treatment information of the IC substrate, and determines whether there is abnormal information. If so, configures the surface treatment abnormal sequence of the IC substrate according to the abnormal state of the surface treatment; Configure the abnormal indicators of each device according to the abnormal sequence of IC substrate surface treatment; Configure abnormal situations according to node abnormality indicators and abnormal thresholds corresponding to different surface treatment industrial computers.

6. The non-contact IC substrate surface treatment system according to claim 5, characterized in that: The surface treatment server obtains the surface treatment information of the IC substrate uploaded by multiple surface treatment industrial computers at a preset time interval; The surface treatment information of each IC substrate is configured to the neural network model according to the acquisition time, so as to configure the feature sequence of the surface treatment information of the IC substrate corresponding to the different acquisition times; A variational autoencoder is used to process the IC substrate surface treatment information feature sequence into a substrate surface treatment process sequence; The surface treatment process sequences of each substrate are sorted according to the surface treatment process as an abnormal surface treatment sequence of the IC substrate; The surface treatment server analyzes the substrate surface treatment process sequence uploaded by the surface treatment industrial computer to determine whether there is abnormal information. If so, the substrate surface treatment process sequence is configured as an IC substrate surface treatment abnormal sequence.

7. The non-contact IC substrate surface treatment system according to claim 6, characterized in that: The surface treatment server scores each IC substrate surface treatment information in the substrate surface treatment process sequence, gives a standard score under normal circumstances, and deducts points if an abnormality occurs; sorts each IC substrate surface treatment information in the IC substrate surface treatment abnormality sequence according to the score; Extracting the sorting sequence numbers of the surface treatment information of each IC substrate in the IC substrate surface treatment abnormality sequence as the abnormality scores corresponding to the surface treatment information of each IC substrate; The sum of the scores corresponding to the surface treatment information of the IC substrate uploaded by each surface treatment industrial computer is used as the abnormality indicator of the corresponding surface treatment industrial computer.

8. A non-contact IC substrate surface treatment method, characterized in that: The method is implemented based on the non-contact IC substrate surface treatment system according to any one of claims 1 to 7; the method comprises: Step 1: Place the IC carrier with preset length, width and thickness on the transport carrier (6) and fix it; Step 2: placing the transport carrier (6) with the IC carrier on the horizontal moving device, or installing the transport carrier on the horizontal moving device; Step 3: Start the horizontal moving device to make the transport carrier (6) transport the IC carrier at a set speed; Step 4: The IC substrate is moved to the surface treatment device (2), and the surface treatment device (2) sprays a liquid medicine onto the IC substrate to rinse the IC substrate in sequence, and then dries the IC substrate after rinsing; Step 5: transport the IC carrier to the surface dust sticking device (3), and the silicone straight roller of the surface dust sticking device (3) sticks dust to the surface of the IC carrier; Step 6: transport the IC carrier to the preheating device (4), and the hot air in the preheating device (4) heats the IC carrier to a set temperature; Step seven: transport the IC carrier to the surface film mounting device (5), and the surface film mounting device (5) performs surface film mounting on the IC carrier.

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