Laser processing system and method for improving FPC drilling quality and efficiency

Abstract

The invention relates to the technical field of laser precision machining, and discloses a laser machining system and method for improving FPC drilling quality and efficiency, and the system comprises a nanosecond laser used for generating ultraviolet laser; the zoom beam expander is arranged at the outlet of the nanosecond laser and is used for adjusting the spot diameter of the laser beam; the plurality of reflecting mirrors comprise a reflecting mirror I, a reflecting mirror II, a reflecting mirror III and a reflecting mirror IV; the galvanometer is used for receiving and controlling the direction of the laser beam to realize drilling path control; the field lens is used for focusing the laser beam to the surface of the FPC to be processed; the processing platform is used for fixing the position of the FPC; and the lead mode laser drilling processing path is used for controlling the laser beam to cut in according to the lead path and completing the drilling operation. By adopting the lead mode technology, the system eliminates worries about the problems of laser switch delay, jump delay and the like while improving the jump speed, so that the production process is greatly simplified, the whole drilling process is more efficient and stable, and the production efficiency of the system is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser precision machining, and in particular to a laser machining system and method for improving the quality and efficiency of FPC drilling. Background Art

[0002] Flexible printed circuit (FPC), also known as soft circuit board or flexible circuit board, is an electronic component with high flexibility and bendability. It is widely used in various electronic devices, especially in situations where compact design and flexible layout are required. The core of FPC is the copper foil layer, which usually has a single layer or multiple layers of copper foil. The copper foil layer is responsible for the conductive function of the circuit. Between the copper foil layers or between the copper foil layer and the substrate, there is one or more layers of insulating materials to form the base layer. Among the many insulating film materials, polyimide and polyester have become the mainstream choice due to their excellent performance. These materials have good heat resistance and chemical stability. These materials not only provide insulation protection, but also enhance the structural strength of the circuit board, enabling it to reduce stress when the circuit board is bent. The thickness of the copper foil is usually between 12 and 25 microns, and the thickness of the insulating film is also roughly between 12 and 25 microns. In order to achieve electrical connection between the copper layers, FPC needs to process through holes or blind holes through high-precision drilling technology. The most widely used processing technology at present is ultraviolet nanosecond laser, which combines the advanced technology of galvanometer and field lens. Its focused spot diameter is between 7 and 15 microns, which can produce extremely high power density. This high power density characteristic enables ultraviolet nanosecond laser to achieve precise drilling operations and ensure high precision and quality of the processing process.

[0003] However, with the continuous increase in market demand, laser drilling equipment has encountered challenges in improving efficiency and ensuring quality. The traditional circle laser drilling method not only needs to consider many delay factors, such as laser switch light delay and device jump delay, which not only greatly reduces the device jump speed and affects the production efficiency of flexible printed circuits (FPC), but also because the delays such as laser switch light and device jump cannot be accurately controlled, which will lead to problems such as insufficient roundness of holes, many burrs on the hole edges and high surface roughness during production. Therefore, significantly improving the production efficiency and quality of FPC without increasing production costs has become a technical problem that needs to be overcome urgently. Summary of the invention

[0004] The main purpose of the present invention is to provide a laser processing system and method for improving the quality and efficiency of FPC drilling, aiming to solve the problems of insufficient drilling roundness, many burrs on the hole edges and surface roughness during production due to the inability to accurately control the delays such as laser switching light and equipment jump in the traditional circle laser drilling method.

[0005] In order to achieve the above-mentioned invention object, the first aspect of the present invention proposes a laser processing system for improving the quality and efficiency of FPC drilling, comprising:

[0006] Nanosecond lasers, used to generate ultraviolet laser light;

[0007] A variable-power beam expander, arranged at the exit of the nanosecond laser, for adjusting the spot diameter of the laser beam;

[0008] A reflector group, wherein the reflector group is used to reflect the laser beam multiple times and guide it to the galvanometer;

[0009] The galvanometer receives and controls the direction of the laser beam to achieve path control of drilling;

[0010] Field lens, focusing the laser beam onto the FPC surface to be processed;

[0011] Processing platform, used to fix the position of FPC;

[0012] The lead mode control unit is connected to the galvanometer and laser signals and is responsible for managing the switching optical signal of the nanosecond laser and the path control signal of the galvanometer.

[0013] Furthermore, the reflector group includes reflector one, reflector two, reflector three, and reflector four.

[0014] Furthermore, the variable-power beam expander includes an automatic adjustment mechanism for automatically adjusting the spot diameter according to the thickness of the FPC or the laser power.

[0015] Furthermore, the processing position of the FPC is determined by focusing the laser beam with a field lens.

[0016] Furthermore, the processing platform includes an automatic calibration system, which can perform real-time calibration according to temperature changes of the platform during the processing.

[0017] Furthermore, the lead mode control unit pre-guides the laser beam before it cuts in through a preset lead path, so as to synchronously control the opening and closing of the laser light and the path jump.

[0018] Furthermore, the nanosecond laser system includes an adaptive control unit capable of adjusting the power and frequency of the laser through real-time feedback.

[0019] Furthermore, the adaptive control unit is interconnected with the automatic calibration system, and the adaptive control unit automatically adjusts the power and frequency of the nanosecond laser and the positioning of the processing platform based on the real-time feedback signal provided by the automatic calibration system.

[0020] Furthermore, the system includes a plurality of beam mode switching functions, and can automatically switch between continuous mode, pulse mode and modulation mode according to processing requirements.

[0021] A second aspect of the present invention provides a laser processing method for improving the quality and efficiency of FPC drilling, comprising the following steps:

[0022] S1: Fix the FPC to be processed on the processing platform;

[0023] S2: Start the nanosecond laser and use the variable-magnification beam expander to adjust the spot size of the laser beam to meet the accuracy requirements of FPC drilling;

[0024] S3: After being reflected by multiple mirrors, the laser beam enters the galvanometer, which controls the movement of the laser beam according to a preset path;

[0025] S4: The laser beam is focused onto the FPC surface through the field lens, the lead mode is started, and the laser beam cuts into the drilling path along the lead path to complete the round hole drilling operation;

[0026] S5: Through the control of the lead pattern, the laser beam cuts in and follows the path to maintain continuous drilling.

[0027] Beneficial effects:

[0028] 1. The present invention adopts advanced lead mode technology. While improving the jump speed, the system effectively eliminates the concerns about laser switch delay and jump delay. This means that operators no longer need to spend time and energy to deal with these cumbersome delay control issues, thereby greatly simplifying the production process. The entire drilling process is more efficient and stable, which greatly improves the production efficiency of the system and makes it more competitive in mass production.

[0029] 2. In the traditional laser drilling process, the operator needs to fine-tune the speed to adapt to the head and tail paths of the laser beam during the laser switching process, which usually leads to increased operational complexity and the accuracy of the circular hole is easily affected. The present invention uses the lead technology to intelligently simplify this process and greatly reduce the need for manual adjustment. The laser beam can run smoothly and stably along the circular path, greatly improving the roundness of the drilling, making each circular hole in the finished product more regular and symmetrical, and significantly improving the quality and consistency of the finished product.

[0030] 3. In the traditional laser drilling process, the laser switch delay and path jump delay are difficult to control accurately, which often causes the laser beam to repeatedly ablate the edge of the hole, resulting in an increase in burrs on the edge of the hole, affecting the processing quality. The present invention uses the lead mode to automatically guide the laser beam to the center of the circle during the switching light stage, accurately avoiding the hole edge area, thereby effectively preventing the laser beam from continuously ablating the hole edge. This improvement not only reduces the burrs on the hole edge, but also makes the hole edge smoother and neater, greatly improving the processing quality.

[0031] 4. The present invention has greatly controlled and improved the edge burr problem of each hole, and the surface roughness of the finished FPC is significantly reduced after laser drilling. This feature brings great convenience to the subsequent processing technology, especially the surface treatment process such as copper electroplating. The flat and smooth surface allows the electroplating layer to adhere to the FPC surface more evenly, improves the electrical performance and product durability, and further improves the overall quality of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the implementation of a laser processing system technical solution for improving the quality and efficiency of FPC drilling of the present invention;

[0033] Figure 2 It is a schematic diagram of the lead mode laser drilling processing principle of the present invention.

[0034] in:

[0035] 1-nanosecond laser; 2-variable beam expander; 3-reflector one; 4-reflector two; 5-reflector three; 6-reflector four; 7-galvanometer; 8-field mirror; 9-back plate; 10-processing platform; 11-FPC; 12-lead mode laser drilling processing path; 13-circular drilling path; 14-switching light cutting into the lead path; 15-center coordinate axis.

[0036] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] Reference Figure 1-Figure 2 An embodiment of the present invention provides a laser processing system for improving the quality and efficiency of FPC drilling, comprising:

[0042] Nanosecond laser 1 is used to generate ultraviolet laser. Ultraviolet nanosecond laser 1 can accurately process FPC11 through high power density, which is suitable for the high precision requirements of FPC11. The system of nanosecond laser 1 includes an adaptive control unit, which can adjust the power and frequency of the laser through real-time feedback to adapt to the processing requirements of FPC11 of different thicknesses and optimize the drilling accuracy. The ultraviolet band laser beam of nanosecond laser 1 can effectively avoid the influence of thermal effects, minimize the heat-affected zone during the drilling process, and thus ensure the stability and integrity of the FPC11 material during the processing process.

[0043] The variable-power beam expander 2 is arranged at the exit of the nanosecond laser 1 and is used to adjust the spot diameter of the laser beam. The variable-power beam expander 2 includes an automatic adjustment mechanism for automatically adjusting the spot diameter according to the thickness of the FPC 11 or the laser power to optimize the drilling accuracy. The variable-power beam expander 2 can flexibly adjust the size of the laser beam to meet the drilling requirements of different sizes and shapes. Its beam expansion function changes the spot diameter by adjusting the optical elements, so that the laser beam can be more accurately focused on a specific area of ​​the FPC 11 to achieve high-quality drilling operations.

[0044] The reflector group includes reflector 1 3, reflector 2 4, reflector 3 5 and reflector 4 6, each of which is responsible for reflecting the laser beam to the next component along a predetermined path. Multiple reflectors are used to reflect the laser beam multiple times and guide it to the galvanometer 7. The surface of the reflector is specially coated to ensure high reflectivity and low loss, maximizing the energy transmission efficiency of the laser beam. Multiple reflectors not only ensure the precise transmission of the laser beam, but also make the layout of the system more flexible and adaptable to different processing environments.

[0045] The galvanometer 7 is used to receive and control the direction of the laser beam. The galvanometer 7 system can quickly adjust the path of the laser beam through high-precision motor control, thereby achieving efficient drilling trajectory control. The swing speed and accuracy of the galvanometer 7 determine whether the drilling path can be kept consistent, and in the lead mode, it can ensure that the laser beam performs drilling operations according to the planned path.

[0046] The field lens 8 is used to focus the laser beam onto the surface of the FPC11 to be processed. The processing position of the FPC11 is focused by the field lens 8 to achieve accurate position during the drilling process. The function of the field lens 8 is to further shrink the spot diameter of the laser beam so as to achieve accurate processing on the surface of the FPC11. Through the focusing of the field lens 8, the laser beam can act on a small area on the surface of the FPC11 with high power density, thereby achieving high-precision micro-hole processing.

[0047] The processing platform 10 is used to fix the position of FPC11. The processing platform 10 not only provides stable mechanical support, but also includes an automatic adjustment function, which can automatically adjust the position according to the size and processing requirements of FPC11 to ensure that FPC11 maintains precise positioning during the drilling process. In addition, the processing platform includes an automatic calibration system, which can perform real-time calibration according to the temperature change of the platform during the processing process to maintain the precise positioning of FPC11. The precision motion control system of the platform 10 can ensure micron-level positioning accuracy during the processing.

[0048] The lead mode control unit includes a lead mode laser drilling processing path 12, which is used to control the laser beam to cut in along the lead path and complete the drilling operation. The lead mode controls the laser beam to cut in from the edge position of the circular drilling path 13 and drill along a preset trajectory, avoiding the influence of the delay of the switch light cutting into the lead path 14 on the processing accuracy in the traditional drilling mode. The lead mode is used to reduce the delay of the laser beam during the switching light and path jump, and maintain the accuracy of the path when the laser beam cuts in. The lead mode can ensure that the roundness of each hole is more consistent and reduce burrs and edge irregularities during the processing process.

[0049] The back plate 9 is used to provide stable support for the entire system, connect the processing platform 10 with other components, and ensure stable operation of the system.

[0050] The center coordinate axis 15 is used to mark the drilling position in the circular drilling path 13 and ensure the drilling accuracy, so as to ensure that the drilling path is consistent with the surface position of the FPC 11 .

[0051] The system includes a variety of beam mode switching functions, which can automatically switch between continuous mode, pulse mode and modulation mode according to processing requirements. This function can switch different laser beam modes according to specific processing requirements to adapt to different processing scenarios and material types.

[0052] The functions in a laser processing system involve multiple key components and their interaction. Here is how each function is implemented in the system, including the working principles and synergies of each component:

[0053] 1. Nanosecond laser and adaptive control unit

[0054] Function: Adjust the power and frequency of the laser through real-time feedback to adapt to FPCs of different thicknesses and optimize drilling accuracy.

[0055] Implementation: A nanosecond laser generates ultraviolet laser light, and its adaptive control unit detects the thickness and material properties of the FPC in real time through sensors. Through a feedback system, the laser automatically adjusts the power and frequency of the laser. For example, a thicker FPC may require higher power and lower frequency, while a thinner FPC requires relatively lower power and higher frequency. The control unit continuously monitors and adjusts the laser output to ensure the accuracy and consistency of the processing.

[0056] 2. Automatic adjustment mechanism of the zoom beam expander

[0057] Function: Automatically adjust the spot diameter of the laser beam according to the thickness of the FPC or the laser power.

[0058] Implementation: The zoom beam expander contains multiple adjustable optical elements, such as convex and concave lenses, which can change the distance between the lenses through a mechanical or electronic control system to adjust the divergence angle and spot size of the laser beam. The sensor detects the thickness of the FPC and the power of the laser, and adjusts the configuration of the beam expander through the servo system to ensure that the spot size matches the processing requirements. For example, a larger spot is used for a larger aperture, and a smaller spot is used for micro-hole drilling.

[0059] 3. Multiple reflections of the laser beam by the mirror system

[0060] Function: Reflect the laser beam multiple times and guide it to the galvanometer.

[0061] Implementation: The mirrors in the system are coated with highly reflective materials (such as silver or gold coatings) to minimize the energy loss of the laser beam. After the laser beam is emitted from the nanosecond laser, it is guided to the galvanometer by a series of mirrors. The angles of these mirrors can be precisely adjusted as needed to ensure that the path of the laser beam in space is controllable and efficient. This configuration allows components such as lasers and galvanometers to be arranged in different positions without affecting the final transmission quality of the laser beam.

[0062] 4. Galvanometer controls the laser beam path

[0063] Function: The direction of the laser beam is controlled by the galvanometer to achieve precise control of the drilling path.

[0064] Implementation: The galvanometer system relies on high-speed motor drive and can quickly change the direction of the laser beam according to the preset control signal. The galvanometer is usually controlled by two axes (X and Y), which can quickly change the positioning of the laser beam on the FPC surface. Through computer control, the galvanometer system can achieve precise drilling path control to ensure that the laser beam moves according to a predetermined pattern or path.

[0065] 5. Field lens focuses the laser beam

[0066] Function: Focus the laser beam to the processing position of FPC to ensure the accuracy of the spot position.

[0067] Implementation method: The field mirror is located after the galvanometer and is used to further focus the laser beam after reflection and control. The focal length of the field mirror is precisely calculated to converge the laser beam into a small spot and achieve high energy density on the FPC surface. By precisely controlling the focal length of the field mirror, the laser beam can achieve high-precision drilling on the FPC surface at different depths.

[0068] 6. Automatic calibration system of processing platform

[0069] Function: Real-time calibration based on platform temperature changes to ensure accurate positioning of the FPC during processing.

[0070] Implementation: The processing platform is equipped with a temperature sensor to monitor the temperature changes of the platform in real time. As the temperature rises or falls during the processing, the platform material may undergo slight thermal expansion or contraction, which will affect the positioning of the FPC. The calibration system automatically adjusts the height or position of the platform to compensate for these errors caused by temperature changes, ensuring that the FPC always remains in the correct processing position. The servo motor and feedback system work together to automatically adjust the slight displacement of the platform.

[0071] 7. Lead pattern controls the laser path

[0072] Function: Reduce the delay of the laser beam during switching light and path jumping, and maintain the path accuracy during cutting.

[0073] Implementation method: The lead mode is a technology that optimizes path planning. By setting a "lead path" before drilling, the laser beam will first follow the lead path to enter the actual trajectory of the drilling. This method effectively solves the path error caused by laser switch delay or galvanometer jump in traditional laser processing. The lead path provides a buffer section before the formal drilling begins, so that the laser beam has stable operation when entering the circular drilling path, thereby reducing the delay effect of turning on and off the light.

[0074] 8. Multiple beam mode switching functions

[0075] Function: Automatically switch between continuous mode, pulse mode and modulation mode according to processing requirements.

[0076] Implementation: The laser control system can automatically adjust the laser's operating mode according to user settings or real-time feedback. Continuous mode is suitable for fast cutting, pulse mode is suitable for precision drilling, and modulation mode is used for processing complex patterns. The control system dynamically selects the most suitable beam mode according to the characteristics of the processing material and specific processing requirements to ensure the best processing effect under different process conditions.

[0077] This embodiment significantly improves the efficiency and quality of laser drilling by introducing advanced lead mode technology, which not only solves the problems of laser switch delay and path jump delay in traditional processes, making the operation simpler and more efficient, but also greatly improves the accuracy and consistency of round holes, effectively reduces the problem of burrs on the edge of holes, and improves the smoothness of the FPC surface. Ultimately, the optimized drilling effect brings better adhesion and product durability to subsequent processes such as copper electroplating, which improves the overall quality of the finished product and is extremely competitive.

[0078] A laser processing method for improving FPC drilling quality and efficiency, comprising the following steps:

[0079] S1: The FPC 11 to be processed is fixed on the processing platform 10, and the processing platform 10 is used to automatically adjust according to the size of the FPC 11. Through a precise mechanical system, the processing platform 10 can automatically adjust according to the size and shape of the FPC 11 to ensure that the FPC 11 remains stable during the processing to avoid vibration or displacement during processing.

[0080] S2: Start the nanosecond laser 1 and use the variable magnification beam expander 2 to adjust the spot size of the laser beam to meet the precision requirements of drilling holes in FPC11. Through the automatic adjustment of the variable magnification beam expander 2, the laser beam can select the appropriate spot diameter according to the material thickness and aperture size of FPC11 to ensure the accuracy and consistency of drilling holes.

[0081] S3: After being reflected by reflector 1 3, reflector 2 4, reflector 3 5, and reflector 4 6, the laser beam enters the galvanometer 7, which controls the movement of the laser beam according to the preset path. The reflector system ensures that the laser beam can be accurately transmitted to the galvanometer 7, and the galvanometer 7 guides the laser beam along the predetermined drilling path at high speed and high precision according to the control signal.

[0082] S4: The laser beam is focused onto the surface of FPC11 through the field lens 8, and the lead mode laser drilling processing path 12 is started. The laser beam cuts into the lead path 14 and the circular drilling path 13 along the switch light to complete the circular hole drilling operation. Through the lead mode laser drilling processing path 12, the laser beam can enter the drilling area along the preset path, avoiding the path error problem caused by the delay of turning on and off the light, and ensuring the accuracy of the circular hole.

[0083] S5: Through the control of the lead mode laser drilling processing path 12, the laser beam cuts in and follows the path to avoid the delay effect and maintain continuous drilling. Under the control of the lead mode laser drilling processing path 12, the galvanometer 7 can ensure the accuracy of the laser beam path and avoid the path deviation caused by the laser switching light, thereby maintaining a stable path following capability during the drilling process.

[0084] S6: After drilling is completed, the finished product is inspected to confirm that the hole geometry and surface condition meet the requirements, and to ensure that the hole roundness, edge quality and surface smoothness meet the expected processing requirements.

[0085] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A laser processing system for improving the quality and efficiency of FPC drilling, characterized in that: include: Nanosecond lasers, used to generate ultraviolet laser light; A variable-power beam expander, arranged at the exit of the nanosecond laser, for adjusting the spot diameter of the laser beam; A reflector group, wherein the reflector group is used to reflect the laser beam multiple times and guide it to the galvanometer; The galvanometer receives and controls the direction of the laser beam to achieve path control of drilling; Field lens, focusing the laser beam onto the FPC surface to be processed; Processing platform, used to fix the position of FPC; The lead mode control unit is connected to the galvanometer and laser signals and is responsible for managing the switching optical signal of the nanosecond laser and the path control signal of the galvanometer.

2. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The reflector group includes reflector one, reflector two, reflector three and reflector four.

3. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The variable-power beam expander includes an automatic adjustment mechanism for automatically adjusting the spot diameter according to the thickness of the FPC or the laser power.

4. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The processing position of the FPC is determined by focusing the laser beam through a field lens.

5. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The processing platform includes an automatic calibration system, which can perform real-time calibration according to the temperature change of the platform during the processing.

6. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The lead mode control unit performs pre-guidance before the laser beam cuts in through a preset lead path, so as to synchronously control the opening and closing of the laser light and the path jump.

7. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The nanosecond laser system includes an adaptive control unit that can adjust the power and frequency of the laser through real-time feedback.

8. The laser processing system for improving FPC drilling quality and efficiency according to claim 7, characterized in that: The adaptive control unit is interconnected with the automatic calibration system. The adaptive control unit automatically adjusts the power and frequency of the nanosecond laser and the positioning of the processing platform based on the real-time feedback signal provided by the automatic calibration system.

9. The laser processing system for improving FPC drilling quality and efficiency according to claim 1, characterized in that: The system includes a variety of beam mode switching functions, and can automatically switch between continuous mode, pulse mode and modulation mode according to processing requirements.

10. A laser processing method for improving FPC drilling quality and efficiency, characterized in that: A laser processing system for improving the quality and efficiency of FPC drilling according to any one of claims 1 to 9, comprising the following steps: S1: Fix the FPC to be processed on the processing platform; S2: Start the nanosecond laser and use the variable-magnification beam expander to adjust the spot size of the laser beam to meet the accuracy requirements of FPC drilling; S3: After being reflected by multiple mirrors, the laser beam enters the galvanometer, which controls the movement of the laser beam according to a preset path; S4: The laser beam is focused onto the FPC surface through the field lens, the lead mode is started, and the laser beam cuts into the drilling path along the lead path to complete the round hole drilling operation; S5: Through the control of the lead pattern, the laser beam cuts in and follows the path to maintain continuous drilling.

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