Optical coupler device and preparation method

Abstract

The invention discloses an optocoupler device and a preparation method. The optocoupler device comprises a support with a cup body, a light-emitting chip and a receiving chip which are arranged in the cup body, a filling layer arranged in the cup body, and a plastic packaging layer covering the cup body. The support with the cup body comprises a molding layer and a plurality of electrodes, the plurality of electrodes are distributed according to a preset interval, and the molding layer is partially filled in the interval of the plurality of electrodes, so that the plurality of electrodes and the molding layer are combined to form the support structure with the cup body. According to the invention, the plurality of electrodes are filled with the molding layers for fixation to form the bracket with the cup body, so that the bracket is stable in structure, and the stability and the reliability during packaging of the light-emitting chip and the receiving chip are improved. The light-emitting chip and the receiving chip are accommodated on the basis of the cup body, the mounting positions of the light-emitting chip and the receiving chip are limited, the packaging structure of the optical coupler device is simplified, and miniaturized packaging of the optical coupler device is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic devices, and in particular to an optical coupling device and a preparation method thereof. Background Art

[0002] Optocoupler devices refer to devices that use light as the medium to transmit electrical signals. Generally, they are manufactured by encapsulating an infrared LED chip and a receiving chip in the same housing. The receiving chip receives the light emitted by the LED chip and converts the received light into current output, thereby realizing the "electricity-light-electricity" conversion control. It has the advantages of no contact, strong anti-interference ability, insulation between output and input, and one-way signal transmission.

[0003] The existing optocoupler device structure is mainly divided into horizontal and vertical packaging structures. The chip is plastic-sealed with two different protective glues, which makes the structure of the optocoupler device larger. At the same time, the pins of the current optocoupler device are arranged on the outside of the packaging structure, which increases the overall size of the device. Since the existing optocoupler device has no corresponding fixed structure for the bracket, the optocoupler device is prone to bracket shaking and deformation during manufacturing and transportation, which may cause the gold wire to be disconnected or the gold wire curvature to be poor. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides an optocoupler device and a preparation method. A plurality of electrodes are fixed and shaped by a molding layer, thereby avoiding poor packaging caused by the shaking of the bracket and improving the stability of the device. A cup structure is formed based on the molding layer, which simplifies the packaging structure of the device and reduces the size of the optocoupler device.

[0005] The present invention provides an optocoupler device, which comprises: a bracket with a cup body, a light emitting chip and a receiving chip arranged in the cup body, a filling layer arranged in the cup body, and a plastic sealing layer covering the outside of the cup body;

[0006] The bracket with cup body includes: a molding layer and a plurality of electrodes, wherein the plurality of electrodes are distributed at a preset interval, and the molding layer partially fills the interval between the plurality of electrodes, so that the plurality of electrodes and the molding layer are combined to form the bracket structure with cup body.

[0007] Furthermore, some of the electrodes are rectangular structures, and / or some of the electrodes are irregular polygonal structures.

[0008] Furthermore, any of the electrodes is provided with more than one through hole.

[0009] Furthermore, the plastic encapsulation layer and the molding layer are made of the same plastic encapsulation material.

[0010] Furthermore, the material of the plastic sealing layer and the molding layer is epoxy resin.

[0011] Furthermore, a blind hole is provided on one side of the bottom of any of the electrodes.

[0012] Furthermore, the height of the blind hole is h2, and the thickness of the electrode is h3;

[0013] The constraint relationship between h2 and h3 is: h3*1 / 4≤h2≤h3*2 / 3.

[0014] Furthermore, the value range of h3 is 0.15mm≤h3≤0.3mm.

[0015] Furthermore, the width of the blind hole is w, and the value range of w is: 0.1mm≤w≤0.3mm.

[0016] Furthermore, the height of the cup body is h1, and the value range of h1 is: 300 μm≤h1≤500 μm.

[0017] Furthermore, the inner wall angle of the cup body is α, and the value range of α is: 90°≤α≤150°.

[0018] Furthermore, the molding layer is doped with silicon dioxide powder, and the silicon dioxide powder accounts for 70% to 95% of the total weight of the molding layer.

[0019] Furthermore, the filling layer is a transparent silicone layer, or the filling layer is a red silicone layer.

[0020] The present invention also provides a method for preparing an optical coupler device, the method for preparing the optical coupler device comprising:

[0021] preparing a plurality of electrodes, and distributing the plurality of electrodes to form an initial scaffold;

[0022] Performing a first injection molding operation on the initial bracket to form a molding layer to obtain a bracket with a cup body;

[0023] Bonding the light-emitting chip and the receiving chip to corresponding bonding positions in the cup body of the bracket;

[0024] Filling silica gel in the cup body so that the silica gel covers the light emitting chip and the receiving chip to form a filling layer;

[0025] A second injection molding operation is performed on the outside of the bracket to form a plastic sealing layer to obtain an optocoupler device.

[0026] Furthermore, the step of preparing a plurality of electrodes and distributing the plurality of electrodes to form an initial support comprises:

[0027] Adjust the shape and size of several electrodes according to the package size and chip size of the optocoupler device;

[0028] A plurality of electrodes are placed in the mold according to preset distribution positions.

[0029] Furthermore, the preparation method further comprises:

[0030] According to the packaging requirements of the optocoupler device, a first through hole is formed in a packaging area of ​​the molding layer corresponding to any of the electrodes;

[0031] A second through hole is formed in a packaging area of ​​any electrode corresponding to the plastic packaging layer.

[0032] Furthermore, the preparation method further comprises:

[0033] A blind hole is formed on the outer side of the bottom end of any of the electrodes based on an etching process, or a blind hole is formed on the outer side of the bottom end of any of the electrodes based on a stamping process.

[0034] The present invention provides an optocoupler device and a preparation method thereof. By fixing a plurality of electrode filling molding layers, a bracket with a cup body is formed, so that the bracket structure is stable, and the stability and reliability of the light-emitting chip and the receiving chip during packaging are improved. Based on the cup body accommodating the light-emitting chip and the receiving chip, the installation position of the light-emitting chip and the receiving chip is limited, the packaging structure of the optocoupler device is simplified, and the miniaturized packaging of the optocoupler device is realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a schematic structural diagram of an optocoupler device in an embodiment of the present invention;

[0037] Figure 2 is a schematic diagram of the arrangement of several electrodes in an embodiment of the present invention;

[0038] Figure 3 1 is a top view of a bracket structure with a cup body in an embodiment of the present invention;

[0039] Figure 4 is a flow chart of a method for processing an optocoupler device in an embodiment of the present invention;

[0040] Figure 5 is a schematic structural diagram of an initial support in an embodiment of the present invention;

[0041] Figure 6 is a schematic structural diagram of a bracket with a cup body in an embodiment of the present invention;

[0042] Figure 7 Schematic diagram of the structure of chip bonding in an embodiment of the present invention;

[0043] Figure 8 Schematic diagram of the structure of encapsulated silica gel in an embodiment of the present invention. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Embodiment 1:

[0046] Figure 1 is a schematic diagram of the structure of an optocoupler device in an embodiment of the present invention, Figure 2 FIG. 1 shows a schematic diagram of the arrangement of several electrodes in an embodiment of the present invention. Figure 3 The top view of the bracket structure with a cup body in the embodiment of the present invention is shown, and the optical coupling device includes: a bracket with a cup body, a light emitting chip 3 and a receiving chip 4 arranged in the cup body, a filling layer 5 arranged in the cup body, and a plastic sealing layer 6 covering the outside of the cup body, wherein the filling layer 5 is used to protect the light emitting chip 3 and the receiving chip 4. The plastic sealing layer 6 is used to encapsulate the optical coupling device as a whole, and can meet the complete plastic sealing requirements.

[0047] Specifically, the bracket with a cup body includes: a molding layer 2 and a plurality of electrodes 1, wherein the plurality of electrodes 1 are distributed at a preset interval, and the molding layer 2 partially fills the interval between the plurality of electrodes 1, so that the plurality of electrodes 1 and the molding layer 2 are combined to form the bracket structure with a cup body, and the molding layer 2 forms a cup body structure on the top of the plurality of electrodes 1, so that the light-emitting chip 3 and the receiving chip 4 can be accommodated in the cup body. Based on the bracket structure formed by the cooperation of the plurality of electrodes 1 and the molding layer 2, the stability of the solid crystal and welding wire of the light-emitting chip 3 and the receiving chip 4 can be improved to avoid jitter, thereby improving the stability and reliability of the light-emitting chip 3 and the receiving chip 4 packaged on the bracket structure.

[0048] Furthermore, some of the electrodes 1 are rectangular structures, and / or some of the electrodes 1 are irregular polygonal structures. The electrodes 1 can be rectangular structures, and the sizes of the electrodes 1 can be kept consistent, thereby improving the convenience of cutting and processing the electrodes 1.

[0049] The plurality of electrodes 1 may also be irregular polygonal structures, and the rationality of the spatial distribution of the plurality of electrodes 1 is improved based on the irregular structure, so that the plurality of electrodes 1 form connection positions for accommodating the light-emitting chip 3 and the receiving chip 4 in the cup body, and the plurality of electrodes 1 may form electrode 1 pin distribution at the bottom of the support structure that satisfies the electrical connection of the external circuit.

[0050] Furthermore, based on the design of the electrode 1 with the irregular polygonal structure, the shape and size of the electrode 1 can be adjusted according to the chip size, ensuring that the electrode 1 in the cup body can meet the electrical connection requirements of the light-emitting chip 3 and the receiving chip 4.

[0051] Specifically, in this embodiment, four electrodes 1 are provided, including a first electrode 11, a second electrode 12, a third electrode 13 and a fourth electrode 14, the first electrode 11 and the third electrode 13 are rectangular structures, the second electrode 12 and the fourth electrode 14 are irregular polygonal structures, the first electrode 11 and the second electrode 12 are located on one side of the bracket of the optocoupler device, and the third electrode 13 and the fourth electrode 14 are arranged on the other side of the bracket of the optocoupler device.

[0052] Specifically, the shape and size of the second electrode 12 are smaller than the shape and size of the fourth electrode 14. The second electrode 12 is used to carry the light-emitting chip 3, and the fourth electrode 14 is used to carry the receiving chip 4. Based on the structure that the size of the receiving chip 4 is larger than the size of the light-emitting chip 3, the receiving chip 4 is arranged to be carried on the fourth electrode 14, and the light-emitting chip 3 is arranged to be carried on the second electrode 12, thereby improving the rationality of the distribution of the electrode 1 in the bracket cup structure, so as to position and install the light-emitting chip 3 and the receiving chip 4.

[0053] Furthermore, the bottom electrode 1 of the light-emitting chip 3 is electrically welded to the second electrode 12, the top electrode 1 of the light-emitting chip 3 is electrically connected to the first electrode 11 based on a metal welding wire, the bottom electrode 1 of the receiving chip 4 is electrically welded to the fourth electrode 14, and the top electrode 1 of the receiving chip 4 is electrically connected to the third electrode 13 based on a metal welding wire, so that the light-emitting chip 3 and the receiving chip 4 can be electrically connected to several of the electrodes 1, and the electrode 1 pins formed at the bottom of the optocoupler device based on several of the electrodes 1 can be connected to an external circuit, thereby meeting the use requirements of the light-emitting chip 3 and the receiving chip 4.

[0054] For details, please refer to Figure 2 Any of the electrodes 1 may be provided with more than one through hole, and the more than one through hole includes a first through hole 15 and a second through hole 16, wherein the second through hole 16 is correspondingly arranged in the edge area of ​​the optocoupler device, and the first through hole 15 is located on one side of the second through hole 16 close to the middle area of ​​the optocoupler device.

[0055] The first through hole 15 is used to increase the contact area between the first electrode 11 and the molding layer 2 , so that the molding layer 2 is partially filled in the first through hole 15 , thereby improving the bonding performance between the molding layer 2 and the first electrode 11 .

[0056] The second through hole 16 is used to increase the contact area between the first electrode 11 and the plastic layer 6 so that the plastic layer 6 is partially filled in the second through hole 16, thereby improving the bonding performance between the plastic layer 6 and the first electrode 11 and improving the packaging reliability of the optocoupler device.

[0057] Furthermore, the second electrode 12 , the third electrode 13 and the fourth electrode 14 are provided with the same through-hole structure and functional effect as the first electrode 11 , which will not be described one by one here.

[0058] Furthermore, several of the electrodes 1 can be set as a structure without through holes, and the plastic layer 2 is filled between the several electrodes 1 to achieve connection and fixation of the several electrodes 1, thereby meeting the packaging requirements of the optocoupler device.

[0059] Specifically, a blind hole 17 is provided on one side of the bottom of any of the electrodes 1. When the optocoupler device is soldered to an external device circuit through solder paste, a space for solder paste to creep can be provided based on the blind hole 17, thereby preventing the optocoupler device from floating due to excessive solder paste during the patch operation, and at the same time increasing the bonding strength of the soldering.

[0060] Furthermore, the height of the blind hole 17 is h2, the thickness of the electrode 1 is h3, and the constraint relationship between h2 and h3 is: h3*1 / 4≤h2≤h3*2 / 3, that is, the height of the blind hole 17 is between 1 / 4 and 2 / 3 of the thickness of the electrode 1, which can meet the solder paste creeping requirement when the optocoupler device is subjected to patch operation.

[0061] Furthermore, the value range of h3 is 0.15mm≤h3≤0.3mm, so that the thickness of the electrode 1 can meet the chip welding requirements of the optocoupler device. Through the small-sized electrode 1 structure, the overall packaging thickness of the optocoupler device can be reduced, simplifying the size of the optocoupler device.

[0062] Specifically, the width of the blind hole 17 is w, and the value range of w is: 0.1mm≤w≤0.3mm. The blind hole 17 with a certain width is provided to ensure the reliability of solder creep when the optocoupler device is mounted.

[0063] Specifically, the plastic encapsulation layer 6 and the molding layer 2 may be made of the same plastic encapsulation material, thereby improving the bonding between the plastic encapsulation layer 6 and the molding layer 2 and improving the packaging reliability of the optocoupler device. The plastic encapsulation layer 6 and the molding layer 2 may be made of epoxy resin, and the material composition of the molding layer 2 and the plastic encapsulation layer 6 may be completely consistent, so as to improve the reliability and convenience of the packaging of the optocoupler device.

[0064] Specifically, based on the molding layer 2, a cup structure is formed above several of the electrodes 1, the height of the cup is h1, and the value range of h1 is: 300μm≤h1≤500μm. A cup structure with a certain height is set so that the cup can accommodate the light-emitting chip 3 and the receiving chip 4, and the light-emitting chip 3 has enough space to send light to the receiving chip 4, thereby meeting the use requirements of the optocoupler device.

[0065] Furthermore, the outer wall of the cup body structure is perpendicular to the top surfaces of the several electrodes 1. When the several electrodes 1 are provided with through holes, the outer wall edge of the cup body is located between the first through hole 15 and the second through hole 16, so that the second through hole 16 is located outside the cup body formed by the molding layer 2, so that the molding layer 6 can cover the outside of the molding layer 2 and partially fill the second through holes 16 of the several electrodes 1, thereby improving the reliability and stability of the packaging structure of the molding layer 6.

[0066] Specifically, the inner wall angle of the cup body is α, and the value range of α is: 90°≤α≤150°, that is, the inner wall of the cup body can be a bevel structure. Based on the bevel structure, the reflection and refraction of the light emitted by the light-emitting chip 3 inside the cup body can be improved, thereby improving the receiving ability of the receiving chip 4 to receive the light emitted by the light-emitting chip 3 and improving the reliability of the use of the optocoupler device.

[0067] The inner wall of the cup body may also be a right-angled structure, which can improve the processing convenience of the cup body structure.

[0068] Specifically, the molding layer 2 is doped with silica powder, and the silica powder accounts for 70% to 95% of the total weight of the molding layer 2. The silica powder can improve the light reflection performance of the molding layer 2, so that the molding layer 2 can effectively block the light emitted by the light-emitting chip 3, eliminate the risk of light overflow, and enable the receiving chip 4 to better receive the light emitted by the light-emitting chip 3. At the same time, it can prevent external light from entering the cup body, thereby preventing external light from interfering with the work of the light-emitting chip 3 and the receiving chip 4.

[0069] Furthermore, when the content of the silicon dioxide powder is too high, the bonding performance of the molding layer 2 is reduced, resulting in insufficient connectivity between the molding layer 2 and a plurality of the electrodes 1, thereby affecting the packaging reliability of the optocoupler device.

[0070] Specifically, the filling layer 5 is a transparent silicone layer, and the light emitting chip 3 and the receiving chip 4 are encapsulated based on the silicone layer, which can effectively protect the light emitting chip 3 and the receiving chip 4 and ensure the packaging reliability of the light emitting chip 3 and the plastic-encapsulated chip.

[0071] Furthermore, the filling layer 5 may also be a red silicone layer, based on which the absorption and transmission of infrared light by the filling layer 5 can be adjusted, so that the filling layer 5 can adjust the emitted and received photoelectricity according to actual conditions, thereby adjusting the performance of the optocoupler device.

[0072] The embodiment of the present invention provides an optocoupler device, which forms a bracket with a cup body by filling a plurality of electrodes 1 with a molding layer 2 for fixing, so that the bracket structure is stable, and the stability and reliability of the light-emitting chip 3 and the receiving chip 4 during packaging are improved. Based on the cup body accommodating the light-emitting chip 3 and the receiving chip 4, the installation positions of the light-emitting chip 3 and the receiving chip 4 are limited, the packaging structure of the optocoupler device is simplified, and the miniaturized packaging of the optocoupler device is realized.

[0073] Embodiment 2:

[0074] Figure 4The flowchart of the method for manufacturing an optical coupler device in an embodiment of the present invention is shown. The manufacturing method is used to manufacture the optical coupler device, and the manufacturing method comprises:

[0075] S11: Prepare the scaffold.

[0076] Figure 5 A schematic structural diagram of an initial bracket in an embodiment of the present invention is shown, a plurality of electrodes 1 are prepared, and the plurality of electrodes 1 are distributed to form an initial bracket, and the shape and size of the plurality of electrodes 1 are adjusted according to the packaging size and chip size of the optocoupler device, so that the shape and size of the plurality of electrodes 1 can meet the die bonding requirements of the light-emitting chip 3 and the receiving chip 4, and at the same time meet the packaging requirements of the optocoupler device.

[0077] Specifically, in this embodiment, according to the packaging requirements of the optocoupler device, a first electrode 11, a second electrode 12, a third electrode 13 and a fourth electrode 14 are prepared, the shape and size of the second electrode 12 are adjusted according to the size of the light-emitting chip 3, and the shape and size of the fourth electrode 14 are adjusted according to the size of the receiving chip 4, so that the second electrode 12 meets the die-bonding installation requirements of the light-emitting chip 3, and the fourth electrode 14 can meet the die-bonding installation requirements of the receiving chip 4.

[0078] The distribution positions of several electrodes 1 are set according to the package size of the optocoupler device, and the several electrodes 1 are placed in the mold according to the preset distribution positions. The first electrode 11, the second electrode 12, the third electrode 13 and the fourth electrode 14 are distributed in the mold according to the preset positions, so that the first electrode 11, the second electrode 12, the third electrode 13 and the fourth electrode 14 are kept at a gap to avoid short circuit between the electrodes 1.

[0079] By adjusting the shape, size and arrangement position of each electrode 1, several electrodes 1 can form an initial bracket in the mold, thereby meeting the packaging requirements of the optocoupler device, improving the rationality of the arrangement structure of the several electrodes 1, and being able to improve the compactness of the chip structure arrangement in the optocoupler device and simplify the overall size of the optocoupler device.

[0080] S12: First injection.

[0081] Figure 6 The schematic structural diagram of the bracket with a cup body in the embodiment of the present invention is shown, and the first injection molding operation is performed on the initial bracket to form a molding layer 2 to obtain the bracket with a cup body.

[0082] Specifically, a plurality of electrodes 1 are arranged in the lower mold of the mold, and the lower mold is closed by a preset upper mold, and the modulated first plastic encapsulation material is injected into the closing mold. After the first plastic encapsulation material is formed, a molding layer 2 is formed on the initial bracket through demolding.

[0083] Furthermore, the first molding material can be epoxy resin, and silicon dioxide powder is added to the epoxy resin so that the silicon dioxide content of the first molding material reaches 70% to 95% of the weight of the molding layer 2, thereby improving the light blocking ability of the molding layer 2 and reducing the outward diffusion of light in the optocoupler device. At the same time, it can block external environmental light from entering the optocoupler device, thereby reducing the risk of interference with the operation of the optocoupler device caused by the external environment.

[0084] Specifically, based on the molding layer 2, a cup body structure is formed on the initial bracket, the inner wall of the cup body is an inclined side wall structure, the inner wall angle of the cup body is α, and the value range of α is: 90°≤α≤150°. Based on the bevel structure, the reflection and refraction of the light emitted by the light-emitting chip 3 inside the cup body can be improved, thereby improving the reliability of the use of the optocoupler device.

[0085] Furthermore, based on the inclined inner wall structure, a cup body structure with a large opening is formed, which can improve the demoulding convenience of the mold.

[0086] Through the first injection molding operation, the first injection molding material is filled in the gaps between the electrodes 1, and a cup structure is formed on the initial bracket formed by the electrodes 1. Based on the cup body, a chip bonding area for accommodating the light-emitting chip 3 and the receiving chip 4 is divided on the top surface of the initial bracket formed by the electrodes 1, which can improve the accuracy of bonding the light-emitting chip 3 and the receiving chip 4, and at the same time improve the compactness of the internal structure arrangement of the optocoupler device.

[0087] S13: Chip bonding wire.

[0088] Figure 7 It shows a schematic structural diagram of chip die bonding in an embodiment of the present invention, where the light emitting chip 3 and the receiving chip 4 are die bonded at corresponding die bonding positions in the cup body of the bracket.

[0089] Specifically, an adhesive is dotted on the crystal-fixing area in the cup body. The adhesive may be silver paste. The light-emitting chip 3 and the receiving chip 4 are correspondingly crystal-fixed in the crystal-fixing area of ​​the cup body through the adhesive.

[0090] In this embodiment, the bottom electrode 1 of the light-emitting chip 3 is electrically welded to the second electrode 12, the top electrode 1 of the light-emitting chip 3 is electrically connected to the first electrode 11 based on a metal welding wire, the bottom electrode 1 of the receiving chip 4 is electrically welded to the fourth electrode 14, and the top electrode 1 of the receiving chip 4 is electrically connected to the third electrode 13 based on a metal welding wire, so that the light-emitting chip 3 and the receiving chip 4 can be electrically connected to several of the electrodes 1, and the electrode 1 pins formed at the bottom of the optocoupler device based on several of the electrodes 1 can be connected to an external circuit, thereby meeting the use requirements of the light-emitting chip 3 and the receiving chip 4.

[0091] S14: Encapsulation silica gel.

[0092] Figure 8 The schematic diagram of the structure of encapsulating silica gel in an embodiment of the present invention is shown. The silica gel is filled in the cup body so that the silica gel covers the light emitting chip 3 and the receiving chip 4 to form a filling layer 5.

[0093] The cup body is filled with silica gel so that the silica gel completely covers the light emitting chip 3 and the receiving chip 4 , thereby ensuring that the filling layer 5 can seal and protect the light emitting chip 3 and the receiving chip 4 .

[0094] S15: Second injection.

[0095] A second injection molding operation is performed outside the bracket to form a plastic sealing layer 6 to obtain an optical coupling device.

[0096] Specifically, the outside of the bracket is injection molded by a second molding material, and the second molding material and the first molding material can be the same epoxy resin, so that the first molding material and the second molding material have good bonding performance, so that the molding layer 2 and the molding layer 6 have good bonding performance, thereby improving the stability of the optocoupler device packaging.

[0097] Specifically, the preparation method further comprises:

[0098] According to the packaging requirements of the optocoupler device, a first through hole 15 is formed in the packaging area of ​​any electrode 1 corresponding to the molding layer 2. When the first injection molding operation is performed, the contact area between the first injection molding material and the plurality of electrodes 1 can be increased based on the first through hole 15, thereby improving the bonding performance between the molding layer 2 and the plurality of electrodes 1.

[0099] A second through hole 16 is formed in the packaging area of ​​any electrode 1 corresponding to the plastic layer 6. When a second injection molding operation is performed, the contact area between the second injection molding material and the plurality of electrodes 1 can be increased based on the second through hole 16, thereby improving the bonding performance between the plastic layer 6 and the plurality of electrodes 1.

[0100] Furthermore, the preparation method further comprises:

[0101] Based on the etching process, a blind hole 17 is formed on the outside of the bottom end of any of the electrodes 1. Laser etching can be performed on the outside of the bottom end of any of the electrodes 1 to form a blind hole 17 on the bottom end of any of the electrodes 1, so that when the optocoupler device is mounted, a tin creeping space can be provided for the solder paste during the mounting of the optocoupler device, thereby improving the stability and reliability of the mounting operation of the optocoupler device.

[0102] Furthermore, a blind hole 17 can be formed on the outer side of the bottom end of the electrode 1 based on a stamping process, and a plurality of electrodes 1 can be stamped in batches through stamping, thereby improving the convenience and efficiency of processing the blind hole 17 on the electrode 1.

[0103] Furthermore, the blind hole 17 may be a circular concave blind hole, or a square concave blind hole, which is prepared according to an actual etching process or a stamping process.

[0104] An embodiment of the present invention provides a method for preparing an optocoupler device, by injection molding a bracket structure with a cup body on a plurality of electrodes 1, limiting the placement space of the chip based on the cup body, and improving the refraction effect of the light emitted by the light-emitting chip 3 based on the cup body, thereby improving the receiving ability of the receiving chip 4 to the light emitted by the light-emitting chip 3, improving the working stability of the optocoupler device, and at the same time improving the compactness of the structural arrangement of the optocoupler device and simplifying the size of the optocoupler device.

[0105] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An optical coupler device, characterized in that: The optical coupling device comprises: a bracket with a cup body, a light emitting chip and a receiving chip arranged in the cup body, a filling layer arranged in the cup body, and a plastic sealing layer covering the outside of the cup body; The bracket with cup body includes: a molding layer and a plurality of electrodes, wherein the plurality of electrodes are distributed at a preset interval, and the molding layer partially fills the interval between the plurality of electrodes, so that the plurality of electrodes and the molding layer are combined to form the bracket structure with cup body.

2. The optocoupler device according to claim 1, characterized in that: Some of the electrodes are rectangular structures, and / or some of the electrodes are irregular polygonal structures.

3. The optical coupler device according to claim 1, characterized in that: Any of the electrodes is provided with more than one through hole.

4. The optocoupler device according to claim 1, wherein: The plastic sealing layer and the molding layer are made of the same plastic sealing material.

5. The optical coupler device according to claim 4, characterized in that: The material of the plastic sealing layer and the molding layer is epoxy resin.

6. The optocoupler device according to claim 1, characterized in that: A blind hole is arranged on one side of the bottom of any electrode.

7. The optical coupler device according to claim 6, characterized in that: The height of the blind hole is h2, and the thickness of the electrode is h3; The constraint relationship between h2 and h3 is: h3*1 / 4≤h2≤h3*2 / 3.

8. The optical coupler device according to claim 7, characterized in that: The value range of h3 is 0.15mm≤h3≤0.3mm.

9. The optical coupler device according to claim 6, characterized in that: The width of the blind hole is w, and the value range of w is: 0.1mm≤w≤0.3mm.

10. The optocoupler device according to claim 1, characterized in that: The height of the cup body is h1, and the value range of h1 is: 300 μm≤h1≤500 μm.

11. The optical coupler device according to claim 1, characterized in that: The inner wall angle of the cup body is α, and the value range of α is: 90°≤α≤150°.

12. The optocoupler device according to claim 1, wherein: The molding layer is doped with silicon dioxide powder, and the silicon dioxide powder accounts for 70% to 95% of the total weight of the molding layer.

13. The optocoupler device according to claim 1, wherein: The filling layer is a transparent silicone layer, or the filling layer is a red silicone layer.

14. A method for preparing an optical coupler device, characterized in that: The preparation method is used to prepare the optical coupler device according to any one of claims 1 to 13, and the preparation method comprises: preparing a plurality of electrodes, and distributing the plurality of electrodes to form an initial scaffold; Performing a first injection molding operation on the initial bracket to form a molding layer to obtain a bracket with a cup body; Bonding the light-emitting chip and the receiving chip to corresponding bonding positions in the cup body of the bracket; Filling silica gel in the cup body so that the silica gel covers the light emitting chip and the receiving chip to form a filling layer; A second injection molding operation is performed on the outside of the bracket to form a plastic sealing layer to obtain an optocoupler device.

15. The method for preparing an optical coupler device according to claim 14, characterized in that: The step of preparing a plurality of electrodes and distributing the plurality of electrodes to form an initial support comprises: Adjust the shape and size of several electrodes according to the package size and chip size of the optocoupler device; A plurality of electrodes are placed in the mold according to preset distribution positions.

16. The method for preparing an optical coupler device according to claim 14, characterized in that: The preparation method further comprises: According to the packaging requirements of the optocoupler device, a first through hole is formed in a packaging area of ​​the molding layer corresponding to any electrode; A second through hole is formed in a packaging area of ​​any electrode corresponding to the plastic packaging layer.

17. The method for preparing an optical coupler device according to claim 14, characterized in that: The preparation method further comprises: A blind hole is formed on the outer side of the bottom end of any of the electrodes based on an etching process, or a blind hole is formed on the outer side of the bottom end of any of the electrodes based on a stamping process.

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