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98results about How to "Avoid encapsulation" patented technology

ZSM-5 type molecular sieve for catalyst for reaction for preparing propylene from methanol and/or dimethyl ether

The invention provides a ZSM-5 type molecular sieve for a catalyst for a reaction for preparing propylene from methanol and/or dimethyl ether, which has a silica alumina ratio of 250-1,150 and a grain diameter of 65-250nm. A preparation method of the molecular sieve comprises the following steps: (1) mixing an aluminum source and an organic directing agent and stirring an obtained mixture at constant temperature of 0-30 DEG C for 2-24 hours; (2) adding a silicon source and an organic addition agent to the mixed solution obtained in the step (1) and continuing stirring the mixed solution to obtain gel; (3) stirring the gel obtained in the step (2) at 35-95 DEG C and then carrying out a crystallization reaction for 24-240 hours at 60-200 DEG C, wherein in the raw materials for synthesizing the molecular sieve, and the molar ratio of OH<-1> to SO2 to AL2O3 to H2O to the organic directing agent to the organic directing agent is (0.1-0.35):1:(0.0005-0.01):(10-25):(0.1-0.6):(0.5-8). The ZSM-5 type catalyst has the characteristics of controllable grain size, adjustable silica alumina ratio, high dispersity, and the like and has higher propylene selectivity and P/E ratio in the reaction for preparing low carbon olefin from the methanol and/or the dimethyl ether.
Owner:DATANG INT CHEM TECH RESINST

High-voltage single solid-state lithium ion battery and preparation method thereof

The invention provides a high-voltage single solid-state lithium ion battery. The lithium ion battery comprises three or more plate-shaped electrodes which are stacked in sequence, wherein the three or more plate-shaped electrodes are sequentially a negative electrode, at least one bipolar plate electrode and a positive electrode from top to bottom, the plate-shaped electrodes are separated by solid electrolyte layers, and the plate-shaped electrodes and the solid electrolyte layers are bonded together in a thermal compounding mode and packaged into a single battery. According to the battery,internal series connection of the single battery is realized, and the problem of difficult packaging or complex packaging structure caused by using a liquid electrolyte is avoided; the single batteryis adjustable in capacity and voltage, high voltage of the single battery can be conveniently realized, and the problems of heating or poor multiplying power and the like when the conventional lithiumion batteries are externally connected in series are avoided; the connection of the energy storage assembly is optimized, and the internal resistance of the battery is reduced; and the production process and equipment are basically the same as those of the existing lithium ion battery, so that large-scale industrial production is facilitated. The invention also provides a preparation method of the high-voltage single solid-state lithium ion battery.
Owner:安徽坤宇塑金新能源技术有限公司

Manufacturing method of patch type LED (Light-Emitting Diode) module

InactiveCN102779923ASave packaging material and packaging process timeGood consistency of geometric featuresFinal product manufacturePrinted circuit aspectsPatch typeManufacturing line
The invention discloses a manufacturing method of a patch type LED (Light-Emitting Diode) module. The manufacturing method is characterized by comprising the following steps of: preparing materials; providing LED chips with flip chip structures, wherein one face of each LED chip is provided with a metal electrode, and the surface intervals of the metal electrodes are not smaller than 80 mum; arranging: putting the plurality of chips into a braid, wherein the metal electrodes of the LED chips are positioned at the bottom of a braid accommodating space, and the light emitting surfaces of the LED chips are positioned on the opening of the accommodating space; patching: sucking the LED chips out of the braid by using a vacuum suction nozzle, and placing onto a bonding pad of a substrate, wherein the metal electrodes are opposite to the bonding pad, and the light emitting surfaces of the LED chips face upwards; and fixing: correspondingly fixing and communicating the bonding pad and the metal electrodes. A braid loading way is directly adopted for flip chip LED chips, so that encapsulation of a single LED light source is avoided, and the encapsulating materials, encapsulating process time and production line of a single LED light source are saved.
Owner:XIAMEN G WATT LIGHTING TECHNOLOGY INC

Self-repairing SRAM (Static Random Access Memory) controller design for DTMB (Digital Terrestrial Multimedia Broadcasting) demodulation chip

The invention discloses a self-repairing SRAM (Static Random Access Memory) controller design for a DTMB (Digital Terrestrial Multimedia Broadcasting) demodulation chip. The controller comprises an error-address storage register group, an error detection circuit, a repairing circuit, an error reporting circuit and a reading-writing control circuit, wherein the self-repairing SRAM controller design is used for storing an error conventional SRAM address; the error detection circuit is used for carrying out error detection on the conventional SRAM, and storing the detected and error address into the error-address storage register group; the repairing circuit is used for mapping the error address into a redundant SRAM when a central module accesses the error address stored in the error-address storage register group and accessing the central module to the redundant SRAM; the error reporting circuit is used for carrying out error detection on the conventional SRAM after the repairing circuit maps the error address to the redundant SRAM, and reporting errors when detecting the error address; the reading-writing control circuit is used for finishing read-writing operation of the central module to the conventional SRAM and the redundant SRAM.
Owner:苏州国芯科技股份有限公司

Integrated cavity type conductive fluid heat spreader

The invention provides an integrated cavity type conductive fluid heat spreader which includes a cavity (1), the heat absorbing end, flow, liquid, fluid pool, driving pump and a heat radiating end together in one room, the internal cavity structure, and the inner surface is an insulating layer (12); runner type electrode for (31, 32), arranged on the cavity surface, which is used as a channel and the direction of fluid flow regulator; a magnet for (41, 42), in the cavity body and the direction of the magnetic poles and the electrode is arranged on the current direction is vertical range setting; conductive fluid (2), the filling in the cavity; power supply chip (7) which is arranged in the cavity, the outer surface of the electrodes used to provide the input current. According to the heat spreader is provided by the invention greatly reduces the production and packaging process, completely avoid the fluid leakage; the compact volume, heat transfer capacity significantly; the cavity electrode on the position can be set flexibly, significantly enhance the electromagnetic driving force, resulting in the enhancement of heat transfer and flow effect is strong; between different parts of the body temperature of the fluid cavity different mixing efficiency is high, the heat transport capability is strong.
Owner:TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI

Method for preparing self-packaging of MEMS (micro electro mechanical systems) device based on surface sacrificial layer technology

The invention provides a method for preparing self-packaging of an MEMS device based on a surface sacrificial layer technology. The method comprises that a substrate protective layer, a lower electrode and a lower electrode protective layer are deposited and prepared on a substrate, and the surface of the lower electrode protective layer is subjected to chemical-mechanical polishing; a first sacrificial layer and an MEMS device structural layer are prepared through the surface sacrificial layer technology; a metal layer is deposited on the structural layer; a second sacrificial layer and a packaging layer are prepared through the surface sacrificial layer technology, and interconnection portions in and out of a packaging area are prepared; and all sacrificial layers are subjected to wet etching, and the MEMS device structural layer is released and self-packaging is completed by an adhesion effect. The method is applicable to infrared sensors and the like of MEMS devices with movable structures, so that self packaging of the MEMS devices can be achieved, the packaging period can be shortened, the process quality and the yield are improved, and the packaging cost is reduced.
Owner:PEKING UNIV
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