75results about How to "Avoid entrapment" patented technology

Provided is a method for manufacturing a semiconductor device. Also provided are: a semiconductor device which can be obtained by the method; and a dispersion that can be used in the method. A method for manufacturing a semiconductor device (500a) of the present invention comprises the steps (a)-(c) described below and is characterized in that the crystal orientation of a first dopant implanted layer (52) is the same as the crystal orientation of a semiconductor layer or a base (10) that is formed of a semiconductor element. (a) A dispersion which contains doped particles is applied to a specific part of a layer or a base. (b) An unsintered dopant implanted layer is obtained by drying the applied dispersion. (c) The specific part of the layer or the base is doped with a p-type or n-type dopant by irradiating the unsintered dopant implanted layer with light, and the unsintered dopant implanted layer is sintered, thereby obtaining a dopant implanted layer that is integrated with the layer or the base.

A marine seismic exploration method and system comprised of continuous recording, self-contained ocean bottom pods characterized by low profile casings. An external bumper is provided to promote ocean bottom coupling and prevent fishing net entrapment. Pods are tethered together with flexible, non-rigid, non-conducting cable used to control pod deployment. Pods are deployed and retrieved from a boat deck configured to have a storage system and a handling system to attach pods to cable on-the-fly. The storage system is a juke box configuration of slots wherein individual pods are randomly stored in the slots to permit data extraction, charging, testing and synchronizing without opening the pods. A pod may include an inertial navigation system to determine ocean floor location and a rubidium clock for timing. The system includes mathematical gimballing. The cable may include shear couplings designed to automatically shear apart if a certain level of cable tension is reached.

A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

A bubble free, self-priming IV set for use in the administration of liquids includes a coupling assembly for attaching the delivery system to a source of liquid and includes a coupling membrane for controlling the flow of liquid and air through the coupling assembly. The system also includes a drip chamber for receiving liquid through the coupling assembly, the drip chamber having a membrane for preventing air from leaving the drip chamber. A self leveling port is disposed within a wall of the drip chamber, the port being permeable to air, but impermeable to liquid. Finally, a patient conduit is in fluid communication with the drip chamber and further comprises a flow control plug disposed at the distal end of the conduit. The flow control plug is permeable to air but impermeable to liquid. Use of this system allows a clinician to attach a source of fluid to a patient without significant intervention, while the system self primes.

A coupling apparatus for fluid dispensing with a disposable connector on the fluid line or fluid dispensing system side. The coupling apparatus includes an insert body that is connectable with a disposable connector device. The insert body includes a recess area defined between a first inner sidewall and a second inner sidewall. The second inner sidewall extends coaxially with the first inner sidewall, and has an aperture defining an opening through a first and second end. The connector device includes a connector body connected with an adapter portion. The connector body includes a beveled end that is insertable through the aperture of the second inner sidewall. The adapter portion is disposed proximate and extends past the beveled end, where the beveled end is recessed within the adapter portion. An insertion space is defined between the beveled end and an outer wall defined by the adapter portion. The adapter portion is insertable into the recess area and the insertion space is receivable of the second inner sidewall.

A method of performing a seismic survey including: deploying nodal seismic sensors at positions in a survey region; activating a plurality of seismic sources; and using the nodal seismic sensors to record seismic signals generated in response to the activation of the plurality of signals.

An integrated underfilling process for attaching a chip / die having conductive solder bump contacts to a substrate. The process involves B-staging filled underfill on the chip / die, depositing a fluxing unfilled underfill onto the surface of the substrate, mating the chip / die with the B-staged underfill to the substrate and reflowing the assembled chip / substrate. The B-staged filled underfill reduces the coefficient of thermal expansion of the underfill fillet and the fluxing unfilled underfill removes metal oxide from the surface of the solder bump contacts and bond pads to promote the formation of reliable metallurgical joints.

A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder / flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder / flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder / flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder / flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

An electrophotographic photoreceptor comprising: an electrophotographic photoreceptor having at least an undercoat layer and a photosensitive layer formed on a conductive substrate, wherein the undercoat layer contains metal oxide fine particles and an electron acceptor compound having a group reactive with the metal oxide fine particles. A process cartridge and an electrophotographic apparatus using the electrophotographic photoreceptor are also provided.

This invention relates to a method of manufacturing micro-cell arrays. Such an array may find use in a number of applications such as, for example, a video display, electronic paper, and signage. The microcell arrays find particular use in electromodulating displays.

A swimming pool cleaning system includes a pump, a first tube coupling a suction port of the pump in fluid communication with a main drain or mobile cleaning device which draws water and settled debris from the bottom of the pool, and a skimming device including an entrainment nozzle and a safety tube. The entrainment nozzle is coupled by a second tube to a coupling device which diverts a small portion of pool return water pumped from an outlet port of the pump. The safety tube extends from above the water line and above the debris trap in the skimmer to the body of the skimmer below the debris trap. Most of the pool return water is pumped into a rotary distribution valve, various outlets of which are connected to various pool cleaning heads embedded in an inner surface of the pool. A single low-horsepower pump produces simultaneous effective skimming and operation of embedded cleaning heads.

This invention relates to a method of manufacturing micro-cell arrays. Such an array may find use in a number of applications such as, for example, a video display, electronic paper, and signage. The microcell arrays find particular use in electromodulating displays.

A tiled detector assembly (1000) and a method for making a tiled radiation detector (1000) is described. The innovative feature of this method is that the xyz misalignment of the detector tiles (304, 304′), the origin of various image artifacts, can be significantly reduced by accurate sizing and alignment of the detector tiles (304, 304′). Consequently, image quality, yield and reliability of as-produced tiled radiation detectors are considerably improved.

The invention provides a closed case-package liquor automatic vending counter, which comprises a counter body, a counter door and an intelligent controller. A goods storage conveyor and a vending conveyer are arranged in different layers of the counter body; the case-package liquor is arranged on the goods storage conveyer and the vending conveyer; the direction of a goods outlet conveyer opposes to the lateral side of the vending conveyer; the direction of the vending conveyer is connected to a vending mechanism positioned at end section of the vending conveyer; the vending mechanism is composed of a vending rotary disc and a drive motor; the drive motor is positioned at the bottom of an underpan is driven by gearing; a semi-circular goods outlet cylinder is positioned at the upper section of the vending rotary disc; the opening of the semi-circular goods outlet cylinder opposes to a goods taking opening positioned on the counter door; the intelligent controller is arranged on the lateral side of the goods taking opening. Compared with the prior art, the invention, which has the advantages of feasible design, excellent safety and reliability, prevention of fake goods and easy maintenance, has outstanding promotion value.

The various embodiments of the present system disclose a system for an optimal cooling by a thermoelectric cooling module and an electric fan thereof. The system comprises a thermoelectric cooling module, an electric fan and a housing. The thermoelectric cooling module comprises a plurality of thermoelectric sub-modules, a hot side management module, a cold side management module and an integrated control module. The present invention provides an optimal cooling on the basis of an external weather condition. The present invention further provides an optimal cooling by implementing an efficient fluid circulation mechanism. The present invention also provides a dynamic management over the working of various modules of the said system.

A garment accessory for attachment to a hem of a garment for prevention of entrapment of the garment beneath a foot or shoe of the wearer, comprising an adhesive-backed flexible and conforming film having a low-friction surface.

A system for cooling an engine of a marine propulsion system having an engine and having a cylinder block. An exhaust manifold that conveys hot exhaust gases from the engine and a pump that pumps water from a body of water are also present in the system. A water jacket surrounding the exhaust manifold conveys water from the pump along at least one stream of water having a cross sectional area for cooling the hot exhaust gases in the exhaust manifold. At least one portion of the water jacket includes at least one converging passageway including a wall of the water jacket that tapers inwardly to reduce the cross-sectional area of the stream of water as the water circulates in the water jacket. The pumped water typically has entrained air in the form of air pockets. The converging passageway reduces the air pockets present in the water to provide even cooling of the manifold.

Antimicrobial metal ion coatings and implants including them. In particular, described herein are coatings including an anodic metal (e.g., silver and / or zinc and / or copper) that is co-deposited with a cathodic metal (e.g., palladium, platinum, gold, molybdenum, titanium, iridium, osmium, rhodium, manganese, niobium or rhenium) on a substrate so that the anodic metal is galvanically released as antimicrobial ions when the apparatus is exposed to a bodily fluid. The anodic metal may be at least about 25 percent by volume of the coating, resulting in a network of anodic metal with less than 20% of the anodic metal in the coating fully encapsulated by cathodic metal. The implant may be configured as an implant such as a bone-screw or intramedullary rod-like body configured to receive a treatment cartridge having a coating as described.

A vertically folding barrier gate arm has a proximal first segment and a distal second segment connected by a pivot hinge allowing them to fold. An extension set pivotally affixed to an outer offset bracket on the housing for the motor of the gate arm is connected to an outer offset bracket on the distal gate arm segment by a multi-articulated compound hinge formed by a plurality of links attached to each other by hinges providing a constrained range of rotation relative to each other. The gate arm translates from a fully extended position where the proximal and distal gate arm segments are parallel and co-linear along a horizontal longitudinal axis, to a vertically folded position where the proximal and distal gate arm segments lie substantially against each other within the plane of rotation of the first segment.

A method of producing molten aluminium-lithium alloys for casting a feedstock in the form of an ingot, the method including the steps of: preparing a molten first aluminium alloy with a composition A which is free from lithium as purposive alloying element, transferring the first aluminium alloy to an induction melting furnace, adding lithium to the first aluminium alloy in the induction melting furnace to obtain a molten second aluminium alloy with a composition B having lithium as purposive alloying element, optionally adding further alloying elements to the second aluminium alloy, transferring the second alloy via a metal conveying trough from the induction melting furnace to a casting station.

There is provided a monolithic pour joint interposed between adjacent concrete slabs disposed on a substrate. The pour joint comprises a plurality of elongate forms interconnected with splices. Each one of the forms has a substantially planar, vertical panel with upper and lower edges and opposing ends respectively defining a form width and a form length. The forms are arranged such that the form lengths are generally aligned end to end. The lower edge of the vertical panel has a base flange extending generally laterally therefrom. A plurality of stakes are disposed in transverse relation to the form width and are secured to a side of the vertical panel at spaced intervals to fixedly maintain the forms in relation to the substrate. The pour joint may include a plurality of dowel holes extending through the vertical panel such that a dowel placement system may be installed in the pour joint.