Preparation method of integrated circuit board

Abstract

The invention relates to a preparation method of an integrated circuit board, which comprises the following steps of: preparing a pre-impregnated base material and a copper foil required by the preparation of the integrated circuit board, covering a layer of copper foil on the pre-impregnated base material, cutting the copper foil on the pre-impregnated base material into a circuit part and a non-circuit part by using a laser cutting mode, the circuit part is the required circuit, the non-circuit part is removed from the pre-impregnated base material through the bonding plate in a bonding mode, so that the pre-impregnated base material with the surface covered with the circuit pattern is obtained, then the pre-impregnated base materials covered with the circuit pattern are sequentially overlapped and laminated, and the required integrated circuit board is obtained. According to the preparation method disclosed by the invention, the copper foil is firstly coated on the pre-impregnated base material, then the copper foil is directly cut on the pre-impregnated base material to form the circuit part, and finally the pre-impregnated base materials are laminated to form the integrated circuit board, so that the whole process is simpler and more convenient, the steps are simpler and faster, and the efficiency is higher.

Description

Technical Field

[0001] The invention relates to the field of circuit board preparation, and in particular to a method for preparing an integrated circuit board. Background Art

[0002] Conventional PCB circuit pattern production includes the steps of making a photosensitive coating layer on the copper clad board, exposure, development, etching, etc. The process is long and there are many factors affecting the circuit yield. It requires the use of multiple materials such as film, photosensitive film, and chemicals. The process also includes multiple wet processes, which cause great pollution to the environment, and the costs of baking the board and wastewater treatment increase accordingly.

[0003] Patent CN106793540B proposes a printed circuit board processing method, which includes the following steps: S1, laser cutting: using laser to cut the required circuit from the copper foil pasted on the carrier; S2, selective viscosity treatment: selective viscosity treatment of the copper foil and the carrier; S3, selective adsorption: selective adsorption of the copper foil corresponding to the non-circuit part after cutting; S4, peeling: peeling the copper foil of the non-circuit part from the carrier to obtain the copper foil corresponding to the circuit part attached to the carrier; S5, preparation of the printed circuit board, transferring the copper foil of the circuit part on the carrier to the substrate to obtain the printed circuit board.

[0004] The preparation method in the above patent first uses laser cutting to cut the copper foil to form the required circuit, and then attaches the circuit to a substrate to obtain a circuit board. This method does not require exposure, development, etching and other steps, simplifies the process flow, does not require chemical treatment, and correspondingly reduces environmental pollution. However, although the above-mentioned preparation method simplifies the process flow, in actual production, when the non-circuit part and the circuit part are subjected to selective viscosity treatment, the non-circuit part and the circuit part are both attached to the same carrier, and the size of the circuit part itself is very small, which is very troublesome when performing different viscosity treatments. The viscosity of the circuit part and the non-circuit part cannot be absolutely separated, and mutual interference will inevitably occur, thereby affecting the subsequent smooth separation of the non-circuit part and the circuit part, which is very troublesome. In addition, after the circuit part is cut out on the carrier, the copper foil of the circuit part on the carrier needs to be transferred to the substrate, and the bonding problem between the copper foil and the substrate needs to be considered after the transfer, which is very troublesome. Moreover, as the requirements for circuit boards become higher and higher, the requirements for the preparation of circuit boards are also higher and higher. Therefore, it is hoped that a preparation method for circuit boards that is more convenient and more efficient can be developed. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for preparing an integrated circuit board which is more convenient and more efficient.

[0006] In order to solve the above technical problems, the technical solution of the present invention is: a method for preparing an integrated circuit board, the innovation of which is: comprising the following steps:

[0007] Prepare the prepreg substrate and copper foil required for the preparation of the integrated circuit board, cover the prepreg substrate with a layer of copper foil, and use laser cutting to cut the copper foil on the prepreg substrate into a circuit part and a non-circuit part. The circuit part is the required circuit, and the non-circuit part is removed from the prepreg substrate through an adhesive plate to obtain a prepreg substrate with a circuit pattern on the surface. Then, the prepreg substrates with circuit patterns are stacked and laminated in sequence to obtain the required integrated circuit board.

[0008] Furthermore, the bonding plate is a contoured plate having the same shape as the non-circuit portion.

[0009] Furthermore, a waste removal plate for removing the non-circuit portion of the adhesive plate is provided on the side of the adhesive plate. The waste removal plate is a contoured plate having the same shape as the non-circuit portion or a flat plate having a size larger than the non-circuit portion.

[0010] Furthermore, when using laser cutting to cut the copper foil into a circuit part and a non-circuit part, it is also necessary to reserve a frame surrounding the circuit part on the periphery of the copper foil. The frame is connected to the circuit part through a connecting belt, and the frame and the connecting belt are both formed by laser cutting of the copper foil.

[0011] Furthermore, the pre-impregnated substrate is a solvent-free pre-impregnated substrate.

[0012] The advantages of the present invention are as follows: the preparation method of the present invention first coats the copper foil on the pre-impregnated substrate, then directly cuts the copper foil on the pre-impregnated substrate to form a circuit part, and finally stacks and laminates the pre-impregnated substrates to form an integrated circuit board. The whole process is simpler, the steps are more simple, and the efficiency is higher.

[0013] The preparation method of the present invention forms the circuit part by directly cutting the copper foil on the pre-impregnated substrate, thus eliminating the subsequent circuit part transfer process, simplifying the preparation process, and also eliminating the subsequent problem of bonding the circuit part to the substrate.

[0014] A solvent-free pre-impregnated substrate is used to cooperate with the circuit part. Since the solvent-free pre-impregnated substrate does not contain solvent, the fluidity is reduced to a certain extent, which is beneficial to reduce the displacement of the circuit part, realize the circuit positioning, and improve the quality of the circuit board.

[0015] For the separation between the circuit part and the non-circuit part, an external adhesive plate is used to stick the non-circuit part off the prepreg substrate. Compared with removing the non-circuit part by taking advantage of the viscosity difference between the circuit part, the non-circuit part and the carrier, this is more convenient and will not cause interference or influence between the circuit part and the non-circuit part, so that the non-circuit part can be separated from the circuit part smoothly. In addition, the adhesive plate with a contoured design can better and more fully fit the non-circuit part when sticking the non-circuit part, and will not touch the circuit part, so that the non-circuit part can be separated from the circuit part and the prepreg substrate more smoothly.

[0016] When using laser cutting to cut the circuit part and the non-circuit part of the copper foil, by reserving a frame connected to the circuit part, the circuit part can be stabilized and shaped to a certain extent, avoiding deformation of the circuit part due to the fluidity of the pre-impregnated substrate during subsequent lamination of the pre-impregnated substrate.

[0017] A waste removal board is arranged beside the bonding board to cooperate with the bonding board, and the non-circuit part bonded to the bonding board is removed from the bonding board in time, so that the bonding board can quickly remove the non-circuit part on the next pre-impregnated substrate, which provides a basis for the continuous implementation of the entire preparation method and avoids the phenomenon of long waiting time due to the need to remove the previous non-circuit part of the bonding board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a circuit board with a circuit pattern. DETAILED DESCRIPTION

[0019] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0020] Embodiment 1

[0021] The method for preparing the integrated circuit board of the present invention is achieved by the following steps:

[0022] First, prepare the prepreg substrate and copper foil required for the preparation of the integrated circuit board. The number of prepreg substrate and copper foil is selected according to the number of layers of the integrated circuit board to be formed. The prepreg substrate is made of the following formula: 80 parts of epoxy resin, 20 parts of phenolic linear epoxy resin, 4 parts of dicyandiamide, 0.2 parts of benzyl dimethylamine, 15 parts of dimethylformamide, 15 parts of ethylene glycol methyl ether, and acetone: appropriate amount, wherein dimethylformamide, ethylene glycol methyl ether and acetone are solvents. After drying, the solvent residue is generally 5-10%.

[0023] Secondly, a layer of copper foil is coated on the prepreg substrate, and the copper foil on the prepreg substrate is cut into a circuit part and a non-circuit part by laser cutting. The circuit part is the required circuit. After the copper foil is cut into the circuit part and the non-circuit part, the non-circuit part is removed from the prepreg substrate through an adhesive plate, thereby obtaining a prepreg substrate with a circuit pattern on the surface.

[0024] The adhesive plate is a profiling plate with the same shape as the non-circuit part. For the separation between the circuit part and the non-circuit part, an external adhesive plate is used to remove the non-circuit part from the prepreg substrate. Compared with removing the non-circuit part by using the viscosity difference between the circuit part, the non-circuit part and the carrier, it is more convenient and there will be no mutual interference and influence between the circuit part and the non-circuit part, so that the non-circuit part can be separated from the circuit part smoothly; in addition, the profiling design of the adhesive plate allows the adhesive plate to better and more comprehensively fit the non-circuit part when sticking to the non-circuit part, and will not touch the circuit part, so that the non-circuit part can be separated from the circuit part and the prepreg substrate more smoothly.

[0025] A waste removal board for removing the non-circuit part on the adhesive board is also arranged beside the adhesive board, and the waste removal board is a contoured board with the same shape as the non-circuit part or a flat plate with a size larger than the non-circuit part. The waste removal board is arranged beside the adhesive board to cooperate with the adhesive board to timely remove the non-circuit part bonded on the adhesive board from the adhesive board, so that the adhesive board can quickly remove the non-circuit part on the next prepreg substrate, which provides a basis for the continuous implementation of the entire preparation method and avoids the phenomenon of long waiting due to the need to remove the previous non-circuit part of the adhesive board.

[0026] Finally, the pre-impregnated substrates covered with circuit patterns are stacked and laminated in sequence at a temperature of 170-180°C for 50 minutes, and then copper is drilled and deposited to obtain the required integrated circuit board.

[0027] Embodiment 2

[0028] The method for preparing the integrated circuit board of the present invention is achieved by the following steps:

[0029] First, prepare the pre-impregnated substrate and copper foil required for the preparation of the integrated circuit board. The amount of the pre-impregnated substrate and copper foil is selected according to the number of layers of the integrated circuit board to be formed. The pre-impregnated substrate is made of the following formula: 80 parts of epoxy resin, 20 parts of phenolic linear epoxy resin, 4 parts of dicyandiamide, 0.2 parts of benzyl dimethylamine, 15 parts of dimethylformamide, 15 parts of ethylene glycol methyl ether, and acetone: appropriate amount. After drying, the solvent residue is generally 5-10%.

[0030] Secondly, a layer of copper foil is coated on the prepreg substrate, and the copper foil on the prepreg substrate is cut into a circuit part and a non-circuit part by laser cutting. The circuit part is the required circuit. When the copper foil is cut into the circuit part and the non-circuit part by laser cutting, a frame surrounding the circuit part needs to be reserved on the periphery of the copper foil. The frame is connected to the circuit part by a connecting tape, and the frame and the connecting tape are both cut from the copper foil by laser. When using laser cutting to cut the circuit part and the non-circuit part of the copper foil, by reserving a frame connected to the circuit part, the circuit part can be stabilized and shaped to a certain extent, avoiding deformation of the circuit part due to the fluidity of the pre-impregnated substrate during subsequent lamination of the pre-impregnated substrate. Because, during lamination, the pre-impregnated substrate needs to be heated, and since the pre-impregnated substrate itself contains solvents, this will cause fluidity on the surface of the pre-impregnated substrate, which will make the connection between the circuit pattern and the pre-impregnated substrate unstable. During subsequent lamination, the circuit pattern may be squeezed by the upper pre-impregnated substrate and deformed. Based on this, in the present invention, when cutting the copper foil, a frame connected to the circuit part is reserved in advance, and the frame is used to stabilize the circuit part to ensure that the shape of the circuit part will not be greatly deformed during the lamination process.

[0031] After the copper foil is cut into a circuit part and a non-circuit part, the non-circuit part is removed from the prepreg substrate through an adhesive plate, thereby obtaining a prepreg substrate with a circuit pattern on the surface.

[0032] The adhesive plate is a profiling plate with the same shape as the non-circuit part. A waste removal plate for removing the non-circuit part on the adhesive plate is also arranged beside the adhesive plate. The waste removal plate is a profiling plate with the same shape as the non-circuit part or a flat plate with a size larger than the non-circuit part.

[0033] Finally, the pre-impregnated substrates covered with circuit patterns are stacked and laminated in sequence at a temperature of 170-180°C for 50 minutes, and then copper is drilled and deposited to obtain the required integrated circuit board.

[0034] Embodiment 3

[0035] First, prepare the pre-impregnated substrate and copper foil required for the preparation of the integrated circuit board. The number of pre-impregnated substrates and copper foils is selected according to the number of layers of the integrated circuit board to be formed. The pre-impregnated substrate uses a solvent-free pre-impregnated substrate. Generally, the pre-impregnated substrate contains a small amount of solvent, while the solvent-free pre-impregnated substrate has no gas volatilization during the lamination process, and there is no solvent residue in the finished circuit board, which improves the product performance. Moreover, since the solvent-free pre-impregnated substrate does not contain solvent, the fluidity is reduced to a certain extent, which is conducive to reducing the displacement of the circuit part, realizing the positioning of the circuit part, and improving the quality of the circuit board.

[0036] The solvent-free pre-impregnated substrate is prepared by using the following formula: 80 parts of epoxy resin, 20 parts of phenolic linear epoxy resin, 4 parts of dicyandiamide, and 0.2 parts of benzyldimethylamine.

[0037] Secondly, a layer of copper foil is coated on the prepreg substrate, and the copper foil on the prepreg substrate is cut into a circuit part and a non-circuit part by laser cutting. The circuit part is the required circuit. After the copper foil is cut into the circuit part and the non-circuit part, the non-circuit part is removed from the prepreg substrate by an adhesive board, so as to obtain a prepreg substrate with a circuit pattern on the surface. The adhesive board is a profiling board with the same shape as the non-circuit part. A waste removal board for removing the non-circuit part on the adhesive board is also provided beside the adhesive board. The waste removal board is a profiling board with the same shape as the non-circuit part or a flat plate with a size larger than the non-circuit part.

[0038] Finally, the pre-impregnated substrates covered with circuit patterns are stacked and laminated in sequence at a temperature of 170-180°C for 50 minutes, and then copper is drilled and deposited to obtain the required integrated circuit board.

[0039] Embodiment 4

[0040] First, prepare the prepreg substrate and copper foil required for the preparation of the integrated circuit board. The number of prepreg substrate and copper foil is selected according to the number of layers of the integrated circuit board to be formed. The prepreg substrate is a solvent-free prepreg substrate, which is made of the following formula: 80 parts of epoxy resin, 20 parts of phenolic linear epoxy resin, 4 parts of dicyandiamide, and 0.2 parts of benzyldimethylamine.

[0041] Secondly, a layer of copper foil is coated on the prepreg substrate, and the copper foil on the prepreg substrate is cut into a circuit part and a non-circuit part by laser cutting. The circuit part is the required circuit. When the copper foil is cut into the circuit part and the non-circuit part by laser cutting, a frame surrounding the circuit part needs to be reserved on the periphery of the copper foil. The frame is connected to the circuit part by a connecting belt. The frame and the connecting belt are both formed by laser cutting of the copper foil. After the copper foil is cut into the circuit part and the non-circuit part, the non-circuit part is removed from the prepreg substrate by an adhesive plate, so as to obtain a prepreg substrate with a circuit pattern on the surface. The adhesive plate is a profiling plate with the same shape as the non-circuit part. A waste removal plate for removing the non-circuit part on the adhesive plate is also provided on the side of the adhesive plate. The waste removal plate is a profiling plate with the same shape as the non-circuit part or a flat plate with a size larger than the non-circuit part.

[0042] Finally, the pre-impregnated substrates covered with circuit patterns are stacked and laminated in sequence at a temperature of 170-180°C for 50 minutes, and then copper is drilled and deposited to obtain the required integrated circuit board.

[0043] Table 1 shows the preparation methods of Example 1, Example 2, Example 3 and Example 4, respectively. Figure 1 The data comparison table of the circuit board shown, Figure 1 In the circuit board shown, the theoretical distance parameter of point A of the circuit pattern from the edge of the circuit board is 14±0.5mil, the theoretical distance parameter of point B from the edge of the circuit board is 28±1mil, the theoretical distance parameter of point C from the edge of the circuit board is 25±1mil, the theoretical distance parameter of point D from the edge of the circuit board is 14±0.5mil, the theoretical distance parameter of point E from the edge of the circuit board is 31±1mil, and the theoretical distance parameter of point F from the edge of the circuit board is 25±1mil. Circuit boards 1-3 in Table 1 are circuit boards prepared by the preparation method of Example 1, circuit boards 4-6 are circuit boards prepared by the preparation method of Example 2, circuit boards 7-9 are circuit boards prepared by the preparation method of Example 3, and circuit boards 10-12 are circuit boards prepared by the preparation method of Example 4;

[0044]

[0045]

[0046] Table 1

[0047] It can be seen from the data in Table 1 that the distances of various measuring points of the circuit boards prepared by the preparation methods of Example 2, Example 3 and Example 4 can be well controlled within the value of the theoretical distance parameter, especially the circuit board prepared by the preparation method of Example 4, the error of its precision can be controlled within a smaller range, while the distances of various measuring points of the circuit board prepared by the preparation method of Example 1 will have certain deviations, and multiple points exceed the allowable error range of the theoretical distance parameter, which ultimately leads to the direct scrapping of the circuit board.

[0048] The preparation method of the present invention further improves the traditional preparation process of the circuit board, directly covers the copper foil on the pre-impregnated substrate, and then directly cuts the copper foil on the pre-impregnated substrate to form the circuit part, which saves the process of transferring the circuit part on the carrier to the substrate and the problem of fixing the circuit part and the substrate after the transfer in the traditional process. Finally, the various pre-impregnated substrates are stacked and laminated to form an integrated circuit board. Compared with the traditional process, the steps required for the preparation process of the whole process are simpler and more efficient.

[0049] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A method for preparing an integrated circuit board, Features: The steps include: Prepare the prepreg substrate and copper foil required for the preparation of the integrated circuit board, cover the prepreg substrate with a layer of copper foil, and use laser cutting to cut the copper foil on the prepreg substrate into a circuit part and a non-circuit part. The circuit part is the required circuit, and the non-circuit part is removed from the prepreg substrate through an adhesive plate to obtain a prepreg substrate with a circuit pattern on the surface. Then, the prepreg substrates with circuit patterns are stacked and laminated in sequence to obtain the required integrated circuit board.

2. The method for preparing an integrated circuit board according to claim 1, Features: The bonding plate is a contoured plate having the same shape as the non-circuit portion.

3. The method for preparing an integrated circuit board according to claim 1 or 2, Features: A waste removal plate for removing the non-circuit part of the adhesive plate is also arranged beside the adhesive plate. The waste removal plate is a contoured plate with the same shape as the non-circuit part or a flat plate with a size larger than the non-circuit part.

4. The method for preparing an integrated circuit board according to claim 1, Features: When using laser cutting to cut the copper foil into a circuit part and a non-circuit part, it is also necessary to reserve a frame surrounding the circuit part on the periphery of the copper foil. The frame is connected to the circuit part through a connecting belt, and the frame and the connecting belt are both formed by laser cutting of the copper foil.

5. The method for preparing an integrated circuit board according to claim 1, Features: The pre-impregnated substrate is a solvent-free pre-impregnated substrate.

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