Method and device for positioning glass sintering center

Abstract

The invention discloses a glass sintering center positioning device which comprises a substrate layer used for placing a to-be-sintered electronic component, the substrate layer is provided with a sinking hole, and the contour shape of the sinking hole is matched with the lower half part of the to-be-sintered electronic component; the cover plate layer is mounted at the upper end of the substrate layer, an upper counter bore is formed in the cover plate layer, and the contour shape of the upper counter bore is matched with the upper half part of the electronic component to be sintered; the substrate layer is detachably connected with the cover plate layer; and the external camera recognition device is used for positioning and measuring the center position coincidence degree between the upper counter bore and the lower counter bore. The stability of the electronic component to be sintered in the sintering device and the accuracy of structural center positioning in the sintering process are optimized.

Description

Technical Field

[0001] The present application relates to a method and device for positioning the center of glass sintering, and belongs to the technical field of glass sintering. Background Art

[0002] During the glass sintering process, the accuracy of the sintered parts after sintering will be low due to technical issues such as sintering temperature and sintering tooling, and will affect the size after sintering, especially for precision parts that need to be used in aerospace, military industry and some precision and tiny electrical devices. If the size after sintering changes, its accuracy will become very poor, making the qualification rate of the entire tooling low during the sintering process, and it is difficult to meet the current technical requirements. Therefore, a new method and device for locating the center of glass sintering has become a problem that technicians in this field need to solve urgently. Summary of the invention

[0003] According to one aspect of the present application, a device and method for center positioning of glass sintering are provided. The method forms a group of several electronic components by preparing a substrate layer and a cover layer, and wraps them up for sintering.

[0004] The present application provides a device for positioning the center of glass sintering, comprising a substrate layer for placing electronic components to be sintered, wherein the substrate layer is provided with a sink hole, and the contour shape of the sink hole is adapted to the lower half of the electronic components to be sintered;

[0005] A cover plate layer is installed on the upper end of the substrate layer, and the cover plate layer is provided with an upper countersunk hole, and the contour shape of the upper countersunk hole is adapted to the upper half of the electronic component to be sintered;

[0006] The substrate layer is detachably connected to the cover layer;

[0007] The external camera recognition device is used to locate and measure the center position overlap between the upper countersunk hole and the lower countersunk hole.

[0008] Optionally, a plurality of first central marks are arranged at the lower end of the substrate layer, and a plurality of second central marks are arranged at the top end of the cover layer;

[0009] The position of the first central mark and the central position of the lower sink hole are arranged on the same vertical extension line, and the position of the second central mark and the central position of the upper sink hole are arranged on the same vertical extension line.

[0010] Optionally, the first central mark and the second central mark are etched into cross marks by laser, and circular marks are etched at the center points of the two cross marks, and the diameters of the two circular marks are the same.

[0011] Optionally, the camera recognition device 5 includes a camera, a picture recognition module, a distance measurement module and a layer covering module 9;

[0012] The camera is used to take pictures of the bottom ends of the substrate layer and the cover layer;

[0013] The image recognition module is used to recognize two images as two layers;

[0014] The layer covering module 9 is used to overlap the two layers and compare the overlap of the circular punctuation marks on the two layers.

[0015] The present application also provides a method for locating the center of glass sintering, which is used in a method for preparing a sintering tool in the production process of electronic components, and uses the aforementioned device for locating the center of glass sintering, and comprises the following steps:

[0016] Step 1: Determine the size of the countersunk hole. Design the size of the upper countersunk hole and the lower countersunk hole for placing the electronic components according to the external dimensions of the electronic components.

[0017] Step 2: Determine the size of the positioning tool, evenly arrange the upper countersunk holes on the base plate layer, and evenly arrange the lower countersunk holes on the cover plate layer, so that the position of each upper countersunk hole fits the position of each lower countersunk hole;

[0018] Step 3: Make the cover layer and the base layer, and use isostatic graphite material for turning and milling according to the designed size and structure to obtain a prefabricated sintering tooling;

[0019] Step 4: Surface hardening, soak and scrub the substrate layer and cover layer of the prefabricated sintering tooling with cleaning liquid, the soaking time is less than 10 minutes, put the prefabricated sintering tooling after soaking into a sintering furnace for sintering, the temperature in the sintering furnace is: 800-900℃, the sintering time is: 20mm / min, and the sintering tooling is formed after sintering;

[0020] Step 5: Center etching: etching a center mark on the center bottom surface of each sink hole of the substrate layer that has been surface hardened in step 4, and etching a center mark on the center top surface of each sink hole of the cover layer that has been surface hardened;

[0021] Step 6: Center positioning measurement, the center mark etched in step 5 is measured by the camera recognition device 5 to measure the overlap between the substrate layer and the cover layer;

[0022] Step 7: measurement and matching. Place the electronic components to be sintered into the sintering tool for error measurement. If the height and height error are less than 0.05 mm, the sintering tool is ready. Otherwise, repeat steps 1 to 4 and re-measure and match.

[0023] Optionally, the internal shapes of the upper countersunk hole and the lower countersunk hole in step 2 are adapted to the outer contour and size of the electronic component.

[0024] Optionally, the isostatically pressed graphite in step three is a high-purity graphite material.

[0025] Optionally, the cleaning liquid in step 4 includes defatted oil powder and water, the mass ratio of the defatted oil powder to water is in the range of 1:10, and the temperature of the water is 30-50°.

[0026] Optionally, the center positioning measurement method in step 6 is:

[0027] Step a: photographing the bottom of the substrate layer by a camera to form a first contrast image, and photographing the top of the cover layer to form a second contrast image;

[0028] Step b: the picture recognition module recognizes the first comparison image and the second comparison image as two layers, and then overlaps the two layers through the layer covering module 9;

[0029] Step c: Compare the overlap of the circular punctuation marks on the two layers. The comparison method is: compare the border distances of the upper end, lower end, left end and right end. If the distance is less than or equal to 0.02 mm, the overlap is qualified. If the distance is greater than 0.02, the overlap is unqualified.

[0030] The beneficial effects of this application include:

[0031] 1) The substrate layer and the cover layer provided in the present application are respectively provided with countersunk holes to form an upper countersunk hole and a lower countersunk hole, and the internal contours of the two countersunk holes are adapted to the external contours of the electronic components, so that the electronic components remain stable during the sintering process;

[0032] 2) The camera recognition device provided in the present application includes a camera, an image recognition module, a distance measurement module and a layer covering module. The camera is used to take pictures of the bottom of the substrate layer and the top of the cover layer. The picture is converted into a layer through the image recognition module. The two layers are covered by the layer covering module. The covered layers are compared with each group of overlapping cross marks. The distances of the four upper, lower, left and right borders of each group of cross marks are compared. If it is less than 0.02mm, it means that the overlap between the substrate layer and the cover layer is qualified, and electronic components can be placed therein for firing. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the structure of the substrate layer viewed from above;

[0034] Figure 2 It is a schematic diagram of the structure of the cover layer from a top view;

[0035] Figure 3 It is a schematic diagram of the structure of the substrate layer from a top view;

[0036] Figure 4 This is a schematic diagram of the cover layer structure when viewed from above;

[0037] Figure 5 It is a schematic cross-sectional view of the combined structure of the substrate layer and the cover layer;

[0038] Figure 6 It is a schematic diagram of the connection of the sintering positioning method device;

[0039] List of components and reference numerals: 1. Substrate layer; 2. Cover layer; 3. Sink hole; 4. Upper sink hole; 5. Camera recognition device; 6. First center mark; 7. Second center mark; 8. Circular mark; 9. Layer covering module; 10. Camera; 11. Image recognition module; 12. Distance measurement module. DETAILED DESCRIPTION

[0040] The present application is described in detail below with reference to embodiments, but the present application is not limited to these embodiments.

[0041] The present application provides a device for positioning the center of glass sintering, comprising a substrate layer 1 for placing electronic components to be sintered, wherein the substrate layer 1 is provided with a sink hole 3, and the contour shape of the sink hole 3 is adapted to the lower half of the electronic components to be sintered;

[0042] The lower half of the electronic component refers to the cross section at the center of the vertical line of the electronic component as the dividing line, the electronic component is divided into upper and lower parts from the dividing line, and the lower half and the contour shape of the sink hole 3 are milled into the same inner contour, so that the electronic component to be sintered is stably placed inside the substrate layer 1;

[0043] A cover layer 2 is installed on the upper end of the substrate layer 1, and the cover layer 2 is provided with an upper countersunk hole 4, and the contour shape of the upper countersunk hole 4 is adapted to the upper half of the electronic component to be sintered;

[0044] The upper countersunk hole 4 and the lower countersunk hole 3 wrap the to-be-sintered part to form a closed inner cavity, and the electronic components to be sintered are placed in the inner cavity and then fired, thereby ensuring the stability of the electronic components in the sintering furnace.

[0045] The lower end of the substrate layer 1 is provided with a plurality of first central marks 6, and the top end of the cover layer 2 is provided with a plurality of second central marks 7;

[0046] The substrate layer 1 and the cover layer 2 are detachably connected. In the present application, the substrate layer 1 and the cover layer 2 can be connected by a snap connection or a screw connection.

[0047] The position of the first center mark 6 and the center position of the lower sink hole 3 are arranged on the same vertical extension line, and the position of the second center mark 7 and the center position of the upper sink hole 4 are arranged on the same vertical extension line.

[0048] The first central mark 6 and the second central mark 7 are etched into cross marks by laser, and a circular mark 8 is etched at the center point of the two cross marks, and the diameters of the two circular marks 8 are the same.

[0049] The connecting line between the circular mark 8 on the substrate layer 1 and each circular mark 8 on the corresponding cover layer 2 coincides with the central vertical line of the electronic component to be sintered, ensuring that the center of the electronic component to be sintered is positioned in the inner cavity, so that the electronic component to be sintered is stabilized at the position of the central vertical line.

[0050] The external camera recognition device 5 is used to locate and measure the center position overlap between the upper sink hole 4 and the lower sink hole 3.

[0051] The camera recognition device 5 includes a camera 10, a picture recognition module 11, a distance measurement module 12 and a layer covering module 9;

[0052] The camera 10 is used to take pictures of the bottom end of the substrate layer 1 and the top end of the cover layer 2;

[0053] The picture recognition module 11 is used to recognize two pictures as two layers;

[0054] The layer covering module 9 is used to overlap the two layers and compare the overlap of the circular punctuation marks 8 on the two layers.

[0055] A method for locating the center of glass sintering, a method for preparing a sintering tooling in the production process of electronic components, using the aforementioned device for locating the center of glass sintering, comprising the following steps:

[0056] Step 1: Determine the size of the countersunk hole. According to the external size of the electronic component, the size of the upper countersunk hole 4 and the lower countersunk hole 3 for placing the electronic component is designed. The upper countersunk hole 4 and the lower countersunk hole 3 overlap to form an inner cavity. The electronic component is placed in the inner cavity to form a stable wrapped inner cavity.

[0057] Step 2: Determine the size of the positioning tool, evenly arrange the upper countersunk holes on the base plate layer, and evenly arrange the lower countersunk holes on the cover plate layer, so that the position of each upper countersunk hole fits the position of each lower countersunk hole;

[0058] The internal shapes of the upper countersunk hole 4 and the lower countersunk hole 3 in step 2 are adapted to the outer contour and size of the electronic component.

[0059] Step 3: Make the cover layer and the base layer, and use isostatic graphite material for turning and milling according to the designed size and structure to obtain a prefabricated sintering tooling;

[0060] The isostatically pressed graphite in step three is a high-purity graphite material.

[0061] Step 4: Surface hardening, soak and scrub the substrate layer and cover layer of the prefabricated sintering tooling with cleaning liquid, the soaking time is less than 10 minutes, put the prefabricated sintering tooling after soaking into a sintering furnace for sintering, the temperature in the sintering furnace is: 800-900℃, the sintering time is: 20mm / min, and the sintering tooling is formed after sintering;

[0062] The cleaning solution in step 4 comprises defatted oil powder and water, the mass ratio of the defatted oil powder to water is in the range of 1:10, and the temperature of the water is 30-50°;

[0063] Step 5: Center etching: etching a center mark on the center bottom surface of each sink hole of the substrate layer that has been surface hardened in step 4, and etching a center mark on the center top surface of each sink hole of the cover layer that has been surface hardened;

[0064] Step 6: Center positioning measurement, the center mark etched in step 5 is used to measure the overlap between the substrate layer and the cover layer through a camera recognition device;

[0065] The method of center positioning measurement in step 6 is:

[0066] Step a: photographing the bottom of the substrate layer 1 by a camera 10 to form a first contrast image, and photographing the top of the cover layer 2 to form a second contrast image;

[0067] Step b: the picture recognition module 11 recognizes the first comparison image and the second comparison image as two layers, and then overlaps the two layers through the layer covering module 9;

[0068] Step c: Compare the overlap of the circular punctuation marks 8 on the two layers. The comparison method is: compare the border distances of the upper end, lower end, left end and right end. If the distance is less than or equal to 0.02 mm, the overlap is qualified. If the distance is greater than 0.02, the overlap is unqualified.

[0069] Step 7: measurement and matching. Place the electronic components to be sintered into the sintering tool for error measurement. If the height and height error are less than 0.05 mm, the sintering tool is ready. Otherwise, repeat steps 1 to 4 and re-measure and match.

[0070] The above are only a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with the profession, without departing from the scope of the technical solution of the present application, using the technical content disclosed above to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. A device for locating the center of glass sintering, characterized in that: It comprises a substrate layer (1) for placing electronic components to be sintered, the substrate layer (1) being provided with a sink hole (3), the contour shape of the sink hole (3) being adapted to the lower half of the electronic components to be sintered; A cover plate layer (2) is mounted on the upper end of the substrate layer (1), the cover plate layer (2) being provided with an upper countersunk hole (4), the contour shape of the upper countersunk hole (4) being adapted to the upper half of the electronic component to be sintered; The base plate layer (1) and the cover plate layer (2) are detachably connected; The external camera recognition device (5) is used to locate and measure the center position coincidence between the upper sink hole (4) and the lower sink hole (3).

2. A device for positioning the center of glass sintering according to claim 1, characterized in that: A plurality of first central marking points (6) are arranged at the lower end of the substrate layer (1), and a plurality of second central marking points (7) are arranged at the top end of the cover layer (2); The position of the first center mark (6) and the center position of the lower sink hole (3) are arranged on the same vertical extension line, and the position of the second center mark (7) and the center position of the upper sink hole (4) are arranged on the same vertical extension line.

3. The device for positioning the center of glass sintering according to claim 1, characterized in that: The first central mark (6) and the second central mark (7) are etched into cross marks by laser, and a circular mark (8) is etched at the center point of the two cross marks, and the diameters of the two circular marks (8) are the same.

4. A device for positioning the center of glass sintering according to claim 3, characterized in that: The camera recognition device (5) comprises a camera (10), a picture recognition module (11), a distance measurement module (12) and a layer covering module (9); The camera (10) is used to take pictures of the bottom end of the substrate layer (1) and the top end of the cover layer (2); The picture recognition module (11) is used to recognize two pictures as two layers; The layer covering module (9) is used to overlap the two layers and compare the overlap degrees of the circular punctuation marks (8) on the two layers.

5. A method for positioning the center of glass sintering, a method for preparing sintering tooling in the production process of electronic components, characterized in that: The device for positioning the center of glass sintering according to any one of claims 1 to 4 is used, comprising the following steps: Step 1: Determine the size of the countersunk hole. Design the size of the upper countersunk hole and the lower countersunk hole for placing the electronic components according to the external dimensions of the electronic components. Step 2: Determine the size of the positioning tool, evenly arrange the upper countersunk holes on the base plate layer, and evenly arrange the lower countersunk holes on the cover plate layer, so that the position of each upper countersunk hole fits the position of each lower countersunk hole; Step 3: Make the cover layer and the base layer, and use isostatic graphite material for turning and milling according to the designed size and structure to obtain a prefabricated sintering tooling; Step 4: Surface hardening, soak and scrub the substrate layer and cover layer of the prefabricated sintering tooling with cleaning liquid, the soaking time is less than 10 minutes, put the prefabricated sintering tooling after soaking into a sintering furnace for sintering, the temperature in the sintering furnace is: 800-900℃, the sintering time is: 20mm / min, and the sintering tooling is formed after sintering; Step 5: Center etching: etching a center mark on the center bottom surface of each sink hole of the substrate layer that has been surface hardened in step 4, and etching a center mark on the center top surface of each sink hole of the cover layer that has been surface hardened; Step 6: Center positioning measurement, the center mark etched in step 5 is measured by the camera recognition device 5 to measure the overlap between the substrate layer and the cover layer; Step 7: measurement and matching. Place the electronic components to be sintered into the sintering tool for error measurement. If the height and height error are less than 0.05 mm, the sintering tool is ready. Otherwise, repeat steps 1 to 4 and re-measure and match.

6. A method for locating the center of glass sintering according to claim 5, characterized in that: The internal shapes of the upper countersunk hole and the lower countersunk hole in step 2 are adapted to the outer contour and size of the electronic component.

7. A method for locating the center of glass sintering according to claim 5, characterized in that: The isostatically pressed graphite in step three is a high-purity graphite material.

8. A method for locating the center of glass sintering according to claim 5, characterized in that: The cleaning solution in step 4 includes defatted oil powder and water, the mass ratio of the defatted oil powder to water is in the range of 1:10, and the temperature of the water is 30-50°.

9. A method for locating the center of glass sintering according to claim 5, characterized in that: The method of center positioning measurement in step 6 is: Step a: photographing the bottom of the substrate layer (1) by means of a camera (10) to form a first comparison image, and photographing the top of the cover layer (2) to form a second comparison image; Step b: the picture recognition module (11) recognizes the first comparison image and the second comparison image as two layers, and then overlaps the two layers through the layer covering module (9); Step c: comparing the overlap of the circular punctuation marks (8) on the two layers, wherein the comparison method is: comparing the border distances of the upper end, the lower end, the left end and the right end; if the distance is less than or equal to 0.02 mm, the overlap is qualified; if the distance is greater than 0.02 mm, the overlap is unqualified.

Images