Blade coating device for solving edge accumulation of spin-coated photoresist

By designing a scraping device including support components, adjustment components and scrapers, the problem of edge stacking of spin-coated photoresist is solved, the accuracy of the photolithography process and product quality are improved, and the production cost and defective rate are reduced.

CN119200333APending Publication Date: 2024-12-27SOUTH WEST INST OF TECHN PHYSICS
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Patent Information

Application Number
CN202411540724.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2024-12-27

AI Technical Summary

Technical Problem

During semiconductor manufacturing, the accumulation of spin-coated photoresist on the edge of the wafer leads to a decrease in the accuracy of the photolithography and the impact of subsequent processes. The existing spraying and scraping equipment has problems such as uneven preparation of thickness films, high cost and inconvenient operation. .

Method used

Design a scraping device including support components, adjustment components and scrapers. The support components are fixed on the spin coating machine and the adjustment components are adjusted to adjust the position of the scraper and wafer. The scraper adopts polytetrafluoroethylene material and split blade design to achieve edges. Removal of photoresist.

Benefits of technology

Effectively solve the problem of edge stacking of spin-coated photoresist, improve the accuracy of the lithography process and product quality, reduce defective rate and production costs, and is simple to operate and is suitable for wafers of different sizes and shapes.

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Abstract

The invention discloses a blade coating device for solving edge accumulation of spin-coated photoresist. The blade coating device comprises a pair of supporting parts, an adjusting part connected with the pair of supporting parts, and a scraper connected with a Z-direction adjusting part in the adjusting part. Through the combined action of the shape and the size of the scraper and the adjusting device, the residual photoresist generated at the edge of the wafer in the spin-coating process is effectively removed. The device is easy to integrate, simple in structure and convenient to operate, by being integrated with a traditional spin coater, the advantages of the spin coater can be maintained, it is guaranteed that photoresist in the area, needing to be patterned, of a wafer is uniform and flat, the problem of edge residual photoresist caused in the spin coating process can be effectively solved, and therefore the precision of the photoetching technology and the product quality are improved.
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Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a scraping device for solving the problem of edge accumulation of spin-coated photoresist, aiming to reduce or eliminate the accumulation of photoresist at the edge of a wafer, improve the flatness of spin-coated photoresist, and improve the precision of photolithography process and product quality. Background Art

[0002] In the semiconductor manufacturing process, photoresist coating is a key step. However, during the spin coating process, due to the fluidity of the photoresist and the centrifugal force generated by the rotation of the substrate, photoresist accumulation often forms on the substrate. This accumulation of photoresist not only affects the accuracy of the photolithography pattern, but may also have adverse effects on subsequent processes.

[0003] At present, the preparation methods of spraying or scraping can improve the edge accumulation of photoresist. However, the spraying equipment is limited by the viscosity of the spray glue and cannot prepare thick films; the scraping equipment is limited by the control accuracy, and there are problems such as uneven scraping, easy damage to the substrate surface, and single-side edge accumulation when preparing thin films; and the purchase cost and operation and maintenance cost of spraying and scraping equipment are high, which is not conducive to small-scale scientific research experiments. Summary of the invention

[0004] (I) Purpose of the invention

[0005] The purpose of the present invention is to provide a scraping device for solving the problem of edge accumulation of spin-coated photoresist, which is integrated on a spin coater and can simultaneously achieve the functions of glue leveling and edge residual glue removal during the spin coating process. It has the advantages of simple structure, easy operation and high flexibility.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, the present invention provides a scraping device for solving the problem of edge accumulation of spin-coated photoresist, which comprises: a supporting component, an adjusting component and a scraper. The supporting component is used to fix the scraping device on the spin coater, and plays the role of fixing and supporting the scraper to ensure its stable operation; the adjusting component connects the supporting component and the scraper, and the adjusting component adjusts the relative position between the scraper and the wafer to adapt to the thickness difference caused by different types of photoresists and wafers of different sizes; the scraper is used to directly contact the photoresist on the surface of the wafer, and scrape off excess photoresist on the edge during the operation of the spin coater. By replacing the scraper, it can adapt to wafers of different shapes and sizes.

[0008] Among them, a pair of fixing screws and a base are provided at the bottom of the supporting component, and the base is fixed on the spin coater tray by the fixing screws. A circular socket is provided on the base, and a support rod for connecting the circular socket of the base is provided at the top of the supporting component, and the support rod is used to connect the adjustment component.

[0009] Wherein, an X-direction adjustment component for X-direction adjustment is provided at the bottom of the adjustment component, an X-direction adjustment handle for X-direction adjustment is provided on the X-direction adjustment component, and a Y-direction adjustment component for Y-direction adjustment is provided on the X-direction adjustment component; a Y-direction adjustment handle for Y-direction adjustment is provided on the Y-direction adjustment component, and a Z-direction adjustment component for Z-direction adjustment is provided on the Y-direction adjustment component; a Z-direction adjustment coarse adjustment knob and a Z-direction fine adjustment knob for Z-direction adjustment are provided on the Z-direction adjustment component, and a digital display screen for displaying the Z-direction moving distance is provided on the Z-direction adjustment component; the X-direction and the Y-direction are two directions perpendicular to each other on the horizontal plane, and the Z-direction is a vertical direction perpendicular to the horizontal plane.

[0010] There are two groups of support components, which are respectively arranged at two ends of the X-direction adjustment component.

[0011] Wherein, a circular socket for connecting the support rod is arranged at the bottom of the X-direction adjustment component.

[0012] The scraping device also includes: a digital display screen, which displays the displacement of the scraper in the Z direction.

[0013] Wherein, a straight blade body is arranged at the top of the scraper, and a pair of centrosymmetrical split blades are arranged at the bottom of the scraper.

[0014] Wherein, the bottom of the Z-direction adjustment component is connected to the blade body of the scraper.

[0015] Wherein, the pair of split blades and the straight blade body form a fixed angle of 15° to 60°.

[0016] Wherein, the scraper is made of polytetrafluoroethylene.

[0017] (III) Beneficial effects

[0018] The scraping device for solving the edge accumulation of spin-coated photoresist provided by the above technical solution can effectively solve the edge accumulation problem caused by spin-coated photoresist, improve the accuracy of the photolithography process and product quality; it is easy to integrate, simple in structure and easy to operate, and reduces the defective rate and production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an isometric view of a coating device provided in an embodiment of the present invention.

[0020] Figure 2 for Figure 1 Isometric view of the spin coater.

[0021] Figure 3 for Figure 1 Isometric view of the center support component.

[0022] Figure 4 for Figure 1 Isometric view of the adjustment component in .

[0023] Figure 5 for Figure 1 Isometric view of the scraper and wafer.

[0024] Figure 6 Schematic diagram of the design principle of the scraper.

[0025] Reference numerals:

[0026] 0: Spin coater; 0-1: Spin coater tray; 0-2: Rotating base; 0-3: Wafer; 1: Support component; 1-1: Fixing screw: 1-2: Base; 1-3: Support rod; 2: Adjustment component; 2-0: Socket; 2-1: X-direction adjustment component; 2-1-1: X-direction adjustment handle; 2-2: Y-direction adjustment component; 2-2-1: Y-direction adjustment handle; 2-3: Z-direction adjustment component; 2-3-1: Z-direction coarse adjustment knob; 2-3-2: Z-direction fine adjustment knob; 2-3-3: Digital display screen; 3: Scraper; 3-1: Straight blade; 3-2: Split blade. DETAILED DESCRIPTION

[0027] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples.

[0028] like Figures 1 to 6 As shown, the scraping device provided in this embodiment includes a pair of supporting parts 1, an adjusting part 2 connected to the pair of supporting parts 1, and a scraper 3 connected to the Z-direction adjusting part 2-3 in the adjusting part 2. The size of the pair of supporting parts 1 and the adjusting part 2 can be adjusted in combination with the size of the spin coater, and it is necessary to ensure that the scraper 3 can be moved to the top of the rotating base of the spin coater in the XY direction and can be moved to contact the surface of the wafer in the Z direction. The scraper 3 can be equipped with a variety of models: the size of the blade and the blade of the scraper 3 can be selected according to the size of the wafer and the area to be patterned in the wafer; the blade and the blade of the scraper 3 are at a fixed angle of 15° to 60°, such as 15°, 30°, 45°, 60°, etc., which can be selected according to the viscosity of the photoresist and the removal effect of the edge residual glue.

[0029] like Figure 2 and Figure 3As shown, the support component 1 is a component for mounting the scraper device on the spin coater 0, and is composed of three main parts, namely, a fixing screw 1-1, a base 1-2, and a support rod 1-3. First, a hole is opened at a suitable position of the spin coater tray 0-1, and the base 1-2 is fixed to the spin coater tray 0-1 by the fixing screw 1-1. Then the support rod 1-3 is placed on the base 1-2 to connect the base 1-2 and the adjustment component 2. There are two support devices, which together play the role of fixing and maintaining the overall structural stability of the scraper device.

[0030] like Figure 4 As shown, the adjustment component 2 is a component for adjusting the relative position between the scraper and the wafer and maintaining a stable relative position state during the scraping process. The adjustment component 2 as a whole is composed of three main parts, an X-direction adjustment component 2-1, a Y-direction adjustment component 2-2, and a Z-direction adjustment component 2-3. The X-direction and the Y-direction are two directions perpendicular to each other on the horizontal plane, and the Z-direction is a vertical direction perpendicular to the horizontal plane. Among them, there are two circular sockets 2-0 at the bottom of the X-direction adjustment component, and the adjustment component 2 can be connected to the support rod 1-3 of the support component 1 through the socket 2-0. Using the X-direction adjustment handle 2-1-1 and the Y-direction adjustment handle 2-2-1, the scraper can be moved in the X and Y directions, that is, in the horizontal direction. The scraping device must accurately control the position of the scraper in the Z direction to ensure that the edge photoresist is scraped cleanly and the wafer surface is not scratched. Therefore, in addition to the Z-direction coarse adjustment knob 2-3-1 for long-distance quick adjustment of the scraper in the Z direction, the Z-direction fine adjustment knob 2-3-2 is added in the Z-direction adjustment component 2-3 for fine adjustment of the scraper distance in the Z direction; in addition, the digital display screen 2-3-3 can intuitively display the displacement of the scraper in the Z direction, providing a numerical reference for the position of the scraper in the Z direction. The three work together to achieve precise regulation of the scraper in the Z direction.

[0031] like Figure 5 and 6 As shown, the scraper 3 is the core component of the present invention, and is connected to the Z-direction adjustment component 2-3. Its design needs to consider the effect of removing edge glue and protecting the surface of the wafer. Specifically: ① In terms of materials, the scraper 3 is made of polytetrafluoroethylene. First of all, polytetrafluoroethylene has a certain wear resistance, which can prevent the scraper 3 from being worn and causing a large height error during repeated use; at the same time, the polytetrafluoroethylene scraper 3 also has a certain self-cleaning function, which can reduce the influence of impurities on the scraping effect. ② In terms of structure, the scraper 3 adopts a pair of split blades 3-2, and the split blades 3-2 are at a fixed angle of 15° to 60° with the straight blade body 3-1 to reduce damage to the wafer surface and improve the scraping effect of the edge photoresist.

[0032] When in use, firstly, the scraping device is moved through a pair of supporting members 1 as follows: Figure 1The wafer 0-3 is then placed on the rotating base 0-2 of the spin coater 0, and a scraper 3 of appropriate size and blade angle is selected according to the size of the wafer and the properties of the photoresist. The scraper is adjusted to the position directly above the wafer using the X- and Y-direction adjustment components 2-1 and 2-2, and the scraper blade is brought into contact with the wafer surface using the Z-direction adjustment component 2-3, and the reading on the digital display screen 2-3-3 is recorded as "position 1". The scraper is lifted a certain distance using the Z-direction adjustment component 2-3.

[0033] Set the spin coater's rotation program, add the final program for the scraper to scrape off the residual glue on the edge, scraping program: 100rpm~1000rpm, 15s~60s. Apply photoresist to the wafer surface and start the spin coater to rotate. When the spin coater enters the scraping program, use the Z-direction adjustment component 2-3 to adjust the digital display screen 2-3-3 reading to "position 1". At this time, the scraper just contacts the wafer surface to scrape off the residual glue on the wafer edge.

[0034] After the spin coater stops, the scraper is lifted a certain distance using the Z-direction adjustment component 2-3 to facilitate removal of the wafer.

[0035] The spin coater of the embodiment can be of any type, and the scraping device can be of any type. Figure 1 As shown, an integrated method of pre-punching holes on the spin coater; the scraping device can also be integrated on a fixed platform outside the spin coater.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A scraping device for solving the edge accumulation of spin-coated photoresist, characterized in that: include: Supporting parts, adjusting parts and scrapers. The supporting parts are used to fix the scraper device on the spin coater, and play the role of fixing and supporting the scraper to ensure its stable operation; The adjustment component connects the supporting component and the scraper. The adjustment component adjusts the relative position between the scraper and the wafer to adapt to the thickness difference caused by different types of photoresists and wafers of different sizes. The scraper is used to directly contact the photoresist on the surface of the wafer. During the operation of the spin coater, the excess photoresist on the edge is scraped off. The scraper can be replaced to adapt to wafers of different shapes and sizes.

2. The coating device according to claim 1, characterized in that: A pair of fixing screws and a base are provided at the bottom of the supporting component, and the base is fixed on the spin coater tray by the fixing screws. A circular socket is provided on the base, and a supporting rod for connecting the circular socket of the base is provided at the top of the supporting component, and the supporting rod is used to connect the adjustment component.

3. The coating device according to claim 2, characterized in that: An X-direction adjustment component for X-direction adjustment is provided at the bottom of the adjustment component, an X-direction adjustment handle for X-direction adjustment is provided on the X-direction adjustment component, and a Y-direction adjustment component for Y-direction adjustment is provided on the X-direction adjustment component; a Y-direction adjustment handle for Y-direction adjustment is provided on the Y-direction adjustment component, and a Z-direction adjustment component for Z-direction adjustment is provided on the Y-direction adjustment component; a Z-direction adjustment coarse adjustment knob and a Z-direction fine adjustment knob for Z-direction adjustment are provided on the Z-direction adjustment component, and a digital display screen for displaying the Z-direction moving distance is provided on the Z-direction adjustment component; the X-direction and the Y-direction are two directions perpendicular to each other on a horizontal plane, and the Z-direction is a vertical direction perpendicular to the horizontal plane.

4. The coating device according to claim 3, characterized in that: There are two groups of supporting components, which are respectively arranged at two ends of the X-direction adjusting component.

5. The coating device according to claim 4, characterized in that: A circular socket for connecting the support rod is arranged at the bottom of the X-direction adjustment component.

6. The coating device according to claim 5, characterized in that: Also includes: The digital display screen shows the displacement of the scraper in the Z direction.

7. The coating device according to claim 6, characterized in that: The top of the scraper is provided with a straight blade body, and the bottom of the scraper is provided with a pair of centrosymmetrical split blades.

8. The coating device according to claim 7, characterized in that: The bottom of the Z-direction adjusting component is connected to the blade body of the scraper.

9. The scraping device according to claim 8, characterized in that: The pair of split blades and the straight blade body form a fixed angle of 15° to 60°.

10. The coating device according to any one of claims 1 to 9, characterized in that: The scraper is made of polytetrafluoroethylene.

Citation Information

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