Circuit board and computing device comprising same

Abstract

The invention discloses a circuit board and a computing device comprising the circuit board, the circuit board comprises a plurality of copper sheets and a plurality of working chips, the working chips are arranged along a first direction, the distance between the adjacent working chips increases or decreases along the first direction, and the copper sheets are respectively arranged between the adjacent working chips. According to the circuit board, the heat dissipation effect is further improved, the manufacturing process is simple, the manufacturing cost is low, and the working performance of the computing equipment comprising the circuit board is also improved.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of October 18, 2018, application number 201811214637.5, and invention name “A metal-based copper-clad circuit board and a computing device comprising the circuit board”. Technical Field

[0002] The present invention relates to a circuit board, in particular to a metal-based copper-clad circuit board. The present invention also relates to a computing device comprising the metal-based copper-clad circuit board. Background Art

[0003] PCB board, or printed circuit board, is a general term for commonly used circuit boards. It is divided into cardboard, semi-fiberglass board, fiberglass board, metal substrate, etc. According to the material, the PCB board with a metal substrate is a form with good heat dissipation performance. Generally, a single-sided board consists of a three-layer structure, namely the circuit layer (copper foil), the insulation layer and the metal base layer. Among them, although the heat dissipation performance of the metal-based PCB board is improved to a certain extent compared with the PCB boards of other materials, with the rapid increase in the computing speed and amount of computing equipment, the requirements for heat dissipation and cost are getting higher and higher. The traditional PCB board with a metal substrate cannot meet the needs of modern computing equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a metal-based copper-clad circuit board and a computing device comprising the metal-based copper-clad circuit board. The metal-based copper-clad circuit board further improves the heat dissipation effect, has a simple manufacturing process and low manufacturing cost.

[0005] In order to achieve the above-mentioned object, the metal-based copper-clad circuit board of the present invention comprises a first copper foil layer, a water-cooled substrate and a first insulating heat-conducting layer, the first copper foil layer comprises a first surface and a second surface, the second surface is connected with a plurality of working chips, and the water-cooled substrate comprises a first water-cooled board surface. The first surface and the first water-cooled board surface are connected by hot pressing through the first insulating heat-conducting layer.

[0006] In one embodiment of the above-mentioned metal-based copper-clad circuit board, a second copper foil layer and a second insulating heat-conducting layer are further included, the second copper foil layer includes a third surface and a fourth surface, and the fourth surface is connected to a plurality of working chips. The water-cooled substrate includes a second water-cooled board surface, and the third surface is hot-pressed with the second water-cooled board surface through the second insulating heat-conducting layer.

[0007] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the second water-cooling surface is arranged opposite to the first water-cooling surface.

[0008] In one embodiment of the above-mentioned metal-based copper-clad circuit board, a third copper foil layer and a third insulating heat-conducting layer are further included, the third copper foil layer includes a fifth surface and a sixth surface, and the sixth surface is connected to a plurality of working chips. The water-cooled substrate includes a third water-cooled board surface, and the fifth surface is hot-pressedly connected to the third water-cooled board surface through the third insulating heat-conducting layer.

[0009] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the third water-cooling surface is perpendicular to the first water-cooling surface.

[0010] In one embodiment of the above-mentioned metal-based copper-clad circuit board, a fourth copper foil layer and a fourth insulating heat-conducting layer are further included, the fourth copper foil layer includes a seventh surface and an eighth surface, and the eighth surface is connected to a plurality of working chips. The water-cooled substrate includes a fourth water-cooled board surface, and the seventh surface is hot-pressedly connected to the fourth water-cooled board surface through the fourth insulating heat-conducting layer.

[0011] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the fourth water-cooling surface is arranged opposite to the third water-cooling surface.

[0012] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the water-cooling substrate includes a metal base and a liquid cooling tube, and the liquid cooling tube is packaged in the metal base.

[0013] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the working chips are multiple and arranged along the first direction.

[0014] In one embodiment of the above-mentioned metal-based copper-clad circuit board, it further includes a copper sheet, and the copper sheet is arranged between adjacent working chips.

[0015] In one implementation of the above-mentioned metal-based copper-clad circuit board, along the first direction, the distance between adjacent working chips increases / decreases gradually.

[0016] In one embodiment of the above-mentioned metal-based copper-clad circuit board, the working chips are arranged in multiple rows along a second direction, and the first direction is perpendicular to the second direction.

[0017] The computing device of the present invention comprises a power supply unit, a control unit connected to the power supply unit, and a computing unit connected to the control unit and the power supply unit, wherein the computing unit is integrated on one or more computing boards, wherein the computing board comprises the metal-based copper-clad circuit board.

[0018] The beneficial effect of the present invention is that the metal-based copper-clad circuit board of the present invention significantly reduces thermal resistance, which not only greatly improves system performance but also reduces cost.

[0019] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front view schematic diagram of an embodiment of the metal-based copper-clad circuit board of the present invention;

[0021] Figure 2 for Figure 1 AA cross-sectional view of ;

[0022] Figure 3 A schematic side view of an embodiment of a metal-based copper-clad circuit board of the present invention;

[0023] Figure 4 A schematic top view of an embodiment of a metal-based copper-clad circuit board of the present invention;

[0024] Figure 5 A schematic top view of an embodiment of a metal-based copper-clad circuit board of the present invention;

[0025] Figure 6 It is a front view schematic diagram of an embodiment of the metal-based copper-clad circuit board of the present invention;

[0026] Figure 7 A block diagram of a computing device according to an embodiment of the present invention.

[0027] Among them, the reference numerals

[0028] 20, 20a, 20b, 20c, 20d: Metal-based copper-clad circuit boards

[0029] 110, 110a, 110b, 110c: first copper foil layer

[0030] 120a, 120b, 120c: second copper foil layer

[0031] 130b, 130c: third copper foil layer

[0032] 140c: The fourth copper foil layer

[0033] 150d: Fifth copper foil layer

[0034] 111, 111a, 111b, 111c: first surface

[0035] 112, 112a, 112b, 112c: second surface

[0036] 121a, 121b, 121c: third surface

[0037] 122a, 122b, 122c: fourth surface

[0038] 131b, 131c: fifth surface

[0039] 132b, 132c: Sixth surface

[0040] 141c: Seventh Surface

[0041] 142c: Eighth Surface

[0042] 210, 210a, 210b, 210c: Water-cooled base plate

[0043] 211, 211a, 211b, 211c: first water cooling panel

[0044] 212a, 212b, 212c: Second water cooling panel surface

[0045] 213b, 213c: The third water cooling panel

[0046] 214c: Fourth water cooling panel

[0047] 310, 310a, 310b, 310c: first insulating heat-conducting layer

[0048] 320a, 320b, 320c: second insulating heat-conducting layer

[0049] 330b, 330c: third insulating heat-conducting layer

[0050] 340c: Fourth insulation and heat conducting layer

[0051] 400: Working chip

[0052] 500: Copper sheet

[0053] 10: Computing Devices

[0054] 11: Power supply unit

[0055] 12: Control unit

[0056] 13: Computational Unit

[0057] 13A: Computing board

[0058] 14: Cooling unit

[0059] X: First direction

[0060] Y: Second direction

[0061] p1, p2, p3: spacing DETAILED DESCRIPTION

[0062] The technical solution of the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the claims attached to the present invention.

[0063] References in the specification to "an embodiment", "another embodiment", "this embodiment", etc., mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include these specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Further, when describing specific features, structures or characteristics in conjunction with an embodiment, whether or not there is an explicit description, it has been shown that it is within the knowledge of those skilled in the art to combine such features, structures or characteristics into other embodiments.

[0064] Certain words are used in the specification and subsequent claims to refer to specific components or parts. It should be understood by those of ordinary skill in the art that technical users or manufacturers may refer to the same component or part by different nouns or terms. This specification and subsequent claims do not use differences in names as a way to distinguish components or parts, but rather use differences in functions of components or parts as the criteria for distinction. The words "include" and "comprising" mentioned throughout the specification and subsequent claims are open-ended terms and should be interpreted as "including but not limited to". In addition, the word "connected" herein includes any direct and indirect means of connection.

[0065] It should be noted that in the description of the present invention, the orientation or position relationship indicated by the terms "transverse", "longitudinal", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. For the sake of clarity, the order terms such as "first", "second", "third", "fourth", etc. mentioned herein are used to distinguish an element, region, or part from another identical or similar element, region, or part, rather than to limit a specific element, region, or part.

[0066] like Figure 1 and Figure 2 As shown, Figure 1 This is a front view of an embodiment of the metal-based copper-clad circuit board of the present invention. Figure 2 for Figure 1The cross-sectional structure diagram of the metal-based copper-clad circuit board 20. The metal-based copper-clad circuit board 20 includes a first copper foil layer 110, a water-cooled substrate 210, and a first insulating heat-conducting layer 310, wherein the first copper foil layer 110 includes a first surface 111 and a second surface 112, the first surface 111 and the second surface 112 are oppositely disposed surfaces of the first copper foil layer 110, the second surface 112 is connected to a plurality of working chips 400, and the water-cooled substrate 210 includes a first water-cooled board surface 211. Figure 2 As shown, the first surface 111 of the first copper foil layer 110 is connected to the first water-cooling plate surface 211 of the water-cooling substrate 210 by thermal compression via the first insulating heat-conducting layer 310 .

[0067] The present invention adopts a water-cooled plate as the substrate of the metal-based copper-clad circuit board. The heat generated by the heat-generating components on the copper foil layer during operation is conducted to the water-cooled plate through the insulating heat-conducting layer, and then the heat is circulated and discharged through the liquid cooling pipe in the water-cooled plate. This not only significantly reduces the thermal resistance, but also significantly improves the overall heat dissipation performance of the circuit board, and the production and manufacturing processes are simple, and the product cost is low.

[0068] In addition, such as Figure 1 As shown, the metal-based copper-clad circuit board 20 includes a first direction X and a second direction Y. The first direction X is perpendicular to the second direction Y. Among them, the working chips 400 are arranged in sequence along the first direction X. In addition, along the first direction X, the distance between adjacent working chips 400 gradually increases. As shown in the figure, the spacing p1 is smaller than the spacing p2, the spacing p2 is smaller than the spacing p3, and so on.

[0069] In other embodiments, the distance between adjacent working chips can be gradually reduced. In specific implementation, the end of the metal-based copper-clad circuit board 20 where the working chips 400 are arranged more closely corresponds to the end with relatively high heat dissipation efficiency in the heat dissipation channel, and the end where the working chips 400 are arranged more sparsely is set at the end with relatively low heat dissipation efficiency in the heat dissipation channel. For example, the end with more closely arranged chips can be set at the air inlet, and the end with more sparse arranged chips can be set at the air outlet, so as to balance the heat dissipation effect of each working chip 400, ensure the working stability of each working chip 400, and thus ensure the working stability of the overall circuit.

[0070] like Figure 1 As shown, the working chips 400 can also be arranged in multiple rows along the second direction Y. In this embodiment, the working chips 400 are arranged in two rows along the second direction Y. Of course, the number of rows can be adjusted as needed.

[0071] In one embodiment of the present invention, Figure 3As shown, the metal-based copper-clad circuit board 20a includes a first copper foil layer 110a, a water-cooled substrate 210a and a first insulating heat-conducting layer 310a, wherein a second surface 112a of the first copper foil layer 110a is connected to a plurality of working chips 400, and a first surface 111a of the first copper foil layer 110a is hot-pressedly connected to a first water-cooled plate surface 211a of the water-cooled substrate 210a via the first insulating heat-conducting layer 310a.

[0072] In addition, the metal-based copper-clad circuit board 20a further includes a second copper foil layer 120a and a second insulating heat-conducting layer 320a, wherein the second copper foil layer 120a includes a third surface 121a and a fourth surface 122a, the third surface 121a and the fourth surface 122a are oppositely disposed surfaces of the second copper foil layer 120a, and the fourth surface 122a is connected to a plurality of working chips 400. The water-cooled substrate 210a includes a second water-cooled board surface 212a, and the third surface 121a of the second copper foil layer 120a is hot-pressedly connected to the second water-cooled board surface 212a of the water-cooled substrate 210a through the second insulating heat-conducting layer 320a. The first water-cooled board surface 211a and the second water-cooled board surface 212a are oppositely disposed surfaces of the water-cooled substrate 210a.

[0073] In this embodiment, the two larger surfaces of the water-cooled substrate are both attached with copper foil through the insulating heat-conducting layer, which can further expand the layout and wiring area of ​​the circuit board. While the layout and wiring area remains unchanged, the overall volume of the circuit board can be reduced, which is conducive to using the metal-based copper-clad circuit board in an environment with limited space.

[0074] In one embodiment of the present invention, Figure 4 As shown, the metal-based copper-clad circuit board 20b includes a first copper foil layer 110b, a second copper foil layer 120b, a water-cooled substrate 210b, a first insulating heat-conducting layer 310b and a second insulating heat-conducting layer 320b, wherein the second surface 112b of the first copper foil layer 110b and the fourth surface 122b of the second copper foil layer 120b are connected with a plurality of working chips 400, the first surface 111b of the first copper foil layer 110b and the first water-cooled board surface 211b of the water-cooled substrate 210b are hot-pressed connected via the first insulating heat-conducting layer 310a, and the third surface 121b of the second copper foil layer 120b and the second water-cooled board surface 212b of the water-cooled substrate 210b are hot-pressed connected via the second insulating heat-conducting layer 320b.

[0075] In addition, the metal-based copper-clad circuit board 20b further includes a third copper foil layer 130b and a third insulating heat-conducting layer 330b, wherein the third copper foil layer 130b includes a fifth surface 131b and a sixth surface 132b, the fifth surface 131b and the sixth surface 132b are oppositely arranged surfaces of the third copper foil layer 130b, and the sixth surface 132b is connected to a plurality of working chips 400. The water-cooled substrate 210b includes a third water-cooled board surface 213b, and the fifth surface 131b of the third copper foil layer 130b is connected to the third water-cooled board surface 213b of the water-cooled substrate 210b by hot pressing through the third insulating heat-conducting layer 330b. The third water-cooled board surface 213b is another surface of the water-cooled substrate 210b excluding the first water-cooled board surface 211b and the second water-cooled board surface 212b, for example, the third water-cooled board surface 213b is a surface substantially perpendicular to the first water-cooled board surface 211b and the second water-cooled board surface 212b.

[0076] In one embodiment of the present invention, Figure 5 As shown, the metal-based copper-clad circuit board 20c includes a first copper foil layer 110c, a second copper foil layer 120c, a third copper foil layer 130c, a water-cooled substrate 210c, a first insulating heat-conducting layer 310c, a second insulating heat-conducting layer 320c, and a third insulating heat-conducting layer 330c, wherein the second surface 112c of the first copper foil layer 110c, the fourth surface 122c of the second copper foil layer 120c, and the sixth surface 132c of the third copper foil layer 130c are respectively connected to a plurality of working chips 400, and the first copper foil layer 110c is connected to the first surface 112c of the first copper foil layer 110c, the fourth surface 122c of the second copper foil layer 120c, and the sixth surface 132c of the third copper foil layer 130c are respectively connected to the first surface 112c of the first copper foil layer 110c, the fourth surface 122c of the second copper foil layer 120c, and the sixth surface 132c of the third copper foil layer 130c. The first surface 111c of the foil layer 110c is hot-pressed to the first water-cooled surface 211c of the water-cooled substrate 210c via the first insulating heat-conducting layer 310c, the third surface 121c of the second copper foil layer 120c is hot-pressed to the second water-cooled surface 212c of the water-cooled substrate 210c via the second insulating heat-conducting layer 320c, and the fifth surface 131c of the third copper foil layer 130c is hot-pressed to the third water-cooled surface 213c of the water-cooled substrate 210c via the third insulating heat-conducting layer 330c.

[0077] In addition, the metal-based copper-clad circuit board 20c further includes a fourth copper foil layer 140c and a fourth insulating heat-conducting layer 340c, wherein the fourth copper foil layer 140c includes a seventh surface 141c and an eighth surface 142c, the seventh surface 141c and the eighth surface 142c are oppositely disposed surfaces of the fourth copper foil layer 140c, and the eighth surface 142c is connected to a plurality of working chips 400. The water-cooled substrate 210c includes a fourth water-cooled board surface 214c, and the seventh surface 141c of the fourth copper foil layer 140c is connected to the fourth water-cooled board surface 214c of the water-cooled substrate 210c by hot pressing through the fourth insulating heat-conducting layer 340c. The fourth water-cooled surface 214c is another surface of the water-cooled substrate 210c excluding the first water-cooled surface 211c, the second water-cooled surface 212c and the third water-cooled surface 213c. For example, the fourth water-cooled surface 214c is a surface substantially perpendicular to the first water-cooled surface 211c and the second water-cooled surface 212c, and is a surface substantially parallel to the third water-cooled surface 213c. From the figure, the first water-cooled surface 211c, the second water-cooled surface 212c, the third water-cooled surface 213c and the fourth water-cooled surface 214c are, for example, four adjacent surfaces of the water-cooled substrate 210c. Preferably, the outlet and inlet of the liquid cooling tube encapsulated in the metal matrix of the water-cooled substrate 210c can be led out from the side, wherein the side refers to the narrow and short surface of the water-cooled substrate 210c excluding the first water-cooled board surface 211c, the second water-cooled board surface 212c, the third water-cooled board surface 213c and the fourth water-cooled board surface 214c, so as to make full use of the larger surface of the water-cooled substrate 210 as much as possible to reduce the volume of the circuit board or set more working chips. Of course, according to actual needs, the outlet and inlet of the liquid cooling tube can also be led out from any one or more of the first water-cooled board surface 211c, the second water-cooled board surface 212c, the third water-cooled board surface 213c and the fourth water-cooled board surface 214c, and the present invention is not limited thereto.

[0078] like Figure 6 As shown, in another embodiment of the present invention, the metal-based copper-clad circuit board 20d includes a fifth copper foil layer 150d, a water-cooled substrate, and a fifth insulating heat-conducting layer, wherein a plurality of working chips 400 are attached to the fifth copper foil layer 150d, and the fifth copper foil layer 150d can be hot-pressed on one or more surfaces of the water-cooled substrate through the fifth insulating heat-conducting layer. The difference between this embodiment and the above-mentioned embodiments is that the metal-based copper-clad circuit board 20a also includes a plurality of copper sheets 500, and the working chips 400 are, for example, various computing and control chips. As the working efficiency of the working chips 400 increases, the heat generated by the working chips 400 also increases. The present invention arranges the copper sheets 500 between adjacent working chips 400. The copper sheets 500 not only have a good heat dissipation effect, but also can reduce line power loss.

[0079] When the distance between adjacent working chips 400 gradually increases or decreases, correspondingly, the size of the copper sheet 500 disposed between the working chips 400 also gradually increases or decreases.

[0080] In the above embodiments, the metal substrate of the water-cooled base plate can be made of aluminum as the substrate material, and copper as the liquid cooling tube material. However, it should be noted that the substrate and the liquid cooling tube can also be made of other materials with good thermal conductivity.

[0081] The computing device of the present invention may be a computing device for virtual currency, such as Figure 7 As shown, the computing device 10 of the present invention includes a power supply unit 11, a control unit 12, a computing unit 13, a heat dissipation unit 14, etc. The control unit 12 is connected to the power supply unit 11, and the computing unit 13 is connected to the control unit 12 and the power supply unit 11. The power supply unit 11 provides a power source for the control unit 12 and the computing unit 13. The computing unit 13 is used to run a specific algorithm to calculate the data. The control unit 12 is used to receive the calculation data of the computing unit 13, and analyze and process the calculation data and output it so as to obtain the corresponding virtual currency after communicating with the remote server. The heat dissipation unit 14 is used to dissipate heat from the computing unit 13 to ensure its normal operation. Among them, the computing unit 13 is, for example, integrated on a computing board 13A. Of course, the computing unit 13 may also include multiple computing boards 13A, such as Figure 5 As shown, the computing board 13A includes the metal-based copper-clad circuit board of any of the above-mentioned embodiments.

[0082] It should be noted that the connection method of the power supply unit, control unit and computing unit of the above-mentioned computing device is only an example of a specific implementation method, and the possibility of other connection methods is not excluded. The present invention does not limit the connection method of the various units of the computing device.

[0083] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A circuit board, characterized in that: include: Multiple copper sheets; as well as A plurality of working chips are arranged along a first direction, and along the first direction, the distance between adjacent working chips increases or decreases, and the copper sheets are respectively arranged between adjacent working chips.

2. The circuit board according to claim 1, characterized in that: The size of the copper sheet is proportional to the distance between the working chips adjacent to the copper sheet.

3. The circuit board according to claim 2, characterized in that: Along the first direction, when the distance between adjacent working chips gradually increases, the size of the copper sheet gradually increases.

4. The circuit board according to claim 2, characterized in that: Along the first direction, when the distance between adjacent working chips gradually decreases, the size of the copper sheet gradually decreases.

5. The circuit board according to claim 1, characterized in that: The copper sheets have the same size.

6. The circuit board according to claim 1, characterized in that: The copper sheet is used to dissipate heat from the circuit board.

7. The circuit board according to claim 1, characterized in that: The copper sheet is used to reduce the line power loss of the circuit board.

8. The circuit board according to claim 1, characterized in that: The circuit board is arranged in the heat dissipation channel.

9. The circuit board according to claim 8, characterized in that: The end where the working chips are arranged more densely is arranged at the air inlet of the heat dissipation channel, and the end where the working chips are arranged more sparsely is arranged at the air outlet of the heat dissipation channel.

10. The circuit board according to claim 8, characterized in that: The end where the working chips are arranged more densely corresponds to the end of the heat dissipation channel with relatively high heat dissipation efficiency, and the end where the working chips are arranged more sparsely corresponds to the end of the heat dissipation channel with relatively low heat dissipation efficiency.

11. The circuit board according to any one of claims 1 to 10, characterized in that: The working chips are arranged in multiple rows along the second direction.

12. The circuit board according to claim 11, characterized in that: The first direction is perpendicular to the second direction.

13. The circuit board according to claim 11, characterized in that: The working chips are arranged in two rows along the second direction.

14. The circuit board according to claim 11, characterized in that: The working chips are arranged in fifteen columns along the first direction and in two rows along the second direction.

15. The circuit board according to any one of claims 1 to 10, characterized in that: It also includes a copper foil layer and a water-cooling substrate, wherein the water-cooling substrate and the copper foil layer are hot-pressed connected via an insulating heat-conducting layer.

16. The circuit board according to claim 15, characterized in that: The working chip and the water-cooling substrate are respectively connected to the two side surfaces of the copper foil layer.

17. The circuit board according to claim 15, characterized in that: The water-cooling substrate comprises a metal base and a liquid cooling tube, and the liquid cooling tube is packaged in the metal base.

18. The circuit board according to claim 17, characterized in that: The metal substrate is an aluminum member, and the liquid cooling tube is a copper member.

19. The circuit board according to claim 17, characterized in that: The water-cooled substrate comprises a plurality of water-cooled board surfaces, the copper foil layers are arranged in a one-to-one correspondence with the water-cooled board surfaces, and each of the copper foil layers is hot-pressedly connected to the water-cooled board surfaces through the insulating heat-conducting layer.

20. The circuit board according to claim 19, characterized in that The outlet and the inlet of the liquid cooling pipe encapsulated in the metal matrix are led out from the side surface of the water-cooling base plate, wherein the side surface is different from the water-cooling plate surface.

21. A computing device, comprising a power supply unit, a control unit connected to the power supply unit, and a computing unit connected to the control unit and the power supply unit, wherein the computing unit is integrated on one or more computing boards, characterized in that: The computing board comprises the circuit board described in any one of claims 1 to 20.

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