80w vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system

Abstract

The 80w vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system comprises a charger main body, a semiconductor refrigeration module, a first thermistor installed on a PCBA board of the charger main body, a second thermistor installed on a coil of the charger main body, a first fan, an MCU control module, an AD acquisition module and a data storage module. Wherein the first thermistor and the second thermistor are electrically connected with the AD acquisition module; the AD acquisition module is used for preprocessing acquired data, converting an analog signal into a digital signal and sending the digital signal to the MCU control module; the MCU control module is electrically connected with the semiconductor refrigeration module and the first fan, the air speed of the first fan and the voltage of the semiconductor refrigeration module are intelligently controlled through the MCU control module, and generated cold air is blown into the charger body for rapid cooling; according to the system, cold air is blown to the charging equipment and the charger for cooling, so that the charging effect and the charging safety can be ensured, and the problem of high heat of a high-power (80w) charger is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicle chargers, and in particular to an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system. Background Art

[0002] At present, more and more cars on the market are equipped with on-board wireless chargers for charging mobile phones, tablets, etc. There is a serious problem with on-board chargers, that is, serious heat generation during charging. Although the design charging power of mainstream products can reach 15W, the mobile phone and charger will generate serious heat during charging. The rising temperature will cause the charging power to decrease, especially for high-power wireless chargers such as 50W and 80W. The high heat problem is serious. Since 80W wireless charging will have higher and stricter requirements on the internal heat dissipation of the charging module and the heat dissipation of the mobile phone; therefore, it is necessary to provide an 80W on-board mobile phone wireless charging cooling and heat dissipation system. Summary of the invention

[0003] In view of the above technical problems and defects, the purpose of the present invention is to provide an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system, which adds a semiconductor refrigeration module to the wireless charger, and sets NTC thermistors on the coil and the main board. The MUC control module controls the operation of the semiconductor refrigeration module and the fan according to the collected data, thereby blowing cold air to the charging device and charger to cool them down, ensuring the charging effect and charging safety, and avoiding the high heat problem of high-power chargers.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is:

[0005] An 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system, comprising a charger body, a semiconductor refrigeration module installed on the charger body, a first thermistor installed on the charger body PCBA board, a second thermistor installed on the charger body coil, a first fan for blowing air to the charging device and the inside of the charger, an MCU control module, an AD acquisition module, and a data storage module;

[0006] Wherein, the first thermistor and the second thermistor are electrically connected to the AD acquisition module, and the monitored data are sent to the AD acquisition module in real time;

[0007] The AD acquisition module is used to pre-process the collected data, convert the analog signal into a digital signal and send it to the MCU control module;

[0008] The MCU control module is connected to the vehicle communication network through the CAN communication serial communication protocol to exchange data, periodically report system status information, and obtain vehicle information in real time; the MCU control module is electrically connected to the semiconductor refrigeration module and the first fan, and the wind speed of the first fan and the voltage of the semiconductor refrigeration module are intelligently controlled by the MCU control module, and the generated cold air is blown into the charger body for rapid cooling;

[0009] The data storage module is used to store data.

[0010] As a preferred embodiment of the present invention, both the first thermistor and the second thermistor are negative temperature coefficient thermistors; and the data storage module is a non-volatile memory.

[0011] As a preferred embodiment of the present invention, the refrigeration and heat dissipation system is provided with several time slice tasks of 1ms, 5ms, 20ms, 100ms and 500ms, and the above time slice tasks are executed in a polling manner; wherein, the 1ms time slice task is used to process the received active refrigeration and heat dissipation command, and to query whether there is a new active refrigeration and heat dissipation command every 1ms; the 5ms time slice task is used for AD acquisition, and a conversion is started when Tick5ms==4; the AD result is read when Tick5ms==5; the 20ms time slice task is used for fault diagnosis; the 100ms time slice task adopts a segmentation method, and different functions are respectively executed when Tick100ms==97, 98 and 99, first judging whether Tick100ms==97? If so, the first fan is processed; judging whether Tick100ms==98? If so, the left semiconductor refrigeration module is processed; judging whether Tick100ms==99? If so, the right semiconductor refrigeration module is processed; judging whether Tick100ms==100? If yes, a CAN message is sent; the 500ms time slice task is used to time the cooling and heat dissipation start time.

[0012] As a preferred embodiment of the present invention, the shielding slat of the charger body is installed on the rear shell, and a first air outlet is provided on the shielding slat, through which air is blown directly to the charging device for cooling; a first fan is provided on the side of the rear shell away from the shielding slat, an inner heat sink is installed at a position close to the first fan air outlet, an inner air inlet is opened at a position close to the inner heat sink, and a second air outlet is provided at an end away from the inner air inlet, and the air entering the rear shell is discharged through the second air outlet; a fan casing is also installed on the rear shell, and the fan casing encloses the first fan, the inner heat sink and the inner air inlet cover, and the fan The shell is provided with a fan air inlet notch at a position opposite to the first fan, and an avoidance notch at a position opposite to the inner heat sink, and a heat insulation plate is provided on the top surface of the fan shell at a position opposite to the avoidance notch; a mounting groove is processed on the heat insulation plate, and a semiconductor refrigeration module is arranged in the mounting groove; the cold surface of the semiconductor refrigeration module contacts the inner heat sink, and the hot surface of the semiconductor refrigeration module contacts the outer heat sink; the outer heat sink is fixed on the heat insulation plate and the fan shell, and a second fan is installed on one side of the outer heat sink; the second fan is used to blow air to the outer heat sink to cool the semiconductor refrigeration module.

[0013] As a preferred embodiment of the present invention, the charger body includes a shielding film, a coil, a coil bracket, a cooling plate, a thermally conductive adhesive, a PCBA board, and a back shell; wherein the coil is pasted on the coil bracket; the cooling plate is arranged between the coil bracket and the thermally conductive adhesive; the thermally conductive adhesive is arranged between the cooling plate and the PCBA board; the PCBA board is fixed on the back shell; the cooling plate is composed of a main board and a plurality of cooling fins arranged at intervals on the main board; the coil bracket is provided with an air outlet channel near the air inlet in the back shell, and the cold air entering the air inlet in the back shell is diverted into two cold air streams under the action of the cooling plate and the coil bracket, one of which passes through the channel between the cooling fins to cool the cooling plate and is discharged from the second air outlet, and the PCBA board and the coil are cooled by the cooling plate, and the other cold air passes through the air outlet channel of the coil bracket and is discharged from the first air outlet, which is used to cool the charging device.

[0014] As a preferred embodiment of the present invention, the charger body further includes an NFC antenna, and the NFC antenna is integrated on the shielding film.

[0015] As a preferred embodiment of the present invention, the shielding fin is fixed to the rear shell by screws; the first fan is fixed to the rear shell by screws; the inner heat sink, the heat insulation plate and the fan casing are connected and fixed by screws; the fan casing and the rear shell are fixedly connected by screws; the outer heat sink is fixed to the fan casing by screws, and the second fan is fixed to the outer heat sink by screws.

[0016] As a preferred embodiment of the present invention, the first air outlet, the inner air inlet of the rear shell and the air outlet channel of the coil bracket are arranged on the same side and opposite to each other, and the width of the inner air inlet is greater than the width of the air outlet channel.

[0017] Compared with the prior art, the advantages and beneficial effects of the present invention are:

[0018] (1) The refrigeration module (semiconductor refrigeration module) in the refrigeration and heat dissipation system provided by the present invention is controlled by the main control MCU to enable the TED module to work for refrigeration, and then the cold air is blown into the heat dissipation structure through the fan. The cold air will be divided into two airflows. One stream of cold air is used to blow to the back of the mobile phone to dissipate the heat of the mobile phone to achieve the best charging efficiency, and the other stream of cold air is blown into the inside of the wireless charger to quickly cool the coil and PCBA, which plays a good protective role.

[0019] (2) The refrigeration and heat dissipation system provided by the present invention adds a second fan on the rear shell, and uses the second fan to lower the semiconductor refrigeration module, thereby reducing the internal and external temperatures of the wireless charger, effectively improving the heating and heat dissipation problems of the charger, and increasing the charging power of the vehicle-mounted wireless charger, thereby avoiding the problem that the charging power of the vehicle-mounted wireless charger is too low in summer and is far from reaching the designed charging power.

[0020] (3) The charger provided by the present invention performs over-temperature protection by judging the temperature of the heating coil and the PCBA when cooling the internal heat dissipation components and the charging device. The semiconductor refrigeration module is provided so that the air blown out by the charger is cold air. The cold air can quickly cool down the phone, allowing the phone to continue charging, ensuring charging efficiency and preventing damage to the phone, and completely solving the high heat problem existing in high-power (80W) chargers.

[0021] (4) The cooling plate inside the charger of the present invention is composed of a main board and a plurality of cooling fins spaced apart on the main board. The air coming in from the air inlet of the rear shell passes through the channel between the two cooling fins and is discharged from the second air outlet. The coil that generates heat during the operation of the charger is directly in contact with the cooling plate, and the PCBA board is in contact with the cooling plate through thermal conductive adhesive. This structural design can quickly cool down the components inside the charger, and the cooling effect is significant.

[0022] (5) The charger provided by the present invention has a simple overall structure and a compact layout, which improves the performance of the wireless charger and is conducive to ensuring and extending the service life of the wireless charger. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0024] Figure 1It is a structural block diagram of the vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system of the present invention;

[0025] Figure 2 is a schematic diagram of the time slice polling mechanism of the present invention;

[0026] Figure 3 This is a 1ms time slice task flow chart of the present invention;

[0027] Figure 4 This is a 5ms time slice task flow chart of the present invention;

[0028] Figure 5 This is the task flow chart of 100ms time slice of the present invention;

[0029] Figure 6 The overall structure of the charger body of the present invention is shown in FIG. Figure 1 ;

[0030] Figure 7 The overall structure of the charger body of the present invention is shown in FIG. Figure 2 ;

[0031] Figure 8 This is a schematic diagram of the partial structure of the charger body of the present invention. Figure 1 ;

[0032] Fig. 9 This is a schematic diagram of the partial structure of the charger body of the present invention. Figure 2 ;

[0033] Fig.10 is an exploded schematic diagram of the charger body of the present invention;

[0034] Fig.11 It is the plane of the charger body of the present invention Figure 1 ;

[0035] Fig.12 It is the plane of the charger body of the present invention Figure 2 ;

[0036] Fig.13 yes Fig.11 Cross-section of the middle AA;

[0037] Fig.14 yes Fig.12 Cross-section of the middle BB;

[0038] Fig.15 yes Fig.12 Cross-section of the middle CC;

[0039] Fig.16 yes Fig.12 Cross-section of the middle DD;

[0040] Fig.17 yes Fig.10 Enlarged view of the cooling plate and coil support;

[0041] Fig.18 is a schematic diagram of the NFC antenna.

[0042] The reference numerals therein include: charger body 1, NFC antenna 2, first fan 3, inner heat sink 4, fan housing 5, heat insulation board 6, semiconductor refrigeration module 7, outer heat sink 8, second fan 9, shielding slit 11, rear shell 12, coil 13, coil bracket 14, cooling plate 15, thermal conductive adhesive 16, PCBA board 17, first air outlet 111, inner air inlet 121, second air outlet 122, fan air inlet notch 501, mounting slot 601, air outlet channel 141, mainboard 151, cooling fin 152. DETAILED DESCRIPTION

[0043] The following will clearly and completely describe the technical solutions of various embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. It should be pointed out that all the drawings are exemplary representations. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The present invention is further described in detail below through specific implementation examples and in conjunction with the drawings.

[0046] like Figure 1As shown, the present embodiment provides an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system, including a charger body 1, a semiconductor refrigeration module (also called a TED module) installed on the charger body, a first thermistor installed on the charger body PCBA board, a second thermistor installed on the charger body coil, a first fan for blowing air to the charging device and the charger, an MCU control module, an AD acquisition module, and a data storage module;

[0047] Wherein, the first thermistor and the second thermistor are electrically connected to the AD acquisition module, and the monitored data are sent to the AD acquisition module in real time; specifically, the first thermistor and the second thermistor are both negative temperature coefficient thermistors (NTC);

[0048] The AD acquisition module is used to pre-process the collected data (filtering and operational amplification, etc.), convert the analog signal into a digital signal and send it to the MCU control module;

[0049] The MCU control module is connected to the vehicle communication network through the CAN communication serial communication protocol to exchange data, periodically report system status information, and obtain vehicle information in real time; specifically, the information can be transmitted to the instrument through the CAN line for real-time information viewing; the MCU control module adopts the Xinwang micro single-chip microcomputer, the MCU control module is electrically connected to the semiconductor refrigeration module and the first fan, and the wind speed of the first fan and the voltage of the semiconductor refrigeration module are intelligently controlled by the MCU control module, and the generated cold air is blown into the charger body for rapid cooling;

[0050] The data storage module is used to store data, including key parameters such as vehicle configuration; specifically, the data storage module is a non-volatile memory (NVM), and the use of a non-volatile memory can prevent the loss of information when the vehicle is powered off.

[0051] Further, if Figures 6 to 18As shown, in this embodiment, the shielding slit 11 of the charger body 1 is installed on the rear shell 12, and a first air outlet 111 is provided on the shielding slit 11, and air is blown directly to the charging device for cooling through the first air outlet 111; a first fan 3 is provided on the side of the rear shell 12 away from the shielding slit 11, an inner heat sink 4 is installed at a position close to the first fan air outlet, an inner air inlet 121 is opened at a position close to the inner heat sink 4, and a second air outlet 122 is provided at one end away from the inner air inlet 121, and the air entering the rear shell 12 is discharged through the second air outlet 122; a fan housing 5 is also installed on the rear shell 12, and the fan housing 5 covers the first fan 3, the inner heat sink 4 and the inner air inlet 121 Inside, the fan housing 5 is provided with a fan air inlet notch 501 at a position opposite to the first fan 3, and an avoidance notch (not shown) at a position opposite to the inner heat sink 4. The top surface of the fan housing 5 is provided with a heat insulation plate 6 at a position opposite to the avoidance notch. The heat insulation plate 6 is processed with a mounting groove 601, and a semiconductor refrigeration module 7 is arranged in the mounting groove 601. The cold surface of the semiconductor refrigeration module 7 contacts the inner heat sink 4, and the hot surface of the semiconductor refrigeration module 7 contacts the outer heat sink 8. The outer heat sink 8 is fixed on the heat insulation plate 6 and the fan housing 5. A second fan 9 is installed on one side of the outer heat sink 8. The second fan 9 is used to blow air to the outer heat sink 8 to cool the semiconductor refrigeration module 7.

[0052] Further, continue as Figures 6 to 18 As shown, in this embodiment, the charger body includes a shielding slit 11, a coil 13, a coil bracket 14, a cooling plate 15, a thermally conductive adhesive 16, a PCBA board 17, and a rear shell 12; wherein the coil 13 is attached to the coil bracket 14, and the coil 13 is used to charge the charging device, and the charging device includes a mobile phone and a tablet; the cooling plate 15 is arranged between the coil bracket 14 and the thermally conductive adhesive 16; the thermally conductive adhesive 16 is arranged between the cooling plate 15 and the PCBA board 17; the PCBA board 17 is fixed on the rear shell 12; the cooling plate 15 is composed of a main board 151 and a spacer arranged on the The mainboard is composed of multiple cooling fins 152; the coil bracket 14 is provided with an air outlet channel 141 near the air inlet 121 in the rear shell; the cold air coming in from the air inlet 121 in the rear shell is diverted into two cold air streams under the action of the cooling plate 15 and the coil bracket 14, one of which passes through the channel between the cooling fins 15 and the cooling fins 15 to cool the cooling plate and then is discharged from the second air outlet 122, and the PCBA board 17 and the coil 13 are cooled by the cooling plate 15, and the other cold air passes through the air outlet channel 141 of the coil bracket 14 and is discharged from the first air outlet 111 to cool the charging device.

[0053] Furthermore, in this embodiment, the charger body also includes an NFC antenna 2, which is integrated on the shielding slit 11. The function of the NFC antenna 2 is to control electromagnetic interference and communication transmission.

[0054] Further, if Figures 6 to 10 As shown, in this embodiment, the shielding slat 11 is fixed to the rear shell 12 by screws, and the NFC antenna 2, the coil 13, the coil bracket 14, the cooling plate 15, the thermal conductive adhesive 16, and the PCBA board 17 are arranged between the shielding slat 11 and the rear shell 12; the first fan 3 is fixed to the rear shell 12 by screws; the inner heat sink 4, the heat insulation plate 6 and the fan housing 5 are connected and fixed by screws; the fan housing 5 is fixedly connected to the rear shell 12 by screws; the outer heat sink 8 is fixed to the fan housing 5 by screws, and the second fan 9 is fixed to the outer heat sink 8 by screws.

[0055] Further, if Figures 13 to 16 As shown, in this embodiment, the first air outlet 111 , the inner air inlet 121 of the rear shell and the air outlet channel 141 of the coil bracket are arranged on the same side and opposite to each other, and the width of the inner air inlet 121 is greater than the width of the air outlet channel 141 .

[0056] Furthermore, in this embodiment, there are two semiconductor refrigeration modules, one is a left semiconductor refrigeration module, and the other is a right semiconductor refrigeration module.

[0057] like Figures 2 to 5 As shown, in this embodiment, the cooling and heat dissipation system adopts a time slice polling architecture, and reasonably allocates tasks to each time slice task according to the time characteristics of the function. Specifically, the cooling and heat dissipation system is designed with several time slice tasks of 1ms, 5ms, 20ms, 100ms, and 500ms. After initialization, the above time slice tasks are executed in a polling manner; the five time slice variables are: Tick1ms, Tick5ms, Tick20ms, Tick100ms, and Tick500ms;

[0058] Among them, the 1ms time slice task is used to process the received active cooling and heat dissipation command, and check every 1ms whether there is a new active cooling and heat dissipation command; specifically, first determine whether Tick1ms==1? If so, set Tick1ms==0, receive new CAN messages (Receive new can msg), if there are new CAN messages, process the received CAN messages (Handlecanmsg), if there are no new CAN messages, continue to determine whether Tick1ms==1?, and repeat the execution;

[0059] The 5ms time slice task is used for AD acquisition. When Tick5ms==4, a conversion is started; when Tick5ms==5, the AD result is read, so there is no waiting time for conversion. Specifically, first determine whether Tick5ms==4? If so, start a conversion to convert the analog signal into a digital signal; if not, continue to determine whether Tick5ms==5? If so, set Tick5ms==0, get the AD value (Get AD value), and repeat the execution;

[0060] The 20ms time slice task is used for fault diagnosis, and existing methods can be used or referred to to detect whether there is a fault in the system;

[0061] The 100ms time slice task adopts the method of segmentation. Different functions are executed when Tick100ms==97,98,99 respectively. This is mainly because the PID algorithm for cooling and heat dissipation takes a long time to execute. When the clock is 32M, the algorithm takes about 200 microseconds. Specifically, first determine whether Tick100ms==97? If so, process the first fan; determine whether Tick100ms==98? If so, process the left semiconductor refrigeration module; determine whether Tick100ms==99? If so, process the right semiconductor refrigeration module; determine whether Tick100ms==100? If so, send a CAN message;

[0062] The 500ms time slice task is used for longer time timing, such as the duration of cooling and heat dissipation.

[0063] In this embodiment, the cooling and heat dissipation function adopts the PID algorithm commonly used in automatic control; specifically, according to the actual situation, the current cooling and heat dissipation duty cycle is used as input, the NTC is used as output feedback, and the deviation between the NTC and the target temperature is calculated through PID calculation to calculate the subsequent cooling and heat dissipation duty cycle; in this embodiment, by adjusting the PID parameters, the temperature control effect can basically make the NTC reach the target temperature within 2 oscillation cycles, the time is about 1 minute, and the overshoot is about 1°C.

[0064] In order to make the control more intuitive, this embodiment adopts the method of converting the collected NTC AD value into the corresponding temperature value for control; specifically, a 10k voltage divider resistor is selected and the constant array is defined as follows:

[0065] const s16 NTC_TEMPERTURE

[81] =

[0066] {900,850,800,750,700,650,600,550,500,

[0067] 490,480,470,460,450,440,430,420,410,400,

[0068] 390,380,370,360,350,340,330,320,310,300,

[0069] 290,280,270,260,250,240,230,220,210,200,

[0070] 190,180,170,160,150,140,130,120,110,100,

[0071] 90,80,70,60,50,40,30,20,10,0,

[0072] -10,-20,-30,-40,-50,-60,-70,-80,-90,-100,

[0073] -110,-120,-130,-140,-150,-160,-170,-180,-190,-200,

[0074] -250,-300};

[0075] The corresponding AD array above is

[0076] const u16 NTC_AD

[81] =

[0077] {113,130,150,172,198,227,259,296,337,

[0078] 346,357,364,373,382,391,401,411,421,431,

[0079] 441,451,461,472,482,493,503,514,525,536,

[0080] 547,558,569,580,591,602,613,623,634,645,

[0081] 656,667,677,688,698,708,719,729,738,748,

[0082] 758,767,776,785,794,803,812,820,828,836,

[0083] 844,851,858,866,872,879,885,892,898,904,

[0084] 909,915,920,925,930,934,939,943,947,951,

[0085] 969,982};

[0086] Through such table lookup calculation, within the temperature range of 0℃ to 60℃, the temperature table lookup accuracy is basically 0.1℃, which fully meets the control requirements.

[0087] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system, characterized in that: It includes a charger body, a semiconductor refrigeration module installed on the charger body, a first thermistor installed on the PCBA board of the charger body, a second thermistor installed on the coil of the charger body, a first fan for blowing air to the charging device and the inside of the charger, an MCU control module, an AD acquisition module, and a data storage module; Wherein, the first thermistor and the second thermistor are electrically connected to the AD acquisition module, and the monitored data are sent to the AD acquisition module in real time; The AD acquisition module is used to pre-process the collected data, convert the analog signal into a digital signal and send it to the MCU control module; The MCU control module is connected to the vehicle communication network through the CAN communication serial communication protocol to exchange data, periodically report system status information, and obtain vehicle information in real time; the MCU control module is electrically connected to the semiconductor refrigeration module and the first fan, and the wind speed of the first fan and the voltage of the semiconductor refrigeration module are intelligently controlled by the MCU control module, and the generated cold air is blown into the charger body for rapid cooling; The data storage module is used to store data.

2. According to claim 1, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The first thermistor and the second thermistor are both negative temperature coefficient thermistors; and the data storage module is a non-volatile memory.

3. According to claim 1, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The cooling and heat dissipation system is provided with several time slice tasks of 1ms, 5ms, 20ms, 100ms and 500ms, and the above time slice tasks are executed in a polling manner; wherein, the 1ms time slice task is used to process the received active cooling and heat dissipation command, and to query whether there is a new active cooling and heat dissipation command every 1ms; the 5ms time slice task is used for AD acquisition, and a conversion is started when Tick5ms==4; the AD result is read when Tick5ms==5; the 20ms time slice task is used for fault diagnosis; the 100ms time slice task adopts a segmentation method, and different functions are respectively executed when Tick100ms==97, 98 and 99, firstly judging whether Tick100ms==97? If so, the first fan is processed; judging whether Tick100ms==98? If so, the left semiconductor refrigeration module is processed; judging whether Tick100ms==99? If so, the right semiconductor refrigeration module is processed; judging whether Tick100ms==100? If yes, a CAN message is sent; the 500ms time slice task is used to time the cooling and heat dissipation start time.

4. According to claim 1, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The shielding slat of the charger body is installed on the rear shell, and a first air outlet is provided on the shielding slat, through which air is blown directly to the charging device for cooling; a first fan is provided on the side of the rear shell away from the shielding slat, an inner heat sink is installed near the first fan air outlet, an inner air inlet is opened near the inner heat sink, and a second air outlet is provided at the end away from the inner air inlet, through which air entering the rear shell is discharged; a fan housing is also installed on the rear shell, and the fan housing contains the first fan, the inner heat sink and the inner air inlet cover, and the fan housing is in contact with the A fan air inlet notch is provided at a position opposite to the first fan, an avoidance notch is provided at a position opposite to the inner heat sink, and a heat insulation plate is provided on the top surface of the fan housing at a position opposite to the avoidance notch; a mounting groove is processed on the heat insulation plate, and a semiconductor refrigeration module is provided in the mounting groove; the cold surface of the semiconductor refrigeration module contacts the inner heat sink, and the hot surface of the semiconductor refrigeration module contacts the outer heat sink; the outer heat sink is fixed on the heat insulation plate and the fan housing, and a second fan is installed on one side of the outer heat sink; the second fan is used to blow air to the outer heat sink to cool the semiconductor refrigeration module.

5. According to claim 4, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The charger body includes a shielding layer, a coil, a coil bracket, a cooling plate, a thermally conductive adhesive, a PCBA board, and a back shell; wherein the coil is pasted on the coil bracket; the cooling plate is arranged between the coil bracket and the thermally conductive adhesive; the thermally conductive adhesive is arranged between the cooling plate and the PCBA board; the PCBA board is fixed on the back shell; the cooling plate is composed of a main board and a plurality of cooling fins arranged on the main board at intervals; the coil bracket is provided with an air outlet channel near the air inlet in the back shell, and the cold air entering the air inlet in the back shell is diverted into two cold air streams under the action of the cooling plate and the coil bracket, one of which passes through the channel between the cooling fins to cool the cooling plate and is discharged from the second air outlet, and the PCBA board and the coil are cooled by the cooling plate, and the other cold air passes through the air outlet channel of the coil bracket and is discharged from the first air outlet, which is used to cool the charging device.

6. According to claim 4, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The charger body further includes an NFC antenna, which is integrated on the shielding layer.

7. According to claim 4, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The shielding fan is fixed to the rear shell by screws; the first fan is fixed to the rear shell by screws; the inner heat sink, the heat insulation plate and the fan casing are connected and fixed by screws; the fan casing and the rear shell are fixedly connected by screws; the outer heat sink is fixed to the fan casing by screws, and the second fan is fixed to the outer heat sink by screws.

8. According to claim 4, an 80W vehicle-mounted mobile phone wireless charging refrigeration and heat dissipation system is characterized in that: The first air outlet, the inner air inlet of the rear shell and the air outlet channel of the coil support are arranged on the same side and opposite to each other, and the width of the inner air inlet is greater than the width of the air outlet channel.

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