Water-cooling chip removal device and chip removal method for machine tool machining

Abstract

The invention discloses a water-cooling chip removal device and method for machine tool machining, and relates to the technical field of machine tools. The chip removal device comprises a chip removal bottom box arranged on the lower portion of a machine tool body, and further comprises a chip collection unit and a chip removal unit, the chip removal unit comprises a vibration screening assembly, a chip guide assembly and a liquid removal assembly; the vibration screening assembly is used for screening the waste chips collected by the collecting assembly according to the volume; the scrap guiding assembly is used for conducting the screened scraps into the liquid removing assembly, and waste liquid in the scraps is removed through the liquid removing assembly. The chip removal device has the advantages that by adopting a collection mode of matching gravity collection and adsorption collection, chips in a machine tool can be thoroughly collected, waste is avoided, meanwhile, by adopting a chip removal mode of matching vibration screening, rotary centrifugation and air blowing, grading treatment of the chips can be achieved according to the size, and the chip removal efficiency is improved. Meanwhile, waste liquid adhered to the scraps can be removed, and the treatment effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of machine tools, and in particular to a water-cooled chip removal device and a chip removal method for machine tool processing. Background Art

[0002] A machine tool refers to a device that uses tools such as drills, reamers, reamers, taps, and dies to perform turning processing on rotating workpieces. Machine tools will produce a lot of waste chips and water-cooling waste liquid during processing. Therefore, a chip removal device is usually installed on the machine tool to remove the waste chips and waste liquid, so as to avoid the accumulation of waste chips affecting the processing efficiency of the machine tool.

[0003] Existing chip removal devices use a variety of methods to remove machine tool waste chips, such as a chip removal machine for machine tools with publication number CN202121239003.2, which includes a machine tool body, a chip cleaning device is fixedly connected to one side of the machine tool body, a chip removal machine is fixedly connected to the bottom of the machine tool body, a chip removal bucket is connected to the left side of the top surface of the chip removal machine, a flushing device is fixedly connected to the top surface of the chip removal machine, and a filter plate is provided on the inner side of the chip removal machine; The existing machine tool chip removal device uses an automatic collection method to collect the waste chips in the machine tool during chip removal. However, during actual processing, a large amount of waste chips will be splashed and adhered to the inside of the machine tool. This part of the waste chips cannot be collected smoothly, and the waste chips are not collected thoroughly enough. For example, the above-mentioned referenced prior art only uses a chip removal bucket for collection, but cannot collect the waste chips adhered to the inside of the machine tool, so that the waste chips are not handled thoroughly enough. In addition, the existing machine tool uses a water-cooled liquid spraying cutter to cool down during processing, so a large amount of water-cooled waste liquid is generated during processing, and the device cannot separate the waste liquid from the waste chips during chip removal, and a large amount of waste liquid will adhere to the cleaned waste chips and cannot be handled; Therefore, it is urgent to design a water-cooled chip removal device and chip removal method for machine tool processing to solve the above problems. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a water-cooled chip removal device and a chip removal method for machine tool processing, which solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A water-cooled chip removal device for machine tool processing, comprising a chip removal bottom box arranged at the lower part of the machine tool body for processing machine tool waste chips, and also comprising: The chip collecting unit is arranged between the chip removal bottom box and the machine tool body, and is used to collect and process the processing waste chips in the machine tool body, and includes a collecting component and an adsorption component, wherein the adsorption component is used to adsorb and collect the debris adhered to the machine tool body; The chip removal unit is arranged in the chip removal bottom box and is used for screening and removing the waste chips collected by the chip collection unit, including a vibration screening component, a chip guiding component and a liquid removal component; The vibrating screening component is used to screen the waste collected by the collecting component according to volume; The chip guide component is used to conduct the screened waste chips to the liquid removal component, and the waste liquid in the waste chips is removed through the liquid removal component.

[0006] Preferably, a control console is provided on the machine tool body, and the control console cooperates with the chip collection unit and the chip removal unit to control the opening and closing and operating status of the chip collection unit and the chip removal unit to realize automatic chip removal of the machine tool waste chips.

[0007] Preferably, the collecting component includes a collecting bucket fixedly installed in the machine tool body for collecting waste chips, and the lower part of the collecting bucket is connected to the chip removal bottom box through a chip dropping square tube. The collecting component is used to transfer the debris generated during the processing of the machine tool body to the chip removal bottom box through the collecting bucket and the chip dropping square tube.

[0008] Preferably, the vibrating screening assembly includes partition plate one and partition plate two fixedly installed in a chip removal bottom box, a servo motor is fixedly installed in the chip removal bottom box, and a driving roller is rotatably installed between the driving end of the servo motor and partition plate one, and a screening inclined plate is installed between the driving roller and partition plate one through a vibration mechanism.

[0009] Preferably, the vibration mechanism comprises two vibration springs fixedly mounted on the second partition plate, and the left side of the screening inclined plate is fixedly mounted on the two vibration springs, and the right side of the vibration spring is slidably mounted in the first partition plate, a vibration cam is fixedly mounted on the driving roller, a linkage rod is slidably mounted between the screening inclined plate and the first partition plate, and a driven triangular block matching the vibration cam is fixedly mounted on the lower part of the linkage rod; A middle inclined plate matched with the chip falling square tube is fixedly installed on the screening inclined plate, and a plurality of lower liquid holes for draining sewage are opened on the middle inclined plate. A chip removal box matched with the screening inclined plate is arranged between the second partition plate and the chip removal bottom box.

[0010] Preferably, the adsorption assembly includes an induced draft box fixedly mounted on a partition plate, and a driving roller passes through the induced draft box and is rotatably connected to the induced draft box, a wind impeller is fixedly mounted inside the driving roller, and the wind impeller is located inside the induced draft box, two adsorption boxes are provided on the collecting bucket, and an adsorption tube for adsorbing waste debris is fixedly connected between the two adsorption boxes and the induced draft box.

[0011] Preferably, a separation cylinder is installed on the driving roller through an air blowing mechanism, the liquid removal assembly includes a plurality of liquid throwing holes opened on the separation cylinder, and an electric opening and closing door for chip removal is arranged at the lower part of the separation cylinder, a bearing inclined plate is fixedly installed at the lower part of the chip removal bottom box, and a chip guide groove cooperating with the electric opening and closing door is opened on the bearing inclined plate, and a chip removal box 2 for chip removal is fixedly installed between the chip guide groove and the chip removal bottom box; Two square pipes for guiding water are fixedly installed on the side of the load-bearing inclined plate, and a plurality of drainage pipes for draining water are fixedly installed on the chip removal bottom box.

[0012] Preferably, the blowing mechanism includes an air guide plate fixedly mounted on a driving roller, the air guide plate is rotatably mounted with an air induced positioning ring, a plurality of air inlet pipes for air intake are fixedly connected between the air induced positioning ring and the air induced box, and a plurality of blowing pipes are fixedly connected between the air guide plate and the separation cylinder.

[0013] Preferably, the chip guide assembly comprises a chip screening net fixedly mounted on the screening inclined plate, a feed pipe is fixedly arranged on the second partition plate via a connecting rod, and the feed pipe is rotatably mounted on the separation cylinder, and a collecting hopper for collecting waste chips passing through the chip screening net is fixedly connected to the feed pipe; An electric telescopic rod is fixedly installed on the second partition plate, and a material pushing arc plate is fixedly installed on the driving end of the electric telescopic rod, and the material pushing arc plate is located in the feed pipe.

[0014] A water-cooled chip removal method for machine tool processing, used for the above-mentioned water-cooled chip removal device for machine tool processing, comprises the following steps: S1. The waste chips generated during the machining of the machine tool body will fall into the chip collection unit, and the waste chips will be collected into the chip removal unit through the collection component; S2, screening the waste according to the volume through the vibrating screening component, and discharging the large volume of waste; S3, conducting the small volume of waste chips to the liquid removal component through the chip guide component, and draining the small volume of waste chips through the liquid removal component; S4. The waste chips adhering to the machine tool body are adsorbed into the liquid removal component through the adsorption component, which promotes chip removal and improves the liquid removal efficiency.

[0015] The present invention provides a water-cooled chip removal device and a chip removal method for machine tool processing, which have the following beneficial effects: 1. When cleaning waste chips, the chip removal device of the present invention adopts a chip removal method in which a collection component and an adsorption component are coordinated, which can realize automatic collection of waste chips under the action of gravity, and can also remove waste chips adhered to the inside of the machine tool by adsorption. The effect of waste chip removal is better and no chips are missed.

[0016] 2. When the chip removal device of the present invention is cleaning the waste chips, the collected waste chips can be screened according to the volume size through the vibration and screening action of the vibrating screening component, and the large volume of waste residues can be directly discharged, and the small volume of waste chips can be conducted to the waste liquid component for secondary treatment. At the same time, the waste liquid is treated, and the screening treatment effect is better.

[0017] 3. When the chip removal device of the present invention is cleaning the waste chips, the servo motor drives the separation cylinder to rotate, so that the waste liquid in the small volume of waste chips can be thrown out at high speed, and air blowing and dehumidification are performed while the liquid is thrown out, which can further improve the liquid discharge effect, effectively prevent the waste liquid from sticking to the waste chips, and improve the dehumidification effect of the waste liquid.

[0018] 4. When cleaning waste chips, the chip removal device of the present invention can separate large-volume waste blocks, small-volume waste chips and waste liquid, and can automatically grade the waste chips while removing the chips, which can effectively improve the waste chip processing efficiency and provide convenience for the subsequent recycling of waste chips.

[0019] To sum up, the present invention can achieve the thorough collection of waste chips in the machine tool without waste by adopting a collection method that combines gravity collection with adsorption collection. At the same time, it adopts a chip removal method that combines vibration screening with rotary centrifugation and air blowing to achieve graded treatment of waste chips according to their volume. At the same time, the waste liquid adhering to the waste chips can be removed, and the treatment effect is better.

[0020] Other features and advantages of the present invention will be described in the following description, and part of them will become obvious from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic structural diagram of a water-cooled chip removal device for machine tool processing proposed by the present invention; Figure 2 for Figure 1 Schematic diagram of the structure after rotating a certain angle; Figure 3 for Figure 1 Structural diagram of the middle chip removal bottom box and collection bucket; Figure 4 for Figure 3 Schematic diagram of the internal structure of the middle chip removal bottom box; Figure 5 for Figure 4 A front view of Figure 6 for Figure 3Schematic diagram of the structure after removing the chip removal bottom box; Figure 7 for Figure 6 Schematic diagram of the structure after removing the collection bucket; Figure 8 It is a structural schematic diagram of the vibrating screening assembly in the present invention; Fig. 9 for Figure 8 Schematic diagram of the structure of the A part; Fig.10 It is a schematic structural diagram of the chip removal unit in the present invention; Fig.11 for Fig.10 Schematic diagram of the structure of the servo motor and the induced draft box; Fig.12 for Fig.11 Schematic diagram of the internal structure of the center induced air box; Fig.13 for Fig.12 Schematic diagram of structural decomposition; Fig.14 for Fig.10 Schematic diagram of the structure of the servo motor and the separation cylinder; Fig.15 for Fig.14 Schematic diagram of the structure of the middle feed pipe and the separation cylinder; Fig.16 for Fig.15 Schematic diagram of the internal structure of the feed pipe and separation cylinder.

[0022] In the figure: 1 chip removal bottom box, 2 machine tool body, 3 control console, 4 chip removal box 1, 5 chip removal box 2, 6 collecting bucket, 7 adsorption box, 8 drainage pipe, 9 adsorption pipe, 10 chip falling square pipe, 11 partition plate 1, 12 servo motor, 13 load-bearing inclined plate, 14 liquid guiding square pipe, 15 partition plate 2, 16 separation cylinder, 17 screening inclined plate, 18 middle inclined plate, 19 chip falling screening net, 20 lower liquid hole, 21 vibration spring, 22 driving roller, 23 vibration cam, 24 driven triangle block, 25 linkage rod, 26 feeding pipe, 27 collecting hopper, 28 induced draft box, 29 air guide plate, 30 electric telescopic rod, 31 wind impeller, 32 air inlet pipe, 33 air blowing pipe, 34 induced draft positioning ring, 35 liquid throwing hole, 36 electric opening and closing door, 37 push arc plate. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0024] Example 1: Reference Figure 1-Figure 3A water-cooled chip removal device for machine tool processing includes a chip removal bottom box 1 arranged at the lower part of a machine tool body 2 for processing machine tool waste chips. The chip removal bottom box 1 is connected to the machine tool body 2 by a snap-fit ​​connection and can be quickly disassembled, so that the chip removal process of the machine tool body 2 at different positions can be carried out conveniently, and the chip removal device in the chip removal bottom box 1 can also be cleaned; When the machine tool body 2 is processed, impurities such as large impurity waste blocks, small waste chips and waste liquid will be mainly generated. The chip removal device is designed to collect and screen the waste chips, realize the overall collection and independent screening of large impurity waste blocks, small waste chips and waste liquid, and realize the separate treatment of waste chips of different volumes.

[0025] The chip removal device also includes: The chip collection unit is arranged between the chip removal bottom box 1 and the machine tool body 2, and is used for collecting and processing the processing waste chips in the machine tool body 2. By adopting a collection method that combines natural gravity collection with adsorption collection, the waste chips adhered to the inside of the machine tool body 2 can be more thoroughly adsorbed and processed, thereby avoiding the occurrence of incomplete waste chip processing and improving the effect of collecting waste chips.

[0026] The chip removal unit is arranged in the chip removal bottom box 1, and is used for screening and removing the waste chips collected by the chip collection unit. It can effectively screen the waste chips according to the size of the waste chips, complete the independent treatment of large-volume waste blocks and small-volume waste chips, and remove the waste liquid adhering to the waste chips during the treatment, so as to avoid the waste liquid adhering to the waste chips and affecting the collection of the waste chips.

[0027] A control console 3 is provided on the machine tool body 2, and the control console 3 cooperates with the chip collection unit and the chip removal unit to control the opening and closing and operating status of the chip collection unit and the chip removal unit, realize the automatic chip removal of the machine tool waste chips, improve the accuracy of the waste chip treatment process, and improve the effect of waste chip treatment.

[0028] Example 2: Reference Figure 3-Figure 5 as well as Figure 11-13 , the technical solution of this embodiment is different from that of the first embodiment in that: the chip collection unit includes a collection component and an adsorption component, wherein the adsorption component is used to adsorb and collect the debris adhered to the machine tool body 2; The chip collection unit adopts a chip removal method that cooperates with the collection component and the adsorption component. It can automatically collect the waste chips under the action of gravity, and can also remove the waste chips adhered to the inside of the machine tool by adsorption. The waste chip removal effect is better and no chips will be missed.

[0029] The collecting assembly includes a collecting bucket 6 fixedly installed in the machine tool body 2 for collecting waste chips, and the lower part of the collecting bucket 6 is connected to the chip removal bottom box 1 through a chip dropping square pipe 10. The collecting assembly is used to transfer the chips and waste liquid generated during the processing of the machine tool body 2 to the chip removal bottom box 1 through the collecting bucket 6 and the chip dropping square pipe 10; Part of the waste chips generated during the processing of the machine tool body 2 will fall directly into the collecting bucket 6, while the other part of the waste chips will splash onto the inner wall of the machine tool body 2 during the processing. The waste chips and waste liquid in the collecting bucket 6 will fall directly into the chip removal bottom box 1 through the chip falling square tube 10, completing the preliminary collection of the waste chips.

[0030] In a further embodiment, a partition plate 11 is fixedly installed in the chip removal bottom box 1, a servo motor 12 is fixedly installed in the chip removal bottom box 1, and a driving roller 22 is rotatably installed between the driving end of the servo motor 12 and the partition plate 11; The adsorption assembly includes an air box 28 fixedly mounted on the partition plate 11, and the driving roller 22 passes through the air box 28 and is rotatably connected to the air box 28. A fan wheel 31 is fixedly mounted inside the driving roller 22, and the fan wheel 31 is located inside the air box 28. Two adsorption boxes 7 are arranged on the collecting hopper 6, and an adsorption tube 9 for adsorbing waste is fixedly connected between the two adsorption boxes 7 and the air box 28. When the servo motor 12 is started, the driving roller 22 is driven to rotate. The driving roller 22 is driven to rotate the impeller 31. The impeller 31 sucks air from the rear and blows air from the front. That is, when the impeller 31 rotates, a wind force airflow is generated. The negative pressure generated when the impeller 31 rotates will be transmitted to the two adsorption boxes 7 through the adsorption tube 9, that is, the two adsorption tubes 9 will produce an adsorption effect on the two adsorption boxes 7, and the adsorption force in the adsorption box 7 will act on the inside of the machine tool body 2, so that the waste chips adhered to the machine tool body 2 can be adsorbed and removed, thereby further improving the effect of adsorbing the waste chips and avoiding the situation where the waste chips are not thoroughly treated.

[0031] Example 3: Reference Figure 3-Figure 10 as well as Figure 14-16 , the technical solution of this embodiment is different from that of the second embodiment in that: the chip removal unit includes a vibration screening component, a chip guiding component and a liquid removal component; The vibrating screening assembly includes a partition plate 2 15 fixedly installed in the chip removal bottom box 1, and a screening inclined plate 17 is installed between the driving roller 22 and the partition plate 11 through a vibration mechanism, and a middle inclined plate 18 matching the chip falling square tube 10 is fixedly installed on the screening inclined plate 17; The vibrating screening component is used to screen the waste chips collected by the collecting component according to the volume. The waste chips and waste liquid falling into the chip discharge bottom box 1 through the chip falling square tube 10 will fall onto the screening inclined plate 17 and the middle inclined plate 18 thereon, and slide on the screening inclined plate 17 and the middle inclined plate 18 under the action of gravity, completing the automatic conduction of the waste chips; The chip removal unit can screen the collected waste chips according to their volume through the vibration and screening action of the vibrating screening component inside it. Large-volume waste residues can be directly discharged, and small-volume waste chips can be transferred to the waste liquid component for secondary treatment. At the same time, the waste liquid is treated, and the screening treatment effect is better.

[0032] A plurality of lower liquid holes 20 for draining sewage are provided on the middle inclined plate 18. After the waste chips and waste liquid fall onto the middle inclined plate 18, the waste liquid will directly fall through the lower liquid holes 20, while the waste chips cannot pass through the lower liquid holes 20 and will continue to slide on the middle inclined plate 18, thereby completing the preliminary separation of the waste liquid and the waste chips.

[0033] In a further embodiment, the vibration mechanism includes two vibration springs 21 fixedly mounted on the partition plate 15, and the left side of the screening inclined plate 17 is fixedly mounted on the two vibration springs 21, and the right side of the vibration spring 21 is slidably mounted in the partition plate 11, a vibration cam 23 is fixedly mounted on the driving roller 22, a linkage rod 25 is slidably mounted between the screening inclined plate 17 and the partition plate 11, and a driven triangular block 24 matching the vibration cam 23 is fixedly mounted on the lower part of the linkage rod 25; A vertical sliding groove cooperating with the linkage rod 25 is provided on the partition plate 11. The vertical sliding groove is used to enable the linkage rod 25 to slide vertically only on the partition plate 11 without being offset or separated from the partition plate 11, so that the screening inclined plate 17 can only vibrate in the vertical direction without tilting during vibration, thereby avoiding the falling of waste chips during vibration screening.

[0034] The servo motor 12 is started to drive the driving roller 22 to rotate. The rotation of the driving roller 22 will drive the vibration cam 23 to rotate. When the vibration cam 23 rotates, it will contact the driven triangle block 24. When the vibration cam 23 rotates to make initial contact with the driven triangle block 24, it will lift the driven triangle block 24 to make it rise. When the vibration cam 23 is not in contact with the driven triangle block 24, the driven triangle block 24 will automatically fall under the action of gravity. Repeat the above steps, the vibration cam 23 rotates and contacts the driven triangle block 24 alternately and intermittently, and the reciprocating lifting motion of the driven triangle block 24 can be realized.

[0035] When the driven triangular block 24 is lifted and lowered reciprocatingly, it will drive the screening inclined plate 17 to lift and lower reciprocatingly through the linkage rod 25, and will realize the reciprocating vibration of the screening inclined plate 17 under the cooperation of the vibration spring 21, that is, the vibration and conduction of the waste chips on the upper part of the screening inclined plate 17 can be realized under the action of vibration, and the waste chips can be quickly driven to move on the screening inclined plate 17, thereby improving the screening and grading effects, and avoiding the accumulation of waste chips to cause blockage, thereby affecting the removal of waste chips.

[0036] In a further embodiment, the driving roller 22 is provided with a separation cylinder 16 via an air blowing mechanism, and the air blowing mechanism comprises an air guide plate 29 fixedly installed on the driving roller 22, and an air induced positioning ring 34 is rotatably installed on the air guide plate 29, and a plurality of air inlet pipes 32 for air intake are fixedly connected between the air induced positioning ring 34 and the air induced box 28, and a plurality of air blowing pipes 33 are fixedly connected between the air guide plate 29 and the separation cylinder 16; The rotation of the driving roller 22 will drive the air guide plate 29 to rotate, and the rotation of the air guide plate 29 will drive the separation cylinder 16 to rotate as a whole through multiple blowing pipes 33. The wind flow in the induced draft box 28 will be blown into the induced draft positioning ring 34 through the air inlet pipe 32, and then blown into the air guide plate 29. The wind flow in the air guide plate 29 will be blown into the separation cylinder 16 through multiple blowing pipes 33.

[0037] The chip guide assembly is used to conduct the screened waste chips to the liquid removal assembly, and remove the waste liquid in the waste chips through the liquid removal assembly. The chip guide assembly includes a chip screening net 19 fixedly mounted on the screening inclined plate 17, a feed pipe 26 is fixedly arranged on the partition plate 15 through a connecting rod, and the feed pipe 26 is rotatably mounted on the separation cylinder 16, and a collecting hopper 27 for collecting waste chips passing through the chip screening net 19 is fixedly connected to the feed pipe 26; A chip box 4 that cooperates with the screening inclined plate 17 is arranged between the partition plate 2 15 and the chip removal bottom box 1. When the screening inclined plate 17 vibrates, the waste chips on it will vibrate and be transmitted to the upper part of the chip screening net 19. At this time, the smaller waste chips will directly fall through the chip screening net 19, while the larger waste blocks that cannot pass through the chip screening net 19 will continue to be transported on the screening inclined plate 17 and finally fall onto the chip box 4, completing the removal of the large waste blocks.

[0038] The small-volume waste chips that pass through the chip screening net 19 will fall onto the collecting hopper 27 under the action of gravity, and then fall into the feed pipe 26. Since the feed pipe 26 is connected to the separation cylinder 16, the waste chips in the feed pipe 26 will directly fall into the separation cylinder 16, completing the conduction of the small-volume waste chips.

[0039] An electric telescopic rod 30 is fixedly installed on the partition plate 15, and a pushing arc plate 37 is fixedly installed on the driving end of the electric telescopic rod 30, and the pushing arc plate 37 is located in the feed pipe 26. When the electric telescopic rod 30 is started, the pushing arc plate 37 will drive the pushing arc plate 37 to move. The movement of the pushing arc plate 37 will squeeze the waste chips in the feed pipe 26, and the waste chips in the feed pipe 26 can be pushed into the separation cylinder 16, so as to improve the feeding efficiency of the waste chips in the feed pipe 26 and avoid the accumulation of waste chips in the separation cylinder 16.

[0040] The liquid removal assembly includes a plurality of liquid throwing holes 35 provided on the separation cylinder 16, and an electric opening and closing door 36 for chip removal is provided at the lower part of the separation cylinder 16, a bearing inclined plate 13 is fixedly installed at the lower part of the chip removal bottom box 1, and a chip guide groove cooperating with the electric opening and closing door 36 is provided on the bearing inclined plate 13, and a chip removal box 5 for chip removal is fixedly installed between the chip guide groove and the chip removal bottom box 1; By driving the separation cylinder 16 to rotate through the servo motor 12, the waste liquid in the small volume of waste chips can be thrown out at high speed, and air blowing and dehumidification are performed while the liquid is thrown out, which can further improve the liquid discharge effect, effectively prevent the waste liquid from adhering to the waste chips, and improve the dehumidification effect of the waste liquid.

[0041] When the separation cylinder 16 rotates, it drives the small volume of waste chips inside to rotate, and generates centrifugal force during the rotation, so that the waste liquid adhering to the waste chips can be thrown out, thus completing the separation of waste chips from waste chips, and preventing the waste liquid from accumulating on the waste chips and affecting the treatment effect; During the centrifugal liquid removal process of the separation drum 16, the wind force and airflow blown into the separation drum 16 by the multiple blowing pipes 33 will act on the waste chips in the separation drum 16, and the waste chips can be blown and dehumidified, thereby improving the efficiency of removing the waste liquid on the waste chips, further improving the waste liquid removal effect, and improving the efficiency of subsequent waste chip treatment.

[0042] After the waste liquid in the separation cylinder 16 is discharged, the electric opening and closing door 36 can be opened, so that the waste chips in the separation cylinder 16 can fall directly into the chip guide groove on the supporting inclined plate 13 through the electric opening and closing door 36, and the waste chips can be discharged through the chip discharge box 25 to complete the collection of the waste chips.

[0043] Two liquid guiding square tubes 14 for guiding water are fixedly installed on the side of the supporting inclined plate 13, and a plurality of drainage pipes 8 for draining water are fixedly installed on the chip removal bottom box 1. The waste liquid falling through the lower liquid hole 20 on the middle inclined plate 18 will fall onto the supporting inclined plate 13 at the bottom of the chip removal bottom box 1, and slide into the two liquid guiding square tubes 14. At the same time, the waste liquid thrown out through the liquid throwing hole 35 on the separation cylinder 16 will also fall onto the supporting inclined plate 13, and synchronously fall into the liquid guiding square tubes 14, and the waste liquid can be discharged through a plurality of drainage pipes 8 after the chip removal is completed.

[0044] The specific chip removal steps of this chip removal device are: Part of the chips and waste liquid generated during the machining of the machine tool body 2 will directly fall onto the screening inclined plate 17 in the chip removal bottom box 1 through the collecting bucket 6 and the chip falling square pipe 10, completing the preliminary collection of the waste chips; Start the servo motor 12 to drive the driving roller 22 to rotate. The rotation of the driving roller 22 drives the vibration cam 23 to rotate, and the cooperation with the driven triangular block 24 drives the linkage rod 25 and the screening inclined plate 17 to move back and forth, and the reciprocating vibration of the screening inclined plate 17 is realized under the cooperation of the vibration spring 21. When the screening inclined plate 17 vibrates, the waste chips on it will vibrate and be transmitted to the upper part of the chip screening net 19. At this time, the smaller waste chips will directly fall through the chip screening net 19, while the larger waste blocks cannot pass through the chip screening net 19 and will continue to be transported on the screening inclined plate 17, and finally fall onto the chip removal box 4, completing the removal of large waste blocks.

[0045] The small-volume waste chips that pass through the chip screening net 19 will fall onto the collecting hopper 27 under the action of gravity, and then fall into the feed pipe 26. Since the feed pipe 26 is connected to the separation cylinder 16, the waste chips in the feed pipe 26 will directly fall into the separation cylinder 16, completing the conduction of the small-volume waste chips. The servo motor 12 is started to drive the driving roller 22 to rotate, and the driving roller 22 rotates to drive the impeller 31 to rotate. The negative pressure generated by the rotation of the impeller 31 is transmitted to the two adsorption boxes 7 through the adsorption tube 9, and the adsorption force in the adsorption box 7 is used to suck the waste chips adhered to the machine tool body 2 into the adsorption tube 9; The waste debris in the adsorption tube 9 will be conducted to the induced draft box 28 along with the wind flow, and blown into the induced draft positioning ring 34 through the air inlet pipe 32, and then blown into the air guide plate 29. The wind flow in the air guide plate 29 will be blown into the separation cylinder 16 through multiple blowing pipes 33.

[0046] The servo motor 12 starts to drive the driving roller 22 to rotate, and then drives the air guide plate 29 to rotate. The rotation of the air guide plate 29 drives the separation cylinder 16 to rotate as a whole through the multiple blowing pipes 33. When the separation cylinder 16 rotates, it drives the small volume of waste chips inside it to rotate, and centrifugal force is generated during the rotation, so that the waste liquid adhering to the waste chips can be thrown out. During the centrifugal liquid throwing process of the separation cylinder 16, the wind force and airflow blown into the separation cylinder 16 by the multiple blowing pipes 33 will act on the waste chips in the separation cylinder 16, and the waste chips are blown and dehumidified; The waste liquid falling through the lower liquid hole 20 on the middle inclined plate 18 will fall onto the supporting inclined plate 13 at the bottom of the chip removal bottom box 1, and slide into the two liquid guiding square tubes 14. At the same time, the waste liquid thrown out through the liquid throwing hole 35 on the separation cylinder 16 will also fall onto the supporting inclined plate 13 and synchronously fall into the liquid guiding square tube 14. The waste liquid can be discharged through multiple liquid discharge pipes 8 after the chip removal is completed.

[0047] The embodiment of the present invention further provides a water-cooled chip removal method for machine tool processing, which is used for the above-mentioned water-cooled chip removal device for machine tool processing, and comprises the following steps: S1, the waste chips generated during the machining of the machine tool body 2 will fall into the chip collection unit, and the waste chips will be collected into the chip removal unit through the collection component; S2, screening the waste according to the volume through the vibrating screening component, and discharging the large volume of waste; S3, conducting the small volume of waste chips to the liquid removal component through the chip guide component, and draining the small volume of waste chips through the liquid removal component; S4. The waste chips adhered to the machine tool body 2 are adsorbed into the liquid removal component by the adsorption component, so as to promote chip removal and improve the liquid removal efficiency.

[0048] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A water-cooled chip removal device for machine tool processing, comprising a chip removal bottom box (1) arranged at the bottom of a machine tool body (2) for processing machine tool waste chips, characterized in that: Also includes: A chip collection unit is arranged between the chip removal bottom box (1) and the machine tool body (2), and is used to collect and process the machining waste chips in the machine tool body (2), comprising a collection component and an adsorption component, wherein the adsorption component is used to adsorb and collect the debris adhered to the machine tool body (2); A chip removal unit is arranged in the chip removal bottom box (1) and is used for screening and removing waste chips collected by the chip collection unit, and comprises a vibration screening component, a chip guiding component and a liquid removal component; The vibrating screening component is used to screen the waste collected by the collecting component according to volume; The chip guide component is used to conduct the screened waste chips to the liquid removal component, and the waste liquid in the waste chips is removed through the liquid removal component.

2. A water-cooled chip removal device for machine tool processing according to claim 1, characterized in that: The machine tool body (2) is provided with a control console (3), which cooperates with a chip collection unit and a chip removal unit and is used to control the opening and closing and operating states of the chip collection unit and the chip removal unit, thereby realizing automatic chip removal of waste chips of the machine tool.

3. The water-cooled chip removal device for machine tool processing according to claim 1, characterized in that: The collecting assembly comprises a collecting bucket (6) fixedly mounted in a machine tool body (2) for collecting waste chips, and the lower portion of the collecting bucket (6) is connected to a chip removal bottom box (1) via a chip dropping square tube (10). The collecting assembly is used to transfer chips generated during machining of the machine tool body (2) to the chip removal bottom box (1) via the collecting bucket (6) and the chip dropping square tube (10).

4. A water-cooled chip removal device for machine tool processing according to claim 3, characterized in that: The vibrating screening assembly comprises a partition plate 1 (11) and a partition plate 2 (15) fixedly mounted in a chip removal bottom box (1), a servo motor (12) fixedly mounted in the chip removal bottom box (1), a driving roller (22) rotatably mounted between a driving end of the servo motor (12) and the partition plate 1 (11), and a screening inclined plate (17) mounted between the driving roller (22) and the partition plate 1 (11) via a vibrating mechanism.

5. A water-cooled chip removal device for machine tool processing according to claim 4, characterized in that: The vibration mechanism comprises two vibration springs (21) fixedly mounted on the second partition plate (15), and the left side of the screening inclined plate (17) is fixedly mounted on the two vibration springs (21), and the right side of the vibration spring (21) is slidably mounted in the first partition plate (11), a vibration cam (23) is fixedly mounted on the driving roller (22), a linkage rod (25) is slidably mounted between the screening inclined plate (17) and the first partition plate (11), and a driven triangular block (24) matching the vibration cam (23) is fixedly mounted on the lower part of the linkage rod (25); A middle inclined plate (18) matched with the chip falling square tube (10) is fixedly mounted on the screening inclined plate (17), and a plurality of lower liquid holes (20) for draining sewage are provided on the middle inclined plate (18). A chip removal box (4) matched with the screening inclined plate (17) is provided between the second partition plate (15) and the chip removal bottom box (1).

6. The water-cooled chip removal device for machine tool processing according to claim 5, characterized in that: The adsorption assembly comprises an induced draft box (28) fixedly mounted on a partition plate (11), and a driving roller (22) passes through the induced draft box (28) and is rotatably connected to the induced draft box (28), a fan wheel (31) is fixedly mounted inside the driving roller (22), and the fan wheel (31) is located inside the induced draft box (28), two adsorption boxes (7) are arranged on the collecting hopper (6), and an adsorption tube (9) for adsorbing waste debris is fixedly connected between the two adsorption boxes (7) and the induced draft box (28).

7. A water-cooled chip removal device for machine tool processing according to claim 6, characterized in that: A separation cylinder (16) is mounted on the driving roller (22) via an air blowing mechanism, the liquid removal assembly comprises a plurality of liquid throwing holes (35) provided on the separation cylinder (16), and an electric opening and closing door (36) for chip removal is provided at the lower portion of the separation cylinder (16), a bearing inclined plate (13) is fixedly mounted at the lower portion of the chip removal bottom box (1), and a chip guide groove cooperating with the electric opening and closing door (36) is provided on the bearing inclined plate (13), and a second chip removal box (5) for chip removal is fixedly mounted between the chip guide groove and the chip removal bottom box (1); Two square liquid-conducting pipes (14) for conducting water are fixedly mounted on the side of the load-bearing inclined plate (13), and a plurality of liquid-draining pipes (8) for draining water are fixedly mounted on the chip-discharging bottom box (1).

8. The water-cooled chip removal device for machine tool processing according to claim 7, characterized in that: The air blowing mechanism comprises an air guide plate (29) fixedly mounted on the driving roller (22); an air induction positioning ring (34) is rotatably mounted on the air guide plate (29); a plurality of air inlet pipes (32) for air inlet are fixedly connected between the air induction positioning ring (34) and the air induction box (28); and a plurality of air blowing pipes (33) are fixedly connected between the air guide plate (29) and the separation cylinder (16).

9. The water-cooled chip removal device for machine tool processing according to claim 8, characterized in that: The chip guide assembly comprises a chip screening net (19) fixedly mounted on the screening inclined plate (17); a feed pipe (26) is fixedly mounted on the second partition plate (15) via a connecting rod, and the feed pipe (26) is rotatably mounted on the separation cylinder (16); and a collecting hopper (27) for collecting waste chips passing through the chip screening net (19) is fixedly connected to the feed pipe (26); An electric telescopic rod (30) is fixedly mounted on the second partition plate (15), and a material pushing arc plate (37) is fixedly mounted on the driving end of the electric telescopic rod (30), and the material pushing arc plate (37) is located in the feed pipe (26).

10. A water-cooled chip removal method for machine tool processing, used in the water-cooled chip removal device for machine tool processing as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1, the waste chips generated during the machining of the machine tool body (2) will fall into the chip collection unit, and the waste chips will be collected into the chip removal unit through the collection component; S2, screening the waste according to the volume through the vibrating screening component, and discharging the large volume of waste; S3, conducting the small volume of waste chips to the liquid removal component through the chip guide component, and draining the small volume of waste chips through the liquid removal component; S4. The waste chips adhering to the machine tool body (2) are adsorbed into the liquid removal component by the adsorption component, thereby promoting chip removal and improving liquid removal efficiency.

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