Full-automatic film tearing equipment for wafer

Abstract

The invention belongs to the technical field of semiconductor processing, and relates to wafer full-automatic film tearing equipment, which comprises an equipment shell, a film tearing mechanism and a film tearing mechanism, the carrying manipulator unit is arranged in the equipment shell, and the carrying manipulator unit takes the wafer out of the wafer conveying box and conveys the wafer to a preset position; the peptizing unit is arranged in the equipment shell; the carrying manipulator unit is used for conveying the wafer into the dispergation unit for dispergation of a wafer film; the wafer carrying unit is arranged in the equipment shell; the carrying manipulator unit is used for conveying the dispergated wafer to the wafer carrying unit; the film tearing unit is arranged in the equipment shell; tearing a wafer film of the wafer on the wafer carrying unit; and the carrying manipulator unit conveys the wafer after film tearing to a preset position. After the structure is adopted, the beneficial effects are that wafer position calibration, wafer film dispergation and wafer film tearing can be carried out in a full-automatic manner.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a fully automatic wafer film tearing device. Background Art

[0002] With the advancement of semiconductor technology, the requirements for product performance are getting higher and higher, and new packaging processes are constantly emerging. When the wafer comes out of the wafer manufacturing plant, the thickness is relatively thick. Due to the requirements for the package size, the wafer will be thinned during packaging to adapt to a smaller package size. In order to protect the circuit layer of the wafer when the wafer is thinned, a film will be attached to the circuit layer of the wafer to protect the wafer from scratches and contamination during thinning and grinding. After the wafer is thinned, this protective film needs to be removed, and the wafer must not be damaged during removal.

[0003] There are many ways to peel off the film. The traditional solution is to adsorb the wafer on a platform, manually peel off an edge with tweezers, and then manually pull the film to remove the thin film on the wafer through external force. This solution is a purely manual mode, with too many human factors and too difficult to control. The tweezers can easily pierce the wafer, and the manual film tearing force is difficult to control, which can easily cause the wafer to break. Therefore, it is necessary to make improvements. Summary of the invention

[0004] In order to solve the above problems in the prior art, the present invention provides a fully automatic wafer film tearing device.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] As one aspect of the present invention, a fully automatic wafer film peeling device is provided, which comprises:

[0007] Equipment housing;

[0008] A transport robot unit is disposed in the equipment housing, and the transport robot unit takes the wafer out of the wafer transfer box and delivers it to a preset position;

[0009] The debonding unit is arranged in the equipment housing; the transport robot unit sends the wafer to the debonding unit to debond the wafer film;

[0010] The wafer handling unit is arranged in the equipment housing; the handling robot unit delivers the wafer after debonding to the wafer handling unit;

[0011] The film-tearing unit is arranged in the equipment housing; it is used to tear the film of the wafer on the wafer handling unit; the handling robot unit delivers the wafer after the film is torn to a preset position;

[0012] It also includes a wafer temporary storage unit, which is arranged in the equipment housing;

[0013] After the wafer is debonded, the transport robot unit transports the wafer to the wafer temporary storage unit to adsorb the wafer, and then the wafer chuck of the wafer transport unit rises to take the wafer and sends it to the film tearing unit for film tearing;

[0014] After the wafer film is peeled off, the wafer handling unit transports the wafer to the wafer temporary storage unit for code reading. After code reading, the wafer is lifted up by the vacuum hollow shaft of the wafer handling unit, and then the handling robot unit lifts the wafer and puts it back into the wafer transfer box. When the handling robot unit lifts the wafer, the wafer temporary storage unit prevents the wafer from warping.

[0015] Optionally, the wafer temporary storage unit includes a temporary storage connecting frame, which is connected to the equipment housing; a code reader is provided on the temporary storage connecting frame; a temporary storage chuck is connected to the temporary storage chuck, and a temporary storage suction cup is connected to the temporary storage chuck, and the temporary storage suction cup is connected to a vacuum generator; after the debonding of the wafer is completed, the transport robot unit transports the wafer to the temporary storage suction cup of the wafer temporary storage unit to adsorb the wafer, and then the wafer chuck of the wafer transport unit rises to take over the wafer and sends it to the film tearing unit for film tearing.

[0016] Optionally, the wafer temporary storage unit also includes a temporary storage lifting cylinder arranged on the temporary storage connecting frame, the movable end of the temporary storage lifting cylinder is connected to the temporary storage mounting plate, the temporary storage mounting plate is connected to at least one temporary storage pressure rod, the temporary storage pressure rod is connected to a temporary storage pressure block, and the temporary storage pressure block is made of rubber material; after the wafer film is peeled off, the wafer handling unit transports the wafer to the barcode reader of the wafer temporary storage unit for barcode reading, and the wafer after barcode reading is lifted up by the vacuum hollow shaft of the wafer handling unit, and then the handling robot unit lifts the wafer and puts it back into the wafer transfer box, and when the handling robot unit lifts the wafer, the temporary storage pressure block of the wafer temporary storage unit presses down the wafer to prevent the wafer from warping.

[0017] As an option, it also includes a wafer carrying unit, which includes a loading shell, the loading shell is connected to the equipment shell, a loading platform is movably connected to the loading shell, a loading elevator is provided in the loading shell, a loading window is provided on the loading shell, so that the loading platform is communicated with the equipment shell, and a loading door that can be opened and closed is provided on the loading window; the loading door is connected to the movable end of the loading elevator, and the loading door is raised or lowered to a preset position by the loading elevator.

[0018] Optionally, the handling robot unit includes a wafer handling robot and a robot transverse movement assembly, the robot transverse movement assembly is arranged in the equipment housing; the bottom of the wafer handling robot is connected to the robot transverse movement assembly; the robot transverse movement assembly includes a transverse movement base connected to the equipment housing, the transverse movement base is slidably connected to the transverse movement slider, and the bottom of the wafer handling robot is connected to the transverse movement slider; a transverse movement screw is rotatably connected to the transverse movement base, one end of the transverse movement screw is connected to the transverse movement drive part arranged on the transverse movement base; a transverse movement nut is threadedly connected to the transverse movement screw, and the transverse movement slider is connected to the transverse movement nut.

[0019] Optionally, the degumming unit includes a degumming shell, which is arranged in the equipment shell; a degumming window is opened on the degumming shell for the entry of a wafer handling robot, and a UV lamp group is arranged in the degumming shell; a working port is provided on the side of the degumming shell, and a degumming box door is provided on the working port; at least one heat dissipation hole is opened on the side of the degumming shell, and a cooling fan is provided on the heat dissipation hole.

[0020] Optionally, it also includes a wafer edge-finding unit, which is arranged in the equipment housing and on the debonding unit. The wafer with the wafer film first passes through the wafer edge-finding unit to calibrate the wafer notch position and rotate to a preset position, and then is sent to the debonding unit for debonding;

[0021] The wafer edge-finding unit includes an edge-finding base plate, which is arranged below the disintegration shell; a wafer edge-finder is arranged on the edge-finding base plate, and the handling robot unit places the wafer with the wafer film on the edge-finding chuck of the wafer edge-finder, and the wafer edge-finder starts to calibrate the wafer notch position and rotates to a preset position.

[0022] Optionally, it also includes an anti-warping unit, which is connected to the degumming shell of the degumming unit; the anti-warping unit includes an anti-warping cylinder connected to the degumming shell, and the movable end of the anti-warping cylinder is arranged downward; the movable end of the anti-warping cylinder is connected to an anti-warping connecting plate, and a plurality of anti-warping pressure rods are arranged on the anti-warping connecting plate at intervals, and the bottom end of the anti-warping pressure rod is connected to an anti-warping pressure block, and the anti-warping pressure block is made of rubber material; while the wafer edge finder is calibrated, the anti-warping cylinder of the anti-warping unit drives the anti-warping pressure block to press down the upper surface of the wafer with the wafer film.

[0023] As an option, the wafer handling unit includes a handling base slidably connected to the equipment housing, and the handling base is movably connected to the equipment housing through a handling connecting plate; the handling base is connected to the handling connecting plate; a handling guide rail is provided on the handling connecting plate, and a handling slider is slidably connected to the handling guide rail, and the handling base is connected to the handling slider; the handling base can move relative to the equipment housing through the cooperation of the handling slider and the handling guide rail; a handling screw is rotatably connected to the handling connecting plate, and the axial direction of the handling screw is parallel to the moving direction of the handling guide rail; both ends of the handling screw are rotatably connected to the handling connecting plate through a handling bearing seat; one end of the handling screw is connected to the movable end of the handling motor provided on the handling connecting plate, a handling nut is threadedly connected to the handling screw, and the handling base is connected to the handling nut;

[0024] The carrying base is slidably connected with a lifting platform, the carrying base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting slider, and the lifting platform is connected to the lifting slider; the lifting platform is lifted up and down on the carrying base through the cooperation of the lifting guide rail and the lifting slider; a lifting screw rod is rotatably connected to the carrying base, and both ends of the lifting screw rod are rotatably connected to the carrying base through bearing seats; a lifting nut piece is threadedly connected to the lifting screw rod, and the lifting platform is connected to the lifting nut piece; one end of the lifting screw rod is connected to a lifting driven wheel, and the carrying base is connected to a lifting motor, and the movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel;

[0025] It also includes a lifting support column, which is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum suction cup unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base through a bearing, and the lifting support column can rotate relative to the handling base;

[0026] The rotating unit comprises a rotating motor arranged on the lifting platform, the movable end of the rotating motor is connected to a rotating driving wheel, the lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

[0027] Optionally, the vacuum suction cup unit comprises a suction cup mounting block connected to the upper end of the lifting support column, the suction cup mounting block is connected to a chuck mounting plate, a wafer chuck is connected to the chuck mounting plate, and an adsorption layer is connected to the surface of the wafer chuck, and the adsorption layer is made of a porous ceramic material;

[0028] A heating groove is provided at the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is provided at the bottom of the chuck mounting plate, and the heating ring baffle presses and fixes the heating ring;

[0029] A vacuum shaft mounting plate is movably provided on the upper part of the lifting support column, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided in the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is movably passed through the suction cup mounting block, the chuck mounting plate and the wafer chuck in sequence, and then connected to the vacuum suction cup, and the suction port of the vacuum suction cup is higher than the surface of the wafer chuck; a stop ring for limiting the vacuum shaft mounting plate is provided on the lifting support column;

[0030] It also includes a mounting bushing, which is connected to the suction cup mounting block, and the vacuum hollow shaft movably passes through the mounting bushing;

[0031] The transport base is connected with a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to rise and fall.

[0032] Optionally, the vacuum shaft lifting unit includes a vacuum shaft lifting portion arranged on a handling base; a movable end of the vacuum shaft lifting portion is connected to a vacuum shaft lifting block, and the vacuum shaft lifting block is located below a vacuum shaft mounting plate.

[0033] Optionally, the film tearing unit includes a first film sticking mechanism and a first film clamping mechanism, the first film sticking mechanism sticks a hot melt adhesive film on the wafer film of the wafer on the wafer transport unit, and the first film clamping mechanism clamps the hot melt adhesive film and moves it to a preset position to tear the wafer film of the wafer.

[0034] Optionally, the first film pasting mechanism includes a first film pasting base connected to the device housing, a first film rolling roller is rotatably connected to the first film pasting base, a first film pasting motor is connected to the first film pasting base, a first film pasting driving wheel is connected to the movable end of the first film pasting motor, a first film pasting driven wheel is connected to one end of the first film pasting roller, and the first film pasting driving wheel and the first film pasting driven wheel are connected by a first film pasting synchronous belt; a hot melt adhesive film is connected to the first film rolling roller;

[0035] A first winding driven roller and a second winding driven roller are rotatably connected to the first film laminating base, the center of the first winding driven roller is located to the lower right of the center of the first film winding roller, and the center of the second winding driven roller is located to the lower left of the center of the first winding driven roller;

[0036] A first outlet channel is formed on the first film laminating base, and the movable end of the hot melt adhesive film is sequentially wound around the first winding driven roller and the second winding driven roller, and moves through the first outlet channel; a first side push cylinder is provided on the first film laminating base, and the movable end of the first side push cylinder is connected to a first side push plate, and the first side push plate is movably arranged in the first outlet channel to push the hot melt adhesive film in the first outlet channel to a preset position;

[0037] The first outlet channel includes a first outlet groove arranged on the first film-sticking base; a first groove pressing block is arranged above the first outlet groove, the first groove pressing block is connected to the movable end of the first groove pressing cylinder arranged on the first film-sticking base, and the first groove pressing block is pressed on the groove opening of the first outlet groove.

[0038] Optionally, a first film pressing cylinder is provided on the first film laminating base, and a first film pressing block is connected to the movable end of the first film pressing cylinder, and the first film pressing block presses the hot melt adhesive film coming out of the first outlet channel onto the wafer film of the wafer;

[0039] The first film sticking base is provided with a first heating lifting cylinder, and the movable end of the first heating lifting cylinder is connected with a first heater. The first heater heats the hot melt adhesive film coming out of the first outlet channel, and heats the hot melt adhesive film to make it stick to the wafer film. When the hot melt adhesive film is heated, the first film pressing block is pushed out by the first film pressing cylinder to press the hot melt adhesive film downward.

[0040] Optionally, a first film cutting assembly is provided on the first film laminating base, and the first film cutting assembly cuts the hot melt adhesive film. The first film cutting assembly includes a first film cutting cylinder connected to the first film laminating base, and the movable end of the first film cutting cylinder is connected to a first blade. The first film pressing block and the first film laminating base are respectively provided with a cutting clearance groove for the first blade to cut.

[0041] Optionally, the first film clamping mechanism is located below the first film laminating mechanism; the first film clamping mechanism comprises a first film feeding roller rotatably connected to the device housing, one end of the first film feeding roller is connected to a first film feeding roller driven wheel, a first film feeding roller motor is provided on the device housing, a movable end of the first film feeding roller motor is connected to a first film feeding roller driving wheel, and the first film feeding roller driven wheel and the first film feeding roller driving wheel are connected via a first film feeding roller synchronous belt;

[0042] The first film clamping mechanism also includes a first film feeding roller movably connected to the device housing, the first film feeding roller is rotatably connected to the first film feeding bracket, and the first film feeding bracket is slidably connected to the device housing; a first film feeding roller cylinder is provided on the device housing, and the movable end of the first film feeding roller cylinder is connected to the first film feeding bracket, and the cut hot melt adhesive film is pressed under the cooperation of the first film feeding roller and the first film feeding roller. During the rotation of the first film feeding roller, the cut hot melt adhesive film is rolled up, and a gap for the wafer film to pass through is formed between the first film feeding roller and the first film feeding roller;

[0043] The first film clamping mechanism also includes a first clamping assembly movably connected to the device housing, the first clamping assembly clamps the hot-melt adhesive film and pulls it out from the first outlet channel, and then the first heater presses the hot-melt adhesive film down to the wafer film to heat and stick it firmly, and then the first film pressing block presses the hot-melt adhesive film, after the heating is completed, the first heater rises, the first blade cuts the hot-melt adhesive film, and then the first film feed roller axis approaches the first film delivery roller axis to press the cut hot-melt adhesive film, the first clamping assembly moves to the right, and the wafer handling unit moves to the left to tear the film.

[0044] Optionally, a first cleaning member is provided on the device housing.

[0045] Optionally, the first clamping assembly includes a first clamping bracket, which is slidably connected to the device housing; the first clamping bracket is connected to the movable end of a mobile power unit provided on the device housing; a first clamping groove is formed on the first clamping bracket, a first clamping cylinder is connected in the first clamping groove, a first clamping block is connected to the movable end of the first clamping cylinder, and the first clamping block cooperates with the first clamping groove.

[0046] The film-tearing unit may further comprise a film-tearing base arranged on a housing of the device, the film-tearing base being provided with a film-supplying assembly and a waste film-recovering assembly, the film-supplying assembly comprising a film-supplying roller shaft rotatably connected to the film-tearing base, the film-tearing base being connected with a film-supplying roller shaft motor, the movable end of the film-supplying roller shaft motor being connected to the film-supplying roller shaft drive wheel, and one end of the film-supplying roller shaft being connected to a film-supplying roller shaft driven wheel; the film-supplying roller shaft drive wheel and the film-supplying roller shaft driven wheel are connected via a film-supplying roller shaft synchronous belt; the film-tearing base being rotatably connected with a first film-supplying driven roller shaft, the first film-supplying driven roller shaft being located at the lower right side of the film-supplying roller shaft;

[0047] The waste film recovery component includes a waste film recovery roller arranged on a film tearing base, a waste film recovery roller motor is arranged on the film tearing base, the movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller, and drives the waste film recovery roller to wind the waste film; a waste film recovery driven roller is rotatably connected to the film tearing base, and the waste film recovery driven roller is located below the waste film recovery roller;

[0048] The film-tearing base is provided with a film pressing assembly, and the film pressing assembly is located between the film supply assembly and the waste film recovery assembly; the film pressing assembly includes a film pressing base connected to the film-tearing base, and the film pressing base is connected to the movable end of the film pressing power part provided on the film-tearing base, and the bottom of the film pressing base is connected with a film-tearing pressing plate, and the film-tearing pressing plate is arranged at a preset angle with the horizontal plane;

[0049] The film pressing base is provided with a first waste film driven roller, which is located above the film tearing pressure plate; the film pressing base is provided with a second waste film driven roller, which is located behind the first waste film driven roller; the film supply roller is connected with a cylindrical film tearing tape, and the movable end of the film tearing tape is connected to the waste film recovery roller after passing through the first film supply driven roller, the second waste film driven roller, the film tearing pressure plate and the first waste film driven roller in sequence;

[0050] The wafer handling unit drives the wafer to move under the film tearing plate, and the wafer handling unit makes the wafer film of the wafer touch the film tearing tape at the bottom of the film tearing plate, through the pressure formed between the film tearing plate and the wafer handling unit; then the wafer handling unit moves to the right, and at the same time the film supply roller rotates to supply the film tearing tape, and the waste film recovery roller rotates to recover the waste film.

[0051] Optionally, it also includes a pressure roller assembly, which is located below the waste film recovery assembly; the pressure roller assembly applies a preset pressure to the film tearing tape, so that the film tearing tape has a preset tension, which facilitates film tearing with the film tearing tape; the pressure roller assembly includes a pressure roller, which is rotatably connected to a pressure roller bracket, and the pressure roller bracket is connected to the movable end of a pressure roller power unit provided on a film tearing base; a passive limiting roller is rotatably connected to the film tearing base, and the passive limiting roller and the pressure roller are on the same plane, and there is a preset interval between the passive limiting roller and the pressure roller.

[0052] The beneficial effects of the fully automatic wafer film peeling device of the present invention are specifically embodied in: 1. It can fully automatically perform wafer position calibration and wafer film debonding, thereby improving operation efficiency; it has an anti-warping mechanism, which can effectively prevent wafer warping when the wafer position is calibrated. There is no need for manual operation throughout the process, and all operations are performed by a robotic arm, thereby preventing wafer damage caused by human operation.

[0053] 2. The wafer handling unit can move left and right, rise and fall, and rotate 360°, which can better apply the wafer to different processes; the adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, and effectively prevent wafer warping and improve wafer flatness.

[0054] 3. There is a heating ring under the wafer chuck, which can heat the wafer film to make the film soft and easier to peel off from the wafer surface; heating not only helps to increase the speed of film tearing, but also ensures the continuity of the film tearing process, thereby improving processing efficiency.

[0055] 4. The film can be torn off automatically without manual tearing, which improves work efficiency; the film is torn off evenly without causing damage to the wafer surface or leaving residual glue; after tearing off the film, the wafer surface will be cleaned to prevent dust from remaining on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The drawings in the specification, which constitute a part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0057] Figure 1 It is a structural stereogram of the fully automatic wafer film peeling device of the present invention;

[0058] Figure 2 A structural stereogram of the fully automatic wafer film peeling device of the present invention with the outer shell removed;

[0059] Figure 3 It is a schematic structural diagram of a wafer transport unit, a film tearing unit and a wafer temporary storage unit of the present invention;

[0060] Figure 4 It is a structural schematic diagram of a wafer carrying unit of the present invention;

[0061] Figure 5 It is a structural schematic diagram of a handling robot unit of the present invention;

[0062] Figure 6 It is an exploded front view of the disintegration unit and the wafer edge finding unit of the present invention;

[0063] Figure 7 It is a rear view of the structure of the debonding unit and the wafer edge finding unit of the present invention;

[0064] Figure 8 It is a structural stereogram of a wafer handling unit of the present invention;

[0065] Fig. 9 A bottom view of the structure of the wafer handling unit of the present invention;

[0066] Fig.10It is a structural front view of the wafer handling unit of the present invention;

[0067] Fig.11 A structural side view of a wafer handling unit of the present invention;

[0068] Fig.12 It is a rear view of the structure of the wafer handling unit of the present invention;

[0069] Fig.13 It is a structural cross-sectional view of a wafer handling unit of the present invention;

[0070] Fig.14 It is a structural cross-sectional view of the vacuum suction cup unit of the present invention;

[0071] Fig.15 It is a structural cross-sectional view of the vacuum shaft lifting unit of the present invention;

[0072] Fig.16 It is a structural front view of the wafer temporary storage unit of the present invention;

[0073] Fig.17 A bottom view of the structure of the wafer temporary storage unit of the present invention;

[0074] Fig.18 It is a structural stereogram of the first film-tearing unit of the present invention;

[0075] Fig.19 This is a structural front view of a first film-tearing unit of the present invention;

[0076] Fig. 20 It is a structural side view of a first film-tearing unit of the present invention;

[0077] Fig.21 It is a structural front view of the first film sticking mechanism of the present invention;

[0078] Fig. 22 It is a structural side view of the first film sticking mechanism of the present invention;

[0079] Fig.23 It is a structural rear view of the first film sticking mechanism of the present invention;

[0080] Fig.24 It is a structural front view of the first film clamping mechanism of the present invention;

[0081] Fig.25 A bottom view of the structure of the first film clamping mechanism of the present invention;

[0082] Fig.26 It is a structural schematic diagram of a second film-tearing unit of the present invention;

[0083] Fig. 27 It is a structural front view of a second film-tearing unit of the present invention;

[0084] Fig.28 A bottom view of the structure of a second film-tearing unit of the present invention;

[0085] Fig.29 is a schematic structural diagram of a first cleaning member of the present invention;

[0086] Fig.30 It is a schematic structural diagram of the first cleaning member of the present invention. DETAILED DESCRIPTION

[0087] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0088] An automatic wafer film peeling device according to an embodiment of the present application is as follows: Figure 1-Figure 2 As shown, it includes: a device housing 1, which plays a protective and supporting role;

[0089] A transport robot unit 2 is disposed in the equipment housing 1, and the transport robot unit 2 takes the wafer out of the wafer transfer box and delivers it to a preset position;

[0090] The debonding unit 3 is arranged in the equipment housing 1; the transport robot unit 2 sends the wafer to the debonding unit 3 to debond the wafer film;

[0091] The wafer handling unit 4 is arranged in the equipment housing 1; the handling robot unit 2 delivers the wafer after debonding to the wafer handling unit 4;

[0092] The film-tearing unit 5 is arranged in the equipment housing 1 ; it tears the wafer film of the wafer on the wafer transport unit 4 ; and the transport robot unit 2 delivers the wafer after the film is torn to a preset position.

[0093] In one embodiment, if Figure 4As shown, it also includes a wafer carrying unit 6, which is arranged on the equipment housing 1; the wafer carrying unit 6 is used to carry a wafer transfer box. It should be noted that the wafer transfer box is used to store wafers, and its structure is a prior art and is not repeated in this embodiment; the wafers without film peeling are placed in the wafer transfer box and taken out by the handling robot unit 2; the wafers after film peeling are placed in the corresponding wafer transfer box by the handling robot unit 2; the wafer carrying unit 6 includes a loading shell 61, which is connected to the equipment housing 1, and the loading shell 61 is connected to the equipment housing 1. A loading platform 62 is connected to the loading shell 61, and a loading elevator 63 is arranged inside the loading shell 61. A loading window 64 is arranged on the loading shell 61, so that the loading platform 62 is communicated with the inside of the equipment shell 1, and a loading door 65 that can be opened and closed is arranged on the loading window 64. The loading door 65 is connected to the movable end of the loading elevator 63. The loading door 65 is raised or lowered to a preset position by the loading elevator 63 to facilitate the operation of the transport robot unit 2; the side of the loading window 64 is provided with a slide groove that is compatible with the side of the loading door 65.

[0094] When the loading door 65 is opened, the transport robot unit 2 can transport the wafers in the wafer transfer box on the loading platform 62 through the loading window 64 .

[0095] In one embodiment, if Figure 2-Figure 3 As shown, it also includes a wafer temporary storage unit 7, which is arranged in the equipment housing 1; the wafer temporary storage unit 7 prevents the wafer from being deformed during the transportation process of the transportation robot unit 2.

[0096] In one embodiment, if Figure 1-Figure 2 As shown, it also includes an air purifier 10, which is arranged on the device housing 1. The air purifier 10 is used to filter the air entering the device housing 1. It should be noted that the structure and operation of the air purifier 10 are both existing technologies and will not be repeated here.

[0097] In one embodiment, if Figure 5As shown, the handling robot unit 2 includes a wafer handling robot 21 and a robot lateral movement assembly 22, and the robot lateral movement assembly 22 is arranged in the equipment housing 1; the wafer handling robot 21 is a prior art, such as: a handling robot disclosed in patent publication number CN115083993A, and its structure is not repeated; the bottom of the wafer handling robot 21 is connected to the robot lateral movement assembly 22; the robot lateral movement assembly 22 includes a lateral movement base 221 connected to the equipment housing 1, and the lateral movement base 221 is slidably connected to the lateral movement slider 22 2. The bottom of the wafer handling robot 21 is connected to the transverse slider 222; a transverse screw is rotatably connected to the transverse base 221, one end of which is connected to a transverse driving unit provided on the transverse base 221, and the transverse driving unit is a motor, which is a prior art and will not be described in detail; a transverse nut is threadedly connected to the transverse screw, and the transverse slider 222 is connected to the transverse nut, and the transverse screw is driven to rotate by the transverse driving unit, so that the transverse slider 222 moves on the transverse base 221, thereby realizing the movement of the wafer handling robot 21.

[0098] In one embodiment, if Figure 6-Figure 7 As shown, the degumming unit 3 includes a degumming shell 31, which is arranged in the equipment shell 1; a degumming window 32 is opened on the degumming shell 31 for the manipulator 211 of the wafer handling robot 21 to enter, and a UV lamp group 33 is arranged in the degumming shell 31 for degumming the wafer film; a working port 35 is provided on the side of the degumming shell 31, and a degumming box door 34 is provided on the working port 35, and the degumming box door 34 is opened to put an instrument to measure the light intensity of the UV lamp group 33; at least one heat dissipation hole is opened on the side of the degumming shell 31, and a heat dissipation fan is provided on the heat dissipation hole for cooling and dissipating the UV lamp group 33; the manipulator 211 of the wafer handling robot 21 clamps the wafer with the wafer film and enters the degumming shell 31 from the degumming window 32, places the wafer with the wafer film under the UV lamp group 33, and degummes the wafer film through the UV lamp group 33.

[0099] In one embodiment, if Figure 6 As shown, it also includes a wafer edge-finding unit 8, and the wafer edge-finding unit 8 is arranged in the equipment housing 1. As an example, the wafer edge-finding unit 8 is arranged on the debonding unit 3, and the wafer with the wafer film first passes through the wafer edge-finding unit 8 to calibrate the wafer notch position and rotate to a preset position, and then is sent to the debonding unit 3 for debonding.

[0100] Specifically, Figure 6-Figure 7As shown, the wafer edge-finding unit 8 includes an edge-finding base plate 81, and the edge-finding base plate 81 is arranged below the disintegration shell 31. As an example, the edge-finding base plate 81 is connected to the below of the disintegration shell 31 through a support rod; a wafer edge-finder 82 is provided on the edge-finding base plate 81, and the structure and working principle of the wafer edge-finder 82 are both prior arts and are not described herein; the handling robot unit 2 places the wafer with the wafer film on the edge-finding chuck 821 of the wafer edge-finder 82, and the wafer edge-finder 82 starts to calibrate the wafer notch position and rotates to a preset position.

[0101] Furthermore, if Figure 6-Figure 7 As shown, it also includes an anti-warping unit 9, which is used to prevent the wafer from warping during the edge finding process; the anti-warping unit 9 is connected to the degumming shell 31 of the degumming unit 3; the anti-warping unit 9 includes an anti-warping cylinder 91 connected to the degumming shell 31, and the movable end of the anti-warping cylinder 91 is arranged downward; the movable end of the anti-warping cylinder 91 is connected to an anti-warping connecting plate 92, and a plurality of anti-warping pressure rods 93 are arranged on the anti-warping connecting plate 92 at intervals, and the bottom end of the anti-warping pressure rod 93 is connected to an anti-warping pressure block 94, and the anti-warping pressure block 94 is made of rubber material; while the wafer edge finder 82 is calibrated, the anti-warping cylinder 91 of the anti-warping unit 9 drives the anti-warping pressure block 94 to press down the upper surface of the wafer with the wafer film to prevent the wafer from warping during the calibration process.

[0102] In one embodiment, if Figure 8-Figure 13 As shown, the wafer handling unit 4 includes a handling base 41 slidably connected to the equipment housing 1, and the handling base 41 is movably connected to the equipment housing 1 through a handling connecting plate 42; the handling base 41 is connected to the handling connecting plate 42; a handling guide rail 43 is provided on the handling connecting plate 42, and a handling slider 44 is slidably connected to the handling guide rail 43, and the handling base 41 is connected to the handling slider 44; the handling base 41 can move relative to the equipment housing 1 through the cooperation of the handling slider 44 and the handling guide rail 43; a handling lead screw 45 is rotatably connected to the handling connecting plate 42, and the axial direction of the handling lead screw 45 is aligned with the handling guide The moving direction of the rail 43 is parallel; both ends of the transport screw 45 are rotatably connected to the transport connecting plate 42 through the transport bearing seat 46 respectively; one end of the transport screw 45 is connected to the movable end of the transport motor 47 provided on the transport connecting plate 42, and a transport nut 48 is threadedly connected to the transport screw 45, and the transport base 41 is connected to the transport nut 48. When the transport motor 47 works, it drives the transport screw 45 to rotate relative to the transport connecting plate 42, so that the transport nut 48 moves on the transport screw 45, thereby realizing the transport base 41 connected to the transport nut 48 to move on the transport connecting plate 42;

[0103] The transport base 41 is slidably connected with a lifting platform 49, the transport base 41 is connected with a lifting guide rail 410, the lifting guide rail 410 is connected with a lifting slider 411, and the lifting platform 49 is connected to the lifting slider 411; the lifting platform 49 is lifted up and down on the transport base 41 by the cooperation between the lifting guide rail 410 and the lifting slider 411; the transport base 41 is rotatably connected with a lifting screw rod 412, and the two ends of the lifting screw rod 412 are rotatably connected to the transport base 41 through bearing seats; the lifting screw rod 412 is threadedly connected with a lifting nut member 413, and the lifting platform 49 is connected to the lifting nut member 413 One end of the lifting screw rod 412 is connected to a lifting driven wheel 414, and a lifting motor 415 is connected to the transport base 41, and a lifting driving wheel 416 is connected to the movable end of the lifting motor 415, and a lifting synchronous belt 417 is connected between the lifting driving wheel 416 and the lifting driven wheel 414. When the lifting motor 415 works, it drives the lifting driving wheel 416 to rotate, and the lifting driving wheel 416 drives the lifting driven wheel 414 to work synchronously through the lifting synchronous belt 417, and the lifting driven wheel 414 drives the lifting screw rod 412 to rotate, and the lifting screw rod 412 drives the lifting nut 413 to move, thereby realizing the lifting platform 49 to be lifted up and down relative to the transport base 41;

[0104] It also includes a lifting support column 418, which is rotatably connected to the lifting platform 49; the upper part of the lifting support column 418 moves through the handling base 41; the lower end of the lifting support column 418 is connected to the rotating unit 419, and the upper end of the lifting support column 418 is connected to a vacuum suction cup unit 420 for adsorbing wafers; the middle part of the lifting support column 418 is rotatably connected to the handling base 41 through a bearing, and the lifting support column 418 can rotate relative to the handling base 41;

[0105] The rotating unit 419 includes a rotating motor 421 disposed on the lifting platform 49, the movable end of the rotating motor 421 is connected to a rotating driving wheel 422, the lower end of the lifting support column 418 is connected to a rotating driven wheel 423, and the rotating driving wheel 422 and the rotating driven wheel 423 are connected via a rotating synchronous belt 424; the rotating motor 421 works to drive the rotating driving wheel 422 to rotate, and the rotating driving wheel 422 drives the rotating driven wheel 423 to work via the rotating synchronous belt 424, thereby realizing the lifting support column 418 to rotate relative to the transport base 41;

[0106] like Fig.14As shown, the vacuum suction cup unit 420 includes a suction cup mounting block 425 connected to the upper end of the lifting support column 418, the suction cup mounting block 425 is connected to a chuck mounting plate 426, and the chuck mounting plate 426 is connected to a wafer chuck 427; an adsorption layer 428 is connected to the surface of the wafer chuck 427, and the adsorption layer 428 is made of a porous ceramic material, and the porous ceramic material has densely distributed pores, which can better adsorb the wafer and increase the adsorption force;

[0107] A heating groove is provided at the bottom of the chuck mounting plate 426, a heating ring 429 is connected to the heating groove, a heating ring baffle 430 is provided at the bottom of the chuck mounting plate 426, and the heating ring baffle 430 presses and fixes the heating ring 429; after the wafer is heated by the heating ring 429, it is more convenient to tear the wafer film;

[0108] A vacuum shaft mounting plate 431 is movably provided on the upper part of the lifting support column 418, and at least one vacuum hollow shaft 432 is connected to the vacuum shaft mounting plate 431, and a channel is provided in the vacuum hollow shaft 432; one end of the vacuum hollow shaft 432 is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft 432 is movably passed through the suction cup mounting block 425, the chuck mounting plate 426 and the wafer chuck 427 in sequence, and then connected to a vacuum suction cup 433, and the suction port of the vacuum suction cup 433 is slightly higher than the surface of the wafer chuck 427, so as to facilitate the suction of the wafer; a stop ring 434 for limiting the vacuum shaft mounting plate 431 is provided on the lifting support column 418 to prevent the vacuum shaft mounting plate 431 from falling onto the moving base 41;

[0109] It also includes a mounting bushing 435, which is connected to the suction cup mounting block 425, and the vacuum hollow shaft 432 moves through the mounting bushing 435, and the mounting bushing 435 protects the vacuum hollow shaft 432, making the vacuum hollow shaft 432 more stable during the lifting process;

[0110] The transfer base 41 is connected to a vacuum shaft lifting unit 436 for driving the vacuum shaft mounting plate 431 to move up and down. Fig.15 As shown, the vacuum shaft lifting unit 436 includes a vacuum shaft lifting part 437 arranged on the conveying base 41, and the vacuum shaft lifting part 437 is a motor or a cylinder, which will not be repeated; the movable end of the vacuum shaft lifting part 437 is connected to a vacuum shaft lifting block 438, and the vacuum shaft lifting block 438 is located below the vacuum shaft mounting plate 431. The vacuum shaft lifting part 437 moves to drive the vacuum shaft lifting block 438 to rise or fall, thereby making the vacuum hollow shaft 432 rise or return to the initial position relative to the wafer chuck 427; the vacuum suction cup 433 is driven by the vacuum shaft lifting unit 436 to remove the sucked wafer from the wafer chuck 427, so as to facilitate subsequent operations.

[0111] After the wafer is debonded, the transport robot unit 2 transports the wafer to the wafer temporary storage unit 7 to adsorb the wafer, and then the wafer chuck 427 of the wafer transport unit 4 rises to take the wafer and sends it to the film tearing unit 5 for film tearing;

[0112] After the wafer film is peeled off, the wafer handling unit 4 transports the wafer to the wafer temporary storage unit 7 for code reading. The wafer after code reading is lifted up by the vacuum hollow shaft 432 of the wafer handling unit 4, and then the handling robot unit 2 lifts up the wafer and puts it back into the wafer transfer box. When the handling robot unit 2 lifts up the wafer, the wafer temporary storage unit 7 prevents the wafer from warping.

[0113] like Figure 16-Figure 17 As shown, the wafer temporary storage unit 7 includes a temporary storage connection frame 71, and the temporary storage connection frame 71 is connected to the equipment housing 1; a code reader 72 is provided on the temporary storage connection frame 71, and the function of the code reader 72 is to read the code on the wafer so as to record whether the wafer has completed film tearing; it should be noted that the structure and working principle of the code reader 72 are both existing technologies and are not repeated here; a temporary storage chuck 73 is connected to the temporary storage connection frame 71, and a temporary storage suction cup 74 is connected to the temporary storage chuck 73, and the temporary storage suction cup 74 is connected to the vacuum generator; after the wafer is debonded, the transport robot unit 2 transports the wafer to the temporary storage suction cup 74 of the wafer temporary storage unit 7 to adsorb the wafer, and then the wafer chuck 427 of the wafer transport unit 4 rises to take over the wafer and sends it to the film tearing unit 5 for film tearing;

[0114] The wafer temporary storage unit 7 also includes a temporary storage lifting cylinder 75 arranged on the temporary storage connecting frame 71, and the movable end of the temporary storage lifting cylinder 75 is connected to a temporary storage mounting plate 76, and at least one temporary storage pressure rod 77 is connected to the temporary storage pressure rod 77, and a temporary storage pressure block 78 is connected to the temporary storage pressure rod 77, and the temporary storage pressure block 78 is made of rubber material; after the wafer film is peeled off, the wafer handling unit 4 transports the wafer to the barcode reader 72 of the wafer temporary storage unit 7 for barcode reading, and the wafer after barcode reading is lifted by the vacuum hollow shaft 432 of the wafer handling unit 4, and then the handling robot unit 2 lifts the wafer and puts it back into the wafer transfer box. When the handling robot unit 2 lifts the wafer, the temporary storage pressure block 78 of the wafer temporary storage unit 7 presses down the wafer to prevent the wafer from warping.

[0115] In one embodiment, if Figure 18-Figure 20 As shown, the film tearing unit 5 includes a first film sticking mechanism 501 and a first film clamping mechanism 502. The first film sticking mechanism 501 sticks a hot melt adhesive film on the wafer film of the wafer on the wafer transport unit 4, and the first film clamping mechanism 502 clamps the hot melt adhesive film and moves it to a preset position to tear the wafer film of the wafer.

[0116] Furthermore, if Figure 21-23As shown, the first film pasting mechanism 501 includes a first film pasting base 5011 connected to the device housing 1, a first film pasting roller 5012 is rotatably connected to the first film pasting base 5011, a first film pasting motor 5013 is connected to the first film pasting base 5011, a first film pasting driving wheel 5014 is connected to the movable end of the first film pasting motor 5013, a first film pasting driven wheel 5015 is connected to one end of the first film pasting roller 5012, and the first film pasting driving wheel 5014 and the first film pasting driven wheel 5015 are connected by a first film pasting synchronous belt; a hot melt adhesive film is connected to the first film pasting roller 5012, and the first film pasting motor 5013 drives the first film pasting roller 5012 to release the hot melt adhesive film on the first film pasting roller 5012 at a preset speed;

[0117] The first film laminating base 5011 is rotatably connected with a first winding driven roller 5016 and a second winding driven roller 5017. The center of the first winding driven roller 5016 is located to the lower right of the center of the first film rolling roller 5012, and the center of the second winding driven roller 5017 is located to the lower left of the center of the first winding driven roller 5016.

[0118] A first outlet channel 5018 is formed on the first film laminating base 5011, and the movable end of the hot melt adhesive film is sequentially wound around the first winding driven roller 5016 and the second winding driven roller 5017, and movably passes through the first outlet channel 5018; a first side push cylinder 5019 is provided on the first film laminating base 5011, and the movable end of the first side push cylinder 5019 is connected to a first side push plate 50110, and the first side push plate 50110 is movably arranged in the first outlet channel 5018 to push the hot melt adhesive film in the first outlet channel 5018 to a preset position;

[0119] The first outlet channel 5018 includes a first outlet groove 50181 arranged on the first film-sticking base 5011; a first pressing groove block 50182 is arranged above the first outlet groove 50181, and the first pressing groove block 50182 is connected to the movable end of the first pressing groove cylinder 50183 arranged on the first film-sticking base 5011, and the first pressing groove block 50182 is pressed on the notch of the first outlet groove 50181. Such a design facilitates the installation and limiting of the hot-melt adhesive film in the first outlet groove 50181.

[0120] Furthermore, the first film laminating base 5011 is provided with a first film laminating cylinder 50111, and a movable end of the first film laminating cylinder 50111 is connected to a first film laminating block 50112.

[0121] The first film-sticking base 5011 is provided with a first film-cutting assembly, which is used to cut the hot-melt adhesive film. The first film-cutting assembly includes a first film-cutting cylinder 50115 connected to the first film-sticking base 5011, and a first blade 50116 is connected to the movable end of the first film-cutting cylinder 50115. The first film-pressing block 50112 and the first film-sticking base 5011 are respectively provided with a cutting clearance groove 50117 for the first blade 50116 to cut. After the hot-melt adhesive film is firmly adhered, the first heating lifting cylinder 50113 rises upward, and the first blade 50116 is pushed out by the first film-cutting cylinder 50115 to cut the hot-melt adhesive film.

[0122] The first film pressing block 50112 presses the hot melt adhesive film coming out of the first outlet channel 5018 onto the cutting clearance groove 50117 to facilitate the first blade 50116 to cut the hot melt adhesive film.

[0123] Before the first film pressing block 50112 moves, the hot melt adhesive film needs to be heated to increase its viscosity; the first film pasting base 5011 is provided with a first heating lifting cylinder 50113, and the movable end of the first heating lifting cylinder 50113 is connected to a first heater 50114, and the first heater 50114 heats the hot melt adhesive film coming out of the first outlet channel 5018, fixes the hot melt adhesive film on the wafer film and heats it to make it stick to the wafer film, and when the hot melt adhesive film is heated, the first film pressing block 50112 pushes out and presses the hot melt adhesive film downward through the first film pressing cylinder 50111.

[0124] Specifically, Figure 24-25 As shown, the first film clamping mechanism 502 is located below the first film laminating mechanism 501; the first film clamping mechanism 502 includes a first film feeding roller 5021 rotatably connected to the device housing 1, one end of the first film feeding roller 5021 is connected to a first film feeding roller driven wheel 5022, the device housing 1 is provided with a first film feeding roller motor 5023, the movable end of the first film feeding roller motor 5023 is connected to a first film feeding roller driving wheel 5024, and the first film feeding roller driven wheel 5022 and the first film feeding roller driving wheel 5024 are connected via a first film feeding roller synchronous belt 5025;

[0125] The first film clamping mechanism 502 also includes a first film feeding roller 5026 movably connected to the device housing 1, the first film feeding roller 5026 is rotatably connected to the first film feeding bracket 5027, and the first film feeding bracket 5027 is slidably connected to the device housing 1 through the cooperation of the slide rail and the slider; the device housing 1 is provided with a first film feeding roller cylinder 5028, the movable end of the first film feeding roller cylinder 5028 is connected to the first film feeding bracket 5027, and the first film feeding roller The cylinder 5028 enables the first film feeding support 5027 to drive the first film feeding roller 5026 to move closer to or farther from the first film feeding roller 5021, and the cut hot melt adhesive film is pressed tightly under the cooperation of the first film feeding roller 5021 and the first film feeding roller 5026. During the rotation of the first film feeding roller 5021, the cut hot melt adhesive film is rolled up, and a gap for the wafer film to pass through is formed between the first film feeding roller 5021 and the first film feeding roller 5026, so as to facilitate the passing of the wafer film.

[0126] The first film clamping mechanism 502 also includes a first clamping assembly movably connected to the equipment housing 1, the first clamping assembly clamps the hot melt adhesive film and pulls it out from the first outlet channel 5018, and then the first heater 50114 presses the hot melt adhesive film down to the wafer film to heat and stick it firmly, and then the first film pressing block 50112 presses down to press the hot melt adhesive film, after the heating is completed, the first heater 50114 rises, the first blade 50116 cuts the hot melt adhesive film, and then the first film feed roller 5026 approaches the first film feeding roller 5021 to press the cut hot melt adhesive film, the first clamping assembly moves to the right, and the wafer handling unit 4 moves to the left to tear the film, thereby realizing the film tearing operation of the hot melt adhesive film sticking to the wafer film; while tearing the film, the first cleaning member 5029 on the equipment housing 1 cleans the surface of the wafer.

[0127] Furthermore, if Fig.29 and Fig.30 As shown, the first cleaning member 5029 includes a cleaning member body 50291, and the cleaning member body 50291 is connected to the device housing 1; an adsorption chamber 50292 is provided at the bottom of the cleaning member body 50291, and the cavity opening of the adsorption chamber 50292 matches the surface of the wafer, and an air inlet channel 50293 and an exhaust channel 50294 are provided on the cleaning member body 50291, and the exhaust channel 50294 is connected to the inner bottom of the adsorption chamber 50292; the air inlet channel 50293 runs through the cleaning member body 50291, and the air outlet of the air inlet channel 50293 forms a preset angle with the horizontal plane. When in use, the air inlet channel 50293 blows air to blow up the dust on the surface of the wafer; the exhaust channel 50294 sucks air to suck the blown dust out of the adsorption chamber 50292, so as to achieve the surface cleaning of the wafer.

[0128] Further, the first clamping assembly includes a first clamping bracket 50210, which is slidably connected to the device housing 1 through the cooperation of a slide rail and a slider; the first clamping bracket 50210 is connected to the movable end of a mobile power unit provided on the device housing 1; the mobile power unit is a cylinder or a motor, which will not be repeated; a first clamping groove 50211 is formed on the first clamping bracket 50210, a first clamping cylinder 50212 is connected in the first clamping groove 50211, and a first clamping block 50213 is connected to the movable end of the first clamping cylinder 50212, and the first clamping block 50213 cooperates with the first clamping groove 50211,

[0129] The film tearing action of the first film sticking mechanism 501 is as follows: the first clamping block 50213 of the first clamping assembly cooperates with the first clamping groove 50211 to first clamp the hot melt adhesive film and pull it out from the first outlet channel 5018, and then the first heater 50114 presses the hot melt adhesive film down to the wafer film to heat and stick it firmly, and then the first film pressing block 50112 presses down to press the hot melt adhesive film, and after the heating is completed, the first heater 50114 rises, the first blade 50116 cuts the hot melt adhesive film, and then the first film feeding roller 5026 approaches the first film feeding roller 5021 to press the cut hot melt adhesive film, the first clamping assembly moves to the right, and the wafer handling unit moves to the left to tear the film; after the film tearing is completed, the first clamping block 50213 releases the waste film, and the waste film falls into the waste film box provided on the equipment housing 1, and then the first film clamping mechanism 502 returns to the initial position, and the wafer handling unit 4 transports the wafer to the next process.

[0130] In one embodiment, if Figure 26-Figure 28 As shown, the film tearing unit 5 includes a film tearing base 51 arranged on the equipment shell 1, and the film tearing base 51 is provided with a film supply assembly 52 and a waste film recovery assembly 53. The film supply assembly 52 includes a film supply roller 521 rotatably connected to the film tearing base 51, and the film tearing base 51 is connected to a film supply roller motor 522, and the movable end of the film supply roller motor 522 is connected to the film supply roller 521, so as to drive the film supply roller 521 to rotate relative to the film tearing base 51; the movable end of the film supply roller motor 522 is connected to a film supply roller driving wheel, and one end of the film supply roller 521 is connected to a film supply roller driven wheel; the film supply roller driving wheel and the film supply roller driven wheel are connected by a film supply roller synchronous belt; the film tearing base 51 is rotatably connected to a first film supply driven roller 57, and the first film supply driven roller 57 is located at the lower right of the film supply roller 521;

[0131] The waste film recovery component 53 includes a waste film recovery roller 531 disposed on the film tearing base 51, and a waste film recovery roller motor is disposed on the film tearing base 51. The movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller 531, driving the waste film recovery roller 531 to wind the waste film; a waste film recovery driven roller 532 is rotatably connected to the film tearing base 51, and the waste film recovery driven roller 532 is located below the waste film recovery roller 531;

[0132] The film-tearing base 51 is provided with a film pressing assembly 54, and the film pressing assembly 54 is located between the film supply assembly 52 and the waste film recovery assembly 53; the film pressing assembly 54 includes a film pressing base 541 connected to the film-tearing base 51, and the film pressing base 541 is connected to the movable end of a film pressing power unit 545 provided on the film-tearing base 51, and the film pressing power unit 545 is a cylinder or a motor; the bottom of the film pressing base 541 is connected to a film-tearing pressing plate 542, and the film-tearing pressing plate 542 is arranged at a preset angle with the horizontal plane, so that one end of the film-tearing pressing plate 542 can cooperate with the wafer film of the wafer on the wafer handling unit 4;

[0133] The film pressing base 541 is provided with a first waste film driven roller 543, and the first waste film driven roller 543 is located above the film tearing pressure plate 542; the film pressing base 541 is provided with a second waste film driven roller 544, and the second waste film driven roller 544 is located behind the first waste film driven roller 543; the film supply roller 521 is connected with a cylindrical film tearing tape 55, and the movable end of the film tearing tape 55 passes through the first film supply driven roller 57, the second waste film driven roller 544, the film tearing pressure plate 542 and the first waste film driven roller 543 in sequence, and is connected to the waste film recovery roller 531 to realize film supply and film collection at the same time.

[0134] The wafer handling unit 4 drives the wafer to move to the bottom of the film tearing pressure plate 542, and the wafer handling unit 4 rises upward until the wafer film of the wafer touches the film tearing tape 55 at the bottom of the film tearing pressure plate 542, and the film tearing tape 55 is bonded to the wafer film of the wafer through the pressure formed between the film tearing pressure plate 542 and the wafer handling unit 4; then the wafer handling unit 4 moves to the right, and at the same time, the film supply roller 521 rotates to supply the film tearing tape 55, and the waste film recovery roller 531 rotates to recover the waste film, and the film tearing tape 55 tears up the wafer film and tears off the entire wafer film at a uniform speed, and then the wafer handling unit 4 moves to the bottom of the first cleaning member 5029 on the equipment housing 1 to clean the surface of the wafer. After the surface of the wafer is cleaned, the wafer handling unit 4 transports the wafer to the next process.

[0135] In one embodiment, it also includes a pressure roller assembly 56, which is located below the waste film recovery assembly 53; the pressure roller assembly 56 applies a preset pressure to the film-tearing tape 55, so that the film-tearing tape 55 has a preset tension, which facilitates the film-tearing tape 55 to tear the film; the pressure roller assembly 56 includes a pressure roller 561, and the pressure roller 561 is rotatably connected to a pressure roller bracket 562, and the pressure roller bracket 562 is connected to the pressure roller disposed on the film-tearing base 51. The movable ends of the power unit 563 are connected, and the pressure roller power unit 563 is a motor or a cylinder. The pressure roller power unit 563 drives the pressure roller 561 to move laterally to form a preset pressure on the film tearing tape 55; the film tearing base 51 is rotatably connected with a passive limiting roller 564, and the passive limiting roller 564 and the pressure roller 561 are on the same plane. There is a preset interval between the passive limiting roller 564 and the pressure roller 561, and the film tearing tape 55 passes through this preset interval.

[0136] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0137] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0138] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0139] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0140] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0141] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0142] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A fully automatic wafer film peeling device, characterized in that: It includes: Equipment housing; A transport robot unit is disposed in the equipment housing, and the transport robot unit takes the wafer out of the wafer transfer box and delivers it to a preset position; The debonding unit is arranged in the equipment housing; the transport robot unit sends the wafer to the debonding unit to debond the wafer film; The wafer handling unit is arranged in the equipment housing; the handling robot unit delivers the wafer after debonding to the wafer handling unit; The film-tearing unit is arranged in the equipment housing; it is used to tear the film of the wafer on the wafer handling unit; the handling robot unit delivers the wafer after the film is torn to a preset position; It also includes a wafer temporary storage unit, which is arranged in the equipment housing; After the wafer is debonded, the transport robot unit transports the wafer to the wafer temporary storage unit to adsorb the wafer, and then the wafer chuck of the wafer transport unit rises to take the wafer and sends it to the film tearing unit for film tearing; After the wafer film is peeled off, the wafer handling unit transports the wafer to the wafer temporary storage unit for code reading. After code reading, the wafer is lifted up by the vacuum hollow shaft of the wafer handling unit, and then the handling robot unit lifts the wafer and puts it back into the wafer transfer box. When the handling robot unit lifts the wafer, the wafer temporary storage unit prevents the wafer from warping.

2. The fully automatic wafer film peeling device according to claim 1, characterized in that: The wafer temporary storage unit includes a temporary storage connection frame, which is connected to the equipment housing; a code reader is provided on the temporary storage connection frame; a temporary storage chuck is connected to the temporary storage chuck, and a temporary storage suction cup is connected to the temporary storage chuck, and the temporary storage suction cup is connected to a vacuum generator; after the debonding of the wafer is completed, the transport robot unit transports the wafer to the temporary storage suction cup of the wafer temporary storage unit to adsorb the wafer, and then the wafer chuck of the wafer transport unit rises to take over the wafer and sends it to the film tearing unit for film tearing.

3. The fully automatic wafer film peeling device according to claim 2, characterized in that: The wafer temporary storage unit also includes a temporary storage lifting cylinder arranged on the temporary storage connecting frame, the movable end of the temporary storage lifting cylinder is connected to a temporary storage mounting plate, the temporary storage mounting plate is connected to at least one temporary storage pressure rod, the temporary storage pressure rod is connected to a temporary storage pressure block, and the temporary storage pressure block is made of rubber material; after the wafer film is peeled off, the wafer handling unit transports the wafer to the barcode reader of the wafer temporary storage unit for barcode reading, and the wafer after barcode reading is lifted up by the vacuum hollow shaft of the wafer handling unit, and then the handling robot unit lifts the wafer and puts it back into the wafer transfer box, and when the handling robot unit lifts the wafer, the temporary storage pressure block of the wafer temporary storage unit presses down the wafer to prevent the wafer from warping.

4. The fully automatic wafer film peeling device according to claim 1, characterized in that: It also includes a wafer carrying unit, which includes a loading shell, the loading shell is connected to the equipment shell, a loading platform is movably connected to the loading shell, a loading elevator is arranged in the loading shell, a loading window is arranged on the loading shell, so that the loading platform is communicated with the equipment shell, and a loading door that can be opened and closed is arranged on the loading window; the loading door is connected to the movable end of the loading elevator, and the loading door is raised or lowered to a preset position by the loading elevator.

5. The fully automatic wafer film peeling device according to claim 1, characterized in that: The handling robot unit includes a wafer handling robot and a robot transverse movement assembly, the robot transverse movement assembly is arranged in the equipment housing; the bottom of the wafer handling robot is connected to the robot transverse movement assembly; the robot transverse movement assembly includes a transverse movement base connected to the equipment housing, the transverse movement base is slidably connected to the transverse movement slider, and the bottom of the wafer handling robot is connected to the transverse movement slider; a transverse movement screw is rotatably connected to the transverse movement base, one end of the transverse movement screw is connected to the transverse movement driving part arranged on the transverse movement base; a transverse movement nut is threadedly connected to the transverse movement screw, and the transverse movement slider is connected to the transverse movement nut.

6. The fully automatic wafer film peeling device according to claim 1, characterized in that: The degumming unit includes a degumming shell, which is arranged in the equipment shell; a degumming window is opened on the degumming shell for the manipulator of the wafer handling robot to enter, and a UV lamp group is arranged in the degumming shell; a working port is arranged on the side of the degumming shell, and a degumming box door is arranged on the working port; at least one heat dissipation hole is opened on the side of the degumming shell, and a heat dissipation fan is arranged on the heat dissipation hole.

7. The fully automatic wafer film peeling device according to claim 6, characterized in that: It also includes a wafer edge-finding unit, which is arranged in the equipment housing and on the debonding unit. The wafer with the wafer film first passes through the wafer edge-finding unit to calibrate the wafer notch position and rotate to a preset position, and then is sent to the debonding unit for debonding; The wafer edge-finding unit includes an edge-finding base plate, which is arranged below the disintegration shell; a wafer edge-finder is arranged on the edge-finding base plate, and the handling robot unit places the wafer with the wafer film on the edge-finding chuck of the wafer edge-finder, and the wafer edge-finder starts to calibrate the wafer notch position and rotates to a preset position.

8. The fully automatic wafer film peeling device according to claim 7, characterized in that: It also includes an anti-warping unit, which is connected to the degumming shell of the degumming unit; the anti-warping unit includes an anti-warping cylinder connected to the degumming shell, and the movable end of the anti-warping cylinder is arranged downward; the movable end of the anti-warping cylinder is connected to an anti-warping connecting plate, and a plurality of anti-warping pressure rods are arranged on the anti-warping connecting plate at intervals, and the bottom end of the anti-warping pressure rod is connected to an anti-warping pressure block, and the anti-warping pressure block is made of rubber material; while the wafer edge finder is calibrated, the anti-warping cylinder of the anti-warping unit drives the anti-warping pressure block to press down the upper surface of the wafer with the wafer film.

9. The fully automatic wafer film peeling device according to claim 1, characterized in that: The wafer handling unit includes a handling base slidably connected to the equipment housing, and the handling base is movably connected to the equipment housing through a handling connecting plate; the handling base is connected to the handling connecting plate; a handling guide rail is provided on the handling connecting plate, and a handling slider is slidably connected to the handling guide rail, and the handling base is connected to the handling slider; the handling base can move relative to the equipment housing through the cooperation of the handling slider and the handling guide rail; a handling screw is rotatably connected to the handling connecting plate, and the axial direction of the handling screw is parallel to the moving direction of the handling guide rail; both ends of the handling screw are rotatably connected to the handling connecting plate through a handling bearing seat; one end of the handling screw is connected to the movable end of the handling motor provided on the handling connecting plate, a handling nut member is threadedly connected to the handling screw, and the handling base is connected to the handling nut member; The carrying base is slidably connected with a lifting platform, the carrying base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting slider, and the lifting platform is connected to the lifting slider; the lifting platform is lifted up and down on the carrying base through the cooperation of the lifting guide rail and the lifting slider; a lifting screw rod is rotatably connected to the carrying base, and both ends of the lifting screw rod are rotatably connected to the carrying base through bearing seats; a lifting nut piece is threadedly connected to the lifting screw rod, and the lifting platform is connected to the lifting nut piece; one end of the lifting screw rod is connected to a lifting driven wheel, and the carrying base is connected to a lifting motor, and the movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel; It also includes a lifting support column, which is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum suction cup unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base through a bearing, and the lifting support column can rotate relative to the handling base; The rotating unit comprises a rotating motor arranged on the lifting platform, the movable end of the rotating motor is connected to a rotating driving wheel, the lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected through a rotating synchronous belt.

10. The fully automatic wafer film peeling device according to claim 9, characterized in that: The vacuum suction cup unit comprises a suction cup mounting block connected to the upper end of the lifting support column, the suction cup mounting block is connected to a chuck mounting plate, a wafer chuck is connected to the chuck mounting plate, and an adsorption layer is connected to the surface of the wafer chuck, and the adsorption layer is made of a porous ceramic material; A heating groove is provided at the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is provided at the bottom of the chuck mounting plate, and the heating ring baffle presses and fixes the heating ring; A vacuum shaft mounting plate is movably provided on the upper part of the lifting support column, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided in the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is movably passed through the suction cup mounting block, the chuck mounting plate and the wafer chuck in sequence, and then connected to the vacuum suction cup, and the suction port of the vacuum suction cup is slightly higher than the surface of the wafer chuck; a stop ring for limiting the vacuum shaft mounting plate is provided on the lifting support column; It also includes a mounting bushing, which is connected to the suction cup mounting block, and the vacuum hollow shaft movably passes through the mounting bushing; The transport base is connected with a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to rise and fall.

11. The fully automatic wafer film peeling device according to claim 10, characterized in that: The vacuum shaft lifting unit comprises a vacuum shaft lifting part arranged on a handling base; a movable end of the vacuum shaft lifting part is connected with a vacuum shaft lifting block, and the vacuum shaft lifting block is located below a vacuum shaft mounting plate.

12. The fully automatic wafer film peeling device according to claim 1, characterized in that: The film tearing unit includes a first film sticking mechanism and a first film clamping mechanism. The first film sticking mechanism sticks a hot melt adhesive film on the wafer film of the wafer on the wafer transport unit. The first film clamping mechanism clamps the hot melt adhesive film and moves it to a preset position to tear the wafer film of the wafer.

13. The fully automatic wafer film peeling device according to claim 12, characterized in that: The first film pasting mechanism comprises a first film pasting base connected to the equipment housing, a first film rolling roller is rotatably connected to the first film pasting base, a first film pasting motor is connected to the first film pasting base, a first film pasting driving wheel is connected to the movable end of the first film pasting motor, a first film pasting driven wheel is connected to one end of the first film pasting roller, and the first film pasting driving wheel and the first film pasting driven wheel are connected by a first film pasting synchronous belt; a hot melt adhesive film is connected to the first film rolling roller; A first winding driven roller and a second winding driven roller are rotatably connected to the first film laminating base, the center of the first winding driven roller is located to the lower right of the center of the first film winding roller, and the center of the second winding driven roller is located to the lower left of the center of the first winding driven roller; A first outlet channel is formed on the first film laminating base, and the movable end of the hot melt adhesive film is sequentially wound around the first winding driven roller and the second winding driven roller, and moves through the first outlet channel; a first side push cylinder is provided on the first film laminating base, and the movable end of the first side push cylinder is connected to a first side push plate, and the first side push plate is movably arranged in the first outlet channel to push the hot melt adhesive film in the first outlet channel to a preset position; The first outlet channel includes a first outlet groove arranged on the first film-sticking base; a first groove pressing block is arranged above the first outlet groove, the first groove pressing block is connected to the movable end of the first groove pressing cylinder arranged on the first film-sticking base, and the first groove pressing block is pressed on the groove opening of the first outlet groove.

14. The fully automatic wafer film peeling device according to claim 13, characterized in that: The first film laminating base is provided with a first film pressing cylinder, the movable end of the first film pressing cylinder is connected to a first film pressing block, and the first film pressing block presses the hot melt adhesive film coming out of the first outlet channel onto the wafer film of the wafer; The first film sticking base is provided with a first heating lifting cylinder, and the movable end of the first heating lifting cylinder is connected with a first heater. The first heater heats the hot melt adhesive film coming out of the first outlet channel, and heats the hot melt adhesive film to make it stick to the wafer film. When the hot melt adhesive film is heated, the first film pressing block is pushed out by the first film pressing cylinder to press the hot melt adhesive film downward.

15. The fully automatic wafer film peeling device according to claim 14, characterized in that: The first film cutting assembly is provided on the first film sticking base, and the first film cutting assembly is used to cut the hot melt adhesive film. The first film cutting assembly includes a first film cutting cylinder connected to the first film sticking base, and the movable end of the first film cutting cylinder is connected to the first blade. The first film pressing block and the first film sticking base are respectively provided with a cutting clearance groove for the first blade to cut.

16. The fully automatic wafer film peeling device according to claim 15, characterized in that: The first film clamping mechanism is located below the first film sticking mechanism; the first film clamping mechanism comprises a first film feeding roller rotatably connected to the device housing, one end of the first film feeding roller is connected to a first film feeding roller driven wheel, a first film feeding roller motor is provided on the device housing, a movable end of the first film feeding roller motor is connected to a first film feeding roller driving wheel, and the first film feeding roller driven wheel and the first film feeding roller driving wheel are connected via a first film feeding roller synchronous belt; The first film clamping mechanism also includes a first film feeding roller movably connected to the device housing, the first film feeding roller is rotatably connected to the first film feeding bracket, and the first film feeding bracket is slidably connected to the device housing; a first film feeding roller cylinder is provided on the device housing, and the movable end of the first film feeding roller cylinder is connected to the first film feeding bracket, and the cut hot melt adhesive film is pressed under the cooperation of the first film feeding roller and the first film feeding roller. During the rotation of the first film feeding roller, the cut hot melt adhesive film is rolled up, and a gap for the wafer film to pass through is formed between the first film feeding roller and the first film feeding roller; The first film clamping mechanism also includes a first clamping assembly movably connected to the device housing, the first clamping assembly clamps the hot-melt adhesive film and pulls it out from the first outlet channel, and then the first heater presses the hot-melt adhesive film down to the wafer film to heat and stick it firmly, and then the first film pressing block presses the hot-melt adhesive film, after the heating is completed, the first heater rises, the first blade cuts the hot-melt adhesive film, and then the first film feed roller axis approaches the first film delivery roller axis to press the cut hot-melt adhesive film, the first clamping assembly moves to the right, and the wafer handling unit moves to the left to tear the film.

17. The fully automatic wafer film peeling device according to claim 1, characterized in that: A first cleaning member is provided on the device housing.

18. The fully automatic wafer film peeling device according to claim 16, characterized in that: The first clamping assembly includes a first clamping bracket, which is slidably connected to the equipment housing; the first clamping bracket is connected to the movable end of the mobile power unit provided on the equipment housing; a first clamping groove is formed on the first clamping bracket, a first clamping cylinder is connected in the first clamping groove, a first clamping block is connected to the movable end of the first clamping cylinder, and the first clamping block cooperates with the first clamping groove.

19. The fully automatic wafer film peeling device according to claim 1, characterized in that: The film tearing unit includes a film tearing base arranged on the equipment shell, and the film tearing base is provided with a film supply assembly and a waste film recovery assembly, and the film supply assembly includes a film supply roller shaft rotatably connected to the film tearing base, and the film tearing base is connected to a film supply roller shaft motor, and the movable end of the film supply roller shaft motor is connected to the film supply roller shaft, driving the film supply roller shaft to rotate relative to the film tearing base; the movable end of the film supply roller shaft motor is connected to a film supply roller shaft driving wheel, and one end of the film supply roller shaft is connected to a film supply roller shaft driven wheel; the film supply roller shaft driving wheel and the film supply roller shaft driven wheel are connected by a film supply roller shaft synchronous belt; the film tearing base is rotatably connected to a first film supply driven roller shaft, and the first film supply driven roller shaft is located at the lower right of the film supply roller shaft; The waste film recovery component includes a waste film recovery roller arranged on a film tearing base, a waste film recovery roller motor is arranged on the film tearing base, the movable end of the waste film recovery roller motor is connected to one end of the waste film recovery roller, and drives the waste film recovery roller to wind the waste film; a waste film recovery driven roller is rotatably connected to the film tearing base, and the waste film recovery driven roller is located below the waste film recovery roller; The film-tearing base is provided with a film pressing assembly, and the film pressing assembly is located between the film supply assembly and the waste film recovery assembly; the film pressing assembly includes a film pressing base connected to the film-tearing base, and the film pressing base is connected to the movable end of the film pressing power part provided on the film-tearing base, and the bottom of the film pressing base is connected with a film-tearing pressing plate, and the film-tearing pressing plate is arranged at a preset angle with the horizontal plane; The film pressing base is provided with a first waste film driven roller, which is located above the film tearing pressure plate; the film pressing base is provided with a second waste film driven roller, which is located behind the first waste film driven roller; the film supply roller is connected with a cylindrical film tearing tape, and the movable end of the film tearing tape is connected to the waste film recovery roller after passing through the first film supply driven roller, the second waste film driven roller, the film tearing pressure plate and the first waste film driven roller in sequence; The wafer handling unit drives the wafer to move under the film tearing plate, and the wafer handling unit makes the wafer film of the wafer touch the film tearing tape at the bottom of the film tearing plate, through the pressure formed between the film tearing plate and the wafer handling unit; then the wafer handling unit moves to the right, and at the same time the film supply roller rotates to supply the film tearing tape, and the waste film recovery roller rotates to recover the waste film.

20. The fully automatic wafer film peeling device according to claim 19, characterized in that: It also includes a pressure roller assembly, which is located below the waste film recovery assembly; the pressure roller assembly applies a preset pressure to the film tearing tape, so that the film tearing tape has a preset tension, which facilitates film tearing with the film tearing tape; the pressure roller assembly includes a pressure roller, which is rotatably connected to a pressure roller bracket, and the pressure roller bracket is connected to the movable end of a pressure roller power unit arranged on a film tearing base; a passive limiting roller is rotatably connected to the film tearing base, and the passive limiting roller and the pressure roller are on the same plane, and there is a preset interval between the passive limiting roller and the pressure roller.

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