Electronic component processing support leg crimping device

Abstract

The invention discloses an electronic component processing support leg crimping device, and relates to the technical field of circuit board production, the electronic component processing support leg crimping device comprises a base and a support mounted on the top of the base, and further comprises a rotary table, and the top of the rotary table is provided with a plurality of positioning grooves; the preheating mechanism is used for preheating the chip mounting position of the circuit board; the tin coating mechanism is used for coating tin paste at a chip mounting position along a rectangular track; the positioning and crimping mechanism is used for positioning, pressing and welding the chip; the pin correction mechanism is used for correcting pins on the chip when the chip is positioned; according to the electronic component processing supporting foot crimping device, firstly, center positioning is automatically carried out on a chip, then, the bottom end of a welding air pipe is pressed down on the top of the chip, the problem that a chip pin tilts and the circuit connection area of a circuit board is small is solved, the chip installation quality is guaranteed, and through straightening the pin, the production efficiency is improved. And the problem that the pins are bent and cannot be accurately butted with the circuit on the circuit board is solved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a device for crimping legs for processing electronic components. Background Art

[0002] Electronic components are basic elements in electronic circuits. They are usually individually packaged and have two or more legs (pins) or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions. One of the common ways to connect electronic components is to solder them to a printed circuit board.

[0003] In the prior art, when installing a chip on a circuit board, the chip is usually placed at the corresponding position of the circuit board first, and then solder paste is applied to each pin of the chip, and finally hot air is blown to the pins for soldering. However, if the chip pins are warped or tilted, the connection area between the pins and the circuit board circuit will be small or not accurately connected, affecting the chip installation quality. Therefore, when installing the chip, a device is needed to accurately position the chip so that the chip will not be offset during hot air soldering, the pins will not be warped, and the pins can also be automatically corrected. Summary of the invention

[0004] The purpose of the present invention is to provide a device for crimping legs of electronic components to solve the above-mentioned deficiencies in the prior art.

[0005] In order to achieve the above-mentioned object, the present invention provides the following technical solution: an electronic component processing foot crimping device, comprising a base and a bracket installed on the top of the base, and also comprising: A turntable is rotatably connected to the top of the base, and a plurality of positioning grooves are provided on the top of the turntable; A preheating mechanism, which is mounted on the bracket and is used to preheat the chip mounting position of the circuit board; A tin coating mechanism, which is mounted on the bracket and is used to coat tin paste along a rectangular track at the chip mounting position; A positioning and pressing mechanism, which is connected to the preheating mechanism and is used to position, press down and weld the chip; The pin correction mechanism is connected to the positioning and crimping mechanism and is used to correct the pins on the chip when the chip is positioned.

[0006] Furthermore, a first motor is installed inside the base, and an output end of the first motor is fixedly connected to the center of the bottom of the turntable; The plurality of positioning grooves are distributed in a ring array with the first motor output end as the center.

[0007] Further, the preheating mechanism comprises a first cylinder mounted on the top of the bracket and a connecting block fixedly connected to the extended end of the first cylinder; A hot air pipe is installed at the bottom of the connecting block, and a preheating pipe is installed at one end of the hot air pipe.

[0008] Furthermore, the tin coating mechanism comprises a fixing frame mounted on the top of the bracket, a rectangular groove opened at the bottom of the fixing frame, a conduit arranged inside the rectangular groove, and an adjusting component for driving the conduit to move along a rectangular track of the rectangular groove; The interior of the conduit is slidably connected with an injection pipe.

[0009] Further, the adjustment assembly includes a second motor installed inside the fixing frame and a fixing sleeve fixedly sleeved on the outside of the output shaft of the second motor and the outside of the conduit respectively; A telescopic rod is fixedly connected between the two fixing sleeves, and a spring is provided on the outer sleeve of the telescopic rod. Two ends of the spring are respectively fixedly connected to the outer walls of the two fixing sleeves.

[0010] Furthermore, a linkage block is fixedly sleeved on the outside of the conduit, a second cylinder is installed at the bottom of the linkage block, a lifting block is fixedly connected to the extended end of the second cylinder, and the lifting block is also fixedly sleeved on the outside of the injection pipe.

[0011] Further, the positioning and crimping mechanism includes a welding air duct installed at the other end of the hot air duct and four air ducts installed on the outer wall of the welding air duct; A positioning block is slidably connected to the inner wall of the air duct, a bevel groove is provided at the bottom of the positioning block, and the lower edge of the positioning block is lower than the lower edge of the welded air duct.

[0012] Furthermore, the pin correction mechanism includes a plurality of correction slots provided inside the positioning block and an electric push rod installed on the top of the air duct; The inner wall of the correction groove is adapted to the outer wall of the chip pin; The extended end of the electric push rod is fixedly connected to the top of the positioning block through a linkage rod.

[0013] Compared with the prior art, the electronic component processing leg crimping device provided by the present invention has the following beneficial effects: 1. The tin paste is applied to the track where each pin of the chip is connected to the circuit board along a rectangular track by a tin coating mechanism, which solves the problem of manual tin coating in the prior art; 2. The chip is automatically centered first, and then the bottom of the welding duct is pressed down on the top of the chip to prevent the chip pins from warping and the circuit board circuit connection area from being small, thus ensuring the quality of chip installation; 3. By pressing the bottom end of the welding duct down on the top of the chip, each correction groove is set on the outside of each pin to straighten the pin, prevent the pin from bending and failing to accurately connect with the circuit on the circuit board, and further improve the quality of chip installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the preheating mechanism and the positioning crimping mechanism of the present invention; Figure 3 This is a schematic structural diagram of the tin coating mechanism of the present invention from a first viewing angle; Figure 4 For the present invention Figure 3 A schematic diagram of the structure enlargement in the middle; Figure 5 This is a schematic structural diagram of the tin coating mechanism of the present invention from a second viewing angle; Figure 6 It is a schematic diagram of the structure of the positioning crimping mechanism and the pin correction mechanism of the present invention; Figure 7 It is a schematic cross-sectional view of the welding air duct, the positioning crimping mechanism and the pin correction mechanism of the present invention.

[0016] Description of reference numerals: 1. Base; 2. Bracket; 3. Turntable; 4. Positioning slot; 5. First cylinder; 6. Connecting block; 7. Hot air pipe; 8. Preheating pipe; 9. Fixed frame; 10. Rectangular slot; 11. Conduit; 12. Injection pipe; 13. Second motor; 14. Fixed sleeve; 15. Telescopic rod; 16. Spring; 17. Linkage block; 18. Second cylinder; 19. Lifting block; 20. Welding air duct; 21. Air duct; 22. Positioning block; 23. Inclined slot; 24. Correction slot; 25. Electric push rod; 26. Linkage rod. DETAILED DESCRIPTION

[0017] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0018] Example: See Figure 1 - Figure 7 , a device for crimping a leg of an electronic component, comprising a base 1 and a bracket 2 mounted on the top of the base 1, and further comprising: The turntable 3 is rotatably connected to the top of the base 1. A plurality of positioning grooves 4 are provided on the top of the turntable 3. A first motor is installed inside the base 1. The output end of the first motor is fixedly connected to the center of the bottom of the turntable 3. The plurality of positioning grooves 4 are distributed in a circular array with the output end of the first motor as the center. In this embodiment, there are six positioning grooves 4. The circuit board is placed inside the left positioning groove 4 by a robot. The first motor is controlled to drive the turntable 3 to rotate clockwise in sections, and the turntable 3 pauses after each rotation of one-sixth of a circle, and the circuit board inside the positioning groove 4 is driven to rotate to the preheating station, the tinning station, the chip placement station, the positioning and crimping station and the lower board station in turn, and finally returns to the upper board station.

[0019] A preheating mechanism is installed on the bracket 2 and is used to preheat the chip mounting position of the circuit board. The preheating mechanism includes a first cylinder 5 installed on the top of the bracket 2 and a connecting block 6 fixedly connected to the extended end of the first cylinder 5; a hot air pipe 7 is installed at the bottom of the connecting block 6, and a preheating pipe 8 is installed at one end of the hot air pipe 7, and the preheating pipe 8 is also fixedly connected to the bottom of the connecting block 6; When the circuit board in the positioning groove 4 rotates to the preheating station, that is, below the preheating tube 8, the first cylinder 5 is controlled to drive the connecting block 6 to move downward, thereby driving the preheating tube 8 to move downward to above the chip mounting position, and hot air is blown to the chip mounting position through the hot air pipe 7 and the preheating pipe 8 to preheat the chip mounting position; After the preheating treatment, the first cylinder 5 is controlled to drive the connecting block 6 to move upward, thereby driving the preheating tube 8 to move upward and reset.

[0020] A tin coating mechanism, which is mounted on the bracket 2 and is used to coat tin paste along a rectangular track at the chip mounting position. The tin coating mechanism includes a fixed frame 9 mounted on the top of the bracket 2, a rectangular groove 10 opened at the bottom of the fixed frame 9, a guide tube 11 arranged inside the rectangular groove 10, and an adjustment component for driving the guide tube 11 to move along the rectangular track of the rectangular groove 10, and each corner of the rectangular groove 10 is processed by rounding; an injection tube 12 is slidably connected inside the guide tube 11, and the adjustment component includes a second motor 13 mounted inside the fixed frame 9 and a fixed sleeve 14 respectively fixedly sleeved on the outside of the output shaft of the second motor 13 and the outside of the guide tube 11; a telescopic rod 15 is fixedly connected between the two fixed sleeves 14, and a spring 16 is sleeved on the outside of the telescopic rod 15, and the two ends of the spring 16 are respectively fixedly connected to the outer walls of the two fixed sleeves 14, and a linkage block 17 is fixedly sleeved on the outside of the guide tube 11, and a second cylinder 18 is installed at the bottom of the linkage block 17, and a lifting block 19 is fixedly connected to the elongated end of the second cylinder 18, and the lifting block 19 is also fixedly sleeved on the outside of the injection tube 12; When the circuit board in the positioning groove 4 rotates to the tinning station, that is, below the injection tube 12, the lifting block 19 is driven downward by controlling the second cylinder 18, thereby driving the injection tube 12 to move downward to above the chip installation position, and the fixing sleeve 14 outside its output shaft is driven to rotate by controlling the second motor 13, and the other fixing sleeve 14 and the guide tube 11 are driven to rotate around the output shaft of the second motor 13 through the telescopic rod 15, and the other fixing sleeve 14 is always moved close to the inner wall of the rectangular groove 10 through the elastic action of the spring 16, thereby driving the guide tube 11 to move along the rectangular track, and applying the tin paste on the track where each pin of the chip is connected to the circuit board through the injection tube 12; After the tin coating is completed, the second cylinder 18 is controlled to drive the lifting block 19 to move upward, driving the injection tube 12 to slide into the guide tube 11, away from the chip installation position, and then driving the circuit board in the positioning groove 4 to rotate to the chip placement position, and the chip is placed on the corresponding installation position on the circuit board by the robot; The second motor 13 drives its output shaft to rotate clockwise or counterclockwise, which can achieve the effect of tinning along a rectangular track.

[0021] The positioning and crimping mechanism is connected to the preheating mechanism and is used to position, press down and weld the chip. The positioning and crimping mechanism includes a welding air duct 20 installed at the other end of the hot air duct 7 and four air ducts 21 installed on the outer wall of the welding air duct 20. The welding air duct 20 is fixed to the bottom of the connecting block 6. A positioning block 22 is slidably connected to the inner wall of the air duct 21. A bevel groove 23 is provided at the bottom of the positioning block 22. The lower edge of the positioning block 22 is lower than the lower edge of the welding air duct 20. When the circuit board and chip inside the positioning groove 4 are rotated to the positioning and crimping station, that is, below the welding air duct 20, the first cylinder 5 is controlled to drive the connecting block 6 to move downward, thereby driving the welding air duct 20 and the air ducts 21 outside it to move downward synchronously. When the bevel grooves 23 abut the top of the chip, the chip is automatically centered. Then the bottom end of the welding air duct 20 is pressed down on the top of the chip to prevent the chip pins from tilting and the problem of small connection area of ​​the circuit board circuit. Then hot air is introduced into the air ducts 21 through the hot air duct 7 and the welding air duct 20, and the hot air is blown to the pins of the chip. The tin paste at each pin automatically climbs the tin, so that the pins are connected to the circuit on the circuit board to achieve the welding processing of the chip pins.

[0022] The pin correction mechanism is connected to the positioning and crimping mechanism and is used to correct the pins on the chip when the chip is positioned. The pin correction mechanism includes a plurality of correction grooves 24 provided inside the positioning block 22 and an electric push rod 25 installed on the top of the air duct 21; the inner wall of the correction groove 24 is adapted to the outer wall of the chip pin; the extended end of the electric push rod 25 is fixedly connected to the top of the positioning block 22 through a linkage rod 26; While the bottom end of the welding air duct 20 is pressed down on the top of the chip, each correction groove 24 is sleeved on the outside of each pin to straighten the pin and prevent the pin from bending and failing to accurately connect with the circuit on the circuit board. When each pin is blown through the air duct 21 and the soldering begins, the electric push rod 25 is controlled to drive the linkage rod 26 to move upward, thereby driving the positioning block 22 to move upward synchronously, so that the positioning block 22 is away from the pin to avoid soldering onto the positioning block 22; After the positioning and crimping are completed, the circuit board and chip in the positioning groove 4 are rotated to the lower plate station, and the circuit board is taken out as a whole by a robot.

[0023] Working principle: when in use, the circuit board is placed inside the left positioning groove 4 by the robot, and the first motor is controlled to drive the turntable 3 to rotate one-sixth of a circle clockwise and then stop. When the circuit board inside the positioning groove 4 is rotated to the preheating position, that is, below the preheating tube 8, the first cylinder 5 is controlled to drive the connecting block 6 to move downward, and then drive the preheating tube 8 to move downward to above the chip installation position, and blow hot air to the chip installation position through the hot air pipe 7 and the preheating pipe 8 to preheat the chip installation position. After the preheating treatment, the first cylinder 5 is controlled to drive the connecting block 6 to move upward, and then drive the preheating tube 8 to move upward and reset, and then the first motor is controlled to drive the turntable 3 to rotate one-sixth of a circle clockwise and then stop, and the circuit board inside the positioning groove 4 is rotated to the coating position. When the tinning station is below the injection tube 12, the lifting block 19 is driven downward by controlling the second cylinder 18, thereby driving the injection tube 12 to move down to the top of the chip installation position, and the fixed sleeve 14 outside its output shaft is driven to rotate by controlling the second motor 13, and the other fixed sleeve 14 and the conduit 11 are driven to rotate around the output shaft of the second motor 13 through the telescopic rod 15, and the other fixed sleeve 14 is always moved along the inner wall of the rectangular groove 10 through the elastic action of the spring 16, thereby driving the conduit 11 to move along the rectangular track, and the tin paste is applied to the track where the pins of the chip are connected to the circuit board through the injection tube 12. After the tinning is completed, the second cylinder 18 is controlled to drive the lifting block 19 to move upward, driving the injection tube 12 to slide toward the inside of the conduit 11 and away from the chip. The circuit board in the positioning groove 4 is rotated to the chip placement position, and the chip is placed on the circuit board by the robot. The first motor is controlled to drive the turntable 3 to rotate one-sixth of a circle clockwise and then stop. The circuit board and chip in the positioning groove 4 are rotated to the positioning and crimping position, that is, below the welding air duct 20. The connecting block 6 is driven downward by controlling the first cylinder 5, and then the welding air duct 20 and the air ducts 21 outside it are synchronously moved downward. When the inclined grooves 23 abut against the top of the chip, the chip is automatically centered. Then the bottom end of the welding air duct 20 is pressed down on the top of the chip to prevent the chip pins from warping and contacting the circuit board circuit. The problem of small connection area is solved. At the same time, each correction groove 24 is sleeved on the outside of each pin to straighten the pin and prevent the pin from bending and being unable to accurately connect with the circuit on the circuit board. Then, hot air is introduced into each air duct 21 through the hot air duct 7 and the welding air duct 20. The hot air blows to each pin of the chip, and the tin paste at each pin automatically climbs the tin. After the tin climbing starts, the electric push rod 25 is controlled to drive the linkage rod 26 to move upward, and then drive the positioning block 22 to move upward synchronously, so that the positioning block 22 is away from the pin. As the tin climbing continues, each pin is connected to the circuit on the circuit board to realize the welding processing of the chip pin, and then the first motor is controlled to drive the turntable 3 to rotate one-sixth of a circle clockwise and then stop. The circuit board and chip inside the positioning groove 4 are rotated to the lower plate station.The robot takes out the entire circuit board, and finally controls the first motor to drive the turntable 3 to rotate one sixth of a circle clockwise and then stops, and the positioning groove 4 returns to the upper plate position on the left side, and controls the robot to place the new circuit board inside the positioning groove 4 on the left side.

[0024] It should be noted that the device structure and drawings of the present invention mainly describe the principle of the present invention. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. On the premise that the technical personnel in the field understand the principle of the above invention, the specific details of the power mechanism, power supply system and control system can be clearly known. The control method of the application document is to automatically control by a controller, and the control circuit of the controller can be realized by simple programming by the technical personnel in the field; the above only describes some exemplary embodiments of the present invention by way of explanation. Undoubtedly, for ordinary technicians in the field, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

[0025] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

Claims

1. A device for crimping a leg of an electronic component, comprising a base (1) and a bracket (2) mounted on the top of the base (1), characterized in that: Also includes: A turntable (3) rotatably connected to the top of the base (1), wherein a plurality of positioning grooves (4) are provided on the top of the turntable (3); A preheating mechanism, which is mounted on the bracket (2) and is used to perform a preheating treatment on the chip mounting position of the circuit board; A tin coating mechanism, which is mounted on the bracket (2) and is used to coat tin paste along a rectangular track at the chip mounting position; A positioning and pressing mechanism, which is connected to the preheating mechanism and is used to position, press down and weld the chip; The pin correction mechanism is connected to the positioning and crimping mechanism and is used to correct the pins on the chip when the chip is positioned.

2. The electronic component processing leg crimping device according to claim 1, characterized in that: A first motor is installed inside the base (1), and an output end of the first motor is fixedly connected to the center of the bottom of the turntable (3); The plurality of positioning grooves (4) are distributed in a ring array with the first motor output end as the center.

3. The electronic component processing leg crimping device according to claim 2, characterized in that: The preheating mechanism comprises a first cylinder (5) mounted on the top of the bracket (2) and a connecting block (6) fixedly connected to the extended end of the first cylinder (5); A hot air pipe (7) is installed at the bottom of the connection block (6), and a preheating pipe (8) is installed at one end of the hot air pipe (7).

4. The electronic component processing leg crimping device according to claim 3, characterized in that: The tin coating mechanism comprises a fixing frame (9) mounted on the top of the bracket (2), a rectangular groove (10) provided at the bottom of the fixing frame (9), a guide tube (11) arranged inside the rectangular groove (10), and an adjusting component for driving the guide tube (11) to move along a rectangular track of the rectangular groove (10); An injection pipe (12) is slidably connected inside the conduit (11).

5. The electronic component processing leg crimping device according to claim 4, characterized in that: The adjustment assembly comprises a second motor (13) mounted inside a fixing frame (9) and a fixing sleeve (14) fixedly sleeved on the outside of an output shaft of the second motor (13) and the outside of the guide tube (11), respectively; A telescopic rod (15) is fixedly connected between the two fixing sleeves (14), and a spring (16) is provided on the outer sleeve of the telescopic rod (15), and two ends of the spring (16) are respectively fixedly connected to the outer walls of the two fixing sleeves (14).

6. The electronic component processing leg crimping device according to claim 5, characterized in that: The exterior of the guide tube (11) is fixedly sleeved with a linkage block (17), a second cylinder (18) is mounted at the bottom of the linkage block (17), a lifting block (19) is fixedly connected to the extended end of the second cylinder (18), and the lifting block (19) is also fixedly sleeved on the exterior of the injection pipe (12).

7. The electronic component processing leg crimping device according to claim 6, characterized in that: The positioning and crimping mechanism comprises a welding air duct (20) installed at the other end of the hot air duct (7) and four air ducts (21) installed on the outer wall of the welding air duct (20); A positioning block (22) is slidably connected to the inner wall of the air duct (21), a bottom of the positioning block (22) is provided with an inclined groove (23), and a lower edge of the positioning block (22) is lower than a lower edge of the welded air duct (20).

8. The electronic component processing leg crimping device according to claim 7, characterized in that: The pin correction mechanism comprises a plurality of correction grooves (24) provided inside the positioning block (22) and an electric push rod (25) installed at the top of the air duct (21); The inner wall of the correction groove (24) is adapted to the outer wall of the chip pin; The extended end of the electric push rod (25) is fixedly connected to the top of the positioning block (22) via a linkage rod (26).

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