Semi-automatic single-blade scribing machine for 6-inch semiconductor wafer

Abstract

The invention discloses a semi-automatic single-blade scribing machine for a 6-inch semiconductor wafer. The semi-automatic single-blade scribing machine comprises an equipment shell, a support assembly, an electrical control box, an X-axis motion control device, a vacuum workbench, a non-contact blade height measuring device, a Y-axis motion control device, a Z-axis motion control device, a scribing blade control device, a visual positioning device and a multifunctional tool bit support. According to the technical scheme, the semi-automatic single-blade scribing machine for the 6-inch semiconductor wafer is manufactured, the semi-automatic single-blade scribing machine for the 6-inch semiconductor wafer adopts the single-axis layout design of an XYZ structure, and compared with traditional equipment, the semi-automatic single-blade scribing machine has the advantages of being simple in structure, controllable in cost and convenient to maintain. And in combination with an optimized software scribing algorithm, the equipment can efficiently complete single-tool precise cutting, and meanwhile, the equipment adapts to various complex cutting requirements. The equipment is particularly optimized for small and medium-sized wafers, can meet the requirement of high-precision scribing, and has remarkable advantages in performance stability and operation convenience.

Description

Technical Field

[0001] The invention relates to the field of dicing machines, and in particular to a 6-inch semiconductor wafer semi-automatic single-blade dicing machine. Background Art

[0002] Semiconductor wafer dicing machines are key equipment used in semiconductor manufacturing to accurately cut and separate large wafers into small chips. Their performance has a decisive influence on the quality and yield of chips. In modern semiconductor manufacturing, with the gradual increase in wafer size and the continuous miniaturization of chip size, higher requirements are placed on the accuracy, stability and adaptability of the dicing process. Wafer dicing machines use high-speed rotating diamond blades to cut wafers along preset cutting paths to separate the chips that were originally connected to each other. These cut chips are widely used in the manufacture of various electronic products such as smartphones, computers, Internet of Things devices, and automotive electronic systems.

[0003] At present, the domestic semiconductor industry is developing rapidly, and the demand for wafer dicing equipment is also growing. However, the existing equipment generally has deficiencies in structural design, high-precision positioning, real-time monitoring of dicing quality, efficient cooling of blades, etc. At the same time, special dicing equipment for small and medium-sized wafers (such as 6 inches) plays an important role in specific fields, so it is of great significance to develop dicing equipment that meets this demand. This can not only meet the domestic market demand, but also provide an opportunity to improve the level of localization of equipment and reduce industry dependence. Therefore, the present invention provides a 6-inch semiconductor wafer semi-automatic single-blade dicing machine. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a 6-inch semiconductor wafer semi-automatic single-blade dicing machine.

[0005] A 6-inch semiconductor wafer semi-automatic single-blade dicing machine in the present invention comprises an equipment housing, a bracket assembly, an electrical control box, an X-axis motion control device, a vacuum workbench, a non-contact blade height measuring device, a Y-axis motion control device, a Z-axis motion control device, a dicing knife control device, a visual positioning device and a multifunctional bracket for a cutter head. The equipment housing is provided with a bracket assembly, an electrical control box is provided under the bracket assembly, an X-axis motion control device is provided on the bracket assembly, a vacuum workbench is provided on the X-axis motion control device, a non-contact blade height measuring device is also provided on the X-axis motion control device, a Y-axis motion control device is provided on the bracket assembly, a Z-axis motion control device is provided on the Y-axis motion control device, a dicing knife control device is installed in front of the Z-axis motion control device, the visual positioning device is provided in front of the Z-axis motion control device, and a multifunctional bracket for a cutter head is connected to the dicing knife control device.

[0006] In the above scheme, an X-axis waterproof cover is installed on the X-axis motion control device, and a vacuum cutting workbench and a non-contact blade height measuring device are provided on the X-axis waterproof cover. The non-contact blade height measuring device includes a non-contact height measuring bracket, an air blowing nozzle, a pure water cleaning nozzle, a cable waterproof groove and a non-contact height measuring sensor. An air blowing nozzle and a pure water cleaning nozzle are provided in the non-contact height measuring bracket. The air blowing nozzle and the pure water cleaning nozzle are arranged in the cable waterproof groove. A non-contact height measuring sensor is also provided on the non-contact height measuring bracket.

[0007] In the above scheme, an industrial computer is provided in the upper part of the equipment shell, and an air-water valve island is provided in the lower part of the equipment shell.

[0008] In the above solution, the front side of the device housing is provided with a display touch screen, a control button panel, a liquid flow meter panel, and a pressure gauge panel.

[0009] In the above solution, a workpiece placing and taking-in sliding door and a cutting area observation window are provided below the display touch screen.

[0010] In the above scheme, an exhaust and drainage interface and an air and water inlet main valve connector are provided on the back of the equipment housing.

[0011] In the above solution, an alarm light is also provided on the device housing.

[0012] In the above solution, the vacuum workbench is a ceramic vacuum workbench.

[0013] The advantages and beneficial effects of the present invention are as follows: the present invention provides a 6-inch semiconductor wafer semi-automatic single-blade dicing machine. The semi-automatic single-blade dicing machine for 6-inch wafers of the present invention adopts a single-axis layout design of an XYZ structure. Compared with traditional equipment, it has the advantages of simple structure, controllable cost and convenient maintenance. Combined with the optimized software dicing algorithm, the device can efficiently complete single-blade precision cutting and adapt to a variety of complex cutting requirements. The equipment is specially optimized for small and medium-sized wafers, which can not only meet the requirements of high-precision dicing, but also has significant advantages in performance stability and operational convenience, providing domestic semiconductor manufacturing and packaging and testing companies with an economical and efficient solution. The dicing blade of the present invention adopts a visual positioning device that supports manual / electric focus, which realizes independent dicing quality monitoring while achieving high-precision dicing, further improving the dicing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the back structure of the present invention; Figure 3 It is a schematic diagram of the internal structure of the present invention; Figure 4 It is a structural schematic diagram of a non-contact blade height measuring device.

[0016] In the figure: 1. Equipment housing 2. Bracket assembly 3. Electrical control box 4. X-axis motion control device 5. Vacuum workbench 6. Contact blade height measuring device 7. Y-axis motion control device 8. Z-axis motion control device 9. Slicing knife control device 10. Visual positioning device 11. Multifunctional bracket for blade 12. Industrial computer 13. Air and water valve island 14. Display touch screen 15. Control button panel 16. Liquid flow meter panel 17. Pressure surface panel 18. Workpiece placement and removal sliding door 19. Cutting area observation window 20. Exhaust and drainage interface 21. Air and water inlet main valve connector 22. Alarm light 41. X-axis waterproof cover 42. Vacuum cutting workbench 61. Non-contact height measuring bracket 62. Air blowing nozzle 63. Pure water cleaning nozzle 64. Cable waterproof groove 65. Non-contact height measuring sensor DETAILED DESCRIPTION

[0017] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0018] like Figure 1-Figure 3As shown, the present invention is a 6-inch semiconductor wafer semi-automatic single-blade dicing machine, including an equipment housing 1, a bracket assembly 2, an electrical control box 3, an X-axis motion control device 4, a vacuum workbench 5, a non-contact blade height measuring device 6, a Y-axis motion control device 7, a Z-axis motion control device 8, a dicing knife control device 9, a visual positioning device 10 and a multifunctional support 11 for a cutter head. The equipment housing 1 is provided with a bracket assembly 2, an electrical control box 3 is provided under the bracket assembly 2, an X-axis motion control device 4 is provided on the bracket assembly 2, a vacuum workbench 5 is provided on the X-axis motion control device 4, a non-contact blade height measuring device 6 is also provided on the X-axis motion control device 4, a Y-axis motion control device 7 is provided on the Y-axis motion control device 7, a dicing knife control device 9 is installed in front of the Z-axis motion control device 8, a visual positioning device 10 is provided in front of the Z-axis motion control device 8, and a multifunctional support 11 for a cutter head is connected to the dicing knife control device 9. Among them, the vacuum workbench 5 is a ceramic vacuum workbench. The electrical control box 3 is connected to the gas and water valve island, the industrial computer and the motors of each motion control device through control cables to realize motion control. The inner side of the equipment housing 1 is connected to the bracket assembly at multiple locations to fix the equipment housing. The lower end of the bracket assembly is provided with universal wheels and shock-absorbing foot pads.

[0019] like Figure 4 As shown, an X-axis waterproof cover 41 is installed on the X-axis motion control device 4, and a vacuum cutting workbench 42 and a non-contact blade height measuring device 6 are provided on the X-axis waterproof cover 41. The non-contact blade height measuring device 6 includes a non-contact height measuring bracket 61, an air blowing nozzle 62, a pure water cleaning nozzle 63, a cable waterproof groove 64 and a non-contact height measuring sensor 65. The non-contact height measuring bracket 61 is provided with an air blowing nozzle 62 and a pure water cleaning nozzle 63. The air blowing nozzle 62 and the pure water cleaning nozzle 63 are arranged in the cable waterproof groove 64. The non-contact height measuring bracket 61 is also provided with a non-contact height measuring sensor 65.

[0020] An industrial computer 12 is provided at the upper part of the equipment housing 1 , and an air-water valve island 13 is provided at the lower part of the equipment housing 1 .

[0021] The front of the device housing 1 is provided with a display touch screen 14, a control button panel 15, a liquid flow meter panel 16, and a pressure gauge panel 17. The display touch screen 14 displays the functional operation interface of the dicing machine system on the screen and supports touch operation. The control button panel 15 is fixedly installed on the inner surface of the device housing 1, and includes a power button, an emergency stop button, a maintenance mode button, and a USB interface. The liquid flow meter panel 16 is fixedly installed on the inner surface of the device housing 1, and displays the real-time flow of various liquids in the device. The pressure gauge panel 17 is fixedly installed on the inner surface of the device housing 1, and displays the real-time pressure of various gases in the device.

[0022] A workpiece access sliding door 18 and a cutting area observation window 19 are provided below the display touch screen 14 . The front end of the workpiece access sliding door 18 is movably connected to the inner surface of the equipment housing 1 , so that the workpiece access sliding door 18 can be opened.

[0023] An exhaust and drainage interface 20 and an air and water inlet main valve joint 21 are provided on the back of the equipment housing 1. The exhaust and drainage joint 20 is fixedly installed on the inner surface of the equipment housing 1, and the air and water inlet main valve joint 21 is fixedly installed on the inner surface of the equipment housing 1.

[0024] An alarm light 22 is also provided on the device housing 1. The lower outer surface of the alarm light 22 is fixedly connected to the upper outer surface of the device housing 1. Different combinations of lights and alarm horns are displayed according to the operating status of the device to remind the device operator / manager.

[0025] Among them, the lower end of the X-axis motion control device 4 is fixedly connected to the upper outer surface of the bracket assembly 2, the upper end of the X-axis motion control device 4 is fixedly connected to the lower outer surface of the ceramic vacuum workbench (θ axis), the rear end of the Y-axis motion control device 7 is fixedly connected to the front outer surface of the bracket assembly 2, the rear end of the Z-axis motion control device 8 is fixedly connected to the front outer surface of the Y-axis motion control device 7, the upper end outer surface of the dicing knife control device 9 is fixedly connected to the front outer surface of the Z-axis motion control device 8, the inner outer surface of the tool head multifunctional bracket 11 is fixedly connected to the tool head end outer surface of the dicing knife control device 9, the rear end outer surface of the visual positioning device 10 is fixedly connected to the front end outer surface of the Z-axis motion control device 8, and the lower end outer surface of the non-contact blade height measuring device 6 is fixedly connected to the upper end of the X-axis motion control device 4.

[0026] The present invention is a 6-inch semiconductor wafer semi-automatic single-blade dicing machine, which can slice 6-inch semiconductor wafers (hereinafter referred to as workpieces). The working platform for placing the workpieces is composed of an X-axis motion control device 4 and a ceramic vacuum worktable (θ axis). The X-axis motion control device 4 can move in the X-axis direction through a motor, a lead screw and a guide rail. The effective X-axis stroke is 300 mm, the speed is in the range of 0.1 mm / s to 600 mm / s, and the repeat positioning accuracy is ≤0.001 mm.

[0027] The X-axis motion control device 4 is equipped with a ceramic vacuum table (θ-axis) to realize the movement of the table in the X direction. The ceramic vacuum table (θ-axis) is provided with a ceramic vacuum suction cup and is directly connected to the DD motor to realize high-precision control of the angle of the table. The maximum working range of the table is 380° (starting from the initial position, 320° clockwise and 60° counterclockwise), and the rotation angle resolution can be accurate to 0.494" (angle).

[0028] A Y-axis motion control device 7 is installed on the bracket assembly 2. The Y-axis motion control device 7 can move in the Y-axis direction through a motor, a lead screw and a guide rail. The effective Y-axis stroke is 200 mm, the speed is in the range of 0.1 mm / s to 200 mm / s, and the repeat positioning accuracy is ≤0.001 mm.

[0029] The upper end of the Y-axis motion control device 7 is equipped with a Z-axis motion control device 8. The Z-axis motion control device 8 drives the lead screw slide to move in the vertical direction of the Y-axis motion control device 7 through a motor, thereby realizing the up and down linear motion of the dicing knife control device 9. This motion control method can achieve high-precision up and down linear motion, thereby accurately controlling the lowering height of the dicing knife head. The maximum stroke of the Z-axis is 20 mm, the motor's movement resolution is as high as 0.00005 mm, and the repeatability accuracy reaches 0.001 mm.

[0030] The front end of the dicing knife control device 9 is a dicing knife head, and a dicing knife head multifunctional bracket 11 is also installed at the front end. The main function of the dicing knife head multifunctional bracket 11 is to provide cooling water and cleaning water for the dicing knife head and the workpiece during dicing to ensure the dicing quality. It also has a jet function to dry the dicing knife head. The power of the dicing knife control device 9 is 2.0KW, and the maximum dicing knife speed is 40,000 rpm.

[0031] The visual positioning device 10 is equipped with a high-magnification lens camera and a low-magnification lens camera. The up and down positions of the camera can be manually adjusted through its own slide to perform focusing, the Y-axis slide can move the camera left and right, and the X-axis slide can move the camera forward and backward, so that the camera and tool head are well positioned.

[0032] Placing the workpiece: The operator opens the workpiece placing and taking sliding door 18, places the workpiece on the ceramic vacuum workbench, turns on the vacuum to adsorb the workpiece, and closes the workpiece placing and taking sliding door 18; Slicing position positioning: The operator operates the software to control the movement of the workpiece in the X and θ directions through the ceramic vacuum workbench and the X-axis motion control device 4, and controls the movement of the visual positioning device 10 in the Y direction through the Y-axis motion control device 7, to obtain a real-time image of the workpiece position (the focus of the visual positioning device needs to be manually adjusted through the vertical direction adjustment function of its own slide) and achieve precise positioning of the slicing position.

[0033] Slicing: The software automatically controls the X-axis motion control device 4 and the Y-axis motion control device 7 to accurately position the tool head of the slicing knife control device 9 to the first predetermined slicing position, the slicing knife control device 9 controls the slicing knife to rotate at high speed, the tool head multifunctional bracket 11 starts to spray cooling water, the Z-axis motion control device 8 descends to the specified slicing height, and the X-axis motion control device 4 makes a uniform linear motion backward to start the first slicing; after the first slicing is completed, the Z-axis motion control device 8 rises to the specified standby height, and the software automatically controls the X-axis motion control device 4 and the Y-axis motion control device 7 to accurately position the tool head of the slicing knife control device 9 to the second predetermined slicing position, and repeats this process until the slicing is completed.

[0034] Precision control during dicing: During the dicing process, the dicing quality needs to be monitored at all times. The software will use the visual positioning device to check the image of the dicing position at regular intervals according to preset conditions. When it is determined that the dicing quality has deteriorated, the blade height measurement device will be used to detect the blade height to ensure the dicing quality.

[0035] The present invention is a semi-automatic single-blade dicing machine for 6-inch wafers, which adopts a single-axis layout design with an XYZ structure. Compared with traditional equipment, it has the advantages of simple structure, controllable cost and convenient maintenance. Combined with the optimized software dicing algorithm, the device can efficiently complete single-blade precision cutting, while adapting to a variety of complex cutting needs. The equipment is specially optimized for small and medium-sized wafers, which can not only meet the requirements of high-precision dicing, but also has significant advantages in performance stability and operational convenience, providing domestic semiconductor manufacturing and packaging and testing companies with an economical and efficient solution. The dicing blade of the present invention adopts a visual positioning device that supports manual / electric focus, which realizes independent dicing quality monitoring while achieving high-precision dicing, further improving the dicing efficiency.

[0036] The multifunctional support 11 of the cutter head of the present invention can simultaneously realize the real-time monitoring and dynamic adjustment of the blade wear during dicing, as well as the cooling control of the blade and the wafer, thereby ensuring the stability and reliability of the dicing quality.

[0037] The dicing knife control device 9 of the present invention can achieve a maximum dicing speed of 40,000 rpm and a power of 2.0KW, and can cope with various complex semiconductor wafer materials.

[0038] The display touch screen 14 of the present invention makes the operation of the device more convenient and reduces the technical requirements for operators through an optimized human-machine interaction interface and semi-automatic operation process. It adopts an intelligent control algorithm, greatly simplifies the operation process, and monitors the device status in real time through a fault diagnosis system, providing a highly intelligent operation experience.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A 6-inch semiconductor wafer semi-automatic single blade dicing machine, characterized in that: It includes an equipment housing, a bracket assembly, an electrical control box, an X-axis motion control device, a vacuum workbench, a non-contact blade height measuring device, a Y-axis motion control device, a Z-axis motion control device, a dicing knife control device, a visual positioning device and a multifunctional bracket for a cutter head. A bracket assembly is arranged in the equipment housing, an electrical control box is arranged under the bracket assembly, an X-axis motion control device is arranged on the bracket assembly, a vacuum workbench is arranged on the X-axis motion control device, a non-contact blade height measuring device is also arranged on the X-axis motion control device, a Y-axis motion control device is arranged on the Y-axis motion control device, a Z-axis motion control device is installed in front of the Z-axis motion control device, the visual positioning device is arranged in front of the Z-axis motion control device, and a multifunctional bracket for a cutter head is connected to the dicing knife control device.

2. A 6-inch semiconductor wafer semi-automatic single-blade dicing machine according to claim 1, characterized in that: An X-axis waterproof cover is installed on the X-axis motion control device, and a vacuum cutting workbench and a non-contact blade height measuring device are arranged on the X-axis waterproof cover. The non-contact blade height measuring device includes a non-contact height measuring bracket, an air blowing nozzle, a pure water cleaning nozzle, a cable waterproof groove and a non-contact height measuring sensor. An air blowing nozzle and a pure water cleaning nozzle are arranged in the non-contact height measuring bracket, and the air blowing nozzle and the pure water cleaning nozzle are arranged in the cable waterproof groove. A non-contact height measuring sensor is also arranged on the non-contact height measuring bracket.

3. A 6-inch semiconductor wafer semi-automatic single-blade dicing machine according to claim 1, characterized in that: An industrial computer is arranged at the upper part of the equipment shell, and an air-water valve island is arranged at the lower part of the equipment shell.

4. A 6-inch semiconductor wafer semi-automatic single blade dicing machine according to claim 1, characterized in that: The front of the device housing is provided with a display touch screen, a control button panel, a liquid flow meter panel, and a pressure gauge panel.

5. A 6-inch semiconductor wafer semi-automatic single blade dicing machine according to claim 4, characterized in that: A workpiece placing and taking sliding door and a cutting area observation window are arranged below the display touch screen.

6. A 6-inch semiconductor wafer semi-automatic single blade dicing machine according to claim 1, characterized in that: The back of the equipment shell is provided with an exhaust and drainage interface and an air and water inlet main valve connector.

7. A 6-inch semiconductor wafer semi-automatic single blade dicing machine according to claim 1, characterized in that: The device housing is also provided with an alarm light.

8. The 6-inch semiconductor wafer semi-automatic single-blade dicing machine according to claim 1, characterized in that: The vacuum workbench is a ceramic vacuum workbench.

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