Laser cutting processing equipment for solid-state relay

Abstract

The invention discloses laser cutting processing equipment for a solid-state relay, and particularly relates to the technical field of laser cutting, a limiting assembly and a blowing dust collection assembly work at the same time and do not affect each other, a lifting plate pushes an adsorption plate to be adsorbed and attached to the solid-state relay, then the lifting plate turns over and rotates, the bottom of the solid-state relay is made to face upwards, and the solid-state relay is clamped. The wiping roller I and the wiping roller II which rotate synchronously perform sliding blowing, wiping and cleaning on the inner cavity of the solid-state relay and change the wiping and blowing positions, gas is conveyed by the cylinder body, and the surface of the wiping roller I and the surface of the wiping roller II are in contact with the interior of a shell of the solid-state relay, so that the solid-state relay is cleaned. During cleaning, fine particles attached to the inner surface and corners of the relay are removed, impurities enter the dust collection chamber through the suction channel to be collected in a centralized mode, then the lifting plate rotates to reset to the initial position, and the cleaned solid-state relay is transferred to the second conveying strip through clockwise overturning of the rotating disc.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting, in particular to laser cutting processing equipment for solid-state relays. Background Art

[0002] Laser cutting has the characteristics of high precision and high speed, and can meet the precise requirements for the size and shape of parts in the manufacturing process of solid-state relays. The internal structure of solid-state relays is complex, containing multiple precise components and connecting parts. Laser cutting can ensure the size and shape accuracy of these parts, thereby improving the overall performance and reliability of solid-state relays.

[0003] After searching, the invention patent with publication number CN117921215B discloses a laser cutting device for embedded heat dissipation materials for ceramic packaging shells. The device uses a feeding mechanism in conjunction with a bearing mechanism and an auxiliary mechanism to detect the thickness of the metal heat sink and separate the adhered metal heat sinks, thereby avoiding direct forced separation of the two metal heat sinks from top to bottom, which would cause surface damage and deformation in the middle of the metal heat sink.

[0004] In the existing solution, when installing some complex-shaped or tiny-sized components in the solid-state relay housing, it is necessary to perform laser cutting operations on the inside. When the laser processing is performed on the inside of the solid-state relay housing, some cutting impurities and debris will be generated. The existing method requires stopping the machine to remove the solid-state relay from the processing equipment for cleaning. The processing continuity is not high, which affects its processing efficiency. In addition, the direct laser cutting method is likely to cause impurities to fly. Summary of the invention

[0005] The object of the present invention is to provide a laser cutting processing device for solid-state relays to solve the problems mentioned in the above background technology.

[0006] The technical problems mainly solved by the present invention are:

[0007] The existing method requires stopping the machine to remove the solid-state relay from the processing equipment for cleaning, which has a low processing continuity and affects the processing efficiency.

[0008] Direct laser cutting can easily cause impurities to fly around.

[0009] The present invention can be achieved through the following technical solutions:

[0010] A laser cutting processing device for solid-state relays, comprising a processing chamber arranged on a substrate, wherein a first conveying belt and a second conveying belt are arranged inside the processing chamber, and a plurality of positioning seats for limiting the position of a solid-state relay housing are elastically installed on the surfaces of the first conveying belt and the second conveying belt, and a limiting component for laser cutting of the solid-state relay is installed inside the processing chamber, and a turntable is rotatably installed on one side of the processing chamber adjacent to the limiting component, and a blowing and dust collection component for cleaning the inside of the solid-state relay after cutting is installed on the surface of the turntable;

[0011] The blowing and brushing dust collection assembly comprises a rotatable lifting plate, the lower end of the lifting plate is fixedly connected with an adsorption plate adsorbed and connected to the solid-state relay, and a suction channel is provided between the lifting plate and the adsorption plate, the bottom surface of the adsorption plate is embedded with a transverse guide rail, and a cylinder body mounted on the lifting plate is provided above the adsorption plate, a dust collection chamber connected to the suction channel is installed on one side of the cylinder body, an L-shaped slide plate is slidably installed on the surface of the transverse guide rail, and a wiping roller 1 and a wiping roller 2 that rotate simultaneously are rotatably installed in the slide plate, the wiping roller 1 and the wiping roller 2 are both provided with a plurality of air holes, and the rotating ends of the wiping roller 1 and the wiping roller 2 are connected with a ventilation seat, and an inlet pipe is provided at the connection between the end of the ventilation seat and the cylinder body;

[0012] When the blowing and brushing dust collection component is working, the solid-state relay is adsorbed by the adsorption plate and turned over and rotated half a circle by the lifting plate, so that the bottom of the solid-state relay faces upward.

[0013] A further technical improvement of the present invention is that a limit groove is provided on the surface of the slide plate, a limit plate is slidably installed in the limit groove, the limit plate is rotatably connected to the wiping roller one and the wiping roller two, and the upper end surface of the limit plate is provided with a spring fixed to the inside of the limit groove.

[0014] A further technical improvement of the present invention is that an air inlet is provided on the top of the cylinder body, and an air outlet is provided on one side of the cylinder body, a one-way valve is embedded in the air outlet, a piston is slidably installed on the side of the inner cavity of the cylinder body close to the air inlet, the top of the inlet pipe enters into the interior of the slide plate and slides along the groove of the side wall of the adsorption plate, and the inlet pipe is connected to the air outlet through a hose.

[0015] A further technical improvement of the present invention is that: the surface of the adsorption plate is provided with a truncated cone groove inclined inwardly.

[0016] A further technical improvement of the present invention is that the blowing and brushing dust collection assembly also includes a supporting cylinder arranged on the turntable, a rotating column driven by a rotating motor is arranged inside the supporting cylinder, one end of the rotating column is fixedly connected to a reinforcement frame, the lower surface of the reinforcement frame is provided with an electric push rod for pushing the dust collection chamber to move, and the reinforcement frame is slidingly arranged with the lifting plate.

[0017] A further technical improvement of the present invention is that a ratchet is sleeved on the outside of the driving shaft of the rotating motor, and a ratchet pawl engaged with the ratchet is installed in the interior of the bearing cylinder.

[0018] A further technical improvement of the present invention is that the limiting assembly includes a lifting fixed seat, a vibration motor is installed on the inner wall of the fixed seat, the output end of the vibration motor is connected to an extended vertical plate of a rectangular structure, the inner side surface of the extended vertical plate is provided with an L-shaped card cavity, and the inner wall of the card cavity is installed with a folding part.

[0019] A further technical improvement of the present invention is that the folding portion comprises a folding curtain connected to the top surface of the card cavity, and the end of the folding curtain is fixedly connected with a gasket in contact with the surface of the solid-state relay.

[0020] A further technical improvement of the present invention is that: a vertical guide rail is provided in the cavity outside the lower end surface of the extended vertical plate, a sliding seat is slidably provided outside the vertical guide rail, and one side of the bottom of the sliding seat is fixed to the gasket;

[0021] A frame plate slidably arranged with the extended vertical plate is fixed on the inner wall surface of the processing chamber, and a cleaning brush in contact with the extended vertical plate is arranged on the lower end surface of the frame plate.

[0022] A further technical improvement of the present invention is that at least one stroke cylinder connected to a fixed seat is provided at the top of the inner cavity of the processing chamber, a multi-stage sliding plate is installed on the upper end surface of the fixed seat, the multi-stage sliding plate is fixed to the top surface of the inner cavity of the processing chamber, and a laser component that moves horizontally and vertically in the processing chamber is provided on the inner side of the multi-stage sliding plate.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. First, the position of the solid-state relay is limited by the limit assembly, and the workpiece after laser processing reaches the bottom of the adsorption plate, working at the same time without affecting each other, ensuring the continuity of processing; the lifting plate moves downward to push the adsorption plate to contact the solid-state relay. Under the suction of negative pressure, the bottom edge of the adsorption plate adsorbs and fits the solid-state relay, and then the lifting plate flips and rotates so that the bottom of the solid-state relay faces upward, that is, the opening of the solid-state relay faces downward, ensuring that impurities fall during blowing and rolling cleaning. When cleaning the inside of the solid-state relay, the synchronously rotating wiping rollers 1 and 2 clean the inner cavity of the solid-state relay. During the cleaning process, the slide slides on the transverse guide rail, synchronously driving the wiping rollers 1 and 2 to move back and forth, changing the cleaning and blowing positions, and the cylinder body delivers gas. High-pressure gas is ejected through the air holes on the wiping roller one and the wiping roller two. The high-pressure gas has a certain impact force and airflow, which blows away the impurities attached to the inside of the solid-state relay and quickly removes the loose impurities inside the solid-state relay. Then, the surfaces of the wiping roller one and the wiping roller two contact the inside of the solid-state relay housing to further remove the fine particles attached to the internal surface and corners of the relay to ensure the thoroughness of the cleaning. Finally, the impurities enter the dust collection chamber through the suction channel for centralized collection, which can efficiently collect the particles generated during the cutting process to avoid secondary pollution. After the cleaning is completed, the lifting plate rotates and resets to the initial position, and after the turntable is turned clockwise, the cleaned solid-state relay is transferred to the position of the conveying conveyor belt two, and is conveyed to the next processing step through the conveyor belt two.

[0025] 2. By placing the extended vertical plate and its folding part on the top of the solid-state relay, impurities generated by its laser cutting are intercepted to avoid the scattering of impurities during cutting, and the gasket is pushed downward by the sliding of the slide in the vertical guide rail, that is, in the rising state, the gasket is always in contact with the upper end surface of the solid-state relay to ensure its connection state, that is, when the extended vertical plate is rising, the cleaning brush wipes and removes the impurities attached to the extended vertical plate, and the folding curtain is in the unfolded state at this time, and the impurities on the folding curtain are vibrated into the solid-state relay housing with the vibration of the vibration motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0027] Figure 1 It is a schematic diagram of the internal structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention;

[0029] Figure 3 For the present invention Figure 1 A partial enlarged view of the center

[0030] Figure 4It is a schematic diagram of the structural connection between the adsorption plate and the slide plate of the present invention;

[0031] Figure 5 This is a schematic diagram of the structural connection between the extended vertical plate and the gasket of the present invention;

[0032] Figure 6 For the present invention Figure 1 A partial enlarged view of point B in the middle;

[0033] Figure 7 It is a structural schematic diagram of the cylinder body of the present invention.

[0034] In the figure: 1. Processing chamber; 2. Conveying strip 1; 3. Positioning seat; 4. Stroke cylinder; 5. Multi-stage sliding plate; 6. Laser assembly; 7. Turntable; 8. Suction channel; 9. Adsorption plate; 10. Horizontal guide rail; 11. Slide plate; 12. Limiting plate; 13. Wiping roller 1; 14. Wiping roller 2; 15. Air hole; 16. Spring; 17. Ventilation seat; 18. Inlet pipe; 19. Fixed seat; 20. Vibration motor; 21. Extended vertical plate; 22. Frame plate; 23. Cleaning brush; 24. Folding curtain; 25. Gasket; 26. Vertical guide rail; 27. Slide seat; 28. Bearing cylinder; 29. ​​Rotating column; 30. Ratchet; 31. Paw; 32. Reinforcement frame; 33. Electric push rod; 34. Dust chamber; 35. Cylinder body; 36. Air inlet; 37. Piston; 38. Air outlet. DETAILED DESCRIPTION

[0035] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0036] See also Figure 1-Figure 7 As shown, the present invention provides a laser cutting processing device for solid-state relays, including a processing chamber 1 arranged on a substrate, wherein a strip-shaped conveying strip 1 2 and a conveying strip 2 are arranged inside the processing chamber 1, and a plurality of positioning seats 3 for limiting the position of the solid-state relay housing are elastically installed on the surfaces of the conveying strip 1 2 and the conveying strip 2, and a limiting component for laser cutting of the solid-state relay is installed inside the processing chamber 1, and a turntable 7 is rotatably installed on one side of the processing chamber 1 adjacent to the limiting component, and a blowing and dust collection component for cleaning the inside of the solid-state relay after cutting is installed on the surface of the turntable 7, such as Figure 1As shown, the solid-state relay housing is transported to the interior of the processing chamber 1 via a conveyor belt 2, and the position of the solid-state relay is limited by a limiting component to achieve its positioning laser cutting. After cutting, it reaches the position of the blowing, brushing and dust suction component. At this time, the limiting component continues to process the next workpiece, and the solid-state relay at the blowing, brushing and dust suction component works at the same time; the blowing, brushing and dust suction component includes a rotatable lifting plate, the lower end of the lifting plate is fixedly connected to an adsorption plate 9 adsorbed and connected to the solid-state relay, and a suction channel 8 is provided between the lifting plate and the adsorption plate 9, and the bottom surface of the adsorption plate 9 is embedded with a transverse guide rail 1 0, and a cylinder 35 installed on the lifting plate is provided above the adsorption plate 9, a dust suction chamber 34 connected to the suction channel 8 is installed on one side of the cylinder 35, an L-shaped slide plate 11 is slidably installed on the surface of the transverse guide rail 10, and a wiping roller 13 and a wiping roller 2 14 that rotate simultaneously are rotatably installed in the slide plate 11, and a plurality of air holes 15 are provided on the wiping roller 13 and the wiping roller 2 14, and the rotating ends of the wiping roller 13 and the wiping roller 2 14 are connected to a ventilation seat 17, and an inlet pipe 18 is provided at the connection between the end of the ventilation seat 17 and the cylinder 35;When the blowing and dust collection assembly is working, the solid-state relay is adsorbed by the adsorption plate 9 and the lifting plate is flipped and rotated half a circle, so that the bottom of the solid-state relay faces upward, that is, when working, the lifting plate first moves downward to push the adsorption plate 9 to contact the solid-state relay. Under the suction of negative pressure, the bottom edge of the adsorption plate 9 adsorbs and fits the solid-state relay, and then the lifting plate is flipped and rotated, so that the bottom of the solid-state relay faces upward, which is convenient for the impurities inside the solid-state relay to fall and be sucked in. When cleaning the inside of the solid-state relay, the opening of the solid-state relay faces downward to ensure the falling of impurities during blowing and rolling cleaning. The synchronously rotating wiping roller 13 and wiping roller 2 14 clean the inner cavity of the solid-state relay. During the cleaning process, the slide plate 11 slides on the transverse guide rail 10, synchronously driving the wiping roller 13 and the wiping roller 2 14 to move back and forth, changing the cleaning and blowing positions, and the gas is transported by the cylinder 35 and reaches the corresponding ventilation seat 17 through the inlet pipe 18. Since the ventilation seat 17 and the wiping roller 1 13 and the wiping roller 2 14 are connected to realize the entry of gas, and high-pressure gas is ejected through the air holes 15 on the wiping roller 13 and the wiping roller 2 14. The high-pressure gas has a certain impact force, which helps to remove impurities attached to the wall surface. At the same time, the high-pressure gas can also form an airflow to blow off the impurities attached to the inside of the solid-state relay, and quickly remove the loose impurities inside the solid-state relay. Then, through the contact between the surfaces of the wiping roller 13 and the wiping roller 2 14 and the inside of the solid-state relay housing, the fine particles attached to the internal surface and corners of the relay are further removed to ensure the thoroughness of the cleaning. Finally, the impurities enter the dust chamber 34 through the suction channel 8 and are collected in a centralized manner. The particles generated during the cutting process can be efficiently collected to avoid secondary pollution. After the cleaning is completed, the lifting plate rotates and resets, and after the turntable 7 is turned over, the cleaned solid-state relay is transferred to the position of the conveying conveying belt 2, and is conveyed to the next processing step through the conveying belt 2. ;

[0037] See also Figure 3 As shown, a limit groove is provided on the surface of the slide plate 11, and a limit plate 12 is slidably installed in the limit groove. The limit plate 12 is rotatably connected to the wiping roller 13 and the wiping roller 14, and the upper end surface of the limit plate 12 is provided with a spring 16 fixed to the inside of the limit groove. The limit plate 12 slides in the limit groove and squeezes the spring 16, so that the wiping roller 13 and the wiping roller 14 can adapt to different heights when sliding to meet the cleaning needs of different scenarios.

[0038] See also Figure 4 and Figure 7As shown, an air inlet 36 is provided at the top of the cylinder body 35, and an air outlet 38 is provided on one side of the cylinder body 35. A one-way valve is embedded in the air outlet 38. A piston 37 is slidably installed on the side of the inner cavity of the cylinder body 35 near the air inlet 36. The top of the inlet pipe 18 enters the interior of the slide plate 11 and slides along the groove of the side wall of the adsorption plate 9. The inlet pipe 18 is connected to the air outlet 38 through a hose. The design of the hose can maintain gas circulation when the slide plate 11 slides in the transverse guide rail 10. When the cylinder body 35 is working, the piston 37 is pushed by the hydraulic pressure to slide along the inside of the cylinder body 35. In this process, gas enters from the air inlet 36, and the piston 37 continues to move until it reaches the limit position of the cylinder body 35, and the gas in front is compressed to form a higher air pressure. At this time, the one-way valve at the air outlet 38 opens to allow high-pressure gas to be discharged. When the piston 37 is reset, the one-way valve is closed to prevent gas backflow, thereby ensuring the one-way flow of gas.

[0039] See also Figure 4 As shown, the surface of the adsorption plate 9 is provided with a truncated cone groove inclined inwardly to guide the falling of impurities.

[0040] See also Figure 6 As shown, the blowing and brushing dust collection assembly also includes a supporting cylinder 28 arranged on the turntable 7, and a rotating column 29 driven by a rotating motor is arranged inside the supporting cylinder 28, and one end of the rotating column 29 is fixedly connected to a reinforcement frame 32, and the lower surface of the reinforcement frame 32 is provided with an electric push rod 33 for pushing the dust collection chamber 34 to move, and the reinforcement frame 32 and the lifting plate are slidingly arranged. Initially, the adsorption plate 9 is located directly above the end solid-state relay. Under the push of the electric push rod 33, the lifting plate and the reinforcement frame 32 slide in a limited position, so that the adsorption plate 9 is fitted with the solid-state relay, completing the adsorption and flipping work of the solid-state relay, and facilitating the cleaning of the inner cavity of the solid-state relay.

[0041] See also Figure 6 As shown, a ratchet 30 is sleeved on the outside of the driving shaft of the rotating motor, and a pawl 31 engaged with the ratchet 30 is installed inside the supporting cylinder 28 for lifting and lowering. The rotating column 29 is driven by the rotating motor to rotate in close proximity to the supporting cylinder 28. When it stops, the pawl 31 is engaged downwardly on the teeth of the ratchet 30 to complete the limitation of the rotating column 29 and ensure the stability of the reinforcement frame 32.

[0042] See also Figure 5As shown, the limit assembly includes a fixed seat 19 that is set to be lifted, and a vibration motor 20 is installed on the inner wall surface of the fixed seat 19. The output end of the vibration motor 20 is connected to an extended vertical plate 21 of a rectangular structure. The inner side surface of the extended vertical plate 21 is provided with an L-shaped card cavity, and the inner wall of the card cavity is installed with a folding portion. The position of the solid-state relay is first locked by the limit assembly, and then laser cutting is performed. When locked, the fixed seat 19 moves downward and contacts the positioning seat 3. At this time, the folding portion is in a contracted state, and the top of the solid-state relay is blocked by the extended vertical plate 21 and its folding portion, and the top of the laser cutting inside the solid-state relay is intercepted to avoid the scattering of impurities during cutting. When the cutting is completed, the folding portion rises with the extended vertical plate 21. At this time, the folding portion is in an expanded state and contacts the upper end surface of the solid-state relay housing, and through the vibration of the vibration motor 20, the impurities in the extended vertical plate 21 and the folding portion are vibrated into the solid-state relay housing. The whole process is in a connected state and will not cause leakage of impurities.

[0043] The folding portion includes a folding curtain 24 connected to the top surface of the card cavity, and the end of the folding curtain 24 is fixedly connected to a gasket 25 in contact with the surface of the solid-state relay;

[0044] A vertical guide rail 26 is provided in the cavity outside the lower end surface of the extended vertical plate 21, and a slide seat 27 is slidably provided outside the vertical guide rail 26, and one side of the bottom of the slide seat 27 is fixed to the gasket 25;

[0045] The inner wall surface of the processing chamber 1 is fixed with a frame plate 22 which is slidably arranged with the extended vertical plate 21, and the lower end surface of the frame plate 22 is provided with a cleaning brush 23 which contacts with the extended vertical plate 21. During cutting, the folding curtain 24 is in a retracted state, and the slide 27 is located at the upper part of the vertical guide rail 26 at this time. After the cutting is completed, the limit assembly moves upward at this time, that is, the fixed seat 19 and its extended vertical plate 21 are upward. In order to prevent impurities from leaking, the slide 27 slides in the vertical guide rail 26 to push the gasket 25 downward, that is, in the rising state, the gasket 25 is always in contact with the upper end surface of the solid-state relay to ensure its connection state, that is, when the extended vertical plate 21 is rising, the cleaning brush 23 wipes and removes the impurities attached to the extended vertical plate 21, and the folding curtain 24 is in an expanded state at this time, and the impurities on the folding curtain 24 are shaken off by the vibration of the vibration motor 20. After completing this action, the slide 27 slides on the vertical guide rail 26 and reaches the initial height to continue the processing of the next step.

[0046] See also Figure 1 and Figure 5As shown, at least one stroke cylinder 4 connected to a fixed seat 19 is provided at the top of the inner cavity of the processing chamber 1, and a multi-stage sliding plate 5 is installed on the upper end surface of the fixed seat 19. The multi-stage sliding plate 5 is fixed to the top surface of the inner cavity of the processing chamber 1, and a laser component 6 that moves horizontally and vertically in the processing chamber 1 is provided on the inner side of the multi-stage sliding plate 5. When working, the sliding laser component 6 performs laser cutting on the inside of the solid-state relay to meet production needs. Before laser cutting, the fixed seat 19 is pushed downward by the stroke cylinder 4, and at the same time, the multi-stage sliding plate 5 is extended in multiple stages to ensure the stable sliding of the fixed seat 19.

[0047] When the present invention is in use, the position of the solid-state relay is first limited by the limit assembly, and the workpiece after laser processing reaches the bottom of the adsorption plate 9, working simultaneously without affecting each other, the lifting plate moves downward to push the adsorption plate 9 to contact the solid-state relay, and under the suction of negative pressure, the bottom edge of the adsorption plate 9 adsorbs and fits the solid-state relay, and then the lifting plate flips and rotates so that the bottom of the solid-state relay faces upward, that is, the opening of the solid-state relay faces downward, ensuring that impurities fall off during blowing and rolling cleaning. When cleaning the inside of the solid-state relay, the synchronously rotating wiping roller 13 and wiping roller 2 14 clean the inner cavity of the solid-state relay. During the cleaning process, the slide plate 11 slides on the transverse guide rail 10, synchronously driving the wiping roller 13 and the wiping roller 2 14 to move back and forth, changing the cleaning and blowing positions, and the cylinder body 35 delivers gas. High-pressure gas is ejected through the air holes 15 on the wiping roller 13 and the wiping roller 14. The high-pressure gas has a certain impact force and airflow, which blows away the impurities attached to the inside of the solid-state relay and quickly removes the loose impurities inside the solid-state relay. Then, the surfaces of the wiping roller 13 and the wiping roller 14 are in contact with the inside of the solid-state relay housing to further remove the fine particles attached to the internal surface and corners of the relay to ensure the thoroughness of the cleaning. Finally, the impurities enter the dust chamber 34 through the suction channel 8 and are collected in a centralized manner. The particles generated during the cutting process can be efficiently collected to avoid secondary pollution. After the cleaning is completed, the lifting plate rotates and resets to the initial position, and after the turntable 7 is turned clockwise, the cleaned solid-state relay is transferred to the position of the conveying conveyor belt 2, and is conveyed to the next processing step through the conveyor belt 2.

[0048] By arranging the extended vertical plate 21 and its folded portion on the top of the solid-state relay, impurities generated by its laser cutting are intercepted to prevent the impurities from flying during cutting, and the gasket 25 is pushed downward by the sliding seat 27 in the vertical guide rail 26, that is, in the rising state, the gasket 25 is always in contact with the upper end surface of the solid-state relay to ensure its connection state, that is, when the extended vertical plate 21 rises, the cleaning brush 23 wipes and removes the impurities attached to the extended vertical plate 21, and the folding curtain 24 is in the unfolded state at this time, and the vibration of the vibration motor 20 is used to vibrate the impurities on the folding curtain 24 into the solid-state relay housing.

[0049] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A laser cutting processing device for a solid-state relay, comprising a processing chamber (1) arranged on a substrate, characterized in that: The processing chamber (1) is provided with a conveyor belt 1 (2) and a conveyor belt 2, and the surfaces of the conveyor belt 1 (2) and the conveyor belt 2 are elastically mounted with a plurality of positioning seats (3) for limiting the position of the solid-state relay housing, and the processing chamber (1) is equipped with a limiting component for laser cutting of the solid-state relay, and a turntable (7) is rotatably mounted on one side of the processing chamber (1) adjacent to the limiting component, and the surface of the turntable (7) is equipped with a blowing and dust collection component for cleaning the inside of the solid-state relay after cutting; The blowing and brushing dust collection component comprises a rotatable lifting plate, the lower end of the lifting plate is fixedly connected to an adsorption plate (9) adsorbedly connected to a solid-state relay, and a suction channel (8) is provided between the lifting plate and the adsorption plate (9), a transverse guide rail (10) is embedded in the bottom surface of the adsorption plate (9), and a cylinder body (35) mounted on the lifting plate is provided above the adsorption plate (9), a dust collection chamber (34) communicating with the suction channel (8) is installed on one side of the cylinder body (35), an L-shaped slide plate (11) is slidably installed on the surface of the transverse guide rail (10), and the slide plate (11) is provided with a plurality of air-conditioning elements, wherein the plurality of air-conditioning elements are ... 1) A wiping roller (13) and a wiping roller (14) are rotatably mounted therein and rotate simultaneously. The wiping roller (13) and the wiping roller (14) are both provided with a plurality of air holes (15). The rotating ends of the wiping roller (13) and the wiping roller (14) are connected to a vent seat (17). An inlet pipe (18) is provided at the connection between the end of the vent seat (17) and the cylinder body (35). When the blowing and brushing dust collection assembly is in operation, the solid-state relay is adsorbed by the adsorption plate (9) and flipped and rotated half a circle by the lifting plate, so that the bottom of the solid-state relay faces upward.

2. The laser cutting processing equipment for solid-state relays according to claim 1, characterized in that: The surface of the slide plate (11) is provided with a limit groove, in which a limit plate (12) is slidably installed, the limit plate (12) is rotatably connected to the wiping roller 1 (13) and the wiping roller 2 (14), and the upper end surface of the limit plate (12) is provided with a spring (16) fixed to the inside of the limit groove.

3. The laser cutting processing equipment for solid-state relays according to claim 1, characterized in that: The top of the cylinder body (35) is provided with an air inlet (36), and one side of the cylinder body (35) is provided with an air outlet (38), a one-way valve is embedded in the air outlet (38), a piston (37) is slidably mounted on the side of the inner cavity of the cylinder body (35) close to the air inlet (36), the top of the inlet pipe (18) enters the interior of the slide plate (11) and slides along the groove of the side wall of the adsorption plate (9), and the inlet pipe (18) is connected to the air outlet (38) through a hose.

4. The laser cutting processing equipment for solid-state relays according to claim 1, characterized in that: The surface of the adsorption plate (9) is provided with a truncated cone groove inclined inwardly.

5. The laser cutting processing equipment for solid-state relays according to claim 1, characterized in that: The blowing and brushing dust collection assembly also includes a supporting cylinder (28) arranged on the turntable (7), a rotating column (29) driven by a rotating motor is arranged inside the supporting cylinder (28), one end of the rotating column (29) is fixedly connected to a reinforcement frame (32), the lower surface of the reinforcement frame (32) is provided with an electric push rod (33) for pushing the dust collection chamber (34) to move, and the reinforcement frame (32) is slidably arranged with the lifting plate.

6. The laser cutting processing equipment for solid-state relays according to claim 5, characterized in that: A ratchet (30) is sleeved on the outside of the driving shaft of the rotating motor, and a ratchet pawl (31) engaged with the ratchet (30) is installed in a lifting manner inside the bearing cylinder (28).

7. The laser cutting processing equipment for solid-state relays according to claim 1, characterized in that: The position limiting assembly comprises a lifting fixed seat (19), the inner wall surface of the fixed seat (19) is equipped with a vibration motor (20), the output end of the vibration motor (20) is connected to an extended vertical plate (21) with a rectangular structure, the inner side surface of the extended vertical plate (21) is provided with an L-shaped card cavity, and the inner wall of the card cavity is equipped with a folding portion.

8. The laser cutting processing equipment for solid-state relays according to claim 7, characterized in that: The folding portion comprises a folding curtain (24) connected to the top surface of the card cavity, and the end of the folding curtain (24) is fixedly connected with a gasket (25) in contact with the surface of the solid-state relay.

9. The laser cutting processing equipment for solid-state relays according to claim 7, characterized in that: A vertical guide rail (26) is provided in the cavity outside the lower end surface of the extended vertical plate (21), a sliding seat (27) is slidably provided outside the vertical guide rail (26), and one side of the bottom of the sliding seat (27) is fixed to the gasket (25); A frame plate (22) slidably arranged with the extended vertical plate (21) is fixed to the inner wall surface of the processing chamber (1), and a cleaning brush (23) in contact with the extended vertical plate (21) is arranged on the lower end surface of the frame plate (22).

10. The laser cutting processing equipment for solid-state relays according to claim 7, characterized in that: At least one stroke cylinder (4) connected to a fixed seat (19) is provided at the top of the inner cavity of the processing chamber (1); a multi-stage sliding plate (5) is installed on the upper end surface of the fixed seat (19); the multi-stage sliding plate (5) is fixed to the top surface of the inner cavity of the processing chamber (1); and a laser component (6) that moves horizontally and vertically in the processing chamber (1) is provided on the inner side of the multi-stage sliding plate (5).

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