Laser heating device

Abstract

The invention relates to a laser heating device. The laser heating device comprises a first carrier plate, a second carrier plate and a plurality of laser chips. The second carrier plate and the first carrier plate are oppositely arranged, and a containing space used for containing a blow molding raw blank is formed between the first carrier plate and the second carrier plate. The plurality of laser chips are arranged in an array on the surface, facing the second support plate, of the first support plate and the surface, facing the first support plate, of the second support plate. The laser chip is high in heating efficiency, low in power consumption and controllable in heating range.

Description

Technical Field

[0001] The present application relates to the technical field of blow molding, and in particular to a laser heating device. Background Art

[0002] In the blow molding process, it is usually necessary to heat the blow molding embryo, and then move the blow molding embryo to the blow molding mold after the heating is completed. The blow molding embryo is expanded by injecting compressed air into the blow molding embryo, and then shaped under the action of the mold. However, the blow molding process in the related art has low heating efficiency when heating the blow molding embryo, large power consumption, and uncontrollable heating range, which affects the heating effect. Summary of the invention

[0003] Based on this, it is necessary to provide a laser heating device to address the problems of low heating efficiency, high power consumption, and uncontrollable heating range when heating blow molded embryos in related technologies.

[0004] A laser heating device, comprising:

[0005] The first carrier board;

[0006] a second carrier plate, arranged opposite to the first carrier plate, and a receiving space for receiving blow molded preforms is formed between the first carrier plate and the second carrier plate; and

[0007] A plurality of laser chips are arranged in an array on a surface of the first carrier plate facing the second carrier plate and on a surface of the second carrier plate facing the first carrier plate.

[0008] The above-mentioned laser chip uses a laser chip to heat the blow molded embryo. The laser chip can provide sufficient heating power and consumes less electricity. The laser chip is arranged on the first carrier plate and the second carrier plate relative to each other, so that the blow molded embryo can be heated from the opposite sides of the blow molded embryo, thereby improving the heating efficiency. At the same time, the first carrier plate and the second carrier plate are arranged relative to each other, and at least part of the laser emitted by the laser chips on the first carrier plate and the second carrier plate can be reflected multiple times on the two relative surfaces and absorbed by the blow molded embryo multiple times, which is also beneficial to improving the heating efficiency, and is also beneficial to improving the utilization efficiency of the laser, thereby reducing the power consumption of the laser heating device. In addition, the laser emitted by the laser chip has good directivity, and the design of the laser chip array arrangement is conducive to local control of the size of the laser power, so that effective control of the heating range can be achieved, and a good heating effect can be provided according to different heating requirements.

[0009] In one embodiment, the first carrier plate and the second carrier plate are arranged parallel to each other. The first carrier plate and the second carrier plate are arranged parallel to each other so that the laser emitted by the laser chip on the two opposite surfaces of the first carrier plate and the second carrier plate has a suitable incident angle on the two opposite surfaces, which is conducive to improving the reflection efficiency of the laser on the first carrier plate and the second carrier plate, thereby improving the utilization efficiency of the laser, improving the heating efficiency and reducing the power consumption.

[0010] In one embodiment, the surface of the first carrier plate facing the second carrier plate and the portion of the surface of the second carrier plate facing the first carrier plate where the laser chip is not provided are provided as reflective surfaces, which is beneficial to improving the reflection efficiency of the laser on the two surfaces opposite to each other of the first carrier plate and the second carrier plate, thereby improving the utilization efficiency of the laser, improving the heating efficiency and reducing the power consumption.

[0011] In one embodiment, the laser heating device further comprises a bottom plate, the bottom plate is connected to the edges of the first carrier plate and the second carrier plate, and the bottom plate, the first carrier plate and the second carrier plate jointly define the accommodating space. Providing the bottom plate can improve the fixing effect and positioning accuracy of the first carrier plate and the second carrier plate, and the bottom plate can also be used to carry and place the blow molded embryo, so that the laser can effectively heat the blow molded embryo from both sides.

[0012] In one embodiment, the surface of the bottom plate facing the accommodating space is set as a reflective surface, so that at least part of the laser beam projected onto the bottom plate can also be reflected onto the first carrier plate, the second carrier plate or the blow molded embryo to participate in heating again, which is conducive to further improving the utilization efficiency of the laser, improving the heating efficiency and reducing the power consumption.

[0013] In one embodiment, the surface of the bottom plate facing the accommodating space, the surface of the first carrier plate facing the second carrier plate, and the surface of the second carrier plate facing the first carrier plate are all provided with a reflective film layer. Providing the reflective film layer to form a reflective surface can improve the reflection efficiency of the laser on the first carrier plate, the second carrier plate, and the bottom plate, thereby improving the utilization efficiency of the laser, improving the heating efficiency, and reducing the power consumption.

[0014] In one embodiment, the laser chip is a vertical cavity surface emitting laser, which can provide sufficient heating power with low power consumption, and emits lasers with good directivity, thereby improving the heating effect.

[0015] In one embodiment, the laser chips are arranged in an equidistant array on the surface of the first carrier plate facing the second carrier plate and on the surface of the second carrier plate facing the first carrier plate. The evenly distributed arrangement of the laser chips can provide a uniform heating effect and is also conducive to controlling the size of the local heating power to meet different heating requirements.

[0016] In one embodiment, the power control of at least part of the laser chips is independent of the power control of another part of the laser chips. The power of the local laser chips can be controlled independently, which is beneficial to the control of the local heating power and meets different heating requirements.

[0017] In one embodiment, the first carrier plate and the second carrier plate are both substantially in the form of a long strip structure, so as to form a receiving space for a plurality of blow-molded embryos to be arranged in sequence along the extension direction of the first carrier plate and the second carrier plate. The first carrier plate and the second carrier plate form a long strip receiving space, so that the blow-molded embryos can be arranged in sequence along the extension direction of the first carrier plate and the second carrier plate, so that the laser chip can provide a uniform and sufficient heating effect to each blow-molded embryo. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the structure of the laser heating device in some embodiments.

[0019] Figure 2 for Figure 1 A schematic structural diagram of the laser heating device from another angle is shown.

[0020] Figure 3 for Figure 1 The schematic diagram of the structure of the laser heating device shown is from another angle.

[0021] Figure 4 for Figure 1 The laser heating device shown is a schematic structural diagram from another angle.

[0022] Figure 5 This is a schematic diagram of the structure in which a laser chip is arranged on the first carrier in some embodiments.

[0023] Reference numerals:

[0024] 10. Laser heating device; 11. First carrier plate; 111. First surface; 12. Second carrier plate; 121. Second surface; 13. Accommodating space; 14. Laser chip; 15. Bottom plate; 20. Blow molding embryo. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0026] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0029] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0031] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 , Figure 2 , Figure 3 and Figure 4 They are schematic diagrams of the structure of the laser heating device 10 at different angles in some embodiments. The laser heating device 10 provided in the present application can be used to heat the blow-molded embryo 20 during the blow molding process. For example, after the blow-molded embryo 20 is obtained in the blow molding process, the blow-molded embryo 20 is heated by the laser heating device 10 to soften it, and then the blow-molded embryo 20 is moved from the laser heating device 10 to the blow molding mold, and compressed air is injected into the blow-molded embryo 20 to expand the blow-molded embryo 20, so that it is shaped under the action of the mold, and the blow molding process is completed after cooling.

[0032] In some embodiments, the laser heating device 10 includes a first carrier plate 11 and a second carrier plate 12, the first carrier plate 11 and the second carrier plate 12 are arranged opposite to each other, the first carrier plate 11 has a first surface 111 facing the second carrier plate 12, the second carrier plate 12 has a second surface 121 facing the first carrier plate 11, and a receiving space 13 for receiving the blow molded embryo 20 is formed between the first surface 111 of the first carrier plate 11 and the second surface 121 of the second carrier plate 12. The laser heating device 10 also includes a plurality of laser chips 14 for emitting lasers, and the plurality of laser chips 14 are arranged in an array on the first surface 111 and the second surface 121. In the process of heating the blow molded embryo 20 using the laser heating device 10, the plurality of blow molded embryos 20 can be accommodated between the first surface 111 and the second surface 121, and the laser chips 14 arranged in an array on the first surface 111 and the second surface 121 emit lasers to the blow molded embryo 20 to heat the blow molded embryo 20.

[0033] The laser chip 14 is used to heat the blow molded embryo 20. The laser chip 14 can provide sufficient heating power and consume less electricity. The laser chip 14 is arranged on the first carrier plate 11 and the second carrier plate 12 relative to each other, so that the blow molded embryo 20 can be heated from the opposite sides of the blow molded embryo 20, thereby improving the heating efficiency. At the same time, the first carrier plate 11 and the second carrier plate 12 are arranged relative to each other, and at least part of the laser emitted by the laser chip 14 on the first carrier plate 11 and the second carrier plate 12 can be reflected multiple times on the two relative surfaces and absorbed by the blow molded embryo 20 multiple times, which is also beneficial to improving the heating efficiency, and is also beneficial to improving the utilization efficiency of the laser, thereby reducing the power consumption of the laser heating device 10. In addition, the laser emitted by the laser chip 14 has good directivity, and the design of the array arrangement of the laser chip 14 is beneficial to local control of the size of the laser power, thereby being able to achieve effective control of the heating range and provide a good heating effect according to different heating requirements.

[0034] In some embodiments, the first surface 111 and the second surface 121 are substantially parallel, and the extension directions of the first carrier plate 11 and the second carrier plate 12 can be substantially parallel to each other. It is understandable that when the first surface 111 and the second surface 121 are parallel to each other, when the laser emitted by the laser chip 14 disposed on the first surface 111 is emitted to the second surface 121, it is easier to reflect back to the first surface 111 with the same emission angle, thereby improving the reflection efficiency of the laser on the first surface 111 and the second surface 121, so that at least part of the laser can be reflected back and forth between the first surface 111 and the second surface 121 for multiple times, so as to be absorbed by the blow molded embryo 20 for multiple times, which is conducive to improving the heating efficiency of the blow molded embryo 20 by the laser, and at the same time improving the utilization efficiency of the laser, thereby improving the heating efficiency and reducing the power consumption.

[0035] In some embodiments, the laser heating device 10 further includes a bottom plate 15, the bottom plate 15 is connected to the edge of the first carrier plate 11 and the second carrier plate 12, and the bottom plate 15, the first carrier plate 11 and the second carrier plate 12 jointly define a receiving space 13. The bottom plate 15, the first carrier plate 11 and the second carrier plate 12 can be an integral structure, or three plate-like structures connected to each other by any applicable fixed connection method such as screw connection, welding, etc. When the blow molded embryo 20 is heated, the blow molded embryo 20 can be placed on the bottom plate 15. Of course, the blow molded embryo 20 can also be placed in the receiving space 13 by hanging, and the blow molded embryo 20 may not contact the bottom plate 15. The bottom plate 15 can improve the fixing effect and positioning accuracy of the first carrier plate 11 and the second carrier plate 12, improve the structural strength of the laser heating device 10, and can also serve as a carrier of the blow molded embryo 20, so that the laser can effectively heat the blow molded embryo 20 from two opposite sides.

[0036] In some embodiments, the surface of the bottom plate 15 facing the accommodating space 13 is set as a reflective surface. The specific method of setting the reflective surface includes but is not limited to coating a reflective film layer on the surface of the bottom plate 15. The reflective film layer is but is not limited to any suitable film layer with good reflective performance such as a silver film. The surface of the bottom plate 15 is set as a reflective surface, so that at least part of the laser projected on the bottom plate 15 can be reflected to the first carrier plate 11, the second carrier plate 12 or the blow molding element to participate in the heating effect again, which is conducive to further improving the utilization efficiency of the laser, improving the heating efficiency and reducing the power consumption.

[0037] Of course, in some embodiments, the portion of the first surface 111 and the second surface 121 where the laser chip 14 is not disposed may also be disposed as a reflective surface, which is beneficial to improving the reflection efficiency of the laser on the first surface 111 and the second surface 121, so that more light can be reflected back and forth between the first surface 111 and the second surface 121 for multiple times, thereby facilitating improving the utilization efficiency of the laser, improving the heating efficiency and reducing the power consumption. A reflective film layer such as a silver film may also be disposed on the first surface 111 and the second surface 121 to form a reflective surface. For example, in some embodiments, before the laser chip 14 is disposed, a reflective film layer may be disposed on the entire surface of the first surface 111 and the second surface 121, and then the laser chip 14 may be disposed on the first surface 111 and the second surface 121, so that the portions of the first surface 111 and the second surface 121 where the laser chip 14 is not disposed are all disposed as reflective surfaces, fully improving the utilization efficiency of the laser, and also facilitating simplifying the manufacturing process and manufacturing difficulty of the laser heating device 10.

[0038] In some embodiments, the laser chip 14 can be a vertical cavity surface emitting laser (VCSEL), which can provide sufficient heating power and consume little electricity. The emitted laser has good directivity and can improve the heating effect. For example, the total power of the laser chips 14 arranged on the first surface 111 and the second surface 121 can reach the 10,000-watt level, which can provide sufficient heating power. The wavelength and power settings of the laser chip 14 are not limited, and can be specifically designed according to the heating requirements of the blow molded embryo 20. The number of laser chips 14 is also not limited, and can be specifically designed according to the size of the first carrier plate 11 and the second carrier plate 12, the number of blow molded embryos 20, and the heating requirements. It will not be repeated in this application.

[0039] Combination Figure 3 and Figure 5As shown, in some embodiments, the laser chips 14 are arranged in an equidistant array on the first surface 111 and the second surface 121. For example, the laser chips 14 are arranged in an array on the first surface 111 and the second surface 121 to form multiple rows and multiple columns, and the row and column spacings of the row and column arrays formed by the laser chips 14 are equal. The uniform distribution of the laser chips 14 can provide a uniform heating effect. At the same time, the distribution of the laser chips 14 is more regular, which is also conducive to controlling the size of the local heating power by controlling the output power of the local laser chips 14 to meet different heating requirements. In the present application, different heating requirements include but are not limited to different placement densities of the blow molding embryos 20 at different positions, and a larger heating power is required when the blow molding embryos 20 are placed more densely, and a smaller heating power is required when they are placed more loosely; or, the materials of the blow molding embryos 20 at different positions are different, resulting in different requirements for the size of the heating power at different positions. It can be seen from this that the laser heating device 10 provided in the present application performs heating through the laser chip 14 with good directivity, making the local heating power control more precise and simple, thereby being able to heat the blow molded blanks 20 of different materials or different placement densities at the same time.

[0040] In some embodiments, the power control of at least part of the laser chips 14 is independent of the power control of another part of the laser chips 14. For example, at least two parts of the laser chips 14 are power controlled through different control circuits. Thus, the power of the local laser chips 14 can be independently controlled, which is conducive to the control of the size of the local heating power and meets different heating requirements. Further, in some embodiments, the output power of all the laser chips 14 on the first surface 111 and the second surface 121 can be independently controlled, which is conducive to accurately controlling the heating power of each position and meeting different heating requirements. Of course, the control of the laser chips 14 facing each other on the first surface 111 and the second surface 121 can also be synchronously associated to jointly change the heating power of the corresponding position in the accommodating space 13. In some embodiments, the first surface 111 and the second surface 121 can also be divided into a plurality of heating areas, each heating area is provided with a plurality of array-arranged laser chips 14, the output power control of the laser chips 14 in the same heating area is synchronously associated, and the output power control of the laser chips 14 in different heating areas is independent of each other. In this way, the heating power of different areas can be effectively adjusted, and the manufacture and control of the laser heating device 10 can be made simpler and more convenient.

[0041] In some examples, the first carrier plate 11 and the second carrier plate 12 may be substantially in the form of a long strip-shaped structure, and the bottom plate 15 may also be substantially in the form of a long strip-shaped structure that is substantially equal in length to the first carrier plate 11 and the second carrier plate 12. Thus, the accommodating space 13 formed between the first carrier plate 11 and the second carrier plate 12 is substantially parallel to the extending direction of the first carrier plate 11 and the second carrier plate 12. When the blow molded embryo 20 is heated, a plurality of blow molded embryos 20 can be arranged in sequence along the eye direction of the first carrier plate 11 and the second carrier plate 12, and the two opposite sides of each blow molded embryo 20 can be opposite to the first surface 111 and the second surface 121, so that the laser heating device 10 can provide a uniform and sufficient heating effect for each blow molded embryo 20.

[0042] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laser heating device, characterized in that: include: The first carrier board; A second carrier plate is arranged opposite to the first carrier plate, and a receiving space for receiving the blow molded blank is formed between the first carrier plate and the second carrier plate; as well as, A plurality of laser chips are arranged in an array on a surface of the first carrier plate facing the second carrier plate and on a surface of the second carrier plate facing the first carrier plate.

2. The laser heating device according to claim 1, characterized in that: The first carrier plate and the second carrier plate are arranged parallel to each other.

3. The laser heating device according to claim 1, characterized in that: The surface of the first carrier plate facing the second carrier plate and the portion of the surface of the second carrier plate facing the first carrier plate where the laser chip is not arranged are arranged as reflection surfaces.

4. The laser heating device according to claim 1, characterized in that: The laser heating device further includes a bottom plate, which is connected to edges of the first carrier plate and the second carrier plate. The bottom plate, the first carrier plate and the second carrier plate jointly define the accommodating space.

5. The laser heating device according to claim 4, characterized in that: The surface of the bottom plate facing the accommodating space is configured as a reflective surface.

6. The laser heating device according to claim 5, characterized in that: A reflective film layer is disposed on a surface of the bottom plate facing the accommodating space, a surface of the first carrier plate facing the second carrier plate, and a surface of the second carrier plate facing the first carrier plate.

7. The laser heating device according to claim 1, characterized in that: The laser chip is a vertical cavity surface emitting laser.

8. The laser heating device according to claim 1, characterized in that: The laser chips are arranged in an equidistant array on a surface of the first carrier plate facing the second carrier plate and on a surface of the second carrier plate facing the first carrier plate.

9. The laser heating device according to claim 1, characterized in that: The power control of at least some of the laser chips is independent of the power control of another part of the laser chips.

10. The laser heating device according to claim 1, characterized in that: The first carrier plate and the second carrier plate are both substantially in the form of long strips, so as to form a containing space for a plurality of blow-molded embryos to be sequentially arranged in intervals along the extending direction of the first carrier plate and the second carrier plate.

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