Cooling system, image generation unit, and head-up display device

Abstract

The invention relates to a cooling system, an image generation unit and a head-up display device. In one aspect, a cooling system is provided that includes a cooling body for being disposed at and in contact with a back surface of a display panel of a head-up display device, the cooling body having a hollow structure for a cooling liquid to flow therethrough, and the cooling body being made of a transparent material. Therefore, the temperature of the display panel can be effectively reduced under the condition that normal display and work of the head-up display are not influenced.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to cooling systems, image generation units, and head-up display devices. Background Technology

[0002] Head-up display (HUD) devices are widely used in vehicles and other means of transportation. They are used to display vehicle information, such as vehicle status, on the windshield of the vehicle, so that the driver can obtain this information while maintaining continuous attention to road conditions.

[0003] Due to the translucency of the windshield, sunlight can pass through it and enter the HUD device. Reflected by large reflectors and other lenses, the sunlight travels in the opposite direction of the display light and focuses onto the display panel of the Picture Generation Unit (PGU). This can cause sudden temperature changes in localized areas of the display panel. When the temperature in this area exceeds the maximum allowable temperature range of the display panel, irreversible damage occurs—a phenomenon known as burn-in—leading to abnormal display and hindering the driver's ability to use the device.

[0004] Currently, the main solutions to the above problems include reducing the backlight power of the HUD device to reduce the temperature rise of the display panel caused by the backlight; or, detecting the temperature of the display panel and actively shutting down the HUD device when the temperature reaches the upper limit of use, and rotating the large reflector to the default power-off position to prevent external sunlight from focusing on the display panel.

[0005] However, screen burn-in is most likely to occur during daytime when there is plenty of sunlight, which coincides with the normal usage time of vehicles. Therefore, actively reducing backlight brightness or turning off the device to protect the display panel will affect the normal display and operation of the HUD, thus significantly impacting the user experience. Summary of the Invention

[0006] This section provides a general overview of this disclosure, rather than a full disclosure of the entire scope or all features of this disclosure.

[0007] The purpose of this disclosure is to provide a cooling system that can effectively reduce the temperature of the display panel of a HUD device without affecting the normal display and operation of the HUD.

[0008] To achieve the above objectives, according to one aspect of this disclosure, a cooling system is provided for a HUD device, comprising a cooling body disposed on and in contact with the back of the display panel of the HUD device, the cooling body having a hollow structure for coolant to flow through, and the cooling body being made of a transparent material.

[0009] In some embodiments, the cooling body may be provided with a light-diffusing structure, which is used to convert the backlight light into a divergent, uniform light. In the case where the cooling body is disposed on the back side, the backlight light enters the cooling body from the side of the cooling body away from the back side.

[0010] In some implementations, the light-diffusing structure can be a micro-reflective surface disposed on the surface of the cooling body.

[0011] In some implementations, the size of the cavity through which the coolant flows in the hollow structure can be configured such that the cavity covers the entire back of the display panel.

[0012] In some embodiments, the cooling system may further include a coolant for flowing through the cooling body, the coolant being a colorless liquid and satisfying at least one of the following conditions: light transmittance greater than or equal to 95%, freezing point below -40°C, and boiling point above 105°C.

[0013] In some implementations, the cooling element can be bonded to the back of the display panel using optical adhesive.

[0014] In some embodiments, the cooling system may further include a drive unit and a heat dissipation unit, wherein the drive unit, the heat dissipation unit, and the cooling body together constitute a circulation loop for the coolant, the drive unit is used to drive the coolant to flow in the circulation loop, and the heat dissipation unit is used to dissipate the heat of the coolant.

[0015] In some embodiments, the heat dissipation device may include a heat dissipation reservoir, a thermoelectric cooler heat sink, and a metal heat sink arranged in sequence along the flow direction of the coolant. The heat dissipation reservoir is used to receive the coolant, the thermoelectric cooler heat sink is used to transfer the heat of the coolant in the heat dissipation reservoir to the metal heat sink, and the metal heat sink is used to dissipate the heat.

[0016] In some implementations, the drive unit may be a gear pump.

[0017] In some embodiments, the cooling system may also include a temperature sensor for sensing the temperature of the front of the display panel, and the drive and heat dissipation devices start and stop based on the temperature sensed by the temperature sensor.

[0018] In some implementations, the temperature sensor can perform surface sensing on the front of the display panel.

[0019] According to another aspect of this disclosure, a PGU is also provided for a HUD device, comprising: Display panel; A backlight device, disposed on one side of the display panel, for providing backlight to the display panel; and According to any of the above embodiments, the cooling system's cooling element is disposed between the display panel and the backlight device and is in contact with the back of the display panel.

[0020] According to another aspect of this disclosure, a HUD device is also provided, which includes a cooling system according to any of the above embodiments, or includes a PGU according to the above embodiments.

[0021] According to the above technical solution, by making the cooling body have a hollow structure for coolant to flow through and by arranging the cooling body in contact with the display panel, cooling of the display panel can be achieved. Furthermore, by placing the cooling body on the back of the display panel and making it from a transparent material, the cooling body can be prevented from affecting the quality of the displayed image. Therefore, without affecting the normal display and operation of the HUD, the temperature of the HUD display panel can be effectively reduced to avoid screen burn-in, thereby improving the user experience of the HUD. Attached Figure Description

[0022] The features and advantages of embodiments of the present disclosure will become more readily understood from the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be enlarged or reduced to show details of specific components. In the drawings: Figure 1 This is a schematic diagram of the PGU (Power Generation Unit) of a HUD (Head-Up Display) device based on related technologies

[0023] Figure 2 This is a schematic front view of a cooling body of a cooling system according to an embodiment of the present disclosure, wherein the cooling body is shown located on the back of a display panel.

[0024] Figure 3 for Figure 2 A schematic top view of the cooling body shown.

[0025] Figure 4 for Figure 2 A schematic side view of the cooling body shown.

[0026] Figure 5 for Figure 2 A partial perspective view of the cooling body shown.

[0027] Figure 6 This is a schematic diagram of the structure of a PGU according to an embodiment of the present disclosure, viewed from a side view, in which only the cooling body of the cooling system is shown.

[0028] Figure 7 Viewed from a slanted, top-down perspective Figure 6 The diagram shows the structure of the PGU.

[0029] Figure 8 for Figure 6 The exploded view of PGU shown.

[0030] Figure 9 This is a schematic diagram of the cooling system according to an embodiment of the present disclosure.

[0031] Figure 10 for Figure 9 An exploded view of the heat dissipation device of the cooling system shown.

[0032] Figure 11 for Figure 9 The diagram shows the structure of the heat dissipation device of the cooling system.

[0033] Figure 12 The working principle of the semiconductor cooler heat sink of the heat dissipation device is illustrated schematically.

[0034] Figure 13 for Figure 9 The diagram shows the structure of the drive unit of the cooling system.

[0035] Figure 14 The installation location of the temperature sensor is schematically shown.

[0036] Figure 15 The installation location of the temperature sensor is schematically shown from another perspective.

[0037] Figure 16 The working status of the temperature sensor is schematically shown.

[0038] In the accompanying drawings, the same or corresponding technical features or components are represented by the same or corresponding reference numerals. Detailed Implementation

[0039] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0040] It should be noted that, for clarity, not all features of a particular embodiment are described or shown in the specification and drawings. Furthermore, to avoid unnecessary details obscuring the technical solutions of interest in this disclosure, only the device structure closely related to the technical solutions of this disclosure is described and shown in the specification and drawings, while other details that are not closely related to the technical content of this disclosure and are known to those skilled in the art are omitted.

[0041] In related technologies, HUD devices typically include a PGU (Power Controller Unit) and a reflective unit with a large reflector. The PGU emits display light carrying information such as vehicle status toward the reflective unit. The display light is reflected by the reflective unit to the windshield, and finally reflected by the windshield to the head-up display, thereby forming a display image for the driver to view.

[0042] Reference Figure 1 The illustration shows an exemplary internal structure of the related technology PGU10'. PGU10' includes a display panel 11' and a backlight device 12'.

[0043] A backlight device 12' is disposed on one side of the display panel 11', that is, on the light-inlet side of the display panel 11' with respect to the display light S1', for providing backlight to the back surface 11'a of the display panel 11'. The back surface 11'a is the side opposite to the front surface 11'b of the display panel 11', which is the light-outlet surface with respect to the display light S1'.

[0044] Display panel 11' is used to allow backlight S2' provided by backlight device 12' to pass through it to form display light S1' carrying information such as vehicle status. Display panel 11' can be, for example, a liquid crystal display (LCD), a diffuser screen, etc.

[0045] It should be noted that the HUD devices and PGUs described herein are not necessarily within the scope of prior art.

[0046] As mentioned earlier, sunlight shines along the reverse path of the HUD device's display light and focuses onto the display panel 11', causing sudden temperature changes in a localized area of ​​the display panel 11'. When the temperature in this area exceeds the upper limit, screen burn-in occurs.

[0047] Currently, the temperature rise of the display panel 11' caused by the backlight is reduced by actively decreasing the brightness of the backlight provided by the backlight device 12', or by actively shutting down the large reflector to the default power-off position to prevent external sunlight from shining on the display panel 11', thus reducing the temperature of the aforementioned area of ​​the display panel 11'. However, the above solutions will affect the normal display and operation of the HUD, thereby significantly impacting the user experience of the HUD.

[0048] This problem can be solved by a cooling system according to an embodiment of the present disclosure. Hereinafter, reference will be made to... Figures 2 to 16 The cooling system 20 according to embodiments of the present disclosure will be described in detail.

[0049] First, refer to Figures 2 to 4The cooling system 20 includes a cooling body 210.

[0050] Cooling element 210 is used to install on the PGU10 of the HUD device (see Figure 6 The display panel 11 is located on the back side 11a and in contact with the back side 11a. The cooling body 210 has a hollow structure for the flow of coolant and is made of a transparent material.

[0051] By having a hollow structure through which coolant flows, the cooling body 210 can cool objects in contact with it using the coolant flowing through it. Since the cooling body 210 is arranged in contact with the display panel 11, it is possible to cool the display panel 11 so that the temperature of each area of ​​the display panel 11, especially the area where external sunlight is focused back into the HUD device, does not exceed the upper limit of the allowable temperature of the display panel 11, thereby avoiding screen burn-in problems.

[0052] Furthermore, as mentioned earlier, the back surface 11a of the display panel 11 is the opposite side to the front surface 11b of the display panel 11, which is the light-emitting surface with respect to the display light S1. By arranging the cooling body 210 at the back surface 11a of the display panel 11, the display light S1 emitted from the front surface 11b of the display panel 11 will not pass through the cooling body 210, thereby preventing the cooling body 210 from interfering with the display light S1 (e.g., reflection and refraction). Moreover, by making the cooling body 210 a transparent material, the backlight light S2 emitted toward the back surface 11a of the display panel 11 can penetrate the cooling body 210 and illuminate the back surface 11a, thereby preventing the cooling body 210 from interfering with the backlight light S2. Thus, it is possible to prevent the cooling body 210 from affecting the quality of the displayed image.

[0053] In this way, the temperature of the HUD device's display panel can be effectively reduced without affecting the normal display and operation of the HUD, thus avoiding screen burn-in and improving the user experience of the HUD.

[0054] Understandably, the contact here includes both direct and indirect contact, and its purpose is solely to allow the coolant in the cooling body 210 to absorb heat from the display panel 11 through contact.

[0055] In some examples, the transparent material can be, for example, glass, transparent plastic, or any other type of transparent material.

[0056] In some implementations, such as Figures 2 to 4 As shown, the cooling body 210 includes an inlet 2101 and an outlet 2102 respectively disposed on opposite sides thereon.

[0057] By setting the inlet 2101 and outlet 2102 and placing them on opposite sides of the cooling body 210, the coolant can flow through the cooling body 210 and the flow of the coolant in the cooling body 210 can be made smoother, thereby quickly removing the heat from the display panel 11.

[0058] In some implementations, in conjunction with reference Figure 5 The cooling body 210 may be provided with a light-uniforming structure 2110, which is used to make the backlight S2 into a divergent uniform light. When the cooling body 210 is provided on the back surface 11a of the display panel 11, the backlight S2 enters the cooling body 210 from the side of the cooling body 210 away from the back surface 11a.

[0059] like Figure 2 As shown, when the cooling body 210 is provided on the back 11a of the display panel 11, the backlight device 12 of the HUD device PGU10 (see Figure 11) Figure 6 The backlight S2 provided will come from the side of the cooling body 210 away from the back surface 11a (i.e., Figure 2 The backlight S2 is incident on the cooling body 210 from the lower side of the cooling body 210. The backlight S2 is usually a collimated parallel light. Through the uniform light structure 2110 provided on the cooling body 210, the backlight S2 incident on the cooling body 210 can be transformed into a divergent uniform light. As a result, the backlight S2 emitted from the cooling body 210 can be evenly distributed on the entire back surface 11a of the display panel 11, thereby improving the uniformity of the backlight illuminating the back surface 11a and avoiding uneven brightness.

[0060] Furthermore, it is understood that the cooling body 210 with the light-uniforming structure 2110 can be directly used as a light-uniforming device. Typically, a light-uniforming device is placed between the display panel and the backlight device of the PGU to transform the collimated parallel backlight light into divergent, uniform light. By providing the cooling body 210 with the light-uniforming structure 2110, this light-uniforming device can be eliminated. This not only allows for cooling of the display panel 11 while still achieving light uniformity for the backlight light, but also simplifies the internal structure of the PGU, thereby reducing the size of the PGU and providing greater flexibility in its structural design.

[0061] In some embodiments, the light-diffusing structure 2110 can be a micro-reflective surface disposed on the surface of the cooling body 210.

[0062] Specifically, such as Figure 2 and Figure 5As shown, the cooling body 210 may include a first surface 210a and a second surface 210b that are opposite to each other. The first surface 210a faces the back surface 11a when the cooling body 210 is disposed on the back surface 11a of the display panel 11. That is, the first surface 210a is... Figure 2 The upper surface of the intermediate cooling body 210, the second surface 210b is Figure 2 The lower surface of the intermediate cooling body 210. The light-uniforming structure 2110 may include a first micro-reflective surface and a second micro-reflective surface, the first micro-reflective surface being disposed on the first surface 210a, and the second micro-reflective surface being disposed on the second surface 210b, and the first micro-reflective surface and the second micro-reflective surface being arranged alternately with each other, for example, Figure 5 The diagram shows that the extension direction A1 of the first micro-reflective surface intersects with the extension direction A2 of the second micro-reflective surface.

[0063] In this configuration, when the backlight S2 shines from below the cooling body 210 onto the second micro-reflective surface of the second surface 210b, the collimated parallel backlight S2 is refracted by the second micro-reflective surface. Subsequently, it passes through the cooling body 210 and shines onto the first micro-reflective surface of the first surface 210a, where it is refracted again before exiting the cooling body 210. In this way, the backlight S2 is dispersed into divergent, uniform light, allowing it to be evenly distributed across the entire back surface 11a of the display panel 11.

[0064] It is understood that the uniform light structure 2110 can take any other suitable form, and no limitation is made here.

[0065] Furthermore, it is understood that the uniform light structure 2110 allows heat transfer between the display panel 11 and the coolant in the cooling body 210, so that the coolant cools the display panel 11 via the heat transfer of the uniform light structure 2110.

[0066] In some embodiments, the size of the cavity through which the coolant flows in the hollow structure can be configured such that the cavity covers the entire back surface 11a of the display panel 11.

[0067] If the coolant does not cover certain areas of the back panel 11a, when sunlight focuses on the area of ​​the front panel 11b of the display panel 11 corresponding to these areas, the cooling effect of the cooling body 210 on that area may be limited or even impossible, which may result in screen burn-in.

[0068] By having the cavity of the cooling body 210 cover the entire back surface 11a of the display panel 11, the coolant in the cavity can cover the entire back surface 11a, thereby directly cooling the entire back surface 11a. This overcomes the aforementioned problems and further improves the cooling effect.

[0069] In some embodiments, the cooling system 20 may further include a coolant for flowing through the cooling body 210, and the coolant is a colorless liquid to avoid the color affecting the backlight S2 passing through the cooling body 210 and thus the normal display and operation of the HUD.

[0070] In some implementations, the light transmittance of the coolant can be greater than or equal to 95%.

[0071] This reduces the impact of the coolant's transmittance on the backlight S2 passing through the coolant body 210, thereby reducing the impact on the normal display and operation of the HUD.

[0072] In some embodiments, the freezing point of the coolant may be less than or equal to -40°C, or the boiling point may be greater than or equal to 105°C, or the freezing point may be less than or equal to -40°C and the boiling point may be greater than or equal to 105°C.

[0073] In other words, the coolant remains liquid within a temperature range of -40°C to 105°C to effectively perform its cooling function. This temperature range is suitable for all application environments of HUD devices, ensuring that the cooling system 20 can operate normally in all application environments of the HUD device, thereby enabling the HUD to display and function properly.

[0074] Below, refer to Figures 6 to 8 The assembly process of PGU10, including the cooling system 20, will be described.

[0075] The cooling body 210 of the cooling system 20 can be bonded to the back surface 11a of the display panel 11, for example, by means of optical adhesive M. The optical adhesive M has good light transmittance, so the backlight S2 emitted from the cooling body 210 can pass through it and be incident on the back surface 11a of the display panel 11 without being significantly affected.

[0076] Exemplarily, during assembly, the first surface 210a of the cooling body 210 is bonded to the back surface 11a of the display panel 11 using optical adhesive M to form an integral assembly. This integral assembly is then assembled into a light guide cavity 13 with a backlight device 12 at its bottom, wherein the second surface 210b of the cooling body 210 contacts the screen mounting surface 131 of the light guide cavity 13 to support the display panel 11. Next, a light shield 14 for the display panel 11 is inserted into the light guide cavity 13 along the Z-axis direction, wherein the inner surface 141 of the light shield 14 contacts and is fixed to the front surface 11b of the display panel 11, and the light shield 14 and the light guide cavity 13 are fixed together, for example, by a snap-fit ​​connection.

[0077] In some implementations, refer to Figure 9The cooling system 20 may further include a drive unit 220 and a heat dissipation device 230. The drive unit 220, the heat dissipation device 230, and the cooling body 210 together form a circulation loop for the coolant. The drive unit 220 is used to drive the coolant to flow in the circulation loop, and the heat dissipation device 230 is used to dissipate the heat of the coolant.

[0078] For example, such as Figure 9 As shown, the drive unit 220 is connected to the inlet of the coolant 210 via the inlet guide pipe 240a, the outlet of the coolant 210 is connected to the heat dissipation device 230 via the hot liquid guide pipe 240b, and the heat dissipation device 230 is connected to the drive unit 220 via the cold liquid guide pipe 240c, thus forming a circulation loop. The drive unit 220 is, for example, mounted on the motherboard 30 so that the operation of the drive unit 220 can be controlled by the motherboard 30.

[0079] In this configuration, the drive unit 220 drives the coolant to flow in the circulation loop. The coolant enters the cooling body 210 via the inlet guide pipe 240a, absorbing heat from the display panel 11 as it flows through the cooling body 210. Subsequently, the heated coolant enters the heat dissipation device 230 via the hot liquid guide pipe 240b, and dissipates heat through the heat dissipation device 230. Then, the cooled coolant returns to the drive unit 220 via the cold liquid guide pipe 240c, continuing the circulation process.

[0080] In this way, the coolant can continuously cool the display panel 11 at a low temperature, thus maintaining a good cooling effect.

[0081] In some implementations, refer to Figure 10 and Figure 11 The heat dissipation device 230 may include a heat dissipation reservoir 2301, a thermoelectric cooler (TEC) heat sink 2302, and a metal heat sink 2303, which are stacked sequentially along the flow direction of the coolant. The heat dissipation reservoir 2301 is used to receive the coolant, the TEC heat sink 2302 is used to transfer the heat of the coolant in the heat dissipation reservoir 2301 to the metal heat sink 2303, and the metal heat sink 2303 is used to dissipate the heat.

[0082] Below, first refer to Figure 12 This paper provides a brief explanation of the working principle of the TEC heatsink 2302.

[0083] TEC heatsink 2302 includes a semiconductor P-pole (in Figure 12 (represented by P), semiconductor N-pole (in) Figure 12The components are denoted by N, a conductive metal 2302a, and an insulating ceramic sheet 2302b. The conductive metal 2302a connects the P-terminal and N-terminal of the semiconductor to form the "cold" side P1 and the "hot" side P2. The insulating ceramic sheet 2302b is located at both ends of the semiconductor P-terminal and the semiconductor N-terminal to isolate and protect the semiconductor P-terminal and the semiconductor N-terminal.

[0084] Under the influence of an external electric field, the current can carry heat from one end of the semiconductor to the other end of the TEC heatsink 2302, thereby forming a "cold" side P1 and a "hot" side P2 on the TEC heatsink 2302, thus achieving unidirectional temperature transfer. For example, multiple, such as a dozen to dozens, cooling pairs composed of P-type and N-type electrodes can be set to improve the cooling capacity.

[0085] Re-reference Figure 10 and Figure 11 In this embodiment, the heat dissipation reservoir 2301 includes an inlet and an outlet. The coolant heated by the display panel 11 enters the heat dissipation reservoir 2301 from the inlet via the hot liquid guide pipe 240b, and returns to the drive unit 220 from the outlet via the cold liquid guide pipe 240c. The TEC heat sink 2302 absorbs heat from the heat dissipation reservoir 2301 on the "cold" side adjacent to it, and transfers heat from the "cold" side to the "hot" side adjacent to the metal heat sink 2303 through the movement of internal electrons. The metal heat sink 2303 dissipates heat into the external space using air convection or accelerated convection by a fan.

[0086] Since the heat dissipation device 230, including the TEC heat sink 2302, utilizes the thermal conductivity of semiconductors, it can transfer and dissipate heat more efficiently, thereby cooling the coolant more effectively and thus improving the cooling efficiency of the coolant on the display panel 11.

[0087] In some implementations, such as Figure 10 As shown, a first thermally conductive silicone pad 2304a can be provided between the heat dissipation reservoir 2301 and the TEC heat sink 2302, and a second thermally conductive silicone pad 2304b can be provided between the TEC heat sink 2302 and the metal heat sink 2303, so as to make the contact between the heat dissipation reservoir 2301 and the TEC heat sink 2302 and the TEC heat sink 2302 and the metal heat sink 2303 more sufficient, thereby improving the heat conduction efficiency.

[0088] In addition, the heat dissipation device 230 may include a fixing bracket 2305 disposed on the outside of the heat dissipation reservoir 2301. The fixing bracket 2305 is locked to the metal heat sink 2303 by screws, for example, to realize the stacking assembly of the internal components of the heat dissipation device 230.

[0089] The heat dissipation device 230 may also take any other suitable form, for example, it may include copper pipes and heat sinks, without limitation.

[0090] In some implementations, refer to Figure 13 The drive unit 220 can be a gear pump.

[0091] The gear pump includes a driving gear 2201, a driven gear 2202, and a gear pump housing 2203. Both the driving gear 2201 and the driven gear 2202 are disposed in the gear pump housing 2203, and the driving gear 2201 can drive the driven gear 2202 to rotate.

[0092] Because the clearance between the outer contours of the driving gear 2201 and the driven gear 2202 and the gear pump housing 2203 is small, when the driving gear 2201 and the driven gear 2202 rotate in opposite directions, a high-pressure region and a low-pressure region are formed at the front and rear ends of the meshing teeth, respectively. Under pressure, the coolant inside the gear pump is squeezed out, thereby driving the coolant.

[0093] The drive unit 220 may also take any other suitable form, without limitation.

[0094] In some implementations, refer to Figures 14 to 16 The cooling system 20 may also include a temperature sensor 240. The temperature sensor 240 is used to sense the temperature of the front side 11b of the display panel 11, and the drive unit 220 and the heat dissipation unit 230 start and stop based on the temperature sensed by the temperature sensor 240.

[0095] For example, when the temperature sensed by the temperature sensor 240 exceeds a threshold, it indicates that the display panel 11 is at risk of burn-in. In this case, the control unit receiving the sensing result can activate the drive unit 220 and the heat dissipation device 230 to cool the display panel 11 by allowing coolant to flow in the cooling body 210. On the other hand, when the temperature sensed by the temperature sensor 240 is below a threshold, it indicates that the display panel 11 is not at risk of burn-in. In this case, the control unit receiving the sensing result can shut down the drive unit 220 and the heat dissipation device 230 to stop cooling the display panel 11 by stopping the flow of coolant.

[0096] In this way, precise temperature control of the display panel 11 can be achieved, and unnecessary energy consumption can be reduced.

[0097] like Figures 14 to 16 As shown, the temperature sensor 240 can be disposed, for example, on the side wall of the large light shield 40. The large light shield 40 is a structural component within the HUD device used to enclose the internal optical path, and the side wall of the large light shield 40 faces the front surface 11b of the display panel 11. Exemplarily, the temperature sensor 240 can be disposed in a mounting hole 401 formed in this side wall, such that its photosensitive portion faces the front surface 11b of the display panel 11. In this way, the temperature of the front surface 11b of the display panel 11 can be detected more effectively.

[0098] In some implementations, the temperature sensor 240 can perform surface sensing on the front side 11b of the display panel 11.

[0099] In other words, temperature sensor 240 senses the temperature of a surface area, such as... Figure 16 Temperature sensing is applied to the surface area between the two dashed lines, rather than to a single point. Therefore, a larger instantaneous sensing range is achieved, thereby improving the protection of the display panel 11.

[0100] According to another aspect of this disclosure, referring to Figure 6 It also provides a PGU10 for HUD devices.

[0101] PGU10 includes: Display panel 11; A backlight device 12 is disposed on one side of the display panel 11 for providing backlight to the display panel 11; and Cooling system 20, the cooling body 210 of cooling system 20 is disposed between display panel 11 and backlight device 12 and is in contact with the back surface 11a of display panel 11.

[0102] According to another aspect of this disclosure, a HUD device is also provided. The HUD device includes a cooling system 20, or includes a PGU 10.

[0103] While this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the specific embodiments described and shown herein. Various changes to the exemplary embodiments can be made by those skilled in the art without departing from the scope defined by the claims of this disclosure.

[0104] The features mentioned and / or shown in the foregoing description of exemplary embodiments of this disclosure may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this disclosure.

Claims

1. A cooling system for a head-up display device, characterized in that: A cooling body is included. The cooling body is used to be arranged at the back of the display panel of the head-up display device and contact the back. The cooling body has a hollow structure for cooling liquid to flow through, and the cooling body is made of a transparent material.

2. The cooling system according to claim 1, characterized in that: The cooler is provided with a light homogenizing structure, and the light homogenizing structure is used to convert the backlight into divergent uniform light. In the case where the cooler is arranged on the back side, the backlight enters the cooler from a side of the cooler away from the back side.

3. The cooling system according to claim 2, characterized in that: The light homogenizing structure is a micro-reflective surface arranged on the surface of the cooling body.

4. The cooling system according to any one of claims 1 to 3, characterized in that: The size of the cavity of the hollow structure through which the cooling liquid flows is set so that the cavity covers the entire back side of the display panel.

5. The cooling system according to any one of claims 1 to 3, characterized in that: It also includes the cooling liquid for flowing through the cooling body, the cooling liquid is a colorless liquid, and the cooling liquid satisfies at least one of the following conditions: light transmittance is greater than or equal to 95%, freezing point is less than or equal to -40°C, and boiling point is greater than or equal to 105°C.

6. The cooling system according to any one of claims 1 to 3, characterized in that: The cooling body is bonded to the back surface of the display panel by optical adhesive.

7. The cooling system according to any one of claims 1 to 3, characterized in that It also includes a driving device and a heat dissipation device. The driving device, the heat dissipation device and the cooling body together constitute a circulation loop for the coolant. The driving device is used to drive the coolant to flow in the circulation loop, and the heat dissipation device is used to discharge the heat of the coolant.

8. The cooling system according to claim 7, characterized in that: The heat dissipation device includes a heat dissipation tank, a TEC heat dissipation block and a metal radiator which are stacked in sequence along the flow direction of the coolant. The heat dissipation tank is used to receive the coolant, the TEC heat dissipation block is used to transfer the heat of the coolant in the heat dissipation tank to the metal radiator, and the metal radiator is used to discharge the heat.

9. The cooling system according to claim 7, characterized in that: The driving device is a gear pump.

10. The cooling system according to claim 7, characterized in that A temperature sensor is also included, and the temperature sensor is used to sense the temperature of the front side of the display panel, and the driving device and the heat dissipation device are started and stopped based on the temperature sensed by the temperature sensor.

11. The cooling system according to claim 10, characterized in that The temperature sensor is capable of performing surface sensing on the front surface of the display panel.

12. An image generation unit for a head-up display device, characterized in that: include: Display panel; A backlight device, disposed on one side of the display panel, for providing backlight to the display panel; as well as According to the cooling system according to any one of claims 1 to 11, the cooling body of the cooling system is arranged between the display panel and the backlight device and is in contact with the back surface of the display panel.

13. A head-up display device, characterized in that: Comprising a cooling system according to any one of claims 1 to 11, or comprising an image generating unit according to claim 12.

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