Multifunctional automatic semiconductor equipment system

Abstract

The multifunctional automatic semiconductor equipment system comprises a finished product detection mechanism and a finished product packaging mechanism, and the output end of the finished product detection mechanism is connected with the input end of the finished product packaging mechanism; the finished product detection mechanism comprises a feeding module, a moving module, a detection module, a discharging module and a control module, the moving module is used for moving finished products to the detection module or the discharging module, the detection module is used for testing the finished products, the detection module is electrically connected with the control module, the control module is electrically connected with the discharging module, and the discharging module is used for classifying the finished products. And qualified products are conveyed to a finished product packaging mechanism. The production cost is greatly reduced, the production efficiency is improved, the product detection standard is improved, system collection traceability of test data is achieved, the market failure analysis process is simplified, the product reliability is guaranteed, and the problems that different test links on a traditional production line need different devices to be completed, and the efficiency is low are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, in particular to a multifunctional automated semiconductor equipment system. Background Art

[0002] In the semiconductor field, a high-precision and high-demand industry, the testing process has become an indispensable and crucial link, carrying the arduous mission of ensuring product quality, meeting customer expectations and maintaining market reputation. As the core component of modern electronic equipment, the stability and reliability of the performance of semiconductor devices are directly related to the operating efficiency and service life of the entire system. Therefore, strict testing of semiconductor products is not only a strict control of product quality, but also a pursuit of technological excellence.

[0003] However, many existing testing process equipment have single functions and cannot meet complex and changing testing needs, which results in workers having to transport finished products in batches to multiple testing process equipment for different testing tasks. This results in low testing efficiency for finished products and reduces the flexibility and scalability of the production line. Summary of the invention

[0004] In view of the above defects, the present invention proposes a multifunctional automated semiconductor equipment system, which can realize the integration of multiple processes such as automatic loading, finished product inspection, and automatic unloading through the cooperation between the finished product inspection mechanism and the finished product packaging mechanism. Qualified products that have passed the test are automatically packaged on the finished product packaging mechanism to achieve full automation, which not only greatly reduces production costs and improves production efficiency, but also improves product inspection standards, realizes systematic collection and traceability of test data, simplifies the market failure analysis process, ensures product reliability, and solves the problem that different test links on traditional production lines require different equipment to complete and are inefficient.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A multifunctional automated semiconductor equipment system comprises a finished product inspection mechanism and a finished product packaging mechanism, wherein the output end of the finished product inspection mechanism is connected to the input end of the finished product packaging mechanism;

[0007] The finished product inspection mechanism includes a loading module, a moving module, a detection module, a unloading module and a control module. The loading module is used to load the finished products. The moving module is used to move the finished products to the detection module or the unloading module. The detection module is used to test the finished products. The detection module is electrically connected to the control module. The control module is electrically connected to the unloading module. The control module is used to distinguish between defective products and qualified products. The unloading module is used to classify the finished products and transport the qualified products to the finished product packaging mechanism. The finished product packaging mechanism is used to package the qualified products.

[0008] The mobile module includes a mobile guide rail and a robotic arm, the mobile guide rail is located above the detection module, the mobile guide rail is slidably connected to the robotic arm, the head end of the mobile guide rail is located above the loading module, and the tail end of the mobile guide rail is located above the unloading module. The sliding direction of the robotic arm is consistent with the conveying direction of the finished product, and the robotic arm is used to clamp the finished product.

[0009] The two mechanical arms are provided with two, the two mechanical arms operate synchronously, and the distance between the two mechanical arms is half of the length of the movable guide rail.

[0010] The detection module includes an insulation and voltage resistance testing device, a laser marking device, a heating device, an electrical parameter testing device, a refrigeration device and a visual inspection device in sequence along the conveying direction of the finished product; the insulation and voltage resistance testing device, the laser marking device, the heating device, the electrical parameter testing device, the refrigeration device and the visual inspection device are electrically connected to the control module respectively.

[0011] The unloading module includes a sorting component, a defective product collection frame and a qualified product conveying device; the sorting component is electrically connected to the control module, the sorting component is used to sort out defective products and qualified products, the defective product collection frame is used to store defective products, and the qualified product conveying device is used to convey qualified products to the finished product packaging mechanism.

[0012] The sorting component includes a sorting robot and a moving cylinder, the moving cylinder is electrically connected to the control module, the driving end of the moving cylinder is fixedly connected to the sorting robot, and the sorting robot moves above the multiple defective product collection frames.

[0013] The sorting component also includes a suction cup cylinder, which is located at the input end of the qualified product conveying device. The movement direction of the suction cup cylinder is toward the qualified product conveying device. The suction cup cylinder is used to absorb qualified products and convey them to the qualified product conveying device.

[0014] The technical solution provided by the embodiments of the present application may have the following beneficial effects:

[0015] 1. Through the cooperation between the finished product inspection mechanism and the finished product packaging mechanism, not only can the integration of multiple processes such as automatic loading, finished product inspection, and automatic unloading be realized. Qualified products that have passed the test are automatically packaged on the finished product packaging mechanism to achieve full automation, which not only greatly reduces production costs and improves production efficiency, but also improves product inspection standards, and realizes systematic collection and traceability of test data, simplifies the market failure analysis process, ensures product reliability, and solves the problem that different testing links on traditional production lines require different equipment to complete and are inefficient.

[0016] 2. One of the robotic arms transports the finished products from the loading module to the inspection module, while the other robotic arm transports the finished products from the inspection module to the unloading module. This alternating working mode reduces the idle time of the two robotic arms and improves their utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of a semiconductor device system according to one embodiment of the present invention;

[0018] Figure 2 It is a schematic diagram of a finished product detection mechanism in one embodiment of the present invention;

[0019] Figure 3 is a cross-sectional view of a finished product detection mechanism according to one embodiment of the present invention;

[0020] Figure 4 yes Figure 2 The enlarged view of point A in the middle;

[0021] Among them, 1. Finished product inspection mechanism; 2. Finished product packaging mechanism; 3. Loading module; 4. Moving module; 41. Moving guide rail; 42. Robot arm; 5. Inspection module; 51. Insulation withstand voltage testing device; 52. Laser marking device; 53. Heating device; 54. Electrical parameter testing device; 55. Refrigeration device; 56. Visual inspection device; 6. Unloading module; 61. Sorting component; 611. Sorting robot; 612. Moving cylinder; 613. Suction cup cylinder; 62. Defective product collection frame; 63. Qualified product conveying device. DETAILED DESCRIPTION

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] In the description of the present invention, it is necessary to understand that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means more than two.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "splicing" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Combine the following Figures 1 to 4 , describing a multifunctional automated semiconductor equipment system according to an embodiment of the present invention.

[0027] A multifunctional automated semiconductor equipment system comprises a finished product inspection mechanism 1 and a finished product packaging mechanism 2, wherein the output end of the finished product inspection mechanism 1 is connected to the input end of the finished product packaging mechanism 2;

[0028] The finished product inspection mechanism 1 includes a loading module 3, a moving module 4, a detection module 5, a unloading module 6 and a control module. The loading module 3 is used to load the finished products. The moving module 4 is used to move the finished products to the detection module 5 or the unloading module 6. The detection module 5 is used to test the finished products. The detection module 5 is electrically connected to the control module. The control module is electrically connected to the unloading module 6. The control module is used to distinguish between defective products and qualified products. The unloading module 6 is used to classify the finished products and transport the qualified products to the finished product packaging mechanism 2. The finished product packaging mechanism 2 is used to package the qualified products.

[0029] In a multifunctional automated semiconductor equipment system of the present solution, the loading module 3 continuously transports multiple finished products to the head end of the moving module 4, so that the moving module 4 starts to start, and moves the finished product detection module 5 for detection, and finally moves the detected finished product to the unloading module 6. Since the detection module 5 is electrically connected to the control module, the detection module 5 can transmit relevant detection information to the control module, and the control module can determine whether the finished product is a defective product or a qualified product based on the information. Then the signal is transmitted to the unloading module 6, so that the unloading module 6 distinguishes the finished products, and then the qualified products are transported to the finished product packaging mechanism 2, and the finished product packaging mechanism 2 can package the qualified products.

[0030] This solution can not only realize the integration of multiple processes such as automatic loading, finished product inspection, and automatic unloading through the cooperation between the finished product inspection mechanism 1 and the finished product packaging mechanism 2. Qualified products that have passed the test are automatically packaged on the finished product packaging mechanism 2 to achieve full automation, which not only greatly reduces production costs and improves production efficiency, but also improves product inspection standards, realizes systematic collection and traceability of test data, simplifies the market failure analysis process, ensures product reliability, and solves the problem that different testing links on traditional production lines require different equipment to complete and are inefficient.

[0031] The mobile module 4 includes a mobile guide rail 41 and a robotic arm 42. The mobile guide rail 41 is located above the detection module 5. The mobile guide rail 41 is slidably connected to the robotic arm 42. The head end of the mobile guide rail 41 is located above the loading module 3, and the tail end of the mobile guide rail 41 is located above the unloading module 6. The sliding direction of the robotic arm 42 is consistent with the conveying direction of the finished product, and the robotic arm 42 is used to clamp the finished product.

[0032] It is worth noting that the extension direction of the movable guide rail 41 is consistent with the transportation direction of the finished product, and the head end of the movable guide rail 41 is located above the loading module 3, and the end of the movable guide rail 41 is located above the unloading module 6, so that when the robot arm 42 clamps the finished product, it can drive the finished product to move along the conveying direction, ensuring that the robot arm 42 can transport the finished product on the loading module 3 to the detection module 5, and transport the finished product from the detection module 5 to the unloading module 6.

[0033] There are two mechanical arms 42 , and the two mechanical arms 42 operate synchronously. The distance between the two mechanical arms 42 is half the length of the moving guide rail 41 .

[0034] First, one of the robotic arms 42 transports the finished product of the loading module 3 to the inspection module 5, and at the same time, the other robotic arm 42 transports the finished product of the inspection module 5 to the unloading module 6. This alternating working mode reduces the idle time of the two robotic arms 42 and improves their utilization. Moreover, in the same unit time, the two robotic arms 42 can handle different transportation tasks at the same time.

[0035] In addition, if one of the robot arms 42 fails and needs maintenance, the other robot arm 42 can continue to work, thereby reducing the downtime of the production line.

[0036] The detection module 5 includes an insulation and voltage resistance testing device 51, a laser marking device 52, a heating device 53, an electrical parameter testing device 54, a refrigeration device 55 and a visual inspection device 56 in sequence along the conveying direction of the finished product; the insulation and voltage resistance testing device 51, the laser marking device 52, the heating device 53, the electrical parameter testing device 54, the refrigeration device 55 and the visual inspection device 56 are electrically connected to the control module respectively.

[0037] The insulation and withstand voltage test device 51 is the first testing device. It first tests the insulation effect and withstand voltage effect of the finished product. It can check those concentrated defects with greater dangers. It plays a decisive role in judging whether the power equipment can continue to participate in operation. It is an important means to ensure the insulation level of the equipment and avoid insulation accidents.

[0038] The laser marking device 52 is the second detection device. The laser marking device 52 uses high-energy-density laser to locally irradiate the finished product, causing the surface material to vaporize or undergo a chemical reaction that causes a color change, thereby leaving a permanent mark, thereby performing an anti-counterfeiting operation on the finished product, so that the control module can identify the finished product and subsequently trace it.

[0039] The electrical parameter testing device 54 can perform electrical parameter testing on the finished product, and can quickly and accurately complete the measurement of parameters such as the positive-sequence capacitance, positive-sequence impedance, zero-sequence capacitance, and zero-sequence impedance of the finished product line.

[0040] The heating device 53 and the refrigeration device 55 can respectively detect the heat resistance and frost resistance of the finished product.

[0041] The visual inspection device 56 uses an industrial camera instead of human eyes to complete the recognition and inspection of the appearance structure of the finished product, effectively reducing the possibility of misjudgment due to human eye fatigue.

[0042] The unloading module 6 includes a sorting component 61, a defective product collection frame 62 and a qualified product conveying device 63; the sorting component 61 is electrically connected to the control module, the sorting component 61 is used to sort out defective products and qualified products, the defective product collection frame 62 is used to store defective products, and the qualified product conveying device 63 is used to convey qualified products to the finished product packaging mechanism 2.

[0043] After multiple inspections by the inspection module 5, the inspection module 5 can transmit the inspection results to the control module. The control module can identify the finished products and determine the qualified products and defective products, and transmit the signal to the sorting component 61. The sorting component 61 can sort out the defective products and qualified products according to the information, and then transport the defective products to the defective product collection box 62, and transport the qualified products to the finished product packaging mechanism 2.

[0044] The sorting component 61 includes a sorting robot 611 and a moving cylinder 612 . The moving cylinder 612 is electrically connected to the control module. The driving end of the moving cylinder 612 is fixedly connected to the sorting robot 611 . The sorting robot 611 moves above the multiple defective product collection frames 62 .

[0045] Among them, after the moving cylinder 612 receives the signal from the control module and identifies that the finished product is a defective product, the sorting robot 611 starts to clamp the defective product at the end of the detection module 5, and extends the piston rod outward, so that the sorting robot 611 moves on multiple defective product collection frames 62, and then puts it into a specific defective product collection frame 62, and then classifies the defective products.

[0046] The sorting component 61 also includes a suction cup cylinder 613, which is located at the input end of the qualified product conveying device 63. The movement direction of the suction cup cylinder 613 is toward the qualified product conveying device 63. The suction cup cylinder 613 is used to absorb qualified products and convey them to the qualified product conveying device 63.

[0047] After receiving the signal from the control module, the moving cylinder 612 identifies that the finished product is a qualified product, and the sorting manipulator 611 starts to clamp the qualified product at the end of the detection module 5, and extends the piston rod outward, so that the sorting manipulator 611 and the qualified product are located between the sorting cylinder and the qualified product conveyor belt. The sorting manipulator 611 starts to absorb the qualified product, and then conveys the qualified product to the qualified product conveyor belt, which conveys the qualified product to the finished product packaging mechanism 2.

[0048] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A multifunctional automated semiconductor equipment system, characterized in that: It includes a finished product detection mechanism and a finished product packaging mechanism, wherein the output end of the finished product detection mechanism is connected to the input end of the finished product packaging mechanism; The finished product inspection mechanism includes a loading module, a moving module, a detection module, a unloading module and a control module. The loading module is used to load the finished products. The moving module is used to move the finished products to the detection module or the unloading module. The detection module is used to test the finished products. The detection module is electrically connected to the control module. The control module is electrically connected to the unloading module. The control module is used to distinguish between defective products and qualified products. The unloading module is used to classify the finished products and transport the qualified products to the finished product packaging mechanism. The finished product packaging mechanism is used to package the qualified products.

2. A multifunctional automated semiconductor equipment system according to claim 1, characterized in that: The mobile module includes a mobile guide rail and a robotic arm, the mobile guide rail is located above the detection module, the mobile guide rail is slidably connected to the robotic arm, the head end of the mobile guide rail is located above the loading module, and the tail end of the mobile guide rail is located above the unloading module. The sliding direction of the robotic arm is consistent with the conveying direction of the finished product, and the robotic arm is used to clamp the finished product.

3. A multifunctional automated semiconductor equipment system according to claim 2, characterized in that: The two mechanical arms are provided with two, the two mechanical arms operate synchronously, and the distance between the two mechanical arms is half of the length of the movable guide rail.

4. The multifunctional automated semiconductor equipment system according to claim 1, characterized in that: The detection module includes an insulation and voltage resistance testing device, a laser marking device, a heating device, an electrical parameter testing device, a refrigeration device and a visual inspection device in sequence along the conveying direction of the finished product; the insulation and voltage resistance testing device, the laser marking device, the heating device, the electrical parameter testing device, the refrigeration device and the visual inspection device are electrically connected to the control module respectively.

5. The multifunctional automated semiconductor equipment system according to claim 1, characterized in that: The unloading module includes a sorting component, a defective product collection frame and a qualified product conveying device; the sorting component is electrically connected to the control module, the sorting component is used to sort out defective products and qualified products, the defective product collection frame is used to store defective products, and the qualified product conveying device is used to convey qualified products to the finished product packaging mechanism.

6. The multifunctional automated semiconductor equipment system according to claim 5, characterized in that: The sorting component includes a sorting robot and a moving cylinder, the moving cylinder is electrically connected to the control module, the driving end of the moving cylinder is fixedly connected to the sorting robot, and the sorting robot moves above the multiple defective product collection frames.

7. The multifunctional automated semiconductor equipment system according to claim 5, characterized in that: The sorting component also includes a suction cup cylinder, which is located at the input end of the qualified product conveying device. The movement direction of the suction cup cylinder is toward the qualified product conveying device. The suction cup cylinder is used to absorb qualified products and convey them to the qualified product conveying device.

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