Production process and application of ENF-grade moisture-proof urea-formaldehyde resin

Abstract

The invention belongs to the technical field of adhesives, and relates to a production process of ENF-grade moisture-proof urea-formaldehyde resin, which comprises the following steps: adding 100 parts of formaldehyde into a reaction kettle, and adjusting the pH value of the reaction solution to 5.0-9.0 by using a sodium hydroxide aqueous solution; adding 40-65 parts of melamine M1, raising the temperature to 80-95 DEG C, and carrying out constant-temperature reaction for 40-60 minutes; adding 30-40 parts of urea U1, and carrying out heat preservation reaction for 10-20 minutes; adding 15-20 parts of melamine M2 and 20-25 parts of urea U2, reacting at the temperature of 90-95 DEG C to the end point, and adjusting the pH value to 9.5-10.0; and cooling to 40 DEG C, and discharging glue for later use. The ENF-grade moisture-proof urea-formaldehyde resin prepared according to the process is applied to preparation of ENF-grade moisture-proof fiberboards or shaving boards. According to the ENF-grade moisture-proof urea-formaldehyde resin production process disclosed by the invention, by adjusting process parameters, the prepared urea-formaldehyde resin is low in formaldehyde emission and excellent in performance, the ENF-grade moisture-proof urea-formaldehyde resin is applied to production of ENF-grade moisture-proof plates, the physical and chemical properties of the plates meet the national standard, and the requirements of consumers for moisture prevention and ultralow formaldehyde of the plates are met.

Description

Technical Field

[0001] The present invention belongs to the technical field of adhesives, and relates to the production of organic adhesives, and particularly to an E NF Production technology and application of moisture-proof urea-formaldehyde resin. Background Art

[0002] Fiberboard, particleboard and other artificial boards are widely used as interior decoration materials. With the increasingly fierce competition of homogeneity, the demand for functional boards is also increasing. NF The moisture-proof board effectively alleviates the problems of ordinary boards absorbing moisture, deforming, and arching in a humid environment. NF Grade board effectively reduces the release of formaldehyde during the use of the board.

[0003] Therefore, the present invention produces E with ultra-low molar ratio of moisture-proof urea-formaldehyde resin NF Moisture-proof panels are of great significance. Summary of the invention

[0004] In order to reduce E NF The present invention discloses a method for measuring the release of formaldehyde during the use of E NF Production process of moisture-proof urea-formaldehyde resin.

[0005] Technical Solution

[0006] A kind of E NF The production process of grade urea-formaldehyde resin for moisture-proofing comprises the following steps:

[0007] (1) 100 parts of formaldehyde are put into a reaction kettle, and the pH value of the reaction solution is adjusted to 5.0 to 9.0 with a sodium hydroxide aqueous solution having a mass concentration of 20 to 30%;

[0008] (2) adding 40 to 65 parts of melamine M1, raising the temperature to 80 to 95° C., and reacting at a constant temperature for 40 to 60 minutes;

[0009] (3) Add 30-40 parts of urea U1, keep warm for 10-20 minutes, check the pH value of the solution and adjust it to 9.0-9.5;

[0010] (4) adding 15 to 20 parts of melamine M2 and 20 to 25 parts of urea U2, reacting at 90 to 95° C. to the end point, and adjusting the pH value to 9.5 to 10.0;

[0011] (5) Cool down to 40°C and prepare the glue for later use;

[0012] The materials involved in the reaction are all in parts by mass.

[0013] According to a preferred embodiment of the present invention, in step (1), the concentration of formaldehyde is 37%.

[0014] According to a preferred embodiment of the present invention, in step (1), the pH value of the reaction solution is adjusted to 7.0 with an aqueous sodium hydroxide solution.

[0015] According to a preferred embodiment of the present invention, in step (2), 55 parts of melamine M1 are added, the temperature is raised to 88° C., and the reaction is carried out at a constant temperature for 50 minutes.

[0016] According to a preferred embodiment of the present invention, in step (3), 35 parts of urea U1 are added, the reaction is kept warm for 15 minutes, and the pH value of the solution is detected and adjusted to 9.0-9.5.

[0017] According to a preferred embodiment of the present invention, in step (4), 18 parts of melamine M2 and 23 parts of urea U2 are added, the reaction is carried out at 93° C. to an end point, and the pH value is adjusted to 9.5-10.0.

[0018] According to a preferred embodiment of the present invention, when used for preparing a particleboard adhesive, after step (3), 10 to 15 parts of water are dehydrated at 60 to 65° C., and then M2 and U2 are added to continue the reaction.

[0019] E prepared by the process of the present invention NF Grade moisture-proof urea-formaldehyde resin, applied to E NF Preparation of moisture-resistant fiberboard or particleboard.

[0020] Beneficial Effects

[0021] The E disclosed in the present invention NF The production process of moisture-proof urea-formaldehyde resin is a new type of moisture-proof urea-formaldehyde resin. By adjusting the process parameters, the urea-formaldehyde resin produced has low formaldehyde emission and excellent performance. It is used in the production of E NF Grade moisture-proof board, the physical and chemical properties of the board are in line with national standards, meeting consumers' needs for moisture-proof and ultra-low formaldehyde boards. DETAILED DESCRIPTION

[0022] The present invention is described in detail below in conjunction with embodiments so that those skilled in the art can better understand the present invention. However, the present invention is not limited to the following embodiments, and more adjustments can be made to the present invention without exceeding the spirit and scope of the present invention.

[0023] Example 1

[0024] A kind of E NF The production process of grade urea-formaldehyde resin for moisture-proofing comprises the following steps:

[0025] (1) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0026] (2) Add 60 parts of melamine M1 and raise the temperature to 80-95°C;

[0027] (3) isothermal reaction at 80 to 95°C for 40 to 60 minutes;

[0028] (4) Add 30 parts of urea U1 and keep warm for 10 to 20 minutes;

[0029] (5) Check the pH value of the solution and adjust it to 9.0-9.5;

[0030] (6) adding 25 parts of melamine M2 and 20 parts of urea U2, reacting at 90-95° C. to the end point, and adjusting the pH value to 9.5-10.0;

[0031] (7) Cool down to 40°C and prepare the glue for later use.

[0032] The adhesive of this embodiment is used to produce furniture-type 3mm thin fiberboard under high humidity. The amount of glue applied is

[0033] 250kg / m 3 , the board properties are as follows:

[0034]

[0035] Note: ≤0.025mg / m 3 It is the E in GBT 39600 "Classification of Formaldehyde Emission of Artificial Boards and Their Products" NF Level limit value.

[0036] Example 2

[0037] A kind of E NF The production process of grade urea-formaldehyde resin for moisture-proofing comprises the following steps:

[0038] (1) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0039] (2) Add 55 parts of melamine M1 and raise the temperature to 80-95°C;

[0040] (3) isothermal reaction at 80 to 95°C for 40 to 60 minutes;

[0041] (4) Add 40 parts of urea U1 and keep warm for 10 to 20 minutes;

[0042] (5) Check the pH value of the solution and adjust it to 9.0-9.5;

[0043] (6) adding 15 parts of melamine M2 and 20 parts of urea U2, reacting at a temperature of 90-95° C. to an end point, and adjusting the pH value to 9.5-10.0;

[0044] (7) Cool down to 40°C and prepare the glue for later use.

[0045] The adhesive of this embodiment is used to produce furniture-type 3mm thin fiberboard under high humidity. The amount of glue applied is

[0046] 250kg / m 3 , the board properties are as follows:

[0047]

[0048] Note: ≤0.025mg / m 3 It is the E in GBT 39600 "Classification of Formaldehyde Emission of Artificial Boards and Their Products" NF Level limit value.

[0049] Example 3

[0050] A production process of ENF grade moisture-proof urea-formaldehyde resin comprises the following steps:

[0051] (1) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0052] (2) Add 40 parts of melamine M1 and raise the temperature to 80-95°C;

[0053] (3) isothermal reaction at 80 to 95°C for 40 to 60 minutes;

[0054] (4) Add 40 parts of urea U1 and keep warm for 10 to 20 minutes;

[0055] (5) Check the pH value of the solution and adjust it to 9.0-9.5;

[0056] (6) adding 15 parts of melamine M2 and 25 parts of urea U2, reacting at a temperature of 90-95° C. to an end point, and adjusting the pH value to 9.5-10.0;

[0057] (7) Cool down to 40°C and prepare the glue for later use.

[0058] The adhesive of this embodiment is used to produce furniture-type 3mm thin fiberboard under high humidity. The amount of glue applied is

[0059] 250kg / m 3 , the board properties are as follows:

[0060]

[0061] Note: ≤0.025mg / m 3 It is the E in GBT 39600 "Classification of Formaldehyde Emission of Artificial Boards and Their Products" NF Level limit value.

[0062] Example 4

[0063] A production process of ENF grade moisture-proof urea-formaldehyde resin comprises the following steps:

[0064] (1) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0065] (2) Add 60 parts of melamine M1 and raise the temperature to 80-95°C;

[0066] (3) isothermal reaction at 80 to 95°C for 40 to 60 minutes;

[0067] (4) Add 30 parts of urea U1 and keep warm for 10 to 20 minutes;

[0068] (5) Check the pH value of the solution and adjust it to 9.0-9.5

[0069] (6) dehydrating at 60-65°C for 15 parts;

[0070] (7) adding 25 parts of melamine M2 and 20 parts of urea U2, reacting at 90-95° C. to the end point, and adjusting the pH value to 9.5-10.0;

[0071] (8) Cool down to 40°C and prepare the glue for later use.

[0072] Using the adhesive of the above embodiment, produce 18mm furniture particleboard in wet state, the glue application amount

[0073] 90kg / m 3 ,The main properties of the board are as follows:

[0074]

[0075] Note: ≤0.025mg / m 3 GBT 39600 "Classification of formaldehyde emission of wood-based panels and their products" E NF Level limit value.

[0076] Example 5

[0077] A kind of E NF The production process of grade urea-formaldehyde resin for moisture-proofing comprises the following steps:

[0078] (1) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0079] (2) Add 55 parts of melamine M1 and raise the temperature to 80-95°C;

[0080] (3) isothermal reaction at 80 to 95°C for 40 to 60 minutes;

[0081] (4) Add 40 parts of urea U1 and keep warm for 10 to 20 minutes;

[0082] (5) Check the pH value of the solution and adjust it to 9.0-9.5;

[0083] (6) dehydrating at 60-65°C for 15 parts;

[0084] (7) adding 15 parts of melamine M2 and 20 parts of urea U2, reacting at 90-95° C. to the end point, and adjusting the pH value to 9.5-10.0;

[0085] (8) Cool down to 40°C and prepare the glue for later use.

[0086] Using the adhesive of the above embodiment, produce 18mm furniture particleboard in wet state, the glue application amount

[0087] 90kg / m 3 ,The main properties of the board are as follows:

[0088]

[0089] Note: ≤0.025mg / m 3 GBT 39600 "Classification of formaldehyde emission of wood-based panels and their products" E NF Level limit value.

[0090] Example 6

[0091] A kind of E NF The production process of grade urea-formaldehyde resin for moisture-proofing comprises the following steps:

[0092] (9) 100 parts of formaldehyde are put into a reaction kettle, and a 20-30% sodium hydroxide aqueous solution is added to adjust the pH value of the reaction solution to 5.0-9.0;

[0093] (10) Add 40 parts of melamine M1 and raise the temperature to 80-95°C;

[0094] (11) reacting at a temperature of 80 to 95° C. for 40 to 60 minutes;

[0095] (12) Add 40 parts of urea U1 and keep warm for 10 to 20 minutes;

[0096] (13) Check the pH value of the solution and adjust it to 9.0-9.5;

[0097] (14) dehydrating at 60-65°C for 15 parts;

[0098] (15) adding 15 parts of melamine M1 and 25 parts of urea U2, reacting at a temperature of 90-95° C. to an end point, and adjusting the pH value to 9.5-10.0;

[0099] (16) Cool down to 40°C and prepare the glue for later use.

[0100] Using the adhesive of the above embodiment, produce 18mm furniture particleboard in wet state, the glue application amount

[0101] 90kg / m 3 ,The main properties of the board are as follows:

[0102]

[0103] Note: ≤0.025mg / m 3 GBT 39600 "Classification of formaldehyde emission of wood-based panels and their products" E NF Level limit value.

[0104] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the specification of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A kind of E NF The production process of grade moisture-proof urea-formaldehyde resin is characterized in that: The steps include: (1) 100 parts of formaldehyde are put into a reaction kettle, and the pH value of the reaction solution is adjusted to 5.0 to 9.0 with a sodium hydroxide aqueous solution having a mass concentration of 20 to 30%; (2) Add 40-65 parts of melamine M1, raise the temperature to 80-95°C, and react at a constant temperature for 40-60 minutes; (3) Add 30-40 parts of urea U1, keep warm for 10-20 minutes, check the pH value of the solution and adjust it to 9.0-9.5; (4) Add 15-20 parts of melamine M2 and 20-25 parts of urea U2, react at 90-95°C to the end point, and adjust the pH value to 9.5-10.0; (5) Cool down to 40℃ and prepare the glue for later use; The materials involved in the reaction are all in parts by mass.

2. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: In step (1), the concentration of formaldehyde is 37%.

3. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: In step (1), the pH value of the reaction solution is adjusted to 7.0 with an aqueous sodium hydroxide solution.

4. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: In step (2), 55 parts of melamine M1 are added, the temperature is raised to 88° C., and the reaction is carried out at a constant temperature for 50 minutes.

5. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: In step (3), 35 parts of urea U1 are added, the reaction is kept warm for 15 minutes, and the pH value of the solution is detected and adjusted to 9.0-9.

5.

6. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: In step (4), 18 parts of melamine M2 and 23 parts of urea U2 are added, the reaction is carried out at 93° C. to the end point, and the pH value is adjusted to 9.5-10.

0.

7. E according to claim 1 NF The production process of grade urea-formaldehyde resin is characterized by: When used for preparing particleboard adhesive, after step (3), dehydrate 10 to 15 parts at 60 to 65°C, then add M2 and U2 and continue the reaction.

8. E produced according to any one of claims 1 to 7 NF The application of grade urea-formaldehyde resin is characterized by: Apply it to E NF Preparation of moisture-resistant fiberboard or particleboard.

Images