Brush for cleaning wafer

Abstract

The brush for cleaning a wafer includes: a brush having a hollow inside for spraying a cleaning liquid and having a plurality of protrusions formed on an outer surface thereof; and a film provided to cover an outer surface of the brush, the film including a plurality of holes through which the plurality of protrusions penetrate.

Description

Technical Field

[0001] The invention relates to a brush for cleaning wafers. Background Art

[0002] Generally speaking, semiconductor wafer processing includes multiple processes such as ion implantation, film evaporation, diffusion, photography, surface polishing, and cleaning, so as to form semiconductor elements in multiple layers on the surface of a wafer with silicon as the main raw material.

[0003] Among such semiconductor wafer processing processes, there is a process for polishing the surface of a wafer, in which the surface of the wafer is polished while the wafer is rotated at a high speed using a chemical mechanical polishing device (CMP) or the like.

[0004] In addition, in processes such as wafer surface polishing, a wafer cleaning process must be included to remove foreign matter or particles generated.

[0005] Here, in the wafer cleaning process, semiconductor wafer cleaning apparatuses of various shapes as disclosed in Japanese Patent Laid-Open Publication No. 10-2005-82323 are used to perform cleaning in various ways.

[0006] For example, the wafer cleaning apparatus includes a pair of cleaning brushes made of a hygroscopic sponge material, which clean the wafer while pressing the wafer by respectively rotating and contacting the front and rear surfaces of the rotating wafer through guide rollers.

[0007] However, the brush in the cleaning device according to the prior art has the following problems due to its soft material characteristics: the brush surface cannot be fixed when the brush is rotated by the roller, or the brush surface is deformed during use.

[0008] In addition, due to the contact between the brush surface and the wafer surface, contaminants are adsorbed onto the brush surface, so there is a problem that the cleaning effect of the wafer is reduced when the brush is repeatedly used. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The problem to be solved by the present invention is to provide a brush for cleaning wafers which can improve durability and cleaning effect.

[0011] Methods used to solve problems

[0012] In order to achieve the above-mentioned problem, a brush for cleaning wafers according to one aspect of the present invention includes: a brush including a hollow interior for spraying cleaning liquid and having a plurality of protrusions formed on the outer surface; and a membrane configured to cover the outer surface of the brush, the membrane including a plurality of holes for the plurality of protrusions to pass through.

[0013] Effects of the Invention

[0014] This embodiment has the advantage that the strength of the brush can be reinforced by the film, thereby improving the rotation stability and durability of the brush.

[0015] In addition, there is an advantage that the cleaning liquid can be guided to be sprayed from the region of the brush where the protrusions are formed, and contaminants can be prevented from being adsorbed on the brush surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a perspective view showing the appearance of a brush for cleaning a wafer according to an embodiment of the present invention.

[0017] Figure 2 is a top view of a brush for cleaning a wafer and a film covering the appearance according to an embodiment of the present invention.

[0018] Figure 3 is a cross-sectional view of a film according to an embodiment of the present invention.

[0019] Figure 4 is a top view of a film according to an embodiment of the present invention.

[0020] Figure 5 It is a cross-sectional view showing a modification of the bonding structure between the film and the brush according to the embodiment of the present invention. DETAILED DESCRIPTION

[0021] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0022] However, the technical idea of ​​the present invention is not limited to the partial embodiments described below, and can be presented in various different ways. As long as it is within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or replaced for use.

[0023] In addition, with respect to the terms (including technical terms and scientific terms) used in the embodiments of the present invention, if no specific definition is clearly given in this specification, they should be interpreted with the meaning that is generally understood by ordinary technicians in the technical field to which the present invention relates, and with respect to commonly used terms such as terms that have been defined in dictionaries, the meaning of the term can be interpreted in light of the context of the relevant technology.

[0024] In addition, the terms used in the embodiments of the present invention are only used to illustrate the embodiments and are not used to limit the present invention.

[0025] In this specification, descriptions about the singular should be understood to include the plural meaning, unless otherwise clearly explained in the context. When it is recorded as "at least one (or more than one) of A and (and) B, C", it may include more than one of all combinations that can be composed of A, B, and C.

[0026] In addition, terms such as first, second, A, B, (a), (b) etc. may be used to describe the components of the embodiments of the present invention. These terms are only used to distinguish one component from other components, and the nature, order or sequence of the components are not limited by these terms.

[0027] In addition, when a certain component is described as being “connected,” “bonded” or “in contact with” other components, it includes not only the case where these components are directly “connected,” “bonded” or “in contact with” other components, but also the case where these components are “connected,” “bonded” or “in contact with” other components existing between the component and the other components.

[0028] Furthermore, when described as being formed or disposed “above (upper)” or “below (lower)” each component, it includes not only the case where two components are directly in contact with each other “above (upper)” or “below (lower)”, but also the case where one or more other components are formed or disposed between the two components. Furthermore, when described as “above (upper)” or “below (lower)”, it includes not only the meaning of the upward direction based on one component, but also the meaning of the downward direction based on one component.

[0029] Figure 1 is a perspective view showing the appearance of a brush for cleaning a wafer according to an embodiment of the present invention, Figure 2 is a top view of a brush for cleaning a wafer and a film covering the appearance according to an embodiment of the present invention, Figure 3 is a cross-sectional view of a film according to an embodiment of the present invention, Figure 4 is a top view of a film according to an embodiment of the present invention.

[0030] Reference Figures 1 to 4 , the brush 10 for cleaning a wafer according to an embodiment of the present invention may include a brush 100 and a film 200 for covering the outer appearance of the brush 100 .

[0031] The brush 100 may be formed in a cylindrical shape. The brush 100 may have a ring-shaped cross section. A hollow 120 may be formed in the center of the brush 100. The hollow 120 may be formed to penetrate from one surface of the brush 100 to the other surface. A rotating shaft (not shown) may be combined with the hollow 120. The rotating shaft rotates by the operation of an actuator (not shown), whereby the brush 100 can also rotate together.

[0032] The wafer cleaning device according to the present embodiment includes a plurality of brushes 10 for cleaning wafers, and the wafer may be disposed between the plurality of brushes 10 for cleaning wafers so as to clean the wafer.

[0033] The material of the brush 100 may be a material through which a fluid can pass. As an example, the material of the brush 100 may be various polymer compounds, i.e., plastic materials. The hollow 120 may be provided with a cleaning liquid injection unit (not shown) for injecting cleaning liquid in the radial direction of the brush 100, and the cleaning liquid injected from the cleaning liquid injection unit is provided to the wafer from the inner surface of the brush 100 via the outer surface.

[0034] The brush 100 may include a plurality of protrusions 110. The plurality of protrusions 110 may be formed in a shape that protrudes outward from the outer surface of the brush 100 more than other areas of the outer surface of the brush 100. When cleaning a wafer, the plurality of protrusions 110 may contact the surface of the wafer. The plurality of protrusions 110 may respectively have a circular cross-sectional shape or a cross-sectional shape of various shapes. The plurality of protrusions 110 may be arranged to be spaced apart from each other along the length direction of the brush 100. The plurality of protrusions 110 may be arranged to be spaced apart from each other along the circumferential direction of the brush 100. Any one of the plurality of protrusions 110 may be arranged to overlap with an area between two protrusions 110 that are adjacently arranged based on the circumferential direction.

[0035] The brush 10 for cleaning wafers may include a film 200 covering an outer surface. The film 200 has a predetermined thickness and may be configured to cover an outer surface of the brush 100. The film 200 may be made of various materials such as PET (polyethylene terephthalate) or PVC (Polyvinyl Chloride).

[0036] The thickness of the film 200 may be in a range of 0.1 mm to 0.5 mm.

[0037] The film 200 is configured to cover the outer surface of the brush 100 , so as to prevent foreign matter from being adsorbed on the outer surface of the brush 100 during the wafer cleaning process.

[0038] The film 200 may include a plurality of holes 210. The plurality of holes 210 may be shaped to penetrate the inner surface of the film 200 from the outer surface thereof. The plurality of holes 210 may be provided to correspond to the region of the film 200 where the protrusion 110 of the brush 100 is provided. The plurality of holes 210 may have a circular cross-sectional shape and various shapes. The diameter of each of the plurality of holes 210 may be greater than the diameter of the protrusion 110. The cross-sectional area of ​​each of the plurality of holes 210 may be formed to be greater than the cross-sectional area of ​​the protrusion 110.

[0039] When the film 200 is combined with the brush 100, the protrusion 110 may be arranged to penetrate the hole 210. Thus, the cleaning liquid provided from the hollow 120 in the brush 100 may be sprayed to the outside through the region where the protrusion 110 is formed on the outer surface of the brush 100. In other words, the cleaning liquid may be sprayed to the outside through the hole 210 of the film 200. Therefore, there is an advantage that the cleaning liquid can be sprayed to the surface of the wafer more uniformly and accurately.

[0040] On the other hand, Figure 3 and Figure 4 As shown, a guide 220 of a shape protruding inwardly from the inner surface of the film 200 may be formed on the inner surface of the film 200 facing the outer surface of the brush 100. The guide 220 may be formed in a bar shape having a length direction along the length direction of the brush 100 or the film 220. A plurality of guides 220 may be provided, and are arranged to be spaced apart from each other along the circumferential direction of the film 200. Through the guide 220, the inner surface of the film 200 and the outer surface of the brush 100 may have areas spaced apart by a predetermined distance in the radial direction, so that the cleaning liquid can be guided to be sprayed from the area of ​​the film 220 where the hole 220 is formed. In addition, the cleaning liquid can be prevented from staying between the inner surface of the film 200 and the outer surface of the brush 100 by the spaced-apart space formed by the guide 220.

[0041] In addition, although not shown, a filter (not shown) may be provided on the outer surface or inner surface of the film 200. The filter may be formed in a film shape so as to be attached to the outer surface or inner surface of the film 200. The filter may be a non-woven fabric. Thus, the surface of the film 200 or the surface of the brush 100 may be prevented from being contaminated by the filter.

[0042] In addition, although not shown in the figure, a plurality of protrusions (not shown) can be formed on the outer surface of the brush 100 or the inner surface of the membrane 200, which are used to guide the flow of the cleaning liquid sprayed from areas other than the protrusions 110, and a flow path for the cleaning liquid to flow can be formed between the protrusions and the protrusions adjacent thereto, thereby guiding the cleaning liquid to be sprayed from the area where the holes 210 of the membrane 200 are formed.

[0043] Figure 5 It is a cross-sectional view showing a modification of the bonding structure between the film and the brush according to the embodiment of the present invention.

[0044] Reference Figure 5 , the film 200 may include an inclined surface 250. The inclined surface 250 may be provided outside a region where a hole 210 is formed, and the hole 210 is combined with the protrusion 110 of the brush 100. The inclined surface 250 may be formed in a shape in which the radial length of the outer surface of the brush 100 becomes farther as it approaches the hole 210. Through the inclined surface 250, the cleaning liquid provided from the brush 100 can be easily sprayed to the outside through the hole 210.

[0045] According to the above-described structure, there is an advantage that the strength of the brush can be reinforced by the film, thereby improving the rotation stability and durability of the brush.

[0046] In addition, there is an advantage that the cleaning liquid can be guided to be sprayed from the region of the brush where the protrusions are formed, and contaminants can be prevented from being adsorbed on the brush surface.

[0047] Above, all the components constituting the embodiments of the present invention are described in a manner of being combined into a whole or operating in combination, but the present invention is not limited to these embodiments. That is to say, as long as it is within the scope of the purpose of the present invention, one or more of all the components of the present invention can be selectively combined and operated by such combination. In addition, for the terms "including", "consisting of" or "having" recorded above, it should be understood that the relevant components can be included, that is, other components can be further included, rather than excluding other components, unless there is a special record to the contrary. For all terms including technical terms or scientific terms, they have the same meaning as the meaning generally understood by ordinary technicians in the technical field to which the present invention belongs, unless a different definition is made for this. For commonly used terms such as terms that have been defined in general dictionaries, it should be understood that their meaning is consistent with the meaning in the context of the context of the relevant technology. If no special definition is made for this in this specification, it should not be interpreted with an idealized or overly formalized meaning.

[0048] The above description is only for the purpose of illustrating the technical idea of ​​the present invention. Therefore, as long as one is a person of ordinary skill in the technical field to which the present invention belongs, various changes and deformations can be made within the scope of the essential features of the present invention. Therefore, the embodiments disclosed in the present invention are not used to limit the technical idea of ​​the present invention, but to illustrate the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted based on the claims recorded later, and all technical ideas within the scope equivalent to them should be included in the scope of the claims of the present invention.

[0049] Industrial Applicability

[0050] According to the brush for cleaning wafers based on an embodiment of the present invention, the strength of the brush can be enhanced by providing a film covering the outer surface of the brush, thereby improving the rotational stability and durability of the brush, and the spraying of the cleaning liquid can be guided by a plurality of protrusions formed on the outer surface of the brush, and contaminants can be prevented from being adsorbed on the surface of the brush, so it has industrial applicability.

Claims

1. A brush for cleaning a wafer, wherein: The brush for cleaning the wafer comprises: a brush including a hollow interior for spraying cleaning fluid and having a plurality of protrusions formed on an outer surface thereof; and a film arranged to cover the outer surface of the brush, The membrane includes a plurality of holes through which the plurality of protrusions pass.

2. The brush for cleaning wafers according to claim 1, wherein: The material of the film includes various materials such as PET (polyethylene terephthalate) or PVC (Polyvinyl Chloride).

3. The brush for cleaning wafers according to claim 1, wherein: The cross-sectional area of ​​the protrusion is smaller than the cross-sectional area of ​​the hole.

4. The brush for cleaning wafers according to claim 1, wherein: A guide is provided on the inner surface of the film facing the outer surface of the brush, and the guide is formed in a shape protruding inwardly from other regions of the inner surface of the film.

5. The brush for cleaning wafers according to claim 1, wherein: The brush for cleaning wafers includes a non-woven fabric, which is arranged on the surface or inside of the film.

6. The brush for cleaning wafers according to claim 1, wherein: The membrane comprises an inclined surface, The inclined surface is arranged outside the hole.

7. The brush for cleaning wafers according to claim 6, wherein: The inclined surface is formed in a shape in which the distance from the outer surface of the brush increases as it approaches the hole.

8. The brush for cleaning wafers according to claim 1, wherein: A flow path is formed on the outer surface of the brush or the inner surface of the film to guide the flow of the cleaning liquid.

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