Multi-temperature-zone chip mounting equipment

Abstract

The invention belongs to the technical field of semiconductor mounting and provides multi-temperature-zone chip mounting equipment which comprises a multi-temperature-zone vacuum heating table device and a temperature control system, the multi-temperature-zone vacuum heating table device comprises a vacuum heating disc, a cooling disc and a heat insulation assembly, and the vacuum heating disc is provided with at least one vacuum heating table. The vacuum heating table comprises an internal temperature sensor and a heating element; the cooling disc is controlled by the temperature control system to reduce the temperature of the vacuum heating disc through a cooling medium; the temperature control system comprises a temperature controller and an external temperature sensor, and the temperature controller controls the heating power of the heating element according to an external temperature signal from the external temperature sensor and an internal temperature signal from the internal temperature sensor. According to the scheme, multi-temperature-zone control is carried out by taking the vacuum heating table as a unit, and the temperature controller simultaneously controls the heating power of the heating element and the flux of the cooling medium, so that the surface temperature of the vacuum heating table can be regulated and controlled more quickly.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor mounting, and in particular relates to multi-temperature zone chip mounting equipment. Background Art

[0002] Chip placement equipment is a key device in the semiconductor manufacturing and electronic equipment assembly process. Its main function is to accurately and efficiently place chips at designated locations. With the trend of miniaturization and integration of electronic devices, higher requirements are placed on the accuracy, speed and stability of chip placement equipment.

[0003] Existing chip mounting equipment usually includes a heating table module, which is used to preheat the chip or substrate before mounting and provide necessary temperature control during the mounting process. The heating table module includes a preheating table, a heating workbench, a vacuum adsorption structure, a visual positioning structure and a cooling workbench; the visual positioning system determines the current mounting position and the target mounting position of the chip, the vacuum adsorption structure stably reflects the chip at the current mounting position to the target mounting position of the PCB board, the preheating table preheats the chip before mounting it to a temperature range suitable for mounting, the heating workbench accurately controls the temperature and monitors the heating status during the mounting process according to the heating control instructions input by the user, and the cooling table provides cooling medium and heat dissipation structure to achieve rapid and uniform cooling of the PCB board and electronic components after the mounting is completed.

[0004] In the current market, the high-temperature plate module in the heating workbench of the chip bonding device often needs to increase the size of the high-temperature heating table when facing large-size and large-quantity chip products, which makes the temperature uniformity of the heating table worse. Because the temperature control of the heating table is inaccurate, the temperature uniformity is poor, and there is no active heat dissipation function, it is easy to cause the edge of the chip substrate to warp and deform, affecting the mounting quality and welding effect. In addition, the cooling table needs to add a separate cooling module, which increases the overall size of the equipment. Summary of the invention

[0005] In order to solve the problem that when a heating workbench in a chip bonding device faces large-size and large-quantity chip products, it is necessary to simultaneously increase the size of the high-temperature workbench so that the temperature drops, which easily causes chip edge warping and deformation, affecting the mounting quality and welding effect, the present application provides a multi-temperature zone vacuum heating table device and a multi-temperature zone chip mounting equipment.

[0006] The multi-temperature zone vacuum heating table device and multi-temperature zone chip mounting equipment provided in this application adopt the following technical solutions: A multi-temperature zone chip mounting device includes a multi-temperature zone vacuum heating table device 10 and a temperature control system 20, wherein the multi-temperature zone vacuum heating table device includes a vacuum heating plate 11, a cooling plate 12 and a heat insulation component 13, wherein the vacuum heating plate 11 has at least one vacuum heating plate 110, and the vacuum heating plate 110 includes an internal temperature sensor 111 and a heating element 112; the cooling plate 12 is located below the vacuum heating plate 11, and is used to reduce the temperature of the vacuum heating plate 11 through a cooling medium under the control of the temperature control system 20; the temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22, wherein the temperature controller 21 controls the heating power of the heating element 112 according to an external temperature signal from the external temperature sensor 22 and an internal temperature signal from the internal temperature sensor 21.

[0007] By adopting the above technical solution, the temperature control system 20 independently controls the temperature of each vacuum heating stage 110 in the vacuum heating plate 11 through the temperature controller 21, and controls the on / off and working power of the circuit where the heating element 112 inside the vacuum heating stage 110 is located according to the external temperature signal measured on the surface of the vacuum heating stage 110 and the external temperature signal measured inside the vacuum heating stage 110.

[0008] The multi-temperature zone vacuum heating table device 10 of this case integrates the functions of the traditional preheating plate, cooling plate and heating plate, and realizes the preheating and heating functions of the chip by accurately controlling the heating element 112 of each vacuum heating table 110. In other words, the vacuum heating plate 11 of this case not only meets the high temperature requirements of the mounting process, but also has the structural function of the preheating plate, effectively reducing the design structure size, improving the efficiency of the mounting process, and reducing energy consumption. In addition, the vacuum heating plate 11 and the cooling plate 12 in this case are both set as independent structures, which supports the replacement of the vacuum heating plate 11 according to product requirements and is easy to maintain.

[0009] Optionally, the vacuum heating plate 11 has a plurality of vacuum heating tables 110, and there are gaps between the vacuum heating tables 110, and the gaps are between 0.1 mm and 0.2 mm; the heating element 112 is a heating rod, and the heating rods are distributed according to preset positions to ensure that the external temperature signal of the vacuum heating table 110 meets the temperature uniformity rule, and the internal temperature sensor 111 is located in the middle of all the heating rods.

[0010] By adopting the above technical solution, since the temperature control system 20 performs temperature control based on the vacuum heating stage 110, the vacuum heating plate 11 in this case is divided into multiple vacuum heating stages 110, which can realize that different vacuum heating stages 110 work in different temperature environments, that is, the vacuum heating plate 11 is set as a multi-temperature zone independent structure to realize independent temperature control of a single temperature zone; and gaps are set between each vacuum heating stage 110 to reduce temperature interference between vacuum heating stages 110. The heating element 112 can be one or more heating rods, and the preset position of the heating rods is calculated through simulation to ensure the temperature uniformity of the heating stage surface.

[0011] Optionally, the heating element includes two heating rods, the internal temperature sensor 111 is installed inside the vacuum heating table 110, and the axis of the internal temperature sensor 111 and the axis of the heating rods are in the same plane.

[0012] By adopting the above technical solution and limiting the position of the internal temperature sensor 111 , the internal temperature signal generated by the internal temperature sensor 111 can fully represent the temperature inside the vacuum heating table 110 when the heating rod is working.

[0013] Optionally, the upper surface of the vacuum heating table 110 is provided with vacuum adsorption holes 113 arranged in a matrix, the vacuum heating table is provided with vacuum holes 114, and the lower surface of the vacuum heating table 110 is provided with vacuum connection holes 115, and the vacuum holes 114 connect the vacuum adsorption holes 113 and the vacuum connection holes 115 to form a vacuum adsorption loop; The vacuum heating table 110 is also provided with a sealing ring positioning groove 116 coaxial with the vacuum connecting hole 115, and the cooling plate 12 is provided with a vacuum sealing groove 121 and a vacuum sealing ring 122. The vacuum sealing ring 122 is coaxially connected with the vacuum sealing groove 121 and the vacuum connecting hole 115 and contacts with the inner wall of the sealing ring positioning groove 116 to form a vacuum sealing structure.

[0014] By adopting the above technical solution, the vacuum connection hole 115, the vacuum hole 114, and the vacuum adsorption hole 113 constitute a vacuum adsorption loop, which is used to adsorb the chip, wafer or substrate to be heated to the upper surface of the vacuum heating table 110 through the pressure between the vacuum and the outside world under a vacuum environment. The vacuum connection hole 115, the sealing ring positioning groove 116, the vacuum sealing ring 122, and the vacuum sealing groove 121 constitute a vacuum sealing structure between the vacuum heating table 110 and the cooling plate 12, which ensures vacuum performance, isolates temperature interference between each vacuum heating table 110, reduces the heat transferred downward by the vacuum heating table 110, and reduces the temperature gradient of the cooling plate 12 of the integrated structure, thereby reducing the influence of the temperature gradient of the cooling plate 12 on the vacuum heating table 110, and ensuring the temperature uniformity of the single-area vacuum heating table.

[0015] Optionally, an active heat dissipation slot 117 is provided on the lower surface of the vacuum heating table 110 , and the vacuum hole 114 is a blind hole.

[0016] By adopting the above technical solution and setting the active heat dissipation groove 117, the heat dissipation area of ​​the vacuum heater is increased to ensure that the heat dissipation rate meets the cooling speed requirement of the vacuum heating plate 11. At the same time, the contact area between the vacuum heating plate 11 and the insulation plate 131 is reduced, and the contact thermal resistance between the vacuum heating plate 11 and the cooling plate 12 is increased. The vacuum hole 114 is set as a dark hole to ensure the sealing of the vacuum hole 114.

[0017] Optionally, the vacuum heating plate 11 is provided with a first vacuum air path hole 118, which is connected to all the vacuum connection holes 115; the cooling plate 12 is provided with a second vacuum air path hole 123 which is connected to all the vacuum sealing grooves 121, and the first vacuum air path hole 118, the vacuum connection hole 115, the vacuum sealing ring 122, the vacuum sealing groove 121, and the second vacuum air path hole 123 constitute a vacuum circuit.

[0018] By adopting the above technical solution, the first vacuum air path through hole 118 in the vacuum heating plate 11 connected to the vacuum adsorption circuit and the vacuum heating plate 11 part in the vacuum sealing structure constitute the vacuum flow channel of the vacuum heating plate. In the cooling plate 12, the second vacuum air path through hole 123 and the cooling plate 12 part in the vacuum sealing structure constitute the vacuum flow channel in the cooling plate 12. The vacuum flow channels of the two components of the vacuum heating plate 11 and the cooling plate 12 together constitute a vacuum circuit, ensuring the vacuum adsorption function of the vacuum heating stage 110, while reducing the thermal crosstalk between the vacuum heating stages 110 in different temperature zones caused by the integrated vacuum flow channel.

[0019] Optionally, the cooling disk 12 is provided with a cooling medium input hole 124, a cooling medium output hole 125 and a heat dissipation groove 126. The cooling medium input hole 124 is used to receive the cooling medium from the outside, and the cooling medium output hole 125 is used to adjust the flux of the cooling medium under the control of the temperature controller 21. The cooling medium input hole 124, the cooling medium output hole 125 and the heat dissipation groove 126 constitute a cooling medium circulation channel.

[0020] By adopting the above technical solution, the temperature controller 21 can simultaneously control the flow rate of the cooling medium transmitted into the cooling disk 12 through the cooling medium input hole 124 of the external pipeline, and the flux of the cooling medium transmitted to each partition of the cooling disk 12 through the heat dissipation groove 126 through the cooling medium output hole 125, thereby realizing the cooling cycle control of the cooling disk 12.

[0021] Optionally, the cooling disk 12 is also provided with a vacuum input hole 127 and a vacuum output hole 128, and the vacuum output hole 128 is coaxial with the vacuum sealing groove 121, and the vacuum input hole 127, the second vacuum air path hole 123 and the vacuum output hole 128 constitute a cooling disk vacuum flow channel sub-circuit in the vacuum circuit.

[0022] By adopting the above technical solution, the external vacuum device forms a vacuum flow sub-circuit of the cooling plate through the cooling input hole 127, the second vacuum air path through hole 123, and the vacuum output hole 128, combined with the vacuum sealing structure and the vacuum adsorption circuit in the vacuum heating plate, to form a vacuum environment. In this vacuum environment, the chip, wafer or substrate is adsorbed through the vacuum adsorption hole 113 in the vacuum heating plate 11, so that the chip, wafer or substrate is closely attached to the vacuum heating stage 110 in the corresponding temperature zone of the vacuum heating plate 11.

[0023] Optionally, the thermal insulation assembly 13 includes a thermal insulation plate 131 and a thermal insulation base 132, the thermal insulation plate 131 is provided with a penetrating heat dissipation groove 133, the cooling plate 12 is provided with a heat dissipation groove sealing hole 129, the heat dissipation groove 133 cooperates with the heat dissipation groove sealing hole 129, and the thermal insulation plate 131 is circumferentially provided with mounting through holes 134.

[0024] By adopting the above technical solution, the heat insulation plate 131 and the cooling plate 12 cooperate with each other to ensure the sealing of the heat dissipation medium. At the same time, these mounting through holes 134 can also ensure that the heat insulation plate 132 can be tightly connected to the vacuum heating plate 11 and tightly connected to the cooling plate 12.

[0025] Optionally, the side wall of the vacuum heating table is provided with a wiring groove 31 corresponding to the heating element 112 and the internal temperature sensor 111, and the insulation base 132 is provided with a wire groove 33, and the wire groove 33 is on the same side as the wiring groove 31; the insulation base 132 is also provided with a threaded mounting bracket, and the mounting bracket has three threads.

[0026] By adopting the above technical solution, the wiring of each heating element 112 and the internal temperature sensor 111 can reach the wire groove 32 through the wiring groove 31 and the side groove of the insulation base 132, ensuring that the wiring of the heating element 112 and the internal temperature sensor 111 can be kept away from the high temperature area to avoid premature aging of the line. The setting of the installation base of the insulation base 132 improves the heat dissipation efficiency of the insulation base as much as possible.

[0027] In summary, the present application includes at least one of the following beneficial technical effects: 1. In the multi-temperature zone chip mounting equipment, the vacuum heating plate 11 and the cooling plate 12 are independent structures. The structure of the vacuum heating plate 11 can be replaced according to product requirements, which improves the quality stability of parts and components, is easy to operate, easy to disassemble and maintain, and reduces maintenance costs.

[0028] 2. In the multi-temperature zone chip mounting equipment, the heating elements 112 of each vacuum heating stage 110 in the vacuum heating plate 11 can be independently controlled by the temperature control system 20 to achieve independent temperature control in multiple temperature zones, and the vacuum heating stage 110 in each temperature zone can ensure the functions of uniform heating, rapid temperature rise and fall, and vacuum adsorption fixation.

[0029] 3. There is no direct contact between the multiple vacuum heating stages 110 in the vacuum heating plate 11. They are independent structures, ensuring that there is no temperature interference between the vacuum heating stages.

[0030] 4. In this case, the vacuum circuit is set to be multi-stage. In the vacuum heating table 110, the vacuum adsorption hole 113, the vacuum hole 11, the first vacuum air path hole 118, and the vacuum connection hole 115 constitute an independent vacuum flow channel of the vacuum heating table 110. The vacuum input hole 127, the second vacuum air path hole 123, and the vacuum output hole 128 of the cooling plate 12 constitute an independent cooling plate vacuum flow channel sub-circuit of the cooling plate 12. The cooling plate vacuum flow channel sub-circuit, the vacuum sealing structure, and the independent vacuum flow channel of the vacuum heating table 110 together constitute the overall vacuum circuit.

[0031] The external vacuum equipment draws a vacuum through the vacuum input hole 127, so that the entire vacuum circuit is in a vacuum state, and then the chip, wafer or substrate is adsorbed through the vacuum adsorption hole 113 to make it fit tightly with the vacuum heating plate 11, so that the vacuum heating plate 11 can heat it to reach the suitable mounting temperature range in the preheating state, the optimal mounting temperature range in the heating state, and the predetermined cooling temperature after mounting is completed.

[0032] 5. Double-layer insulation is performed by the insulation plate 131 and the cooling plate 12, which effectively reduces the heat energy transmitted downward from the vacuum heating table 110. The heat energy is transmitted back through the cooling plate 12 and the insulation plate 131 to affect other vacuum heating tables 110, thereby reducing the temperature crosstalk between the vacuum heating tables 110 and ensuring the uniformity of the surface temperature indicated by the external temperature signal of the working surface of the vacuum heating table 11 in the corresponding temperature zone of the vacuum heating table 110.

[0033] 6. The temperature controller 21 of this case can simultaneously control multiple heating rods of the heating element 112 in each vacuum heating table 110, and can also control the flux of the cooling medium in the cooling plate 12, thereby realizing dual control of temperature control and cooling control, and can improve the overall control response capability for adjusting the working surface of the vacuum heating table 110. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a module schematic diagram of the multi-temperature zone chip mounting equipment provided in this case; Figure 2A schematic diagram of the structure of the multi-temperature zone chip mounting equipment provided for this case; Figure 3 for Figure 2 Exploded diagram of a medium- and multi-temperature-zone chip placement device; Figure 4 for Figure 2 A cross-sectional view of the vacuum heating table in the longitudinal direction; Figure 5 for Figure 2 Schematic diagram of the cooperation between the vacuum heating table and the cooling plate; Figure 6 for Figure 2 A perspective view of the lower surface of the medium vacuum heating table; Figure 7 for Figure 2 Schematic diagram of the wiring slots in the vacuum heating table; Figure 8 for Figure 2 A top view of the middle insulation base; Fig. 9 is a schematic diagram of the vacuum flow channel sub-circuit in the cooling plate; Fig.10 is a perspective view of the top of the cooling plate; Fig.11 is a schematic diagram of the top of the cooling plate; Fig.12 A schematic diagram of the structure of the thermal insulation component. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0036] The present invention provides a multi-temperature zone chip mounting device, referring to Figure 1As shown, it includes a multi-temperature zone vacuum heating table device 10 and a temperature control system 20. The temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22. The multi-temperature zone vacuum heating table device 10 includes a vacuum heating plate 11, a cooling plate 12 and a heat insulation component 13. The cooling plate 12 is located under the vacuum heating plate 11, and the temperature of the vacuum heating plate 11 is reduced by a cooling medium under the control of the temperature control system 20. The heat insulation component 13 is used to isolate the temperature transfer between the vacuum heating plate 11 and the cooling plate 12. The vacuum heating plate 11 has at least one vacuum heating table 110, and the vacuum heating table 110 includes an internal temperature sensor 111 and a heating element 112; the temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22; the temperature controller 21 controls the heating power of the heating element 112 according to the external temperature signal from the external temperature sensor 22 and the internal temperature signal from the internal temperature sensor 21.

[0037] In this case, the temperature control system 20 takes the vacuum heating table 110 as a unit, changes the on / off and working power of the circuit where the heating element 112 inside the vacuum heating table 110 is located, adjusts the flow rate of the cooling medium of the cooling plate 12 to change the heat dissipation efficiency of the vacuum heating table 110, and realizes the temperature controller 21 to independently control the temperature of each vacuum heating table 110 in the vacuum heating plate 11. In addition, the vacuum heating plate 11 and the cooling plate 12 are both configured as independent structures, which supports the replacement of the vacuum heating plate 11 according to product requirements and is easy to maintain. At the same time, the temperature of the vacuum heating table 110 is accurately controlled by the temperature control system 20, which can realize the functions of the traditional preheating plate and the heating plate, and achieve structural simplification.

[0038] In one embodiment, referring to the attached Figure 1 The temperature controller 21 has a first input end, a second input end, a temperature control end and a flow control end. The first input end is connected to the external temperature sensor 22 to obtain the external temperature signal of the vacuum heating table, the second input end is connected to the internal temperature sensor 111 to obtain the internal temperature signal of the vacuum heating table 110, the temperature control end is connected to the circuit where the heating element 112 is located to transmit the heating control signal, and the flow control end is connected to the cooling plate 12 to transmit the flow control signal.

[0039] The temperature controller 21 obtains an external temperature value according to an external temperature signal, obtains an internal temperature value according to an internal temperature signal, obtains a temperature difference according to the difference between the external temperature value and the internal temperature value, and obtains a heating control signal and a flow control signal according to the temperature difference. The temperature controller 21 changes the on-off of the circuit where the heating element 112 in the corresponding vacuum heating table 110 is located and changes the heating power of the heating element 112 through the heating control signal. The specific change method can be to increase the current transmitted to the heating element 112 or reduce the current transmitted to the heating element 112, or directly disconnect the circuit where the heating element 112 is located, etc.

[0040] The temperature controller 21 changes the flux of the cooling medium in the cooling disk 12 through a flow control signal. As the cooling medium in the cooling disk 12 circulates, the temperature of the cooling disk 12 decreases, thereby providing active cooling for the vacuum heating disk 11, thereby ensuring that when the vacuum heating disk 11 is in a high-temperature working state, the temperature of the lower surface of the entire device is within a safe temperature range.

[0041] In one embodiment, reference Figure 2 and Figure 3 As shown, the vacuum heating plate 11 has a plurality of vacuum heating stages 110, and there are gaps ( Figure 2 The vacuum heating plate 11 is divided into a plurality of vacuum heating stages 110, and the temperature control system 20 performs temperature control based on the vacuum heating stage 110. Therefore, in this case, the temperature control system 20 can be used to control different vacuum heating stages 110 to perform different temperatures. Different vacuum heating stages 110 can be operated under different temperature environments, that is, the vacuum heating plate is set as a multi-temperature zone independent structure to achieve independent temperature control in a single temperature zone; and gaps are set between each vacuum heating stage 110 to reduce temperature interference between the vacuum heating stages 110.

[0042] by Figure 3 For example, the vacuum heating plate 11 has four vacuum heating tables 110. From left to right, the first vacuum heating table 110 and the fourth vacuum heating table 110 have no chips to be heated. The heating element 112 in the vacuum heating table 110 is disconnected from the circuit under the control of the temperature controller 21, and the vacuum heating table 110 does not work; the chip on the second vacuum heating table 110 is still in the preheating state, and the heating element 112 in the vacuum heating table 110 works in the state corresponding to the preheating power under the control of the temperature controller 21, and the chip is preheated for subsequent patching; the chip on the third vacuum heating table 110 is in the patching process, and the heating element 112 in the vacuum heating table 110 works in the state corresponding to the heating power under the control of the temperature controller 21, and the heating chip ensures that the patching process proceeds smoothly. The gap between adjacent vacuum heating tables 110 is set between 0.1mm and 0.2mm. The chip here can be replaced by other electronic devices that need to be mounted, such as wafers and substrates.

[0043] In one embodiment, referring to the attached Figure 3 As shown, the heating elements 112 are respectively embedded in each vacuum heating stage 110 , and the temperature of each vacuum heating stage 110 is controlled by a temperature controller 21 through the heating elements 112 and a cooling plate 12 matched with the vacuum heating stage 110 .

[0044] The heating elements 112 in each vacuum heating table 110 are two heating rods, which are distributed according to preset positions to ensure that the external temperature signal of the vacuum heating table 110 meets the temperature uniformity rule. In other words, the positions of the heating rods are calculated based on simulation, and the positions of the heating rods are set to ensure that the surface temperature of the vacuum heating table 110 is uniform (i.e., it meets the temperature uniformity rule). For example, refer to the attached Figure 2 and attached Figure 3 As shown, from left to right, the length direction of the two heating rods in the first vacuum heating table 110 is the left-right direction, and the two heating rods are arranged one front and one back; the direction of the two heating rods in the second vacuum heating table 110 is the front-to-back direction, and the two heating rods are arranged one left and one right; the direction of the two heating rods in the third vacuum heating table 110 is the front-to-back direction, and the two heating rods are arranged one left and one right; the length direction of the heating rods in the fourth vacuum heating table 110 is the left-to-right direction, and the two heating rods are arranged one front and one back.

[0045] The sensing end of the internal temperature sensor 111 is located in the middle of all the heating rods in the vacuum heating table 110 to ensure that the working temperatures of the two heating rods are collected as much as possible. Figure 3 The internal temperature sensor 111 is in the shape of a long strip. The internal temperature sensor 111 is installed in the middle of the two heating rods. The axis of the internal temperature sensor 111 and the axis of the two heating rods are in the same horizontal plane.

[0046] The internal temperature sensor 111 generates an internal temperature signal according to the temperature inside the vacuum heating table 110, and transmits the internal temperature signal to the first input end of the temperature controller 21 in the form of an electrical signal; the external temperature sensor 22 usually adopts a contact temperature sensor, and the external temperature sensor 22 generates an external temperature signal according to the temperature of the outer surface of the vacuum heating table 110, and transmits the external temperature signal to the second input end of the temperature controller 21 in the form of an electrical signal.

[0047] The temperature controller 21 presets a temperature offset offset, which represents the change in the heating control signal corresponding to a unit temperature increase, and the change in the flow control signal corresponding to a unit temperature increase. Therefore, the temperature controller 21 obtains a heating control signal to control the circuit where the heating rod is located based on the temperature difference between the external temperature value and the internal temperature value, combined with the temperature offset, to ensure that the surface of the heating table is within the preset working temperature value range corresponding to the working state such as preheating / heating, and also obtains a flow control signal, and changes the flux of the cooling medium in the cooling disk 12 through the flow meter integrated in the temperature controller 21 itself, and passes the cooling medium in the cooling medium circulation channel composed of the "cooling medium input hole 124, the cooling medium output hole 125 and the heat dissipation groove 126".

[0048] In one embodiment, reference Figure 2 , Figure 3 As shown, the upper surface of the vacuum heating table 110 is provided with vacuum adsorption holes 113 arranged in a matrix. Figure 4 As shown, a vacuum hole 114 and a first vacuum air path hole 118 are provided in the vacuum heating table 110. Both the vacuum hole 114 and the first vacuum air path hole 118 are dark holes. The length direction of the vacuum hole 114 is the front-to-back direction. The number of vacuum holes 114 is related to the number of columns of the array composed of the vacuum adsorption holes 113. The length direction of the first vacuum air path hole 118 is the left-right direction. The number of the first vacuum air path hole 118 is related to the number of rows of the array composed of the vacuum adsorption holes 113. A vacuum connection hole 115 is provided on the lower surface of the vacuum heating table 110. The vacuum hole 114 is connected to the vacuum adsorption hole 113 upward, connected to the first vacuum air path hole 118 left and right, and connected to the vacuum connection hole 115 downward. Therefore, the vacuum adsorption hole 113, the vacuum hole 114, and the vacuum connection hole 115 constitute a vacuum adsorption circuit, which is an independent vacuum flow channel of the vacuum heating table 110.

[0049] In one embodiment, reference Figure 5 As shown, a sealing ring positioning groove 116 coaxial with the vacuum connecting hole 115 is further provided at the bottom of the vacuum heating table 110, a vacuum sealing groove 121 is opened at the top of the cooling plate 12, and a vacuum sealing ring 122 is further provided at the top of the cooling plate 12. There is no direct contact between the vacuum sealing ring 122 and all the vacuum heating tables 110 in the vacuum heating plate 11, the vacuum sealing ring 122 is coaxial with the vacuum sealing groove 121, and the vacuum sealing ring 122 is made of a heat-insulating material, preferably a polyimide with low thermal conductivity.

[0050] This example can reduce the contact area between the vacuum heating plate 11 and the cooling plate 12, thereby reducing the heat energy transferred from the vacuum heating plate 11 to the cooling plate 12 when the vacuum heating plate 11 is working because the cooling plate 12 is an integrated structure. In this example, since the cooling plate 12 is an integrated structure, this case reduces the heat transferred downward by each vacuum heating stage 110 in the vacuum heating plate 11, reduces the temperature gradient of the cooling plate 12, indirectly reduces the influence of the temperature gradient of the vacuum heating plate 11 and the cooling plate 12, and ensures the temperature uniformity of a single vacuum heating stage 110 in the vacuum heating plate 11.

[0051] Furthermore, the top of the vacuum sealing ring 122 is in line contact with the sealing ring positioning groove 116 of the vacuum heating plate 11, and an O-ring installation groove is formed between the vacuum sealing ring 122 and the sealing ring positioning groove 116, in which an O-ring 119 is arranged, and the O-ring 119 is made of high temperature resistant material.

[0052] The sealing ring positioning groove 116 , the O-ring 119 , the vacuum sealing ring 122 , and the sealing ring positioning groove 116 together constitute a vacuum sealing structure (vacuum sealing channel) between the vacuum heating table 110 and the cooling plate 12 .

[0053] In one embodiment, referring to the attached Figure 6 As shown, the lower surface of the vacuum heating table 110 is provided with an active heat dissipation groove 117 to increase the heat dissipation area, ensure that the heat dissipation rate meets the heating plate cooling speed requirement, and at the same time reduce the contact area between the vacuum heating plate 11 and other components, increase the contact thermal resistance between the vacuum heating plate and the cooling plate, reduce the heat transferred downward by each vacuum heating table 110 in the vacuum heating plate 11, reduce the temperature gradient of the cooling plate 12, indirectly reduce the influence of the temperature gradient of the vacuum heating plate 11 and the cooling plate 12, and ensure the temperature uniformity of a single vacuum heating table 110 in the vacuum heating plate 11.

[0054] In one embodiment, reference Figure 6 and Figure 7 As shown, the side wall of the vacuum heating table 110 is also provided with a plurality of wiring grooves 31 , which correspond to the heating element 112 and the internal temperature sensor 111 , and the wiring of the heating element 112 and the internal temperature sensor 111 are both led out close to the wiring grooves 31 .

[0055] refer to Figure 1 and Figure 2 As shown, the insulation assembly 13 includes an insulation plate 131 and an insulation base 132. The insulation plate 131 is arranged between the vacuum heating table 110 and the cooling plate 12 to increase the thermal resistance between the vacuum heating table 11 and the cooling plate 12 to ensure that the temperatures of the vacuum heating tables 110 in the vacuum heating table 11 are not affected by each other when the temperatures are independently controlled.

[0056] refer to Figure 7 and Figure 8 As shown, the bottom of the heat insulation base 132 is provided with a side groove and a wire groove 33 which are connected to each other. The side groove and the wiring groove 31 are located on the same side to facilitate the wiring of the heating element 112 and the internal temperature sensor 111. After passing through the wiring groove 31, the wiring of the heating element 112 and the internal temperature sensor 111 is connected to the wiring groove 31. Figure 3 The side groove at the bottom of the heat-insulating base 132 shown enters into the wire groove 33 at the bottom of the heat-insulating base 132 .

[0057] refer to Figure 6 As shown, the lower surface of the vacuum heating table 110 is also provided with positioning bolt holes 30 to facilitate the connection of the cooling plate 12 to the vacuum heating plate 11 by bolt connection.

[0058] In one embodiment, reference Fig. 9 and Fig.10As shown, the cooling plate 12 is provided with a second vacuum air passage hole 123, which is a blind hole; the cooling plate 12 is also provided with a vacuum input hole 127 and a vacuum output hole 128, which is coaxial with the vacuum sealing groove 121, and the vacuum input hole 127, the second vacuum air passage hole 123 and the vacuum output hole 128 constitute a cooling plate vacuum flow sub-loop. The vacuum input hole 127 can be positioned at any position for access to external vacuum pumping equipment.

[0059] In the vacuum heating plate 11, the vacuum adsorption hole 113, the vacuum hole 114, the first vacuum air path through hole 118, and the vacuum connection hole 115 constitute the vacuum flow channel sub-loop of the heating plate. The vacuum connection hole 115, the O-ring 119, the sealing ring positioning groove 116, the vacuum sealing ring 122, and the vacuum sealing groove 121 constitute a vacuum sealing structure. The vacuum flow channel sub-loop of the heating plate, the vacuum sealing structure, and the vacuum flow channel sub-loop of the cooling plate together constitute a vacuum loop. In other words, the first vacuum air path through hole 118 and the vacuum connection hole 115 of the vacuum heating plate 11, the vacuum sealing ring 122, the vacuum sealing groove 121, the vacuum output hole 128, and the second vacuum air path through hole 123 of the cooling plate 12 constitute a vacuum loop.

[0060] In one embodiment, continue to refer to the attached Fig.10 and Fig.11 As shown, the cooling plate 12 is provided with a cooling medium input hole 124 , a cooling medium output hole 125 , and a heat dissipation slot 126 . The cooling medium input hole 124 is used to receive the cooling medium from the outside, and the cooling medium output hole 125 is used to adjust the flux of the cooling medium under the control of the temperature controller 21 .

[0061] When the vacuum heating plate 11 starts to heat, the cooling plate 21 continuously introduces cooling gas as cooling medium through the cooling medium input hole 126 via the external pipeline. The cooling gas circulates along the internal partition of the cooling plate 12, that is, flows along the cooling medium circulation channel of "cooling medium input hole 124, cooling medium output hole 125 and heat dissipation groove 126". The heat insulation performance of the cooling plate 21 is enhanced to prevent the heat of the upper vacuum heating plate 11 from being transferred to the outside or other unrelated vacuum heating table 110, avoiding damage to components and personnel, and enhancing the independent temperature control performance of the vacuum heating table 110.

[0062] In one embodiment, reference Figure 2 and Fig.12 As shown, the thermal insulation assembly 13 includes a thermal insulation plate 131 and a thermal insulation base 132 . The thermal insulation plate is a separate independent structure, located between the vacuum heating plate 11 and the cooling plate 12 , and is used to increase the thermal resistance between the vacuum heating plate 11 and the cooling plate 12 .

[0063] The insulating base 132 is installed on the lower surface of the cooling plate 12 to ensure that the operating temperature of the patented device meets the temperature design requirements, while reducing the contact area between the leads of the heating element 112 and the internal temperature sensor 111 and the high temperature area of ​​the vacuum heating plate 11 to avoid circuit failure caused by high temperature.

[0064] The heat-insulating plate 132 uses polyimide heat-insulating material to increase the direct contact thermal resistance between the vacuum heating plate 11 and the cooling plate 12, reduce the heat transfer between the plates, play a certain heat-insulating role, and reduce the thermal crosstalk between the vacuum heating plate 11 and the cooling plate 12. The size of the heat-insulating plate 132 is set according to the structural size of the vacuum heating table 110. The heat-insulating plate 131 is provided with mounting holes 134 in the circumference. The mounting holes 134 are usually fastening bolt holes, which are used to fix the heat-insulating plate 132 with the vacuum heating plate 11 above and the cooling plate 12 below to ensure the installation position.

[0065] And, reference Fig.12 As shown, the heat-insulating plate 131 is provided with a through heat-dissipating groove 133, referring to Fig.11 As shown, the cooling plate 12 is provided with a heat dissipation groove sealing hole 129, and the heat dissipation groove 133 cooperates with the heat dissipation groove sealing hole 129 to form a heat dissipation sealing structure to ensure the sealing of the heat dissipation medium.

[0066] The heat-insulating base 132 also uses polyimide heat-insulating material. A wire groove 33 is also provided on the bottom of the heat-insulating base 132. According to the design requirements of the equipment, the lines of each module are concentrated on one side of the structure for easy installation and use. Due to the special material properties, the heat-insulating base 132 can meet the high temperature resistance requirements while increasing the temperature gradient between the cooling plate 12 and the mounting frame to ensure the installation contact surface temperature requirements of the multi-temperature zone vacuum heating component.

[0067] When the multi-temperature zone chip mounting equipment in this case is performing the mounting process, the multi-temperature zone chip mounting equipment uses the vacuum heating table 110 as a unit to perform independent temperature control in each temperature zone. In the area where mounting is not performed, the vacuum heating table 110 is heated to the pre-heating temperature zone; in the area where mounting is performed, the vacuum heating table 110 is heated to the high temperature zone; in the vacuum heating table where mounting is completed, the vacuum heating table 110 is cooled to the cooling temperature zone. The wafer or substrate is placed on the vacuum heating plate 11, and the external vacuum device is used to Fig. 9 The vacuum input hole 127 shown provides a vacuum environment through a vacuum circuit, and adsorbs the wafer or substrate through the vacuum adsorption hole 113 in the vacuum heating plate 11, so that the wafer or substrate is tightly fitted to the vacuum heating plate 11.

[0068] The vacuum heating plate 11 is controlled by the temperature controller 21, and the heating rod is used as the heating element 112. The heating rod is used to heat the vacuum heating plate 11, and the temperature uniformity of all the vacuum heating table surfaces of the vacuum heating plate 11 is ensured during operation. The vacuum heating table 110 heats the mounted product by heat conduction. The heat insulation plate 12 under the vacuum heating plate can reduce the thermal crosstalk between the vacuum heating tables 110 in different temperature zones, and further ensure the temperature uniformity of the vacuum heating table 110 during the mounting process.

[0069] While the vacuum heating plate 11 begins to heat, the cooling plate 12 continuously introduces cooling gas as a cooling medium from an external pipeline into the interior through the cooling medium input hole 124. The cooling gas flows in the partitioned circulation channel inside the cooling plate 12. The cooling plate 12 as a whole acts as a heat insulator to prevent the heat of the vacuum heating plate 11 above from being transferred to the outside, thereby avoiding damage to external components and personnel.

[0070] Before mounting, the vacuum heating plate 11 is heated to the temperature point of the pre-heating zone to preheat the substrate or wafer to a temperature range suitable for mounting, thereby improving the mounting quality and efficiency. During the mounting process, the high-temperature working area of ​​the vacuum heating table 110 continues to heat, and at the same time, the cooling plate 12 passes the refrigerant medium to ensure that the temperature controller 21 accurately controls the temperature to the mounting process temperature, ensuring that the welding or bonding between the wafer and the substrate achieves the best effect; and when the vacuum heating plate 11 is working at a high temperature, the cooling medium is circulated in the cooling plate 12 to ensure the high thermal insulation effect of the cooling plate 12 under high temperature, prevent the heat of the high-temperature vacuum heating plate 11 from being transferred to the mounting bracket at the bottom of the insulation base 132, and avoid damage to equipment and personnel caused by high temperature. After the mounting is completed, the vacuum heating plate 11 stops heating, and the cooling medium of the cooling plate 12 continues to circulate, quickly cooling the vacuum heating table 110 to reduce the temperature of the substrate or wafer and electronic components, ensuring the mounting or bonding quality and product stability. When the temperature drops to the predetermined cooling temperature, the temperature controller continues to work and accurately controls the temperature. At the same time, the vacuum heating table 110 of the next area to be mounted continues to heat.

[0071] After all wafers and substrates of the whole board are mounted, the vacuum heating table 110 in all areas of the vacuum heating plate 11 stops heating, and the cooling medium inside the cooling plate 12 circulates to achieve a fast and uniform cooling effect, and quickly cools to ensure the reliability of the mounting process. After the wafer or substrate is fully cooled, the vacuum suction cup stops adsorption, and the wafer or substrate is removed by an external device to complete the mounting process.

[0072] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. Multi-temperature zone chip mounting equipment, characterized in that: The invention comprises a multi-temperature zone vacuum heating table device and a temperature control system, wherein the multi-temperature zone vacuum heating table device comprises a vacuum heating plate, a cooling plate and a heat insulation component, wherein the vacuum heating plate has at least one vacuum heating plate, and the vacuum heating plate comprises an internal temperature sensor and a heating element; the cooling plate is located under the vacuum heating plate and is used to reduce the temperature of the vacuum heating plate through a cooling medium under the control of the temperature control system; the temperature control system comprises a temperature controller and an external temperature sensor, wherein the temperature controller controls the heating power of the heating element and the flux of the cooling medium according to an external temperature signal from the external temperature sensor and an internal temperature signal from the internal temperature sensor.

2. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that: The vacuum heating plate has a plurality of vacuum heating stages, and there is a gap between the vacuum heating stages, the gap being 0.1 mm to 0.2 mm; the heating element is a heating rod, and the heating rods are distributed according to preset positions to ensure that the external temperature signal of the vacuum heating stage meets the temperature uniformity rule, and the internal temperature sensor is located in the middle of all the heating rods.

3. The multi-temperature zone chip mounting equipment according to claim 2, characterized in that: The heating element includes two heating rods. The internal temperature sensor is installed inside the vacuum heating table, and the axis of the internal temperature sensor and the axis of the heating rod are in the same plane.

4. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that: The upper surface of the vacuum heating table is provided with vacuum adsorption holes arranged in a matrix, the vacuum heating table is provided with a vacuum hole, and the lower surface of the vacuum heating table is provided with a vacuum connection hole, and the vacuum hole communicates with the vacuum adsorption hole and the vacuum connection hole to form a vacuum adsorption loop; The vacuum heating table is also provided with a sealing ring positioning groove coaxial with the vacuum connecting hole, and the cooling plate is provided with a vacuum sealing groove and a vacuum sealing ring. The vacuum sealing ring is coaxially connected with the vacuum sealing groove and the vacuum connecting hole and contacts with the inner wall of the sealing ring positioning groove to form a vacuum sealing structure.

5. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that: The lower surface of the vacuum heating table is provided with active heat dissipation grooves, and the vacuum holes are dark holes.

6. The multi-temperature zone chip mounting equipment according to claim 4, characterized in that: The vacuum heating plate is provided with a first vacuum air path through hole, which is connected to all the vacuum connection holes; the cooling plate is provided with a second vacuum air path through hole connected to all the vacuum sealing grooves, and the first vacuum air path through hole, the vacuum connection hole, the vacuum sealing ring, the vacuum sealing groove, and the second vacuum air path through hole constitute a vacuum circuit.

7. The multi-temperature zone chip mounting equipment according to claim 6, characterized in that: The cooling plate is provided with a cooling medium input hole, a cooling medium output hole and a heat dissipation groove. The cooling medium input hole is used to receive the cooling medium from the outside. The cooling medium output hole is used to adjust the flux of the cooling medium under the control of the temperature controller. The cooling medium input hole, the cooling medium output hole and the heat dissipation groove constitute a cooling medium circulation channel.

8. The multi-temperature zone chip mounting equipment according to claim 7, characterized in that: The cooling disk is also provided with a vacuum input hole and a vacuum output hole, wherein the vacuum output hole is coaxial with the vacuum sealing groove, and the vacuum input hole, the second vacuum air path through hole and the vacuum output hole constitute a cooling disk vacuum flow channel sub-loop in the vacuum loop.

9. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that: The heat insulation component includes a heat insulation plate and a heat insulation base. The heat insulation plate is provided with a penetrating heat dissipation groove. The cooling plate is provided with a heat dissipation groove sealing hole. The heat dissipation groove cooperates with the heat dissipation groove sealing hole. The heat insulation plate is provided with mounting through holes in the circumference.

10. According to the multi-temperature zone chip mounting equipment according to claim 9, the side wall of the vacuum heating table is provided with wiring grooves corresponding to the heating elements and the internal temperature sensors, and the thermal insulation base is provided with a wire groove, and the wire groove is on the same side as the wiring groove; the thermal insulation base is also provided with a threaded mounting bracket, and the mounting bracket has three.

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