Double-phase refrigerating system for server and control method of double-phase refrigerating system

Abstract

The invention discloses a double-phase refrigerating system for a server and a control method of the double-phase refrigerating system, and the double-phase refrigerating system comprises a refrigerating module which is used for providing a refrigerating working medium for the server so as to keep the normal working temperature of the server, and the refrigerating module comprises a fluorine pump refrigerating mode and a compressor refrigerating mode; the heat dissipation module is used for heat exchange of the refrigerant and transferring heat absorbed by the refrigerant into the atmosphere, and the heat dissipation module comprises an air cooling heat dissipation mode and a mixed heat dissipation mode; the refrigeration module is connected with the heat dissipation module through a pipeline. According to the phase change liquid cooling plate disclosed by the invention, the liquid working medium can be supplemented more timely, the dry burning phenomenon is avoided, and the phase change liquid cooling plate has stronger heat exchange performance and temperature equalization performance.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation in data centers, and in particular to a two-phase refrigeration system for a server and a control method thereof. Background Art

[0002] With the rapid development of science and technology, the number and scale of global data centers are growing year by year. The servers in data centers are running faster and faster to meet the needs of autonomous driving, high-performance computers, artificial intelligence and other fields. The resulting high heat flux density problem has become one of the main factors restricting the development of electronic components. Traditional air cooling can no longer meet the growing demand for heat dissipation; the emerging data center liquid cooling technology mainly includes immersion liquid cooling and cold plate liquid cooling. Although immersion liquid cooling has strong heat dissipation performance, it has strict requirements on the working fluid, and the installation and maintenance costs are high, so it is difficult to popularize in a short time; cold plate liquid cooling is currently the most mature and widely used liquid cooling technology. The commonly used cold plate liquid cooling adopts a single-phase liquid circulation cooling method. However, as the heat flux density of server chips continues to rise, single-phase liquid cooling can no longer meet the heat dissipation needs of chips. More efficient phase change cold plate liquid cooling is needed for heat dissipation. However, the current phase change cold plate liquid cooling has problems such as uneven working fluid distribution, dry burning, and local hot spots.

[0003] Based on the above problems, the present invention discloses a two-phase refrigeration system for a server and a control method thereof. Compared with conventional liquid cooling plates, the phase change liquid cooling plate disclosed in the present invention can replenish liquid working fluid more timely, avoid dry burning, and has stronger heat exchange performance and temperature uniformity performance. Summary of the invention

[0004] In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, an object of the present invention is to provide a two-phase refrigeration system for a server and a control method thereof.

[0005] The purpose of the present invention is achieved through the following technical solutions:

[0006] A two-phase refrigeration system for a server, comprising:

[0007] A refrigeration module, used to provide a refrigerant to the server to maintain the normal operating temperature of the server, the refrigeration module includes a fluorine pump refrigeration mode and a compressor refrigeration mode;

[0008] A heat dissipation module is used for heat exchange of the refrigerant and transfers the heat absorbed by the refrigerant to the atmosphere. The heat dissipation module includes an air cooling mode and a mixed cooling mode.

[0009] The refrigeration module is connected to the heat dissipation module through a pipeline.

[0010] Further, the refrigeration module includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a plurality of server liquid cooling modules 3, a fourth temperature sensor 116, a fourth pressure sensor 117 and a liquid return pipe 118;

[0011] The liquid storage tank 101 is connected to two branches respectively, the first branch includes a first valve 1021, a fluorine pump 103 and a second valve 1022 connected in sequence, and the second branch includes a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106 and a fourth valve 1024; the two branches are connected to a first temperature sensor 107; the first temperature sensor 107, the first pressure sensor 108, the first heat exchanger 109, the second temperature sensor 110 and the second pressure sensor 111 are connected in sequence; the second pressure sensor 111 is connected to an electronic expansion valve 112 and a fifth valve 1025 in parallel;

[0012] It is then connected to the liquid supply pipe 113, and the liquid supply pipe 113 is respectively connected to multiple server liquid cooling modules, the third pressure sensor 114, the third temperature sensor 115 and the sixth valve 1026 are connected in sequence and arranged between the liquid supply pipe and the server liquid cooling modules, the multiple server liquid cooling modules are connected to the liquid return pipe 118, and the fourth pressure sensor 117 and the fourth temperature sensor 116 are arranged between the liquid return pipe 118 and the server liquid cooling modules.

[0013] Further, the fluorine pump refrigeration mode includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117 and a liquid return pipe 118;

[0014] The compressor refrigeration mode includes a liquid storage tank 101, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117 and a liquid return pipe 118.

[0015] Further, the heat dissipation module includes a second heat exchanger 201, a third temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, a fourth temperature sensor 205, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210 and a third heat exchanger 211;

[0016] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109 and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210 and the third heat exchanger 211 are integrated in a chassis.

[0017] Further, the air-cooling heat dissipation mode includes a second radiator 201, a fan 206 and an air inlet 207;

[0018] The hybrid heat dissipation mode includes a second radiator 201 , a fan 206 , an air inlet 207 , a water tank 208 , a ninth valve 2033 , a second water pump 209 , a jet nozzle 210 and a third heat exchanger 211 .

[0019] Further, the server liquid cooling module includes a server fan 301, a cold row 302, a fifth temperature sensor 303, a phase change liquid cooling plate 304, a memory liquid cooling module 305, a sixth temperature sensor 306, a heat sink 307 and a liquid separation module 308;

[0020] The server fan 301 is installed on the side of the cold row 302 and is connected; the phase change liquid cooling plate 304 is close to the internal chip of the server, the sixth temperature sensor 306 is set on the phase change liquid cooling plate, and the memory liquid cooling module 305 is fitted with the server memory; the heat sink fins 307 are installed between the memory liquid cooling modules 305, and the fifth temperature sensor is used to detect the temperature inside the server liquid cooling module.

[0021] Furthermore, the phase change liquid cooling plate includes a liquid cooling plate cover plate 3041, a liquid cavity 3042, a jet plate 3043 and a liquid cooling plate bottom plate 3044 from top to bottom; the liquid cavity 3042 includes a working fluid inlet 30421, a working fluid outlet 30422, a liquid separation cavity 30423 and a reflux cavity 30424; the jet plate 3043 includes a jet hole 30431 and a reflux port 30432; and the liquid cooling plate bottom plate 3044 is provided with a liquid cooling channel 30441.

[0022] Furthermore, the cooling medium of the phase change liquid cooling plate 304 enters the liquid separation chamber 30423 from the medium inlet 30421, and the medium is divided in the liquid separation chamber 30423 and is ejected onto the liquid cooling plate bottom plate 3044 through different jet holes 30431 and spreads to the entire liquid cooling plate bottom plate 3044. The medium flows in an S-shape along the liquid cooling channel 30441 on the liquid cooling plate bottom plate 3044. At the same time, the medium continuously ejects downward through the jet holes 30431, forming a turbulent flow with the medium flowing on the liquid cooling plate bottom plate 3044, continuously replenishing the liquid cooling plate bottom plate 3044 with the medium and enhancing the heat exchange performance of the phase change liquid cooling plate 304 by convection heat exchange. After the medium absorbs heat through heat exchange on the liquid cooling plate bottom plate 3044, it refluxes from the reflux port 30432 to the reflux chamber 30424, and finally flows out from the medium outlet 30422.

[0023] Furthermore, the refrigeration module 1 and the heat dissipation module 2 are connected via a pipeline; the pipeline includes a second heat exchanger 201 , a third temperature sensor 202 , a seventh valve 2031 , a first water pump 204 , an eighth valve 2032 , a first heat exchanger 109 and a fourth temperature sensor 205 .

[0024] A control method based on the two-phase refrigeration system for a server,

[0025] The fluorine pump cooling mode and the compressor cooling mode are switched according to the temperature feedback of the server liquid cooling module, the supercooling degree of the refrigeration module 1 is calculated according to the data fed back by the second temperature sensor 110 and the second pressure sensor 111, and the air cooling mode and the mixed cooling mode are switched according to the supercooling degree.

[0026] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0027] The present invention provides a new solution for the heat dissipation system of the data center. The phase change liquid cooling plate is bonded to the main heat-generating chip in the server, and the heat exchange efficiency is improved by the phase change of the cooling medium inside the phase change liquid cooling plate. At the same time, the present invention adopts a hybrid cooling method combining air cooling and phase change cooling to dissipate heat from the server, integrating air cooling and phase change cooling into one, thereby improving the integration of the heat dissipation system.

[0028] Compared with conventional liquid cooling plates, the phase change liquid cooling plate disclosed in the present invention adopts a liquid cooling plate structure that combines jet impact and microchannel liquid cooling, has a stronger turbulence effect and can replenish liquid working fluid more timely, avoid dry burning, and has stronger heat exchange performance and temperature uniformity performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a diagram of a two-phase refrigeration system for a server provided by the present invention;

[0030] Figure 2 It is a structural schematic diagram of a server liquid cooling module provided by the present invention;

[0031] Figure 3 It is a schematic structural diagram of the phase change liquid cooling plate provided by the present invention;

[0032] Figure 4 It is a specific flow chart of a control method of a two-phase refrigeration system for a server according to the present invention. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below in conjunction with examples, but the embodiments of the present invention are not limited thereto.

[0034] Example

[0035] like Figure 1 As shown, a two-phase refrigeration system for a server includes a refrigeration module 1 and a heat dissipation module 2.

[0036] The refrigeration module 1 is used to provide a refrigerant to the server to maintain the normal operating temperature of the server, and includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117, and a liquid return pipe 118.

[0037] The specific connection method is:

[0038] The liquid storage tank 101 is connected to two branches respectively, the first branch includes a first valve 1021, a fluorine pump 103 and a second valve 1022 connected in sequence, and the second branch includes a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106 and a fourth valve 1024; the two branches are connected to the first temperature sensor 107; the first temperature sensor 107, the first pressure sensor 108, the first heat exchanger 109, the second temperature sensor 110 and the second pressure sensor 111 are connected in sequence; the The second pressure sensor 111 is connected to the electronic expansion valve 112 and the fifth valve 1025 in parallel, and then connected to the liquid supply pipe 113. The liquid supply pipe 113 is respectively connected to multiple server liquid cooling modules. The third pressure sensor, the third temperature sensor and the sixth valve are connected in sequence and arranged between the liquid supply pipe and the server liquid cooling module. The multiple server liquid cooling modules are connected to the return liquid pipe 118. The fourth pressure sensor 117 and the fourth temperature sensor 116 are arranged between the return liquid pipe 118 and the server liquid cooling module to complete the connection of the refrigeration module.

[0039] The fluorine pump refrigeration mode includes a liquid storage tank 101, a first valve 1021, a fluorine pump 103, a second valve 1022, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, a fifth valve 1025, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117 and a liquid return pipe 118.

[0040] The compressor refrigeration mode includes a liquid storage tank 101, a third valve 1023, a gas separator 104, a compressor 105, an oil separator 106, a fourth valve 1024, a first temperature sensor 107, a first pressure sensor 108, a first heat exchanger 109, a second temperature sensor 110, a second pressure sensor 111, an electronic expansion valve 112, a liquid supply pipe 113, a third pressure sensor 114, a third temperature sensor 115, a sixth valve 1026, a server liquid cooling module 3, a fourth temperature sensor 116, a fourth pressure sensor 117 and a liquid return pipe 118.

[0041] The heat dissipation module 2 is used for heat exchange of the working fluid and transfers the heat absorbed by the working fluid to the atmosphere, and includes a second heat exchanger 201, a seventh temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, an eighth temperature sensor 205, a fan 206, an air inlet 207, a water tank 208, a ninth valve 2033, a second water pump 209, a jet nozzle 210 and a third heat exchanger 211.

[0042] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109 and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210 and the third heat exchanger 211 are integrated in a chassis.

[0043] The heat dissipation module 2 includes an air cooling heat dissipation mode and a mixed heat dissipation mode;

[0044] The air cooling mode includes a second radiator 201, a fan 206, and an air inlet 207;

[0045] The hybrid heat dissipation mode includes a second radiator 201 , a fan 206 , an air inlet 207 , a water tank 208 , a ninth valve 2033 , a second water pump 209 , a jet nozzle 210 , and a third heat exchanger 211 .

[0046] The second heat exchanger 201, the third temperature sensor 202, the seventh valve 2031, the first water pump 204, the eighth valve 2032, the first heat exchanger 109 and the fourth temperature sensor 205 are connected in sequence; the second heat exchanger 201, the fan 206, the air inlet 207, the water tank 208, the ninth valve 2033, the second water pump 209, the jet nozzle 210 and the third heat exchanger 211 are integrated in a chassis.

[0047] The refrigeration module 1 and the heat dissipation module 2 are connected via a pipeline; the pipeline includes a second heat exchanger 201, a seventh temperature sensor 202, a seventh valve 2031, a first water pump 204, an eighth valve 2032, a first heat exchanger 109, and an eighth temperature sensor 205.

[0048] The two-phase refrigeration system for a server switches between a fluorine pump refrigeration mode and a compressor refrigeration mode according to temperature feedback from a server liquid cooling module 3, calculates the degree of supercooling of the refrigeration module 1 according to data fed back from a second temperature sensor 110 and a second pressure sensor 111, and switches between an air cooling mode and a mixed cooling mode according to the degree of supercooling.

[0049] Figure 2 3 is a structural diagram of a server liquid cooling module, wherein the server liquid cooling module includes a server fan 301, a cold row 302, a fifth temperature sensor 303, a phase change liquid cooling plate 304, a memory liquid cooling module 305, a sixth temperature sensor 306, a heat sink 307, and a liquid separation module 308;

[0050] The server fan 301 is installed on the side of the cold row 302 and connected together by bolts; the phase change liquid cooling plate 304 is closely attached to the internal chip of the server, and thermal conductive silicone grease is applied between the phase change liquid cooling plate 304 and the chip to reduce thermal resistance; the memory liquid cooling module 305 is attached to the server memory; the heat dissipation fins 307 are installed between the memory liquid cooling modules 305;

[0051] The phase change liquid cooling plate 304 and the memory liquid cooling module 305 cool the high-power chips and memory inside the server respectively; the server fan 301 cooperates with the cold row 302 and the heat sink fins 307 to perform secondary cooling on the air inside the server, thereby reducing the temperature of the air inside the server and maintaining the uniformity of the air temperature.

[0052] Figure 3 It is a structural schematic diagram of a phase change liquid cooling plate, wherein the phase change liquid cooling plate 304 includes a liquid cooling plate cover plate 3041, a liquid cavity 3042, a jet plate 3043, and a liquid cooling plate bottom plate 3044; the liquid cavity 3042 includes a working fluid inlet 30421, a working fluid outlet 30422, a liquid separation cavity 30423, and a reflux cavity 30424; the jet plate 3043 includes a jet hole 30431 and a reflux port 30432; the liquid cooling plate bottom plate 3044 is provided with a liquid cooling channel 30441, and the shape and size of the liquid cooling channel 30441 can be set according to requirements, and can be a serpentine flow channel, a parallel flow channel, a bifurcated flow channel, or various composite flow channels.

[0053] The cooling medium of the phase change liquid cooling plate 304 enters the liquid separation chamber 30423 from the medium inlet 30421, and the medium is divided in the liquid separation chamber 30423 and ejected to the liquid cooling plate bottom plate 3044 through different jet holes 30431 and spreads to the entire liquid cooling plate bottom plate 3044. The medium flows in an S shape along the liquid cooling channel 30441 on the liquid cooling plate bottom plate 3044. At the same time, the medium continuously ejects downward through the jet holes 30431, and forms a turbulent flow with the medium flowing on the liquid cooling plate bottom plate 3044, continuously replenishing the liquid cooling plate bottom plate 3044 with the medium and enhancing the heat exchange performance of the phase change liquid cooling plate 304 by convection heat exchange. After the medium absorbs heat through heat exchange on the liquid cooling plate bottom plate 3044, it refluxes from the reflux port 30432 to the reflux chamber 30424, and finally flows out from the medium outlet 30422.

[0054] It is further explained that the shape of the jet hole 30431 is selected according to needs, including but not limited to cylindrical, conical, spiral, etc.; the shape of the liquid cooling channel 30441 is selected according to needs, including but not limited to serpentine flow channel, annular flow channel, fractal flow channel, etc.

[0055] Figure 4 The present invention provides a control method for a two-phase refrigeration system for a server, comprising:

[0056] S1 controls the two-phase refrigeration system to circulate through the control mainboard;

[0057] S2 defines T b is the maximum temperature allowed by the electronic components of the server, T6 is the temperature data collected by the sixth temperature sensor 306, and when T6 <T b When T6>T b When the compressor is turned on, the cooling mode is turned on;

[0058] S3 Definition T c is the maximum superheat allowed by the system; T3 and T4 are temperature data collected by the third temperature sensor 115 and the fourth temperature sensor 116, respectively; P3 and P4 are pressure data collected by the third pressure sensor 114 and the fourth pressure sensor 117, respectively; the saturation temperature under pressure P4 is defined as T def1 , define superheat T0 = T4-T def1 ; When T0>0℃, control the frequency of fluorine pump 103 to H1. When T0>T c When , the heat dissipation module 2 is controlled to switch to the mixed heat dissipation mode;

[0059] S4 defines Tthr as the critical value of the system superheat, Tc as the maximum superheat allowed by the system; T3 and T4 are the temperature data collected by the third temperature sensor 115 and the fourth temperature sensor 116, respectively, and P3 and P4 are the pressure data collected by the third pressure sensor 114 and the fourth pressure sensor 117, respectively; the saturation temperature under pressure P4 is defined as T def1 , define superheat T0 = T4-T def1 ; When T0>0℃, the frequency of the compressor 105 is controlled to H2; when T0>Tthr, the opening degree of the electronic expansion valve 108 is controlled to open to F1; when T0>Tc, the heat dissipation module 2 is controlled to switch to the mixed heat dissipation mode;

[0060] S5 defines ΔT as the maximum inlet and outlet temperature difference allowed by the system, T7 and T8 are the temperature data collected by the seventh temperature sensor 202 and the eighth temperature sensor 205 respectively, and defines T e =T4T3 is the temperature difference between the inlet and outlet water of the system. When T e >ΔT, control the flow rate of the first water pump 204 to F1;

[0061] S6 defines Td as the minimum subcooling degree allowed by the system, T1 and T2 are temperature data collected by the first temperature sensor 107 and the second temperature sensor 110, P1 and P2 are pressure data collected by the first pressure sensor 108 and the second pressure sensor 111, and defines the saturation temperature at pressure P2 as T def2 , define the supercooling T t =T2-Tdef2 When T t <T d When T t >T d When , the heat dissipation module 2 is controlled to switch to the air cooling mode;

[0062] S7 defines Tf as the maximum temperature allowed for the air inside the server, T5 as the temperature data collected by the fifth temperature sensor 303, and when T5>Tf, the frequency of the server fan 302 is increased to H3, and the heat dissipation module 2 is controlled to switch to the air cooling mode.

[0063] The phase change liquid cooling plate is bonded to the main heat-generating chip in the server, and the heat exchange efficiency is improved by the phase change of the cooling medium inside the phase change liquid cooling plate. Compared with conventional liquid cooling plates, the phase change liquid cooling plate adopts a structure that combines jet impact and microchannel liquid cooling, has a stronger turbulence effect and can replenish liquid medium more timely, avoiding dry burning, and has stronger heat exchange performance and temperature uniformity performance.

[0064] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A two-phase refrigeration system for a server, characterized in that: include: A refrigeration module (1), used for providing a refrigeration medium to the server to maintain a normal operating temperature of the server, the refrigeration module comprising a fluorine pump refrigeration mode and a compressor refrigeration mode; A heat dissipation module (2) is used for heat exchange of the refrigerant and transfers the heat absorbed by the refrigerant to the atmosphere, wherein the heat dissipation module includes an air cooling mode and a mixed cooling mode; The refrigeration module is connected to the heat dissipation module through a pipeline.

2. The two-phase refrigeration system for a server according to claim 1, characterized in that: The refrigeration module comprises a liquid storage tank (101), a first valve (1021), a fluorine pump (103), a second valve (1022), a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106), a fourth valve (1024), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), an electronic expansion valve (112), a fifth valve (1025), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), a plurality of server liquid cooling modules (3), a fourth temperature sensor (116), a fourth pressure sensor (117) and a liquid return pipe (118); The liquid storage tank (101) is connected to two branches respectively, the first branch comprises a first valve (1021), a fluorine pump (103) and a second valve (1022) which are connected in sequence, and the second branch comprises a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106) and a fourth valve (1024); the two branches are connected to a first temperature sensor (107); the first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110) and a second pressure sensor (111) are connected in sequence; the second pressure sensor (111) is connected to an electronic expansion valve (112) and a fifth valve (1025) which are connected in parallel; Then, it is connected to the liquid supply pipe 113, and the liquid supply pipe 113 is respectively connected to multiple server liquid cooling modules. The third pressure sensor (114), the third temperature sensor (115) and the sixth valve (1026) are connected in sequence and arranged between the liquid supply pipe and the server liquid cooling modules. The multiple server liquid cooling modules are connected to the liquid return pipe (118), and the fourth pressure sensor (117) and the fourth temperature sensor (116) are arranged between the liquid return pipe (118) and the server liquid cooling modules.

3. The two-phase refrigeration system for a server according to claim 2, characterized in that: The fluorine pump refrigeration mode comprises a liquid storage tank (101), a first valve (1021), a fluorine pump (103), a second valve (1022), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), a fifth valve (1025), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), a server liquid cooling module (3), a fourth temperature sensor (116), a fourth pressure sensor (117) and a liquid return pipe (118); The compressor refrigeration mode comprises a liquid storage tank (101), a third valve (1023), a gas separator (104), a compressor (105), an oil separator (106), a fourth valve (1024), a first temperature sensor (107), a first pressure sensor (108), a first heat exchanger (109), a second temperature sensor (110), a second pressure sensor (111), an electronic expansion valve (112), a liquid supply pipe (113), a third pressure sensor (114), a third temperature sensor (115), a sixth valve (1026), a server liquid cooling module (3), a fourth temperature sensor (116), a fourth pressure sensor (117) and a liquid return pipe (118).

4. The two-phase refrigeration system for a server according to claim 1, characterized in that: The heat dissipation module comprises a second heat exchanger (201), a third temperature sensor (202), a seventh valve (2031), a first water pump (204), an eighth valve (2032), a fourth temperature sensor (205), a fan (206), an air inlet (207), a water tank (208), a ninth valve (2033), a second water pump (209), a jet nozzle (210) and a third heat exchanger (211); The second heat exchanger (201), the third temperature sensor (202), the seventh valve (2031), the first water pump (204), the eighth valve (2032), the first heat exchanger (109) and the fourth temperature sensor (205) are connected in sequence; the second heat exchanger (201), the fan (206), the air inlet (207), the water tank (208), the ninth valve (2033), the second water pump (209), the jet nozzle (210) and the third heat exchanger (211) are integrated in a chassis.

5. The two-phase refrigeration system for a server according to claim 4, characterized in that: The air-cooling heat dissipation mode includes a second heat sink (201), a fan (206) and an air inlet (207); The hybrid heat dissipation mode comprises a second radiator (201), a fan (206), an air inlet (207), a water tank (208), a ninth valve (2033), a second water pump (209), a jet nozzle (210) and a third heat exchanger (211).

6. The two-phase refrigeration system for a server according to claim 2, characterized in that: The server liquid cooling module comprises a server fan (301), a cold row (302), a fifth temperature sensor (303), a phase change liquid cooling plate (304), a memory liquid cooling module (305), a sixth temperature sensor (306), a heat sink (307) and a liquid separation module (308); The server fan (301) is installed on the side of the cold row (302) and connected; the phase change liquid cooling plate (304) is closely attached to the internal chip of the server, the sixth temperature sensor (306) is arranged on the phase change liquid cooling plate, and the memory liquid cooling module (305) is attached to the server memory; the heat dissipation fins (307) are installed between the memory liquid cooling modules (305), and the fifth temperature sensor is used to detect the temperature inside the server liquid cooling module.

7. The two-phase refrigeration system for a server according to claim 6, characterized in that: The phase-change liquid cooling plate comprises, from top to bottom, a liquid cooling plate cover plate (3041), a liquid cavity (3042), a jet plate (3043) and a liquid cooling plate bottom plate (3044); the liquid cavity (3042) comprises a working fluid inlet (30421), a working fluid outlet (30422), a liquid separation cavity (30423) and a reflux cavity (30424); the jet plate (3043) comprises a jet hole (30431) and a reflux port (30432); and the liquid cooling plate bottom plate (3044) is provided with a liquid cooling channel (30441).

8. The two-phase refrigeration system for a server according to claim 7, characterized in that: The cooling medium of the phase change liquid cooling plate (304) enters the liquid separation chamber (30423) from the medium inlet (30421), and the medium is divided in the liquid separation chamber (30423) and sprayed onto the liquid cooling plate bottom plate (3044) through different spray holes (30431) and spreads to the entire liquid cooling plate bottom plate (3044). The medium flows in an S shape along the liquid cooling channel (30441) on the liquid cooling plate bottom plate (3044). At the same time, the medium is continuously The jet is ejected downward through the jet hole (30431), forming a turbulent flow with the working medium flowing on the bottom plate (3044) of the liquid cooling plate, continuously replenishing the working medium for the bottom plate (3044) of the liquid cooling plate and enhancing the heat transfer performance of the convective heat transfer of the phase change liquid cooling plate (304). After the working medium undergoes heat exchange and absorbs heat on the bottom plate (3044), it flows back from the reflux port (30432) to the reflux chamber (30424), and finally flows out from the working medium outlet (30422).

9. The two-phase refrigeration system for a server according to claim 1, characterized in that: The refrigeration module (1) and the heat dissipation module (2) are connected via a pipeline; the pipeline comprises a second heat exchanger (201), a third temperature sensor (202), a seventh valve (2031), a first water pump (204), an eighth valve (2032), a first heat exchanger (109), and a fourth temperature sensor (205).

10. A control method for a two-phase refrigeration system for a server according to any one of claims 1 to 9, characterized in that: The fluorine pump refrigeration mode and the compressor refrigeration mode are switched according to the temperature feedback of the server liquid cooling module, the supercooling degree of the refrigeration module (1) is calculated according to the data fed back by the second temperature sensor (110) and the second pressure sensor (111), and the air cooling heat dissipation mode and the mixed heat dissipation mode are switched according to the supercooling degree.

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