Immersed liquid cooling heat exchange device and method

Abstract

The invention relates to the technical field of computer electronic products, in particular to an immersed liquid cooling heat exchange device and method.The immersed liquid cooling heat exchange device comprises a complete machine assembly, a pressure gauge is arranged on the upper portion of the complete machine assembly, a vacuum pump is arranged at the position adjacent to the pressure gauge, and an air compressor is arranged at the position adjacent to the vacuum pump. Compared with the prior art, a preset temperature and pressure relative database can be formed through a temperature detection feedback mechanism and a software presetting function, interaction of the air compressor and the vacuum pump is adjusted, and adaptation of the pressure and the temperature in the case is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of computer electronic products, and specifically provides an immersion type liquid cooling heat exchange device and method. Background Art

[0002] At present, in the field of computer electronic products, such as mainframes, servers, self-service products, etc., there is an urgent need to improve product performance, which leads to a surge in the heat of CPU, GPU and other chips in electronic products. On the one hand, the circuit board modules formed by highly integrated chips are larger and more work is run. Software;

[0003] On the other hand, with the use of overclocking and turbo frequency to achieve high-performance chips, the power consumption of a single chip has soared from 300W or 400W to 500W or even 600W to complete the processing performance. Conventional air cooling or liquid cooling is difficult to solve the heat dissipation of the sharp surge in power consumption. As a result, the chip temperature has soared rapidly. Even if the current boiling and condensation heat exchange with higher heat transfer coefficients are used, it is difficult to quickly cope with the sudden surge in power consumption.

[0004] Based on the above problems, how to dissipate the heat of the ultra-high power consumption of a single chip is the primary issue to be solved, and is also the purpose of the present invention. Summary of the invention

[0005] The present invention aims at solving the above-mentioned deficiencies of the prior art and provides an immersion liquid cooling heat exchange device with strong practicality.

[0006] A further technical task of the present invention is to provide an immersion liquid cooling heat exchange method that is rationally designed, safe and applicable.

[0007] The technical solution adopted by the present invention to solve its technical problem is:

[0008] An immersion type liquid cooling heat exchange device comprises a complete machine assembly, wherein a pressure gauge is arranged on the upper part of the complete machine assembly, a vacuum pump is arranged adjacent to the pressure gauge, and an air compressor is arranged adjacent to the vacuum pump.

[0009] Furthermore, the whole machine assembly includes a frame and a box, the frame is on the rear side, the box is on the front side, a circuit board is provided in the box, a chip heat sink is provided on the circuit board, a seal is fixed on the front side of the circuit board, a transparent structural plate is provided on the front side of the seal, a pressure plate is provided on the front side of the transparent structural plate, and the circuit board, seal, transparent structural plate and pressure plate are all fixed in the box.

[0010] Furthermore, a corresponding temperature detector is provided in the chip heat sink to detect the temperature condition in real time.

[0011] Furthermore, a pump is provided on the upper part of the rack, a heat exchanger is provided on one side of the pump, and a fan module is provided on the front side of the heat exchanger;

[0012] A pressure gauge is arranged on the side of the frame, a safety valve is arranged on the opposite side, a condensing coil is arranged on the front side of the frame, and the condensing coil is fixed on the box body.

[0013] Furthermore, the heat exchanger includes a condensation plate and a heat dissipation module. The condensation plate performs condensation heat exchange in the immersion chamber, and an air-cooled heat dissipation module is welded on the top.

[0014] Furthermore, the fan module is provided with an air guide cover, and the fan module with the air guide cover cooperates with the condensation plate.

[0015] An immersion liquid cooling heat exchange method, first, start the preset software, determine whether the target software is running, if so, start the temperature and pressure control management device, then determine whether the pressure reaches the preset value and whether the chip temperature is the preset value, if so, close the temperature and pressure control management device.

[0016] Further, software presetting is performed, and predetermined software is used to determine the running status and resource occupancy of the chip;

[0017] If several chips need to be overclocked or turbo-clocked, the software calculates the required operating temperature of the chip, and calculates the radiator temperature and the boiling point of the immersion liquid based on the overheat, so that the required system pressure can be obtained. The pressure regulation system works, the vacuum pump performs vacuuming, and the pressure gauge monitors in real time and adjusts to the preset pressure. At the same time, the temperature of each module is reversely controlled to ensure that the chip works at the preset temperature. When the scheduled software work is completed, the software presets signal feedback to adjust the corresponding chip occupancy and calculate the required operating temperature of the chip. At the same time, the boiling point of the corresponding immersion liquid is obtained through the above calculation, and the corresponding system required pressure is obtained. At this time, the vacuum pump stops working and the air compressor works to complete the adjustment of the system pressure and reach the preset operating temperature of the chip.

[0018] Furthermore, the temperature and pressure control management device includes a vacuum pump, an air compressor, a pressure gauge, a safety valve and a temperature detection device;

[0019] The temperature detection device is placed in the chip heat sink integrated in the chip and immersed in the liquid.

[0020] Compared with the prior art, the immersion liquid cooling heat exchange device and method of the present invention have the following outstanding beneficial effects:

[0021] The present invention forms a database of preset temperature and pressure through a temperature detection feedback mechanism and a software presetting function, and adjusts the interaction between an air compressor and a vacuum pump to achieve adaptation of pressure and temperature in a chassis.

[0022] By changing the air pressure in the liquid cooling chassis through air compressors and vacuum pumps, different boiling points can be obtained, and the boiling point of the liquid can be controlled, and finally the chip can work at low temperature. Through the heat exchange of liquid boiling, the heat transfer efficiency is improved, the temperature rise is effectively reduced, and the chip overclocking or even turbo frequency can be achieved in a short time or long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Attached Figure 1 It is a schematic diagram of the assembly of the external heat dissipation system of the present invention, which requires the heat exchanger and condensing coil to be used in combination with air cooling and liquid cooling;

[0025] Attached Figure 2 It is an exploded diagram that the external heat dissipation system of the present invention requires the use of a heat exchanger and a condensing coil for air cooling and liquid cooling;

[0026] Attached Figure 3 This is a schematic diagram of the air-cooling heat dissipation assembly of the present invention;

[0027] Attached Figure 4 This is an exploded structural diagram of the air-cooled heat dissipation device of the present invention;

[0028] Attached Figure 5 This is a schematic diagram of the structure of the condensation plate in the air-cooled heat dissipation of the present invention;

[0029] Attached Figure 6 It is a schematic diagram of the process of an immersion liquid cooling heat exchange method. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] A best embodiment is given below:

[0032] like Figure 1-5 As shown, an immersion liquid cooling heat exchange device in this embodiment includes a complete machine component 2, a pressure gauge 3-5 is provided on the upper part of the complete machine component 1, a vacuum pump 1 is provided adjacent to the pressure gauge 3-5, and an air compressor 4 is provided adjacent to the vacuum pump 1.

[0033] The whole machine assembly 1 includes a frame 3-1 and a box 2-1, the frame 3-1 is at the rear side, the box 2-1 is at the front side, a circuit board 2-5 is arranged in the box 2-1, a chip heat sink 2-5-1 is arranged on the circuit board 2-5, a seal 2-2 is fixed to the front side of the circuit board 2-5, a transparent structural plate 2-3 is arranged to the front side of the seal 2-2, a pressing plate 2-4 is arranged to the front side of the transparent structural plate 2-3, and the circuit board 2-5, the seal 2-2, the transparent structural plate 2-3 and the pressing plate 2-4 are all fixed in the box 2-1. The box 2-1 is filled with a corresponding immersion liquid, such as a low-boiling-point fluorinated liquid.

[0034] There is a corresponding temperature detector in the chip heat sink 2-5-1 to detect the temperature conditions in real time.

[0035] When the external heat dissipation system requires the use of a heat exchanger and a condensing coil for air cooling and liquid cooling, a pump 3-2 is provided on the upper part of the rack 3-1, a heat exchanger 3-3 is provided on one side of the pump 3-2, and a fan module 3-4 is provided on the front side of the heat exchanger 3-3;

[0036] A pressure gauge 3-5 is provided on the side of the frame 3-1, a safety valve 3-6 is provided on the opposite side, and a condensing coil 3-7 is provided on the front side of the frame 3-1, and the condensing coil 3-7 is fixed on the box body 2-1.

[0037] When air cooling is used for heat dissipation, the heat exchanger 3-3 includes a condensation plate 3-9 and a heat dissipation module 3-8. The condensation plate 3-9 performs condensation heat exchange in the immersion chamber, and the air cooling heat dissipation module 3-8 is welded on the top.

[0038] The fan module 3-8 is provided with an air guide cover 3-10, and the fan module 3-8 with the air guide cover 3-10 cooperates with the condensation plate 3-9 to achieve efficient heat exchange.

[0039] Based on the above device, an immersion liquid cooling heat exchange method in this embodiment first starts the preset software to determine whether the target software is running. If so, the temperature and pressure control management device is started, and then it is determined whether the pressure reaches the preset value and whether the chip temperature is the preset value. If so, the temperature and pressure control management device is closed.

[0040] Specifically:

[0041] Software preset is performed. The working process uses the preset software to determine the running status and resource occupancy of the chip. For example, when using A, the CPU resources need to occupy 90%, the GPU resources need to occupy 95%, and several chips need to be overclocked or turbo-clocked. The software calculates the required operating temperature of the chip, and calculates the temperature of the radiator 2-5-1 and the boiling point of the immersion liquid according to the overheating. In this way, the required system pressure can be obtained. The pressure regulation system works, the vacuum pump 1 performs vacuuming, and the pressure gauge 3-5 performs real-time monitoring and adjusts to the preset pressure. At the same time, the temperature of each module is reversely controlled to ensure that the chip works at the preset temperature. When the preset software work is completed, the software presets signal feedback to adjust the corresponding chip occupancy and calculate the required operating temperature of the chip. At the same time, the boiling point of the corresponding immersion liquid is obtained through the above series of calculations, and the corresponding system required pressure is obtained. At this time, the vacuum pump 1 stops working, and the air compressor 4 works to complete the adjustment of the system pressure, and the preset operating temperature of the chip has been reached.

[0042] Among them, the temperature and pressure control management device includes a vacuum pump 1, an air compressor 4, a pressure gauge 3-5, a safety valve 3-6 and a temperature detection component temperature detection device;

[0043] Temperature detection component The temperature detection device is placed on the chip heat sink 2-5-1 and integrated into the chip and the immersion liquid.

[0044] When processing large files or large software and key application software, the chip work ratio (for example, 95% of CPU or GPU resources) and temperature control point of the preset software are analyzed by the software and the corresponding pressure database in the immersion liquid cooling chassis is formed. When such software is used, the real-time working temperature of the chip is detected through the temperature detection feedback mechanism. When the preset working point is reached, such as 40°C, the vacuum pump 1 works quickly to extract the vacuum degree in the liquid cooling chassis to reach the preset pressure of the system, so as to quickly reach the boiling of the chip radiator 2-5-1. Through boiling and condensation heat exchange, the system reaches thermal balance and quickly takes away the heat. At the same time, the chip completes the use of overclocking and turbo frequency. After the overclocking and turbo frequency work is completed or the preset software is closed, the temperature and pressure detection feedback mechanism is adjusted by the existing temperature. If normal pressure work is required, the pressure pump works to restore the pressure in the chassis to normal to ensure the life and reliability of the equipment.

[0045] The above-mentioned specific implementations are only specific cases of the present invention. The patent protection scope of the present invention includes but is not limited to the above-mentioned specific implementations. Any technical solutions that conform to the above-mentioned specific implementations of the present invention and any appropriate changes or substitutions made by ordinary technicians in the relevant technical field shall fall within the patent protection scope of the present invention.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An immersion liquid cooling heat exchange device, characterized in that: The invention comprises a complete machine component. A pressure gauge is arranged on the upper part of the complete machine component. A vacuum pump is arranged adjacent to the pressure gauge. An air compressor is arranged adjacent to the vacuum pump.

2. The immersion liquid cooling heat exchange device according to claim 1, characterized in that: The whole machine assembly includes a frame and a box, the frame is on the rear side, the box is on the front side, a circuit board is arranged in the box, a chip heat sink is arranged on the circuit board, a seal is fixed on the front side of the circuit board, a transparent structural plate is arranged on the front side of the seal, a pressure plate is arranged on the front side of the transparent structural plate, and the circuit board, the seal, the transparent structural plate and the pressure plate are all fixed in the box.

3. The immersion liquid cooling heat exchange device according to claim 2, characterized in that: There is a corresponding temperature detector inside the chip heat sink to detect the temperature conditions in real time.

4. The immersion liquid cooling heat exchange device according to claim 3, characterized in that: A pump is provided on the upper part of the frame, a heat exchanger is provided on one side of the pump, and a fan module is provided on the front side of the heat exchanger; A pressure gauge is arranged on the side of the frame, a safety valve is arranged on the opposite side, a condensing coil is arranged on the front side of the frame, and the condensing coil is fixed on the box body.

5. The immersion liquid cooling heat exchange device according to claim 4, characterized in that: The heat exchanger comprises a condensation plate and a heat dissipation module. The condensation plate performs condensation heat exchange in the immersion chamber, and an air-cooled heat dissipation module is welded on the top.

6. The immersion liquid cooling heat exchange device according to claim 5, characterized in that: The fan module is provided with an air guide cover, and the fan module with the air guide cover cooperates with the condensation plate.

7. An immersion liquid cooling heat exchange method, characterized in that: First, start the preset software and determine whether the target software is running. If so, start the temperature and pressure control management device, then determine whether the pressure reaches the preset value and whether the chip temperature is the preset value. If so, close the temperature and pressure control management device.

8. The immersion liquid cooling heat exchange method according to claim 7, characterized in that: Perform software presetting and use the pre-set software to determine the chip's operating status and resource occupancy; If several chips need to be overclocked or turbo-clocked, the software calculates the required operating temperature of the chip, and calculates the radiator temperature and the boiling point of the immersion liquid based on the overheat, so that the required system pressure can be obtained. The pressure regulation system works, the vacuum pump performs vacuuming, and the pressure gauge monitors in real time and adjusts to the preset pressure. At the same time, the temperature of each module is reversely controlled to ensure that the chip works at the preset temperature. When the scheduled software work is completed, the software presets signal feedback to adjust the corresponding chip occupancy and calculate the required operating temperature of the chip. At the same time, the boiling point of the corresponding immersion liquid is obtained through the above calculation, and the corresponding system required pressure is obtained. At this time, the vacuum pump stops working and the air compressor works to complete the adjustment of the system pressure and reach the preset operating temperature of the chip.

9. The immersion liquid cooling heat exchange method according to claim 8, characterized in that: The temperature and pressure control management device includes a vacuum pump, an air compressor, a pressure gauge, a safety valve and a temperature detection device; The temperature detection device is placed in the chip heat sink integrated in the chip and immersed in the liquid.

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