Polymer chip bonding device

Abstract

The invention relates to the field of micro-nano chip manufacturing, and particularly discloses a polymer chip bonding device. The upper substrate posture turnover mechanism and the lower substrate bearing workbench are arranged, the upper substrate posture turnover mechanism can fix the upper substrate and drive the upper substrate to turn over, and the lower substrate bearing workbench can fix the lower substrate and adjust the position of the lower substrate. A plasma modification unit is used for carrying out plasma modification operation on the surface of a substrate during overturning of the substrate, whether the upper substrate and the lower substrate are aligned or not is observed through a microscopic observation unit, the position of the lower substrate is adjusted through a lower substrate bearing workbench, and the lower substrate is lifted to be bonded with the upper substrate. The whole device realizes integrated operation of polymer chip surface modification, alignment of the upper substrate and the lower substrate and compression bonding, realizes pose change of the upper substrate between a plasma modification station and a bonding station, and is simple in structure, low in cost, automatic in the whole substrate bonding process, good in alignment precision and high in bonding efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of micro-nano chip manufacturing, and in particular relates to a polymer chip bonding device. Background Art

[0002] Micro-nano chips refer to chips with the minimum feature size of the functional structure at the micrometer or nanometer scale, including microfluidic chips, micro-nano electromechanical integrated systems, micro-sensing / actuation chips, semiconductor chips, etc. Polymer materials and silicon-based materials are commonly used materials for micro-nano chips. PDMS (polydimethylsiloxane) is one of the typical polymers used in the manufacture of micro-nano chips. Due to its advantages such as low cost, simple molding process, good light transmittance, strong chemical stability, and good biocompatibility, it is particularly widely used in micro-nano chips for biochemical / environmental testing, medical diagnosis and treatment, etc. Usually, PDMS micro-nano chips are composed of no less than 2 pieces of PDMS or glass substrates, on which there are micro-nano-scale microstructures made using micro-nano processing technology. These separated substrates need to be bonded to form chips with complete closed functional structures, liquid flow networks, circuits, etc. The bonding surface is modified with oxygen plasma, and the bonding between PDMS and silicon-based substrates such as PDMS or glass can be achieved with a little compression.

[0003] At present, the surface modification of PDMS micro-nano chips often relies on plasma cleaning machines, the alignment between substrates is manually observed and adjusted, and the pressing and bonding mostly relies on manual operation. There are disadvantages such as poor alignment accuracy, low bonding efficiency, and low degree of automation. It cannot meet the needs of wafer-level large-size chips and multi-layer substrate stacked micro-nano chip bonding, and cannot adapt to the mass industrialization of polymer micro-nano chips. In response to the above problems, the inventor proposed a polymer chip bonding device that can be automatically operated, has good alignment accuracy, and high bonding efficiency. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a polymer chip bonding device to solve the problem that the substrate of the existing micro-nano chip requires manual observation and alignment, and the compression bonding also requires manual operation, which leads to poor alignment accuracy, low bonding efficiency and low degree of automation.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A polymer chip bonding device, comprising a mounting platform, wherein the mounting platform is integrated with:

[0007] An upper substrate posture flipping mechanism is arranged on the mounting platform and is used to drive the upper substrate to flip. The upper substrate can realize a movement including multi-degree-of-freedom bending, twisting, compression and stretching deformation within a certain space range of the upper substrate posture flipping mechanism.

[0008] A positioning unit, used for pressing down and positioning the upper substrate after leveling and flipping;

[0009] A lower substrate carrying workbench, used for fixing the lower substrate and adjusting the position of the lower substrate so that the lower substrate is aligned with the upper substrate;

[0010] A plasma modification unit, used for performing plasma modification operation on the surface of the substrate;

[0011] The microscopic observation unit is used to observe whether the upper substrate and the lower substrate are aligned.

[0012] Preferably, the upper substrate posture flipping mechanism consists of an upper substrate adsorption plate, a plate frame, a flexible connector and a rotating support shaft, the upper substrate adsorption plate is installed on the plate frame, the plate frame is connected to the rotating support shaft through the flexible connector, and the rotating support shaft is connected to the mounting table.

[0013] Preferably, the positioning unit is composed of a reference frame and a wedge-shaped positioning structure, and the wedge-shaped positioning structure is installed on both side edges of the upper surface of the reference frame perpendicular to the rotation support shaft.

[0014] Preferably, the lower substrate supporting workbench is composed of a lower substrate supporting plate, an illumination light source and a four-degree-of-freedom precision workbench connected to the mounting platform; the lower substrate supporting plate is installed on the top of the four-degree-of-freedom precision workbench; the illumination light source is connected to the four-degree-of-freedom precision workbench and is located between the four-degree-of-freedom precision workbench and the lower substrate supporting plate.

[0015] Preferably, the plasma modification unit is composed of a plasma excitation module and a moving mechanism connected to the mounting platform, and the plasma excitation module is mounted on the moving mechanism.

[0016] Preferably, the microscopic observation unit is composed of a one-dimensional camera adjustment track connected to the mounting platform and a microscopic camera installed on the one-dimensional camera adjustment track, and the microscopic camera is suspended above the lower substrate supporting workbench.

[0017] Preferably, the outer edges of the two frame frames of the plate frame perpendicular to the rotating support shaft are wedge-shaped, and the wedge-shaped positioning structure includes a fixed wedge block connected to the reference frame and a movable wedge block slidably embedded in the fixed wedge block. The cross-section of the fixed wedge block is wide at the top and narrow at the bottom, which is complementary to the outer edge of the plate frame set in a wedge shape, and the number of the movable wedge blocks is not less than two, and the movable wedge block slides and abuts against the outer edge of the frame of the plate frame set in a wedge shape.

[0018] Preferably, the moving mechanism comprises a plasma excitation module moving track connected to the mounting platform, and the range of movement of the plasma excitation module along the plasma excitation module moving track covers the modification station and the bonding station.

[0019] Preferably, the reference frame is a hollow structure, the size of the hollow structure area is larger than the size of the lower substrate supporting plate and smaller than the size of the upper substrate adsorption plate, and the upper surface of the reference frame is the leveling reference plane of the upper substrate adsorption plate, and the parallelism error with the upper surface of the lower substrate supporting plate is no more than 10 microns.

[0020] Preferably, the material of the upper substrate adsorption plate and the lower substrate supporting plate includes a hard transparent material, or a hard opaque material, but it is necessary to drill a hole at the observation position where the upper substrate adsorption plate and the lower substrate supporting plate are aligned, and the method of fixing the upper substrate by the upper substrate adsorption plate and the method of fixing the lower substrate by the lower substrate supporting plate include but are not limited to vacuum adsorption, bonding and electrostatic field adsorption.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention provides an upper substrate posture flipping mechanism and a lower substrate bearing workbench. The upper substrate posture flipping mechanism can fix the upper substrate and drive the upper substrate to flip. The lower substrate bearing workbench can fix the lower substrate and adjust the position of the lower substrate. In addition, a positioning unit is provided to limit the upper substrate posture flipping mechanism after flipping, so as to avoid the upper substrate from shifting during the alignment process. A plasma modification unit is used to perform plasma modification operation on the substrate surface between substrate flipping. During the alignment process, a microscopic observation unit is used to observe whether the upper substrate and the lower substrate are aligned. Then, the position of the lower substrate is adjusted by the lower substrate bearing workbench, and the lower substrate is lifted and bonded to the upper substrate. The entire device realizes the integrated operation of polymer chip surface modification, upper and lower substrate alignment, and compression bonding. The upper substrate can be flipped by 180° to realize the posture change between the plasma modification station and the bonding station. The structure is simple and the cost is low. The entire substrate bonding process is automated. The alignment accuracy is good and the bonding efficiency is high. The device can effectively promote the precision production of existing micro-nano chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of the polymer chip bonding device of the present invention;

[0024] Figure 2 A schematic diagram of a substrate and an alignment mark of the present invention;

[0025] In the figure: 101, upper substrate adsorption plate; 102, flexible connector; 103, lower substrate carrying plate; 104, rotating support shaft; 105, plate rack; 106, movable wedge block; 107, reference frame; 108, illumination light source; 109, fixed wedge block; 110, microscope camera; 111, one-dimensional adjustment track of camera; 112, plasma excitation module; 113, moving track of plasma excitation module; 114, support column; 115, four-degree-of-freedom precision workbench; 201, alignment mark; 202, substrate. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Embodiment 1:

[0028] See also Figure 1 - Figure 2 As shown, a polymer chip bonding device includes a mounting platform, on which the following components are integrated:

[0029] An upper substrate posture flipping mechanism is arranged on the mounting platform and is used to drive the upper substrate to flip. The upper substrate can realize a movement including multi-degree-of-freedom bending, twisting, compression and stretching deformation within a certain space range of the upper substrate posture flipping mechanism.

[0030] A positioning unit, used for pressing down and positioning the upper substrate after leveling and flipping;

[0031] A lower substrate carrying workbench, used for fixing the lower substrate and adjusting the position of the lower substrate so that the lower substrate is aligned with the upper substrate;

[0032] A plasma modification unit, used for performing plasma modification operation on the surface of the substrate;

[0033] The microscopic observation unit is used to observe whether the upper substrate and the lower substrate are aligned.

[0034] By setting an upper substrate posture flipping mechanism and a lower substrate bearing workbench, the upper substrate posture flipping mechanism can fix the upper substrate and drive the upper substrate to flip, the upper substrate can realize movement forms including multi-degree-of-freedom bending, twisting, compression and tensile deformation within a certain spatial range of the upper substrate posture flipping mechanism, and has a certain elastic leveling space, the lower substrate bearing workbench can fix the lower substrate and adjust the position of the lower substrate, during the fixing process, the upper substrate moves within a certain elastic leveling space to achieve high-precision leveling of the upper and lower substrates, and a positioning unit is further provided to limit the upper substrate posture flipping mechanism after flipping to avoid the upper substrate from shifting during the alignment process, and a plasma modification unit is used to perform plasma modification operation on the substrate surface between substrate flippings, and during the alignment process, the microscopic observation unit is used to observe whether the upper substrate and the lower substrate are aligned, and then the lower substrate position is adjusted by the lower substrate bearing workbench, and the lower substrate is lifted and bonded to the upper substrate, and the entire substrate bonding process is automated, with good alignment accuracy and high bonding efficiency, which can effectively promote the precision production of existing micro-nano chips.

[0035] The upper substrate posture flipping mechanism is composed of an upper substrate adsorption plate 101, a plate frame 105, a flexible connector 102 and a rotating support shaft 104. The upper substrate adsorption plate 101 is installed on the plate frame 105. The plate frame 105 is connected to the rotating support shaft 104 through the flexible connector 102. The rotating support shaft 104 is connected to the mounting table.

[0036] The plate rack 105 can be set to a U-shape or a U-shape. The function of the plate rack 105 is to clamp the adsorption plate made of brittle or low-strength materials such as glass and polymer. When the upper substrate is made of opaque hard materials, such as metal and other easily machined materials, the plate rack 105 can be omitted.

[0037] The material of the flexible connector 102 includes but is not limited to a rubber rod, a spring, a plastic rod, an air bag, etc., and is an elastic material that can achieve multi-degree-of-freedom bending, twisting, compression, and stretching.

[0038] The driving method of the rotating support shaft 104 includes but is not limited to driving by a servo motor, a cylinder, etc., manual rotation by a handle or a crank, etc.

[0039] The positioning unit is composed of a reference frame 107 and a wedge-shaped positioning structure. The wedge-shaped positioning structure is installed on the upper surface of the reference frame 107 at both side edges perpendicular to the rotating support shaft 104 .

[0040] The lower substrate supporting workbench is composed of a lower substrate supporting plate 103, an illumination light source 108 and a four-degree-of-freedom precision workbench 115 connected to the mounting platform. The four-degree-of-freedom precision workbench 115 can move in the x, y and z directions and can also rotate around the z direction. The lower substrate supporting plate 103 is installed on the top of the four-degree-of-freedom precision workbench 115. The illumination light source 108 is connected to the four-degree-of-freedom precision workbench 115 and is located between the four-degree-of-freedom precision workbench 115 and the lower substrate supporting plate 103, illuminating the bonded upper substrate adsorption plate 101 and the lower substrate supporting plate 103 from bottom to top.

[0041] The plasma modification unit is composed of a plasma excitation module 112 and a moving mechanism connected to the mounting platform. The plasma excitation module 112 is mounted on the moving mechanism and suspended above the upper substrate adsorption plate 101 and the lower substrate supporting plate 103 .

[0042] The microscopic observation unit is composed of a one-dimensional camera adjustment track 111 connected to the mounting table and a microscopic camera 110 installed on the one-dimensional camera adjustment track 111. The microscopic camera 110 is suspended above the lower substrate supporting workbench, so that the observation field position can be adjusted to adapt to substrates of different sizes and designs. In addition, when the upper substrate is flipped, the microscopic camera 110 can be moved to the outside to avoid structural interference when the upper substrate is flipped.

[0043] The plate frame 105 is wedge-shaped and perpendicular to the outer edges of the two frame frames of the rotating support shaft 104. The wedge-shaped positioning structure includes a fixed wedge block 109 connected to the reference frame 107 and a movable wedge block 106 slidably embedded in the fixed wedge block 109. The cross-section of the fixed wedge block 109 is wide at the top and narrow at the bottom, which is complementary to the outer edge of the wedge-shaped plate frame 105, and the number of the movable wedge blocks 106 is not less than two. The movable wedge blocks 106 slide and abut against the outer edge of the frame of the plate frame 105 which is wedge-shaped.

[0044] The moving mechanism includes a plasma excitation module moving track 113 connected to the mounting table. The range of movement of the plasma excitation module 112 along the plasma excitation module moving track 113 covers the modification station and the bonding station. The driving form includes but is not limited to linear guides, ball screws, gear racks, servo motors, etc., or direct manual movement; the movement form includes but is not limited to two orthogonal rectangular coordinate systems in two movement directions or a rotation combined with a one-dimensional linear direction polar coordinate system, and the movement range covers the modification station and the bonding station.

[0045] The reference frame 107 is a hollow structure, the size of the hollow structure area is larger than the size of the lower substrate supporting plate 103 and smaller than the size of the upper substrate adsorption plate 101, and the upper surface of the reference frame 107 is the leveling reference plane of the upper substrate adsorption plate 101, and the parallelism error with the upper surface of the lower substrate supporting plate 103 is no more than 10 microns.

[0046] The materials of the upper substrate adsorption plate 101 and the lower substrate support plate 103 include but are not limited to hard transparent materials such as glass and PMMA, or opaque materials such as metal and ceramics, but it is necessary to drill holes at the aligned observation positions of the upper substrate adsorption plate 101 and the lower substrate support plate 103, such as Figure 2 As shown, an alignment mark 201 can be set on the substrate 202. When processing an opaque substrate, the alignment mark 201 is needed to align the upper substrate and the lower substrate. The method of fixing the upper substrate by the upper substrate adsorption plate 101 and the method of fixing the lower substrate by the lower substrate supporting plate 103 include but are not limited to vacuum adsorption, bonding and electrostatic field adsorption.

[0047] Embodiment 2:

[0048] Reference Figure 1 - Figure 2 , a polymer chip bonding device, which can realize the plasma modification of polymer substrate or glass bonding surface, upper and lower substrate alignment, and compression bonding integration operations. The device structure schematic diagram of this embodiment is shown in Figure 1As shown, the upper substrate adsorption plate 101 is made of transparent glass, with an outer size of 140mm×140mm square and a thickness of 2mm, and a vacuum adsorption channel is arranged on the surface, which is used to adsorb and fix a PDMS or glass upper substrate that is not larger than 4 inches in round or square during operation; the lower substrate supporting plate 103 is made of transparent glass, with an outer size of 110mm×110mm square and a thickness of 2mm, and a vacuum adsorption channel is arranged on the surface, which is used to adsorb and fix a PDMS or glass lower substrate that is not larger than 4 inches in round or square during operation; the upper substrate adsorption plate 101 is bonded to the upper surface of the plate frame 105, and the rotating support shaft 104 is connected to the plate frame 105 through a rubber flexible connector 102, so that the upper substrate adsorption plate 101 can be rotated 180° to achieve a posture flip between the modification station and the bonding station, and the plate frame 105 has a wedge-shaped structure on both sides perpendicular to the rotating support shaft 104, which complements the shape of the fixed wedge block 109 and the movable wedge block 106 installed on the reference frame 107. The block 106 is driven to telescopically move by the cylinder at its rear to achieve clamping and releasing of the plate rack 105. The middle through hole of the reference frame 107 is a square of 120mm×120mm. The binocular microscope camera 110 is used to observe the relative position deviation of the alignment marks 201 on the upper and lower substrates. The microscope camera 110 is installed on a one-dimensional adjustment track 111, and the position of the observation field can be adjusted along the diagonal direction of the bonding station. The plasma excitation module 112 is used for surface modification of the bonding surfaces of the upper and lower substrates. It is installed on the plasma excitation module moving track 113, and the plasma excitation module 112 can be moved within the modification station and the bonding station. The lower substrate carrier plate 103 is directly installed on the four-degree-of-freedom precision workbench 115. The gap between the lower substrate carrier plate 103 and the four-degree-of-freedom precision workbench 115 is installed with an illumination light source 108. When the upper substrate adsorption plate 101 is located at the modification station, it is supported by three support columns 114 arranged in a triangle to ensure that the upper substrate adsorption plate 101 is basically in a horizontal state.

[0049] The general workflow of the polymer chip bonding apparatus:

[0050] S1: The upper substrate adsorption plate 101 is located at the bonding station and placed on the support column 114. The upper substrate is placed on the adsorption area of ​​the upper substrate adsorption plate 101 with the bonding surface facing upwards, and the vacuum adsorption is started to fix the upper substrate. The lower substrate is placed on the adsorption area of ​​the lower substrate carrier plate 103 with the bonding surface facing upwards, and the vacuum adsorption is started to fix the lower substrate. The Z axis of the workbench 115 is adjusted so that the bonding surface of the lower substrate is about 2 mm lower than the upper surface of the reference frame 107;

[0051] S2 plasma modification: The plasma excitation module 112, driven by the motor, moves in a "U-shaped" manner along the moving track 113 in the XY plane. After the movement range completely covers the bonding surfaces of the upper and lower substrates, it moves to the initial position outside the modification station;

[0052] S3 flipping and leveling: The upper substrate adsorption plate 101 is flipped to the bonding station under the drive of the motor and slowly falls to the upper surface of the reference frame 107. The movable wedge block 106 is extended under the drive of the cylinder to clamp the wedge mechanism of the plate frame 105. The rubber flexible connector 102 is deformed accordingly, so that the plate frame is close to the fixed wedge block 109 and pressed to the upper surface of the reference frame 107, so as to achieve the leveling and rough alignment of the upper substrate. The Z axis of the workbench 115 is adjusted so that the distance between the upper and lower substrate bonding surfaces is not greater than 0.2 mm.

[0053] S4 Alignment and bonding: Start the illumination light source 108, move the microscope camera 110 from the outside of the bonding station to the alignment observation area, observe the relative position difference of the alignment marks on the upper and lower substrates, adjust the X, Y, and θ axes of the workbench 115, make the alignment mark on the lower substrate coincide with the alignment mark on the upper substrate, adjust the Z axis of the precision workbench 115, lift the lower substrate and contact and press it with the upper substrate, and achieve chip bonding;

[0054] S5 reset: the upper substrate adsorption plate 101 breaks the vacuum, releases the upper substrate, adjusts the Z axis of the precision workbench 115, and makes the bonded chip drop by about 2 mm. Turn off the illumination light source 108, move the microscope camera 110 to the outside of the bonding station, retract the movable wedge block 106 under the drive of the cylinder, release the plate rack 105, rotate the upper substrate adsorption plate 101 back to the modification station, and slowly fall on the three support pillars 114, break the vacuum of the lower substrate carrier plate 103, and remove the bonded chip.

[0055] The standard parts used in the present invention can all be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0056] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0060] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

Claims

1. A polymer chip bonding device, characterized in that: It includes a mounting platform, on which are integrated: An upper substrate posture flipping mechanism is arranged on the mounting platform and is used to drive the upper substrate to flip. The upper substrate can realize a movement including multi-degree-of-freedom bending, twisting, compression and stretching deformation within a certain space range of the upper substrate posture flipping mechanism. A positioning unit, used for pressing down and positioning the upper substrate after leveling and flipping; A lower substrate carrying workbench, used for fixing the lower substrate and adjusting the position of the lower substrate so that the lower substrate is aligned with the upper substrate; A plasma modification unit, used for performing plasma modification operation on the surface of the substrate; The microscopic observation unit is used to observe whether the upper substrate and the lower substrate are aligned.

2. A polymer chip bonding device according to claim 1, characterized in that: The upper substrate posture flipping mechanism consists of an upper substrate adsorption plate, a plate frame, a flexible connector and a rotating support shaft. The upper substrate adsorption plate is installed on the plate frame, the plate frame is connected to the rotating support shaft through the flexible connector, and the rotating support shaft is connected to the mounting table.

3. A polymer chip bonding device according to claim 2, characterized in that: The positioning unit is composed of a reference frame and a wedge-shaped positioning structure, and the wedge-shaped positioning structure is installed on the upper surface of the reference frame at two side edges perpendicular to the rotating support shaft.

4. A polymer chip bonding device according to claim 3, characterized in that: The lower substrate carrying workbench is composed of a lower substrate carrying plate, an illumination light source and a four-degree-of-freedom precision workbench connected to the mounting platform. The lower substrate carrying plate is installed on the top of the four-degree-of-freedom precision workbench. The illumination light source is connected to the four-degree-of-freedom precision workbench and is between the four-degree-of-freedom precision workbench and the lower substrate carrying plate.

5. The polymer chip bonding device according to claim 1, characterized in that: The plasma modification unit is composed of a plasma excitation module and a moving mechanism connected to the mounting platform, and the plasma excitation module is mounted on the moving mechanism.

6. The polymer chip bonding device according to claim 1, characterized in that: The microscopic observation unit is composed of a one-dimensional camera adjustment track connected to the mounting platform and a microscopic camera installed on the one-dimensional camera adjustment track, and the microscopic camera is suspended above the lower substrate bearing workbench.

7. The polymer chip bonding device according to claim 3, characterized in that: The outer edges of the two frame frames of the plate frame perpendicular to the rotating support shaft are wedge-shaped, and the wedge-shaped positioning structure includes a fixed wedge block connected to the reference frame and a movable wedge block slidably embedded in the fixed wedge block. The cross-section of the fixed wedge block is wide at the top and narrow at the bottom, which is complementary to the outer edge of the plate frame set in a wedge shape, and the number of the movable wedge blocks is not less than two, and the movable wedge block slides and abuts against the outer edge of the frame frame of the plate frame set in a wedge shape.

8. The polymer chip bonding device according to claim 5, characterized in that: The moving mechanism comprises a plasma excitation module moving track connected to the mounting platform, and the range in which the plasma excitation module moves along the plasma excitation module moving track covers the modification station and the bonding station.

9. The polymer chip bonding device according to claim 4, characterized in that: The reference frame is a hollow structure, the size of the hollow structure area is larger than the size of the lower substrate supporting plate and smaller than the size of the upper substrate adsorption plate, the upper surface of the reference frame is the leveling reference plane of the upper substrate adsorption plate, and the parallelism error with the upper surface of the lower substrate supporting plate is no more than 10 microns.

10. The polymer chip bonding device according to claim 4, characterized in that: The materials of the upper substrate adsorption plate and the lower substrate supporting plate include hard transparent materials, or hard opaque materials, but holes need to be punched at the observation positions where the upper substrate adsorption plate and the lower substrate supporting plate are aligned. The method of fixing the upper substrate by the upper substrate adsorption plate and the method of fixing the lower substrate by the lower substrate supporting plate include but are not limited to vacuum adsorption, bonding and electrostatic field adsorption.

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