Wafer double-sided cleaning equipment

Abstract

The invention belongs to the technical field of wafer production equipment, and particularly relates to wafer double-sided cleaning equipment. The feeding and discharging device and the cleaning system are arranged on the two sides of the carrying assembly, and the carrying assembly is used for transferring wafers between the feeding and discharging device and the cleaning system; the cleaning system comprises a machine frame, a double-face scrubbing mechanism and a secondary cleaning device, wherein the double-face scrubbing mechanism and the secondary cleaning device are arranged on the machine frame. The double-face scrubbing mechanism is used for physically scrubbing the double faces of a wafer. And the liquid medicine spraying mechanism and the two-fluid cleaning mechanism are used for chemically cleaning the top surface of the wafer. The wafer cleaning device is used for solving the problem of poor wafer cleaning effect. The double-sided scrubbing mechanism in the cleaning system can perform double-sided scrubbing on a physical layer on the wafer, then the wafer is conveyed to the wafer placement position through the carrying manipulator for secondary chemical cleaning, and the bottom surface of the wafer is flushed and protected by the bottom surface flushing device, so that impurities are prevented from being attached to the bottom surface of the wafer, and the cleaning effect is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer production equipment, and in particular relates to a wafer double-side cleaning device. Background Art

[0002] During the wafer manufacturing and processing process, such as cutting, grinding, polishing and other steps, a large number of particle pollutants will be generated. These particles may be debris from the wafer itself, or particles generated by the wear of the processing equipment. Therefore, after the wafer has gone through various processing steps, the surface of the wafer needs to be cleaned to remove these pollutants and ensure the cleanliness of the wafer surface to meet the requirements of subsequent manufacturing processes.

[0003] At present, in the field of wafer cleaning technology, most of the cleaning is single-wafer cleaning. First, the wafer is placed on the operating table, and one side of the wafer is cleaned using the cleaning equipment. Then, the wafer is gripped and flipped by a robotic arm, and the other side of the wafer is cleaned. Its characteristics are that the bottom cleaning and the front cleaning are independent of each other, which is not only inefficient, but also the two sides of the wafer are cleaned separately, which easily leads to impurities re-attaching to the first side after the second cleaning is completed, resulting in poor wafer cleaning effect. In addition, the efficiency is low due to the two separate cleanings. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a double-sided wafer cleaning device to solve the problem of poor wafer cleaning effect. The technical solution of the present invention to solve the above technical problems is as follows: a double-sided wafer cleaning device, comprising a transport component and a loading and unloading device and a cleaning system arranged on both sides of the transport component, wherein the transport component is used to transfer wafers between the loading and unloading device and the cleaning system; The transport assembly includes a driving track and a plurality of transport manipulators arranged on the driving track; The cleaning system comprises: a frame, a double-sided scrubbing mechanism and a secondary cleaning device arranged on the frame, wherein the double-sided scrubbing mechanism is used to physically scrub both sides of the wafer; The secondary cleaning device includes: a bottom surface flushing device, a liquid medicine spraying mechanism, a two-fluid cleaning mechanism and a scrubbing chamber. The top of the bottom surface flushing device extends out of the rack table to form a wafer placement position. The bottom surface flushing device is used to flush and protect the bottom surface of the wafer. The scrubbing chamber is surrounded by the top of the bottom surface flushing device. The liquid medicine spraying mechanism and the two-fluid cleaning mechanism are used for chemically cleaning the top surface of the wafer.

[0005] Compared with the prior art, the above technical solution has the following beneficial effects: The wafers in the loading and unloading devices on both sides can be transferred to the cleaning system through the handling assembly, and then transported back to the loading and unloading devices after cleaning. The double-sided brushing mechanism in the cleaning system can first physically brush the double sides of the wafer, and then send it to the wafer placement position through the handling robot for secondary chemical cleaning. The bottom surface flushing device is used to flush and protect the bottom surface of the wafer, and the liquid medicine spraying mechanism is used to spray the top surface of the wafer with liquid medicine. Then, the two-fluid cleaning mechanism is used to spray the top of the wafer again, and the residual liquid medicine is removed at the same time. The bottom surface flushing device can continuously flush the bottom surface of the wafer when the two-fluid cleaning mechanism and the liquid medicine spraying mechanism are working to ensure that impurities will not adhere to the bottom surface of the wafer. Physical cleaning is performed first and then chemical cleaning is performed, with good cleaning effect and high cleaning efficiency.

[0006] Based on the above technical solution, the embodiment of the present application can also be improved as follows: In one embodiment, the double-sided scrubbing mechanism comprises: A protective cover is arranged on the frame; A supporting device, comprising at least three rotating supporting units, wherein the plurality of rotating supporting units are divided into two groups arranged opposite to each other, and output ends of the rotating supporting units extend into the protective cover to clamp the outer edge of the wafer; The scrubbing device comprises two groups of scrubbing heads arranged between the two groups of rotating support units, and a first driving unit for driving the scrubbing heads. The first driving unit is located outside the protective cover and is used to drive the scrubbing heads arranged at intervals on both sides of the wafer to move closer to or away from each other.

[0007] In one embodiment, the scrubber head comprises: A fixing plate, one end of which is connected to the output end of the first driving unit, and the other end of which extends into the protective cover; A brush roller is rotatably connected to the fixed plate; A nozzle is mounted on the fixing plate, wherein the outlet of the nozzle faces the contact point between the brush roller and the wafer; A scrubbing motor is installed on the fixed plate, and an output end of the scrubbing motor is drivingly connected to one end of the brush roller.

[0008] In one embodiment, a avoidance groove located between the two groups of the rotation support units is opened on the protective cover along the moving direction of the first driving unit, and two water retaining plates for shielding the avoidance groove are respectively provided on the two fixed plates located inside the protective cover; An oblong hole is formed at the bottom of the protective cover for the rotation support unit to pass through, a first waterproof plate is arranged around the upper periphery of the oblong hole, the first waterproof plate is covered with a second waterproof plate on the outside, and the second waterproof plate is covered with a waterproof sleeve which is sleeved on the rotation support unit on the upper outside.

[0009] In one embodiment, the input ends of the two groups of the rotation support units located outside the protective cover are respectively connected to two groups of rotation drive devices, and the rotation drive devices are used to drive the rotation support units to rotate; A second driving unit is installed at the bottom of the frame, and the second driving unit includes a second double-headed driving cylinder installed at the bottom of the frame. The two slides of the second double-headed driving cylinder are respectively connected to sliding plates, and the rotating driving device is installed on the sliding plates to drive the two groups of the rotating driving devices and the two groups of rotating support units to move closer to or away from each other.

[0010] In one embodiment, the protective cover includes a cover body arranged on the frame and a cover cover matched with the cover body, and an entrance and exit corresponding to the output end of the top of the support device is opened at the junction of the cover cover and the cover body, and the entrance and exit is used for a handling robot that clamps the wafer to extend into, and a door drive cylinder is arranged on the outside of the protective cover, and the output end of the door drive cylinder is connected to a door panel for covering or revealing the entrance and exit.

[0011] In one embodiment, the bottom surface washing device includes: a load plate; A support seat, mounted on one side of the load plate; A rotating shaft is arranged vertically and rotatably mounted on the supporting seat, and has a coaxially arranged through passage inside; A protective tube, passing through the through passage and rotatably cooperating with the rotating shaft, with both ends extending out from the rotating shaft; An infusion tube, inserted into the protection tube, with the bottom end extending out of the protection tube; A spray nozzle, installed at the top of the protection tube and connected with the infusion tube; The carrier plate is arranged horizontally and mounted on the top of the rotating shaft, and a movable through hole adapted to the spray nozzle is opened on the top surface; A driving mechanism, mounted on the load plate and drivingly connected to the rotating shaft; A rotation limiting assembly is disposed on the load plate and connected to the lower end of the protection tube; A plurality of support blocks are mounted on the top surface of the carrier plate and arranged around the rotating shaft; A plurality of positioning posts are installed on the top surface of the carrier plate, arranged around the rotating shaft, and located at the periphery of the supporting block.

[0012] In one embodiment, the support base comprises: The support tube is arranged vertically and has first annular grooves at both upper and lower ends; A fixing frame, mounted on the load plate and connected to the support tube; A plurality of first bearings are disposed in the first annular groove in a one-to-one correspondence and sleeved outside the rotating shaft; A top cover, mounted on the top of the support tube and sleeved outside the rotating shaft; The rotating shaft is provided with a support ring outside, the bottom of the support ring abuts against the first bearing, and the rotating shaft is provided with a guide cover outside, the guide cover is located above the top cover and covers the opening of the top cover.

[0013] In one embodiment, the rotation limiting assembly comprises: A limit bar is arranged horizontally and installed on the outer periphery of the bottom end of the protection tube; The concave block has slots on both sides of the top that match the limit strips; A connecting piece, one end of which is connected to the concave block, and the other end of which is connected to the load plate.

[0014] In one embodiment, it further comprises: A photoelectric sensor is mounted on the load board; A light shielding sheet is arranged horizontally, mounted on the rotating shaft, and located below the supporting tube, and can pass through the sensing area of ​​the photoelectric sensor; The upper and lower ends of the through-channel are both provided with second annular grooves, a second bearing is installed in the second annular groove, and the second bearing is sleeved outside the protection tube.

[0015] In one embodiment, it further comprises: A support plate, mounted on the top of the rotating shaft and movably sleeved outside the protection tube, with a top surface connected to the bottom of the support plate; A guide cover is installed on the top surface of the support plate and movably sleeved outside the spray nozzle, and has a truncated cone on the top, and the top surface of the truncated cone has a plurality of lower ring plates arranged concentrically and nested; The outer periphery of the spray nozzle is provided with a baffle ring, and the bottom surface of the baffle ring is provided with a plurality of concentrically nested upper ring plates, and the upper ring plates and the lower ring plates are arranged alternately. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2It is a schematic diagram of the overall structure of the double-sided scrubbing mechanism in the present invention.

[0019] Figure 3 for Figure 2 Schematic diagram of the overall structure from another perspective.

[0020] Figure 4 for Figure 2 Schematic diagram of the overall structure behind the hidden cover.

[0021] Figure 5 for Figure 4 A schematic diagram of the structure from another perspective.

[0022] Figure 6 for Figure 4 Schematic diagram of the structure from an upward perspective.

[0023] Figure 7 for Figure 4 Schematic diagram of the structure from a top-down perspective.

[0024] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure along the AA axis.

[0025] Fig. 9 It is a schematic diagram of the overall structure of the bottom surface washing device in the present invention.

[0026] Fig.10 for Fig. 9 Schematic diagram of the longitudinal cross-sectional structure.

[0027] Fig.11 for Fig.10 A magnified schematic diagram of point B in the middle.

[0028] Fig.12 for Fig.10 Enlarged schematic diagram of point C in the middle.

[0029] Fig.13 for Fig.10 An enlarged schematic diagram of the middle carrier plate.

[0030] Reference numerals: 1. Handling assembly; 2. Double-sided brushing mechanism; 3. Bottom surface washing device; 4. Loading and unloading device; 5. Brushing chamber; 6. Liquid spraying mechanism; 7. Two-fluid cleaning mechanism; 8. Wafer; 101. driving track; 102. handling manipulator; 201, frame, 202, supporting device; 203, scrubbing device; 204, scrubbing motor; 205, synchronous wheel; 206, avoidance groove; 207, water retaining plate; 208, oblong hole; 209, first waterproof plate; 2010, second waterproof plate; 2011, waterproof cover; 2012, door drive cylinder; 2013, door plate; 2014, exhaust pipe; 2015, drain pipe; 2017, linear track; 20101, rack table; 20102, protective cover; 201021, cover body; 201022, cover; 201023, entrance and exit; 20201, a rotation support unit; 20202, a rotation drive device; 20203, a second drive unit; 202031, second double-head driving cylinder; 202032, sliding plate; 20301, a scrubbing head; 20302, a first driving unit; 203011, fixed plate; 203012, brush roller; 203013, nozzle; 203021, bracket; 203022, first double-head driving cylinder; 301, load plate; 302, support seat; 303, rotating shaft; 304, protection tube; 305, infusion tube; 306, spray nozzle; 307, bearing plate; 308, driving mechanism; 309, rotation limiting assembly; 3010, support block; 3011, positioning column; 3012, photoelectric sensor; 3013, light shielding sheet; 3014, second bearing; 3015, support plate; 3016, guide cover; 3021, support tube; 3022, fixed frame; 3023, first bearing; 3024, top cover; 3031, through channel; 3032, support ring; 3033, guide cover; 3061, retaining ring; 3062, upper ring plate; 3071, movable through hole; 3081, motor; 3082, driving wheel; 3083, driven wheel; 3084, transmission belt; 3091, limit strip; 3092, concave block; 3093, connecting piece; 30161, round table; 30162, lower ring plate; 30211, first ring groove; 30212, flange; 30221, first support plate; 30222, second support plate; 30223, reinforcement plate; 30311, second ring groove; 30921, card slot. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention. It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the invention belongs.

[0032] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0034] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] like Figure 1 As shown, a double-sided cleaning device for wafer 8 provided by the present invention comprises a transport component 1 and loading and unloading devices 4 and a cleaning system arranged on both sides of the transport component 1, wherein the transport component 1 is used to transfer wafer 8 between the loading and unloading devices 4 and the cleaning system, and the loading and unloading devices 4 are used to place wafers 8 to be cleaned and wafers 8 after cleaning, and operators can take and place wafers on the side of the loading and unloading devices 4 away from the transport component 1; The transport component 1 includes a driving rail 101 and a plurality of transport robots 102 arranged on the driving rail 101, wherein the driving rail 101 can be implemented by a slide module, etc., to drive the transport robot 102 to move back and forth and align with the positions of the wafers 8 on both sides. The transport robot 102 can be implemented by a wafer 8 transport robot. The wafer 8 transport robot can autonomously adjust the up and down height, and can transport the wafer 8 in the loading and unloading device 4 to the cleaning system on the other side, and can also transport the wafer 8 in the cleaning system to the loading and unloading device 4.

[0036] In this embodiment, the cleaning system includes: a frame and a double-sided brushing mechanism and a secondary cleaning device arranged on the frame. The double-sided brushing mechanism and the secondary cleaning device on the frame 201 are arranged in pairs, wherein the double-sided brushing mechanism is used to physically brush both sides of the wafer, which is the first cleaning, and then the secondary cleaning device is used to complete the secondary chemical cleaning.

[0037] The secondary cleaning device includes: a bottom surface flushing device, a liquid medicine spraying mechanism, a two-fluid cleaning mechanism and a scrubbing chamber. The top of the bottom surface flushing device extends out of the rack table to form a wafer placement position. The bottom surface flushing device is used to flush and protect the bottom surface of the wafer. The scrubbing chamber is surrounded by the top of the bottom surface flushing device. The liquid medicine spraying mechanism and the two-fluid cleaning mechanism are used for chemically cleaning the top surface of the wafer.

[0038] The bottom surface flushing device is used to enable the top of the wafer to be placed to extend above the table of the rack 201 to form a wafer placement position. A brushing chamber 5 is arranged on the table of the rack 201 and is surrounded by the top of the bottom surface flushing device 3. The top of the brushing chamber 5 is open, and the opening facilitates the top of the bottom surface flushing device 3 to extend out, so that the wafer is placed on the top of the bottom surface flushing device 3. The brushing chamber 5 can prevent liquid from spraying and splashing during the cleaning process. A drain outlet is arranged at the bottom of the brushing chamber 5. The brushing chamber 5 includes an outer cavity and an inner cavity nested in the outer cavity. The top of the bottom surface flushing device 3 passes through the inner cavity, and a through hole connected to the outer cavity is formed at the top of the inner cavity. The outer cavity is connected to an exhaust device through a pipeline.

[0039] The bottom surface flushing device 3 is used to flush and protect the bottom surface of the wafer 8, and the double-sided brushing mechanism 2 is used to brush both sides of the wafer 8 at the same time. The wafer 8 in the bottom surface flushing device 3 and the double-sided brushing mechanism 2 is picked up and placed by the transport robot 102.

[0040] The structures of the liquid medicine spraying mechanism and the two-fluid cleaning mechanism are similar, and both include a lifting mechanism, a rotating mechanism and a cleaning swing arm which are arranged in sequence. The lifting mechanism that controls the lifting drives the overall movement up and down, and the rotating mechanism controls the cleaning swing arm to move to or away from above the wafer. A nozzle is arranged on the cleaning swing arm to spray liquid medicine, or a two-fluid nozzle is arranged to form a liquid medicine spraying mechanism and a two-fluid cleaning mechanism respectively.

[0041] The overall cleaning process is: first use the transport robot to take the wafer from the loading and unloading device and place it in the double-sided brushing mechanism for physical cleaning. The double-sided brushing mechanism can physically clean both sides of the wafer at the same time, and then use the transport robot to transfer the wafer to the wafer placement position on the top of the bottom rinsing device. At this time, the wafer with more important washing requirements is placed facing up as the top surface. The liquid spraying mechanism on the rack focuses on spraying the top surface of the wafer, and then the two-fluid cleaning mechanism is used to rinse the top surface of the wafer, and at the same time, the residual liquid on the top surface is rinsed off. During the liquid spraying and two-fluid cleaning process, the bottom rinsing device is turned on simultaneously to continuously rinse and protect the bottom surface of the wafer to prevent residual impurities on the top surface from being rinsed to the top surface of the wafer. Physical double-sided brushing is used to complete physical cleaning at one time, and then chemical cleaning is completed at one time. The overall cleaning efficiency is high and the effect is good.

[0042] Among them, Fig. 9 , 10 As shown, the bottom flushing device 3 includes: a load plate 301, a support seat 302, a rotating shaft 303, a protective tube 304, an infusion tube 305, a spray nozzle 306, a carrier plate 307, a driving mechanism 308, a rotation limiting assembly 309, a plurality of support blocks 3010 and a plurality of positioning columns 3011.

[0043] The load plate 301 is arranged vertically, serving as the basic supporting structure of the entire device, and is connected to the lifting mechanism in a transmission manner to achieve the overall lifting of the device, thereby cooperating with other devices.

[0044] The support base 302 is installed on one side of the load plate 301 to stably support the entire rotating shaft 303 and the components installed thereon, thereby ensuring that the rotating shaft 303 can remain stable when rotating at high speed without shaking or deflecting.

[0045] The rotating shaft 303 is arranged vertically and rotatably mounted on the supporting seat 302 , and has a coaxially arranged through channel 3031 inside; the through channel 3031 is used to accommodate and protect other components.

[0046] The protection tube 304 passes through the through channel 3031 and is rotatably matched with the rotating shaft 303 , and both ends extend out from the rotating shaft 303 to provide additional protection and support for the infusion tube 305 .

[0047] The infusion tube 305 is inserted into the protection tube 304, and the bottom end extends out of the protection tube 304, for conveying cleaning liquid; it is preferably a PFA tube, which has good high and low temperature resistance, corrosion resistance and aging resistance.

[0048] The spray nozzle 306 is installed at the top of the protection tube 304 and is connected to the liquid infusion tube 305 for spraying the cleaning liquid onto the bottom surface of the wafer 8 .

[0049] The carrier plate 307 is arranged horizontally and installed on the top of the rotating shaft 303 , and a movable through hole 3071 adapted to the spray nozzle 306 is opened on the top surface for carrying the wafer 8 .

[0050] The driving mechanism 308 is mounted on the loading plate 301 and is in driving connection with the rotating shaft 303 , so as to drive the rotating shaft 303 and the supporting plate 307 and the wafer 8 thereon to rotate at a high speed.

[0051] The rotation limiting assembly 309 is disposed on the load plate 301 and connected to the lower end of the protection tube 304 , and is used to support and limit the protection tube 304 to prevent it from rotating along the rotation axis 303 .

[0052] A plurality of support blocks 3010 are installed on the top surface of the carrier plate 307 and arranged around the rotating shaft 303 ; they are used to support the wafer 8 and keep a certain distance between the wafer 8 and the carrier plate 307 , thereby ensuring that the spray nozzle 306 can fully spray the bottom surface of the wafer 8 .

[0053] Multiple positioning posts 3011 are installed on the top surface of the carrier plate 307, arranged around the rotating axis 303, and located on the periphery of the support block 3010, to ensure that the wafer 8 can be accurately positioned at a predetermined position when placed, to prevent the wafer 8 from shifting or shaking during rotation or cleaning, which helps to ensure the uniformity and consistency of cleaning and improve the cleaning effect.

[0054] The wafers 8 in the loading and unloading devices 4 on both sides can be transferred to the cleaning system through the conveying component 1, and then conveyed back to the loading and unloading devices 4 after cleaning. The double-sided brushing mechanism 2 in the cleaning system can first perform double-sided brushing on the wafer 8, and then use the secondary cleaning device for secondary chemical cleaning. A protective tube 304 is provided in the rotating shaft 303 in the bottom surface flushing device 3. The protective tube 304 is sleeved on the outside of the infusion tube 305 to provide additional protection and support, thereby improving the working stability of the infusion tube 305, and helping to reduce the vibration and noise caused by rotation, thereby improving the stability and reliability of the cleaning process; the rotation of the protective tube 304 is limited by the rotation limiting component 309, and the protective tube 304, the infusion tube 305 and the spray nozzle 306 will all remain stationary and fixed, thereby making it unnecessary for the bottom end of the infusion tube 305 to be connected to the liquid supply system through a rotating joint, thereby avoiding the situation where metal impurities caused by the wear of the rotating joint contaminate the cleaning liquid, thereby improving the cleaning effect.

[0055] When using the bottom surface flushing device 3 for cleaning: first use the transport robot 102 to move the wafer 8 to the support block 3010, and use the outer edge to be supported by multiple support blocks 3010 to avoid interference with the spray cleaning, and use multiple positioning columns 3011 to perform surrounding positioning to avoid deviation or shaking during the rotation cleaning process; then start the driving mechanism 308, and the driving mechanism 308 drives the rotating shaft 303 and the supporting plate 307 and wafer 8 thereon to rotate at high speed. At the same time, since the protection tube 304 and the rotating shaft 303 are rotationally matched, and the rotation limiting component 309 limits the rotation of the protection tube 304, the protection tube 304, the infusion tube 305 and the spray nozzle 306 will all remain stationary and fixed, and the cleaning liquid can be input from the lower end of the infusion tube 305, and the bottom surface of the high-speed rotating wafer 8 is fully sprayed through the spray nozzle 306.

[0056] The outer periphery of the scrubbing chamber 5 corresponding to each bottom surface rinsing device 3 on the rack 201 is also provided with a two-fluid cleaning mechanism 7 and a liquid spraying mechanism 6, which are respectively used to spray the wafer 8 on the bottom surface rinsing device 3.

[0057] In this embodiment, Fig.10 , 12 As shown, in order to improve the support stability, the support seat 302 includes: a support cylinder 3021, a fixing frame 3022 and a plurality of first bearings 3023, which are specifically configured as follows: The support cylinder 3021 is arranged vertically, and first annular grooves 30211 are provided at both ends to provide stable support, so as to ensure that the rotating shaft 303 does not vibrate or deviate due to structural instability when rotating at high speed, thereby improving the stability and reliability of the entire cleaning device; The fixing frame 3022 is installed on the load plate 301 and connected to the support tube 3021 for fixed support; A plurality of first bearings 3023 are arranged in the first annular groove 30211 in a one-to-one correspondence and sleeved outside the rotating shaft 303. Through the rolling contact characteristics, the friction resistance and energy loss of the rotating shaft 303 during the rotation process are significantly reduced, the rotation efficiency and precision are improved, and the service life is also extended; The top cover 3024 is installed on the top of the support cylinder 3021 and is sleeved on the outside of the rotating shaft 303. It forms a relatively closed structure by cooperating with the first annular groove 30211 and the first bearing 3023, thereby helping to prevent the cleaning liquid or other pollutants from entering the first bearing 3023, ensuring the cleanliness and lubrication of the first bearing 3023, and improving its sealing performance and durability. There is a support ring 3032 outside the rotating shaft 303, and the bottom of the support ring 3032 abuts against the first bearing 3023, which is used to provide necessary vertical support for the rotating shaft 303 and realize the function of axial limiting.

[0058] The above-mentioned arrangement enhances structural stability, optimizes rotation performance, and improves sealing performance. The reasonable structural layout and easily disassembled connection method reduce maintenance costs and downtime, and improves the use effect, safety, and reliability of the device.

[0059] Based on the above embodiments, Fig.12 As shown, the rotating shaft 303 has a guide cover 3033 outside, and the guide cover 3033 is located above the top cover 3024 and covers the opening of the top cover 3024.

[0060] By providing the guide cover 3033 , it is possible to prevent the cleaning liquid from flowing into the interior of the support tube 3021 through the opening of the top cover 3024 , thereby further ensuring the cleanliness and lubrication of the first bearing 3023 and improving the stability of long-term use.

[0061] Based on the above embodiment, the fixing frame 3022 includes: a first support plate 30221, a second support plate 30222 and two reinforcing plates 30223, which are specifically configured as follows: The first support plate 30221 is horizontally mounted on the load plate 301 and sleeved on the upper end of the support tube 3021; The second support plate 30222 is horizontally mounted on the load plate 301 and sleeved on the lower end of the support tube 3021; The two reinforcing plates 30223 are disposed between the load plate 301 and the second support plate 30222 and are located on both sides of the support tube 3021 .

[0062] Through the upper and lower supports of the first support plate 30221 and the second support plate 30222, the load can be effectively shared, and the bearing performance of the structure is improved, making the structure safer and more reliable, thereby ensuring the stability of the support tube 3021, and by setting the reinforcement plate 30223, the strength, rigidity and stability of the structure are increased, and it helps to resist the influence of external forces or vibrations, thereby improving the overall stability of the structure.

[0063] In this embodiment, if Fig.10 As shown, flanges 30212 are fixedly sleeved on the upper and lower ends of the support tube 3021, and the two flanges 30212 are respectively attached to the first support plate 30221 and the second support plate 30222 and bolted.

[0064] Through the above arrangement, the support tube 3021 is vertically limited, and the bolt connection facilitates disassembly and assembly, thereby improving the efficiency of assembly and maintenance of the device.

[0065] In some embodiments, Fig. 9As shown, the driving mechanism 308 includes: a motor 3081, a driving wheel 3082, a driven wheel 3083 and a transmission belt 3084, and its specific configuration is as follows: The motor 3081 is mounted on the second support plate 30222; The driving wheel 3082 is mounted on the driving shaft of the motor 3081; The driven wheel 3083 is arranged below the support cylinder 3021 and is fixedly sleeved outside the rotating shaft 303; The transmission belt 3084 is sleeved between the driving wheel 3082 and the driven wheel 3083 .

[0066] Specifically, the motor 3081 is vertically mounted on the bottom of the second support plate 30222 through a concave plate, thereby improving the structural compactness of the device.

[0067] Through the above arrangement, since the transmission belt 3084 is elastic, it can effectively reduce the impact and vibration load, so the noise generated is small, and the rotating shaft 303 can be driven smoothly and stably to rotate at high speed.

[0068] In some embodiments, Fig. 9 , 11 As shown, the rotation limiting assembly 309 includes: a limiting bar 3091, a concave block 3092 and a connecting piece 3093, and its specific configuration is as follows: The limiting strip 3091 is arranged horizontally and installed on the outer periphery of the bottom end of the protection tube 304; The top sides of the concave block 3092 are provided with slots 30921 adapted to the limiting strips 3091; One end of the connecting piece 3093 is connected to the concave block 3092, and the other end is connected to the load plate 301; it is preferably an integrally formed part with the concave block 3092 and bolted to the load plate 301 to facilitate installation, thereby improving the assembly efficiency of the device, but is not limited to this and is not limited to this.

[0069] When in use, the protection tube 304 is passed through the inner side of the concave block 3092 , and the two ends of the limiting strip 3091 are respectively engaged with a slot 30921 .

[0070] Through the above arrangement, the protection tube 304 can be stably supported and rotationally restricted, and can be easily disassembled and assembled through the snap connection, thereby improving the assembly efficiency.

[0071] In some embodiments, Fig. 9 , 10 As shown, it also includes: A photoelectric sensor 3012 is mounted on the load board 301; The shading sheet 3013 is arranged horizontally, installed on the rotating shaft 303 , and is located below the supporting tube 3021 , and can pass through the sensing area of ​​the photoelectric sensor 3012 .

[0072] Through the above arrangement, the rotation speed of the rotating shaft 303 can be stably counted in real time, so that the operating status of the equipment can be understood in time, which is convenient for automatic control.

[0073] In some embodiments, Fig.11 As shown, the upper and lower ends of the through channel 3031 are both provided with second annular grooves 30311 , and the second bearing 3014 is installed in the second annular groove 30311 . The second bearing 3014 is sleeved outside the protection tube 304 .

[0074] By setting the second bearing 3014 as the connecting piece 3093 between the rotating shaft 303 and the protective tube 304, it is ensured that the protective tube 304 is not affected by the high-speed rotation of the rotating shaft 303 while being firmly supported, thereby improving the running stability. By setting the second annular groove 30311, an installation position is provided for the second bearing 3014, thereby ensuring stable installation and improving the compactness of the structure.

[0075] In some embodiments, Fig.13 As shown, including: The support plate 3015 is installed on the top of the rotating shaft 303 and is movably sleeved outside the protection tube 304, and the top surface is connected to the bottom of the carrier plate 307; The guide cover 3016 is installed on the top surface of the support plate 3015 and is movably sleeved outside the spray nozzle 306. The top of the guide cover 3016 has a truncated cone 30161. The top surface of the truncated cone 30161 has a plurality of concentrically nested lower ring plates 30162. The outer periphery of the spray nozzle 306 is provided with a baffle ring 3061 , and the bottom surface of the baffle ring 3061 is provided with a plurality of concentrically nested upper ring plates 3062 , and the upper ring plates 3062 and the lower ring plates 30162 are arranged alternately.

[0076] When in use, the cleaning liquid on the top surface of the supporting plate 307 falls onto the truncated cone 30161 of the guide cover 3016 through the movable through hole 3071, and then flows along the truncated cone 30161 to the supporting plate 3015 and is thrown out, and cooperates with the external brushing chamber 5 to collect the thrown out liquid; among them, due to the covering of the baffle ring 3061 and the alternating blocking with the lower ring plate 30162, the cleaning liquid cannot flow into the gap between the spray nozzle 306 and the guide cover 3016.

[0077] Through the above arrangement, a sealing effect is achieved, which prevents the cleaning liquid from flowing into the through channel 3031, ensures the cleanliness and lubrication of the second bearing 3014, improves the stability of long-term operation, and extends the service life.

[0078] In this example, Figure 4 As shown, the double-sided scrubbing mechanism 2 includes: a protective cover 20102, a supporting device 202 and a scrubbing device 203.

[0079] The protective cover 20102 is arranged on the frame 201, and the protective cover 20102 can prevent liquid from splashing during scrubbing, and prevent various substances such as external gas and liquid from entering therein; the supporting device 202 includes at least three rotating support units 20201, and the three rotating support units 20201 can clamp and fix a wafer 8. In this embodiment, four rotating support units 20201 are used, and the four rotating support units 20201 are divided into two groups arranged opposite to each other, each group includes two rotating support units 20201, and the output end of the rotating support unit 20201 extends into the protective cover 20102, that is, the top of the rotating support unit 20201 extends into the protective cover 20102, which is used to clamp the outer edge of the wafer 8. Specifically, the rotating support unit 20201 includes a rotating support shaft, and a friction wheel is arranged on the top of the rotating support shaft. A groove in contact with the outer edge of the wafer 8 is formed on the circumferential surface of the friction wheel, which is used to clamp the wafer 8 for rotation.

[0080] The scrubbing device 203 includes two groups of scrubbing heads 202031 arranged between the two groups of rotating support units 20201, and a first driving unit 20302 for driving the scrubbing heads 202031. The two groups of scrubbing heads 202031 are arranged at intervals up and down, located inside the protective cover 20102, and respectively located on the upper and lower surfaces of the wafer 8, for synchronously cleaning the wafer 8. The first driving unit 20302 is located outside the protective cover 20102, and is used to drive the scrubbing heads 202031 arranged at intervals on both sides of the wafer 8 to approach or move away from each other. During cleaning, the first driving unit 20302 drives the two scrubbing heads 202031 to approach and contact both sides of the wafer 8. After cleaning is completed, the first driving unit 20302 drives the two scrubbing heads 202031 to separate, making room for placing and removing the wafer 8.

[0081] The edges of the wafer 8 are clamped by using multiple rotating support units 20201 in the support device 202, and then scrubbing heads 202031 are respectively arranged on the upper and lower surfaces of the wafer 8 to clean both sides of the wafer 8 at the same time. The rotating support unit 20201 not only plays a supporting role, but also drives the wafer 8 to rotate, so that the scrubbing heads 202031 located between the two groups of rotating support units 20201 can fully scrub the surface of the wafer 8. The protective cover 20102 can prevent liquid from splashing during the scrubbing process. The entire scrubbing process is highly intelligent and efficient, and double-sided scrubbing can be completed in one go.

[0082] Specifically, the scrubbing head 202031 includes: a fixing plate 203011, a brush roller 203012 and a nozzle 203013.

[0083] One end of the fixed plate 203011 is located outside the protective cover 20102 and connected to the output end of the first driving unit 20302, and the other end extends into the protective cover 20102 and into the middle of the two groups of rotating support units 20201. The brush roller 203012 is rotatably connected to the fixed plate 203011, and both ends of the brush roller 203012 are fixed to the fixed plate 203011 through shaft seats. The brush roller 203012 can rotate to clean the surface of the wafer 8. The nozzle 203013 is installed on the fixed plate 203011, and the outlet of the nozzle 203013 faces the contact point between the brush roller 203012 and the wafer 8. When the brush roller 203012 rotates, the nozzle 203013 continuously sprays cleaning liquid to keep the surface of the wafer 8 moist, improve the cleaning effect, and avoid wear.

[0084] The fixed plate 203011 is provided with a brushing motor 3081204, the output end of the brushing motor 3081204 is connected to one end of the brush roller 203012 by transmission, one end of the brush roller 203012 extends out of the protective cover 20102, a synchronous wheel 205 is provided on the end, and the output end of the brushing motor 3081204 drives the synchronous wheel 205 through a transmission belt, thereby driving the brush roller 203012 to rotate.

[0085] Among them, the brush roller 203012 includes a central roller shaft and a brush wrapped around the outside of the roller shaft. The roller shaft is hollow inside and has a number of spray holes evenly opened on the surface. A sealing ring is rotatably connected to one end of the roller shaft. Cleaning liquid can be introduced into the inside of the roller shaft through the sealing ring, so that the cleaning liquid quickly overflows from the surface of the brush.

[0086] In this embodiment, the first driving unit 20302 includes: a bracket 203021 and a first double-head driving cylinder 203022 .

[0087] The bracket 203021 is arranged on the frame table 20101 outside the protective cover 20102, and the bracket 203021 is vertically arranged. The first double-headed driving cylinder 203022 is installed on the bracket 203021. The fixed plates 203011 of the two scrubbing heads 202031 are fixedly connected to the two slides of the first double-headed driving cylinder 203022. A linear rail 2017 is also connected between the fixed plates 203011 to play a guiding role. The first double-headed driving cylinder 203022 slides the two fixed plates 203011 downward in a vertical direction to realize the up and down opening and closing of the two fixed plates 203011, thereby driving the up and down opening and closing of the two scrubbing heads 202031.

[0088] In this embodiment, Figure 5As shown, in order to ensure that the first driving unit 20302 can smoothly drive the fixed plate 203011 to move up and down, an avoidance groove 206 located between the two groups of the rotating support units 20201 is opened on the protective cover 20102 along the moving direction of the first double-headed driving cylinder 203022 in the first driving unit 20302, and the fixed plate 203011 extends into the protective cover 20102 through the avoidance groove 206. Two water baffles 207 for shielding the avoidance groove 206 are respectively arranged on the two fixed plates 203011 located inside the protective cover 20102. The two water baffles 207 can prevent the liquid inside the protective cover 20102 from being thrown out of the avoidance groove 206. The two water baffles 207 are arranged at intervals and staggered along the length direction of the fixed plates 203011, so that when the two fixed plates 203011 move up and down, they can block the avoidance groove 206.

[0089] like Figure 7 , 8 As shown, in order to improve the waterproof effect, an oblong hole 208 is formed at the bottom of the protective cover 20102 for the rotation support unit 20201 to pass through, and a first waterproof plate 209 is provided around the upper periphery of the oblong hole 208. The first waterproof plate 209 is coated with a second waterproof plate 2010 on the outside, and the upper outer part of the second waterproof plate 2010 is coated with a waterproof cover 2011 which is sleeved on the rotation support unit 20201. By sequentially sleeved from the outside to the inside with the waterproof cover 2011, the second waterproof plate 2010 and the first waterproof plate 209, the rotation support shaft passes through the oblong hole 208 at the bottom of the protective cover 20102 to seal, thereby preventing water from flowing out of the oblong hole 208, and the oblong hole 208 is arranged along the displacement direction of the rotation support shaft.

[0090] like Figure 6 As shown, the input ends of the two groups of rotating support units 20201 located outside the protective cover 20102 are respectively connected to two groups of rotating drive devices 20202, and the rotating drive devices 20202 are used to drive the rotating support units 20201 to rotate. The two groups of rotating drive devices 20202 are arranged at the bottom of the frame table 20101, and the top output end of the rotating support unit 20201 extends into the protective cover 20102, and the bottom input end of the rotating support unit 20201 is located outside the protective cover 20102, and a synchronous wheel 205 is installed on the input end. A synchronous wheel 205 is installed at the bottom of each rotating support unit 20201 in each group, and is connected to the output end of the rotating drive device 20202 through a transmission belt 3084, so as to drive the two groups of rotating support units 20201 to rotate respectively. The rotating drive device 20202 can be realized by a servo motor 3081, etc.

[0091] like Figure 6As shown, a second driving unit 20203 is installed at the bottom of the frame table 20101, and the second driving unit 20203 includes a second double-headed driving cylinder 202031 installed at the bottom of the frame table 20101, and the second double-headed driving cylinder 202031 is used to drive the two groups of rotating support units 20201 to open and close, and the two slides of the second double-headed driving cylinder 202031 are respectively connected to the sliding plate 202032; and the sliding plate 202032 is Z-shaped, one end of which is connected to the sliding table of the second double-headed driving cylinder 202031, and the other end is connected to the sliding table of the second double-headed driving cylinder 202031. The end is slidably connected to the bottom of the frame table 20101 through a linear rail 2017, and the linear rail 2017 plays a guiding role. The rotating drive device 20202 is installed on the sliding plate 202032 to drive the two groups of the rotating drive devices 20202 and the two groups of rotating support units 20201 to move closer to or away from each other. Specifically, after the bottom end of the rotating support shaft in the rotating support unit 20201 passes through the sliding plate 202032, the rotating drive device 20202 drives the rotating support shaft to rotate through the connection of the transmission belt 3084.

[0092] like Figure 2 , 3 As shown, in order to facilitate taking or inspecting the inside of the protective cover 20102, the protective cover 20102 is set to be split. Specifically, the protective cover 20102 includes a cover body 201021 set on the rack table 20101 and a cover 201022 matched and covered on the cover body 201021. The cover 201022 can be removed to facilitate personnel to operate the inside; like Figure 3 As shown, an entrance and exit 201023 corresponding to the output end of the top of the supporting device 202 is provided at the junction of the cover 201022 and the cover body 201021, and the entrance and exit 201023 is convenient for the wafer 8 to enter and exit from the entrance and exit 201023 when the cover 201022 is closed. The entrance and exit 201023 is arranged on the protective cover 20102 near the side of the conveying component 1, and is used for the conveying robot 102 that clamps the wafer 8 to extend therein. A door driving cylinder 2012 is arranged on the outside of the protective cover 20102, and the output end of the door driving cylinder 2012 is connected to a door panel 2013 for covering or revealing the entrance and exit 201023. The door driving cylinder 2012 can be realized by a cylinder or a motor 3081, etc., to move the door panel 2013 up and down to cover the entrance and exit 201023 or expose the entrance and exit 201023.

[0093] In this embodiment, the side wall of the protective cover 20102 is provided with an exhaust pipe 2014 connected to the interior thereof, and the bottom of the protective cover 20102 is provided with a drain pipe 2015 connected to the interior thereof, and the liquid accumulated in the protective cover 20102 is discharged through the drain pipe 2015.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double-sided wafer cleaning device, characterized in that: It comprises a transport component and loading and unloading devices and a cleaning system arranged on both sides of the transport component, wherein the transport component is used to transfer wafers between the loading and unloading devices and the cleaning system; The transport assembly includes a driving track and a plurality of transport manipulators arranged on the driving track; The cleaning system comprises: a frame, a double-sided scrubbing mechanism and a secondary cleaning device arranged on the frame, wherein the double-sided scrubbing mechanism is used to physically scrub both sides of the wafer; The secondary cleaning device includes: a bottom surface flushing device, a liquid medicine spraying mechanism, a two-fluid cleaning mechanism and a scrubbing chamber. The top of the bottom surface flushing device extends out of the rack table to form a wafer placement position. The bottom surface flushing device is used to flush and protect the bottom surface of the wafer. The scrubbing chamber is surrounded by the top of the bottom surface flushing device. The liquid medicine spraying mechanism and the two-fluid cleaning mechanism are used for chemically cleaning the top surface of the wafer.

2. The double-sided wafer cleaning equipment according to claim 1, characterized in that: The double-sided scrubbing mechanism comprises: A protective cover is arranged on the frame; A supporting device, comprising at least three rotating supporting units, wherein the plurality of rotating supporting units are divided into two groups arranged opposite to each other, and output ends of the rotating supporting units extend into the protective cover to clamp the outer edge of the wafer; The scrubbing device comprises two groups of scrubbing heads arranged between the two groups of rotating support units, and a first driving unit for driving the scrubbing heads. The first driving unit is located outside the protective cover and is used to drive the scrubbing heads arranged at intervals on both sides of the wafer to move closer to or away from each other.

3. The double-sided wafer cleaning equipment according to claim 2, characterized in that: The scrubbing head comprises: A fixing plate, one end of which is connected to the output end of the first driving unit, and the other end of which extends into the protective cover; A brush roller is rotatably connected to the fixed plate; A nozzle is mounted on the fixing plate, wherein the outlet of the nozzle faces the contact point between the brush roller and the wafer; A scrubbing motor is installed on the fixed plate, and an output end of the scrubbing motor is drivingly connected to one end of the brush roller.

4. The double-sided wafer cleaning equipment according to claim 3, characterized in that: The protective cover is provided with an avoidance groove between the two groups of the rotating support units along the moving direction of the first driving unit, and two water retaining plates for shielding the avoidance groove are respectively provided on the two fixing plates inside the protective cover; An oblong hole is formed at the bottom of the protective cover for the rotation support unit to pass through, a first waterproof plate is arranged around the upper periphery of the oblong hole, the first waterproof plate is covered with a second waterproof plate on the outside, and the second waterproof plate is covered with a waterproof sleeve which is sleeved on the rotation support unit on the upper outside.

5. The wafer double-side cleaning equipment according to claim 2, characterized in that: The input ends of the two groups of rotation support units located outside the protective cover are respectively connected to two groups of rotation drive devices, and the rotation drive devices are used to drive the rotation support units to rotate; A second driving unit is installed at the bottom of the frame, and the second driving unit includes a second double-headed driving cylinder installed at the bottom of the frame. The two slides of the second double-headed driving cylinder are respectively connected to sliding plates, and the rotating driving device is installed on the sliding plates to drive the two groups of the rotating driving devices and the two groups of rotating support units to move closer to or away from each other.

6. The double-sided wafer cleaning equipment according to claim 2, characterized in that: The protective cover includes a cover body arranged on the frame and a cover cover matched with the cover body, and an entrance and exit corresponding to the output end of the top of the support device are opened at the junction of the cover cover and the cover body, and the entrance and exit are used for a handling robot that clamps the wafer to extend into, and a door drive cylinder is arranged on the outside of the protective cover, and the output end of the door drive cylinder is connected to a door panel for covering or revealing the entrance and exit.

7. The wafer double-side cleaning equipment according to claim 1, characterized in that: The bottom surface flushing device includes: a load plate; A support seat, mounted on one side of the load plate; A rotating shaft is arranged vertically and rotatably mounted on the supporting seat, and has a coaxially arranged through passage inside; A protective tube, passing through the through passage and rotatably cooperating with the rotating shaft, with both ends extending out from the rotating shaft; An infusion tube, inserted into the protection tube, with the bottom end extending out of the protection tube; A spray nozzle, installed at the top of the protection tube and connected with the infusion tube; The carrier plate is arranged horizontally and mounted on the top of the rotating shaft, and a movable through hole adapted to the spray nozzle is opened on the top surface; A driving mechanism, mounted on the load plate and drivingly connected to the rotating shaft; A rotation limiting assembly is disposed on the load plate and connected to the lower end of the protection tube; A plurality of support blocks are mounted on the top surface of the carrier plate and arranged around the rotating shaft; A plurality of positioning posts are installed on the top surface of the carrier plate, arranged around the rotating shaft, and located at the periphery of the supporting block.

8. The wafer double-side cleaning equipment according to claim 7, characterized in that: The support base comprises: The support tube is arranged vertically and has first annular grooves at both upper and lower ends; A fixing frame, mounted on the load plate and connected to the support tube; A plurality of first bearings are disposed in the first annular groove in a one-to-one correspondence and sleeved outside the rotating shaft; A top cover, mounted on the top of the support tube and sleeved outside the rotating shaft; The rotating shaft is provided with a support ring outside, the bottom of the support ring abuts against the first bearing, and the rotating shaft is provided with a guide cover outside, the guide cover is located above the top cover and covers the opening of the top cover.

9. The double-sided wafer cleaning equipment according to claim 7, characterized in that: The rotation limiting component comprises: A limit bar is arranged horizontally and installed on the outer periphery of the bottom end of the protection tube; The concave block has slots on both sides of the top that match the limit strips; A connecting piece, one end of which is connected to the concave block, and the other end of which is connected to the load plate.

10. The double-sided wafer cleaning equipment according to claim 7, characterized in that: Also includes: A support plate, mounted on the top of the rotating shaft and movably sleeved outside the protection tube, with a top surface connected to the bottom of the support plate; A guide cover is installed on the top surface of the support plate and movably sleeved outside the spray nozzle, and has a truncated cone on the top, and the top surface of the truncated cone has a plurality of lower ring plates arranged concentrically and nested; The outer periphery of the spray nozzle is provided with a baffle ring, and the bottom surface of the baffle ring is provided with a plurality of concentrically nested upper ring plates, and the upper ring plates and the lower ring plates are arranged alternately.

Images