Projection equipment, laser television and vehicle

Abstract

The embodiment of the invention provides projection equipment, a laser television and a vehicle, the projection equipment comprises an MEMS galvanometer chip, the MEMS galvanometer chip adopts silicon carbide as a chip substrate, and compared with a silicon-based chip, the silicon carbide has the characteristics of high thermal conductivity, high forbidden band width and the like, and the MEMS galvanometer chip has the advantages of high thermal conductivity and high forbidden band width. According to the MEMS galvanometer chip, the rotating suspension beam integrated with the mirror surface in the projection equipment using the MEMS galvanometer chip is not easy to damage at high temperature and low in heat dissipation requirement, the problems caused by working temperature rise such as fusing of the rotating suspension beam are avoided, the projection equipment has better environment adaptability, the heat dissipation requirement is low, the heat dissipation structure can be reduced, and the projection equipment is more miniaturized.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a projection device, a laser television, and a vehicle. Background Technology

[0002] A laser TV is a fourth-generation television product that uses a laser light source as its display light source and combines it with front projection display technology to create an image. It uses red, green, and blue solid-state lasers as its light source, receives the image via a television signal, and displays the image on a dedicated projection screen using related technologies.

[0003] MEMS galvanometer chips, as the core component for laser scanning in projection devices, precisely control the deflection angle of the laser beam through their tiny, drivable mirrors, thereby achieving laser pointing deflection, patterning scanning, and image scanning. In related technologies, MEMS galvanometer chips used in projection devices are typically made of silicon. Silicon has low thermal conductivity and a narrow bandgap, resulting in poor heat dissipation for silicon-based MEMS galvanometer chips. This makes the tiny structures of their rotating cantilever vulnerable to damage, making the projection device subject to stringent operating temperature requirements. Summary of the Invention

[0004] This application provides a projection device, a laser TV, and a vehicle, which have better environmental adaptability and are more compact.

[0005] In a first aspect, embodiments of this application provide a projection device, the device including a MEMS galvanometer chip (10), the MEMS galvanometer chip (10) including a chip substrate, the material of the chip substrate including silicon carbide;

[0006] The MEMS galvanometer chip (10) is used to reflect the incident beam to form a projected beam.

[0007] In one possible implementation, the device further includes a laser (20), and the laser (20) and the MEMS galvanometer chip (10) are arranged sequentially along the projection optical path;

[0008] The laser (20) is used to emit a laser beam to the MEMS galvanometer chip (10). The laser beam is reflected by the MEMS galvanometer chip (10) along the projection optical path to form a projection beam.

[0009] In one possible implementation, the device further includes a first optical component (30), and a laser (20) emits a laser beam toward the first optical component (30) along the projection optical path;

[0010] The first optical component (30) is used to form a projected image based on the laser beam emitted from the laser (20) and to propagate the projected image along the projection optical path to the MEMS galvanometer chip (10).

[0011] In one possible implementation, the first optical component (30) includes a beam splitter and a beam combiner.

[0012] In one possible implementation, the device further includes a second optical component (40) disposed on the light-emitting side of the laser (20), and the laser (20) emits a laser beam toward the second optical component (40) along the projection optical path;

[0013] The second optical component (40) is used to perform optical path correction on the laser beam from the laser (20) and propagate the corrected laser beam along the projection optical path to the first optical component (30).

[0014] In one possible implementation, the second optical component (40) includes a speckle-reducing structure;

[0015] Speckle-reducing structures are used to reduce the coherence between laser beams emitted from multiple sources.

[0016] In one possible implementation, the second optical component (40) further includes a collimating lens;

[0017] The collimating lens is used to convert the laser beam from the speckle structure into a parallel beam and propagate the parallel beam along the projection optical path to the first optical component (30).

[0018] In one possible implementation, the device further includes a projection lens (50) disposed on the light-reflecting side of the MEMS galvanometer chip (10).

[0019] The projection lens (50) is used to magnify and project the projection image from the MEMS galvanometer chip (10).

[0020] In one possible implementation, the device further includes a heat dissipation device (60);

[0021] A heat dissipation device (60) is installed on the non-light-emitting side of the laser (20) to absorb the heat generated by the laser (20).

[0022] Secondly, embodiments of this application provide a laser television, which includes a projection device as mentioned in the first aspect / various possible real-time modes of the first aspect.

[0023] Thirdly, embodiments of this application provide a vehicle that includes the laser TV mentioned in the second aspect.

[0024] This application provides a projection device, a laser TV, and a vehicle. The projection device includes a MEMS galvanometer chip. The MEMS galvanometer chip uses silicon carbide as the chip substrate. Compared with silicon-based chips, silicon carbide has the characteristics of high thermal conductivity and wide bandgap. This makes the rotating cantilever integrated with the mirror in the projection device using the MEMS galvanometer chip less prone to damage at high temperatures and has lower heat dissipation requirements. This avoids problems caused by operating temperature rise, such as the melting of the rotating cantilever. This gives the projection device better environmental adaptability, and the lower heat dissipation requirements can reduce the size of the heat dissipation structure, making the projection device more miniaturized. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] Figure 1 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 1 ;

[0027] Figure 2 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 2 ;

[0028] Figure 3 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 3 ;

[0029] Figure 4 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 4 ;

[0030] Figure 5 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 5 ;

[0031] Figure 6 This is a schematic diagram of the structure of a projection device provided in one embodiment of this application. Figure 6 .

[0032] Figure label:

[0033] 10: SiC MEMS galvanometer chip; 20: Laser; 30: First optical component; 40: Second optical component; 50: Projection lens; 60: Heat dissipation device.

[0034] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0035] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0036] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] A laser TV is a fourth-generation television product that uses a laser light source as its display light source and combines it with front projection display technology to create an image. It uses red, green, and blue solid-state lasers as its light source, receives the image via a television signal, and displays the image on a dedicated projection screen using related technologies.

[0038] MEMS galvanometer chips, as core components of laser scanning, can precisely control the deflection angle of the laser beam through their tiny, drivable mirrors, thereby achieving laser pointing deflection, patterning scanning, and image scanning. In existing technologies, MEMS galvanometer chips are made of silicon, which has low thermal conductivity and a narrow bandgap. Silicon-based MEMS galvanometer chips have poor heat dissipation capabilities, making their tiny rotating cantilever structures vulnerable to damage and subject to stringent operating temperature requirements.

[0039] To address the aforementioned technical problems, embodiments of this application propose a projection device, such as... Figure 1 As shown, the device includes a MEMS galvanometer chip 10, the MEMS galvanometer chip 10 includes a chip substrate, and the material of the chip substrate includes silicon carbide;

[0040] The MEMS galvanometer chip 10 is used to reflect the incident beam to form a projected beam.

[0041] The MEMS galvanometer chip 10 is a miniature, drivable mirror fabricated using microelectromechanical systems (MEMS) technology. In projection devices, it primarily performs the functions of light deflection and scanning. By precisely controlling the tilt angle of the galvanometer, the transmission direction of the incident light beam can be changed, thereby achieving beam projection and display. In the projection device, the light emitted from the laser source is deflected by the MEMS galvanometer chip 10 and accurately projected onto a designated position. By adjusting the tilt angle of the galvanometer, precise control of the light direction can be achieved. The MEMS galvanometer chip 10 can scan the laser beam by rapidly and precisely changing its tilt angle. This scanning method can generate continuous image frames, thus forming a complete video image.

[0042] The working principle of the MEMS galvanometer chip 10 is mainly based on electromagnetic drive or piezoelectric drive principles. The following is an introduction to the working principle of the electromagnetically driven MEMS galvanometer chip 10:

[0043] Structural Composition: The MEMS galvanometer chip 10 typically consists of a metal coil, a galvanometer, and a magnet. The metal coil is formed on the galvanometer, which is formed inside the coil through MEMS processing, and the magnet is arranged below the galvanometer.

[0044] Electromagnetic drive: When current flows through the coil, according to Fleming's law, a Lorentz force is generated that causes the galvanometer to tilt. This force causes the galvanometer to tilt slightly, thereby changing the transmission direction of the laser beam.

[0045] Precise control: By precisely controlling the magnitude and direction of the current in the coil, the tilt angle of the galvanometer can be precisely controlled. This control method enables the MEMS galvanometer chip 10 to achieve rapid and accurate adjustment of the light direction.

[0046] MEMS galvanometer chips in projection devices typically employ single-crystal silicon galvanometers, including a rotating cantilever integrated with the mirror surface to drive the galvanometer to rotate under load. The rotating cantilever is made of the same material as the galvanometer, namely single-crystal silicon. Due to silicon's inherent low thermal conductivity, low bandgap, and low heat dissipation capacity, the microstructure of the rotating cantilever is easily damaged, requiring high operating temperatures. However, the MEMS galvanometer chip in the projection device provided in this application uses silicon carbide as the chip substrate. Compared to silicon-based chips, silicon carbide has high thermal conductivity and a wide bandgap, making the rotating cantilever integrated with the mirror surface less prone to damage at high temperatures and reducing heat dissipation requirements. This avoids problems caused by overheating, such as cantilever meltdown, resulting in better environmental adaptability for the projection device. Furthermore, the lower heat dissipation requirements allow for a smaller heat dissipation structure, enabling more compact projection devices.

[0047] In one embodiment, such as Figure 2As shown, the device also includes a laser 20, and the laser 20 and the MEMS galvanometer chip 10 are arranged sequentially along the projection optical path;

[0048] Laser 20 is used to emit a laser beam to MEMS galvanometer chip 10. The laser beam is reflected by MEMS galvanometer chip 10 along the projection optical path to form a projection beam.

[0049] The projection optical path refers to the optical path through which light emitted from a light source shines on a specific object (such as a mask, image display element, etc.), passes through a series of optical elements (such as lenses, mirrors, etc.), and is finally projected onto a screen or other projection surface to form an image.

[0050] In this embodiment, the laser 20 serves as a light source emitting device, emitting a laser beam. For each frame of the displayed image, the laser 20 emits laser light of corresponding intensity. The laser intensity is determined based on each frame of the displayed image, and this determination process can be implemented internally within the laser. In this case, the laser 20 needs to have the function of receiving and processing image signals. Furthermore, the projection device also includes a modulator responsible for receiving each frame of the displayed image and processing it, separating it into red, green, and blue primary color image signals. After processing, these signals are sent to the laser 20, controlling the laser 20 to emit light of corresponding intensity, thereby adjusting parameters such as intensity and color of the laser beam.

[0051] The laser beam emitted by laser 20 reaches the MEMS galvanometer chip 10 along the projection optical path. The MEMS galvanometer chip 10 reflects the laser beam to form a projection beam, thus achieving projection. The MEMS galvanometer chip 10 includes a galvanometer and a rotating beam integrated with the mirror. After the laser beam strikes the galvanometer, it is reflected by the galvanometer. The rotating beam can drive the galvanometer to rotate, changing the angle of the galvanometer and thus changing the emission direction of the projection beam. The projection device using the MEMS galvanometer chip 10 utilizes the persistence of vision of the human eye and achieves scanning projection through the rotating beam in the MEMS galvanometer chip 10.

[0052] The projection device provided in the above embodiments uses a silicon carbide-based MEMS galvanometer chip, which has a higher limit operating temperature, lower heat dissipation requirements, and higher operating frequency and power density compared to silicon-based MEMS galvanometer chips. This makes the SiC MEMS galvanometer chip-based projection device have better environmental adaptability, reduces the size of the heat dissipation structure, and improves the resolution of the projection device and achieves a better user experience by increasing the operating frequency and power density.

[0053] In one embodiment, such as Figure 3 As shown, the device also includes a first optical component 30, and the laser 20 emits a laser beam toward the first optical component 30 along the projection optical path;

[0054] The first optical component 30 is used to form a projected image based on the laser beam emitted from the laser 20, and to propagate the projected image along the projection optical path to the MEMS galvanometer chip 10.

[0055] The first optical component 30 is mainly responsible for modulating, shaping, and projecting the light emitted by the laser 20, ultimately forming a clear and colorful image through reflection by the MEMS galvanometer chip 10. The performance of the first optical component 30 directly affects the image quality of the projection device, including key indicators such as resolution, color reproduction, contrast, and brightness.

[0056] Laser 20 includes red, green, and blue three-primary-color solid-state lasers, used to emit continuous laser light of three wavelengths as color light sources. The light emitted by these lasers is used for imaging after optical processing. The red, green, and blue light sources in laser 20 can be arranged on the same plane so that they can emit laser beams in the same direction. If the laser beams emitted by the three light sources are not in the same direction, corresponding optical elements need to be set to adjust the optical path of the laser beam emitted by each light source so that all beams propagate to the first optical component 30 for imaging.

[0057] The first optical component 30 forms a projected image based on the laser beam emitted by the laser 20. In one embodiment, the first optical component 30 includes a beam splitter and a beam combiner.

[0058] In laser projection equipment, although the multiple laser sources in laser 20 emit laser beams independently, the emitted laser beams all reach the first optical component 30 along the same projection optical path. Therefore, a beam splitter is needed to separate the received laser beams into red, green, and blue (RGB) beams. A beam splitter is an optical element that can separate a laser beam into multiple beams, each with the same frequency and phase during transmission. The beam splitter separates the laser beam into red, green, and blue (RGB) beams through its special optical properties, which allow it to reflect or transmit light of different wavelengths separately, thus achieving light separation. The separated RGB beams can then be used in subsequent projection processes to form a color image.

[0059] A beam combiner, also known as a beam splitter, is used to combine multiple light beams into a single beam. In laser projection equipment, beam combiners are primarily used to recombine the RGB three-color beams separated by a beam splitter into a single beam. This is achieved through the special design of the beam combiner, which ensures that light of different wavelengths interferes at specific angles and positions, thus forming a single beam. The combined beam can then be further magnified by a projection lens and projected onto a screen to create a high-quality color image.

[0060] In laser projection equipment, beam splitters and beam combiners need to work precisely together to achieve high-quality projection effects. Specifically, the beam splitter first separates the laser beam into RGB beams. These beams then undergo their respective processing paths (such as focusing by lenses or modulation by light valves) before being combined back into a single beam by the beam combiner. In this process, the accuracy and performance of both the beam splitter and the beam combiner are crucial. If the beam splitter's separation effect is unsatisfactory, or the beam combiner's beam combining effect is inaccurate, the quality of the projected image will degrade.

[0061] To achieve precise coordination between the beam splitter and the beam combiner, high-precision optical coating technology and optical processing techniques are typically required. These technologies ensure that the optical performance of the beam splitter and the beam combiner is optimized, thereby achieving high-quality projection effects.

[0062] If a laser projection device does not include a beam splitter and beam combiner, the formation of the projected image will be severely affected. In this case, the beams emitted by the laser source may not be effectively separated and combined, leading to problems such as color distortion and reduced sharpness in the projected image.

[0063] In one embodiment, such as Figure 4 As shown, the device also includes a second optical component 40, which is disposed on the light-emitting side of the laser 20. The laser 20 emits a laser beam toward the second optical component 40 along the projection optical path.

[0064] The second optical component 40 is used to perform optical path correction on the laser beam from the laser 20 and propagate the corrected laser beam along the projection optical path to the first optical component 30.

[0065] Viewed from the projection optical path, the second optical component 40 is positioned between the laser 20 and the first optical component 30. It processes the laser beams emitted from multiple light sources in the laser 20 and propagates the processed laser beams to the first optical component 30 for imaging. The processing of the laser beams by the second optical component 40 includes, but is not limited to, focusing, speckle correction, and collimation.

[0066] Speckle is caused by the coherence of laser light, which leads to interference when light waves meet in certain areas of space, resulting in alternating bright and dark granular patterns. This pattern can appear as noise or interference, particularly in fields like projection displays and optical imaging, where it reduces image clarity and quality. Therefore, anti-speckle technology has emerged to reduce or eliminate this phenomenon.

[0067] In one embodiment, the laser 20 includes multiple light sources, and the second optical component 40 includes a speckle-reducing structure;

[0068] Speckle-reducing structures are used to reduce the coherence between laser beams emitted from multiple sources.

[0069] A speckle reduction structure typically consists of multiple parts, each playing a specific role, working together to reduce or eliminate laser beam speckle. The speckle reduction structure includes: a light source section, optical components, and a control system section, wherein:

[0070] The light source section includes an auxiliary light source (such as an LED), which is mixed with the laser light source to reduce the coherence of the laser and reduce speckle phenomenon.

[0071] The optical components include compound eye lens assemblies, diffusers, apertures, and filters. Compound eye lens assemblies, composed of multiple small lenses, homogenize the energy distribution of the light spot while simultaneously diffusing and focusing the light, helping to reduce speckle. Diffusers scatter the laser light, changing its direction and further reducing speckle. For example, homogenizing glass, also known as an engineered scattering sheet or light homogenizer, is a special optical element. Its surface has microscopic irregular structures, such as tiny bumps, textures, or scattering particles. When light shines on the homogenizing glass, these microstructures scatter the light, redistributing the originally concentrated and non-uniform beam in space. Apertures and filters are used to adjust the intensity and frequency of the light, optimize its quality, and reduce speckle generation.

[0072] The control system includes control circuitry, sensors, and a feedback mechanism. The control circuitry receives and processes image signals, controlling the light intensity and frequency of the light source, as well as the operating status of the optical components, based on the signal content. The sensors and feedback mechanism monitor the quality of the light and adjust the parameters of the control system based on the monitoring results to achieve a more precise speckle reduction effect.

[0073] In the speckle reduction structure, each component plays a specific role, working together to reduce or eliminate laser beam speckle. By optimizing the design and parameter settings of these components, the performance and quality of the laser projection or imaging system can be further improved. It should be noted that the specific structure of the speckle reduction structure is not limited in the embodiments of this application.

[0074] In one embodiment, the second optical component 40 further includes a collimating lens;

[0075] The collimating lens is used to convert the laser beam from the speckle-reducing structure into a parallel beam and propagate the parallel beam along the projection optical path to the first optical component 30.

[0076] The laser beam from the speckle-reducing structure is transformed into parallel light by a collimating lens, allowing the entire laser beam to enter the entrance of the first optical component 30, reducing losses during laser transmission, and ensuring that the projected image formed by the first optical component 30 is clearer.

[0077] In one embodiment, such as Figure 5 As shown, the device also includes a projection lens 50, which is disposed on the light-reflecting side of the MEMS galvanometer chip 10.

[0078] The projection lens 50 is used to magnify and project the projection image from the MEMS galvanometer chip 10.

[0079] In terms of the projection optical path, the projection lens 50 is positioned behind the MEMS galvanometer chip 10, that is, on the light-emitting side of the MEMS galvanometer chip 10, and is used to project the projection image reflected by the MEMS galvanometer chip 10 onto the target position, such as a screen. It utilizes the principle of light refraction to accurately project the optical image formed inside the projection optical engine onto the designated screen.

[0080] The quality of the projection lens directly affects the clarity, contrast, and color reproduction of the projected image. A high-quality projection lens can provide high-resolution, low-distortion images, ensuring that viewers can see clear and realistic pictures.

[0081] In addition, the projection lens 50 can also have a zoom function, allowing users to adjust the focal length as needed to adapt to different screen sizes and projection distances.

[0082] A projection lens 50 typically consists of multiple lenses and mirrors that work together through precise optical and mechanical design to achieve the desired imaging effect. The following are the main components of a projection lens:

[0083] Lens barrel: The lens barrel is the main structure of the projection lens, used to fix and protect the internal lenses and mirrors. It is usually made of metal or plastic and has sufficient strength and rigidity to ensure the stability and durability of the lens.

[0084] Lens Group: The lens group is the core component of a projection lens, consisting of multiple lenses. These lenses can be different types of lenses, such as convex lenses, concave lenses, and plane mirrors, used to refract, focus, and form an image of light. The design and optimization of the lens group are crucial to the quality of the projected image.

[0085] Aperture: Located at the very front of the lens, the aperture controls the amount of light passing through, thus controlling depth of field and exposure. By adjusting the aperture size, users can adjust the brightness and contrast of the projected image.

[0086] Focusing ring: The focusing ring is used to adjust the lens's focal length to suit different screen sizes and projection distances. By rotating the focusing ring, users can change the distance between lens groups, thereby altering the focal length and the size of the projected image.

[0087] Other components: In addition to the main components mentioned above, a projection lens may also include other components such as filters, mirrors, and correction lenses. These components are used to further improve the quality of the projected image, such as filtering unwanted light, reflecting light to change the light path, and correcting lens distortion.

[0088] The projection lens 50 in the projection device plays a crucial role in light projection, image quality, and focus adjustment. Its complex and sophisticated structure comprises multiple lenses and mirrors, and achieves the desired imaging effect through precise optical and mechanical design. These components work together to ensure that the laser projector can output high-quality, clear projected images.

[0089] Typically, considering the installation location of the projection device, a short-throw lens is used. This allows the projector to be installed at a closer distance when projecting the same screen size; conversely, when the projector is installed at the same distance, a short-throw design allows for a larger screen size. A short-throw lens can project light from a very small vertical distance of 30cm to 60cm onto the screen from the projector.

[0090] In one embodiment, the projection lens 50 includes a refractive lens and a reflective lens.

[0091] A refraction lens is a key component of a projection lens. Its main function is to use the principle of light refraction to refract light from one medium (such as air) to another medium (such as a lens material), thereby changing the direction of light propagation and focusing it onto the projection screen. Specifically, a refraction lens achieves its function in the following ways:

[0092] Light focusing: In a refracting lens, a convex lens focuses light rays onto a single point, called the focal point. In a projection lens, this focal point is the image point on the projection screen. By precisely designing the curvature and materials of the lens, it is possible to ensure that light is accurately focused on the projection screen, forming a clear and sharp image.

[0093] Image magnification: The refractive lens not only focuses light but also magnifies the optical image formed inside the projector. This allows for the projection of large images onto the screen even if the projector itself is small.

[0094] Color correction: The lenses in the refractive lens can also be used to correct color distortion in the projected image. By adjusting the dispersion characteristics of the lens, it can be ensured that light of different wavelengths is correctly focused on the screen, thereby avoiding color blurring and distortion.

[0095] The primary function of a reflecting lens is to change the direction of light propagation through reflection, thereby adjusting the sharpness and brightness of an image. Specifically, reflecting lenses achieve their function in the following ways:

[0096] Light direction adjustment: The reflective lens can change the direction of light propagation, reflecting light that was originally heading in another direction onto the projection screen. In this way, even if the light source of the projector and the projection screen are not on the same straight line, projection can still be achieved through the reflective lens.

[0097] Image sharpness adjustment: The reflective surface in the reflective lens typically has high precision and high reflectivity, ensuring that light maintains high sharpness and brightness during reflection. By adjusting the angle and position of the reflector, the sharpness and brightness of the projected image can be further optimized.

[0098] Improved space utilization: Using reflective lenses can save space in the projection system. By guiding light onto the projection screen through reflection, long lens groups or light transmission ducts can be avoided, thus simplifying the structure of the projection system and improving space utilization.

[0099] In summary, both the refracting and reflecting lenses play crucial roles in a projection lens. The refracting lens is primarily responsible for light focusing, image magnification, and color correction, while the reflecting lens alters the direction of light propagation and adjusts image sharpness and brightness through reflection. These two components work together to achieve high-quality projection results.

[0100] In one embodiment, such as Figure 6 As shown, the device also includes a heat dissipation device 60;

[0101] The heat dissipation device 60 is installed on the non-light-emitting side of the laser 20 to absorb the heat generated by the laser 20.

[0102] Laser 20 generates a significant amount of heat during operation, especially under continuous operation. A heat dissipation device 60 is installed on laser 20 to absorb and dissipate the heat generated. Specifically, the heat dissipation device 60 needs to be installed on the non-emitting side of the laser 20 to avoid affecting the laser's output.

[0103] The heat dissipation device 60 can employ a thermoelectric cooler (TEC) to achieve heat dissipation. A thermoelectric cooler utilizes the Peltier effect of semiconductor materials; when direct current passes through a coupler composed of two different semiconductor materials connected in series, heat is absorbed and released at the two ends of the coupler, respectively, achieving the purpose of cooling. In use, the heat-absorbing end of the thermoelectric cooler is typically mounted on the non-emitting side of the laser 20 to absorb the heat generated by the laser 20, while the heat-dissipating end is mounted on the surface of the projection device to dissipate the conducted heat to the outside of the projection device, preventing any impact on the projection device.

[0104] It should be noted that the spatial positions of the various parts in the aforementioned projection device can be adjusted according to the device's shape and size. During adjustment, it is only necessary to ensure that the projection light path remains consistent with the above description and that each part serves the same function. After adjustment, optical elements such as lenses or mirrors can be added between any two parts of the projection light path to adjust the beam's propagation direction and guide it to the next part.

[0105] In conjunction with the above embodiments, this application also provides a laser TV, which includes the projection device in any of the above embodiments.

[0106] The laser TV also includes a screen; by adjusting the position between the projector and the screen, the projected image is displayed on the screen. In addition, the laser TV includes a speaker enclosure, a fan cooling module, and a wireless connectivity module. The speaker enclosure outputs and plays media audio. The fan cooling module dissipates heat from the laser TV's internal components. The entire narrow, flat laser TV body uses flexible rubber connections to prevent resonance, and an external shock-absorbing mounting bracket is fixed to the vehicle's ceiling. The laser TV supports both wired and wireless data transmission, and can wirelessly connect to mobile devices such as smartphones via built-in Wi-Fi / Bluetooth modules.

[0107] The aforementioned laser TV utilizes a silicon carbide-based MEMS galvanometer chip. Compared to traditional laser TVs, the projection device using a silicon carbide-based MEMS galvanometer chip employs red, green, and blue laser light sources. The image is projected after passing through a homogenizing glass that eliminates speckle and roughness, a short-throw lens consisting of a refracting mirror and a reflecting mirror, and the MEMS galvanometer chip on a silicon carbide substrate. Compared to silicon-based MEMS galvanometer chips, silicon carbide-based MEMS galvanometer chips offer advantages such as better thermal conductivity, a wider bandgap, and a higher saturated electron drift velocity. This results in higher operating temperatures, lower heat dissipation requirements, and higher operating frequencies and power densities. Consequently, laser TVs using silicon carbide-based MEMS galvanometer chips exhibit better environmental adaptability, smaller heat dissipation structures, and improved resolution and viewing experience through increased operating frequencies and power densities. Furthermore, this laser TV can achieve even higher physical resolution by stitching together images from multiple silicon carbide-based MEMS galvanometer chips.

Claims

1. A projection device, characterized by The device comprises a MEMS galvanometer chip (10), the MEMS galvanometer chip (10) comprises a chip substrate, and a material of the chip substrate comprises silicon carbide; The MEMS galvanometer chip (10) is used for reflecting an incident light beam to form a projection light beam.

2. The apparatus of claim 1, wherein, The device further comprises a laser (20), and the laser (20) and the MEMS galvanometer chip (10) are sequentially arranged along a projection light path; The laser (20) is used for emitting a laser light beam to the MEMS galvanometer chip (10), and the laser light beam forms a projection light beam after being reflected by the MEMS galvanometer chip (10) along the projection light path.

3. The apparatus of claim 2, wherein, The device further comprises a first optical assembly (30), and the laser (20) emits a laser light beam to the first optical assembly (30) along the projection light path; The first optical assembly (30) is used for forming a projection image according to the laser light beam emitted from the laser (20) and making the projection image propagate to the MEMS galvanometer chip (10) along the projection light path.

4. The apparatus of claim 3, wherein, The first optical assembly (30) comprises a light splitting mirror and a light combining mirror.

5. The apparatus of claim 4, wherein, The device further comprises a second optical assembly (40), and the second optical assembly (40) is arranged on an out-light side of the laser (20), and the laser (20) emits a laser light beam to the second optical assembly (40) along the projection light path; The second optical assembly (40) is used for correcting an optical path of the laser light beam from the laser (20) and making the corrected laser light beam propagate to the first optical assembly (30) along the projection light path.

6. The apparatus of claim 5, wherein, The laser (20) comprises a plurality of light sources, and the second optical assembly (40) comprises a speckle elimination structure; The speckle elimination structure is used for reducing coherence between laser light beams emitted by the plurality of light sources.

7. The apparatus of claim 6, wherein, The second optical assembly (40) further comprises a collimating mirror; The collimating mirror is used for changing the laser light beam from the speckle elimination structure into a parallel light beam and making the parallel light beam propagate to the first optical assembly (30) along the projection light path.

8. The apparatus of claim 7, wherein, The device further comprises a projection lens (50), and the projection lens (50) is arranged on a reflection out-light side of the MEMS galvanometer chip (10); The projection lens (50) is used for magnifying and projecting the projection image from the MEMS galvanometer chip (10) out.

9. The apparatus of claim 8, wherein, The device further comprises a heat dissipation device (60); The heat dissipation device (60) is mounted on a surface of a non-out-light side of the laser (20) and is used for absorbing heat generated by the laser (20).

10. A laser television, characterized by, The laser television comprises the projection device according to any one of claims 1-9.

11. A vehicle characterized by comprising: The vehicle comprises the laser television according to claim 10.

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