Double-chuck test system

Abstract

The utility model provides a double-chuck testing system. The double-chuck testing system comprises a first chuck, a second chuck, a seven-axis linear motion system and a testing mechanism, wherein the first chuck and the second chuck are used for placing a to-be-tested slide glass; the seven-axis linear motion system is used for moving and transporting the first chuck and the second chuck to a detection position; according to the double-chuck testing system, the position, height and angle of the to-be-tested slide glass can be adjusted through the seven-axis linear motion system, the to-be-tested slide glass can be tested through the testing mechanism, manual operation proficiency and sense organ are not depended on, large-batch testing can be carried out, and devices are not prone to being damaged.

Description

Technical Field

[0001] The present application belongs to the field of chip production technology, and more specifically, to a dual-chuck testing system. Background Art

[0002] The wafer carrier is a new form of product produced by the new process. Common types include stacked, silicon-based, BGA packaged, and single-chip. It has the advantages of miniaturization, high integration, and low cost. The probe station is one of the important testing equipment in the semiconductor industry. It is widely used in precision electrical measurements of complex and high-speed devices to ensure quality and reliability, and to reduce R&D time and device manufacturing process costs. Because the wafer carrier test points, namely the Pad points, are exposed and distributed on the surface of the wafer carrier, coupled with the influence of material consistency and production process, the final wafer carrier's Pad point positions are inconsistent and irregularly arranged, and even the heights of its Pad points are inconsistent; the probe stations currently on the market are mainly used for wafer inspection, chip R&D, and fault analysis in the wafer manufacturing process, and cannot be directly used for the testing of wafer carrier products.

[0003] Existing technical solutions are mainly divided into manual and tooling types. The manual method is to manually place the product on a manual probe station, magnify the image of a product through a microscope, find its Pad points one by one, and then operate the probe for testing. Due to the cumbersome operation and reliance on manual operation proficiency and senses, large-scale testing cannot be carried out and it is easy to damage the device. Summary of the invention

[0004] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: to provide a dual-chuck testing system, including a first chuck and a second chuck for placing a wafer to be tested, a seven-axis linear motion system for moving the first chuck and the second chuck to a detection position, and a testing mechanism for testing the wafer to be tested.

[0005] Optionally, the testing mechanism includes a variable-magnification microscopic vision component and a three-axis electric needle holder, the variable-magnification microscopic vision component is used to obtain position data and height data of the pad point of the wafer to be tested, and the three-axis electric needle holder is used to test the pad point of the wafer to be tested according to the position data and the height data.

[0006] Optionally, the testing mechanism further comprises a magnetic working panel, and the three-axis electric needle holder is magnetically connected to the magnetic working panel.

[0007] Optionally, the testing mechanism further includes a three-axis vision adjustment component, which is connected to the variable-magnification microscopic vision component and is used to adjust the position of the variable-magnification microscopic vision component in the X-axis, Y-axis and Z-axis directions.

[0008] Optionally, the testing mechanism further comprises a three-axis manual needle holder, and the three-axis manual needle holder is magnetically connected to the magnetic working panel.

[0009] Optionally, the seven-axis linear motion system includes a base, a first lifting and rotating axis, a second lifting and rotating axis, an X-axis linear motor, a first Y-axis linear motor, and a second Y-axis linear motor. The X-axis linear motor is fixed on the base, the first Y-axis linear motor and the second Y-axis linear motor are fixedly connected to the X-axis linear motor, the first lifting and rotating axis is fixedly connected to the first Y-axis linear motor, and the second lifting and rotating axis is fixedly connected to the second Y-axis linear motor.

[0010] The beneficial effects of the dual chuck testing system provided by the present application are as follows: compared with the prior art, the dual chuck testing system provided by the present application can adjust the position, height and angle of the test wafer through a seven-axis linear motion system, and can test the test wafer through a testing mechanism, without relying on manual operation proficiency and senses, and can perform large-scale testing and is not prone to damage devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0012] Figure 1 This is a schematic diagram of the overall structure of the fully automatic wafer-carrying probe station;

[0013] Figure 2 It is a schematic diagram of the internal structure of the dual-chuck test system and the fully automatic wafer-carrying probe station;

[0014] Figure 3 This is a structural diagram of the seven-axis linear motion system.

[0015] Among them, the reference numerals in the figure are:

[0016] 1. Three-color indicator light; 2. Display; 3. Control area; 4. Operation component; 5. Loading and unloading area; 6. Equipment body; 7. Transfer work head; 8. Transfer Z axis; 9. First vacuum processing system; 10. First tray transfer robot; 11. Second tray transfer robot; 12. Second vacuum processing system; 13. Transfer Y axis; 14. Transfer X axis; 15. First spare bin; 16. First loading bin; 17. First OK bin; 18. First NG bin; 19. First bottom vision component; 20. First chuck; 21 , three-axis vision adjustment component; 22. Zoom microscope vision component; 23. Three-axis electric needle holder; 24. Three-axis manual needle holder; 25. Magnetic work panel; 26. Seven-axis linear motion system; 27. Second spare material bin; 28. Second loading material bin; 29. ​​Second OK material bin; 30. Second NG material bin; 31. Second bottom vision component; 32. Second chuck; 33. First lifting and rotating axis; 34. Second lifting and rotating axis; 35. X-axis linear motor; 36. First Y-axis linear motor; 37. Base; 38. Second Y-axis linear motor. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0018] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0019] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] Please also read Figure 1-Figure 3 , the dual chuck testing system provided in the embodiment of the present application is now described.

[0022] A double chuck test system includes a first chuck 20 and a second chuck 32 for placing a wafer to be tested, a seven-axis linear motion system 26 for moving the first chuck 20 and the second chuck 32 to a testing position, and a test mechanism for testing the wafer to be tested.

[0023] See also Figure 3 In some embodiments of the present application, the seven-axis linear motion system 26 includes a base 37, a first lifting and rotating axis 33, a second lifting and rotating axis 34, an X-axis linear motor 35, a first Y-axis linear motor 36, and a second Y-axis linear motor 38. The X-axis linear motor 35 is fixed on the base 37, the first Y-axis linear motor 36 and the second Y-axis linear motor 38 are fixedly connected to the X-axis linear motor 35, the first lifting and rotating axis 33 is fixedly connected to the first Y-axis linear motor 36, and the second lifting and rotating axis 34 is fixedly connected to the second Y-axis linear motor 38.

[0024] The first chuck 20 and the second chuck 32 mounted thereon can be transported to a designated position by the seven-axis linear motion system 26, and can perform lifting, rotation and other actions, that is, adjust the angle and height of the slides placed on the first chuck 20 and the second chuck 32. Specifically, when the chucks are transported by the seven-axis linear motion system and arrive at the exact center of the magnetic suction working panel 25, the zoom microscope vision component 22 obtains the height and position information of the slide on the chuck, and then adjusts it to a suitable height and position by the seven-axis motion system, so as to achieve a more accurate test effect and avoid damage to the slide to be tested.

[0025] Specifically, the X-axis linear motor 35 is mounted on the marble base 37 by screw locking, the first Y-axis linear motor 36 and the second Y-axis linear motor 38 are mounted on the X-axis linear motor 35 by screw locking, the first lifting and rotating shaft 33 is also mounted on the first Y-axis linear motor 36 by screw locking, and the second lifting and rotating shaft 34 is also mounted on the first Y-axis linear motor 36 by screw locking. The seven-axis linear motion system 26 can transport the first chuck 20 and the second chuck 32 mounted thereon to a designated position, and complete lifting, rotating and other actions, that is, adjusting the angle and height of the wafer placed on the first chuck 20 and the second chuck 32, etc., to achieve a more accurate test effect and avoid damaging the wafer to be tested.

[0026] See also Figure 2In some embodiments of the present application, the testing mechanism includes a zoom microscope vision component 22 and a three-axis electric needle holder 23. The zoom microscope vision component 22 is used to obtain the position data and height data of the pad point of the carrier to be tested, and the three-axis electric needle holder 23 is used to test the pad point of the carrier to be tested according to the position data and the height data.

[0027] The variable-magnification microscopic vision component 22 can take pictures of the slide directly below it and process the relevant data to obtain the position data and height data of its Pad point, and then based on these data, the three-axis electric needle holder 23 starts to move the probe to the position of the Pad point to start testing.

[0028] See also Figure 2 In some embodiments of the present application, the testing mechanism further includes a magnetic working panel 25, and the three-axis electric needle seat 23 is magnetically connected to the magnetic working panel 25. The three-axis electric needle seat 23 can be conveniently and quickly taken in and replaced, and the position of the three-axis electric needle seat 23 can be adjusted.

[0029] See also Figure 2 In some embodiments of the present application, the testing mechanism also includes a three-axis vision adjustment component 21, which is connected to the zoom microscopic vision component 22 and is used to adjust the position of the zoom microscopic vision component 22 in the X-axis, Y-axis and Z-axis directions.

[0030] The three-axis visual adjustment component 21 can be used to conveniently adjust the photographing position for different materials.

[0031] See also Figure 2 In some embodiments of the present application, the testing mechanism further includes a three-axis manual needle holder 24. Some chips need to be powered on or tested with voltage, and a DC probe can be connected to the three-axis manual needle holder 24 to power on or test the chip.

[0032] In some embodiments of the present application, the three-axis manual needle seat 24 is magnetically connected to the magnetic working panel 25. In other embodiments of the present application, the three-axis manual needle seat 24 can also be fixed in other ways, which is not limited in the present application.

[0033] Working principle: After the slide is placed on the first chuck 20, the seven-axis linear motion system 26 moves the first chuck 20 to the concentric lower position of the zoom microscopic vision component. The zoom microscopic vision component 22 takes a picture of the slide directly below it and processes the relevant data to obtain the position data and height data of its Pad point. Then, based on these data, the three-axis electric needle holder 23 installed on the magnetic work panel 25 by magnetic attraction begins to move the probe to the position of the Pad point to start the test. After the test is completed, the seven-axis linear motion system 26 moves the first chuck 20 to the unloading position. Then, the slide on the second chuck 32 is tested.

[0034] Example

[0035] See also Figure 2 The dual chuck test system provided in the present application is installed in a fully automatic wafer-carrying probe station. The fully automatic wafer-carrying probe station includes a dual chuck test system and an automatic loading and unloading system. The automatic loading and unloading system is used to load and unload the first chuck 20 and the second chuck 32.

[0036] See also Figure 1 The exterior of the fully automatic wafer-carrying probe station equipment is mainly composed of the following parts: an equipment body 6, a loading and unloading area 5, and a control area 3. The control area 3 is equipped with a display 2, an operating component 4, etc. The operating component 4 includes a mouse and keyboard buttons. The equipment body 6 is also equipped with a three-color indicator light 1 to conveniently display the current status of the equipment.

[0037] The fully automatic wafer-carrying probe station equipment is mainly composed of a fully automatic loading and unloading system and a dual-chuck test system. After the wafer product is transferred through the fully automatic loading and unloading system, it reaches the dual-chuck test system and starts testing. Repeating the above steps can complete functions such as automatic loading and unloading, automatic recognition of PAD point three-dimensional coordinates, automatic correction of alignment, and automatic testing.

[0038] See also Figure 2 In some embodiments of the present application, the automatic loading and unloading system includes a transfer work head 7, a transfer X-axis 14, a transfer Y-axis 13 and a transfer Z-axis 8. The transfer X-axis 14 is used to drive the transfer work head 7 to move in the X-axis direction, the transfer Y-axis 13 is used to drive the transfer work head 7 to move in the Y-axis direction, and the transfer Z-axis 8 is used to drive the transfer work head 7 to move in the Z-axis direction.

[0039] The transfer work head 7 can clamp the wafer to be tested, and the position of the transfer work head 7 in the X-axis direction, Y-axis direction and Z-axis direction can be adjusted by the transfer X-axis 14, the transfer Y-axis 13 and the transfer Z-axis 8, thereby realizing the loading and unloading of the wafer to be tested.

[0040] See also Figure 2 In some embodiments of the present application, the fully automatic wafer-carrying probe station has two loading and unloading areas 5, namely a first loading and unloading area and a second loading and unloading area. The first loading and unloading area is provided with a first spare material bin 15, a first loading material bin 16, a first OK material bin 17 and a first NG material bin 18, and the second loading and unloading area is provided with a second spare material bin 27, a second loading material bin 28, a second OK material bin 29 and a second NG material bin 30.

[0041] The first spare bin 15 and the second spare bin 27 are used to store empty trays and can also be used as spares. The first loading bin 16 and the second loading bin 28 are used to store the wafers to be tested. The first OK bin 17 and the second OK bin 29 are used to store the wafers that have passed the test. The first NG bin 18 and the second NG bin 30 are used to store the wafers that have failed the test. By setting two loading and unloading areas 5 and cooperating with two chucks, the working efficiency of the test can be improved.

[0042] See also Figure 2 In some embodiments of the present application, the first loading and unloading area is provided with a first tray transfer robot 10 for transferring trays, and the second loading and unloading area is provided with a second tray transfer robot 11 for transferring trays.

[0043] The trays can be transferred between the various silos by the first tray transfer robot 10 and the second tray transfer robot 11.

[0044] See also Figure 2 In some embodiments of the present application, the first loading and unloading area is further provided with a first vacuum processing system 9; and the second loading and unloading area is further provided with a second vacuum processing system 12.

[0045] Through the first vacuum processing system 9 and the second vacuum processing system 12, it is applicable to the wafers transferred using the waffle box to achieve compatible loading. The first tray transfer robot 10 will first transfer the tray with the waffle box to the first vacuum processing system 9, perform vacuum treatment on it, and then transfer the work head 7 to the first vacuum processing system to start grabbing the wafer to be tested to complete the test task. The working process of the second vacuum processing system 12 is the same.

[0046] See also Figure 2 In some embodiments of the present application, a first bottom vision component 19 is provided in the first loading and unloading area, and a second bottom vision component 31 is provided in the second loading and unloading area. The first bottom vision component 19 and the second bottom vision component 31 are electrically connected to a controller, and the controller is electrically connected to the automatic loading and unloading system.

[0047] Through the first bottom vision component 19 and the second bottom vision component 31, the position and angle of the wafers in the first chuck 20 and the second chuck 32 can be corrected to facilitate testing.

[0048] The main actions of the fully automatic wafer-carrying probe station are as follows:

[0049] 1) Manually select the second loading and unloading area to operate the equipment;

[0050] 2) placing the wafer to be tested into the second loading bin 28 in the loading and unloading area 5 of the equipment;

[0051] 3) The second tray transfer robot 11 transfers the tray of the second loading bin 28 to the vacuum treatment system for vacuum treatment;

[0052] 4) The transfer working head 7 comes to the second vacuum processing system 12 and starts to grab the wafer to be tested;

[0053] 5) The transfer work head 7 brings the wafer to be tested to the position of the second bottom vision component 31, corrects the current wafer, and then places it on the second chuck 32;

[0054] 6) The seven-axis linear motion system 26 moves the second chuck 32 to the position to be measured, and the zoom microscope vision component 22 performs pad recognition and pad parameter reading;

[0055] 7) The three-axis electric needle holder 23 starts to move the probe to the position of the wafer pad point according to the parameters fed back by the zoom microscope vision component 22 to start testing. At the same time, the first chuck 20 has completed the loading operation (i.e., the above steps 3-5);

[0056] 8) After all the wafers on the second chuck 32 are tested, the seven-axis linear motion system 26 moves the second chuck 32 to the unloading position, and at the same time, the seven-axis linear motion system 26 moves the first chuck 20 to the position to be tested;

[0057] 9) The transfer work head 7 comes to the unloading position and starts to sort the wafers on the second chuck 32 after the test according to the test results;

[0058] 10) Place the wafers with qualified test results into the second OK bin 29, and place the wafers with unqualified test results into the second NG bin 30;

[0059] 11) The transfer working head 7 comes to the second vacuum processing system 12 again to start grabbing the wafer to be tested;

[0060] 12) Repeat the above steps to complete the automatic test of the wafer without stopping the machine. The double chuck design can greatly improve the efficiency.

[0061] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A dual chuck test system, characterized in that: It includes a first chuck and a second chuck for placing a wafer to be tested, a seven-axis linear motion system for moving the first chuck and the second chuck to a detection position, and a testing mechanism for testing the wafer to be tested.

2. The dual chuck test system according to claim 1, characterized in that: The testing mechanism includes a variable-magnification microscopic vision component and a three-axis electric needle holder, wherein the variable-magnification microscopic vision component is used to obtain position data and height data of a pad point of a wafer to be tested, and the three-axis electric needle holder is used to test the pad point of the wafer to be tested according to the position data and the height data.

3. The dual chuck test system as claimed in claim 2, characterized in that: The testing mechanism also includes a magnetic attraction working panel, and the three-axis electric needle seat is magnetically connected to the magnetic attraction working panel.

4. The dual chuck test system as claimed in claim 3, characterized in that: The testing mechanism also includes a three-axis vision adjustment component, which is connected to the variable-magnification microscopic vision component and is used to adjust the position of the variable-magnification microscopic vision component in the directions of the X-axis, the Y-axis and the Z-axis.

5. The dual chuck test system as claimed in claim 3, characterized in that: The testing mechanism also includes a three-axis manual needle holder, and the three-axis manual needle holder is magnetically connected to the magnetic working panel.

6. The dual chuck test system according to claim 1, characterized in that: The seven-axis linear motion system includes a base, a first lifting and rotating axis, a second lifting and rotating axis, an X-axis linear motor, a first Y-axis linear motor, and a second Y-axis linear motor. The X-axis linear motor is fixed on the base, the first Y-axis linear motor and the second Y-axis linear motor are fixedly connected to the X-axis linear motor, the first lifting and rotating axis is fixedly connected to the first Y-axis linear motor, and the second lifting and rotating axis is fixedly connected to the second Y-axis linear motor.

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