Movable clamping jig for double-faced adhesive tape mold

Abstract

The utility model discloses a double faced adhesive tape die movable clamping jig which comprises a control mechanism and clamping rods, the clamping rods are symmetrically arranged below the control mechanism, each clamping rod is of an L-shaped structure, the clamping rods move under the control of the control mechanism, and a cooling device is arranged on each clamping rod in a sleeved mode. The cooling plate is in contact with the two sides of the cutting die, the temperature of the cutting die is reduced through the cooling plate, the viscosity of a double-faced adhesive tape product is reduced, the double-faced adhesive tape product is not prone to being attached to the surface of the cutting die, the product quality is improved, and the problems that the double-faced adhesive tape product is prone to being attached to the surface of the die and the product quality is affected after being punched in the background technology are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of jigs, and particularly relates to a double-sided adhesive mold movable clamp jig. Background Art

[0002] At present, double-sided adhesive products are generally punched into the required shape by punching dies. The die is the die of the punching product. A box is a flat paper when it is printed. After printing, it is necessary to make a flat die with the same shape as the box to punch it. This die is the printing die, and the die needs to be used with a corresponding clamp when in use. The existing clamp is only used to clamp and fix the die, and the double-sided adhesive product will be sticky when it contacts the surface of the punching die. After punching, the double-sided adhesive product will adhere to the surface of the mold, and the product yield is not high, which affects the product quality. Therefore, a double-sided adhesive mold movable clamp is proposed. Utility Model Content

[0003] The utility model aims to overcome the problem in the prior art that double-sided adhesive products are easily adhered to the mold surface after punching, which affects the product quality. The utility model provides a double-sided adhesive mold movable clamping fixture which contacts the cutting mold through a cooler to reduce the temperature of the cutting mold, thereby reducing the viscosity of the double-sided adhesive and preventing the double-sided adhesive from adhering to the cutting mold.

[0004] In order to achieve the above-mentioned purpose, the utility model provides a double-sided adhesive mold movable clamp, including a control mechanism and a clamp rod, the clamp rod is symmetrically arranged under the control mechanism, the clamp rod is an L-shaped structure, the clamp rod moves under the control of the control mechanism, and a cooler is sleeved on the clamp rod.

[0005] Preferably, the cooler includes a cooling bin, an air intake pipe, a cooling plate, a connecting pipe and an exhaust pipe, the cooling bin is sleeved on the clamping rod, the cooling plates are symmetrically arranged above and below the horizontal section of the clamping rod, the cooling plates are semicircular, and two groups of cooling plates form a circular structure. A connecting pipe is connected between the two groups of cooling plates, and two groups of connecting pipes are symmetrically arranged, and the connecting pipes are arranged on both sides of the clamping rod, one end of the air intake pipe is connected to the top of the cooling plate at the upper end, and the other end of the air intake pipe is connected to the outer surface of the cooling bin, one end of the exhaust pipe is connected to the lower end of the side of the cooling plate at the lower end, and the other end of the exhaust pipe is connected to the bottom of the cooling bin.

[0006] Preferably, the control mechanism includes a fixed block, a control bin, a lead screw nut, a driving motor, a movable plate, a fixed block, a lead screw and a partition. The control bin is arranged on the clamping rod, the partition is arranged in the middle of the inner wall of the control bin, the fixed block is symmetrically arranged on the side of the inner wall of the control bin, the driving motor is symmetrically arranged on both sides of the partition, the driving motor and the fixed block are arranged on the same axis, one end of the lead screw is rotatably arranged in the fixed block, and the other end of the lead screw is fixedly connected to the driving motor, the lead screw nut is sleeved on the lead screw, and the movable plate is symmetrically sleeved on the lead screw nut, the connecting block is symmetrically arranged through the two groups of side walls of the movable plates, the connecting block is symmetrically arranged on both sides of the lead screw nut, and the upper end of the clamping rod is arranged through the upper wall of the connecting block.

[0007] Preferably, the cooling bin includes a vertical plate, a bin body, fan blades, a rotating motor, a semiconductor heat sink and a mounting plate, the bin body is sleeved on a clamping rod, the bin body is respectively connected to an inlet pipe and an exhaust pipe, the mounting plate is arranged at one end of the bin body away from the inlet pipe, the semiconductor heat sink is arranged through the mounting plate, the cooling surface of the semiconductor heat sink is arranged toward the inlet pipe, the vertical plate is arranged in the bin body and between the inlet pipe and the mounting plate, the rotating motor is arranged on the side of the vertical plate, the fan blades are fixedly connected to the rotating motor, and the fan blades and the inlet pipe are located on the same axis.

[0008] Preferably, the air inlet pipe and the air outlet pipe are both located on one side of the cooling surface of the semiconductor heat sink.

[0009] Preferably, a rib is provided at the lower end of the side surface of the vertical plate, and the rib is provided on the bottom wall of the bin body. A limit plate is provided at the upper end of the side surface of the vertical plate extending toward one side of the mounting plate, and the limit plate is sleeved on the clamp rod.

[0010] Preferably, positioning rods are symmetrically provided between the side surfaces of the inner wall of the control chamber, the positioning rods penetrate the partition plate and the movable plate, a movable sleeve is sleeved at the connection between the positioning rods and the movable plate, and the movable sleeve is movably sleeved on the positioning rods.

[0011] Preferably, a side of the cooling plate close to the clamping rod is provided with an arc-shaped recessed structure that matches the shape of the clamping rod.

[0012] The beneficial effects of the utility model are:

[0013] The utility model adds a cooler, when the clamp rod is inserted into the cutting die, the cooling plate contacts the two sides of the cutting die, and the temperature of the cutting die is reduced by the cooling plate, thereby causing the viscosity of the double-sided adhesive product to decrease, making it difficult to adhere to the surface of the cutting die, thereby improving the product quality, and solving the problem in the background technology that the double-sided adhesive product is easy to adhere to the mold surface after punching, thereby affecting the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The utility model is a schematic diagram of the overall structure of a double-sided adhesive mold movable clamp fixture.

[0015] Figure 2 It is a structural diagram of the double-sided adhesive mold movable clamp fixture of the utility model from another perspective.

[0016] Figure 3 yes Figure 2 A partial enlarged view of point A in the middle.

[0017] Figure 4 yes Figure 1 Diagram of the internal structure of the control mechanism.

[0018] Figure 5 yes Figure 3 Diagram of the internal structure of the middle cooling chamber.

[0019] In the figure: 1. control mechanism; 2. clamping rod; 3. cooler; 4. fixing block; 5. control chamber; 6. lead screw nut; 7. drive motor; 8. moving plate; 9. connecting block; 10. lead screw; 11. partition; 12. cooling chamber; 13. air inlet pipe; 14. cooling plate; 15. connecting pipe; 16. exhaust pipe; 17. vertical plate; 18. chamber body; 19. fan blade; 20. rotating motor; 21. semiconductor heat sink; 22. mounting plate; 23. rib plate; 24. limit plate; 25. positioning rod; 26. moving sleeve. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-5 , clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, specific orientation structure and operation, and therefore should not be understood as a limitation on the present invention.

[0022] The present embodiment provides a double-sided adhesive mold movable clamp fixture, including a control mechanism 1 and a clamp rod 2, the clamp rod 2 is symmetrically arranged under the control mechanism 1, the clamp rod 2 is an L-shaped structure, the clamp rod 2 moves under the control of the control mechanism 1, and a cooler 3 is sleeved on the clamp rod 2. The cooler 3 includes a cooling chamber 12, an air inlet pipe 13, a cooling plate 14, a connecting pipe 15 and an exhaust pipe 16. The cooling chamber 12 is sleeved on the clamp rod 2, and the cooling plate 14 is symmetrically arranged above and below the horizontal section of the clamp rod 2. The plate 14 is semicircular, and the two groups of cooling plates 14 form a circular structure. A connecting pipe 15 is connected between the two groups of cooling plates 14. Two groups of connecting pipes 15 are symmetrically arranged. The connecting pipes 15 are arranged on both sides of the clamping rod 2. One end of the air intake pipe 13 is connected to the top of the cooling plate 14 at the upper end, and the other end of the air intake pipe 13 is connected to the outer surface of the cooling bin 12. One end of the exhaust pipe 16 is connected to the lower end of the side of the cooling plate 14 at the lower end, and the other end of the exhaust pipe 16 is connected to the bottom of the cooling bin 12.

[0023] In one embodiment, specifically, the control mechanism 1 includes a fixed block 4, a control compartment 5, a screw nut 6, a drive motor 7, a movable plate 8, a connecting block 9, a screw rod 10 and a partition 11. The control compartment 5 is arranged on the clamping rod 2, the partition 11 is arranged in the middle of the inner wall of the control compartment 5, the fixed block 4 is symmetrically arranged on the side of the inner wall of the control compartment 5, the drive motor 7 is symmetrically arranged on both sides of the partition 11, the drive motor 7 and the fixed block 4 are arranged on the same axis, one end of the screw rod 10 is rotatably arranged in the fixed block 4, and the other end of the screw rod 10 is fixedly connected to the drive motor 7, the screw nut 6 is sleeved on the screw nut 10, the movable plate 8 is symmetrically sleeved on the screw nut 6, the connecting block 9 is symmetrically arranged to penetrate the side walls of the two groups of movable plates 8, the connecting block 9 is symmetrically arranged on both sides of the screw nut 6, the upper end of the clamping rod 2 is arranged to penetrate the upper wall of the connecting block 9, and the air inlet pipe 13 and the exhaust pipe 16 are both located on the cooling surface side of the semiconductor heat sink 21.

[0024] In one embodiment, specifically, the cooling bin 12 includes a vertical plate 17, a bin body 18, fan blades 19, a rotating motor 20, a semiconductor heat sink 21 and a mounting plate 22. The bin body 18 is sleeved on the clamp rod 2, and the bin body 18 is respectively connected to the air inlet pipe 13 and the exhaust pipe 16. The mounting plate 22 is arranged in the bin body 18 at one end away from the air inlet pipe 13. The semiconductor heat sink 21 is arranged through the mounting plate 22, and the cooling surface of the semiconductor heat sink 21 is arranged toward the air inlet pipe 13. The vertical plate 17 is arranged in the bin body 18 and between the air inlet pipe 13 and the mounting plate 22. The rotating motor 20 is arranged on the side of the vertical plate 17. The fan blades 19 are fixedly connected to the rotating motor 20, and the fan blades 19 and the air inlet pipe 13 are located on the same axis.

[0025] In one embodiment, specifically, a rib plate 23 is provided at the lower end of the side of the vertical plate 17, and the rib plate 23 is provided on the bottom wall of the bin body 18. A limit plate 24 is extended from the upper end of the side of the vertical plate 17 toward the mounting plate 22, and the limit plate 24 is sleeved on the clamp rod 2.

[0026] In one embodiment, specifically, positioning rods 25 are symmetrically provided between the inner wall sides of the control chamber 5, the positioning rods 25 are arranged to penetrate the partition 11 and the movable plate 8, and a movable sleeve 26 is sleeved at the connection between the positioning rod 25 and the movable plate 8, and the movable sleeve 26 is movably sleeved on the positioning rod 25 to improve the stability of the clamping rod 2.

[0027] In one embodiment, specifically, an arc-shaped recessed structure matching the shape of the clamping rod 2 is provided on one side of the cooling plate 14 close to the clamping rod 2, thereby increasing the contact surface between the cooling plate 14 and the clamping rod 2. On the one hand, the stability of the cooling plate 14 is improved, and on the other hand, the temperature of the clamping rod 2 can be reduced, thereby increasing the cooling effect on the cutting die.

[0028] The installation process of the double-sided adhesive mold movable clamp jig in this embodiment is as follows: start the drive motor 7, the drive motor 7 drives the lead screw 10 to rotate, the lead screw 10 drives the lead screw nut 6 to move, the lead screw nut 6 drives the movable plate 8 to move, the movable plate 8 drives the clamping rod 2 to move through the connecting block 9, and the clamping rod 2 is inserted into the cutting die to achieve the fixed installation of the cutting die, at this time, the cooling plate 14 is in contact with the cutting die;

[0029] During punching, the semiconductor heat sink 21 and the rotating motor 20 are started, the temperature of the semiconductor heat sink 21 on one side close to the vertical plate 17 decreases, the rotating motor 20 drives the fan blades 19 to rotate, and the fan blades 19 control the air to blow toward the air inlet pipe 13, the air enters the upper cooling plate 14 through the air inlet pipe 13, and then enters the lower cooling plate 14 through the connecting pipe 15, and finally returns to the bin body 18 through the exhaust pipe 16, forming an air circulation flow. At the same time, when the air circulates, the air contacts the cooling surface of the semiconductor heat sink 21, the air temperature decreases, and then the temperature of the cooling plate 14 is reduced. The cooling plate 14 reduces the temperature of the cutting die, which causes the viscosity of the double-sided adhesive product to decrease, and it is not easy to adhere to the surface of the cutting die, which solves the problem of the double-sided adhesive product being easy to adhere to the mold surface after punching, thereby affecting the product quality, as mentioned in the background technology.

[0030] The above contents are merely examples and explanations of the structure of the utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the utility model.

Claims

1. A double-sided adhesive mold movable clamp, characterized in that: It comprises a control mechanism (1) and a clamping rod (2), wherein the clamping rod (2) is symmetrically arranged under the control mechanism (1), the clamping rod (2) is an L-shaped structure, the clamping rod (2) moves under the control of the control mechanism (1), and a cooler (3) is sleeved on the clamping rod (2); The cooler (3) comprises a cooling chamber (12), an air inlet pipe (13), a cooling plate (14), a connecting pipe (15) and an exhaust pipe (16); the cooling chamber (12) is sleeved on the clamping rod (2); the cooling plates (14) are symmetrically arranged above and below the horizontal section of the clamping rod (2); the cooling plates (14) are semicircular; two groups of the cooling plates (14) form a circular structure; a connecting pipe (15) is provided between the two groups of the cooling plates (14). The connecting pipe (15) is symmetrically provided with two groups. The connecting pipe (15) is arranged on both sides of the clamping rod (2). One end of the air intake pipe (13) is connected to the top of the cooling plate (14) located at the upper end, and the other end of the air intake pipe (13) is connected to the outer surface of the cooling chamber (12). One end of the exhaust pipe (16) is connected to the lower end of the side of the cooling plate (14) located at the lower end, and the other end of the exhaust pipe (16) is connected to the bottom of the cooling chamber (12).

2. The double-sided adhesive mold movable clamp according to claim 1, characterized in that: The control mechanism (1) comprises a fixed block (4), a control chamber (5), a lead screw nut (6), a drive motor (7), a movable plate (8), a connecting block (9), a lead screw (10) and a partition (11); the control chamber (5) is arranged on the clamping rod (2); the partition (11) is arranged in the middle of the inner wall of the control chamber (5); the fixed block (4) is symmetrically arranged on the side of the inner wall of the control chamber (5); the drive motor (7) is symmetrically arranged on both sides of the partition (11); the drive motor (7) and the fixed block (4) are arranged On the same axis, one end of the lead screw (10) is rotatably arranged in the fixed block (4), and the other end of the lead screw (10) is fixedly connected to the drive motor (7). The lead screw nut (6) is sleeved on the lead screw (10), and the movable plate (8) is symmetrically sleeved on the lead screw nut (6). The connecting block (9) is symmetrically arranged to penetrate the side walls of the two groups of movable plates (8). The connecting block (9) is symmetrically arranged on both sides of the lead screw nut (6), and the upper end of the clamping rod (2) is arranged to penetrate the upper wall of the connecting block (9).

3. The double-sided adhesive mold movable clamp according to claim 1, characterized in that: The cooling chamber (12) comprises a vertical plate (17), a chamber body (18), a fan blade (19), a rotating motor (20), a semiconductor heat sink (21) and a mounting plate (22); the chamber body (18) is sleeved on a clamping rod (2); the chamber body (18) is respectively connected to an air inlet pipe (13) and an air outlet pipe (16); the mounting plate (22) is arranged at one end of the chamber body (18) away from the air inlet pipe (13); the semiconductor heat sink (21) penetrates the mounting plate (22); a cooling surface of the semiconductor heat sink (21) faces the air inlet pipe (13); the vertical plate (17) is arranged in the chamber body (18) and between the air inlet pipe (13) and the mounting plate (22); the rotating motor (20) is arranged on a side of the vertical plate (17); the fan blade (19) is fixedly connected to the rotating motor (20); and the fan blade (19) and the air inlet pipe (13) are located on the same axis.

4. The double-sided adhesive mold movable clamp according to claim 3, characterized in that: The air inlet pipe (13) and the air outlet pipe (16) are both located on one side of the cooling surface of the semiconductor heat sink (21).

5. The double-sided adhesive mold movable clamp according to claim 3, characterized in that: A rib plate (23) is provided at the lower end of the side surface of the vertical plate (17), and the rib plate (23) is arranged on the bottom wall of the bin body (18). A limit plate (24) is provided at the upper end of the side surface of the vertical plate (17) extending toward the mounting plate (22), and the limit plate (24) is sleeved on the clamping rod (2).

6. The double-sided adhesive mold movable clamp according to claim 2, characterized in that: Positioning rods (25) are symmetrically arranged between the inner wall sides of the control chamber (5); the positioning rods (25) penetrate the partition plate (11) and the movable plate (8); a movable sleeve (26) is sleeved at the connection between the positioning rods (25) and the movable plate (8); the movable sleeve (26) is movably sleeved on the positioning rods (25).

7. The double-sided adhesive mold movable clamp according to claim 1, characterized in that: A side of the cooling plate (14) close to the clamping rod (2) is provided with an arc-shaped recessed structure that matches the shape of the clamping rod (2).

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