Multi-time forming and packaging mold for component

Abstract

The utility model relates to the technical field of dies, in particular to a multi-time forming and packaging die for components. Through the exhaust port and the partial pressure groove which are matched with the forming cavities, on one hand, injected colloid can be more uniformly and rapidly filled into different forming cavities through the partial pressure groove, and on the other hand, waste containing gas is discharged into the waste groove through the exhaust port, so that the content of the gas in the forming cavities is greatly reduced; the size of the diameter of the small hole end of the exhaust port is set to be 3-10 [mu] m, a large amount of colloid not containing gas can be prevented from being discharged when waste containing gas is discharged, the width of the partial pressure groove is set to be 0.05-2 mm, under the condition that it is guaranteed that the colloid smoothly flows in different forming cavities, raw material loss is reduced, and production efficiency is improved. The problems that when an existing mold is used for packaging components, vortexes can be generated at the position of a mold stand column, and therefore bubbles and lack of glue appear on packaged products are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of molds, in particular to a component multiple molding and packaging mold. Background Art

[0002] In the packaging process of components, a large number of products require secondary packaging, such as Figure 1 As shown, the product needs to be molded twice. The second molding is performed on the basis of the first molding to obtain the final product. However, in order to form Figure 1 In the hollow area in the middle of the top, a column needs to be set on the mold. The glue collides with the column when flowing, which will generate vortices at the column, resulting in a large number of bubbles, glue deficiency and other defective products, resulting in a product yield loss of 15%-20% and uncontrollable, thus affecting the packaging molding quality of the product. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a component multiple molding packaging mold, which solves the problem that when packaging components, the current mold will generate vortices at the mold columns, thereby causing bubbles and glue shortages in the packaged products.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A component multiple molding packaging mold comprises a mold base, wherein the mold base is provided with a mold cavity mechanism for molding, and a glue injection mechanism for injecting glue into the mold cavity mechanism with an adjustable flow rate;

[0006] The mold cavity mechanism includes a plurality of molding cavities for component packaging molding, a partition is provided between two adjacent molding cavities, a plurality of pressure dividing grooves connecting the adjacent molding cavities are provided on the partition, an exhaust port is provided on the mold base at one end of the molding cavity, and a waste groove is provided on the mold base on the side away from the molding cavity where the exhaust ports are located.

[0007] Preferably, the glue injection mechanism comprises a glue inlet, and a glue inlet passage is connected between the glue inlet and the molding cavity.

[0008] Preferably, the width of the glue inlet channel is 1.7 mm to 2.5 mm.

[0009] Preferably, a support portion for reinforcement is provided on the molding cavity.

[0010] Preferably, the exhaust port is conical, the small hole end of the exhaust port is close to the waste tank, and the diameter of the small hole end of the exhaust port is 3um to 10um.

[0011] Preferably, the width of the voltage divider groove is 0.05 mm to 2 mm.

[0012] Preferably, the minimum single-side gap between the side wall of the molding cavity and the molded colloid is 0.2 mm to 0.4 mm.

[0013] Compared with the prior art, the utility model provides a component multiple molding packaging mold, which has the following beneficial effects:

[0014] 1. By setting the exhaust port and the pressure dividing groove matched with the molding cavity, on the one hand, the injected colloid can be filled into different molding cavities more evenly and quickly through the pressure dividing groove, and on the other hand, the waste containing gas can be discharged into the waste groove through the exhaust port, so that the gas content in the molding cavity is greatly reduced, thereby improving the packaging quality of components.

[0015] 2. By setting the diameter of the small hole end of the exhaust port to 3um to 10um, it is possible to avoid a large amount of colloid without gas being discharged when the waste containing gas is discharged, thereby greatly reducing the waste of colloid and thus reducing cost losses.

[0016] 3. By setting the width of the pressure divider groove to 0.05 mm to 2 mm, the total amount of colloid in the pressure divider groove can be reduced while ensuring the smooth flow of the colloid in different molding cavities, thereby reducing the loss of colloid raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is a schematic diagram of the packaging structure of components in the prior art;

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of the packaging mold of the utility model;

[0020] Figure 3 This is a front view of the packaging mold of the utility model;

[0021] Figure 4 It is a side view of the packaging mold of the utility model.

[0022] In the figure: 1. mold base; 2. mold cavity mechanism; 21. molding cavity; 22. partition; 23. pressure divider groove; 24. exhaust port; 25. waste trough; 26. support part; 3. glue injection mechanism; 31. glue inlet; 32. glue inlet channel. DETAILED DESCRIPTION

[0023] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0024] In order to further solve the problem of a large number of bubbles, lack of glue and other defective products in the current packaging mold during the packaging process, please refer to Figure 2-Figure 4 The present embodiment proposes a component multiple molding packaging mold, which further improves the existing mold and discharges the bubbles generated in the packaging process, thereby improving the qualified rate of the product. After batch verification, there are no defective products such as bubbles and glue deficiency when packaging components. Compared with the yield before the mold improvement, there is a significant improvement. A mold cavity mechanism 2 for molding and a glue injection mechanism 3 for injecting glue into the mold cavity mechanism 2 with an adjustable flow rate are provided on the mold base 1. The glue injection mechanism 3 injects the molten glue into the mold cavity mechanism 2, and at the same time, the flow rate of the colloid injected into the mold cavity mechanism 2 can be controlled by the control of the ejector pin, and then molding is performed in the mold cavity mechanism 2 to realize the packaging of components. During the exhaust process, the ejection speed of the ejector pin is relatively reduced to avoid damage to the molding cavity 21 caused by excessive pressure in the molding cavity.

[0025] The mold cavity mechanism 2 includes a plurality of molding cavities 21 for component packaging molding. Glue injected by the glue injection mechanism 3 flows in the molding cavity 21, and then cooled and molded to encapsulate the components. A partition 22 is provided between two adjacent molding cavities 21. The partition 22 is provided with a plurality of pressure dividing grooves 23 connecting the adjacent molding cavities 21. The pressure dividing grooves 23 are used for the glue to flow between different molding cavities 21 to avoid the situation that glue is lacking in a certain molding cavity 21, thereby affecting the packaging quality. An exhaust port 24 is provided on the mold base 1 at one end of the molding cavity 21. A waste trough 25 is provided on the mold base 1 on one side of the molding cavity 21, where several exhaust ports 24 are away from the mold base 1. During molding, as the glue injection mechanism 3 continuously injects glue into the mold cavity mechanism 2, the bubbles at the columns in the mold molding cavity 21 will be continuously pushed toward the exhaust ports 24, and the gas will be discharged through the exhaust ports 24. Part of the glue will also be discharged into the waste trough 25 through the exhaust ports 24, so that the discharged waste can be collected through the waste trough 25, greatly reducing the probability of material shortage and bubbles in the final cooled and molded product in the molding cavity 21.

[0026] The glue injection mechanism 3 is provided on the mold base 1 , and includes a glue inlet 31 . A glue inlet passage 32 is connected between the glue inlet 31 and the molding cavity 21 . The ejector rod injects the molten glue in the glue inlet 31 into the molding cavity 21 , and then the packaging molding of the components is realized in the molding cavity 21 .

[0027] The width of the existing glue inlet channel 32 is relatively small, and the glue flow rate is relatively small when the glue is introduced, resulting in a slow speed for the glue to fill the molding cavity 21, which easily causes the glue to partially solidify before filling the molding cavity 21, thereby affecting the cooling and molding effect of the product. Therefore, the width of the glue inlet channel 32 is 1.7mm~2.5mm, which can increase the flow rate of the glue in the glue inlet channel 32 and ensure that the pressure of the colloid flow channel is strengthened by the rotating rod, so that the colloid can quickly fill the entire molding cavity 21, and ensure that the waste with gas is discharged before the colloid in the molding cavity 21 is initially solidified.

[0028] At present, due to the large size of the mold, the area of ​​the mold base 1 is relatively large, which makes the length of the molding cavity 21 longer. During use, in order to ensure the quality of its molding surface, the current molding cavity 21 is usually made of other metal molding, and then attached to the mold base 1 for use, resulting in the longer molding cavity 21 may be deformed during long-term use, thereby affecting the product size. Therefore, a support part 26 for reinforcement is provided on the molding cavity 21. At present, the molding cavity 21 is usually made of sheet metal, and the mold base 1 is universal. Several molding cavities 21 are detachably installed on the mold base 1, and the length is relatively long, so it may be deformed in the middle during use. Therefore, the material in the middle part is thickened to improve its bending resistance and avoid deformation of the molding cavity 21 during use and cause poor product molding.

[0029] When exhausting gas, the exhaust port 24 will also bring out some waste, thus causing some waste. In order to reduce the waste of waste, the exhaust port 24 is conical, and the small hole end of the exhaust port 24 is close to the waste groove 25. The diameter of the small hole end of the exhaust port 24 is 3um~10um, so that on the basis of exhausting air, the discharge amount of waste containing air can be reduced, thereby reducing waste. At the same time, the glue pressure in the molding cavity 21 can be greater, the density of the glue is improved, and the yield of the product is improved.

[0030] When the glue flows into the molding cavity 21 through the glue injection mechanism 3, the glue pressure in different molding cavities 21 may be different, which may cause the pressure in some molding cavities 21 to be too high and the glue in some molding cavities 21 to be insufficient, thereby affecting the quality of product packaging molding. However, at this time, if the width of the pressure divider groove 23 is too small, the glue may flow slowly between different molding cavities 21, and a larger width may cause greater waste. Therefore, the width of the pressure divider groove 23 is 0.05mm~2mm. On the one hand, it can realize the flow of colloid in different molding cavities 21, so that the colloid is more evenly distributed throughout the entire molding cavity 21. At the same time, it can also reduce the large amount of colloid waste caused by the excessive width of the pressure divider groove 23.

[0031] At present, the unilateral gap between the side wall of the molding cavity 21 and the molded colloid is small, which causes the glue to flow unsmoothly at this position, which may cause some products to be short of material and have bubbles after molding. Therefore, the minimum unilateral gap between the side wall of the molding cavity 21 and the molded colloid is 0.2mm~0.4mm. This can increase the gap when the colloid flows from the side during the secondary packaging process, so that the colloid can better fill the gap between the side wall of the molding cavity 21 and the molded colloid, avoiding bubbles or lack of material due to the gap being too small, and at the same time making the colloid flow more smoothly, thereby reducing the probability of bubbles and short of material products.

[0032] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A component multiple molding packaging mold, comprising a mold base (1), characterized in that: The mold base (1) is provided with a mold cavity mechanism (2) for molding, and a glue injection mechanism (3) for injecting glue into the mold cavity mechanism (2) with an adjustable flow rate; The mold cavity mechanism (2) comprises a plurality of molding cavities (21) for component packaging molding, a partition (22) is provided between two adjacent molding cavities (21), a plurality of pressure dividing grooves (23) communicating with adjacent molding cavities (21) are provided on the partition (22), an exhaust port (24) is provided on the mold base (1) at one end of the molding cavity (21), and a waste material groove (25) is provided on the mold base (1) at a side away from the plurality of exhaust ports (24) and the molding cavity (21).

2. The packaging mold according to claim 1, characterized in that: The glue injection mechanism (3) comprises a glue inlet (31), and a glue inlet passage (32) is connected between the glue inlet (31) and the molding cavity (21).

3. The packaging mold according to claim 2, characterized in that: The width of the glue inlet channel (32) is 1.7 mm to 2.5 mm.

4. The packaging mold according to claim 1, characterized in that: The molding cavity (21) is provided with a supporting portion (26) for reinforcement.

5. The packaging mold according to claim 1, characterized in that: The exhaust port (24) is conical, the small hole end of the exhaust port (24) is close to the waste tank (25), and the diameter of the small hole end of the exhaust port (24) is 3um to 10um.

6. The packaging mold according to claim 1, characterized in that: The width of the voltage dividing groove (23) is 0.05 mm to 2 mm.

7. The packaging mold according to claim 1, characterized in that: The minimum single-side gap between the side wall of the molding cavity (21) and the molded colloid is 0.2 mm to 0.4 mm.

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