Golden finger protection jig for reflow soldering of PCB (Printed Circuit Board)
By designing a gold finger protective fixture containing horizontal bars in a rectangular frame, the problems of friction and adhesion of gold fingers during the reflow process of traditional protective fixtures are solved, and the stable protection and easy operation of gold fingers are achieved.
Patent Information
- Application Number
- CN202420582278.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2034-03-25
AI Technical Summary
Traditional gold finger protective gears are prone to friction and adhesion of gold fingers during reflow soldering, affecting quality, and the silicone material deformation at high temperatures affects the clamping effect.
Design a gold finger protective tool for reflow soldering of PCB circuit boards, use horizontal strips in rectangular frames to block the gold fingers, and ensure the stable placement and barrier of the circuit board through step-like settings and positioning blocks and positioning columns. flush, avoid friction.
It realizes that the operation of the gold finger does not affect the operation during the reflow soldering process, ensures the protection of the quality of the gold finger, and simplifies the operation process, avoiding friction and deflection of the gold fingers during disassembly and assembly and welding.
Smart Images
Figure CN222128381U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to the technical field of protective fixtures, in particular to a gold finger protective fixture for reflow soldering of a PCB circuit board. Background Art
[0002] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. There is a heating circuit inside this equipment, which heats the air or nitrogen to a high enough temperature and blows it to the circuit board with the components attached, so that the solder on both sides of the components melts and then bonds with the motherboard. The advantage of this process is that the temperature is easy to control and oxidation can be avoided during the soldering process.
[0003] However, the gold fingers on the circuit board need to be protected during the reflow process. The traditional protection method is to use high-temperature adhesive tape to stick on the gold fingers. Since there are multiple gold fingers on a circuit board, sticking high-temperature adhesive tape is very time-consuming and labor-intensive.
[0004] Chinese patent publication number CN 206251465 U provides a protective fixture for a gold finger, including: a groove mechanism, a circuit board; the circuit board is provided with a gold finger; the groove mechanism includes: an upper protective layer, a lower protective layer and a back protective layer respectively connected to the upper and lower protective layers; the groove mechanism is consistent with the gold finger, and the groove mechanism is sleeved on the outside of the gold finger of the circuit board.
[0005] The protective fixture for the gold finger in the above patent uses a C-shaped clamping structure to protect the gold finger. If the clamping structure is too tight, it will cause friction to the gold finger during disassembly and assembly, affecting the quality of the gold finger; if it is too loose, it may also cause falling off; moreover, during reflow soldering, the temperature is around 210-250°C, and the silicone material inside the above clamping structure will change; there is a problem that the silicone softens and sticks to the gold finger, or the silicone deforms and affects the subsequent clamping effect. Utility Model Content
[0006] The purpose of the utility model is to provide a gold finger protection fixture for PCB circuit board reflow soldering, which directly places the circuit board on the fixture and uses a shielding sheet to shield the gold finger. The structure is very simple and will not produce any influence during reflow soldering; and will not cause friction with the gold finger. In order to solve the technical problems raised in the above background technology.
[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0008] A gold finger protection jig for PCB circuit board reflow soldering comprises a jig plate, on which two workstations for PCB circuit board placement are arranged; each workstation is provided with a circuit board placement slot; a baffle placement slot is arranged on the jig plate and covers the two PCB circuit board placement workstations; a baffle is installed on the baffle placement slot, and the baffle comprises a rectangular frame, in which a plurality of horizontal bars capable of shielding the circuit board gold fingers are integrally arranged.
[0009] As a further technical solution of the utility model, the baffle placement groove and the circuit board placement groove are arranged in a stepped shape.
[0010] As a further technical solution of the utility model, after the PCB circuit board is placed in the circuit board placement groove, its upper surface is flush with the baffle placement groove.
[0011] As a further technical solution of the utility model, after the baffle is placed in the baffle placement groove, its upper surface is flush with the upper surface of the fixture plate.
[0012] As a further technical solution of the utility model, the baffle placement groove is arranged in a rectangular shape, and stripping grooves are opened at the four edges of the baffle placement groove, and the stripping grooves penetrate the fixture plate.
[0013] As a further technical solution of the utility model, a plurality of positioning blocks and positioning columns are provided at both ends of the circuit board placement groove for facilitating the placement of the PCB circuit board.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] 1. When using the utility model, the circuit board is directly placed in the circuit board placement slot, and then the baffle is placed in the baffle placement slot. At this time, the horizontal bar on the baffle will cover all the gold fingers. The structure is simple and the operation is very convenient;
[0016] 2. In the utility model, positioning blocks and positioning columns are arranged on the outside of the circuit board placement groove, which can achieve the effect of rapid positioning and fixing when placing the circuit board, and will not deflect and leak the gold finger during the reflow soldering process;
[0017] 3. According to the utility model, after the reflow soldering is completed, the staff can push up the fingers from the bottom of the stripping groove to remove the baffle from the baffle placement groove, which can achieve the purpose of quickly removing the baffle, and the process will not cause friction to the gold finger, which greatly protects the quality of the gold finger. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of the utility model.
[0019] Figure 2It is a three-dimensional structural schematic diagram of the utility model.
[0020] Figure 3 This utility model Figure 2 Schematic diagram of part of the structure.
[0021] Figure 4 It is a structural schematic diagram of the fixture plate in the utility model.
[0022] Figure 5 This utility model Figure 3 A partial enlarged schematic diagram of .
[0023] In the figure: 1- jig plate, 2- baffle placement slot, 3- stripping slot, 4- circuit board placement slot, 5- positioning block, 6- positioning column, 7- baffle. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] See also Figure 1-5 In an embodiment of the utility model, a gold finger protection jig for PCB circuit board reflow soldering includes a jig plate 1, on which two stations for placing PCB circuit boards are provided; each station is provided with a circuit board placement slot 4; a baffle placement slot 2 is provided on the jig plate 1, covering the two PCB circuit board placement stations; a baffle 7 is installed on the baffle placement slot 2, and the baffle 7 includes a rectangular frame, in which a plurality of horizontal bars capable of shielding the circuit board gold fingers are integrally arranged.
[0026] In this embodiment, the baffle placement slot 2 and the circuit board placement slot 4 are arranged in a stepped shape.
[0027] By adopting the above technical solution, both the placement stability of the circuit board and the stability of the baffle 7 after placement can be ensured.
[0028] In this embodiment, after the PCB circuit board is placed in the circuit board placement groove 4, its upper surface is flush with the baffle placement groove 2; after the baffle 7 is placed in the baffle placement groove 2, its upper surface is flush with the upper surface of the fixture plate 1.
[0029] By adopting the above technical solution, it is possible to ensure that the blocking piece 7 does not rub against the gold finger while ensuring the adhesion effect between the blocking piece 7 and the circuit board, thereby avoiding sliding.
[0030] In this embodiment, the baffle placement groove 2 is arranged in a rectangular shape, and stripping grooves 3 are opened at four edges of the baffle placement groove 2 , and the stripping grooves 3 penetrate the fixture plate 1 .
[0031] By adopting the above technical solution, after the reflow soldering is completed, the staff can push up the fingers from the bottom of the stripping groove 3 to remove the baffle 7 from the baffle placement groove 2, which can achieve the purpose of quickly removing the baffle 7, and this process will not cause friction to the gold finger, which greatly protects the quality of the gold finger.
[0032] In this embodiment, a plurality of positioning blocks 5 and positioning posts 6 are provided at both ends of the circuit board placement slot 4 for facilitating the placement of the PCB circuit board.
[0033] By adopting the above technical solution, the circuit board can be quickly positioned and fixed when it is placed, and no deviation will occur during the reflow soldering process to leak out the gold fingers.
[0034] The working principle of the utility model is as follows: when in use, the circuit board is directly placed in the circuit board placement groove 4. Since the positioning block 5 and the positioning column 6 are arranged on the outer side of the circuit board placement groove 4, the circuit board can be quickly positioned and fixed when it is placed, and no deflection will occur during the reflow soldering process to leak out the gold fingers; then the baffle 7 is placed in the baffle placement groove 2, and the horizontal bar on the baffle 7 will cover all the gold fingers, the structure is simple, and the operation is very convenient;
[0035] After the reflow soldering is completed, the staff can push up the fingers from the bottom of the stripping groove 3 to remove the baffle 7 from the baffle placement groove 2, which can achieve the purpose of quickly removing the baffle 7, and this process will not cause friction to the gold finger, which greatly protects the quality of the gold finger.
[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
[0037] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A gold finger protection fixture for PCB circuit board reflow soldering, Features: include A jig plate (1), wherein the jig plate (1) is provided with two workstations for facilitating the placement of PCB circuit boards; each workstation is provided with a circuit board placement slot (4); The baffle placement slot (2) is formed on the fixture plate (1) and covers two PCB circuit board placement stations; A baffle (7) is mounted on the baffle placement groove (2), and the baffle (7) comprises a rectangular frame, in which a plurality of horizontal bars capable of shielding the gold fingers of the circuit board are integrally arranged.
2. The gold finger protection fixture for PCB circuit board reflow soldering according to claim 1, Features: The baffle placement groove (2) and the circuit board placement groove (4) are arranged in a stepped shape.
3. The gold finger protection fixture for PCB circuit board reflow soldering according to claim 1, Features: After the PCB circuit board is placed in the circuit board placement groove (4), its upper surface is flush with the baffle placement groove (2).
4. The gold finger protection fixture for PCB circuit board reflow soldering according to claim 1, Features: After the baffle (7) is placed in the baffle placement groove (2), its upper surface is flush with the upper surface of the fixture plate (1).
5. The gold finger protection fixture for PCB circuit board reflow soldering according to claim 1, Features: The baffle placement groove (2) is arranged in a rectangular shape, and stripping grooves (3) are provided at four edges of the baffle placement groove (2), and the stripping grooves (3) penetrate the fixture plate (1).
6. The gold finger protection fixture for PCB circuit board reflow soldering according to claim 1, Features: A plurality of positioning blocks (5) and positioning columns (6) are provided at both ends of the circuit board placement groove (4) for facilitating the placement of the PCB circuit board.