Double-sided automatic exposure machine for wafer production

Abstract

The utility model provides a double-sided automatic exposure machine for wafer production, which relates to the technical field of wafer production, and comprises a box body, an exposure device arranged in the box body, an annular plate arranged in the box body, a driving mechanism arranged in the box body, a loader arranged above the annular plate, and a plurality of vertical plates fixedly arranged on the annular plate in a circumferential array manner, one side of each vertical plate is provided with a pressing plate, one side, facing the corresponding vertical plate, of each pressing plate is fixedly provided with two guide rods which are arranged at intervals, the guide rods penetrate through the vertical plates, the vertical plates are fixedly connected with springs, the other ends of the springs are fixedly connected to the pressing plates, and the loader is internally provided with a plurality of storage grooves which are distributed in a circumferential array mode. The double-sided exposure device is matched with the exposure of the exposure device, double-sided exposure can be performed on the wafer, and the double-sided exposure technology allows exposure of two surfaces of the wafer at the same time, so that the exposure times and the exposure time are greatly reduced, and the production efficiency is remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a double-sided automatic exposure machine for wafer production. Background Art

[0002] An exposure machine is a device that transfers image information on a film or other transparent object to a surface coated with a photosensitive substance by emitting UVA wavelength ultraviolet light.

[0003] For example, an efficient wafer one-time exposure machine with the announcement number CN220730626U specifically discloses a cabinet, a workbench is provided in the cabinet, a turntable is provided on the workbench, the turntable is driven by a servo motor, material storage racks are provided on the left and right sides of the turntable, a material storage box is provided on the material storage rack, two trays are symmetrically provided on the turntable, a plurality of lifting pins are provided on the upper end surface of the tray, an exposure plate is connected to the workbench through a Z-axis servo moving module, the exposure plate extends above the turntable, an exposure machine body is provided above the exposure plate through a bracket, a transfer mechanism is provided between the material storage racks on both sides, a correction mechanism is connected between the transfer mechanism and the material storage rack, the exposure machine loads materials alternately through two trays, and the first gripper, the second gripper and the third gripper respectively realize loading, positioning and unloading of wafers.

[0004] The exposure machine in the prior art cannot perform double-sided exposure. Since each side needs to be exposed separately, this will increase the number of exposures and exposure time, thereby increasing production costs. For this reason, we propose a double-sided automatic exposure machine for wafer production. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a double-sided automatic exposure machine for wafer production, which solves the problems raised by the above-mentioned background technology.

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a double-sided automatic exposure machine for wafer production, comprising a box body, an exposure device is arranged in the box body, a ring plate is arranged in the box body, a driving mechanism is installed in the box body, the driving mechanism is connected to the ring plate and can drive the ring plate to flip, a carrier is arranged above the ring plate, a plurality of vertical plates distributed in a circular array are fixedly installed on the ring plate, a pressure plate is arranged on one side of the vertical plate, two guide rods arranged at intervals are fixedly installed on the side of the pressure plate facing the vertical plate, the guide rods penetrate the vertical plate, the vertical plates are fixedly connected with springs, the other end of the spring is fixedly connected to the pressure plate, a plurality of storage slots distributed in a circular array are arranged in the carrier, the upper end of the carrier is opened and a top plate is provided at the upper port, the top plate can seal the carrier, the top plate and the carrier are interference fit, and the carrier is arranged directly below the exposure device.

[0007] As a further technical solution of the utility model, the side of the pressing plate facing the carrier is arranged as an arc-shaped surface, and the side of the pressing plate facing the carrier is provided with an anti-skid rubber suction cup layer.

[0008] As a further technical solution of the utility model, the driving mechanism includes a motor, the motor is fixedly installed in the box, a rotating shaft is fixedly installed on the output shaft end of the motor, and the end of the rotating shaft is fixedly connected to the annular plate.

[0009] As a further technical solution of the utility model, the pressure plate and the guide rod are hollow inside, and a number of evenly distributed air holes are opened on the side of the pressure plate facing the carrier. A suction pump is installed on the annular plate, and the air inlet pipe end of the suction pump is connected to and fixedly installed with a pipeline, and the pipeline is connected with multiple connecting pipes, and the connecting pipes can be slidably inserted into the guide rod and connected with the guide rod.

[0010] As a further technical solution of the utility model, the storage slots are all penetrated by cross bars, the cross bars are all fixedly connected in the carrier, the cross bars are all sleeved with elastic members, and the two ends of the elastic members are respectively fixedly connected to the storage slots and the carrier.

[0011] As a further technical solution of the utility model, the storage slot is a magnet, and a plurality of electromagnets distributed in a circular array are fixedly installed in the carrier.

[0012] As a further technical solution of the utility model, an observation window is installed on the box.

[0013] The utility model provides a double-sided automatic exposure machine for wafer production, which has the following beneficial effects compared with the prior art:

[0014] 1. This design is a double-sided automatic exposure machine for wafer production. By driving the carrier and the wafers in the storage slot to rotate around the rotating axis, the wafers are driven to perform a flipping operation. In conjunction with the exposure of the exposure device, the wafer can be exposed on both sides. The double-sided exposure technology allows the two sides of the wafer to be exposed at the same time, which greatly reduces the number of exposures and exposure time, thereby significantly improving production efficiency.

[0015] 2. The double-sided automatic exposure machine designed for wafer production can increase the power supply to the electromagnet according to the exposure requirements during the exposure process. The electromagnet applies a repulsive force or an attractive force to the storage slot, which can drive the storage slot to move horizontally and adjust the position of the wafer in the storage slot, thereby fine-tuning the wafer position to meet different exposure requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a double-sided automatic exposure machine for wafer production;

[0017] Figure 2 A schematic diagram of the internal structure of a double-sided automatic exposure machine for wafer production;

[0018] Figure 3 It is a schematic diagram of a partial structure enlargement of a ring plate of a double-sided automatic exposure machine for wafer production;

[0019] Figure 4 This is a schematic diagram of the internal structure of a carrier of a double-sided automatic exposure machine for wafer production.

[0020] In the figure: box body 1, annular plate 2, carrier 3, vertical plate 4, pressure plate 5, guide rod 6, spring 7, storage slot 8, top plate 9, motor 10, rotating shaft 11, exposure device 12, suction pump 13, pipeline 14, connecting pipe 15, cross bar 16, elastic member 17, electromagnet 18. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model provides a technical solution for a double-sided automatic exposure machine for wafer production:

[0023] A double-sided automatic exposure machine for wafer production comprises a box body 1, an exposure device 12 is arranged in the box body 1, an annular plate 2 is arranged in the box body 1, a driving mechanism is installed in the box body 1, the driving mechanism is connected to the annular plate 2 and can drive the annular plate 2 to flip, a carrier 3 is arranged above the annular plate 2, a plurality of vertical plates 4 distributed in a circular array are fixedly installed on the annular plate 2, a pressure plate 5 is arranged on one side of the vertical plates 4, two guide rods 6 arranged at intervals are fixedly installed on the side of the pressure plate 5 facing the vertical plates 4, the guide rods 6 penetrate the vertical plates 4, springs 7 are fixedly connected to the vertical plates 4, and the other end of the spring 7 is fixedly connected to the pressure plate 5, a plurality of storage slots 8 distributed in a circular array are arranged in the carrier 3, the upper end of the carrier 3 is opened and a top plate 9 is provided at the upper end, the top plate 9 can seal the carrier 3, the top plate 9 and the carrier 3 are interference fit, and the carrier 3 is arranged directly below the exposure device 12. The side of the pressing plate 5 facing the carrier 3 is configured as an arc surface, and the side of the pressing plate 5 facing the carrier 3 is provided with an anti-skid rubber suction cup layer. The driving mechanism includes a motor 10, which is fixedly installed in the box 1, and a rotating shaft 11 is fixedly installed at the output shaft end of the motor 10, and the end of the rotating shaft 11 is fixedly connected to the annular plate 2.

[0024] like Figure 3 and Figure 4 As shown, the pressing plate 5 and the guide rod 6 are hollow inside, and a number of evenly distributed air holes are opened on the side of the pressing plate 5 facing the carrier 3. A suction pump 13 is installed on the annular plate 2, and the air inlet pipe end of the suction pump 13 is connected and fixedly installed with a pipeline 14, and a plurality of connecting pipes 15 are connected to the pipeline 14, and the connecting pipes 15 can be slidably inserted into the guide rod 6 and connected with the guide rod 6. The storage slots 8 are all penetrated by cross bars 16, and the cross bars 16 are all fixedly connected in the carrier 3. The cross bars 16 are all sleeved with elastic members 17, and the two ends of the elastic members 17 are respectively fixedly connected to the storage slots 8 and the carrier 3. The storage slots 8 are magnets, and a plurality of electromagnets 18 distributed in a circumferential array are fixedly installed in the carrier 3. An observation window is installed on the box body 1.

[0025] The working principle of the utility model is as follows: the wafer is placed in the storage slot 8 and covered with the top plate 9, which can store multiple wafers. The elastic force of the spring 7 drives the pressure plate 5 to press on the outside of the carrier 3, which can preliminarily fix the carrier 3. Then, the air in the pipeline 14 is sucked by the suction pump 13. Through the conduction of the connecting pipe 15 and the guide rod 6, the pressure plate 5 and the carrier 3 are in a negative pressure state, which can further improve the stability of the fixation of the carrier 3. The motor 10 drives the rotating shaft 11 to rotate, which can drive the carrier 3 and the wafer in the storage slot 8 to rotate around the rotating shaft 11, thereby driving the wafer to perform a flipping operation, and cooperate with the exposure of the exposure device 12 to perform double-sided exposure on the wafer. During the exposure process, according to the exposure requirements, the electromagnet 18 can be energized, and the electromagnet 18 applies a repulsive force or an attractive force to the storage slot 8, which can drive the storage slot 8 to translate and adjust the position of the wafer in the storage slot 8, thereby fine-tuning the wafer position to meet different exposure requirements.

[0026] Double-sided exposure technology allows both sides of the wafer to be exposed at the same time, which greatly reduces the number of exposures and exposure time, thereby significantly improving production efficiency. The forward exposure and reverse exposure in the double-sided exposure technology can enhance the exposure effect of each other, thereby improving the exposure quality. This technology can reduce quality problems caused by underexposure or overexposure, making the wafer manufacturing process more stable and reliable. Double-sided exposure reduces the number of exposures and exposure time, which can reduce energy and equipment consumption. Secondly, it reduces the scrap rate, further reducing production costs.

[0027] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A double-sided automatic exposure machine for wafer production, characterized in that: The invention comprises a box body (1), wherein an exposure device (12) is arranged in the box body (1), wherein an annular plate (2) is arranged in the box body (1), wherein a driving mechanism is installed in the box body (1), wherein the driving mechanism is connected to the annular plate (2) and can drive the annular plate (2) to flip, wherein a carrier (3) is arranged above the annular plate (2), wherein a plurality of vertical plates (4) distributed in a circular array are fixedly installed on the annular plate (2), wherein a pressure plate (5) is arranged on one side of the vertical plate (4), and wherein two pressure plates (5) are fixedly installed on the side of the pressure plate (5) facing the vertical plate (4) Guide rods (6) are arranged at intervals, the guide rods (6) penetrate the vertical plates (4), the vertical plates (4) are fixedly connected to springs (7), the other ends of the springs (7) are fixedly connected to the pressure plates (5), a plurality of storage slots (8) distributed in a circular array are arranged in the carrier (3), the upper end of the carrier (3) is opened and a top plate (9) is provided at the upper end, the top plate (9) can seal the carrier (3), the top plate (9) and the carrier (3) are interference fit, and the carrier (3) is arranged directly below the exposure device (12).

2. A double-sided automatic exposure machine for wafer production according to claim 1, characterized in that: The side of the pressing plate (5) facing the carrier (3) is arranged as an arc-shaped surface, and the side of the pressing plate (5) facing the carrier (3) is provided with an anti-slip rubber suction cup layer.

3. A double-sided automatic exposure machine for wafer production according to claim 2, characterized in that: The driving mechanism comprises a motor (10), the motor (10) being fixedly mounted in the box (1), a rotating shaft (11) being fixedly mounted on the output shaft end of the motor (10), and an end of the rotating shaft (11) being fixedly connected to the annular plate (2).

4. A double-sided automatic exposure machine for wafer production according to claim 3, characterized in that: The pressing plate (5) and the guide rod (6) are hollow inside, and a plurality of evenly distributed air holes are provided on a side of the pressing plate (5) facing the carrier (3). A suction pump (13) is installed on the annular plate (2), and an air inlet pipe end of the suction pump (13) is connected to and fixedly installed with a pipeline (14), and the pipeline (14) is connected to a plurality of connecting pipes (15), and the connecting pipes (15) can be slidably inserted into the guide rod (6) and are connected to the guide rod (6).

5. A double-sided automatic exposure machine for wafer production according to claim 4, characterized in that: The storage slots (8) are all penetrated by cross bars (16), the cross bars (16) are all fixedly connected in the carrier (3), the cross bars (16) are all sleeved with elastic members (17), and the two ends of the elastic members (17) are respectively fixedly connected to the storage slots (8) and the carrier (3).

6. A double-sided automatic exposure machine for wafer production according to claim 5, characterized in that: The storage slot (8) is a magnet, and a plurality of electromagnets (18) distributed in a circular array are fixedly installed in the carrier (3).

7. A double-sided automatic exposure machine for wafer production according to claim 6, characterized in that: An observation window is installed on the box body (1).

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