Infrared VCSEL Laser assembly

Abstract

The utility model discloses an infrared VCSEL Laser assembly, which comprises a film-coated glass window, a flat window film-coated tube cap, a chip, a ceramic gasket, a tube socket, pins and a plastic LC lower sleeve, the tube socket and the flat window film-coated tube cap are coaxially sleeved and packaged, the ceramic gasket is arranged in the middle of the upper end of the tube socket, the film-coated glass window is arranged in the middle of the top end of the flat window film-coated tube cap, and the chip is arranged in the plastic LC lower sleeve. The utility model has the following advantages: the tube socket and the flat window plated tube cap are packaged coaxially, the tube socket and the tube cap are coaxial, the light-emitting surface of the chip is positioned in the center of the tube socket, and the flat window plated tube cap is adopted, so that the product power is higher, the coupling efficiency is higher, and the light-emitting surface of the chip is positioned in the center of the tube socket. And the thickness of the ceramic gasket can be specifically adjusted according to product requirements, and optical path coupling alignment is carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of optical component medical equipment CT (Computed Tomography) machines, in particular to an infrared VCSEL Laser component. Background Art

[0002] Most of the existing medical equipment CT (Computed Tomography) machines are imported. The infrared 850nm VCSEL Laser components used in the equipment are also imported packaging components. The cost is very high. In addition, foreign countries have restrictions on the export of such chips to China, and the procurement cycle is particularly long. Therefore, an infrared VCSEL Laser component is provided to solve the above problems. Utility Model Content

[0003] In order to solve the problems raised in the above background technology, the technical solution adopted by the utility model to solve the technical problems is: an infrared VCSEL Laser component, which includes: a coated glass window, a flat window coated tube cap, a chip, a ceramic gasket, a tube seat, a pin, and a plastic LC lower sleeve. The tube seat and the flat window coated tube cap are packaged through a coaxial sleeve, the ceramic gasket is arranged in the middle of the upper end of the tube seat, the coated glass window is arranged in the middle of the top of the flat window coated tube cap, and the coated glass window is used to transmit optical signals.

[0004] As a preferred technical solution of the utility model, the plastic LC lower sleeve is coaxially packaged on the outside of the flat window coated tube cap, the pins pass through the tube seat and are welded on the circuit board, and the number of pins is set to two, wherein the function of the plastic LC lower sleeve is to couple and align with the TO to ensure the maximum output of optical power, and the function of the pins is to be welded on the circuit board to transmit electrical signals.

[0005] As a preferred technical solution of the utility model, the chip is placed on top of a ceramic gasket through high-temperature curing of conductive silver glue, and the conductive silver glue is cured at a high temperature of 150°C for 1.5 hours, wherein the function of the ceramic gasket is to fix the chip on the gasket.

[0006] As a preferred technical solution of the utility model, the tube seat and the flat window coated tube cap are both made of TO46 Kovar material, wherein the flat window coated tube cap is used to support the glass sheet and protect the air tightness inside the window.

[0007] As a preferred technical solution of the utility model, the chip, the tube seat, and the pins are connected to each other by gold wire through a fully automatic wire bonding machine, wherein the ceramic gasket is used to fix the chip on the gasket, and the tube seat is used as a carrier for mounting the chip to protect the air tightness inside the window.

[0008] As a preferred technical solution of the utility model, the light-emitting surface of the chip is located at the center of the tube holder, and the function of the chip is to convert electrical signals into optical signals and transmit signals.

[0009] The utility model has the following advantages: the tube seat and the flat window plated tube cap are coaxially packaged, the tube seat and the tube cap are coaxial, the chip light-emitting surface is located in the center of the tube seat, and the flat window plated tube cap has a larger light-transmitting area to make the product more powerful and the coupling efficiency higher. The ceramic gasket can be used to adjust the gasket thickness according to product needs during optical path coupling alignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of a preferred embodiment of the utility model;

[0011] Figure 2 This is a schematic diagram of the split structure of the flat window coated tube cap and the plastic LC lower sleeve in the preferred embodiment of the utility model;

[0012] Figure 3 It is a schematic diagram of the internal structure of a preferred embodiment of the utility model.

[0013] Explanation of the reference numerals: 1. coated glass window; 2. flat window coated tube cap; 3. chip; 4. ceramic gasket; 5. tube seat; 6. pin; 7. plastic LC lower sleeve. DETAILED DESCRIPTION

[0014] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0015] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0016] The utility model will be further described below in conjunction with the accompanying drawings.

[0017] Please refer to Figure 1-Figure 3 The utility model discloses an infrared VCSEL Laser component, comprising: a coated glass window 1, a flat window coated tube cap 2, a chip 3, a ceramic gasket 4, a tube seat 5, a pin 6, and a plastic LC lower sleeve 7. The tube seat 5 and the flat window coated tube cap 2 are packaged through a coaxial sleeve connection. The ceramic gasket 4 is arranged at the middle position of the upper end of the tube seat 5, the coated glass window 1 is arranged at the middle position of the top end of the flat window coated tube cap 2, and the coated glass window 1 is used to transmit optical signals.

[0018] Combination Figure 2 and Figure 3 As shown, the plastic LC lower sleeve 7 is coaxially packaged on the outside of the flat window coated tube cap 2. The function of the plastic LC lower sleeve 7 is to couple and align with the TO to ensure the maximum output of optical power. The pin 6 passes through the tube seat 5 and is welded on the circuit board. The function of the pin 6 is to be welded on the circuit board to transmit electrical signals. There are two pins 6. The chip 3 is cured on the ceramic gasket 4 through high temperature of conductive silver glue, and the conductive silver glue is cured at a high temperature of 150°C for 1.5 hours. The function of the chip 3 is to convert electrical signals into optical signals and transmit signals.

[0019] Among them, the materials of the tube holder 5 and the flat window coated tube cap 2 are both made of TO46 Kovar material. The chip 3, tube holder 5, and pin 6 are connected to the circuit with gold wire through a fully automatic wire bonding machine. The light-emitting surface of the chip 3 is located in the center of the tube holder 5. The function of the coated glass window 1 is to transmit light and transmit optical signals; the function of the flat window coated tube cap 2 is to carry the glass sheet and protect the air tightness inside the window; the function of the ceramic gasket 4 is to fix the chip 3 on the gasket; the function of the tube holder 5 is to be a carrier for mounting the chip 3 to protect the air tightness inside the window.

[0020] In summary, the utility model uses an infrared 850nm VCSEL single transverse mode chip 3 for packaging, and the materials use a TO46 Kovar gold-plated tube seat 5 and a flat window coated tube cap 2. The chip 3 and aluminum nitride are mounted using a fully automatic die bonding machine, and the conductive silver glue is cured at a high temperature of 150°C for 1.5 hours. Then, the relevant components are connected to the relevant circuits using gold wires through a fully automatic wire bonding machine, and the sealed chamber of the energy storage welding machine is filled with high-purity nitrogen for capping and leak detection, and then the optical path is aligned and coupled, thereby becoming a finished product for use in medical equipment CT machines.

[0021] The above are only preferred implementations of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

[0022] Other parts of the present invention not described in detail belong to the prior art and will not be described in detail here.

[0023] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. An infrared VCSEL Laser component, characterized in that: include: A coated glass window (1), a flat window coated tube cap (2), a chip (3), a ceramic gasket (4), a tube seat (5), a pin (6), and a plastic LC lower sleeve (7); the tube seat (5) and the flat window coated tube cap (2) are packaged via a coaxial sleeve connection; the ceramic gasket (4) is arranged at the middle of the upper end of the tube seat (5); the coated glass window (1) is arranged at the middle of the top end of the flat window coated tube cap (2); and the coated glass window (1) is used to transmit optical signals.

2. An infrared VCSEL Laser assembly as claimed in claim 1, characterized in that: The plastic LC lower sleeve (7) is coaxially packaged on the outside of the flat window coated tube cap (2), and the pin (6) passes through the tube seat (5) and is welded on the circuit board. The number of the pins (6) is two.

3. An infrared VCSEL Laser assembly as claimed in claim 1, characterized in that: The chip (3) is placed on top of a ceramic gasket (4) through high-temperature curing of conductive silver glue.

4. An infrared VCSEL Laser assembly as claimed in claim 1, characterized in that: The tube seat (5) and the flat window coated tube cap (2) are both made of TO46 varable material.

5. An infrared VCSEL Laser assembly as claimed in claim 1, characterized in that: The chip (3), the tube seat (5) and the pin (6) are connected to each other by means of a gold wire through a fully automatic wire bonding machine.

6. An infrared VCSEL Laser assembly as claimed in claim 1, characterized in that: The light-emitting surface of the chip (3) is located at the center of the tube base (5), and the chip (3) is an 850nm VCSEL single transverse mode.

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