Anti-static structure and camera module

Abstract

The embodiment of the utility model provides an anti-static structure and a camera module. The camera module comprises a shell, and a lens assembly and an imaging chip which are assembled in the shell, the lens assembly comprises a metal lens barrel and at least one lens, the anti-static structure is arranged in the shell, the anti-static structure is provided with a guide surface facing the metal lens barrel, and the guide surface is located between the metal lens barrel and the imaging chip; the anti-static structure is electrically connected with the conducting element and is connected to the grounding end through the conducting element. According to the anti-static structure and the camera module provided by the embodiment of the invention, an electrostatic protection effect on the imaging chip can be achieved.

Description

Technical Field

[0001] The present application relates to the field of optical lenses, and more specifically, to an anti-static structure and a camera module having the anti-static structure. Background Art

[0002] With the continuous improvement of autonomous driving technology, the requirements for vehicle-mounted cameras are also increasing, and the stability of camera performance is a very important evaluation indicator.

[0003] Most of the current high-definition vehicle camera modules use metal lens barrels and metal shells, and AA glue is generally used to connect the metal lens barrel and the metal shell. This design allows the AA glue to form an insulating layer between the metal lens barrel and the front shell, so static electricity protection measures need to be taken. Otherwise, once the external static electricity is transmitted to the inner cavity of the module through the gaps between the connecting parts of the camera module and directly reaches the imaging chip, it will damage the chip and cause the imaging performance of the camera module to fail.

[0004] According to the camera module of the related art, a conductive structure is usually set outside the module for static electricity conduction, such as designing conductive wires, conductive glue, metal nuts, etc. between the lens and the housing; or a shielding cover is designed outside the imaging chip for static electricity protection.

[0005] However, the above anti-static solution has the following shortcomings: it is necessary to add structural parts or conductive glue for electrostatic protection, which increases material costs, and it is necessary to add additional assembly steps for the anti-static structure, which affects assembly efficiency; in addition, the shell design is complex and the processing cost is high; and the anti-static measures have poor compatibility.

[0006] In view of the above situation, it is necessary to provide an anti-static structure and a camera module to at least partially solve the above technical problems. Utility Model Content

[0007] The present application can at least partially solve the problems existing in the above-mentioned prior art.

[0008] According to one aspect of the present application, an anti-static structure for a camera module is provided, wherein the camera module includes a shell and a lens assembly and an imaging chip assembled in the shell, wherein the lens assembly includes a metal lens barrel and at least one lens, and the anti-static structure is arranged in the shell, the anti-static structure has a guide surface facing the metal lens barrel, and the guide surface is located between the metal lens barrel and the imaging chip; the anti-static structure is electrically connected to the conductive element and is connected to the ground terminal through the conductive element.

[0009] In one embodiment, the shell has a light through hole corresponding to the imaging chip, wherein the imaging chip has a photosensitive area and a non-photosensitive area; the antistatic structure is arranged at the light through hole and corresponds to the non-photosensitive area of ​​the imaging chip.

[0010] In one embodiment, the guide surface has a first distance from the first end surface of the metal lens barrel, the imaging chip has a second distance from the first end surface of the metal lens barrel, and the first distance is smaller than the second distance.

[0011] In one embodiment, the guide surface and the first end surface of the metal lens barrel have a first distance D1, and the first distance D1 and the mechanical back focus length FFL of the camera module satisfy: 0.3≤D1 / FFL≤0.98.

[0012] In one embodiment, the material of the antistatic structure is selected from any one or more of copper, aluminum, steel, and alloy.

[0013] In one embodiment, the conductive element includes a shell, the shell is a metal shell, and the anti-static structure includes a first current-conducting structure arranged on the inner wall of the shell, the first current-conducting structure is electrically connected to the shell and connected to the ground terminal through the shell.

[0014] In one embodiment, the anti-static structure and the housing are an integrated structure or a separate structure.

[0015] In one embodiment, the first power-leading structure includes an inwardly protruding conductive plate disposed along the radial direction of the housing.

[0016] In one embodiment, the number of the conductive plates is one or more.

[0017] In one embodiment, the radial cross-section of the conductive plate is rectangular, arc-shaped or polygonal.

[0018] In one embodiment, the first current conducting structure includes an inwardly protruding annular conductor disposed around the inner periphery of the shell.

[0019] In one embodiment, the inner cross-section of the annular conductor is rectangular, circular or elliptical.

[0020] In one embodiment, the camera module also includes a circuit board, and the imaging chip is mounted on the first surface of the circuit board; the conductive element includes the circuit board; the anti-static structure includes a second power-leading structure arranged on the first surface of the circuit board, the second power-leading structure is electrically connected to the circuit board, and is connected to a connector connected to the circuit board through the circuit board.

[0021] In one embodiment, the second current drawing structure includes a conductive sheet or a conductive column.

[0022] In one embodiment, the cross-sectional shape of the conductive sheet or the conductive column is rectangular, circular, elliptical or polygonal.

[0023] In one embodiment, the second current drawing structure includes a conductive ring disposed around the imaging chip.

[0024] In one embodiment, the cross-section of the conductive ring is rectangular, circular or elliptical.

[0025] In one embodiment, the second current leading structure is welded, riveted, snapped, locked or fixedly connected to the first surface of the circuit board.

[0026] In one embodiment, the material of the housing is selected from metal or plastic.

[0027] In one embodiment, the ground terminal includes a connector in the camera module.

[0028] According to another aspect of the present application, a camera module is also provided, comprising the anti-static structure as described above.

[0029] According to the anti-static structure and camera module provided by the above-mentioned embodiment of the present application, when the static electricity at the end of the lens assembly is conducted to the inside of the module through the metal lens barrel, it can be guided away by the anti-static structure before approaching the imaging chip, thereby playing a role in protecting the imaging chip from static electricity. In addition, the anti-static structure provided by the embodiment of the present application is simple in design, does not increase the number of module parts, is conducive to reducing module costs, and does not increase the module assembly process, is conducive to improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings, in which:

[0031] Figure 1 is a structural schematic diagram of a camera module according to an implementation mode of the present application;

[0032] Figure 2A is a structural schematic diagram of a first power-inducing structure according to an embodiment of the present application;

[0033] Figure 2B is a structural schematic diagram of a first power-inducing structure according to another embodiment of the present application;

[0034] Figure 2C is a structural schematic diagram of a first power-inducing structure according to another embodiment of the present application;

[0035] Figure 3 is a structural schematic diagram of a camera module according to another embodiment of the present application;

[0036] Figure 4A is a structural schematic diagram of a second power-inducing structure according to an embodiment of the present application;

[0037] Figure 4B is a structural schematic diagram of a second power-inducing structure according to another embodiment of the present application;

[0038] Figure 4C is a structural schematic diagram of a second power introduction structure according to another embodiment of the present application; and

[0039] Figure 5 It is a structural schematic diagram of a camera module according to another embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to better understand the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application and do not limit the scope of the present application in any way. Throughout the specification, the same figure numbers refer to the same elements. The expression "and / or" includes any one of the relevant listed items and any combination of any two or more. It should also be noted that, for ease of description, only the parts related to the technical features of the present application are shown in the accompanying drawings.

[0041] Use of the word “may” with respect to an example or implementation (eg, with respect to what an example or implementation may include or implement) means that there is at least one example or implementation that includes or implements such feature, while all examples or implementations are not limited thereto.

[0042] It should be noted that in this specification, the expressions first, second, third, etc. are only used to distinguish one feature from another, but do not represent any limitation on the features, and especially do not represent any order of precedence.

[0043] In the drawings, the thickness, size and shape of each component may be slightly exaggerated for convenience of explanation. The drawings are only examples and are not drawn strictly to scale.

[0044] Throughout the specification, when, for example, an element is described as being “on,” “connected to,” or “coupled to” another element, the element may be directly “on,” “connected to,” or “coupled to” the other element, or one or more other elements may be present between the element and the other element. Conversely, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, other elements may not be present between the element and the other element.

[0045] For ease of description, spatially relative terms such as "above," "higher," "lower," and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "higher" relative to another element will be "below" or "lower" relative to the other element. Therefore, depending on the spatial orientation of the device, the term "above" includes both "above" and "lower" orientations. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0046] It should also be understood that the terms "comprises", "including", "having", "includes" and / or "comprising", when used in this specification, indicate the presence of the stated features, elements and / or components, but do not exclude the presence of one or more other features, elements, components and / or combinations thereof. In addition, when a statement such as "at least one of..." appears after a list of listed features, it modifies all of the features in the list, rather than just the individual elements in the list.

[0047] As used herein, the words "substantially," "approximately," and similar words are used as words of approximation rather than degrees, and are intended to account for the inherent variations in measurements or calculations that one of ordinary skill in the art would recognize.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having the same meaning as they have in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined in this article.

[0049] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0050] Figure 1 A camera module 100 with an anti-static structure according to an embodiment of the present application is shown.

[0051] like Figure 1As shown, the camera module 100 of this embodiment may include a housing 120 and a lens assembly, an imaging chip 150 and a circuit board 170 assembled in the housing 120. The lens assembly may include a metal lens barrel 110 and at least one lens assembled in the metal lens barrel 110.

[0052] In this embodiment, the housing 120 is a metal housing, which can be selected from, but not limited to, metal or alloy materials such as copper, aluminum, and steel. The housing 120 can be fixedly mounted on a base (not shown) of the camera module 100. In some embodiments, the housing 120 can be divided into an upper housing 121 and a lower housing 122.

[0053] The imaging chip 150 may have a photosensitive area and a non-photosensitive area. The upper shell 121 of the housing 120 has a light hole 130 corresponding to the imaging chip 150 , and the opening size of the light hole 130 should be at least larger than the photosensitive area of ​​the imaging chip 150 to provide a light path for the imaging chip 150 .

[0054] The imaging chip 150 may be mounted on a circuit board 170, which may include a plurality of PCB (Printed Circuit Board) boards and inter-board connectors 180 between the PCB boards. The circuit board 170 may be electrically connected to a connector 190, which may be used to achieve connection between different components or units and current, signal or data transmission. The connector 90 may also be electrically connected to the metal housing 120.

[0055] In this embodiment, a first adhesive layer 210 is provided at the connection between the housing 120 (e.g., the upper housing 121) and the metal lens barrel 110. The first adhesive layer 210 may be an AA adhesive layer. A second adhesive layer 220 is provided between the housing 120 (e.g., the upper housing 121) and the circuit board 170. The second adhesive layer 220 may be an adhesive or a curing adhesive.

[0056] refer to Figure 1 As shown, the camera module 100 has an antistatic structure arranged on the inner wall of the housing 120, and the antistatic structure can be set as a first power-leading structure 140 protruding inwardly arranged along the radial direction of the housing 120. The first power-leading structure 140 has a guiding surface facing the metal lens barrel 110, and the guiding surface is located between the metal lens barrel 110 and the imaging chip 150. The guiding surface can be, for example, the upper surface of the first power-leading structure 140.

[0057] Exemplarily, the first power-inducing structure 140 of this embodiment can be disposed at the light-through hole 130 of the housing 120. In order not to affect the imaging performance of the camera module 100, the first power-inducing structure 140 corresponds to the non-photosensitive area of ​​the imaging chip 150. Specifically, the first power-inducing structure 140 can overlap with the projection of the bottom end of the lens assembly in the XY direction, but the overlapping portion will not affect the imaging performance of the camera module 100.

[0058] The guide surface of the first power-inducing structure 140 is higher than the imaging chip 150 in the Z direction, that is, in the direction of the optical axis of the camera module 100. Specifically, there may be a first distance between the guide surface (e.g., the upper surface) of the first power-inducing structure 140 and the first end surface (e.g., the bottom end surface) of the metal lens barrel 110, and there may be a second distance between the upper surface of the imaging chip 150 and the bottom end surface (bottom end surface) of the metal lens barrel 110. By setting the first distance to be smaller than the second distance, the static electricity at the end of the lens assembly can be received by the guide surface of the first power-inducing structure 140 and conducted to the ground before reaching the imaging chip 150, thereby playing a role in protecting the components such as the imaging chip 150 in the housing 120 from static electricity.

[0059] As an exemplary embodiment, the guide surface of the first conductive structure 140 and the first end surface of the metal lens barrel 110 have a first distance D1, and the first distance D1 and the mechanical back focal length FFL of the camera module 100 satisfy: 0.3≤D1 / FFL≤0.98. Further, it can satisfy: 0.4≤D1 / FFL≤0.94. Among them, the mechanical back focal length FFL of the camera module 100 refers to the distance from the bottom end surface of the lens assembly to the imaging surface. By controlling the ratio of the first distance to FFL within a certain range, it can be ensured that a good electrostatic conduction effect is achieved.

[0060] In this embodiment, the first power-conducting structure 140 is electrically connected to the housing 120 (e.g., the upper housing 121), and the first power-conducting structure 140 and the housing 120 may be an integrated structure or a detachable structure. The first power-conducting structure 140 may be connected to the ground terminal through the housing 120, for example, it may be connected to the connector 190 through the housing 120, so as to achieve grounding. In this way, the housing 120 is used as a conductive element, so that the static electricity at the lens assembly end can be conducted to the ground terminal through the first power-conducting structure 140 and the conductive element (e.g., the upper housing 121), thereby protecting the imaging chip 150 from being broken down by the static electricity at the lens assembly end.

[0061] The following will be combined Figure 2A , Figure 2B and Figure 2C The first power-leading structure 140 is further described in detail.

[0062] like Figure 2AAs shown, in one embodiment, the first power guiding structure 140 may include an inwardly protruding conductive plate 1410 (or conductive block) disposed radially along the housing 120. The radial cross-sectional shape of the conductive plate 1410 may be any one of a rectangular, arc-shaped, and a polygonal shape. The number of the conductive plates 1410 may be one or more.

[0063] like Figure 2B and Figure 2C As shown, the first power conducting structure 140 may also include an inwardly protruding annular conductor disposed around the inner periphery of the housing 120. The shape of the inner cross-section of the annular conductor may be, but is not limited to, a rectangle, a circle, or an ellipse, etc., and the present application does not impose any specific restrictions on this. For example, Figure 2B The inner cross-sectional shape of the annular conductor 1420 shown in FIG. 1 may be a square or a rectangle; Figure 2C The inner cross-section of the ring-shaped conductor 1430 shown may be circular.

[0064] The above-mentioned embodiments provide an anti-static structure and a camera module 100 having an anti-static structure. The anti-static structure can be a first power-drawing structure. The first power-drawing structure 140 can include a plurality of conductive plates or conductive blocks protruding inwardly arranged along the radial direction of the upper shell 121, or can be a full circle of annular conductors arranged along the inner periphery of the upper shell 121. The inner cross-sectional shape of the annular conductor can be square, circular, elliptical or any other shape. This application does not impose specific restrictions on this. The anti-static structure provided by the above-mentioned embodiments has a simple component structure, does not increase the number of module components, is conducive to reducing module costs, and does not increase the module assembly process, is conducive to improving production efficiency.

[0065] refer to Figure 1 As shown in FIG. 1 , the lightning marks outside the camera module 100 are the locations where static electricity is applied during the EMC test, while the lightning marks inside the camera module 100 are schematic diagrams of static electricity conduction. Figure 1 It can be seen that by setting an integrated or detachable anti-static structure inside the shell 120, the static electricity at the lens assembly end can be conducted to the inside of the module through the metal lens barrel 110 and can be guided away by the anti-static structure before approaching the imaging chip 150, thereby playing a role in electrostatic protection for the imaging chip 150.

[0066] Figure 3 A camera module 100 with an anti-static structure according to another embodiment of the present application is shown. For the sake of brevity, in this embodiment, some descriptions similar to the above embodiments will be omitted.

[0067] like Figure 3As shown, the camera module 100 of this embodiment may include a housing 120 and a lens assembly, an imaging chip 150, a circuit board 170, etc. assembled in the housing 120. The lens assembly may include a metal lens barrel 110 and at least one lens assembled in the metal lens barrel 110. In this embodiment, the housing 120 is a metal housing, for example, it can be selected from but not limited to metal or alloy materials such as copper, aluminum, steel, etc. In some embodiments, the housing 120 can be divided into an upper housing 121 and a lower housing 122.

[0068] In this embodiment, the camera module 100 has an anti-static structure disposed in the housing 120, and the anti-static structure includes a second power-drawing structure 171 disposed on the circuit board 170. The second power-drawing structure 171 has a guide surface facing the metal lens barrel 110, and the guide surface is located between the metal lens barrel 110 and the imaging chip 150. The guide surface can be, for example, the upper surface of the second power-drawing structure 171.

[0069] The second current-leading structure 171 may specifically include a metal conductive sheet, or may include a solid conductive column or a conductive ring, etc. The material of the second current-leading structure 171 may be any conductive metal such as copper, aluminum, steel, etc.

[0070] The second power-leading structure 171 is electrically connected to the circuit board 170, and can be connected to the connector 190 through the circuit board 170, so as to achieve grounding. Specifically, the second power-leading structure 171 can be welded, riveted, snapped or locked on the first surface (e.g., the upper surface) of the circuit board 170, or can be fixedly connected to the circuit board 170 by other connection methods. Among them, the second power-leading structure 171 can be close to the packaging area of ​​the imaging chip 150 in the XY plane direction; the height in the Z direction (the optical axis direction of the camera module) is higher than the imaging chip 150 and lower than the bottom end surface of the metal lens barrel 110, and there may be an overlap with the projection of the bottom end of the lens assembly, but the overlap does not affect the imaging performance of the camera module 100.

[0071] The following will be combined Figure 4A , Figure 4B and Figure 4C The second power-leading structure 171 is further described in detail.

[0072] like Figure 4A As shown, the second conducting structure 171 may be a conductive sheet or a conductive column 1710, and the number of the conductive sheet or the conductive column 1710 may include one or more. One or more conductive sheets or conductive columns 1710 are disposed on the circuit board 170 and may be close to the imaging chip 150 mounted on the circuit board 170. The cross-sectional shape of the conductive sheet or conductive column 1710 may be rectangular, circular, polygonal, or any other shape, such as a triangle, an ellipse, etc., and the present application does not impose any specific limitation on this.

[0073] like Figure 4B and Figure 4C As shown, the second conductive structure 171 can also be a conductive ring arranged around the imaging chip, and the cross-sectional shape of the conductive ring (the shape of the inner ring and the outer ring) can be rectangular, circular, elliptical, etc., or any other shape, and the present application does not impose any specific restrictions on this. Figure 4B The conductive ring 1720 shown in FIG. 1 may have a cross-sectional shape that is circular or elliptical, etc. Figure 4C The cross-sectional shape of the conductive ring 1730 shown may be square or rectangular.

[0074] The above-mentioned embodiments provide an anti-static structure and a camera module 100 having an anti-static structure. By means of the anti-static structure inside the housing 120, the static electricity at the end of the lens assembly is conducted to the inside of the module through the metal lens barrel 110, and is guided away by the anti-static structure before approaching the imaging chip 150, thereby playing a role in electrostatic protection. The anti-static structure may be a second power-inducing structure 171, and the second power-inducing structure may include one or more conductive sheets and conductive columns disposed on the upper surface of the circuit board 170, or may be a conductive ring disposed in a full circle around the imaging chip 150. The anti-static structure provided in the above-mentioned embodiments has a simple component structure, does not increase the number of module components, is conducive to reducing module costs, and does not increase the module assembly process, is conducive to improving production efficiency.

[0075] Figure 5 A camera module 100 with an anti-static structure according to another embodiment of the present application is shown.

[0076] like Figure 5 As shown, the camera module 100 of this embodiment may include a housing 160 and a lens assembly, an imaging chip 150, a circuit board 170, etc. assembled in the housing 160. The lens assembly may include a metal lens barrel 110 and at least one lens assembled in the metal lens barrel 110.

[0077] The camera module 100 of this embodiment and Figure 3 The difference between the embodiment shown is that the housing 160 of the camera module 100 is a plastic housing and can be divided into an upper housing 161 and a lower housing 162 .

[0078] In this embodiment, the camera module 100 has an anti-static structure disposed in the housing 120, and the anti-static structure includes a second power-drawing structure 171 disposed on the circuit board 170. The second power-drawing structure 171 has a guide surface facing the metal lens barrel 110, and the guide surface is located between the metal lens barrel 110 and the imaging chip 150. The guide surface can be, for example, the upper surface of the second power-drawing structure 171.

[0079] The second power-leading structure 171 is electrically connected to the circuit board 170, and can be connected to the connector 190 through the circuit board 170, so as to achieve grounding. Specifically, the second power-leading structure 171 can be welded or fixedly connected to the first surface (e.g., the upper surface) of the circuit board 170 by other connection methods. For the specific structure, function, processing and other features of the second power-leading structure 171 of this embodiment, reference can be made to the description in the aforementioned embodiment, which will not be repeated here.

[0080] According to the embodiment of the present application, an anti-static structure and a camera module 100 having the anti-static structure are provided. By means of the anti-static structure inside the shell 160, static electricity at the end of the lens assembly is conducted to the inside of the module through the metal lens barrel 110, and is guided away by the anti-static structure before approaching the imaging chip 150, thereby playing a role in static electricity protection.

[0081] Moreover, the second power-leading structure 171 provided in the above-mentioned embodiment of the present application can be applicable to different types of camera modules with metal lens barrels, and can be applicable to camera modules in which a metal lens barrel and a metal shell are combined, and can also be applicable to camera modules in which a metal lens barrel and a plastic lens barrel are combined, and thus has better compatibility.

[0082] What are introduced above are only a few specific embodiments among the multiple implementation methods that can be implemented in the present application. It can be understood that, as needed, the shell 120 of the camera module 100 can also accommodate other anti-static structures of different numbers and types, and the position, quantity and specific shape of the first power-drawing structure and the second power-drawing structure in the above-mentioned implementation method can be designed according to different usage requirements, and the present application does not impose any restrictions on this.

[0083] In addition, the features described in this application can be implemented in different forms and should not be understood as being limited to the examples described in this application. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. In addition, the specific embodiments are not necessarily limited to the order described, but can be performed in any order or in parallel.

[0084] Finally, it should be noted that the above description is only an implementation method of the present application and an explanation of the technical principles used. Those skilled in the art should understand that without departing from the technical concept, other technical solutions formed by any combination of the above technical features or their equivalent features should also be included in the protection scope involved in the present application. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in the present application to form a technical solution.

Claims

1. An anti-static structure for a camera module, characterized in that: The camera module comprises a housing, a lens assembly and an imaging chip assembled in the housing, wherein the lens assembly comprises a metal lens barrel and at least one lens. The anti-static structure is disposed in the housing, and the anti-static structure has a guide surface facing the metal lens barrel, and the guide surface is located between the metal lens barrel and the imaging chip; The anti-static structure is electrically connected to the conductive element and is connected to the ground terminal through the conductive element.

2. The antistatic structure according to claim 1, characterized in that: The housing has a light-through hole corresponding to the imaging chip, wherein the imaging chip has a photosensitive area and a non-photosensitive area; The anti-static structure is arranged at the light-through hole and corresponds to the non-photosensitive area of ​​the imaging chip.

3. The antistatic structure according to claim 1, characterized in that: The guide surface has a first distance from the first end surface of the metal lens barrel, the imaging chip has a second distance from the first end surface of the metal lens barrel, and the first distance is smaller than the second distance.

4. The antistatic structure according to claim 1, characterized in that: A first distance D1 is formed between the guide surface and the first end surface of the metal lens barrel, and the first distance D1 and a mechanical back focus length FFL of the camera module satisfy the following conditions: 0.3≤D1 / FFL≤0.

98.

5. The antistatic structure according to claim 1, characterized in that: The material of the antistatic structure is selected from any one of copper, aluminum and steel.

6. The antistatic structure according to any one of claims 1 to 5, characterized in that: The conductive element includes the shell, which is a metal shell. The anti-static structure includes a first power-inducing structure disposed on the inner wall of the shell, wherein the first power-inducing structure is electrically connected to the shell and is connected to a ground terminal through the shell.

7. The antistatic structure according to claim 6, characterized in that: The anti-static structure and the housing are an integrated structure or a separate structure.

8. The antistatic structure according to claim 6, characterized in that: The first power-leading structure includes an inwardly protruding conductive plate arranged along the radial direction of the housing.

9. The antistatic structure according to claim 8, characterized in that: The number of the conductive plates is one or more.

10. The antistatic structure according to claim 8, characterized in that: The radial cross-section of the conductive plate is rectangular, arc-shaped or polygonal.

11. The antistatic structure according to claim 6, characterized in that: The first current-leading structure includes an annular conductor that is arranged around the inner periphery of the shell and protrudes inward.

12. The antistatic structure according to claim 11, characterized in that: The inner ring cross-section of the annular conductor is rectangular, circular or elliptical.

13. The antistatic structure according to claim 2, characterized in that: The camera module further includes a circuit board, and the imaging chip is mounted on a first surface of the circuit board; The conductive element includes the circuit board; The anti-static structure includes a second power-leading structure disposed on the first surface of the circuit board, the second power-leading structure is electrically connected to the circuit board, and is connected to a connector connected to the circuit board through the circuit board.

14. The antistatic structure according to claim 13, characterized in that: The second current-drawing structure includes a conductive sheet or a conductive column.

15. The antistatic structure according to claim 14, characterized in that: The cross-sectional shape of the conductive sheet or the conductive column is rectangular, circular, elliptical or polygonal.

16. The antistatic structure according to claim 13, characterized in that: The second power-drawing structure includes a conductive ring disposed around the imaging chip.

17. The antistatic structure according to claim 16, characterized in that: The cross-sectional shape of the conductive ring is rectangular, circular or elliptical.

18. The antistatic structure according to any one of claims 13 to 17, characterized in that: The second current-leading structure is welded, riveted, snapped, locked or fixedly connected to the first surface of the circuit board.

19. The antistatic structure according to any one of claims 13 to 17, characterized in that: The material of the shell is selected from metal or plastic.

20. The antistatic structure according to claim 1, characterized in that: The ground terminal includes a connector in the camera module.

21. A camera module, characterized in that: Comprising the antistatic structure according to any one of claims 1-20.

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