Preparation method of textured structure of crystalline silicon solar cell
A technology for solar cells and crystalline silicon, applied in the field of solar cells, can solve the problems of poor uniformity of nano metal particles, unfavorable coating process, increase environmental protection pressure, etc., and achieve the effects of improving poor appearance, avoiding white spots and contamination, and improving conversion efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2019-03-19
Abstract
Description
technical field
[0001] The invention relates to a method for preparing a textured surface structure of a crystalline silicon solar cell, belonging to the technical field of solar cells. Background technique
[0002] With the wide application of solar cell components, photovoltaic power generation occupies an increasingly important proportion in new energy and has achieved rapid development. Among the current commercialized solar cell products, crystalline silicon (monocrystalline and polycrystalline) solar cells have the largest market share, maintaining a market share of more than 85%.
[0003] At present, in the production process of solar cells, the textured structure on the surface of silicon wafers can effectively reduce the surface reflectance of solar cells, which is one of the important factors affecting the photoelectric conversion efficiency of solar cells. In order to obtain a good textured structure on the surface of crystalline silicon solar cells to achieve a ...
Examples
Embodiment 1
[0045] A method for preparing a textured structure of a crystalline silicon solar cell, comprising the steps of:
[0046] (1) Clean the silicon wafer, then put the silicon wafer into an alkaline solution to remove the damaged layer on the surface of the silicon wafer. The alkaline solution is a NaOH solution with a concentration of 1 to 5 mol / L and a treatment temperature of 20~ 35°C, the processing time is 20~200 seconds;
[0047] (2) Then put the silicon wafer into the acidic solution, and perform isotropic corrosion on the surface of the silicon wafer to reduce the structural difference on different grains;
[0048]The mixed acid solution is a mixed solution containing hydrofluoric acid and nitric acid, wherein the molar ratio of hydrofluoric acid to nitric acid is greater than or equal to 1:5; the treatment temperature is 8-45°C, and the treatment time is 5-250 s;
[0049] (3) Put the silicon wafer into a hydrofluoric acid solution containing an oxidizing agent and a meta...