Addition-curable silicone composition, cured product, optical element

Abstract

The present invention provides an addition-curable silicone composition providing a cured product having high heat discoloration resistance and high sulfuration resistance, and a highly reliable optical element sealed by the cured product. The addition-curable silicone composition includes: (A-1) a branched chain organopolysiloxane represented by the following average composition formula (1), (R 1 3 SiO 1 / 2 ) a (R 2 R 1 2 SiO 1 / 2 ) b (R 2 R 1 SiO) c (R 1 2 SiO) d (R 2 SiO 3 / 2 ) e (R 1 SiO 3 / 2 ) f (SiO 4 / 2 ) g ···(1) The branched organopolysiloxane has at least two siloxane units represented by the following formula (2) in one molecule as (R in the average composition formula (1) 2 R 1 2 SiO 1 / 2 ) unit, [Chemical Formula 1] (A-2) a linear organopolysiloxane represented by the following formula (3): the mass ratio (A-1):(A-2) is 100:0 to 50:50 [Chemical formula 2] (B) an organohydrogenpolysiloxane having at least two siloxane units represented by the following formula (4) in one molecule, [Chemical formula 3] (C) an organohydrogenpolysiloxane containing a platinum group metal Hydrosilylation catalyst.

Description

technical field

[0001] The present invention relates to an addition-curable silicone composition, its cured product, and an optical element sealed by the cured product. Background technique

[0002] A device having a light emitting diode (LED) as an optical semiconductor element generally has a configuration in which the LED mounted on the substrate is sealed with a sealing material made of a transparent resin. Epoxy resins have been used as this encapsulant, but due to the increase in heat generation and the shortening of the wavelength of light due to the recent miniaturization of semiconductor packages and higher brightness of LEDs, cracks and yellowing have occurred in the resin. , leading to a decrease in reliability.

[0003] Therefore, from the viewpoint of heat resistance and heat discoloration resistance, silicone resin compositions are attracting attention as sealing materials, and addition reaction-curable silicone resin compositions can be cured in a short time ...

Examples

Embodiment 1～3、 comparative example 1～3

[0133] The following components were mixed at the blending ratio shown in Table 1 to prepare an addition-curable silicone composition. In addition, in Table 1, a part shows a mass part.

[0134] (A-1) Ingredients:

[0135] (CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3.8 (SiO 2 ) 4.3 branched chain silicone resin

[0136] (A-2) Ingredients:

[0137] (A-2-a)(CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3 Expressed linear silicone oil with a viscosity of 2,000mPa·s

[0138] (A-2-b)(CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 Linear silicone oil represented by SiO) with a viscosity of 240mPa·s

[0139] (A-2-c)(CH 2 =CH(CH 3 ) 2 SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3 Expressed linear silicone oil with a viscosity of 700mPa·s

[0140] (B) Ingredients:

[0141] (B-a) organohydrogenpolysiloxane represented by the following formula (8)

[0142] [chemical formula 14]

[0143]

[0144] In the formula, the arrange...

technical field

[0001] The present invention relates to an addition-curable silicone composition, its cured product, and an optical element sealed by the cured product. Background technique

[0002] A device having a light emitting diode (LED) as an optical semiconductor element generally has a configuration in which the LED mounted on the substrate is sealed with a sealing material made of a transparent resin. Epoxy resins have been used as this encapsulant, but due to the increase in heat generation and the shortening of the wavelength of light due to the recent miniaturization of semiconductor packages and higher brightness of LEDs, cracks and yellowing have occurred in the resin. , leading to a decrease in reliability.

[0003] Therefore, from the viewpoint of heat resistance and heat discoloration resistance, silicone resin compositions are attracting attention as sealing materials, and addition reaction-curable silicone resin compositions can be cured in a short time ...

Examples

Embodiment 1～3、 comparative example 1～3

[0133] The following components were mixed at the blending ratio shown in Table 1 to prepare an addition-curable silicone composition. In addition, in Table 1, a part shows a mass part.

[0134] (A-1) Ingredients:

[0135] (CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3.8 (SiO 2 ) 4.3 branched chain silicone resin

[0136] (A-2) Ingredients:

[0137] (A-2-a)(CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3 Expressed linear silicone oil with a viscosity of 2,000mPa·s

[0138] (A-2-b)(CH 2 =CH(CH 3 )(C 6 h 5 ) SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 Linear silicone oil represented by SiO) with a viscosity of 240mPa·s

[0139] (A-2-c)(CH 2 =CH(CH 3 ) 2 SiO 1 / 2 ) 2 ((C 6 h 5 ) 2 SiO) 3 Expressed linear silicone oil with a viscosity of 700mPa·s

[0140] (B) Ingredients:

[0141] (B-a) organohydrogenpolysiloxane represented by the following formula (8)

[0142] [chemical formula 14]

[0143]

[0144] In the formula, the arrange...

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