A layered capacitive multi-dimensional force sensor

By using a layered structure of measurement layer and deformation layer and a serpentine structure deformed beam in a capacitive multidimensional force sensor, combined with parallel plates and vertical induction capacitors, the accuracy problem caused by the complexity of the capacitive multidimensional force sensor is solved, and the accuracy problem is achieved. Higher measurement accuracy and lower cost.

CN109855774BActive Publication Date: 2024-12-17GUANGXI UNIV
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Patent Information

Application Number
CN201910065266.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-01-23
Publication Date
2024-12-17
Estimated Expiration
2039-01-23

AI Technical Summary

Technical Problem

The main structure of the existing capacitive multi-dimensional force sensor is complex, resulting in low measurement accuracy and cannot meet the high-precision needs of industrial applications.

Method used

The measurement layer and the deformation layer are distributed layered in layers, and fixedly connected through threaded holes. The deformed beam of the serpentine structure transmits load and causes capacitance changes. Combined with parallel plates and vertical induction capacitor dynamic electrodes, multi-dimensional force measurement is achieved.

Benefits of technology

Simplifies the sensor processing process, reduces costs, improves measurement accuracy, and enhances the adaptability and accuracy of the sensor.

✦ Generated by Eureka AI based on patent content.

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    Figure CN109855774B_ABST
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Abstract

The present invention discloses a layered capacitive multi-dimensional force sensor, which consists of a deformation layer and a measuring layer. The deformation layer mainly includes an outer ring of the deformation layer, an inner ring of the deformation layer and a serpentine structure deformation beam. The inner ring of the deformation layer is provided with threaded holes and through holes, which are respectively used to connect the measuring layer and the input shaft. The outer ring of the deformation layer is provided with a countersunk hole for connecting an external load. The measuring layer is provided with a sensor moving electrode part and a measuring inner ring, and the sensor moving electrode part includes a vertical induction capacitor moving electrode part and a parallel plate induction capacitor moving electrode part. The present invention adopts the upper and lower layered distribution of the measuring layer and the deformation layer, and the measuring layer and the deformation layer can use different materials, which makes the sensor easier to process, reduces the production cost, and improves the processing accuracy, thereby improving the sensor measurement accuracy.
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Description

Technical Field

[0001] The invention belongs to the technical field of sensors and relates to a force sensor, in particular to a layered capacitive multi-dimensional force sensor. Background Art

[0002] Multi-dimensional force sensors can measure multi-dimensional force signals in space. As one of the most important sensors for realizing industrial intelligence, they are widely used in mechanical processing, automobile manufacturing, intelligent robots, aerospace and other fields. There are many types of force sensors, which can be divided into strain type, piezoelectric type, piezomagnetic type, optical type and capacitive type according to the way the force signal is generated. At present, the more mature force sensors on the market are mainly electromagnetic and strain type. The essence of the output signal of the electromagnetic force sensor is two angular displacement signals with phase difference. The force information is obtained by combining and processing the signals; the sensor is a wear-free non-contact sensor, but due to its large size, it cannot be used in robots. The strain type has high sensitivity and fast response, but its structure and circuit design are complex, force decoupling is difficult, and an additional A / D converter is required. The strain gauge needs to be precisely pasted, and the strain gauge is easy to damage and is too sensitive to electromagnetic noise.

[0003] Capacitive force sensors have the advantages of good temperature stability, simple structure, strong adaptability, small electrostatic attraction, good dynamic response, and non-contact detection. However, the main structure of the capacitive multi-dimensional force sensor is extremely complex to process, resulting in low precision, which affects the measurement accuracy. Summary of the invention

[0004] The purpose of the present invention is to address the shortcomings of current capacitive multi-dimensional force sensors and propose a layered capacitive multi-dimensional force sensor in which a measuring layer and a deformation layer are distributed in upper and lower layers.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A layered capacitive multi-dimensional force sensor, which is mainly composed of a deformation layer 1 and a measuring layer 2; the deformation layer 1 at least includes a deformation layer outer ring 3, a deformation layer inner ring 4, a serpentine structure deformation beam 5, and an overload protection beam 6; the deformation layer inner ring 4 is provided with a threaded hole 7 and a through hole 8; the measuring layer 2 at least includes a measurement layer inner ring 9, a parallel plate induction capacitor moving electrode part 10, and a vertical induction capacitor moving electrode part 11; the parallel plate induction capacitor moving electrode part 10 and the vertical induction capacitor moving electrode part 11 are both 4 in number, and are uniformly distributed on the outside of the measurement layer inner ring 9. The measurement layer 2 is fixedly connected to the deformation layer inner ring 4 through the threaded hole 7; the serpentine structure deformation beam 5 is distributed in a spoke-like manner along the outside of the deformation layer inner ring 4; the overload protection beam 6 is a cantilever beam connected to the outer edge of the deformation layer inner ring 4, and is uniformly distributed along the outside of the deformation layer inner ring 4, and is used to install an overload protection device.

[0007] The characteristics and beneficial effects of the present invention are:

[0008] The present invention adopts the upper and lower layered distribution of the measuring layer and the deformation layer. The measuring layer and the deformation layer can be made of different materials, which makes the sensor easier to process, reduces the sensor cost, improves the processing accuracy, and thus improves the measurement accuracy of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a three-dimensional exploded view of the present invention;

[0010] Figure 2 is an assembly diagram of the present invention;

[0011] In the attached figure: 1. deformation layer; 2. measurement layer; 3. inner circle of deformation layer; 4. outer circle of deformation layer; 5. serpentine structure deformation beam; 6. overload protection beam; 7. threaded hole; 8. through hole; 9. inner circle of measurement layer; 10. moving electrode part of parallel plate induction capacitor; 11. moving electrode part of vertical induction capacitor. DETAILED DESCRIPTION

[0012] In order to better understand the present invention, exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

[0013] As attached Figures 1 to 2As shown, a layered capacitive multi-dimensional force sensor is mainly composed of a deformation layer 1 and a measuring layer 2; the deformation layer 1 at least includes a deformation layer outer ring 3, a deformation layer inner ring 4, a serpentine structure deformation beam 5, and an overload protection beam 6; the deformation layer inner ring 4 is provided with a threaded hole 7 and a through hole 8; the measurement layer 2 at least includes a measurement layer inner ring 9, a parallel plate induction capacitor moving electrode part 10, and a vertical induction capacitor moving electrode part 11; the number of the parallel plate capacitor moving electrode part 10 and the vertical capacitor moving electrode part 11 are both 4, and are uniformly distributed on the outside of the measurement layer inner ring 9. The measurement layer 2 is fixedly connected to the deformation layer inner ring 4 through the threaded hole 7; the serpentine structure deformation beam 5 is distributed in a wheel-assisted manner along the outside of the deformation layer inner ring 4, one end of which is connected to the inner side of the deformation layer outer ring 3, and the other end is connected to the inner side of the deformation layer inner ring 4; the overload protection beam 6 is a cantilever beam connected to the outer edge of the deformation layer inner ring 4, and is uniformly distributed along the outer side of the deformation layer inner ring 4, for installing an overload protection device. In the figure, the number of the serpentine structure deformation beams 5 is 4, but in the actual production process, the number of the serpentine structure deformation beams 5 can be adjusted according to the size of the elastic force.

[0014] The working process of the present invention is as follows: the inner circle 4 of the deformation layer is subjected to an external load, which is transmitted to the outer circle 3 of the deformation layer through the serpentine structure deformation beam 5. During the transmission process, the serpentine structure deformation beam 5 is deformed to cause a slight deflection of the measuring layer 2, thereby causing the pole pitch of the capacitor to change, causing the capacitance value of the capacitor to change. The change value of the capacitance is collected by the detection circuit, and finally the force in each direction is calculated by the corresponding decoupling formula.

[0015] Finally, it should be noted that the above are only preferred embodiments of the present invention, and the present invention is not limited to the above embodiments, and various modifications or variations can be made. Therefore, the description and drawings should be considered illustrative rather than restrictive. All equivalent technical changes studied by applying the principles of the present invention are included in the patent scope of the present invention.

Claims

1. A layered capacitive multi-dimensional force sensor, characterized in that: The invention comprises at least a deformation layer (1) and a measuring layer (2); the deformation layer (1) comprises at least a deformation layer outer ring (3), a deformation layer inner ring (4), a serpentine structure deformation beam (5), and an overload protection beam (6); the deformation layer inner ring (4) is provided with a threaded hole (7) and a through hole (8); the measurement layer (2) is fixedly connected to the deformation layer inner ring (4) through the threaded hole (7); one end of the serpentine structure deformation beam (5) is connected to the inner side of the deformation layer outer ring (3), and the other end is connected to the outer side of the deformation layer inner ring (4); the overload protection beam (6) is a cantilever beam connected to the outer edge of the deformation layer inner ring (4), and is used for installing an overload protection device; the measurement layer (2) and the deformation layer (1) are arranged in a split structure with upper and lower layers, and the measurement layer (2) and the deformation layer (1) are made of different materials.

2. A layered capacitive multi-dimensional force sensor according to claim 1, characterized in that: The measuring layer (2) comprises at least a measuring layer inner ring (9), a parallel plate induction capacitor moving electrode portion (10), and a vertical induction capacitor moving electrode portion (11); the parallel plate induction capacitor moving electrode portion (10) is located above the overload protection beam (6), and the vertical induction capacitor moving electrode portion (11) is located above the serpentine structure deformation beam (5).

Citation Information

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