An electronic component that overheats and detaches

Abstract

The invention discloses an overheated detached electronic component, which utilizes a cavity composed of an electronic ceramic component, an insulating medium and a reed. The reed forms electrical contact with the surface of the electronic ceramic component through vacuum adsorption or low-temperature soldering. At this time, the reed is in a bent state. When the electronic component is overheated due to circuit abnormality or failure of the electronic ceramic component, the vacuum leaks or the low-temperature solder melts. At this time, the reed relies on its own elastic force or negative pressure to flip over and automatically detach from the surface of the electronic ceramic component, so that the electronic component is disconnected and prevented from catching fire.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and more particularly to an overheated detached electronic component. Background Art

[0002] At present, circuit electronic technology is developing rapidly, and electronic components are widely used. There are protection elements in the circuit to protect the circuit when overvoltage or overcurrent occurs. The most commonly used protection devices are components such as varistors and thermistors.

[0003] However, when overvoltage or overcurrent occurs in the circuit, the protection device will generate high temperature while playing a protective role, which may cause the insulating medium of the protection device to catch fire and burn, causing the circuit to burn.

[0004] Therefore, how to enable electronic components serving as protection devices to achieve overheating protection is a problem that those skilled in the art need to solve urgently. Summary of the invention

[0005] In view of this, the present invention provides an electronic component that disengages upon overheating, wherein a cavity is formed by a ceramic medium, an insulating medium and a reed, and electrical contact between the reed and the ceramic medium is formed by vacuum adsorption or low-temperature soldering. When an abnormal circuit or failure of the electronic ceramic component causes overheating, the vacuum leakage of the electronic component or melting of the low-temperature solder causes the reed to flip over, the component automatically disengages from the circuit, and the reed disengages from the ceramic medium, thereby preventing the electronic component from catching fire.

[0006] In order to achieve the above object, the present invention adopts the following technical solution:

[0007] An electronic component that is detached from overheating comprises: an insulating medium, a ceramic medium and a reed; the reed comprises an upper reed and a lower reed; the lower reed, the ceramic medium and the upper reed are sequentially arranged in the insulating medium in this order; the edges of the upper reed, the ceramic medium and the lower reed are clamped and stopped on the inner side wall of the insulating medium, and the upper reed and the upper surface of the ceramic medium and the lower reed and the lower surface of the ceramic medium form cavities; the upper and lower surfaces of the ceramic medium form an upper surface electrode and a lower surface electrode; the center surface of the upper reed is concave and then fits the upper surface electrode, or the center surface of the upper reed is detached from the upper surface electrode after the electronic component is overheated; the center surface of the lower reed is convex and then fits the lower surface electrode, or the center surface of the lower reed is detached from the lower surface electrode after the electronic component is overheated.

[0008] Preferably, the bottom edge of the insulating medium is provided with a flange structure for clamping the lower spring sheet; a clamping groove with a cross-section of an inverted right-angled triangle is provided on the inner side wall of the insulating medium; the edge of the lower spring sheet is clamped on the horizontal bottom edge, and the upper spring sheet is located below the clamping groove; the electronic component also includes a pressure ring, the cross-sectional shape of the pressure ring is an inverted right-angled trapezoid matching the clamping groove, and the pressure ring is clamped in the clamping groove to fix the upper spring sheet, the ceramic medium and the lower spring sheet in the insulating medium.

[0009] Preferably, the electronic component also includes an insulating coating, an arc-extinguishing medium and a lead; the reed is provided with a solder groove; the insulating coating is coated on the outer edges of the upper surface electrode and the lower surface electrode; the insulating medium includes an upper insulating medium and a lower insulating medium, the upper insulating medium is provided with an upper sealing joint, the lower insulating medium is provided with a lower sealing joint matching with the upper sealing joint, and the upper sealing joint and the lower sealing joint are top-stop-matched and connected; the upper reed and the lower reed are respectively inserted into the upper insulating medium and the lower insulating medium, and the leads are connected at the outer edges of the reeds; a tin lead groove is provided on the inner side wall of the lower insulating medium between the lower reed and the lower surface electrode; the cavity is filled with an arc-extinguishing medium.

[0010] Preferably, the electronic component also includes the insulating coating, the leads and the heat shrink tubing; the insulating medium is silicone rubber, including an upper insulating medium and a lower insulating medium; the upper insulating medium and the lower insulating medium are respectively embedded in the upper spring sheet and the lower spring sheet, and the leads are connected at the outer edges of the spring sheets; the outer edges of the upper surface electrode and the lower surface electrode are coated with the insulating coating; the upper insulating medium is provided with an upper sealing joint, and the lower insulating medium is provided with a lower sealing joint matching with the upper sealing joint, the upper sealing joint and the lower sealing joint are top-stop matched and connected, and fixed at the connection point with the heat shrink tubing; the cavity is a vacuum environment.

[0011] Preferably, the insulating medium is the inner electrode of the electronic component, and the reed is the outer electrode of the electronic component. The inner electrode can be made of a variety of conductive materials, and the outer electrode is made of elastic conductive material or memory metal to form the reed.

[0012] Preferably, when the electronic component fails due to overheating, the reed is flipped and separated from the upper surface electrode and / or the lower surface electrode by elastic force or negative pressure.

[0013] Preferably, the insulating medium is polytetrafluoroethylene material.

[0014] Preferably, the arc extinguishing medium is SF6 or a gas generating agent; the reed is pressed together, and when the reed is attached to the surface of the ceramic medium, the low-temperature solder is added from the solder tank and heated until the low-temperature solder melts. After cooling, the low-temperature solder solidifies, and the upper reed is attached to the upper surface electrode, and the lower reed is attached to the lower surface electrode; when the circuit is abnormal or the electronic component fails, the ceramic medium is heated and the low-temperature solder melts, the upper reed is separated from the upper surface electrode, and the lower reed is separated from the lower surface electrode.

[0015] Preferably, the edge of the upper reed of the upper insulating medium is embedded in the upper sealing joint, and the edge of the lower reed of the lower insulating medium is embedded in the lower sealing joint; after heating and evacuation in a vacuum furnace, the vacuum is released and the negative pressure is attracted, the upper reed adheres to the upper surface electrode, and the lower reed adheres to the lower surface electrode; when the circuit is abnormal or the electronic component fails, the ceramic medium is heated, high-temperature gas escapes or the negative pressure fails, the upper reed detaches from the upper surface electrode, and the lower reed detaches from the lower surface electrode. The inner electrode has no weldability requirements, and aluminum electrodes can be directly used without secondary printing of silver, copper, etc., thereby reducing costs; the embedding range of the reed extends to the upper sealing joint and the lower sealing joint, increasing the wrapping range of the reed, making full use of the metal's small leakage of vacuum gas, and can ensure the vacuum environment in the electronic component and extend the life of the electronic component.

[0016] It can be known from the above technical scheme that compared with the prior art, the present invention discloses an electronic component that is detached due to overheating, and a cavity is formed by using a ceramic medium, an insulating medium and a reed, and an electrical contact is formed between the reed and the ceramic medium by vacuum adsorption or low-temperature soldering. When the circuit is abnormal or the electronic ceramic component fails and causes overheating, the vacuum leakage of the electronic component or the melting of the low-temperature solder causes the reed to flip over, and the component automatically detaches from the circuit, and the reed detaches from the ceramic medium, thereby preventing the electronic component from catching fire. The present invention has a simple structure and is convenient to process. The upper and lower surfaces of the insulating medium are hollowed out, so that the failure of the electronic component can be visually observed. The external placement of the reed makes the heat dissipation area large, the ability to pass large currents is strong, and the product has high heat resistance. When the electronic component of the present invention is welded as a whole machine, a clamping method can be used to prevent processing failure caused by melting of low-temperature solder due to reflow soldering. The cavity can accommodate low-temperature solder to avoid problems such as tin splashing causing short circuits in other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0018] Figure 1 The accompanying drawing is a schematic diagram of the structure of the simple overheating release electronic component provided by the present invention before assembly;

[0019] Figure 2 The accompanying drawing is a schematic diagram of the working state structure of the simple overheating separation electronic component provided by the present invention;

[0020] Figure 3 The accompanying drawing is a schematic diagram of the structure of the simple overheating-disconnected electronic component after failure provided by the present invention;

[0021] Figure 4 The accompanying drawing is a schematic diagram of the structure of the solder connection type overheating separation electronic component before assembly provided by the present invention;

[0022] Figure 5 The accompanying drawing is a schematic diagram of the working state structure of the solder connection type overheating separation electronic component provided by the present invention;

[0023] Figure 6 The accompanying drawing is a schematic diagram of the structure of a solder-connected overheated electronic component after failure provided by the present invention;

[0024] Figure 7 The accompanying drawing is a schematic diagram of the structure of the vacuum adsorption type overheating separation electronic component before assembly provided by the present invention;

[0025] Figure 8 The accompanying drawing is a schematic diagram of the working state structure of the vacuum adsorption type overheating separation electronic component provided by the present invention;

[0026] Fig. 9 The accompanying drawing is a schematic diagram of the structure of the vacuum adsorption type overheated detached electronic component after failure provided by the present invention.

[0027] 1-insulating medium, 11-upper insulating medium, 111-upper sealing joint, 12-lower insulating medium, 121-lower sealing joint, 13-tinning bath, 2-ceramic medium, 21-upper surface electrode, 22-lower surface electrode, 31-upper reed, 32-lower reed, 33-soldering bath, 4-cavity, 5-card slot, 6-pressure ring, 7-insulating coating, 8-lead wire, 9-heat shrink tubing. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The embodiment of the present invention discloses an electronic component that is detached from overheating, comprising: an insulating medium 1, a ceramic medium 2 and a reed; the reed comprises an upper reed 31 and a lower reed 32; the lower reed 32, the ceramic medium 2 and the upper reed 31 are sequentially arranged in the insulating medium 1; the edges of the upper reed 31, the ceramic medium 2 and the lower reed 32 are clamped and stopped on the inner wall of the insulating medium 1, and the upper reed 31 and the upper surface of the ceramic medium 2 and the lower reed 32 and the lower surface of the ceramic medium 2 form a cavity 4; the upper and lower surfaces of the ceramic medium 2 form an upper surface electrode 21 and a lower surface electrode 22; the center surface of the upper reed 31 is concave and then adheres to the upper surface electrode 21, or the center surface of the upper reed 31 is detached from the upper surface electrode 21 after the electronic component is overheated; the center surface of the lower reed 32 is convex and then adheres to the lower surface electrode 22, or the center surface of the lower reed 32 is detached from the lower surface electrode 22 after the electronic component is overheated.

[0030] In order to further optimize the above technical solution, the bottom edge of the insulating medium 1 is provided with a flange structure for clamping the lower spring leaf 32; a clamping groove 5 with a cross-section of an inverted right-angled triangle is provided on the inner side wall of the insulating medium 1; the edge of the lower spring leaf 32 is clamped on the horizontal bottom edge, and the upper spring leaf 31 is located below the clamping groove 5; the electronic component also includes a pressure ring 6, the cross-sectional shape of the pressure ring 6 is an inverted right-angled trapezoid that matches the clamping groove 5, and the pressure ring 6 is clamped in the clamping groove 5 to fix the upper spring leaf 31, the ceramic medium 2 and the lower spring leaf 32 in the insulating medium 1.

[0031] In order to further optimize the above technical scheme, the electronic component also includes an insulating coating 7, an arc-extinguishing medium and a lead 8; the reed is provided with a solder groove 33; the outer edges of the upper surface electrode 21 and the lower surface electrode 22 are coated with an insulating coating 7; the insulating medium 1 includes an upper insulating medium 11 and a lower insulating medium 12, the upper insulating medium 11 is provided with an upper sealing joint 111, and the lower insulating medium 12 is provided with a lower sealing joint 121 matching the upper sealing joint 111, and the upper sealing joint 111 and the lower sealing joint 121 are connected by top stop fitting; the upper reed 31 and the lower reed 32 are respectively inserted into the upper insulating medium 11 and the lower insulating medium 12, and the leads 8 are connected at the outer edges of the reeds; a tin lead groove 13 is provided on the inner side wall of the lower insulating medium 12 between the lower reed 32 and the lower surface electrode 22; the cavity 4 is filled with the arc-extinguishing medium.

[0032] In order to further optimize the above technical solution, the electronic component also includes an insulating coating 7, a lead 8 and a heat shrink tube 9; the insulating medium 1 is silicone rubber, including an upper insulating medium 11 and a lower insulating medium 12; the upper insulating medium 11 and the lower insulating medium 12 are respectively embedded in the upper spring 31 and the lower spring 32, and the leads 8 are connected at the outer edges of the springs; the outer edges of the upper surface electrode 21 and the lower surface electrode 22 are coated with an insulating coating 7; the upper insulating medium 11 is provided with an upper sealing joint 111, and the lower insulating medium 12 is provided with a lower sealing joint 121 that matches the upper sealing joint 111, the upper sealing joint 111 and the lower sealing joint 121 are top-stop matched and connected, and are fixed at the connection with a heat shrink tube 9; the cavity 4 is a vacuum environment.

[0033] In order to further optimize the above technical solution, the insulating medium 1 is the inner electrode of the electronic component, and the reed is the outer electrode of the electronic component. The inner electrode can be made of a variety of conductive materials, and the outer electrode is made of elastic conductive material or memory metal to form a reed.

[0034] In order to further optimize the above technical solution, when the electronic component fails due to overheating, the reed is flipped and separated from the upper surface electrode 21 and / or the lower surface electrode 22 by elastic force or negative pressure.

[0035] In order to further optimize the above technical solution, the insulating medium 1 is made of polytetrafluoroethylene material.

[0036] In order to further optimize the above technical solution, the arc extinguishing medium is SF6 or a gas generating agent; the reed is pressed together, and when the reed is attached to the surface of the ceramic medium 2, low-temperature solder is added from the solder tank 33, and the low-temperature solder is heated until it melts. After cooling, the low-temperature solder solidifies, and the upper reed 31 is attached to the upper surface electrode 21, and the lower reed 32 is attached to the lower surface electrode 22; when the circuit is abnormal or the electronic component fails, the ceramic medium 2 is heated and the low-temperature solder melts, the upper reed 31 is separated from the upper surface electrode 21, and the lower reed 32 is separated from the lower surface electrode 22.

[0037] In order to further optimize the above technical solution, the edge of the upper reed 31 of the upper insulating medium 11 is embedded in the upper sealing joint 111, and the edge of the lower reed 32 of the lower insulating medium 12 is embedded in the lower sealing joint 121; after heating and evacuation in a vacuum furnace, the vacuum is released and the negative pressure is sucked in, the upper reed 31 is attached to the upper surface electrode 21, and the lower reed 32 is attached to the lower surface electrode 22; when the circuit is abnormal or the electronic component fails, the ceramic medium 2 is heated, the high temperature escapes gas or the negative pressure fails, the upper reed 31 is separated from the upper surface electrode 21, and the lower reed 32 is separated from the lower surface electrode 22. There is no weldability requirement for the internal electrode, and aluminum electrodes can be directly used without the need for secondary printing of silver, copper, etc., thereby reducing costs; the embedding range of the reed extends to the upper sealing joint 111 and the lower sealing joint 121, which increases the wrapping range of the reed, fully utilizing the characteristics of metal with low leakage of vacuum gas, which can ensure the vacuum environment in the electronic component and extend the life of the electronic component.

[0038] In order to further optimize the above technical solution, the upper insulating medium 11 and the lower insulating medium 12 are annular structures, so that the state of the reed can be visually observed and whether the electronic component is in a normal working state can be directly observed.

[0039] In order to further optimize the above technical solution, the overheated detached electronic component provided by the present invention can be applied to a varistor or thermistor for realizing overcurrent and overvoltage protection.

[0040] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0041] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic component that overheats and detaches, It is characterized in that include: An insulating medium (1), a ceramic medium (2) and a spring; the spring comprises an upper spring (31) and a lower spring (32); the lower spring (32), the ceramic medium (2) and the upper spring (31) are arranged in the insulating medium (1) in this order; the edges of the upper spring (31), the ceramic medium (2) and the lower spring (32) are clamped and stopped on the inner side wall of the insulating medium (1); the upper spring (31) and the upper surface of the ceramic medium (2) and the lower spring (32) and the ceramic medium are connected to each other. (2) are provided with cavities (4); the upper and lower surfaces of the ceramic medium (2) form an upper surface electrode (21) and a lower surface electrode (22); the center surface of the upper layer spring sheet (31) is concave and then abuts against the upper surface electrode (21), or the center surface of the upper layer spring sheet (31) is separated from the upper surface electrode (21) after the electronic component is overheated; the center surface of the lower layer spring sheet (32) is convex and then abuts against the lower surface electrode (22), or the center surface of the lower layer spring sheet (32) is separated from the lower surface electrode (22) after the electronic component is overheated.

2. An overheated detached electronic component according to claim 1, It is characterized in that The bottom edge of the insulating medium (1) is provided with a flange structure for clamping the lower layer spring sheet (32); the inner side wall of the insulating medium (1) is provided with a clamping groove (5) with a cross section in the shape of an inverted right triangle; the edge of the lower layer spring sheet (32) is clamped on the horizontal bottom edge, and the upper layer spring sheet (31) is located below the clamping groove (5); the electronic component also includes a pressure ring (6), the cross section of the pressure ring (6) is an inverted right trapezoid that matches the clamping groove (5), and the pressure ring (6) is clamped in the clamping groove (5) to fix the upper layer spring sheet (31), the ceramic medium (2) and the lower layer spring sheet (32) in the insulating medium (1).

3. An overheated detached electronic component according to claim 1, It is characterized in that The electronic component further comprises an insulating coating (7), an arc extinguishing medium and a lead (8); the reed is provided with a solder groove (33); the outer edges of the upper surface electrode (21) and the lower surface electrode (22) are coated with the insulating coating (7); the insulating medium (1) comprises an upper insulating medium (11) and a lower insulating medium (12); the upper insulating medium (11) is provided with an upper sealing joint (111), and the lower insulating medium (12) is provided with a lower sealing joint matching the upper sealing joint (111). (121), the upper sealing joint (111) and the lower sealing joint (121) are connected in a stop-fitting manner; the upper spring sheet (31) and the lower spring sheet (32) are respectively inserted into the upper insulating medium (11) and the lower insulating medium (12), and the lead wire (8) is connected at the outer edge of the spring sheet; a tin lead groove (13) is provided on the inner side wall of the lower insulating medium (12) between the lower spring sheet (32) and the lower surface electrode (22); and the cavity (4) is filled with an arc extinguishing medium.

4. An overheated detached electronic component according to claim 1, It is characterized in that The electronic component further comprises an insulating coating (7), a lead wire (8) and a heat shrinkable tube (9); the insulating medium (1) is silicone rubber, comprising an upper insulating medium (11) and a lower insulating medium (12); the upper insulating medium (11) and the lower insulating medium (12) are respectively embedded in the upper spring sheet (31) and the lower spring sheet (32), and are connected to the lead wire (8) at the outer edges of the spring sheets; the outer edges of the upper surface electrode (21) and the lower surface electrode (22) are coated with the insulating coating (7); the upper insulating medium (11) is provided with an upper sealing joint (111), and the lower insulating medium (12) is provided with a lower sealing joint (121) matched with the upper sealing joint (111); the upper sealing joint (111) and the lower sealing joint (121) are connected by a stop-matching manner and are fixed at the connection point by the heat shrinkable tube (9); the cavity (4) is a vacuum environment.

5. An overheated detached electronic component according to claim 1, It is characterized in that The insulating medium (1) is the inner electrode of the electronic component, and the reed is the outer electrode of the electronic component.

6. An overheated detached electronic component according to claim 1, It is characterized in that When the electronic component fails due to overheating, the reed sheet is turned over and separated from the upper surface electrode (21) and / or the lower surface electrode (22) by means of elastic force or negative pressure.

7. An overheated detached electronic component according to claim 2, It is characterized in that The insulating medium (1) is a polytetrafluoroethylene material.

8. An overheated detached electronic component according to claim 3, It is characterized in that The arc extinguishing medium is SF6 or a gas generating agent; the reed is pressed together, and when the reed is attached to the surface of the ceramic medium (2), low-temperature solder is added from the solder tank (33), heated until the low-temperature solder melts, and the low-temperature solder solidifies after cooling, the upper reed (31) is attached to the upper surface electrode (21), and the lower reed (32) is attached to the lower surface electrode (22); when the circuit is abnormal or the electronic component fails, the ceramic medium (2) is heated and the low-temperature solder melts, the upper reed (31) is separated from the upper surface electrode (21), and the lower reed (32) is separated from the lower surface electrode (22).

9. An overheated detached electronic component according to claim 4, It is characterized in that The edge of the upper reed (31) of the upper insulating medium (11) is embedded in the upper sealing joint (111), and the edge of the lower reed (32) of the lower insulating medium (12) is embedded in the lower sealing joint (121); heating and exhausting in a vacuum furnace, after the vacuum is released, negative pressure is attracted, the upper reed (31) is attached to the upper surface electrode (21), and the lower reed (32) is attached to the lower surface electrode (22); when the circuit is abnormal or the electronic component fails, the ceramic medium (2) is heated, high-temperature gas escapes or the negative pressure fails, the upper reed (31) is separated from the upper surface electrode (21), and the lower reed (32) is separated from the lower surface electrode (22).

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