A plasma generator, device and implementation method

Abstract

The present invention relates to a plasma generator, a device, and an implementation method, and relates to the technical field of air environmental protection, which solves the problem that the power loss of a large resistor is large and the efficiency of plasma generation is reduced. The present invention includes a discharge plate for generating plasma, and the discharge plate includes several layers of substrates, and the several layers of substrates are sequentially defined as a first layer substrate, a second layer substrate, ..., an N-1th layer substrate, and an Nth layer substrate. Adjacent odd layers are connected in parallel to form odd distributed capacitors, and adjacent even layers are connected in parallel to form even distributed capacitors. The odd distributed capacitors and the even distributed capacitors are connected in series to the ion generator power supply circuit. The present invention has the effect of reducing power loss and improving the efficiency of plasma generation.

Description

Technical Field

[0001] The present invention relates to the technical field of air environmental protection, and in particular to a plasma generator and an implementation method thereof. Background Art

[0002] Ordinary air purification can only reduce PM2.5. When removing odors, charcoal bags are mainly used, or fragrances are used to cover up the odor.

[0003] For disinfection, spraying and ozone sterilization are mainly used. Spraying is mainly used in some occasions with high disinfection requirements, and generally needs to be done when no one is around. Ozone disinfection is also used in unmanned occasions, such as deodorizing refrigerators or some unmanned factory workshops.

[0004] When positive ions and negative ions annihilate each other in the air, they release energy, which can decompose most organic matter in the air, and can achieve the effect of removing odors and killing bacteria and viruses. We call these positive and negative ions plasma.

[0005] There are generally two ways to generate traditional plasma.

[0006] The first method uses DC high voltage electricity to generate plasma. A negative ion generator and a positive ion generator are placed at a certain safe distance. Both positive and negative ions use DC high voltage power and generate plasma by ionizing the air.

[0007] The second method uses AC high voltage electricity to generate plasma. Metal wires or metal needles are used as electrodes at both ends of the high voltage, and discharge through a medium (usually glass or air), releasing positive and negative ions alternately at the discharge end to generate plasma.

[0008] The DC high voltage method is inefficient because the positive and negative ions are far apart and the probability of annihilation is low, and a large number of ions are absorbed by the earth and other objects without any effect. At the same time, a large number of ions gather around the discharge needle that generates ions, thereby preventing the generation of new ions, resulting in a low total amount of ions, so the overall efficiency is very low. Therefore, the DC high voltage method is not suitable for actual production and processing.

[0009] By using AC high voltage electricity, positive and negative ions are released simultaneously. The distance between the positive and negative ions is very short, and they are easily annihilated, which greatly improves the efficiency of deodorization and sterilization. However, because the distance between the two ends of the high voltage is close, the breakdown effect of the medium will produce a large breakdown current, thereby producing a large amount of ozone. High concentrations of ozone are harmful to the human body.

[0010] The above-mentioned prior art solutions have the following defects:

[0011] By reducing the discharge current, the generation of ozone can be reduced, so that the discharge is always in the state of ion discharge and lower energy level corona discharge. The discharge current is tens of microamperes, and a large resistor needs to be connected in series in the discharge circuit. However, the large resistor has a large power loss, which reduces the efficiency of plasma generation, and there is still room for improvement. Summary of the invention

[0012] The first object of the present invention is to provide a plasma generator which reduces power loss and improves plasma generation efficiency.

[0013] The above-mentioned object of the present invention is achieved through the following technical solutions:

[0014] A plasma generator comprises a discharge plate for generating plasma, wherein the discharge plate comprises a plurality of substrate layers, wherein the plurality of substrate layers are sequentially defined as a first substrate layer, a second substrate layer, ..., an N-1th substrate layer, and an Nth substrate layer, wherein adjacent odd-numbered layers are connected in parallel with each other in pairs to form odd-numbered distributed capacitors, and adjacent even-numbered layers are connected in parallel with each other in pairs to form even-numbered distributed capacitors, and both the odd-numbered distributed capacitors and the even-numbered distributed capacitors are connected in series to a power supply circuit of the ion generator.

[0015] By adopting the above technical solution, distributed capacitance is generated to replace the use of resistors. At the same time, resistors are energy-consuming components, while capacitors are energy storage components. Therefore, in terms of electrical appliance use, capacitors do not consume electrical energy. Once high-voltage capacitors are used, due to the large size and high price of high-voltage capacitors, in order to reduce the impact of distributed capacitance on discharge, the capacitors must be placed close to the discharge end, which will block the air duct. The distributed capacitance between the substrates reduces the area. The distributed capacitance exists between two conductors that have a voltage difference and are insulated from each other. Therefore, in any circuit, distributed capacitance will be formed between any two insulated conductors that have a voltage difference, thereby reducing power loss and improving the efficiency of plasma generation.

[0016] The present invention is further configured as follows: the substrate is provided with 4 layers, the first layer of the substrate and the third layer of the substrate are connected in parallel through vias to generate a first distributed capacitance, the second layer of the substrate and the fourth layer of the substrate are connected in parallel through vias to generate a second distributed capacitance, and the first distributed capacitance and the second distributed capacitance are connected in series to the ion generator power supply circuit.

[0017] By adopting the above technical solution and using a 4-layer substrate, two groups of distributed capacitors are generated. The two groups of distributed capacitors are connected in parallel to increase the capacitance, and then connected in series to the power supply circuit for use, which is highly practical.

[0018] The present invention is further configured as follows: the first substrate includes a first copper-clad group, a first upper discharge wire, a first lower discharge wire matched with the first upper discharge wire, a first through hole arranged between the first upper discharge wire and the first lower discharge wire, and a first copper-clad sheet;

[0019] The second substrate comprises a second copper clad group, second through holes arranged corresponding to the first through holes, and a second copper clad sheet;

[0020] The third layer substrate includes a third copper clad group, third through holes arranged corresponding to the second through holes, and third copper clad sheets corresponding to the second copper clad sheets one by one;

[0021] The fourth layer substrate includes a fourth copper-clad group corresponding to the second copper-clad group, a fourth upper discharge line, a fourth lower discharge line matched with the fourth upper discharge line, and a fourth through hole arranged between the fourth upper discharge line and the fourth lower discharge line, wherein the fourth lower discharge line is connected to the fourth copper-clad group;

[0022] The first upper discharge wire corresponds to the fourth upper discharge wire in one-to-one correspondence, and the first lower discharge wire corresponds to the fourth lower discharge wire in one-to-one correspondence;

[0023] The first lower discharge line is connected to the second copper-clad group and the fourth copper-clad group, and the first upper discharge line is connected to the second copper-clad sheet, the third copper-clad sheet, and the fourth upper discharge line.

[0024] By adopting the above technical solution, the first copper clad group and the first copper clad sheet are used for conduction, the first upper discharge line and the first lower discharge line are discharged through the first through hole, so as to provide mutual annihilation of positive ions and negative ions, the first substrate and the fourth substrate have the same principle, and the second substrate and the third substrate are connected and connected in parallel with the first substrate or the fourth substrate, so as to increase the size of the distributed capacitance.

[0025] The present invention is further configured to include: an ion detection component for detecting the amount of ions;

[0026] The ion detection component comprises a generating layer for generating plasma and a detecting layer for detecting ions.

[0027] By adopting the above technical solution, plasma is generated through the generating layer, and the amount of plasma is detected through the detecting layer, thereby improving the overall detection accuracy and having strong practicality.

[0028] The present invention is further configured as follows: the ion detection component also includes a reinforcement layer for increasing the amount of plasma generated.

[0029] By adopting the above technical solution, since the amount of plasma generated by the generating layer is limited, an additional reinforcing layer is used to generate plasma, thereby increasing the amount of plasma generated and providing the detecting layer with synchronous detection, thereby improving the accuracy and efficiency of detection.

[0030] The present invention is further configured as follows: the generating layer comprises a first generating plate, a second generating plate, a third generating plate, and a fourth generating plate.

[0031] The first generation plate comprises a first generation copper-clad portion, a first upper generation discharge needle, a first lower generation discharge needle matched with the first upper generation discharge needle, a first generation annihilation hole arranged between the first upper generation discharge needle and the first lower generation discharge needle, a first generation electrode sheet, and a first generation isolation groove arranged between the first generation electrode sheets;

[0032] The second generation plate comprises a second generation copper-clad portion, a second generation annihilation hole arranged corresponding to the first generation annihilation hole, and a second generation isolation groove corresponding to the first generation isolation groove;

[0033] The third generation plate comprises a third generation copper-clad portion, a third generation annihilation hole corresponding to the second generation annihilation hole, and a third generation isolation groove corresponding to the second generation isolation groove;

[0034] The fourth generation plate includes a fourth generation copper-clad portion corresponding to the second generation copper-clad portion, a fourth upper generation discharge needle, a fourth lower generation discharge needle matched with the fourth upper generation discharge needle, a fourth generation annihilation hole arranged between the fourth upper generation discharge needle and the fourth lower generation discharge needle, a fourth generation electrode sheet, and a fourth generation isolation groove arranged between the fourth generation electrode sheets and corresponding to the third generation isolation groove;

[0035] The first copper-clad generating portion is connected to the first lower discharge generating needle and the third copper-clad generating portion, the first generating electrode sheet is connected to the fourth generating electrode sheet, and the first upper discharge generating needle is connected to the fourth upper discharge generating needle;

[0036] The first upper discharge generating needle corresponds to the fourth upper discharge generating needle in one-to-one correspondence, and the first lower discharge generating needle corresponds to the fourth lower discharge generating needle in one-to-one correspondence.

[0037] By adopting the above technical solution, the principle of the generating layer is similar to that of the discharge plate, and the first lower discharge generating needle and the first upper discharge generating needle, and the fourth lower discharge generating needle and the fourth upper discharge generating needle annihilate each other, thereby providing plasma.

[0038] The present invention is further configured to: further include a control component for controlling the ion detection component, wherein the control component obtains preset forward voltage information or reverse voltage information;

[0039] According to the forward voltage information or the reverse voltage information, the generating layer is controlled to form corresponding plasma and the preset blower is controlled to blow the corresponding plasma to the detecting layer;

[0040] The detection layer detects the corresponding plasma concentration and forms corresponding detection current information.

[0041] By adopting the above technical solution and controlling the setting of the components, the forward voltage information and the reverse voltage information are obtained and controlled, making the whole more intelligent and improving the plasma generation efficiency.

[0042] A second object of the present invention is to provide a plasma generator device which reduces power loss and improves plasma generation efficiency.

[0043] The above-mentioned object of the present invention is achieved through the following technical solutions:

[0044] A plasma generator device comprises an upper mounting plate and a lower mounting plate, wherein a plurality of discharge plates are arranged and are equidistantly distributed between the upper mounting plate and the lower mounting plate, wherein the discharge plate is mounted at one end of the upper mounting plate, and a control component is installed at the other end of the upper mounting plate and is arranged between the upper mounting plate and the lower mounting plate, wherein a reinforcement layer, a generating layer, and a detection layer are sequentially installed from the discharge plate to the control component, and the generating layer, the detection layer, and the reinforcement layer are all arranged between the upper mounting plate and the lower mounting plate.

[0045] By adopting the above technical solution, the upper mounting plate and the lower mounting plate are arranged so as to install the discharge plate, the control assembly, the generating layer, the detecting layer and the reinforcing layer, thereby improving the overall integrity and enhancing the practicality.

[0046] The third object of the present invention is to provide a method for realizing a plasma generator, which will reduce power loss and improve the efficiency of plasma generation.

[0047] The above-mentioned object of the present invention is achieved through the following technical solutions:

[0048] A method for realizing a plasma generator, wherein a discharge plate comprises a plurality of substrate layers, wherein the plurality of substrate layers are sequentially defined as a first substrate layer, a second substrate layer, ..., an N-1th substrate layer, and an Nth substrate layer, wherein adjacent odd-numbered layers are connected in parallel with each other in pairs to form odd-numbered distributed capacitors, and adjacent even-numbered layers are connected in parallel with each other in pairs to form even-numbered distributed capacitors, and both the odd-numbered distributed capacitors and the even-numbered distributed capacitors are connected in series to a power supply circuit of an ion generator.

[0049] By adopting the above technical solution, distributed capacitance is generated to replace the use of resistors. At the same time, resistors are energy-consuming components, while capacitors are energy storage components. Therefore, in terms of electrical appliance use, capacitors do not consume electrical energy. Once high-voltage capacitors are used, due to the large size and high price of high-voltage capacitors, in order to reduce the impact of distributed capacitance on discharge, the capacitors must be placed close to the discharge end, which will block the air duct. The distributed capacitance between the substrates reduces the area. The distributed capacitance exists between two conductors that have a voltage difference and are insulated from each other. Therefore, in any circuit, distributed capacitance will be formed between any two insulated conductors that have a voltage difference, thereby reducing power loss and improving the efficiency of plasma generation.

[0050] The present invention is further configured as follows: the control method of the control component is as follows:

[0051] Obtaining preset forward voltage information or reverse voltage information;

[0052] According to the forward voltage information or the reverse voltage information, the generating layer is controlled to form corresponding plasma and the preset blower is controlled to blow the corresponding plasma to the detecting layer;

[0053] The detection layer detects the corresponding plasma concentration and forms corresponding detection current information.

[0054] By adopting the above technical solution and controlling the setting of the components, the forward voltage information and the reverse voltage information are obtained and controlled, making the whole more intelligent and improving the plasma generation efficiency.

[0055] In summary, the beneficial technical effects of the present invention are:

[0056] 1. Reduce power loss and improve plasma generation efficiency;

[0057] 2. Save space and components. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 It is a structural schematic diagram of a plasma generator device.

[0059] Figure 2 It is a schematic diagram of the 4-layer substrate of the discharge plate.

[0060] Figure 3 It is a schematic diagram of the structure of the discharge plate.

[0061] Figure 4 It is a structural diagram of the occurrence layer.

[0062] Figure 5 It is a structural diagram of the reinforcement layer.

[0063] Figure 6 It is a schematic diagram of the structure of the detection layer.

[0064] Figure 7 It is the circuit block diagram of the control component.

[0065] In the figure, 1, control component; 2, discharge plate; 20, first substrate; 201, first copper-clad group; 202, first upper discharge line; 203, first lower discharge line; 204, first through hole; 205, first copper-clad sheet; 21, second substrate; 211, second copper-clad group; 212, second through hole; 213, second copper-clad sheet; 22, third substrate; 221, third copper-clad group; 222, third through hole; 223, third copper-clad sheet; 23, fourth substrate; 231, fourth copper-clad group; 232, fourth upper discharge line; 233, fourth lower discharge line; 234, fourth through hole; 3, ion detection component; 31, generating layer; 311, first generation plate; 3111, first generation copper-clad portion; 3112, first upper generation discharge needle; 3113, first lower generation discharge needle; 3114, first generation annihilation hole; 3115, first generation electrode sheet; 3116, first generation isolation groove; 312, second generation plate; 3121, second generation copper-clad portion; 3122, second generation annihilation hole; 3123, second generation isolation groove; 313, third generation plate; 3131, third generation copper-clad portion; 3132, third generation annihilation hole; 3133, third generation isolation groove; 314, fourth generation plate; 3141, fourth generation copper-clad portion; 314 2. The fourth upper discharge needle; 3143. The fourth lower discharge needle; 3144. The fourth annihilation hole; 3145. The fourth electrode sheet; 3146. The fourth isolation groove; 32. The detection layer; 321. The first detection board; 3211. The first detection copper-clad part; 322. The second detection board; 3221. The first detection copper-clad part; 33. The reinforcement layer; 331. The first reinforcement board; 3311. The first reinforcement copper-clad part; 3312. The first upper reinforcement discharge needle; 3313. The first lower reinforcement discharge needle; 3314. The first reinforcement annihilation hole; 3315. The first reinforcement electrode sheet; 3316. The first reinforcement isolation groove; 332 , second layer reinforcement plate; 3321, second reinforcement copper clad portion; 3322, second reinforcement annihilation hole; 3323, second reinforcement isolation groove; 333, third layer reinforcement plate; 3331, third reinforcement copper clad portion; 3332, third reinforcement annihilation hole; 3333, third reinforcement isolation groove; 334, fourth layer reinforcement plate; 3341, fourth reinforcement copper clad portion; 3342, fourth upper reinforcement discharge needle; 3343, fourth lower reinforcement discharge needle; 3344, fourth reinforcement annihilation hole; 3345, fourth reinforcement electrode sheet; 3346, fourth reinforcement isolation groove; 4, upper mounting plate; 5, lower mounting plate; 61, first via hole; 62, second via hole. DETAILED DESCRIPTION

[0066] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0067] Reference Figure 1 , is a plasma generator device disclosed in the present invention, comprising an upper mounting plate 4, a lower mounting plate 5, a control component 1, an ion detection component 3, and a discharge plate 2. The ion detection component 3 is used to detect the amount of ions and comprises a generating layer 31, a reinforcing layer 33, and a detecting layer 32. The generating layer 31 is used to generate plasma, the detecting layer 32 is used to detect ions, the reinforcing layer 33 is used to increase the amount of plasma generated, and the control component 1 is used to control the ion detection component 3.

[0068] In this embodiment, a 4-layer substrate is preferably used. The first layer of substrate 20 and the third layer of substrate 22 are connected in parallel through vias to generate a first distributed capacitance. The second layer of substrate 21 and the fourth layer of substrate 23 are connected in parallel through vias to generate a second distributed capacitance. The first distributed capacitance and the second distributed capacitance are connected in series to the ion generator power supply circuit. Based on the principle that there is distributed capacitance between layers of the PCB board, 4 layers of conductive layers are made on the 4-layer substrate, and the distributed capacitance between each layer is connected in parallel to form a larger capacitance, which is then connected in series to the discharge circuit. The conductive layers are the first copper clad group 201, the second copper clad group 211, the third copper clad group 221, and the fourth copper clad group 231.

[0069] The upper mounting plate 4, the lower mounting plate 5, the control component 1, the generating layer 31, the reinforcing layer 33, the detecting layer 32, and the discharge plate 2 are all PCB boards, and electronic components are welded on the upper mounting plate 4, the lower mounting plate 5, the control component 1, the generating layer 31, the reinforcing layer 33, the detecting layer 32, and the discharge plate 2. And they are fixed to each other by soldering with solder wire and soldering iron. The welding and fixing methods belong to the common knowledge of those skilled in the art and will not be described in detail here.

[0070] There are several discharge plates 2, and preferably 8 in this embodiment, and the 8 discharge plates 2 are equidistantly distributed and installed between the upper mounting plate 4 and the lower mounting plate 5, and the discharge plate 2, the control component 1, the generating layer 31, the detecting layer 32, and the reinforcing layer 33 are perpendicular to the upper mounting plate 4 and the lower mounting plate 5. The reinforcing layer 33, the generating layer 31, and the detecting layer 32 are installed in sequence from the discharge plate 2 to the control component 1.

[0071] There are mainly ion discharge, corona discharge and spark discharge in air discharge. When the voltage is constant, the discharge mode is determined by the discharge current. Ions are produced from ion discharge to spark discharge. Ozone generally occurs in high-energy corona discharge and spark discharge.

[0072] In order to reduce ozone, the discharge current is reduced so that the discharge is always in the state of ion discharge and corona discharge at a lower energy level. Since the discharge current is very small, only tens of microamperes, the method of connecting a resistor in series in the discharge circuit is generally adopted. However, since a larger resistor is required, the power loss is very large and the efficiency is very low. Because it is AC high voltage, in order to solve the problem of low efficiency, the resistor is replaced with a capacitor. Since the capacitor theoretically does not consume power itself, the efficiency can be greatly improved. However, high-voltage capacitors are large in size and expensive. In order to reduce the influence of distributed capacitance on discharge, the capacitor must be placed close to the discharge end, which will block the air duct. Therefore, a high-insulation material PCB board is used as an ion generator.

[0073] Reference Figure 2 As shown, the plasma generator includes a discharge plate 2 for generating plasma, and the discharge plate 2 includes a plurality of layers of substrates, which are defined in sequence as a first layer of substrate 20, a second layer of substrate 21, ..., an N-1th layer of substrate, and an Nth layer of substrate. Adjacent odd layers are connected in parallel with each other in pairs to form odd distributed capacitors, and adjacent even layers are connected in parallel with each other in pairs to form even distributed capacitors. Both the odd distributed capacitors and the even distributed capacitors are connected in series to the power supply circuit of the ion generator.

[0074] The first copper-clad group 201 and the third copper-clad group 221 are spaced and crossed, and the second copper-clad group 211 and the fourth copper-clad group 231 are spaced and crossed. The first substrate 20 and the third substrate 22 are connected through the first via 61, and the second substrate 21 and the fourth substrate 23 are connected through the second via 62, so that the capacitor formed is connected in series with the discharge line to increase the discharge area, and the first upper discharge line 202 and the first lower discharge line 203 are arranged on one side, and the fourth upper discharge line 232 and the fourth lower discharge line 233 are arranged on the other side, so that both the front and back sides are synchronously annihilated. In this embodiment, 3 groups are used for discharge annihilation, and the number of discharge lines can also be increased or decreased as needed. Electrode A and electrode C are connected to both ends of the high voltage for power on. The method of connecting by vias is common knowledge of those skilled in the art and will not be repeated here.

[0075] Gold is deposited on the first upper discharge wire 202, the first lower discharge wire 203, the fourth upper discharge wire 232, and the fourth lower discharge wire 233 to prevent the discharge electrode from being burned by high voltage discharge, thereby extending the life. Moreover, during discharge, discharge will only be conducted from one point on an electrode, and no discharge will be conducted at other places. Therefore, the first upper discharge wire 202, the first lower discharge wire 203, the fourth upper discharge wire 232, and the fourth lower discharge wire 233 are used. If one place is burned, the distance between the two electrodes will increase, and the distances at other places will be closer, so discharge will be conducted at other places, which can greatly extend the life.

[0076] The PCB board adopts FR-4 grade, and its dielectric 1mm withstand voltage is 35KV. The thickness of each dielectric layer is 0.2mm, and the withstand voltage is 7KV, which is much higher than the actual working voltage of about 2KV, which can ensure safety and will not cause breakdown. After actual measurement, the input power of capacitor discharge is only about 20% of that of resistor discharge under the same plasma amount and discharge number, which greatly improves efficiency and reduces circuit cost.

[0077] Reference Figure 3 As shown, the first substrate 20 includes a first copper clad group 201, a first upper discharge line 202, a first lower discharge line 203 matched with the first upper discharge line 202, a first through hole 204 disposed between the first upper discharge line 202 and the first lower discharge line 203, and a first copper clad sheet 205. The first lower discharge line 203 corresponds to the fourth lower discharge line 233, and the first upper discharge line 202 corresponds to the fourth upper discharge line 232.

[0078] The second substrate 21 includes a second copper clad group 211 , second through holes 212 corresponding to the first through holes 204 , and a second copper clad sheet 213 .

[0079] The third substrate 22 includes a third copper clad group 221 , third through holes 222 corresponding to the second through holes 212 , and third copper clad sheets 223 corresponding to the second copper clad sheets 213 .

[0080] The fourth substrate 23 includes a fourth copper clad group 231 corresponding to the second copper clad group 211 , a fourth upper discharge line 232 , a fourth lower discharge line 233 matching the fourth upper discharge line 232 , and a fourth through hole 234 disposed between the fourth upper discharge line 232 and the fourth lower discharge line 233 . The fourth lower discharge line 233 is connected to the fourth copper clad group 231 .

[0081] The first lower discharge line 203 is connected to the second copper clad group 211 and the fourth copper clad group 231 , and the first upper discharge line 202 is connected to the second copper clad sheet 213 , the third copper clad sheet 223 , and the fourth upper discharge line 232 .

[0082] The four layers of substrates are pressed and fixed to each other. The PCB board can be double-layered, quadruple-layered, etc. The multi-layer manufacturing of the PCB board is common knowledge to those skilled in the art and will not be elaborated here.

[0083] Reference Figure 4 As shown, the generating layer 31 includes a first generating plate 311, a second generating plate 312, a third generating plate 313, and a fourth generating plate 314. The principle of generating plasma by the generating layer 31 is consistent with the principle of the discharge plate 2, and will not be described in detail here. The first generating plate 311, the second generating plate 312, the third generating plate 313, and the fourth generating plate 314 are compositely processed to form a PCB board.

[0084] The first layer of the generating plate 311 includes a first generating copper-clad portion 3111, a first upper generating discharge needle 3112, a first lower generating discharge needle 3113 cooperating with the first upper generating discharge needle 3112, a first generating annihilation hole 3114 arranged between the first upper generating discharge needle 3112 and the first lower generating discharge needle 3113, a first generating electrode sheet 3115, and a first generating isolation groove 3116 arranged between the first generating electrode sheets 3115.

[0085] The second generation plate 312 includes a second generation copper cladding portion 3121 , second generation annihilation holes 3122 corresponding to the first generation annihilation holes 3114 , and second generation isolation grooves 3123 corresponding to the first generation isolation grooves 3116 .

[0086] The third generating plate 313 includes a third generating copper-clad portion 3131 , third generating annihilation holes 3132 corresponding to the second generating annihilation holes 3122 , and third generating isolation grooves 3133 corresponding to the second generating isolation grooves 3123 .

[0087] The fourth generating plate 314 includes a fourth generating copper-clad portion 3141 corresponding to the second generating copper-clad portion 3121, a fourth upper generating discharge needle 3142, a fourth lower generating discharge needle 3143 cooperating with the fourth upper generating discharge needle 3142, a fourth generating annihilation hole 3144 arranged between the fourth upper generating discharge needle 3142 and the fourth lower generating discharge needle 3143, a fourth generating electrode sheet 3145, and a fourth generating isolation groove 3146 arranged between the fourth generating electrode sheets 3145 and corresponding to the third generating isolation groove 3133.

[0088] The first copper-clad portion 3111 is connected to the first lower discharge generating needle 3113 and the third copper-clad portion 3131, the first generating electrode sheet 3115 is connected to the fourth generating electrode sheet 3145, the first upper discharge generating needle 3112 is connected to the fourth upper discharge generating needle 3142, the first upper discharge generating needle 3112 corresponds to the fourth upper discharge generating needle 3142 one-to-one, and the first lower discharge generating needle 3113 corresponds to the fourth lower discharge generating needle 3143 one-to-one.

[0089] Reference Figure 5 As shown, the reinforcing layer 33 includes a first reinforcing plate 331, a second reinforcing plate 332, a third reinforcing plate 333, and a fourth reinforcing plate 334. The principle of generating plasma by the reinforcing layer 33 is consistent with the principle of the discharge plate 2, and will not be described in detail here. The first reinforcing plate 331, the second reinforcing plate 332, the third reinforcing plate 333, and the fourth reinforcing plate 334 are compositely processed to form a PCB board.

[0090] The first reinforcing plate 331 includes a first reinforced copper clad portion 3311, a first upper reinforced discharge needle 3312, a first lower reinforced discharge needle 3313 cooperating with the first upper reinforced discharge needle 3312, a first reinforced annihilation hole 3314 arranged between the first upper reinforced discharge needle 3312 and the first lower reinforced discharge needle 3313, a first reinforced electrode sheet 3315, and a first reinforced isolation groove 3316 arranged between the first reinforced electrode sheets 3315.

[0091] The second reinforcing plate 332 includes a second reinforcing copper cladding portion 3321 , second reinforcing annihilation holes 3322 corresponding to the first reinforcing annihilation holes 3314 , and second reinforcing isolation grooves 3323 corresponding to the first reinforcing isolation grooves 3316 .

[0092] The third reinforcing plate 333 includes a third reinforcing copper cladding portion 3331 , third reinforcing annihilation holes 3332 corresponding to the second reinforcing annihilation holes 3322 , and third reinforcing isolation grooves 3333 corresponding to the second reinforcing isolation grooves 3323 .

[0093] The fourth layer reinforcement plate 334 includes a fourth reinforced copper clad portion 3341 corresponding to the second reinforced copper clad portion 3321, a fourth upper reinforced discharge needle 3342, a fourth lower reinforced discharge needle 3343 cooperating with the fourth upper reinforced discharge needle 3342, a fourth reinforced annihilation hole 3344 arranged between the fourth upper reinforced discharge needle 3342 and the fourth lower reinforced discharge needle 3343, a fourth reinforced electrode sheet 3345, and a fourth reinforced isolation groove 3346 arranged between the fourth reinforced electrode sheet 3345 and corresponding to the third reinforced isolation groove 3333.

[0094] The first reinforced copper clad portion 3311 is connected to the first lower reinforced discharge needle 3313 and the third reinforced copper clad portion 3331, the first upper reinforced discharge needle 3312 is connected to the fourth upper reinforced discharge needle 3342, the first upper reinforced discharge needle 3312 corresponds to the fourth upper reinforced discharge needle 3342 one-to-one, and the first lower reinforced discharge needle 3313 corresponds to the fourth lower reinforced discharge needle 3343 one-to-one.

[0095] Reference Figure 6 As shown, the detection layer 32 includes a first detection board 321 and a second detection board 322. The first detection board 321 and the second detection board 322 are compositely formed into a PCB board. A first detection copper-clad portion 32213211 is provided on the first detection board 321, and a second detection copper-clad portion is provided on the second detection board 322. Electronic components are also welded on the detection board.

[0096] The control component 1 obtains preset forward voltage information or reverse voltage information;

[0097] According to the forward voltage information or the reverse voltage information, the generation layer 31 is controlled to form corresponding plasma and the preset blower is controlled to blow the corresponding plasma to the detection layer 32;

[0098] The detection layer 32 detects the corresponding plasma concentration and forms corresponding detection current information

[0099] Reference Figure 4-6 As shown, the copper connected to electrode X and electrode Y has both positive and negative sides, and is completely exposed without covering with green oil. Electrode Y is connected to an operational amplifier for amplification and then sent to a single-chip microcomputer. Figure 4 The electrodes X and Figure 5 , 6 The electrode X in is connected, Figure 4 The middle electrode Y is surrounded by three plate electrodes X. Figure 5 In the figure, the copper connected to electrode X is only on the front side and is exposed without being covered with green oil.

[0100] When electrode X outputs +12V through the single chip microcomputer to control the ±12V controller, the plasma generated by the ion generator is blown through the space between the three plates by the wind, and the negative ions are absorbed by electrode X, and the positive ions are repelled and absorbed by electrode Y, which generates a positive current to the ground.

[0101] When -12V is input to electrode X, positive ions are absorbed and negative ions are absorbed by electrode Y, which generates a negative current to the ground. The current to the ground from electrode Y is amplified by the operational amplifier and converted into a voltage and sent to the MCU for processing. The MCU can calculate the value of the positive and negative ions based on the voltage change, thereby accurately controlling the amount of ions.

[0102] Figure 6 In the figure, the copper connected to electrode X is only on the reverse side, without green oil. The others are positive components, RC2 and RC1 are thermistors, used to measure temperature, and R3 is a heating resistor, connected to RC1. The power of R3 is fixed. When the wind speed is high, the temperature rise is small, and when the wind speed is low, the temperature rise is high. RC2 measures the normal temperature, and this temperature is compared with the temperature of RC1 to measure the size of the wind speed. According to the size of the wind speed, the MCU can reduce the amount of ions at low wind speeds, and turn it off when the wind stops, so as not to generate ions.

[0103] Reference Figure 7 As shown in the figure, the 12V power supply provides power for the whole machine. The 5V voltage regulator module provides power for the MCU. When a short circuit occurs in the high-voltage part, the short-circuit protection transmits the signal to the MCU through the sampling resistor to provide protection to prevent the danger of high voltage. When the power supply voltage is too high or too low, the overvoltage and undervoltage protection transmits the sampling signal to the MCU for shutdown protection.

[0104] The -12V conversion circuit outputs -12V voltage to the ±12V conversion module through a DC-DC converter. The ±12V conversion module outputs +12V voltage or -12V voltage according to the MCU control. The PWM adjustable power supply is controlled by the MCU to determine how much voltage to output to the high-voltage generator. The high-voltage generator uses the 30KHZ push-pull signal output by the MCU to generate high voltage. The size of the high voltage is controlled by the power output of the PWM adjustable power supply. The higher the voltage, the higher the high voltage.

[0105] The high voltage generator is boosted by a transformer, and the primary and secondary are isolated. The secondary high voltage terminal is connected to the ion plate electrode A and electrode C. Because the high voltage required for the production of positive and negative ions is different, it is greatly affected by temperature and humidity. Generally, negative ions are easier to produce. In order to ensure that the positive and negative ions are of similar size, electrode C is connected to the high voltage to the ground for filtering, and a 102 high voltage capacitor is connected to the ground. This capacitor can make the output ions more stable and ensure that the positive and negative ions are of similar size to form plasma. The specific principle is that when the output of negative ions is high, a large number of negative ions are released through the air, and a positive current to the ground is generated at the secondary end of the transformer. This current charges the capacitor to form a DC positive voltage to the ground. This positive voltage is superimposed on the AC high voltage of the transformer secondary, so that the positive high voltage at the high voltage discharge extreme increases and the negative high voltage decreases, thereby increasing the positive ions and reducing the negative ions until a balance is reached. When the positive ions are high, the situation is just the opposite. When the balance is reached, the number of positive and negative ions is basically the same.

[0106] The signals fed back by the ion plate and the ion sensor integrated board are amplified by the operational amplifier and sent to the MCU for processing. The PWM adjustable power supply voltage is continuously adjusted by measuring the amount of ions, and finally the high voltage is adjusted to control the size of the plasma.

[0107] Wind speed measurement measures the wind speed. When the wind speed decreases or stops, the ion generator is turned off. At the same time, the thermistor on the wind speed measurement can also measure the ambient temperature. When in an extreme environment, the ions are also turned off (such as a car exposed to the sun in summer). Humidity testing uses a humidity sensor to test the ambient humidity. When the humidity is too high, such as above 90% (when taking a shower in the bathroom), it is difficult to generate ions and the plasma efficiency will decrease. At this time, the plasma can be turned off and wait for recovery.

[0108] Based on the same inventive concept, an embodiment of the present invention provides a method for implementing a plasma generator, including a discharge plate 2 including several layers of substrates, which are defined in sequence as a first layer substrate 20, a second layer substrate 21, ..., an N-1th layer substrate, and an Nth layer substrate, and adjacent odd layers are connected in parallel with each other in pairs to form odd distributed capacitors, and adjacent even layers are connected in parallel with each other in pairs to form even distributed capacitors, and the odd distributed capacitors and the even distributed capacitors are both connected in series to the ion generator power supply circuit.

[0109] Based on the same inventive concept, an embodiment of the present invention provides a method for implementing a plasma generator, and the control method of the control component 1 is as follows:

[0110] Obtaining preset forward voltage information or reverse voltage information;

[0111] According to the forward voltage information or the reverse voltage information, the generation layer 31 is controlled to form corresponding plasma and the preset blower is controlled to blow the corresponding plasma to the detection layer 32;

[0112] The detection layer 32 detects the corresponding plasma concentration and forms corresponding detection current information.

[0113] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A plasma generator, characterized in that: The invention comprises a discharge plate (2) for generating plasma, wherein the discharge plate (2) comprises a plurality of layers of substrates, wherein the plurality of layers of substrates are defined in sequence as a first layer of substrate (20), a second layer of substrate (21), ..., an N-1th layer of substrate, and an Nth layer of substrate, wherein two adjacent odd-numbered layers are connected in parallel to form odd-numbered distributed capacitors, and two adjacent even-numbered layers are connected in parallel to form even-numbered distributed capacitors, and both the odd-numbered distributed capacitors and the even-numbered distributed capacitors are connected in series to a power supply circuit of an ion generator; The substrate is provided with four layers, the first substrate (20) and the third substrate (22) are connected in parallel through vias to generate a first distributed capacitance, the second substrate (21) and the fourth substrate (23) are connected in parallel through vias to generate a second distributed capacitance, and the first distributed capacitance and the second distributed capacitance are connected in series to the ion generator power supply circuit; The first layer of substrate (20) comprises a first copper-clad group (201), a first upper discharge wire (202), a first lower discharge wire (203) matched with the first upper discharge wire (202), a first through hole (204) arranged between the first upper discharge wire (202) and the first lower discharge wire (203), and a first copper-clad sheet (205); the second layer of substrate (21) comprises a second copper-clad group (211), a second through hole (212) arranged corresponding to the first through hole (204), and a second copper-clad sheet (213); the third layer of substrate (22) comprises a third copper-clad group (221), a third through hole (222) arranged corresponding to the second through hole (212), and a third copper-clad sheet (223) corresponding one-to-one with the second copper-clad sheet (213); the fourth layer of substrate (23) comprises a second copper-clad group (211), a second through hole (212) arranged corresponding to the first through hole (204), and a second copper-clad sheet (213); The fourth copper-clad group (231) corresponding to the group (211), the fourth upper discharge wire (232), the fourth lower discharge wire (233) matched with the fourth upper discharge wire (232), and the fourth through hole (234) arranged between the fourth upper discharge wire (232) and the fourth lower discharge wire (233), the fourth lower discharge wire (233) is connected to the fourth copper-clad group (231); the first upper discharge wire (202) and the fourth upper discharge wire (232) are in one-to-one correspondence, and the first lower discharge wire (203) and the fourth lower discharge wire (233) are in one-to-one correspondence; the first lower discharge wire (203) is connected to the second copper-clad group (211) and the fourth copper-clad group (231), and the first upper discharge wire (202) is connected to the second copper-clad sheet (213), the third copper-clad sheet (223), and the fourth upper discharge wire (232); It also includes an ion detection component (3) for detecting the amount of ions; the ion detection component (3) includes a generating layer (31) for generating plasma and a detecting layer (32) for detecting ions.

2. A plasma generator according to claim 1, characterized in that: The ion detection component (3) also includes a reinforcement layer (33) for increasing the amount of plasma generated.

3. A plasma generator according to claim 1, characterized in that: The generating layer (31) comprises a first generating plate (311), a second generating plate (312), a third generating plate (313), and a fourth generating plate (314), wherein the first generating plate (311) comprises a first generating copper-clad portion (3111), a first upper generating discharge needle (3112), a first lower generating discharge needle (3113) matched with the first upper generating discharge needle (3112), a first generating annihilation hole (3114) arranged between the first upper generating discharge needle (3112) and the first lower generating discharge needle (3113), a first generating electrode sheet (3115), and a first generating copper-clad portion (3111) arranged at the first generating electrode sheet (3115). The first generating isolation groove (3116) is formed between the first generating electrode sheet (3115); the second generating plate (312) comprises a second generating copper-clad portion (3121), a second generating annihilation hole (3122) arranged corresponding to the first generating annihilation hole (3114), and a second generating isolation groove (3123) corresponding to the first generating isolation groove (3116); the third generating plate (313) comprises a third generating copper-clad portion (3131), a third generating annihilation hole (3132) arranged corresponding to the second generating annihilation hole (3122), and a second generating isolation groove (3123) corresponding to the second generating isolation groove (3123). The fourth generation plate (314) comprises a fourth generation copper-clad portion (3141) corresponding to the second generation copper-clad portion (3121), a fourth upper generation discharge needle (3142), a fourth lower generation discharge needle (3143) matched with the fourth upper generation discharge needle (3142), a fourth generation annihilation hole (3144) arranged between the fourth upper generation discharge needle (3142) and the fourth lower generation discharge needle (3143), a fourth generation electrode sheet (3145), and a fourth generation electrode sheet (3145) arranged between the fourth generation electrode sheet (3145) and connected to the third generation isolation groove (3133). 3) a corresponding fourth generating isolation groove (3146); the first generating copper-clad part (3111) is connected to the first lower generating discharge needle (3113) and the third generating copper-clad part (3131), the first generating electrode sheet (3115) is connected to the fourth generating electrode sheet (3145), and the first upper generating discharge needle (3112) is connected to the fourth upper generating discharge needle (3142); the first upper generating discharge needle (3112) corresponds to the fourth upper generating discharge needle (3142) one by one, and the first lower generating discharge needle (3113) corresponds to the fourth lower generating discharge needle (3143) one by one.

4. A plasma generator according to claim 1, characterized in that: The invention also comprises a control component (1) for controlling the ion detection component (3), wherein the control component (1) obtains preset forward voltage information or reverse voltage information; controls the generation layer (31) to form corresponding plasma according to the forward voltage information or reverse voltage information, and controls the preset fan to blow the corresponding plasma to the detection layer (32); the detection layer (32) detects the corresponding plasma concentration and forms corresponding detection current information.

5. A plasma generator device, characterized in that: The invention comprises an upper mounting plate (4), a lower mounting plate (5), and the discharge plate (2) as claimed in claim 1, wherein the discharge plate (2) is provided with a plurality of discharge plates (2) which are equidistantly distributed between the upper mounting plate (4) and the lower mounting plate (5), the discharge plate (2) is installed at one end of the upper mounting plate (4), and a control component (1) is installed at the other end of the upper mounting plate (4) and between the upper mounting plate (4) and the lower mounting plate (5), and a reinforcing layer (33), a generating layer (31), and a detecting layer (32) are sequentially installed from the discharge plate (2) to the control component (1), and the generating layer (31), the detecting layer (32), and the reinforcing layer (33) are all arranged between the upper mounting plate (4) and the lower mounting plate (5).

6. A method for implementing the plasma generator according to claim 5, characterized in that: The discharge plate (2) comprises a plurality of substrate layers, which are defined in sequence as a first substrate layer (20), a second substrate layer (21), ..., an N-1th substrate layer, and an Nth substrate layer, wherein adjacent odd-numbered layers are connected in parallel with each other in pairs to form odd-numbered distributed capacitors, and adjacent even-numbered layers are connected in parallel with each other in pairs to form even-numbered distributed capacitors, and both the odd-numbered distributed capacitors and the even-numbered distributed capacitors are connected in series to a power supply circuit of an ion generator; The substrate is provided with four layers, the first substrate (20) and the third substrate (22) are connected in parallel through vias to generate a first distributed capacitance, the second substrate (21) and the fourth substrate (23) are connected in parallel through vias to generate a second distributed capacitance, and the first distributed capacitance and the second distributed capacitance are connected in series to the ion generator power supply circuit; The first layer of substrate (20) comprises a first copper-clad group (201), a first upper discharge wire (202), a first lower discharge wire (203) matched with the first upper discharge wire (202), a first through hole (204) arranged between the first upper discharge wire (202) and the first lower discharge wire (203), and a first copper-clad sheet (205); the second layer of substrate (21) comprises a second copper-clad group (211), a second through hole (212) arranged corresponding to the first through hole (204), and a second copper-clad sheet (213); the third layer of substrate (22) comprises a third copper-clad group (221), a third through hole (222) arranged corresponding to the second through hole (212), and a third copper-clad sheet (223) corresponding one-to-one with the second copper-clad sheet (213); the fourth layer of substrate (23) comprises a second copper-clad group (211), a second through hole (212) arranged corresponding to the first through hole (204), and a second copper-clad sheet (213); The invention relates to a fourth copper-clad group (231) corresponding to the group (211), a fourth upper discharge wire (232), a fourth lower discharge wire (233) matched with the fourth upper discharge wire (232), and a fourth through hole (234) arranged between the fourth upper discharge wire (232) and the fourth lower discharge wire (233); the fourth lower discharge wire (233) is connected to the fourth copper-clad group (231); the first upper discharge wire (202) corresponds to the fourth upper discharge wire (232) one by one, and the first lower discharge wire (203) corresponds to the fourth lower discharge wire (233) one by one; the first lower discharge wire (203) is connected to the second copper-clad group (211) and the fourth copper-clad group (231), and the first upper discharge wire (202) is connected to the second copper-clad sheet (213), the third copper-clad sheet (223), and the fourth upper discharge wire (232).

7. The method for implementing a plasma generator according to claim 6, characterized in that: The control method of the control component (1) is as follows: obtaining preset forward voltage information or reverse voltage information; controlling the generation layer (31) to form corresponding plasma according to the forward voltage information or reverse voltage information and controlling the preset fan to blow the corresponding plasma to the detection layer (32); the detection layer (32) detects the corresponding plasma concentration and forms corresponding detection current information.

Images