A carrying device

Abstract

The present invention relates to the field of panel technology, and in particular to a carrying device, wherein a carrying plate is provided, and more than two first supporting points are provided on the surface of a first carrying area of ​​the carrying plate. A substrate contacts the carrying plate through the first supporting points, and the first supporting points play an anti-slip role for the substrate. When the substrate needs to be transferred, the transfer and storage of the substrate are achieved through the transfer of the carrying plate, thereby avoiding the problem of breakage caused by different weights of the substrate and excessive bending exceeding the weight it can bear when switching between product varieties, thereby reducing cost losses.

Description

Technical Field

[0001] The present invention relates to the technical field of panels, and in particular to a bearing device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is recognized by the world today as an industry with greater potential and future prospects than Liquid Crystal Display (LCD). It has many advantages such as self-luminescence, fast response speed, wide viewing angle, wide application range and flexibility. It has broad application prospects in head-mounted displays, mobile display devices and consumer electronic products. The two main parts of the OLED process are evaporation and packaging. There is generally a transmission transition device between the evaporation equipment and the packaging equipment. Due to functional needs, the transmission transition device generally has a cache device to temporarily store the substrate transferred from the upstream evaporation.

[0003] Currently known buffer devices are designed to contact the substrate at multiple points around the periphery, and the middle part usually has no support points. This will cause the substrate to bend significantly after being placed in the buffer device. When the product variety is changed, the weight of the substrate often changes due to design changes or process changes. If the weight of the substrate is too large, it will cause excessive bending and breakage. This buffer device is generally a multi-layer structure. If the glass on the upper layer is broken, it will cause almost all the substrates on the lower layer to break, resulting in huge material waste and cost losses. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a bearing device capable of reducing the bending amount of a substrate placed in a buffer device.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A carrying device, comprising a carrying plate and a substrate, wherein the shape of the carrying plate is adapted to the shape of the substrate, the carrying plate comprises a first carrying area and a non-carrying area, and the substrate comprises a contact area and a non-contact area;

[0007] The first bearing area is arranged corresponding to the contact area and the shape of the first bearing area matches the shape of the contact area. More than two first supporting points are arranged on the surface of the first bearing area, and a distance is arranged between two adjacent first supporting points. The substrate contacts the bearing plate through the first supporting points.

[0008] The non-load-bearing area is arranged correspondingly to the non-contact area, and the shape of the non-load-bearing area is matched with the shape of the non-contact area.

[0009] The beneficial effects of the present invention are:

[0010] By setting a carrying plate, more than two first supporting points are provided on the surface of the first carrying area of ​​the carrying plate. The substrate contacts the carrying plate through the first supporting points. The first supporting points play an anti-slip role for the substrate. When the substrate needs to be transferred, the transfer and storage of the substrate are achieved through the transfer of the carrying plate, thereby avoiding the problem of breakage caused by different weights of the substrate and excessive bending that exceeds the weight it can bear when switching between product varieties, thereby reducing cost losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of a carrying device according to the present invention;

[0012] Figure 2 is a schematic structural diagram of a carrying device according to the present invention;

[0013] Figure 3 is a schematic structural diagram of a carrying device according to the present invention;

[0014] Figure 4 is a schematic structural diagram of a carrying device according to the present invention;

[0015] Figure 5 is a schematic structural diagram of a carrying device according to the present invention;

[0016] Figure 6 is a schematic structural diagram of a carrying device according to the present invention;

[0017] Figure 7 A schematic diagram of a film placing process of a carrier device according to the present invention;

[0018] Figure 8 A schematic diagram of a film placing process of a carrier device according to the present invention;

[0019] Fig. 9 A schematic diagram of a film taking process of a carrier device according to the present invention;

[0020] Description of labels:

[0021] 1. Carrying plate;

[0022] 2. non-bearing area group; 21. first non-bearing area; 211. first non-sub-bearing area; 212. second non-sub-bearing area; 22. second non-bearing area;

[0023] 3. The first support point; DETAILED DESCRIPTION

[0024] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0025] Please refer to Figure 1 , the technical solution provided by the present invention:

[0026] A carrying device, comprising a carrying plate and a substrate, wherein the shape of the carrying plate is adapted to the shape of the substrate, the carrying plate comprises a first carrying area and a non-carrying area, and the substrate comprises a contact area and a non-contact area;

[0027] The first bearing area is arranged corresponding to the contact area and the shape of the first bearing area matches the shape of the contact area. More than two first supporting points are arranged on the surface of the first bearing area, and a distance is arranged between two adjacent first supporting points. The substrate contacts the bearing plate through the first supporting points.

[0028] The non-load-bearing area is arranged correspondingly to the non-contact area, and the shape of the non-load-bearing area is matched with the shape of the non-contact area.

[0029] From the above description, it can be seen that the beneficial effects of the present invention are:

[0030] By setting a carrying plate, more than two first supporting points are provided on the surface of the first carrying area of ​​the carrying plate. The substrate contacts the carrying plate through the first supporting points. The first supporting points play an anti-slip role for the substrate. When the substrate needs to be transferred, the transfer and storage of the substrate are achieved through the transfer of the carrying plate, thereby avoiding the problem of breakage caused by different weights of the substrate and excessive bending that exceeds the weight it can bear when switching between product varieties, thereby reducing cost losses.

[0031] Furthermore, the non-load-bearing area includes more than two non-load-bearing area groups with a square shape, the more than two non-load-bearing area groups are arranged in an array and a second load-bearing area is provided between two adjacent non-load-bearing area groups, more than two second support points are provided on the surface of the second load-bearing area, and a spacing is provided between two adjacent second support points and the spacing is equal.

[0032] Furthermore, each of the non-load-bearing area groups includes four first non-load-bearing areas, and the four first non-load-bearing areas respectively occupy four triangular areas formed by two groups of diagonals of the non-load-bearing area group, and the two groups of diagonals of the non-load-bearing area group constitute the third load-bearing area of ​​the carrying plate. More than two third support points are provided on the surface of the third load-bearing area, and a spacing is provided between two adjacent third support points, and the spacing is equal.

[0033] Furthermore, the four first non-sub-bearing areas each include a first non-sub-bearing area and a second non-sub-bearing area, and a fourth bearing area is provided between the first non-sub-bearing area and the second non-sub-bearing area, a fourth supporting point is provided on the surface of the fourth bearing area, a spacing is provided between two adjacent fourth supporting points, and the spacing is equal, the first non-sub-bearing area is located at the top of the triangular area and the shape of the first non-sub-bearing area is a triangle, the second non-sub-bearing area is located at the bottom of the triangular area and the shape of the second non-sub-bearing area is a trapezoid, and the top is arranged close to the center of the non-bearing area group.

[0034] Furthermore, each of the non-load-bearing area groups includes two second non-load-bearing areas, and the two second non-load-bearing areas respectively occupy two triangular areas formed by one group of diagonals of the non-load-bearing area group, and a fifth load-bearing area is provided between the two second non-load-bearing areas of each non-load-bearing area, and more than two fifth support points are provided on the surface of the fifth load-bearing area, and a spacing is provided between two adjacent fifth support points, and the spacing is equal.

[0035] Furthermore, the thickness of the carrier plate is 0.5-2 mm.

[0036] From the above description, it can be seen that since the spacing between each layer of the cache device is small, the thickness of the carrier plate is set to 0.5-2mm to ensure that the carrier plate and the substrate can be placed just on the sheet placing layer of the cache device when they are transferred to the cache device. Due to the support of the carrier plate, the substrate will not bend, and there will be no fragmentation problems during the transfer and storage process.

[0037] Furthermore, the distance between two adjacent first supporting points is 5-200 mm.

[0038] It can be seen from the above description that the distance between two adjacent first supporting points is set to 5-200 mm, which can stably support the substrate without sliding during the transfer process.

[0039] Furthermore, the first supporting point is a columnar supporting object with a hemispherical shape or a square cross-section, and the material of the first supporting point is resin.

[0040] From the above description, it can be seen that the first support point is a hemispherical or square-cross-section columnar support, and the material of the first support point is resin, which can reduce the sliding between the substrate and the first support point and improve the stability of the substrate and the carrier plate during the transfer process.

[0041] Furthermore, the diameter of the hemispherical first supporting point is 1-5 mm.

[0042] From the above description, it can be seen that the diameter of the hemispherical first support point is 1-5mm, which can ensure the stability of the substrate and the carrier plate during the transfer process while preventing the overall height from being too high, thereby preventing mutual squeezing between layers during storage to cause breakage.

[0043] Furthermore, the non-load-bearing area is a hollow structure.

[0044] From the above description, it can be seen that the non-bearing area is a hollow structure which can reduce its overall weight and the non-contact area of ​​the substrate is used for vapor deposition. When the non-bearing area is set as a hollow structure and the evaporated material is deposited on the non-contact area of ​​the substrate, it will not touch the evaporated material on the non-contact area of ​​the substrate, thereby avoiding damage to the film layer of the substrate.

[0045] Please refer to Figure 1 , Figure 5 and Figure 6 , Embodiment 1 of the present invention is:

[0046] Please refer to Figure 1 , a carrying device, comprising a carrying plate 1 and a substrate 6, wherein the shape of the carrying plate 1 is adapted to the shape of the substrate 6, the carrying plate 1 comprises a first carrying area and a non-carrying area, and the substrate 6 comprises a contact area and a non-contact area;

[0047] The non-bearing area is a hollow structure.

[0048] The thickness of the carrier plate 1 is 0.5-2 mm, and the optimal thickness is determined according to the spacing between the layers of the cache device and the rigidity of the material used for making it. It must basically ensure that the substrate is placed in the cache device without bending.

[0049] The distance between two adjacent first supporting points 3 is 5-200 mm, and the distance between two adjacent first supporting points can be staggered appropriately according to the design of the graphics in the actual panel.

[0050] The first supporting point 3 is a hemispherical or square columnar supporting object, and the material of the first supporting point 3 is resin.

[0051] The diameter of the hemispherical first supporting point 3 is 1-5 mm, and the specific diameter value can be determined according to the spacing and distribution of the first supporting points.

[0052] The first bearing area is arranged corresponding to the contact area and the shape of the first bearing area is adapted to the shape of the contact area. More than two first supporting points 3 are arranged on the surface of the first bearing area, and a distance is arranged between two adjacent first supporting points 3. The substrate 6 contacts the bearing plate 1 through the first supporting points 3.

[0053] The non-load-bearing area is arranged correspondingly to the non-contact area, and the shape of the non-load-bearing area is matched with the shape of the non-contact area.

[0054] The non-load-bearing area includes more than two non-load-bearing area groups 2 with a square shape, and the more than two non-load-bearing area groups 2 are arranged in an array and a second load-bearing area is provided between two adjacent non-load-bearing area groups 2. More than two second supporting points are provided on the surface of the second load-bearing area, and a spacing is provided between two adjacent second supporting points, and the spacing is equal.

[0055] The non-load-bearing area can be composed of four non-load-bearing area groups 2, or only a single non-load-bearing area group 2 is also possible (please refer to the figure of the load-bearing plate 1 of the single non-load-bearing area group 2). Figure 5 and Figure 6 ), or a larger number of non-load-bearing area groups 2, the number of which is adjusted and designed according to the design requirements of the substrate 6.

[0056] The distance between two adjacent second supporting points is 5-200 mm, and the distance between two adjacent second supporting points can be staggered appropriately according to the design of the graphics in the actual panel.

[0057] The second supporting point is a columnar supporting object with a hemispherical shape or a square cross-section, and the material of the second supporting point is resin.

[0058] The diameter of the hemispherical second supporting points is 1-5 mm, and the specific diameter value can be determined according to the spacing and distribution of the second supporting points.

[0059] Please refer to Figure 2 , Embodiment 2 of the present invention is:

[0060] The difference between embodiment 2 and embodiment 1 is that each of the non-load-bearing area groups 2 includes four first non-load-bearing areas 21, and the four first non-load-bearing areas 21 respectively occupy four triangular areas formed by two groups of diagonals of the non-load-bearing area group 2, and the two groups of diagonals of the non-load-bearing area group 2 constitute the third load-bearing area of ​​the carrying plate 1, and more than two third support points are provided on the surface of the third load-bearing area, and a spacing is provided between two adjacent third support points, and the spacing is equal.

[0061] The distance between two adjacent third supporting points is 5-200 mm, and the distance between two adjacent third supporting points can be staggered appropriately according to the design of the graphics in the actual panel.

[0062] The third supporting point is a columnar supporting object with a hemispherical shape or a square cross-section, and the material of the third supporting point is resin.

[0063] The diameter of the hemispherical third supporting point is 1-5 mm, and the specific diameter value can be determined according to the spacing and distribution of the third supporting points.

[0064] Please refer to Figure 3 , Embodiment 3 of the present invention is:

[0065] The difference between embodiment three and embodiment one is that: the four first non-load-bearing areas 21 all include a first non-sub-load-bearing area 211 and a second non-sub-load-bearing area 212, and a fourth load-bearing area is provided between the first non-sub-load-bearing area 211 and the second non-sub-load-bearing area 212, and a fourth support point is provided on the surface of the fourth load-bearing area, and a spacing is provided between two adjacent fourth support points and the spacing is equal, the first non-sub-load-bearing area 211 is located at the top of the triangular area and the shape of the first non-sub-load-bearing area 211 is a triangle, the second non-sub-load-bearing area 212 is located at the bottom of the triangular area and the shape of the second non-sub-load-bearing area 212 is a trapezoid, and the top is arranged close to the center of the non-load-bearing area group 2.

[0066] The distance between two adjacent fourth supporting points is 5-200, and the distance between two adjacent fourth supporting points can be staggered appropriately according to the design of the graphics in the actual panel.

[0067] The fourth supporting point is a columnar supporting object with a hemispherical shape or a square cross-section, and the material of the fourth supporting point is resin.

[0068] The diameter of the hemispherical fourth supporting point is 1-5 mm, and the specific diameter value can be determined according to the spacing and distribution of the fourth supporting points.

[0069] Please refer to Figure 4 , Embodiment 4 of the present invention is:

[0070] The difference between embodiment 4 and embodiment 1 is that each of the non-load-bearing area groups 2 includes two second non-load-bearing areas 22, and the two second non-load-bearing areas 22 respectively occupy two triangular areas formed by one group of diagonals of the non-load-bearing area group 2, and a fifth load-bearing area is provided between the two second non-load-bearing areas 22 of each non-load-bearing area, and more than two fifth support points are provided on the surface of the fifth load-bearing area, and a spacing is provided between two adjacent fifth support points, and the spacing is equal.

[0071] The distance between two adjacent fifth supporting points is 5-200 mm, and the distance between two adjacent fifth supporting points can be staggered appropriately according to the design of the graphics in the actual panel.

[0072] The fifth supporting point is a columnar supporting object with a hemispherical shape or a square cross-section, and the material of the fifth supporting point is resin.

[0073] The diameter of the hemispherical fifth supporting point is 1-5 mm, and the specific diameter value can be determined according to the spacing and distribution of the fifth supporting points.

[0074] Please refer to Figures 7 to 9 A process diagram for placing and taking films;

[0075] Please refer to Figure 7 and Figure 8 , a carrier plate 1 is disposed on the transmission device 5, and a substrate 6 is disposed on the carrier plate 1. When the substrate 6 is to be placed, the carrier plate 1 and the substrate 6 are placed into the buffer device 4 at the same time through the transmission device 5;

[0076] Please refer to Fig. 9 When the substrate 6 is to be taken out, the carrier plate 1 and the substrate 6 are taken out from the buffer device 4 at the same time through the transmission device 5, so that the substrate 6 can be taken and placed without causing the problem of excessive bending of the substrate 6 in the buffer device 4.

[0077] In addition, the number of layers of the cache device 4 can be designed to be multiple layers as required, generally 12-24 layers.

[0078] The material of the carrier plate 1 can be a lightweight material (such as aluminum alloy or carbon fiber, etc.).

[0079] The shape of the non-carrying area of ​​the carrier plate 1 is designed according to the shape requirements of the film layer formed on the non-contact area of ​​the substrate 6 .

[0080] In summary, the present invention provides a carrying device, by setting a carrying plate, with more than two first supporting points on the surface of the first carrying area of ​​the carrying plate, the substrate contacts the carrying plate through the first supporting points, and the first supporting points have an anti-slip effect on the substrate. When the substrate needs to be transferred, the transfer and storage of the substrate are achieved through the transfer of the carrying plate, thereby avoiding the problem of breakage caused by different weights of the substrate and excessive bending that exceeds the weight it bears when switching between product varieties, and can reduce the bending of the traditional substrate by 70%, thereby reducing cost losses.

[0081] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A carrying device, characterized in that: It comprises a carrier plate and a substrate, wherein the shape of the carrier plate matches the shape of the substrate, the carrier plate comprises a first carrier area and a non-carrying area, and the substrate comprises a contact area and a non-contact area; The first bearing area is arranged corresponding to the contact area and the shape of the first bearing area matches the shape of the contact area. More than two first supporting points are arranged on the surface of the first bearing area, and a distance is arranged between two adjacent first supporting points. The substrate contacts the bearing plate through the first supporting points. The non-load-bearing area is arranged correspondingly to the non-contact area, and the shape of the non-load-bearing area is adapted to the shape of the non-contact area; The non-load-bearing area includes more than two square non-load-bearing area groups, the more than two non-load-bearing area groups are arranged in an array, and a second load-bearing area is provided between two adjacent non-load-bearing area groups, and more than two second supporting points are provided on the surface of the second load-bearing area, and a spacing is provided between two adjacent second supporting points, and the spacing is equal; The first supporting point is a hemispherical or square-section columnar supporting object, and the material of the first supporting point is resin; Each of the non-load-bearing area groups includes four first non-load-bearing areas, and the four first non-load-bearing areas respectively occupy four triangular areas formed by two groups of diagonals of the non-load-bearing area group. The two groups of diagonals of the non-load-bearing area group constitute the third load-bearing area of ​​the carrying plate. More than two third support points are provided on the surface of the third load-bearing area, and a spacing is provided between two adjacent third support points, and the spacing is equal.

2. The carrying device according to claim 1, characterized in that: The four first non-sub-carrying areas each include a first non-sub-carrying area and a second non-sub-carrying area, and a fourth carrying area is arranged between the first non-sub-carrying area and the second non-sub-carrying area, a fourth supporting point is arranged on the surface of the fourth carrying area, a spacing is arranged between two adjacent fourth supporting points, and the spacing is equal, the first non-sub-carrying area is located at the top of the triangular area and the shape of the first non-sub-carrying area is a triangle, the second non-sub-carrying area is located at the bottom of the triangular area and the shape of the second non-sub-carrying area is a trapezoid, and the top is arranged close to the center of the non-carrying area group.

3. The carrying device according to claim 1, characterized in that: The thickness of the carrier plate is 0.5-2 mm.

4. The carrying device according to claim 1, characterized in that: The distance between two adjacent first supporting points is 5-200 mm.

5. The carrying device according to claim 1, characterized in that: The diameter of the hemispherical first supporting point is 1-5 mm.

6. The carrying device according to claim 1, characterized in that: The non-bearing area is a hollow structure.

7. A carrying device, characterized in that: It comprises a carrier plate and a substrate, wherein the shape of the carrier plate matches the shape of the substrate, the carrier plate comprises a first carrier area and a non-carrying area, and the substrate comprises a contact area and a non-contact area; The first bearing area is arranged corresponding to the contact area and the shape of the first bearing area matches the shape of the contact area. More than two first supporting points are arranged on the surface of the first bearing area, and a distance is arranged between two adjacent first supporting points. The substrate contacts the bearing plate through the first supporting points. The non-load-bearing area is arranged correspondingly to the non-contact area, and the shape of the non-load-bearing area is adapted to the shape of the non-contact area; The non-load-bearing area includes more than two square non-load-bearing area groups, the more than two non-load-bearing area groups are arranged in an array, and a second load-bearing area is provided between two adjacent non-load-bearing area groups, and more than two second supporting points are provided on the surface of the second load-bearing area, and a spacing is provided between two adjacent second supporting points, and the spacing is equal; The first supporting point is a hemispherical or square-section columnar supporting object, and the material of the first supporting point is resin; Each of the non-load-bearing area groups includes two second non-load-bearing areas, and the two second non-load-bearing areas respectively occupy two triangular areas formed by one group of diagonals of the non-load-bearing area group. A fifth load-bearing area is provided between the two second non-load-bearing areas of each non-load-bearing area, and more than two fifth support points are provided on the surface of the fifth load-bearing area, and a spacing is provided between two adjacent fifth support points, and the spacing is equal.

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