Wet processing equipment and operation method thereof

By designing a wet treatment device using a groove body and a fixing device in the semiconductor packaging process, the problem of uniform wet treatment of large substrates and easy blockage of nozzles is solved, and efficient and reliable wet treatment effect is achieved.

CN110970331BActive Publication Date: 2025-03-04PYXIS CF PTE LTD
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Patent Information

Application Number
CN201911310296.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-10-14
Filing Date
2019-12-18
Publication Date
2025-03-04
Estimated Expiration
2039-12-18

AI Technical Summary

Technical Problem

In semiconductor packaging processes, existing wet treatment equipment is difficult to achieve uniform wet treatment of large substrates, and nozzles are prone to clogging, resulting in high equipment maintenance and inspection costs.

Method used

A wet treatment device is designed, adopting a combination of a groove body and a fixing device. The substrate is installed on the outside of the side wall of the groove body, and the treatment liquid is evenly distributed on the surface of the substrate through the treatment liquid driving device, avoiding the clogging problem of traditional nozzle structures.

Benefits of technology

The uniform wet treatment of large substrates is achieved, the processing effect and equipment reliability are improved, and the maintenance and inspection costs are reduced.

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Abstract

The present disclosure relates to a wet processing device for wet processing a substrate, the wet processing device comprising: a tank body, suitable for containing a processing liquid, the tank body comprising at least one side wall, the at least one side wall being provided with an opening connecting the inner side and the outer side of the tank body; a fixing device, configured to fix the substrate at the opening of the side wall. The present disclosure also relates to an operation method of the wet processing device, comprising: placing a substrate at the opening of the side wall, and operating the fixing device to fix the substrate; and wet processing the substrate.
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Description

Technical Field

[0001] The present disclosure relates to a wet processing apparatus and an operating method thereof. Background Art

[0002] In semiconductor processing, such as semiconductor packaging, it is necessary to perform wet processing of etching and / or pre-dipping on the substrate. Etching the substrate means applying an etching treatment liquid to the processing surface of the substrate to be processed, for example, the metal layer on the surface of the substrate can be removed, for example, the metal seed layer on the surface of the substrate can be removed, or a rough surface can be formed on the metal layer on the surface of the substrate. Pre-dipping the substrate means applying a pre-dipping treatment liquid to the processing surface of the substrate to be processed, for example, the surface of the substrate can be cleaned, for example, the substrate can be pre-wetted to allow the substrate to better perform subsequent processing steps. Summary of the invention

[0003] The present disclosure proposes a wet processing equipment and an operation method thereof, wherein the wet processing is etching or pre-impregnation processing. The wet processing equipment (i.e., etching-pre-impregnation equipment) has a simple structure and is easy to operate, which helps to improve the processing effect of the wet processing procedure and improve the production efficiency of semiconductor packaging, and is particularly suitable for panel-level semiconductor packaging.

[0004] A brief summary of the disclosure is presented below to provide a basic understanding of some aspects of the disclosure. This disclosure is not an extensive review of the disclosure. It is not intended to identify key or important elements of the disclosure or to describe the scope of the disclosure. The following disclosure only presents some concepts of the disclosure in a simplified form as a preface to the specific embodiments provided below.

[0005] The present disclosure provides a wet processing (i.e., etching or pre-impregnation processing) device for wet processing a substrate, the wet processing device comprising: a trough body, suitable for containing a processing liquid, the trough body comprising at least one side wall, the at least one side wall being provided with an opening connecting the inner side and the outer side of the trough body; a fixing device, configured to fix the substrate at the opening of the side wall.

[0006] According to one embodiment of the present disclosure, the fixing device is disposed on the outside of the trough body, so that the fixing device can be conveniently operated from the outside of the trough body.

[0007] According to one embodiment of the present disclosure, the wet processing equipment includes a substrate mounting plate fixed to the outer side of the side wall, the substrate mounting plate having an opening and a substrate mounting area arranged around the opening, and the position of the opening of the substrate mounting plate corresponds to the position of the opening of the side wall.

[0008] According to one embodiment of the present disclosure, the fixing device is disposed on the substrate mounting plate.

[0009] According to one embodiment of the present disclosure, the fixing device includes at least one clamping member, at least a portion of which is configured to be able to move between a side of the substrate mounting area away from the opening and the substrate mounting area, and to apply pressure toward the substrate mounting area.

[0010] Thus, the fixing device can be constructed in a light-weight manner that is easy to open and close, and the substrate can be fixed to the substrate mounting plate in a manner that is conducive to fluid sealing.

[0011] At least a portion of the clamping member can move between an extended position and a retracted position. In the retracted position, the clamping plate is not located above the substrate mounting area, and the substrate can pass through the space above the substrate mounting area without hindrance, thereby allowing the operation of placing the substrate on the substrate mounting plate or unloading the substrate from the substrate mounting plate to be conveniently performed.

[0012] According to an advantageous embodiment of the present disclosure, the at least one clamping member comprises a plurality of clamping members, and the plurality of clamping members are arranged around the opening of the substrate mounting plate.

[0013] According to another advantageous embodiment of the present disclosure, the fixing device includes a first driving mechanism and a second driving mechanism, the first driving mechanism is configured to drive at least a portion of the clamping member along a first direction so that at least a portion of the clamping member moves from a side of the substrate mounting area away from the opening to the substrate mounting area, the first direction is a direction pointing from a side of the substrate mounting area away from the opening to the substrate mounting area, the second driving mechanism is configured to drive at least a portion of the clamping member along a second direction so that at least a portion of the clamping member applies pressure toward the substrate mounting area, and the second direction is perpendicular to the substrate mounting plate.

[0014] The first drive mechanism and the second drive mechanism of the plurality of clamping members can be connected to a control module, and the control module can operate the plurality of clamping members simultaneously in response to the operator's instructions. This automated implementation method can significantly shorten the fixing operation time and reduce production costs. In addition, compared with manual operation, the fixing operation with the help of the drive mechanism has high repeatability and consistency, thereby ensuring the reliability of the fixing operation and the sealing of the substrate installation.

[0015] According to one embodiment of the present disclosure, the clamping member includes a support plate and a clamping plate, the support plate includes a receiving groove, the clamping plate is inserted into the receiving groove and can slide in the receiving groove along the first direction, the first driving mechanism is configured to drive the clamping plate along the first direction so that the clamping plate extends from the receiving groove and moves from a side of the substrate mounting area away from the substrate mounting area to the substrate mounting area, and the second driving mechanism is configured to drive the clamping plate along the second direction so that the clamping plate applies pressure toward the substrate mounting area.

[0016] According to one embodiment of the present disclosure, the clamping member also includes a connecting plate, which is arranged on the bracket plate and fixedly connected to the first driving mechanism, and the first driving mechanism is configured to drive the connecting plate along a third direction, wherein the third direction is parallel to the substrate mounting plate and perpendicular to the first direction, and the connecting plate includes a cam groove, which extends between the first direction and the third direction and forms an angle greater than 0 degrees and less than 90 degrees with the first direction, and the clamping plate is fixedly provided with a protrusion, which passes through the bracket plate and cooperates with the cam groove, and when the connecting plate is driven by the first driving mechanism to move along the third direction, the protrusion moves in the cam groove along the extension direction of the cam groove, so that the clamping plate slides in the receiving groove of the bracket plate along the first direction.

[0017] According to one embodiment of the present disclosure, the fixing device also includes a pivot shaft connected to the middle part of the bracket plate, and the second driving mechanism is configured to drive the side of the bracket plate along the first direction away from the opening to move along the second direction away from the substrate mounting plate, the bracket plate rotates around the pivot shaft, and the side of the bracket plate along the first direction close to the opening moves along the second direction close to the substrate mounting plate, thereby causing the clamping plate to apply pressure toward the substrate mounting area.

[0018] According to one embodiment of the present disclosure, the clamping plate includes a cantilever portion and a card end, the cantilever portion is suitable for being inserted into the receiving groove of the bracket plate, and the card end extends from one end of the cantilever portion toward the substrate mounting plate and is suitable for applying pressure toward the substrate mounting plate. When the bracket plate is parallel to the substrate mounting plate, the first distance between the pivot axis and the second driving mechanism measured along the first direction is greater than the second distance between the pivot axis and the card end of the clamping plate measured along the first direction. Thus, the force applied by the second driving mechanism can be amplified by the lever principle, so that the fixation of the substrate at the card end of the clamping plate is more stable, thereby strengthening the sealing effect and preventing leakage of the processing liquid during the wet processing process.

[0019] According to one embodiment of the present disclosure, the first distance is twice the second distance.

[0020] According to one embodiment of the present disclosure, the support plate is provided with a guide rail extending along the third direction for guiding the connecting plate to move along the third direction on the support plate.

[0021] According to an embodiment of the present disclosure, the at least one side wall includes a plurality of side walls, and at least two of the plurality of side walls are provided with the openings, so that a plurality of substrates to be processed can be wet processed simultaneously, thereby obtaining several times higher wet processing efficiency.

[0022] According to one embodiment of the present disclosure, the wet processing apparatus further includes a substrate stopper configured to be movable from an outer side of the opening to a middle portion of the opening.

[0023] The substrate stopper may include a support attached to the substrate mounting plate and an arm generally parallel to the substrate mounting plate. The arm may be rotated between an idle position outside the opening and a stop position above the opening in a plane parallel to the substrate mounting plate. Before the wet process begins, the arm may be set in an idle position, in which case the stopper is located outside the opening of the side wall to facilitate the operation of mounting and fixing the substrate to the substrate mounting plate. During the wet process, the arm may be rotated to a stopper position, in which case the stopper is located in the middle of the opening of the side wall and blocks the outside of the substrate to prevent the substrate from deforming under the pressure of the processing liquid inside the tank body.

[0024] According to an embodiment of the present disclosure, the wet processing equipment further includes a cleaning liquid drainage channel located on the bottom wall of the trough body, and the cleaning liquid enters the trough body through the cleaning liquid drainage channel to clean the substrate.

[0025] According to an advantageous embodiment of the present disclosure, the wet processing equipment further comprises a processing liquid driving device located in the tank body and facing the opening, wherein the processing liquid driving device is configured to drive the processing liquid to flow toward the opening.

[0026] As a result, the processing liquid near the substrate can be quickly replenished, so that the temperature, concentration, pH and other parameters of the processing liquid near the substrate can be kept consistent, and other chemical components can be evenly dispersed, so that the properties of the substrate after etching or pretreatment process are uniform and stable, thereby improving the quality of wet processing.

[0027] According to an embodiment of the present disclosure, the processing liquid driving device is mounted to the side wall having the opening. Due to this configuration, the movement process of the processing liquid driving device can be realized in a more stable manner and allows accurate control of the distance from the processing liquid driving device to the substrate to be processed.

[0028] According to one embodiment of the present disclosure, the distance between the treatment liquid driving device and the side wall having the opening is in the range of 2 mm to 4 mm. The arrangement of the treatment liquid driving device close to the side wall having the opening allows a more uniform treatment effect to be obtained.

[0029] According to one embodiment of the present disclosure, the treatment liquid driving device includes a plurality of blades, which are arranged in a plane parallel to the side wall having the opening and are configured to be movable in a plane parallel to the side wall having the opening.

[0030] According to one embodiment of the present disclosure, the treatment liquid driving device includes a sprocket, a plurality of blades attached to the sprocket, a driving shaft and a supporting shaft. The sprocket is driven by the driving shaft to move circumferentially around the driving shaft and the supporting shaft, and the sprocket drives the plurality of blades to move in a directional manner.

[0031] The treatment liquid driving device adopts a blade structure, avoids the use of a nozzle structure, eliminates the problem of nozzle clogging, and reduces the need for equipment maintenance and inspection.

[0032] According to another embodiment of the present disclosure, the treatment liquid driving device includes a plurality of nozzles, which are arranged in an array in a plane parallel to the side wall having the opening and are configured to spray the treatment liquid toward the side wall having the opening, and the nozzles are configured to be able to move in a plane parallel to the side wall having the opening.

[0033] According to one embodiment of the present disclosure, the wet processing equipment further includes at least one seal, which is disposed in at least one of the following areas: an area of ​​the substrate mounting plate surrounding the opening and an area of ​​the sidewall having the opening surrounding the opening.

[0034] According to one embodiment of the present disclosure, the position where the clamping end of the clamping plate applies pressure toward the substrate mounting plate at least partially overlaps with the position of the sealing member in a direction perpendicular to the substrate mounting plate. Thus, the sealing effect of the sealing member can be improved due to the pressure acting on the sealing member, thereby preventing leakage of the processing liquid during the wet processing process.

[0035] According to an embodiment of the present disclosure, the clamping plate may include a plurality of clamping ends, and the positions where the plurality of clamping ends apply pressure toward the substrate mounting plate at least partially overlap with the position of the sealing member in a direction perpendicular to the substrate mounting plate, thereby further improving the sealing effect.

[0036] The present disclosure also provides an operating method for operating the wet processing equipment, comprising:

[0037] Placing a substrate outside the side wall and at the opening, and operating the fixing device to fix the substrate; and performing a wet process on the substrate.

[0038] According to an embodiment of the present disclosure, placing the substrate at the opening of the side wall and operating the fixing device to fix the substrate includes: operating the fixing device to fix the substrate to the substrate mounting plate.

[0039] According to one embodiment of the present disclosure, the wet processing of the substrate includes:

[0040] The processing liquid driving device is used to drive the processing liquid to flow toward the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 is an overall schematic diagram of a wet processing device according to an embodiment of the present disclosure;

[0042] Figure 2 is a perspective view of a tank body according to an embodiment of the present disclosure;

[0043] Figure 3 yes Figure 1 A cross-sectional view of a wet processing equipment;

[0044] Figure 4 is a schematic diagram of a substrate mounting plate according to one embodiment of the present disclosure;

[0045] Figure 5 is a schematic diagram of a wet processing equipment body according to an embodiment of the present disclosure;

[0046] Figure 6 is a perspective view of a fixing device according to an embodiment of the present disclosure as viewed from the upper surface, showing a clamping member;

[0047] Figure 7 is a schematic diagram of a fixing device according to an embodiment of the present disclosure, viewed from the front, showing a clamping member;

[0048] Figure 8 is a perspective view of a fixing device according to an embodiment of the present disclosure as viewed from the lower side, wherein a clamping member is shown;

[0049] Fig. 9 is based on Figure 8 A cross-sectional view of the fixing device along line BB;

[0050] Fig.10 is a schematic diagram of a fixing device according to an embodiment of the present disclosure as viewed from the front, showing a base plate mounting plate and a base plate;

[0051] Fig.11 yes Fig.10 A partial enlarged view of the card end;

[0052] Fig.12 is a schematic diagram of a fixing device according to another embodiment of the present disclosure as viewed from the front;

[0053] Fig.13 is a schematic diagram of a treatment liquid driving device according to an embodiment of the present disclosure;

[0054] Fig.14 is a schematic diagram of a treatment liquid driving device according to another embodiment of the present disclosure;

[0055] Fig.15 is a schematic diagram of a process liquid driving device mounted to a side wall according to an embodiment of the present disclosure;

[0056] Fig.16 is a schematic diagram of a method for operating a wet processing device according to an embodiment of the present disclosure.

[0057] Reference numerals list

[0058] Tank 1 Treatment liquid inlet I1

[0059] Side wall S Process liquid distributor D

[0060] Bottom wall B Treatment liquid outlet O

[0061] Front side wall 11 35 Fixing device 2

[0062] Rear side wall 12 Clamping member 20

[0063] Left side wall 13 Bracket plate 21

[0064] Right side wall 14 through hole 21h

[0065] Opening 15 Receiving slot 21s

[0066] Treatment liquid L 40 Upper surface 211

[0067] Processing liquid inlet I lower surface 212

[0068] Treatment liquid total inlet I0 inner surface 213

[0069] Outer surface 214 Sliding rod 83

[0070] Front face 215 Conduit 84

[0071] Rear surface 216 Cage 85

[0072] Inner end 217 35 Air pressure detection hole V

[0073] Outer end 218

[0074] Clamping plate 22

[0075] Cantilever part 23

[0076] Protrusion 23p

[0077] Card end 24

[0078] Angle α

[0079] Angle β

[0080] The first driving mechanism 71

[0081] Second driving mechanism 72

[0082] Support 26

[0083] Connecting plate 27

[0084] Cam groove 27c

[0085] Guide Rail 28

[0086] Pivot shaft 29

[0087] Pivot axis P

[0088] Fulcrum P1

[0089] Longitudinal axis Q of the cylinder

[0090] Extension axis R of the card end

[0091] Substrate 3

[0092] Base plate mounting plate 6

[0093] Opening 65

[0094] Substrate mounting area 6A

[0095] Side edges 65a, 65b, 65c, 65d of the opening

[0096] Sealing ring 64

[0097] Processing liquid driving device 8

[0098] Connection frame 81

[0099] Blade 82 DETAILED DESCRIPTION

[0100] In the following description of various exemplary structures according to the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration various exemplary devices, systems, and environments in which aspects of the present disclosure may be practiced.

[0101] In the description of the present invention, the directions or positional relationships indicated by "horizontal", "vertical", "up", "down", "top", "bottom", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the devices provided by the disclosure are usually placed when in use, or are the directions or positional relationships commonly understood by those skilled in the art. They are only for the convenience of describing the disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the disclosure.

[0102] In some wet processing (etching or pre-impregnation) technologies, a transmission device is used to fix the substrate to be processed on the table of the transmission device. Under the drive of the transmission device, the substrate is conveyed through a spraying device, which is arranged directly opposite to the substrate, and the surface to be processed of the substrate faces the spraying device. The spraying device sprays the processing liquid to the surface to be processed of the substrate through a nozzle: the spraying device of the etching unit sprays the etching processing liquid to the surface to be processed of the substrate, and the spraying device of the pre-impregnation unit sprays the pre-impregnation processing liquid to the surface to be processed of the substrate, so as to etch or pre-impregnate the substrate. In recent years, panel-level semiconductor processing technology has emerged, that is, a large panel is used to process and form multiple semiconductor devices at one time. Compared with traditional wafer-level and single semiconductor processing technology, panel-level processing technology has the advantages of high productivity and low cost. However, in the panel-level processing technology, due to the large area of ​​the panel (substrate), the wet processing using traditional technology will increase the difficulty of the panel (substrate) transmission process. In addition, the existing wet processing has the disadvantage that the processing liquid is not easy to spray evenly. The processing liquid sprayed by each nozzle usually presents a fan-shaped area, and the adjacent nozzles will have overlapping spraying areas. The amount of processing liquid sprayed in the overlapping spraying area is large, and the amount of processing liquid sprayed in the non-overlapping area is small, making it difficult to accurately control the wet processing effect. In particular, it is more difficult to form a uniform spraying process on a large panel (substrate). On the other hand, the spray nozzle is easy to clog, which increases the maintenance and inspection costs of the equipment.

[0103] Figure 1 is a schematic diagram of a wet processing (ie, etching or pre-impregnation processing) device according to an embodiment of the present disclosure, Figure 2 FIG. 1 is a schematic diagram of a tank body 1 of a wet processing (ie, etching or pre-impregnation processing) device according to the present disclosure. Figure 1 and Figure 2 As shown, the wet processing equipment may include a tank body 1 and a fixing device 2. The tank body 1 is made of, for example, an insulating material and includes a bottom wall B ( Figure 2 ) and a plurality of side walls S. At least one of the plurality of side walls S may be provided with an opening 15 connecting the inner side and the outer side of the tank body 1. The fixing device 2 is provided on the outer side of the tank body 1 and is configured to fix the substrate ( Figure 1 , Figure 2 Not shown, see Figure 3 ) is fixed to the outer side of the side wall S and is located at the opening 15. Thus, the opening 15 allows the surface to be processed of the substrate 3 to face the inner side of the tank body 1 and to contact the processing liquid contained in the tank body 1 during the wet processing.

[0104] The wet processing equipment according to the present disclosure may have the following advantages:

[0105] 1. Since the substrate is directly mounted on the outside of the side wall of the tank, compared with the process in which the substrate is transferred to the spraying device through a transmission device, the transmission device with a large and complex structure can be omitted, simplifying the complexity of the wet processing process. In addition, the installation and unloading operations of the substrate can also be carried out from the outside of the tank in a simpler and faster way.

[0106] 2. The processing liquid contained in the tank body contacts the substrate liquid installed at the opening of the tank body, so that the processing liquid is evenly distributed on the surface to be processed of the substrate.

[0107] 3. The wet processing equipment according to the present disclosure is particularly suitable for processing larger substrates, such as substrates with a size of up to 600 mm, and is therefore particularly suitable for large-size panel-level semiconductor packaging.

[0108] like Figure 2 As shown, the multiple side walls S of the tank body 1 may include a front side wall 11, a rear side wall 12, a left side wall 13 and a right side wall 14. The bottom wall B and the multiple side walls S together define a receiving space suitable for accommodating the treatment liquid. The wet processing equipment may also include a pumping device (not shown) for the treatment liquid. Figure 2 Only an example of a tank body with four side walls is shown, however, the embodiments of the present disclosure are not limited thereto. For example, the tank body may include less than four side walls or more than four side walls. For example, the side wall portions located in the same plane are referred to as one side wall, and the side wall portions located in different planes are referred to as different side walls.

[0109] According to an embodiment of the present disclosure, at least one of the side walls S of the tank body 1 may be provided with an opening 15 connecting the inside and outside of the tank body 1. The opening 15 may have a shape substantially consistent with the area to be processed of the substrate 3, for example, a substantially rectangular shape.

[0110] In some examples, one side wall S of the tank body 1 may be provided with an opening 15 connecting the inner side and the outer side of the tank body 1, for example Figure 1 and Figure 2 In the shown tank body 1 , an opening 15 communicating the inner side and the outer side of the tank body 1 may be provided on the front side wall 11 .

[0111] In other examples, at least two of the side walls S of the tank body 1 are provided with openings 15 connecting the inside and outside of the tank body 1. In one embodiment according to the present disclosure, openings 15 connecting the inside and outside of the tank body 1 are provided at two opposite side walls S of the tank body 1.

[0112] The tank body 1 may further include a partition wall inside. The partition wall and the side wall S of the tank body 1 may define a plurality of separate processing tank parts inside the tank body 1. Each processing tank part may correspond to one of the at least two side walls S having the opening 15.

[0113] According to one embodiment of the present disclosure, at least one of the side walls S of the processing tank may be provided with a processing liquid inlet I. A processing liquid outlet O may be provided at the bottom wall B of the processing tank. At the beginning of the wet processing, the processing liquid may enter the tank body 1 through the processing liquid inlet I, and after the wet processing is completed, the processing liquid in the tank body 1 may be discharged through the processing liquid outlet O.

[0114] In some examples, at least one treatment liquid inlet I is respectively provided on two opposite side walls S of the tank body 1, for example Figure 2 As shown, a treatment liquid inlet I is provided on both the left side wall 13 and the right side wall 14 .

[0115] In some examples, the treatment liquid inlet I includes a treatment liquid total inlet I0 located on the outside of the side wall, that is, the side of the side wall facing the outside of the tank body, and a treatment liquid sub-inlet I1 located on the inside of the side wall, that is, the side of the side wall facing the inside of the tank body, and a treatment liquid distributor D. The cross-sectional area of ​​the treatment liquid total inlet I0 is greater than the cross-sectional area of ​​a single treatment liquid sub-inlet I1, the number of the treatment liquid total inlet I0 is less than the number of the treatment liquid sub-inlets I1, and the treatment liquid total inlet I0 and the treatment liquid sub-inlets I1 are connected into a whole through the treatment liquid distributor D. For example Figure 2 As shown, a total inlet I0 for the treatment liquid is arranged on the outer side of the side wall of the left side wall 13 of the tank body 2, and a plurality of sub-inlets I1 for the treatment liquid with a single cross section smaller than the total inlet I0 for the treatment liquid are arranged on the inner side of the side wall of the left side wall 13 (not shown, the shape and size are basically the same as the sub-inlets I1 for the treatment liquid on the right side wall 14); a total inlet I0 for the treatment liquid is arranged on the outer side of the side wall of the right side wall 14 of the tank body 2 (not shown, the shape and size are basically the same as the total inlet I0 for the treatment liquid on the left side wall 14), and a plurality of sub-inlets I1 for the treatment liquid with a single cross section smaller than the total inlet I0 for the treatment liquid are arranged on the inner side of the side wall of the right side wall 14. During the wet treatment process, the treatment liquid enters the treatment liquid distributor D through the total inlet I0 for the treatment liquid, and then is dispersed into a plurality of liquid streams into the tank body 1 through the plurality of sub-inlets I1 for the treatment liquid on the other side of the treatment liquid distributor D. Since there are a plurality of sub-inlets I1 for the treatment liquid, the resistance of the liquid entering the tank body 1 is reduced, the speed of the treatment liquid entering the tank body is increased, and the liquid inlet time is reduced.

[0116] In some examples, multiple treatment liquid outlets may be provided at the bottom wall B inside the treatment tank, and / or the cross-section of the treatment liquid outlet may have a larger size, thereby allowing the treatment liquid to be discharged in a very short time, such as within 3S. Figure 1 As described above, two treatment liquid outlets O are provided at the bottom wall B of the tank body 1 .

[0117] In some examples, the treatment liquid outlet O is connected to a liquid storage tank (not shown), and the treatment liquid is stored in the liquid storage tank for circulation.

[0118] In some examples, the bottom wall B of the tank body 1 has a cleaning liquid drainage channel (not shown), which can be connected to a cleaning liquid tank (not shown), and the cleaning liquid is stored in the cleaning liquid tank. Therefore, after the wet treatment process of the substrate by the processing liquid is completed, when it is necessary to use the cleaning liquid to clean the substrate, the cleaning liquid in the cleaning liquid tank can be injected into the tank body through the cleaning liquid drainage channel to clean the substrate. After the cleaning process is completed, the cleaning liquid is discharged into the cleaning liquid tank through the cleaning liquid drainage channel. The type of cleaning liquid is selected according to the specific process. The cleaning liquid can be water, for example, and the present disclosure does not limit the type of cleaning liquid. Therefore, the wet treatment process and the cleaning process of the substrate can be completed in the same wet treatment device.

[0119] According to one embodiment of the present disclosure, Figure 1 and Figure 2 As shown, the left wall 13 and the right wall 14 of the tank body 1 have shorter horizontal sides than the front wall 11 and the rear wall 12 of the tank body 1, so that the tank body 1 is thin and flat. In this way, on the basis of the unchanged size of the substrate that can be processed, the tank body has a smaller volume, and the processing liquid can fill the tank body 1 in a very short time, for example, within 3S to complete the processing liquid filling process.

[0120] Figure 3 for Figure 1 A cross-sectional view of a wet processing plant with a magnified view of a selected area is shown. Figure 3 As shown, the substrate 3 is fixed to the front side wall 11 and contacts the treatment liquid L contained in the treatment tank portion. The treatment tank may be provided with a treatment liquid inlet I at the side wall S. The treatment tank may be provided with a treatment liquid outlet O at the bottom wall B.

[0121] Return to reference Figure 1 In some examples, the wet processing apparatus further includes a substrate mounting plate 6. The substrate 3 is fixed to the outer side of the side wall S of the tank body 1 by being mounted on the substrate mounting plate 6. For example, the substrate mounting plate 6 is located between the fixing device 2 and the side wall S. Figure 4 and Figure 5 An exemplary structure of the substrate mounting plate 6 is described.

[0122] like Figure 4 As shown, the substrate mounting plate 6 has an opening 65. The opening 65 may have a shape substantially consistent with the opening 15 of the side wall S and the area to be processed of the substrate 3. Figure 4 In the illustrated embodiment, the opening 56 of the substrate mounting plate 6 is substantially rectangular in shape. The substrate mounting plate 6 is fixed to the outer side of the side wall S having the opening 15, so that the position of the opening 65 of the substrate mounting plate 6 corresponds to the position of the opening 15 of the side wall S (see FIG. Figure 5 ). For example, the shape and size of the opening 65 of the substrate mounting plate 6 are respectively the same as the shape and size of the opening 15 of the side wall S, or the shape of the opening 65 of the substrate mounting plate 6 is the same as the shape of the opening 15 of the side wall S, but its size is slightly larger or slightly smaller than the size of the opening of the side wall S, but the embodiments according to the present disclosure are not limited thereto. For example, the position of the opening 65 of the substrate mounting plate 6 and the position of the opening 15 of the side wall S "correspond" means that the opening 65 and the opening 15 overlap at least partially in area. In some examples, "corresponding" means that the opening 65 and the opening 15 are in a state with the maximum overlapping area. During the wet processing process, the surface to be processed of the substrate 3 can be exposed to the processing liquid inside the tank body 1 through the opening 65 in the substrate mounting plate 6 and the opening 15 in the side wall S.

[0123] In some examples, the fixation between the baseboard mounting plate 6 and the side wall S can be a removable connection using one or more fasteners (e.g., screws, bolts, etc.). In some examples, the fixation between the baseboard mounting plate 6 and the side wall S can be a nearly permanent connection (e.g., a welded connection, an adhesive, etc.).

[0124] The substrate mounting plate 6 is provided with a substrate mounting area 6A (such as Figure 4 The substrate mounting area 6A is arranged around the opening 65 and is configured to extend along each side of the opening 65. For example, when the substrate 3 is mounted on the substrate mounting plate 6, the edge of the substrate 3 overlaps the substrate mounting area 6A.

[0125] According to one embodiment of the present disclosure, Figure 1 As shown, the fixing device 2 is fixedly disposed on the substrate mounting plate 6 and is configured to mount the substrate 3 to be processed to the substrate mounting area of ​​the substrate mounting plate 6, for example, by applying pressure to the substrate 3 in the direction toward the side wall S in the substrate mounting area.

[0126] In other embodiments, the fixing device 2 may also be different from Figure 1 Optionally, the fixing device 2 may be directly disposed on the side wall S of the tank body 1. Optionally, the fixing device 2 may be a pressure applying device that is completely independent of the tank body 1 and the substrate mounting plate 6.

[0127] According to one embodiment of the present disclosure, the fixing device 2 may include at least one clamping member. In some examples, the fixing device 2 may include multiple clamping members. Figure 1 As shown, four clamping members 20 are arranged around the opening 65 of the substrate mounting plate 6, and are respectively arranged adjacent to the four sides of the opening 65 of the substrate mounting plate 6. Each clamping member 20 is configured to apply pressure to the substrate 3 at one side of the opening 65 in a direction toward the side wall S. Thus, the fixing device can be constructed in an easy-to-operate and lightweight manner, and the substrate 3 can be fixed to the substrate mounting plate 6 in a fluid-tight manner.

[0128] The following references Figures 6 to 10 An exemplary structure of a clamping member 20 according to an embodiment of the present disclosure is described. In the following description, an xyz coordinate system is defined with reference to the substrate mounting plate 6. The z-axis is perpendicular to the substrate mounting plate 6, and its positive direction is the direction away from the substrate mounting plate 6. The x-axis is perpendicular to the side of the opening 65 of the substrate mounting plate 6, and its positive direction points from the side of the substrate mounting area 6A away from the opening 65 to the substrate mounting area 6A, that is, from the substrate mounting area 6A to the center of the opening 65.

[0129] According to one embodiment of the present disclosure, Figure 6 As shown, the clamping member 20 may include a support plate 21 and a clamping plate 22 .

[0130] The bracket plate 21 is a plate-like member extending along the length direction, width direction and thickness direction, the length direction is parallel to the side of the opening 65 of the substrate mounting plate 6 close to the bracket plate 21, and the width direction is perpendicular to the side of the opening 65 of the substrate mounting plate 6 close to the bracket plate 21.

[0131] refer to Figure 7 The clamping plate 22 is a plate-like member with an L-shaped cross section, including a cantilever portion 23 and a clamping end 24 formed into two branches of the L-shape. The clamping end 24 extends from one end of the cantilever portion 23, and the extending direction of the clamping end 24 is substantially perpendicular to the extending direction of the cantilever portion 23. The clamping end 24 is configured to contact the substrate 3 and apply pressure to the substrate 3 in the direction of the substrate mounting plate 6.

[0132] For ease of description, the geometric features of the support plate 21 are defined as follows.

[0133] See also Figure 6The support plate 21 has an upper surface 211 and a lower surface 212 extending in the length direction and the width direction, wherein the lower surface 212 is defined as the surface facing the substrate mounting plate 6, and the upper surface 211 is defined as the surface away from the substrate mounting plate 6. The support plate 21 has an inner side surface 213 and an outer side surface 214 extending in the length direction and the thickness direction, wherein the side surface facing the opening 65 of the substrate mounting plate 6 is defined as the inner side surface 213, and the side surface away from the opening 65 facing the substrate mounting plate 6 is defined as the outer side surface 214. The support plate 21 also has a front face 215 and a rear face 216 extending in the width direction and the thickness direction, wherein the front face 215 is defined as Figure 6 The support plate 21 has two opposite ends along the width direction, namely an inner end 217 and an outer end 218 , wherein the inner end 217 terminates at the inner side surface 213 , and the outer end 218 terminates at the outer side surface 214 .

[0134] The support plate 21 includes a receiving groove 21s opened at the inner side surface 213 thereof (see Figure 8 and Fig. 9 The cantilever portion 23 of the clamping plate 22 is inserted into the receiving groove 21s through the opening on the inner surface 213 of the support plate 21. The cantilever portion 23 is configured to be able to slide in the receiving groove 21s along the x-axis direction, so that the clamping plate 22 can be in the extended position (refer to Figure 8 ) and retracted position (reference Fig. 9 ) between the two positions. The extended position is closer to the center of the opening 65 of the substrate mounting plate 6 along the x-axis direction than the retracted position. In the extended position, a portion of the clamping plate 22 (e.g., the card end 24) may be located above the substrate mounting area 6A. In the retracted position, the clamping plate 22 is not located above the substrate mounting area 6A. The so-called "located above the substrate mounting area 6A" here means that the projection in the direction perpendicular to the substrate mounting plate 6 overlaps with the substrate mounting area 6A. Therefore, in the retracted position of the clamping plate 22, the substrate 3 can pass through the space above the substrate mounting area 6A without hindrance, thereby allowing the operation of placing the substrate 3 on the substrate mounting plate 6 or unloading the substrate 3 from the substrate mounting plate 6 to be conveniently performed.

[0135] refer to Figure 6 The support plate 21 is configured to be rotatable about a pivot axis P parallel to the y-axis, so that the support plate 21 can be in an inclined position (see Figure 7 ) and parallel positions (see Fig.10 ), and therefore, the card end 24 of the clamping plate 22 can move away from or close to the substrate mounting area 6A in the z-axis direction. Figure 7As shown, in the inclined position, the support plate 21 is inclined relative to the substrate mounting plate 6, that is, an angle α greater than 0° and less than 90° is formed between the upper surface 211 and the lower surface 212 of the support plate 21 and the plane of the substrate mounting plate 6, so that the inner end 217 of the support plate 21 is farther away from the substrate mounting plate 6 than the outer end 218. In the inclined position, the clamping end 24 of the clamping plate 22 does not contact the substrate 3 located on the substrate mounting plate 6. Fig.10 As shown, in the parallel position, the support plate 21 is substantially parallel to the substrate mounting plate 6 , and the clamping end 24 of the clamping plate 22 abuts against the substrate 3 located on the substrate mounting plate 6 .

[0136] The operation process of the fixing device 2 is as follows: when the wet processing device is not in operation, the support plate 21 is in an inclined position and the clamping plate 22 is in a retracted position, and the operator can place the substrate 3 to be processed in the substrate mounting area 6A of the substrate mounting plate 6. After the placement is completed, the operator can first move the clamping plate 22 located in the receiving groove 21s of the support plate 21 from the retracted position to the extended position, so that the clamping end 24 of the clamping plate 22 moves to the top of the substrate mounting area 6A. Then, the operator can move the support plate 21 from the inclined position to the parallel position, so that the clamping end 24 of the clamping plate 22 moves toward the substrate mounting area 6A and applies pressure to the substrate 3, thereby, the substrate 3 is fastened to the substrate mounting plate 6 in the substrate mounting area 6A.

[0137] In a variation example not shown in the present disclosure, the clamping member 20 may be formed as a plate-like member having a pressing portion fixed at one end, which may perform movement in the x-axis direction and in the z-axis direction as a whole under the guidance of, for example, a guide rail. In the process of installing the substrate 3, the clamping member 20 may first move the guide rail extending in the x-axis direction toward the center of the opening 65, so that the pressing portion is located above the substrate mounting area 6A. Different from the pivotal movement of the support plate 21 around the y-axis in the above-mentioned embodiment, in the present embodiment, the clamping member 20 may be linearly moved toward the substrate mounting plate 6 along the guide rail 28 extending in the z-axis direction as a whole, so that the pressing portion applies pressure to the substrate 3 in the substrate mounting area 6A.

[0138] Regarding the design of the clamp 20, the principle followed by the present disclosure is that at least a portion of the clamp 20 can perform movement in the x-axis direction and in the z-axis direction. First, at least a portion of the clamp 20 can move in the x-axis direction between the side of the substrate mounting area 6A away from the opening 65 (corresponding to the above-mentioned retracted position) and the substrate mounting area 6A (corresponding to the above-mentioned extended position), thereby leaving an operating space for the placement and unloading of the substrate 3 above the substrate mounting area 6A. Second, at least a portion of the clamp 20 (such as the above-mentioned card end 24) can move in the z-axis direction, thereby engaging the substrate 3 located on the substrate mounting plate 6 and applying pressure thereto, or releasing pressure and disengaging from the substrate 3. Guided by this principle, those skilled in the art can conceive of other structural designs and movement forms of the clamp 20 without departing from the scope of protection of the present disclosure.

[0139] According to an embodiment of the present disclosure, the fixing device 2 further includes a driving mechanism for driving the movement of the clamping member 20 .

[0140] In some examples, the fixture 2 includes a first driving mechanism 71 and a second driving mechanism 72. The first driving mechanism 71 is configured to drive at least a portion of the clamp 20 along the x-axis direction, so that at least a portion of the clamp 20 moves from a side of the substrate mounting area 6A away from the opening 65 to the substrate mounting area 6A. The second driving mechanism 72 is configured to drive at least a portion of the clamp 20 along the z-axis direction, so that at least a portion of the clamp 20 applies pressure toward the substrate mounting area 6A.

[0141] It should be noted that “the first driving mechanism 71 drives at least a portion of the clamping member 20 along the x-axis direction” is not limited to the case where the movement trajectory of at least a portion of the clamping member 20 is along the x-axis direction. At least a portion of the clamping member 20 may also move in a direction that forms a certain angle with the x-axis direction under the drive of the first driving mechanism 71. For example, when the clamping member 20 is in a position such as Figure 7 In the state of the tilted position shown, the movement direction of at least a portion of the clamping member 20 forms a certain angle with the x-axis direction. “The first driving mechanism 71 drives at least a portion of the clamping member 20 along the x-axis direction” should be understood as the movement of at least a portion of the clamping member 20 includes a component along the x-axis direction.

[0142] The driving mechanism can be various linear driving devices known to those skilled in the art, such as electric motors, cylinders, ball screws, etc. The first driving mechanism 71 and the second driving mechanism 72 of the plurality of clamps 20 can be connected to a control module, and the control module can operate the plurality of clamps 20 simultaneously in response to the operator's instructions. This automated implementation can significantly shorten the fixing operation time and reduce production costs. In addition, compared with manual operation, the fixing operation with the help of the driving mechanism has high repeatability and consistency, thereby ensuring the reliability of the fixing operation and the sealing of the substrate installation.

[0143] Figures 8 to 10 Detailed description is given in FIG. 7A of the first drive mechanism 71 and the second drive mechanism 72 according to an embodiment of the present disclosure. As an example, the first drive mechanism 71 and the second drive mechanism 72 are both in the form of a cylinder, which may include a cylinder barrel and a piston rod capable of linear reciprocating motion in the cylinder barrel.

[0144] Figure 8 2 is a perspective view of the fixing device 2 according to the present disclosure as viewed from the lower surface 212 of the bracket plate 21 . Fig. 9 FIG. 2 is another perspective view showing a fixing device 2 according to the present disclosure in a cross-sectional form, viewed from a side of a lower surface 212 of a bracket plate 21 .

[0145] The fixing device 2 may include two supporting members 26, which are respectively arranged at the front surface 215 and the rear surface 216 of the bracket plate 21. The first driving mechanism 71 is configured such that its cylinder is fixed at one of the supporting members 26 and the longitudinal axis of the cylinder extends along the y-axis direction, so that the piston rod of the first driving mechanism 71 can perform linear reciprocating motion along the y-axis direction.

[0146] In addition to the support plate 21 and the clamping plate 22, the clamping member 20 further includes a connecting plate 27, which is disposed on the lower surface 212 of the support plate 21 and fixedly connected to the end of the piston rod of the first driving mechanism 71. A guide rail 28 extending along the y-axis direction may also be disposed on the lower surface 212 of the support plate 21. Thus, the linear movement of the connecting plate 27 along the y-axis direction may be guided along the guide rail 28.

[0147] The connecting plate includes at least one cam groove 27c. The cam groove 27c has an elongated shape, such as a rectangular shape, with its extension axis between the x-axis and the y-axis and forming an angle β ( Fig. 9 ).exist Figure 8 In the illustrated embodiment, the number of the cam grooves 27c is two.

[0148] like Figure 8 and Fig. 9As shown, the cantilever portion 23 of the clamping plate 22 may be fixed with a protrusion 23p, for example, in a cylindrical shape. The protrusion 23p passes through the support plate 21 and cooperates with the cam groove 27c of the connecting plate 27. To this end, the support plate 21 may be provided with a through hole 21h ( Fig. 9 ), the through hole 21h communicates with the receiving groove 21s of the bracket plate 21 and the lower surface 212 of the bracket plate 21. Figure 8 In the illustrated embodiment, the number of the protrusions 23p is also two.

[0149] When the connecting plate 27 is driven by the first driving mechanism 71 to move linearly along the y-axis, the connecting plate 27 drives the protrusion 23p to move in the cam groove 27c along the extension axis of the cam groove 27c, so that the clamping plate 22 slides in the receiving groove 21s of the bracket plate 21 along the x-axis direction, thereby moving between the extended position and the retracted position.

[0150] Figure 8 2 shows the clamping plate 22 in the extended position, Fig. 9 2 shows the clamping plate 22 in the retracted position. Figure 8 When the first driving mechanism 71 drives the connecting plate 27 to move in the positive direction of the y-axis, the protrusion 23p moves from the cam groove 27c closest to the center of the opening 65 along the extension axis of the cam groove 27c until it reaches the position of the cam groove 27c farthest from the center of the hole 65, so that the clamping plate 22 moves to Fig. 9 Conversely, from Fig. 9 When the first driving mechanism 71 drives the connecting plate 27 to move in the negative direction of the y-axis, the protrusion 23p moves from the cam groove 27c farthest from the center of the hole 65 along the extension axis of the cam groove 27c until it reaches the position of the cam groove 27c closest to the center of the opening 65, so that the clamping plate 22 moves to Figure 8 . The extended position is shown in FIG.

[0151] refer to Fig.10 The second drive mechanism 72 is configured such that its cylinder is fixed on the base plate mounting plate 6 and the longitudinal axis Q of the cylinder extends along the z-axis direction, so that the piston rod of the second drive mechanism 72 can perform linear reciprocating motion along the z-axis direction. The outer end 218 of the bracket plate 21 is fixedly connected to the end of the piston rod of the second drive mechanism 72.

[0152] Return to reference Figure 8, the support plate 21 may include a pivot shaft 29 protruding from its front face 215 and rear face 216 to define a pivot axis P. A mounting hole is provided in the support member 26, and the pivot shaft 29 of the support plate 21 can be inserted into the mounting hole of the support member 26. A bearing may also be provided in the mounting hole to support the rotation of the pivot shaft 29 in the mounting hole. In some examples, the pivot shaft is connected to the middle of the support plate, and the middle refers to the position between the inner end and the outer end of the support plate. In some examples, the pivot shaft 29 is arranged at an approximately middle position in the width direction of the support plate 21.

[0153] When the outer end portion 218 of the support plate 21 is driven to move linearly along the z-axis via the second driving mechanism 72 , the support plate 21 can rotate around the pivot axis 29 , so that the support plate 21 can move between a parallel position and an inclined position.

[0154] exist Fig.10 In the illustrated embodiment, when the support plate 21 is in a parallel position, the first distance L1 between the pivot shaft 29 and the second drive mechanism 72 is greater than the second distance L2 between the pivot shaft 29 and the clamping end 24 of the clamping plate 22 when measured along the x-axis. When viewed in the xz plane, the pivot axis P of the pivot shaft 29 intersects the xz plane at a fulcrum P1, which is the fulcrum for the lever movement of the clamping member. The first distance L1 between the pivot shaft 29 and the second drive mechanism 72 refers to the distance between the fulcrum P1 and the longitudinal axis Q of the cylinder barrel of the second drive mechanism 72 along the x-axis. The second distance L2 between the pivot shaft 29 and the clamping end 24 of the clamping plate 22 refers to the distance between the fulcrum P1 and the extension axis R of the clamping end 24 of the clamping plate 22 along the x-axis.

[0155] Therefore, the force applied by the second driving mechanism 72 can be amplified through the lever principle, so that the substrate 3 is fixed more firmly at the clamping end 24 of the clamping plate 22, thereby enhancing the sealing effect and preventing leakage of the processing liquid during the wet processing.

[0156] In some examples, the first distance L1 is twice the second distance L2.

[0157] Figure 7 The fixing device 2 is shown with the support plate 21 in an inclined position and the clamping plate 22 in an extended position. Fig.10 FIG. 2 shows a fixing device 2 with the support plate 21 in a parallel position and the clamping plate 22 in an extended position. Figure 7 Starting from the position shown, when the second driving mechanism 72 drives the outer end 218 of the support plate 21 along the positive direction of the z-axis, the support plate 21 can rotate around the pivot axis 29 until it reaches Fig.10During this process, the inner end 217 of the support plate 21 and the clamping end 24 of the clamping plate 22 move substantially along the negative direction of the z-axis. Fig.10 In the parallel position shown, the second driving mechanism 72 pushes the outer end 218 of the support plate 21 along the positive direction of the z-axis, so that the clamping end 24 of the clamping plate 22 applies pressure to the substrate 3 along the negative direction of the z-axis in the substrate mounting area 6A. As a result, the substrate 3 is firmly mounted on the substrate mounting plate 6.

[0158] In some examples, the pivot shaft 29 of the support plate 21 can be arranged in a manner different from the above-mentioned embodiment. For example, the pivot shaft 29 can be arranged at the outer end 218 of the support plate 21 in the width direction, and the end of the piston rod of the second drive mechanism 72 is connected to the middle part of the support plate 21 in the width direction.

[0159] According to one embodiment of the present disclosure, referring to Figure 8 , the second driving mechanism 72 may include a plurality of cylinders which are equidistantly distributed in the length direction of the support plate 21. Thus, the driving force of the second driving mechanism 72 applied to the outer end portion 218 of the support plate 21 may be evenly distributed in the length direction of the support plate 21. Furthermore, the fixing force applied to the substrate 3 may be evenly distributed along the side of the substrate mounting area 6A, which is conducive to ensuring the sealing contact between the substrate 3 and the substrate mounting plate 6 at different positions.

[0160] According to one embodiment of the present disclosure (not shown), the wet processing device further includes a substrate stopper, which is configured to be movable from the outside of the opening to the middle of the opening. The substrate stopper includes a support attached to the substrate mounting plate and an arm substantially parallel to the substrate mounting plate. One end of the arm may have a hinge portion, which cooperates with a receiving hole in the support so as to define a hinge axis of the arm, which is perpendicular to the substrate mounting plate. One end of the arm may be connected to a stopper, which is, for example, formed as a thin sheet parallel to the substrate mounting plate. Thus, the arm can rotate around the hinge axis between an idle position outside the opening and a stop position above the opening in a plane parallel to the substrate mounting plate. In some examples, the arm may include an adjustment device for the stopper at one end of the stopper, such as an adjustment bolt, for adjusting the distance between the stopper and the substrate mounting plate. Thus, the stopper can be adjusted to a position away from the substrate mounting plate during the rotation of the arm to avoid collision with other devices on the substrate mounting plate, such as a fixing device.

[0161] Before the wet process begins, the arm can be set to an idle position, in which case the stopper is located outside the opening of the side wall to facilitate the operation of mounting and fixing the substrate to the substrate mounting plate. During the wet process, the arm can be rotated to a stopper position, in which case the stopper is located in the middle of the opening of the side wall and blocks the outside of the substrate to prevent the substrate from being deformed under the pressure of the process liquid inside the tank body.

[0162] In some examples, such as Figures 10 to 12 As shown, the wet processing equipment further comprises at least one seal. The seal may be disposed in the area surrounding the opening 65 of the substrate mounting plate 6 to ensure good sealing between the substrate 3 and the substrate mounting plate 6. The seal may also be disposed in the area surrounding the opening 15 of the side wall S to ensure good sealing between the side wall S and the substrate mounting plate 6.

[0163] In one embodiment according to the present disclosure, referring to Fig.10 , the sealing member is in the form of a sealing ring 64. A recess for accommodating the sealing ring 64 may be provided in the substrate mounting plate 6. In some examples, such as Fig.10 As shown, the recess is open toward the outside of the substrate mounting plate to ensure a good seal between the substrate 3 and the substrate mounting plate 6. In some examples (not shown), the recess is open toward the inside of the substrate mounting plate to ensure a good seal between the side wall S and the substrate mounting plate 6. In some examples (not shown), the side wall S may be provided with a recess for accommodating a sealing ring 64 on its outside to ensure a good seal between the side wall S and the substrate mounting plate 6. In another embodiment (not shown) according to the present disclosure, the sealing member is in the form of a gasket, which may be a rectangular shape with a hollow portion, and the hollow portion has, for example, a shape and size substantially consistent with the opening 65 of the substrate mounting plate 6 or the opening 15 of the side wall S. The gasket is placed between the substrate 3 and the substrate mounting plate 6 or between the substrate mounting plate 6 and the side wall S.

[0164] refer to Fig.11 , the position of the seal is set so that when the support plate 21 is in a parallel position, the position where the clamping end 24 of the clamping plate 22 applies pressure toward the substrate mounting plate 6 overlaps with the position of the seal at least partially along the z-axis. As a result, the sealing effect of the seal can be improved due to the pressure acting on the seal, preventing leakage of the processing liquid L during the wet processing process.

[0165] To further improve the sealing effect, refer to Fig.12, the clamping plate 22 of the clamping member 20 of the fixing device 2 may include a plurality of clamping ends 24. Accordingly, a sealing member may be arranged at a position where the plurality of clamping ends 24 apply pressure toward the substrate mounting plate 6. In the case where the sealing member is a sealing ring 64, a plurality of sealing rings 64 may be provided at different positions away from the side edge of the opening 65. In the case where the sealing member is a gasket, the plurality of clamping ends 24 may apply pressure to the gasket at different positions away from the side edge of the opening 65.

[0166] It should be noted that although Fig.11 and Fig.12 In the figure, the seal is shown in the form of a sealing ring 64, however, the present disclosure is not limited thereto, as mentioned above, the seal may also take the form of a gasket, and when the bracket plate 21 is in a parallel position, the position of the pressure applied by the clamping end 24 of the clamping plate 22 toward the substrate mounting plate 6 is projected in a direction perpendicular to the substrate mounting plate 6 within the extension range of the gasket.

[0167] Return to reference Figure 3 In some examples, such as Figure 3 As shown in the partially enlarged view in FIG. 1 , the wet processing equipment also includes an air pressure detection hole V. The position of the air pressure detection hole V in the wet processing equipment corresponds to the position of the sealing ring 64. The air pressure detection hole V is connected to a pressure detection device (not shown) for detecting the air pressure value around the sealing ring 64 to determine whether the connection of the substrate 3 to the wet processing equipment is stable.

[0168] The wet processing equipment also includes a processing liquid driving device 8 located in the tank body 1. Figure 1 As shown, the processing liquid driving device 8 is arranged to face the opening 15 on the side wall S and is configured to drive the processing liquid L to flow toward the opening 15. As a result, the processing liquid L near the substrate 3 can be quickly replenished, so that the temperature, concentration, pH and other parameters of the processing liquid L near the substrate 3 are kept consistent, and the chemical components of the processing liquid L are evenly dispersed, thereby obtaining a uniform processing effect.

[0169] According to one embodiment of the present disclosure, Fig.13 As shown, the treatment liquid driving device 8 includes a connection frame 81 and a plurality of blades 82 attached to the connection frame 81. The plurality of blades 82 are formed into a grid shape parallel to each other. The connection frame 81 and the plurality of blades 82 are arranged in a plane parallel to the side wall S having the opening 15 (refer to Figure 1 The connecting frame 81 can be connected to a driving device via a sliding rod 83, and the driving device can drive the connecting frame 81 and the plurality of blades 82 to move in a plane parallel to the side wall S, such as reciprocating in a horizontal direction or a vertical direction, thereby driving the flow of the processing liquid L near the substrate 3.

[0170] In other embodiments, the treatment liquid driving device having multiple blades may also be configured in a manner different from that of Fig.13 The embodiment shown is arranged in a manner. Optionally, the treatment liquid driving device may include a sprocket and a plurality of blades attached to the sprocket, and the treatment liquid driving device also includes a rod-shaped driving shaft and a supporting shaft. Optionally, the driving shaft and the supporting shaft are arranged in parallel, each having a top end and a bottom end opposite to the top end. Optionally, the bottom ends are arranged on the bottom wall of the trough body. Optionally, the driving shaft and the supporting shaft are substantially perpendicular to the bottom wall of the trough body. In some examples, the plane formed by the connecting line of the driving shaft and the supporting shaft, i.e., the connecting line surface, is substantially parallel to the opening, and the position of the connecting line surface corresponds to the opening. For example, the position of the connecting line surface "corresponds" to the opening, which means that at least part of the area of ​​the connecting line surface and the opening overlaps. In some examples, "corresponding" means that the area of ​​the connecting line surface completely covers the area of ​​the opening. Optionally, there are two sprockets, and the first sprocket and the second sprocket are respectively coiled around the top and bottom of the driving shaft and the supporting shaft in a flat ring shape, and the connecting line of the driving shaft and the supporting shaft is the long diameter of the flat ring. In some examples, the top and bottom of each blade are respectively attached to the first sprocket and the second sprocket, and optionally, each blade is substantially parallel to the driving shaft and the supporting shaft. Driven by the driving shaft, the sprocket moves circumferentially between the driving shaft and the supporting shaft, thereby driving a plurality of blades to always move in the same direction around the driving shaft and the supporting shaft, that is, always move circumferentially in a clockwise or counterclockwise direction. As a result, the blades drive the treatment liquid to form a stable laminar flow in the tank body, avoiding the formation of excessive turbulent flow, so that the wet treatment process is more stable.

[0171] The treatment liquid driving device adopts a blade structure, avoids the use of a nozzle structure, eliminates the problem of nozzle clogging, and reduces the need for equipment maintenance and inspection.

[0172] According to another embodiment of the present disclosure, Fig.14 As shown, the treatment liquid driving device 8 includes a connecting frame 81 and a plurality of conduits 84 attached to the connecting frame 81. The plurality of conduits 84 are arranged in parallel in a plane parallel to the side wall S having the opening 15. A plurality of nozzles (not shown) are arranged in an equidistant manner on each conduit 84, and the plurality of nozzles are open to the side wall S having the opening 15. The plurality of nozzles can therefore be arranged in an array in a plane parallel to the side wall S having the opening 15. During the wet treatment process, the treatment liquid L can flow in the conduit 84 and spray toward the substrate 3 at the opening 15 of the side wall S through the nozzle. The connecting frame 81 can be connected to the driving device via a sliding rod 83, and the driving device can drive the connecting frame 81, the plurality of conduits 84 and the plurality of nozzles to move in a plane parallel to the side wall S, for example, reciprocating in a horizontal direction or a vertical direction, so as to uniformly spray the treatment liquid L onto the surface to be treated of the substrate 3.

[0173] According to a further embodiment of the present disclosure, the treatment liquid driving device 8 may include a plurality of blades 82 and a plurality of conduits with nozzles 84. In this configuration, the movement of the blades 82 and the spraying action of the nozzles may produce a synergistic effect to better drive the treatment liquid to flow, so as to obtain a uniform treatment effect.

[0174] To obtain a more uniform treatment effect, the treatment liquid driving device 8 may be arranged as close as possible to the side wall S having the opening 15. For example, the distance between the treatment liquid driving device 8 and the side wall S may be in the range of 2 mm to 4 mm.

[0175] In some examples, the process liquid driving device 8 may be mounted to the side wall S having the opening 15. Fig.15 In the illustrated embodiment, a holder 85 for the processing liquid driving device 8 may be provided on the inner side of the side wall S. The holder 85 is substantially perpendicular to the side wall S and protrudes toward the inside of the tank body 1. The holder 85 is provided on both sides of the processing liquid driving device 8. The holder 85 may have a through hole, and the sliding rod 83 of the processing liquid driving device 8 may be inserted and supported in the through hole. The holder 85 plays a dual role of holding the processing liquid driving device 8 and guiding the movement of the processing liquid driving device 8. Due to this configuration, the movement process of the processing liquid driving device 8 can be achieved in a more stable manner, and allows accurate control of the distance from the processing liquid driving device 8 to the substrate 3 to be processed.

[0176] The following will describe an operating method of the above-mentioned processing equipment for wet processing the substrate 3 to be processed.

[0177] First, the substrate 3 is placed outside the side wall and at the opening, and the fixing device 20 is operated to fix the substrate 3 .

[0178] In some examples, the wet processing apparatus 1 includes a substrate mounting plate 6 fixed to the outer side of the side wall, the substrate mounting plate 6 having an opening 65 and a substrate mounting area 6A arranged around the opening 65, and the position of the opening 65 corresponds to the position of the opening. In this case, the step of operating the fixing device 20 to fix the substrate 3 also includes operating the fixing device 20 to fix the substrate 3 to the substrate mounting plate 6.

[0179] Then, the substrate 3 is subjected to a wet treatment.

[0180] In some examples, the wet processing device 1 includes a processing liquid driving device 8 located in the tank body 1 and facing the opening, and the processing liquid driving device 8 is configured to drive the processing liquid to flow toward the opening. In this case, the step of wet processing the substrate 3 may include: using the processing liquid driving device 8 to drive the processing liquid to flow toward the substrate 3.

[0181] Fig.16The operating method of a wet processing (etching or pre-impregnation processing) device 1 according to an embodiment of the present disclosure is shown, and the method includes:

[0182] S1: Place the substrate 3 outside the side wall S and at the opening 15.

[0183] S2: Operate the fixing device 2 to fix the substrate 3 on the substrate mounting plate 6.

[0184] For example, the first driving mechanism 71 is first operated to move the clamping plate 22 from the retracted position to the extended position, and the card end 24 of the clamping plate 22 moves to above the substrate mounting area 6A, and then the second driving mechanism 72 is operated to rotate the support plate 21 from the inclined position to the parallel position, and the card end 24 of the clamping plate 22 applies pressure to the substrate 3 in the substrate mounting area 6A.

[0185] S3 : turning on the processing liquid pumping device 8 , injecting the processing liquid L into the tank body 1 , and making the processing liquid L contact at least a portion of the substrate 3 .

[0186] S4: Turn off the treatment liquid pumping device and stop injecting the treatment liquid into the tank body 1.

[0187] S5: Activate the processing liquid driving device 8 to drive the processing liquid L to flow toward the surface to be processed of the substrate 3.

[0188] S6: Perform a wet treatment process and time the wet treatment process.

[0189] S7: Turn off the processing liquid driving device 8.

[0190] S8: Discharge the treatment liquid from the tank body 1.

[0191] S9 : operating the fixing device 2 to release the substrate 3 from the substrate mounting area 6A and unload the substrate 3 from the substrate mounting plate 6 .

[0192] Further features of the disclosure can be found in the claims, the drawings and the description of the drawings. The features and feature combinations mentioned above in the description and the features and feature combinations further in the description of the drawings and / or shown in the drawings alone are intended not only for the combination indicated respectively, but also for use in other combinations or alone without departing from the scope of the disclosure. Details of the disclosure which are not explicitly shown and explained in the figures, but which are present and can be produced from the explained details by means of separate feature combinations, are hereby included and disclosed. Therefore, details and feature combinations which do not have all the features of the originally formed independent claims are also to be regarded as disclosed.

Claims

1. A wet processing device for wet processing a substrate, the wet processing device comprising: A tank body, made of insulating material, suitable for containing the treatment liquid, the tank body comprising at least one side wall, the at least one side wall being provided with an opening connecting the inner side and the outer side of the tank body; A substrate mounting plate having an opening and a substrate mounting area arranged around the opening, wherein the position of the opening of the substrate mounting plate corresponds to the position of the opening of the side wall; as well as A fixing device is disposed on the substrate mounting plate and is configured to fix the substrate to the opening of the side wall, wherein: The fixing device comprises a driving mechanism and at least one clamping member, At least a portion of the clamp is configured to move between an extended position and a retracted position in a direction parallel to the substrate mounting plate, wherein a projection of at least a portion of the clamp in a direction perpendicular to the substrate mounting plate overlaps with the substrate mounting area, and a projection of at least a portion of the clamp in a direction perpendicular to the substrate mounting plate does not overlap with the substrate mounting area in the retracted position; and at least another portion of the clamp is configured to apply pressure toward the substrate mounting area in a direction perpendicular to the substrate mounting plate or release the pressure, and wherein The driving mechanism is configured to drive the movement of the clamping member. 2 . The wet processing equipment according to claim 1 , wherein the fixing device is arranged on the outside of the tank body.

3. The wet processing equipment according to claim 1, wherein: The at least one clamping member includes a plurality of clamping members, and the plurality of clamping members are disposed around the opening of the substrate mounting plate.

4. The wet processing equipment according to claim 1, wherein: The driving mechanism includes a first driving mechanism and a second driving mechanism, the first driving mechanism being configured to drive at least a portion of the clamping member along a first direction so that the at least a portion of the clamping member moves from the retracted position to the extended position, the first direction being a direction parallel to the substrate mounting plate and pointing from the retracted position to the extended position, the second driving mechanism being configured to drive at least another portion of the clamping member along a second direction so that the at least another portion of the clamping member applies pressure toward the substrate mounting area, the second direction being perpendicular to the substrate mounting plate and pointing to the substrate mounting plate.

5. The wet processing equipment according to claim 4, wherein: The clamping member includes a support plate and a clamping plate, the support plate includes a receiving groove, the clamping plate is inserted into the receiving groove and can slide in the receiving groove along the first direction, the first driving mechanism is configured to drive the clamping plate along the first direction so that the clamping plate extends from the receiving groove and moves from the retracted position to the extended position, and the second driving mechanism is configured to drive the clamping plate along the second direction so that the clamping plate applies pressure toward the substrate mounting area.

6. The wet processing equipment according to claim 5, wherein: The clamping member also includes a connecting plate, which is arranged on the bracket plate and fixedly connected to the first driving mechanism, and the first driving mechanism is configured to drive the connecting plate along a third direction, wherein the third direction is parallel to the substrate mounting plate and perpendicular to the first direction, and the connecting plate includes a cam groove, which extends between the first direction and the third direction and forms an angle greater than 0 degrees and less than 90 degrees with the first direction, and the clamping plate is fixedly provided with a protrusion, which passes through the bracket plate and cooperates with the cam groove. When the connecting plate is driven by the first driving mechanism to move along the third direction, the protrusion moves in the cam groove along the extension direction of the cam groove, so that the clamping plate slides in the receiving groove of the bracket plate along the first direction.

7. The wet processing equipment according to claim 6, wherein: The fixing device also includes a pivot shaft connected to the middle part of the bracket plate, and the second driving mechanism is configured to drive the side of the bracket plate away from the opening along the first direction to move away from the substrate mounting plate along the second direction, and the bracket plate rotates around the pivot shaft, and the side of the bracket plate close to the opening along the first direction moves close to the substrate mounting plate along the second direction, so that the clamping plate applies pressure toward the substrate mounting area.

8. The wet processing equipment according to claim 7, wherein: The clamping plate includes a cantilever portion and a clamping end, wherein the cantilever portion is adapted to be inserted into a receiving groove of the bracket plate, and the clamping end extends from one end of the cantilever portion toward the substrate mounting plate and is adapted to apply pressure toward the substrate mounting plate. When the bracket plate is parallel to the substrate mounting plate, a first distance between the pivot axis and the second driving mechanism measured along the first direction is greater than a second distance between the pivot axis and the clamping end of the clamping plate measured along the first direction.

9. The wet processing equipment according to claim 8, wherein: The first distance is twice the second distance.

10. The wet processing equipment according to claim 1 or 2, further comprising a cleaning liquid drainage channel located on the bottom wall of the tank body, and the cleaning liquid enters the tank body through the cleaning liquid drainage channel to clean the substrate.

11. The wet processing equipment according to claim 1 or 2, further comprising a processing liquid driving device located in the tank body and facing the opening, wherein the processing liquid driving device is configured to drive the processing liquid to flow toward the opening.

12. The wet processing equipment according to claim 11, wherein: The treatment liquid driving device includes a sprocket, a plurality of blades attached to the sprocket, a driving shaft and a supporting shaft. The sprocket moves circumferentially around the driving shaft and the supporting shaft under the drive of the driving shaft, and the sprocket drives the plurality of blades to move in a directional manner.

13. The wet processing equipment according to claim 1, further comprising at least one seal, wherein the at least one seal is disposed in at least one of the following areas: an area of ​​the substrate mounting plate surrounding the opening and an area of ​​the side wall having the opening surrounding the opening.

14. The wet processing equipment according to claim 5, wherein: The clamping plate includes a cantilever portion and a clamping end, wherein the cantilever portion is adapted to be inserted into a receiving groove of the bracket plate, and the clamping end extends from one end of the cantilever portion toward the substrate mounting plate and is adapted to apply pressure toward the substrate mounting plate. The wet processing equipment includes at least one seal, and the at least one seal is arranged in at least one of the following areas: an area of ​​the substrate mounting plate surrounding the opening and an area of ​​the side wall having the opening surrounding the opening, and the position where the card end applies pressure toward the substrate mounting plate at least partially overlaps with the position of the seal in a direction perpendicular to the substrate mounting plate.

15. The wet processing equipment according to claim 14, wherein: The clamping plate includes a plurality of card ends, and positions where the plurality of card ends apply pressure toward the substrate mounting plate at least partially overlap with positions of the sealing member in a direction perpendicular to the substrate mounting plate.

16. A method for operating a wet processing apparatus as claimed in claim 1, comprising: Placing a substrate outside the side wall and at the opening, and operating the fixing device to fix the substrate; as well as The substrate is wet treated.

17. The operating method according to claim 16, wherein: The wet processing equipment includes a substrate mounting plate fixed to the outer side of the side wall, the substrate mounting plate having an opening and a substrate mounting area arranged around the opening, the position of the opening corresponding to the position of the opening, Placing the substrate outside the side wall and at the opening, and operating the fixing device to fix the substrate comprises: The fixing device is operated to fix the substrate to the substrate mounting plate.

Citation Information

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