Light emitting module

Abstract

Provided is a light emitting module capable of stably achieving high heat dissipation performance. The light emitting module (1) comprises: a first substrate (10) having a first surface (10a) and a second surface (10b) opposite to the first surface (10a), wherein a recess (11) is formed on the first surface (10a), and an opening (12) reaching the second surface (10b) is formed on the bottom surface (11a) of the recess (11); a second substrate (20) disposed in the recess (11); a light emitting element (21) mounted on the second substrate (20) and capable of emitting light through the opening (12); and a buffer material (30) disposed between the first substrate (10) and the second substrate (20) and having elasticity. In a state where no force is applied to press the second substrate (20) against the first substrate (10), the second substrate (20) protrudes from the first surface (10a) of the first substrate (10).

Description

Technical Field

[0001] Embodiments relate to a light emitting module. Background Art

[0002] In recent years, light emitting modules using light emitting diodes (LEDs) have been developed and applied to various applications. In order to apply LEDs to small applications such as automobile headlights that require high luminosity, high output is required. In this case, there is a concern that the light emitting module may be damaged due to the heat generated by the LED, thereby reducing reliability. Therefore, in the light emitting module, it is required to stably achieve high heat dissipation performance.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-243512 Summary of the invention

[0006] An object of the embodiment is to provide a light emitting module capable of stably achieving high heat dissipation performance.

[0007] The light-emitting module according to the embodiment comprises: a first substrate having a first surface and a second surface opposite to the first surface, a recess being formed on the first surface, and an opening reaching the second surface being formed on the bottom surface of the recess; a second substrate disposed in the recess; a light-emitting element mounted on the second substrate and capable of emitting light through the opening; and a buffer material disposed between the first substrate and the second substrate and having elasticity. In a state where no force is applied to press the second substrate against the first substrate, the second substrate protrudes from the first surface of the first substrate.

[0008] The light-emitting module involved in the embodiment comprises: a first substrate having a first surface and a second surface opposite to the first surface, a recessed portion being formed on the first surface, and an opening portion reaching the second surface being formed on the bottom surface of the recessed portion; a second substrate arranged in the recessed portion; a light-emitting element mounted on the second substrate and capable of emitting light through the opening; and a buffer material which is arranged in an area of ​​the first surface of the first substrate other than the recessed portion and has elasticity.

[0009] According to the embodiment, a light emitting module capable of stably achieving high heat dissipation performance can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A It is a plan view showing the light emitting module according to the first embodiment.

[0011] Figure 1B yes Figure 1A A cross-sectional view taken along line IB-IB' is shown.

[0012] Figure 2A It is a cross-sectional view showing a state in which the light emitting module according to the first embodiment is not fixed to a fixed member.

[0013] Figure 2B It is a cross-sectional view showing a state where the light emitting module according to the first embodiment is fixed to a fixed member.

[0014] Figure 3A It is a plan view showing a light emitting module according to a second embodiment.

[0015] Figure 3B yes Figure 3A A cross-sectional view taken along line IIIB-IIIB' is shown.

[0016] Figure 4A It is a cross-sectional view showing a state in which the light emitting module according to the second embodiment is not fixed to a fixed member.

[0017] Figure 4B It is a cross-sectional view showing a state where the light emitting module according to the second embodiment is fixed to a fixed member.

[0018] Figure 5 It is a cross-sectional view showing a light emitting module according to a third embodiment.

[0019] Fig. 6A It is a bottom view showing the positional relationship between the first substrate and the cushioning material in the first embodiment.

[0020] Figure 6B It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0021] Figure 6C It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0022] Fig. 7A It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0023] Figure 7B It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0024] Figure 7C It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0025] Fig. 8AIt is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0026] Figure 8B It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0027] Fig.9A It is a bottom view showing the positional relationship between the first substrate and the buffer material in the second embodiment.

[0028] Fig. 9B It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the second embodiment.

[0029] Fig. 9C It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the second embodiment.

[0030] Fig. 10A It is a cross-sectional view showing a state in which the light emitting module according to the fourth embodiment is not fixed to a fixed member.

[0031] Fig. 10B It is a cross-sectional view showing a state where a light emitting module according to a fourth embodiment is fixed to a fixed member.

[0032] Fig.11 It is a cross-sectional view showing a heat transfer member in a fourth embodiment.

[0033] Fig. 12A It is a cross-sectional view showing a method of forming a heat transfer member in the fourth embodiment.

[0034] Fig. 12B Yes means Fig. 12A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0035] Fig.13A It is a cross-sectional view showing a method of forming a heat transfer member in the fourth embodiment.

[0036] Fig. 13B Yes means Fig.13A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0037] Fig.14A It is a cross-sectional view showing a method of forming a heat transfer member in the fourth embodiment.

[0038] Fig. 14B Yes means Fig.14A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0039] Fig.15A It is a cross-sectional view showing a method of forming a heat transfer member in the fourth embodiment.

[0040] Fig. 15B Yes means Fig.15A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0041] Fig.16A It is a cross-sectional view showing a state in which the light emitting module according to the fifth embodiment is not fixed to a fixed member.

[0042] Fig. 16B It is a cross-sectional view showing a state where the light emitting module according to the fifth embodiment is fixed to a fixed member.

[0043] Fig.17 It is a cross-sectional view showing a light emitting module according to a sixth embodiment.

[0044] -Explanation of symbols-

[0045] 1, 2, 3, 4, 5, 6: light-emitting module,

[0046] 10: 1st substrate,

[0047] 10a: Side 1,

[0048] 10b: Side 2,

[0049] 10c: Center,

[0050] 11: concave part,

[0051] 11a: bottom surface,

[0052] 11b: Side,

[0053] 12: Opening,

[0054] 13: Connector,

[0055] 15: 1st pad,

[0056] 16: Through hole,

[0057] 17: Modular structure,

[0058] 20: 2nd substrate,

[0059] 20a: Side 1,

[0060] 20b: Side 2,

[0061] 21: Light emitting element,

[0062] 22: phosphor layer,

[0063] 23: Sidewall,

[0064] 25: 2nd pad,

[0065] 27: Light emitting device,

[0066] 30: cushioning material,

[0067] 30a: Side 1,

[0068] 30b: Side 2,

[0069] 30c: incision,

[0070] 31: Line,

[0071] 32: Spacer,

[0072] 40: heat conducting component,

[0073] 40a: Side 1,

[0074] 40b: Side 2,

[0075] 41: Metal part,

[0076] 41a: Metal powder,

[0077] 42: Resin part,

[0078] 42a: Resin liquid,

[0079] 43: paste,

[0080] 100: fixed component,

[0081] 100a: Side 1,

[0082] 101: threaded hole,

[0083] 102: Screws. DETAILED DESCRIPTION

[0084] <First Embodiment>

[0085] First, the first embodiment will be described.

[0086] Figure 1A is a plan view showing a light emitting module according to this embodiment. Figure 1B yes Figure 1A A cross-sectional view taken along line IB-IB' is shown.

[0087] like Figure 1A as well as Figure 1BAs shown, the light-emitting module 1 involved in this embodiment comprises: a first substrate 10, having a first surface 10a and a second surface 10b opposite to the first surface 10a, a recess 11 is formed on the first surface 10a, and an opening 12 reaching the second surface 10b is formed on the bottom surface 11a of the recess 11; a second substrate 20, arranged in the recess 11; a light-emitting element 21, mounted on the second substrate 20, capable of emitting light through the opening 12; and a buffer material 30, which is arranged between the first substrate 10 and the second substrate 20 and has elasticity.

[0088] The following describes this in more detail.

[0089] In the light emitting module 1 involved in this embodiment, a first substrate 10 is provided. The first substrate 10 is a module substrate, and a glass epoxy substrate, a metal substrate, a ceramic substrate, etc. are used. In the first substrate 10, wiring is provided in a base material or on the surface of the base material. The main surfaces of the first substrate 10 are a first surface 10a and a second surface 10b. The first surface 10a and the second surface 10b are opposite to each other.

[0090] A recess 11 is formed on the first surface 10a. When viewed from the direction from the first surface 10a toward the second surface 10b (hereinafter, also referred to as the "vertical direction"), the shape of the recess 11 is, for example, a rectangle. An opening 12 is formed on the bottom surface 11a of the recess 11. The opening 12 reaches the second surface 10b of the first substrate 10. That is, the opening 12 penetrates the first substrate 10 in the thickness direction. When viewed from the vertical direction (hereinafter, also referred to as the "top view"), the shape of the opening 12 is, for example, a rectangle with rounded corners, and is located inside the recess 11.

[0091] A connector 13 is mounted on the second surface 10b of the first substrate 10. An external power source can be electrically connected to the connector 13. In addition, a pair of first pads 15 are provided on the second surface 10b. The first pads 15 are made of metal, for example. The connector 13 and the first pads 15 are electrically connected to each other via wiring in the first substrate 10. When viewed from the second surface 10b toward the direction (vertical direction) of the first surface 10a, the opening 12 and the connector 13 are arranged at a position sandwiching the center 10c of the first substrate 10. When viewed from above, when the shape of the first substrate 10 is rectangular, the center 10c is the intersection of the diagonals of the first substrate 10.

[0092] The first substrate 10 has two or more through holes 16 formed therein. The through holes 16 extend in the vertical direction and reach the first surface 10a and the second surface 10b. As described later, the through holes 16 are holes for screwing the first substrate 10 to the fixed member 100. Figure 1A In the example shown, eight through holes 16 are formed, but the present invention is not limited thereto, and the through holes 16 may be provided at two or more locations sandwiching the recessed portion 11 .

[0093] The first substrate 10, the connector 13, and the first pads 15 form a module structure 17. The first substrate 10 has a recess 11, an opening 12, and a through hole 16 formed therein.

[0094] The second substrate 20 is arranged in the concave portion 11 of the first substrate 10. The shape of the second substrate 20 is, for example, a rectangular plate, and when viewed from above, the second substrate 20 is a shape that is just accommodated in the concave portion 11. The second substrate 20 includes metal or ceramics, for example, a ceramic substrate, for example, an aluminum nitride (AlN) substrate. The main surfaces of the second substrate 20 are the first surface 20a and the second surface 20b, which are opposite to each other. The first surface 20a is the surface on the first substrate 10 side.

[0095] A light emitting element 21 is mounted on the first surface 20 a of the second substrate 20 . The light emitting element 21 is, for example, a light emitting diode (LED). In a plan view, the light emitting element 21 is located in the opening 12 of the first substrate 10 and can emit light through the opening 12 .

[0096] A phosphor layer 22 may be provided on the light emitting element 21. In the phosphor layer 22, a plurality of phosphor particles are dispersed in a base material made of a transparent resin. In a plan view, a side wall 23 may be provided around the light emitting element 21 and the phosphor layer 22. The side wall 23 is formed of, for example, a white resin. A pair of second solder pads 25 are provided on the first surface 20a. The second solder pads 25 are made of, for example, metal. The second solder pads 25 are electrically connected to the light emitting element 21. Figure 1A as well as Figure 1B In the example shown, a light emitting device 27 is formed by the second substrate 20 , the light emitting element 21 , the phosphor layer 22 , the side wall 23 , and the second pad 25 .

[0097] In the light emitting module 1, a pair of leads 31 are provided to connect the pair of first pads 15 to the pair of second pads 25. Thus, the anode and cathode of the light emitting element 21 can be connected to an external power source via the pair of second pads 25, the pair of leads 31, the pair of first pads 15, the wiring of the first substrate 10, and the connector 13.

[0098] Furthermore, a buffer material 30 is provided between the module structure 17 and the light emitting device 27, more specifically, between the bottom surface 11a of the recess 11 of the first substrate 10 and the first surface 20a of the second substrate 20. For example, the buffer material 30 is bonded to the bottom surface 11a of the recess 11 of the first substrate 10 by an adhesive, and the buffer material 30 is bonded to the first surface 20a of the second substrate 20 by an adhesive. In addition, in the case where the buffer material 30 itself has adhesiveness, an adhesive is not required. For example, the buffer material 30 is in a layered shape, and when viewed from above, the outer edge of the buffer material 30 is slightly smaller than the outer edge of the recess 11, and an opening is formed at a position corresponding to the opening 12.

[0099] The buffer material 30 is made of an elastic material, preferably a material having an elastic modulus of 0.1 MPa or more and 1000 MPa or less, and more preferably a material having an elastic modulus of 1 MPa or more and 100 MPa or less. Thus, the buffer material 30 can be elastically deformed. For example, if a compressive force in the thickness direction is applied to the buffer material 30, the thickness becomes thinner, and if the compressive force disappears, the original thickness returns. The buffer material 30, for example, includes at least one of graphite and an elastic resin material. The buffer material 30 is preferably formed of a material having elasticity and high heat resistance, for example, preferably includes a silicone resin. In addition, the thickness of the buffer material 30 is preferably 200 μm or less.

[0100] Next, the operation of the light emitting module 1 according to the present embodiment will be described.

[0101] Figure 2A is a cross-sectional view showing a state where the light emitting module according to the present embodiment is not fixed to a fixed member (hereinafter also referred to as a “free state”). Figure 2B It is a cross-sectional view showing a state where the light emitting module according to the present embodiment is fixed to a fixed member (hereinafter also referred to as a “fixed state”).

[0102] like Figure 2A As shown, in the free state, no force is applied to press the second substrate 20 against the first substrate 10. Therefore, no compressive force is applied to the buffer 30. In this state, the portion on the second surface 20b side of the second substrate 20 protrudes from the first surface 10a of the first substrate 10. The protrusion amount is preferably less than half the thickness of the buffer material 30. The reason for this is that the entire second surface 20b of the second substrate 20 is easily brought into contact with the first surface 100a of the fixed member 100.

[0103] like Figure 2BAs shown, in a fixed state, the light emitting module 1 is fixed to the fixed member 100. The fixed member 100 is, for example, a heat sink. A threaded hole 101 is formed on the first surface 100a of the fixed member 100. The threaded hole 101 is arranged at a position corresponding to the through hole 16 of the light emitting module 1. The screw 102 is inserted through the through hole 16 of the first substrate 10 and is threadedly fixed to the threaded hole 101 of the fixed member 100, whereby the first substrate 10 and the fixed member 100 are mechanically connected. Thus, the light emitting module 1 is fixed to the fixed member 100. At this time, the light emitting module 1 is fixed to the fixed member 100 at two or more positions sandwiching the opening 12 of the first substrate 10, that is, at two or more positions sandwiching the light emitting device 27. Therefore, the second surface 20b of the second substrate 20 will not be separated from the first surface 100a of the fixed member 100.

[0104] At this time, the second substrate 20 and the buffer material 30 are pressed between the first substrate 10 and the fixed member 100, and a compressive force is applied. As a result, the buffer material 30 is elastically deformed and becomes thinner, and the position of the second surface 20b of the second substrate 20 in the vertical direction is approximately equal to the position of the first surface 10a of the first substrate 10. As a result, the first surface 10a of the first substrate 10 contacts the first surface 100a of the fixed member 100, and the second surface 20b of the second substrate 20 contacts the first surface 100a of the fixed member 100. At this time, the second surface 20b of the second substrate 20 is pressed against the first surface 100a of the fixed member 100 by the rebound force of the buffer material 30.

[0105] In this state, when power is applied to the light emitting element 21 by an external power source and the light emitting element 21 is turned on, the heat generated in the light emitting element 21 is transferred within the second substrate 20 and transferred to the fixed member 100 as a heat sink. Since the second substrate 20 and the fixed member 100 are in direct contact and pressed, the thermal resistance between the second substrate 20 and the fixed member 100 is low. As a result, the heat generated in the light emitting element 21 can be efficiently released to the fixed member 100, and the temperature rise of the light emitting module 1 can be suppressed.

[0106] Next, the effects of this embodiment will be described.

[0107] According to the present embodiment, since an elastic buffer material 30 is sandwiched between the module structure 17 and the light-emitting device 27, the buffer material 30 is compressed in the fixed state. Therefore, the entire second surface 20b of the second substrate 20 is in contact with and pressed against the first surface 100a of the fixed member 100. Thus, high heat dissipation can be achieved. In addition, assuming that a light-emitting module according to a comparative example having the same structure as that of the present embodiment except that the buffer material 30 is not provided, a thermal simulation was performed under the same conditions for the light-emitting module 1 according to the present embodiment in which the buffer material 30 is provided and the light-emitting module according to the comparative example. As a result, the reaction temperature (Tj) of the present embodiment (with the buffer material 30) was 4.2% lower than that of the comparative example (without the buffer material 30).

[0108] In addition, since the buffer material 30 has elasticity, even in the free state, even if the second surface 20b of the second substrate 20 is tilted relative to the first surface 10a of the first substrate 10, the buffer material 30 can absorb the tilt, so that the entire second surface 20b of the second substrate 20 is in contact with the first surface 100a of the fixed member 100. Similarly, even if there are slight irregularities on the bottom surface 11a of the recess 11 of the first substrate 10 or the first surface 20a of the second substrate 20, the buffer material 30 can absorb the irregularities, so that the second surface 20b of the second substrate 20 is in contact with the first surface 100a of the fixed member 100 stably. As a result, the heat dissipation can be stabilized. In this way, the light emitting module 1 involved in this embodiment has a high tolerance for assembly accuracy and can stably achieve high heat dissipation performance. Therefore, the reliability of the light emitting module 1 is high and the deviation between products is small.

[0109] Furthermore, according to the present embodiment, in the free state, the second surface 20b of the second substrate 20 protrudes from the first surface 10a of the first substrate 10. Therefore, when the first surface 100a of the fixed member 100 is flat, the buffer material 30 can be compressed in the fixed state, and the second substrate 20 can be pressed against the fixed member 100 by the resilience of the buffer material 30.

[0110] In addition, in the present embodiment, the first surface 100a of the fixed member 100 is flat, and the second surface 20b of the second substrate 20 protrudes from the first surface 10a of the first substrate 10 in the free state, but the present invention is not limited thereto. The positional relationship between the first surface 10a and the second surface 20b in the vertical direction can be appropriately selected according to the shape of the mounting area of ​​the light emitting module 1 on the first surface 100a of the fixed member 100.

[0111] <Second Embodiment>

[0112] Next, a second embodiment will be described.

[0113] Figure 3A is a plan view showing a light emitting module according to this embodiment. Figure 3B yes Figure 3A A cross-sectional view taken along line IIIB-IIIB' is shown.

[0114] like Figure 3A as well as Figure 3B As shown, the light emitting module 2 according to the present embodiment is different from the light emitting module 1 according to the first embodiment in that the position of the buffer material 30 is different. That is, the buffer material 30 is not disposed between the first substrate 10 and the second substrate 20, but is disposed in a region other than the recess 11 in the first surface 10a of the first substrate 10. For example, the buffer material 30 is in a layered shape, and when viewed from above, the outer edge of the buffer material 30 is slightly smaller than the outer edge of the first substrate 10, and an opening is formed at a position corresponding to the recess 11. The first surface 30a of the buffer material 30 is in contact with the first surface 10a of the first substrate 10, and the second surface 30b of the buffer material 30 is exposed. The second surface 30b is a surface opposite to the first surface 30a.

[0115] A spacer 32 may be provided between the bottom surface 11a of the recess 11 of the first substrate 10 and the first surface 20a of the second substrate 20 at the position where the buffer material 30 is arranged in the first embodiment. The spacer 32 is made of, for example, metal, ceramic or resin material. For example, the thermal conductivity of the spacer 32 is higher than that of the buffer material 30. The structure other than the above in this embodiment is the same as that in the first embodiment.

[0116] That is, the light-emitting module 2 involved in this embodiment comprises: a first substrate 10, having a first surface 10a and a second surface 10b opposite to the first surface 10a, a recess 11 being formed on the first surface 10a, and an opening 12 reaching the second surface 10b being formed on the bottom surface 11a of the recess 11; a second substrate 20 arranged in the recess 11; a light-emitting element 21 mounted on the second substrate 20 and capable of emitting light through the opening 12; and a buffer material 30, which is arranged in an area other than the recess 11 in the first surface 10a of the first substrate 10 and has elasticity.

[0117] Next, the operation of the light emitting module 2 according to the present embodiment will be described.

[0118] Figure 4A is a cross-sectional view showing a state (free state) in which the light emitting module according to the present embodiment is not fixed to a fixed member. Figure 4B It is a cross-sectional view showing a state (fixed state) in which the light emitting module according to the present embodiment is fixed to a fixed member.

[0119] like Figure 4AAs shown, in the free state, no force is applied to press the first substrate 10 against the fixed member 100. Therefore, no compressive force is applied to the cushioning material 30. In this state, the portion of the cushioning material 30 on the second surface 30b side protrudes beyond the second surface 20b of the second substrate 20.

[0120] like Figure 4B As shown, in the fixed state, the light emitting module 2 is fixed to the fixed member 100 by the screw 102. The structure of the fixed member 100 is the same as that of the first embodiment. In the fixed state, the buffer material 30 is pressed between the first substrate 10 and the fixed member 100, so that a compressive force is applied. As a result, the buffer material 30 is elastically deformed and becomes thinner, and the position of the second surface 30b of the buffer material 30 in the vertical direction is approximately equal to the position of the second surface 20b of the second substrate 20. As a result, the second surface 30b of the buffer material 30 contacts the first surface 100a of the fixed member 100, and the second surface 20b of the second substrate 20 contacts the first surface 100a of the fixed member 100. At this time, the second surface 20b of the second substrate 20 is pressed against the first surface 100a of the fixed member 100 by the tightening force of the screw 102. At this time, the light emitting module 1 is fixed to the fixed member 100 at two or more positions sandwiching the opening 12 of the first substrate 10, that is, at two or more positions sandwiching the light emitting device 27. Therefore, the second surface 20b of the second substrate 20 is not separated from the first surface 100a of the fixed member 100.

[0121] If the light emitting element 21 is turned on in this state, the heat generated in the light emitting element 21 is transferred within the second substrate 20 and transferred to the fixed member 100 as a heat sink. Since the second substrate 20 is in direct contact with the fixed member 100 and is pressed, the thermal resistance between the second substrate 20 and the fixed member 100 is low. In addition, the heat generated in the light emitting element 21 is also transferred to the fixed member 100 via the second substrate 20, the first substrate 10, and the buffer material 30. Therefore, the heat generated in the light emitting element 21 can be efficiently released to the fixed member 100. As a result, the temperature rise of the light emitting module 2 can be suppressed.

[0122] The operations other than those described above in this embodiment are the same as those in the first embodiment.

[0123] Next, the effects of this embodiment will be described.

[0124] According to the present embodiment, even when there is a height difference between the second surface 20b of the second substrate 20 and the first surface 10a of the first substrate 10, the cushioning material 30 elastically deforms to absorb the height difference, and both the cushioning material 30 and the second substrate 20 are stably in contact with the fixed member 100. In addition, even when the second surface 20b of the second substrate 20 is inclined relative to the first surface 10a of the first substrate 10, the cushioning material 30 absorbs the inclination, and the entire second surface 20b of the second substrate 20 is in contact with the first surface 100a of the fixed member 100. Furthermore, even when there are minute irregularities on the first surface 10a of the first substrate 10, the cushioning material 30 absorbs the irregularities, so that the entire first surface 30a of the cushioning material 30 is in contact with the first surface 10a of the first substrate 10, and the entire second surface 30b of the cushioning material 30 is in contact with the first surface 100a of the fixed member 100. In this way, the light emitting module 2 has a large margin for the dimensional accuracy and assembly accuracy of the components, and can efficiently and stably dissipate heat from the light emitting element 21 to the fixed member 100 .

[0125] In addition, in the present embodiment, the first surface 100a of the fixed member 100 is flat, and the buffer material 30 protrudes from the second surface 20b of the second substrate 20 in the free state, but the present invention is not limited thereto. The positional relationship between the second surface 30b of the buffer material 30 and the second surface 20b of the second substrate 20 in the vertical direction can be appropriately selected according to the shape of the mounting area of ​​the light emitting module 2 on the first surface 100a of the fixed member 100.

[0126] Effects other than those described above in this embodiment are the same as those in the first embodiment.

[0127] <Third Embodiment>

[0128] Next, a third embodiment will be described.

[0129] Figure 5 It is a cross-sectional view showing a light emitting module according to the present embodiment.

[0130] This embodiment is an example in which the above-mentioned first embodiment and second embodiment are combined.

[0131] like Figure 5 As shown, in the light emitting module 3 according to the present embodiment, the buffer material 30 is provided between the bottom surface 11a of the recessed portion 11 of the first substrate 10 and the first surface 20a of the second substrate 20, and in both regions of the first surface 10a of the first substrate 10 excluding the recessed portion 11. In addition, the position of the second surface 30b of the buffer material 30 provided on the first surface 10a of the first substrate 10 in the vertical direction and the position of the second surface 20b of the second substrate 20 may be the same as or different from each other.

[0132] The configuration, operation, and effects other than those described above in this embodiment are the same as those in the first embodiment or the second embodiment.

[0133] <Modification>

[0134] Modifications of the above-described embodiments will be described below.

[0135] Figures 6A to 8B It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the first embodiment.

[0136] In addition, in order to make the figure easier to observe, Figures 6A to 8B In the figure, the cushioning material 30 is hatched. In addition, the through hole 16 is omitted from illustration.

[0137] like Fig. 6A As shown, the buffer material 30 may also be provided on the entire bottom surface 11a of the recessed portion 11 of the first substrate 10. This is equivalent to the first embodiment described above. In addition, in fact, there may be a small gap between the side surface 11b of the recessed portion 11 and the side surface of the buffer material 30, and there may also be a small gap between the side surface of the opening 12 and the side surface of the buffer material 30 when viewed from above. The first embodiment also includes such a case.

[0138] The buffer material 30 may be provided only on a portion of the bottom surface 11a of the recessed portion 11 of the first substrate 10. In the following, the shape of the buffer material 30 in a plan view will be described with respect to such a modified example. Figure 6B As shown, the shape of the cushioning material 30 is a frame surrounding the opening 12, and can also be isolated from the side 11b of the recess 11. As a result, when the cushioning material 30 is compressed in the thickness direction, it can be deformed in the horizontal direction, so the thickness change amount becomes larger. Figure 6C As shown in FIG. 1 , the shape of the cushioning material 30 may also be a frame with a cutout 30c formed therein. Thus, the cushioning material 30 is easily deformed in the horizontal direction. Fig. 7A as well as Figure 7B As shown, the shape of the cushioning material 30 may also be a "コ" shape along the three sides of the opening 12. Figure 7C as well as Fig. 8A As shown, the shape of the cushioning material 30 may also be two strips along the opposite sides of the opening 12. Figure 8B As shown, the shape of the cushioning material 30 may be dot-shaped. In addition, the cushioning material 30 may be a combination of the above shapes.

[0139] Figures 9A to 9C It is a bottom view showing the positional relationship between the first substrate and the buffer material in a modification of the second embodiment.

[0140] exist Figures 9A to 9C In order to facilitate the understanding of the drawings, the cushioning material 30 is hatched and the through-hole 16 is omitted from illustration.

[0141] like Fig.9A As shown, the buffer material 30 may also be provided in the entire region other than the recessed portion 11 in the first surface 10a of the first substrate 10. This is equivalent to the above-mentioned second embodiment. In addition, in fact, when viewed from above, there may be a small gap between the side surface 11b of the recessed portion 11 and the side surface of the buffer material 30, and there may be a small gap between the side surface of the first substrate 10 and the side surface of the buffer material 30. The second embodiment also includes such a case.

[0142] The buffer material 30 may be provided only in a portion of the area other than the recessed portion 11 in the first surface 10a of the first substrate 10. In the following, the shape of the buffer material 30 in a plan view will be described with respect to such a modified example. Fig. 9B As shown in FIG. 1 , the buffer material 30 may be provided only around the concave portion 11 and separated from the edge of the first substrate 10. Fig. 9C As shown, the buffer material 30 may be provided only at the four corners of the first surface 10 a of the first substrate 10 .

[0143] <Fourth Implementation Method>

[0144] Next, a fourth embodiment will be described.

[0145] Fig. 10A as well as Fig. 10B It is a cross-sectional view showing a light emitting module according to the present embodiment.

[0146] Fig. 10A Indicates a state of freedom, Fig. 10B Indicates a fixed state. Fig. 10A as well as Fig. 10B Shown with Figure 1B Quite a cross section.

[0147] Fig.11 It is a cross-sectional view showing the heat transfer member in this embodiment.

[0148] like Fig. 10A as well as Fig. 10B As shown, in the light emitting module 4 according to the present embodiment, in addition to the structure of the light emitting module 1 according to the first embodiment, a heat conducting member 40 is further provided. The heat conducting member 40 is provided on the second surface 20b of the second substrate 20. As described above, the second surface 20b of the second substrate 20 is a surface opposite to the first surface 20a on which the light emitting element 21 is mounted.

[0149] The heat conducting member 40 is, for example, in the shape of a plate along the second surface 20 b of the second substrate 20 . The thickness of the heat conducting member 40 is, for example, not less than 10 μm and not more than 500 μm. The first surface 40 a of the heat conducting member 40 is in contact with the second surface 20 b of the second substrate 20 .

[0150] like Fig. 10A As shown, in the free state, the portion of the heat conducting member 40 on the second surface 40b side protrudes from the first surface 10a of the first substrate 10. In addition, the second surface 40b of the heat conducting member 40 is exposed.

[0151] like Fig. 10B As shown, in the fixed state, the buffer material 30 is compressed, the first surface 10a of the first substrate 10 contacts the first surface 100a of the fixed member 100, and the second surface 40b of the thermal conductive member 40 contacts the first surface 100a of the fixed member 100. At this time, the second surface 40b of the thermal conductive member 40 is pressed against the first surface 100a of the fixed member 100 by the rebound force of the buffer material 30.

[0152] like Fig.11 As shown, in the heat conducting member 40, a metal portion 41 and a resin portion 42 are provided. The metal portion 41 is formed by combining a plurality of metal powders 41a. The metal portion 41 contains metal, for example, pure metal. The metal portion 41 contains, for example, one or more metals selected from the group consisting of gold (Au), silver (Ag) and copper (Cu). The resin portion 42 contains a resin material. A portion of the resin portion 42 is disposed between the metal powders 41a.

[0153] In addition, the resin portion 42 may not necessarily be provided in the heat conducting member 40. In this case, air gaps may be formed between the metal powders 41a.

[0154] Next, a method for forming the heat conduction member 40 will be described.

[0155] Fig. 12A It is a cross-sectional view showing a method of forming the heat transfer member in this embodiment.

[0156] Fig. 12B Yes means Fig. 12A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0157] Fig.13A It is a cross-sectional view showing a method of forming the heat transfer member in this embodiment.

[0158] Fig. 13B Yes means Fig.13A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0159] Fig.14AIt is a cross-sectional view showing a method of forming the heat transfer member in this embodiment.

[0160] Fig. 14B Yes means Fig.14A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0161] Fig.15A It is a cross-sectional view showing a method of forming the heat transfer member in this embodiment.

[0162] Fig. 15B Yes means Fig.15A A partial enlarged cross-sectional view of the periphery of the metal powder is shown.

[0163] First, a light emitting module without the heat conducting member 40 is prepared. The structure of the light emitting module is similar to Figure 1B The light emitting module 1 shown is the same. Then, the light emitting surface of the light emitting module, that is, the first surface 20a of the second substrate 20 is directed downward, and the second surface 20b of the second substrate 20 is directed upward.

[0164] On the other hand, Fig. 12A as well as Fig. 12B As shown, a paste 43 in which metal powder 41a is dispersed in a resin liquid 42a is prepared. The resin liquid 42a contains a resin material and an organic solvent. The metal powder 41a contains a metal, for example, a pure metal, for example, one or more metals selected from the group consisting of gold, silver and copper. The particle diameter of the metal powder 41a is, for example, 1 μm or less, preferably 500 nm or less, and more preferably 100 nm or less. By reducing the particle diameter of the metal powder 41a, the metal powder 41a can be easily sintered with each other.

[0165] Next, the paste 43 is applied to the second surface 20b of the second substrate 20. In the applied paste 43, the metal powder 41a is dispersed substantially uniformly in the resin liquid 42a.

[0166] Next, if Fig.13A , Fig. 13B , Fig.14A as well as Fig. 14B As shown, the organic solvent in the paste 43 is volatilized and the resin material in the paste 43 is solidified. For example, the paste 43 is heated to a temperature of 200° C. or less. As a result, the organic solvent is removed from the resin liquid 42a, the metal powders 41a come into contact with each other, the resin material in the resin liquid 42a is solidified to form a solid resin portion 42, and the metal diffuses between the metal powders 41a via the contact points between the metal powders 41a.

[0167] Next, if Fig.15A as well as Fig. 15BAs shown, the metal powder 41a is sintered. For example, the paste 43 is heated to a temperature lower than the melting point of the metal powder 41a, for example, a temperature of 180°C or higher and 250°C or lower. As a result, the metal powders 41a are sintered to form the metal portion 41. At this time, a portion of the resin portion 42 remains between the metal powders 41a. In this way, the heat conducting member 40 is formed. In this way, the heat conducting member 40 is manufactured. Fig. 10A The light emitting module 4 is shown.

[0168] like Fig. 10B As shown, the first substrate 10 of the light emitting module 4 is pressed against the fixed member 100 by the screw 102 , so that the first substrate 10 of the light emitting module 4 and the thermal conductive member 40 are in contact with the fixed member 100 .

[0169] Next, the effects of this embodiment will be described.

[0170] According to the present embodiment, the heat conductive member 40 formed by sintering the metal powder 41a between the second substrate 20 of the light emitting module 4 and the fixed member 100 can improve the thermal conductivity between the second substrate 20 and the fixed member 100. Since the heat conductive member 40 is formed by solidifying the paste 43, it is possible to suppress the formation of a small gap between the heat conductive member 40 and the second surface 20b of the second substrate 20. As a result, high heat dissipation can be achieved.

[0171] The configuration and effects other than those described above in this embodiment are the same as those in the first embodiment.

[0172] <Fifth Implementation Method>

[0173] Next, a fifth embodiment will be described.

[0174] Fig.16A as well as Fig. 16B It is a cross-sectional view showing a light emitting module according to the present embodiment.

[0175] Fig.16A Indicates a state of freedom, Fig. 16B Indicates a fixed state. Fig.16A as well as Fig. 16B Shown with Figure 3B Quite a cross section.

[0176] like Fig.16A as well as Fig. 16B As shown, in the light emitting module 5 according to the present embodiment, in addition to the structure of the light emitting module 2 according to the second embodiment, a heat conducting member 40 is further provided. The heat conducting member 40 is provided on the second surface 20b of the second substrate 20. The structure and formation method of the heat conducting member 40 are as described in the fourth embodiment.

[0177] like Fig.16A As shown, in the free state, the cushioning material 30 provided on the first surface 10 a of the first substrate 10 protrudes more than the thermally conductive member 40 provided on the second surface 20 b of the second substrate 20 .

[0178] like Fig. 16B As shown, in the fixed state, the second surface 30b of the cushioning material 30 contacts the first surface 100a of the fixed member 100, and the second surface 40b of the thermal conductive member 40 contacts the first surface 100a of the fixed member 100. At this time, the cushioning material 30 and the thermal conductive member 40 are pressed against the fixed member 100.

[0179] In the present embodiment, since the heat conduction member 40 is interposed between the second substrate 20 and the member to be fixed 100 , the thermal conductivity between the second substrate 20 and the member to be fixed 100 can be improved.

[0180] The configuration and effects other than those described above in this embodiment are the same as those in the second embodiment.

[0181] <Sixth Implementation Method>

[0182] Next, a sixth embodiment will be described.

[0183] Fig.17 It is a cross-sectional view showing a light emitting module according to the present embodiment.

[0184] Fig.17 It means Figure 5 Quite a cross section.

[0185] like Fig.17 As shown, in the light emitting module 6 according to this embodiment, in addition to the structure of the light emitting module 3 according to the third embodiment, a heat conducting member 40 is further provided. The heat conducting member 40 is provided on the second surface 20b of the second substrate 20. The structure and formation method of the heat conducting member 40 are as described in the fourth embodiment.

[0186] The configuration and effects other than those described above in this embodiment are the same as those in the third embodiment.

[0187] -Industrial Availability-

[0188] The present invention can be used as a light source for lighting devices such as automobile headlights, streetlights, and interior lights.

Claims

1. A light emitting module, comprising: A first substrate having a first surface and a second surface opposite to the first surface, wherein a recess is formed on the first surface, and an opening reaching the second surface is formed on the bottom surface of the recess; a second substrate disposed in the recess; a light emitting element mounted on the second substrate and capable of emitting light through the opening; A buffer material is disposed between the first substrate and the second substrate and has elasticity; A first pad, disposed on the second surface of the first substrate; a second pad provided on the surface of the second substrate on which the light emitting element is mounted and electrically connected to the light emitting element; as well as A lead wire connects the first pad and the second pad via the opening. The second substrate protrudes from the first surface of the first substrate in a state where no force pressing the second substrate against the first substrate is applied.

2. The light emitting module according to claim 1, wherein: In a state of being fixed to a fixed member, the second substrate and the first substrate are in contact with the fixed member.

3. The light emitting module according to claim 1, wherein: The light emitting module further includes a heat conducting member provided on a surface of the second substrate that faces a surface on which the light emitting element is mounted.

4. The light emitting module according to claim 3, wherein: In a state of being fixed to a fixed member, the first substrate and the heat transfer member are in contact with the fixed member.

5. The light emitting module according to claim 2 or 4, wherein: The fixed component is a heat sink.

6. The light emitting module according to any one of claims 1 to 4, wherein: The elastic modulus of the buffer material is 0.1 MPa or more and 1000 MPa or less.

7. The light emitting module according to any one of claims 1 to 4, wherein: The buffer material includes at least one of graphite and an elastic resin material.

8. The light emitting module according to claim 7, wherein: The resin material includes silicone resin.

9. The light emitting module according to claim 3 or 4, wherein: The thermally conductive member has a metal portion.

10. The light emitting module according to claim 9, wherein: The metal portion includes one or more metals selected from the group consisting of gold, silver, and copper.

11. The light emitting module according to claim 9, wherein: The metal part is formed by combining multiple metal powders.

12. The light emitting module according to claim 11, wherein: The thermally conductive member further comprises a resin portion, A portion of the resin portion is disposed between the metal powders.

13. The light emitting module according to any one of claims 1 to 4, wherein: The light emitting module further includes a connector mounted on the second surface of the first substrate, the connector being electrically connected to the light emitting element and being capable of being electrically connected to an external power source.

14. The light emitting module according to claim 13, wherein: The opening and the connector are arranged at positions sandwiching the center of the first substrate when viewed from the second surface toward the first surface.

15. The light emitting module according to any one of claims 1 to 4, wherein: The first substrate is a glass epoxy substrate.

16. The light emitting module according to any one of claims 1 to 4, wherein: The first substrate is formed with a through hole for screw-fixing with a fixed member.

17. The light emitting module according to any one of claims 1 to 4, wherein: The second substrate includes metal or ceramics.

18. A light emitting module comprising: A first substrate having a first surface and a second surface opposite to the first surface, wherein a recess is formed on the first surface, and an opening reaching the second surface is formed on the bottom surface of the recess; a second substrate disposed in the recess; a light emitting element mounted on the second substrate and capable of emitting light through the opening; as well as a buffer material, which is provided in a region other than the concave portion in the first surface of the first substrate and has elasticity, In a state of being fixed to a fixed member, the cushioning material and the second substrate are in contact with the fixed member.

19. A light emitting module comprising: A first substrate having a first surface and a second surface opposite to the first surface, wherein a recess is formed on the first surface, and an opening reaching the second surface is formed on the bottom surface of the recess; a second substrate disposed in the recess; a light emitting element mounted on the second substrate and capable of emitting light through the opening; a buffer material, which is provided in a region other than the concave portion in the first surface of the first substrate and has elasticity; and a heat conducting member provided on a surface of the second substrate that is opposite to a surface on which the light emitting element is mounted, In a state of being fixed to a fixed member, the cushioning material and the thermally conductive member are in contact with the fixed member.

20. The light emitting module according to claim 18 or 19, wherein: The cushioning material protrudes beyond the second substrate in a state where no force is applied to press the second substrate against the first substrate.

21. The light emitting module according to claim 18 or 19, wherein: The fixed component is a heat sink.

22. The light emitting module according to claim 18 or 19, wherein: The elastic modulus of the buffer material is 0.1 MPa or more and 1000 MPa or less.

23. The light emitting module according to claim 18 or 19, wherein: The buffer material includes at least one of graphite and an elastic resin material.

24. The light emitting module according to claim 23, wherein: The resin material includes silicone resin.

25. The light emitting module according to claim 19, wherein: The thermally conductive member has a metal portion.

26. The light emitting module according to claim 25, wherein: The metal portion includes one or more metals selected from the group consisting of gold, silver, and copper.

27. The light emitting module according to claim 25 or 26, wherein: The metal part is formed by combining multiple metal powders.

28. The light emitting module according to claim 27, wherein: The thermally conductive member further comprises a resin portion, A portion of the resin portion is disposed between the metal powders.

29. The light emitting module according to claim 18 or 19, wherein: The light emitting module further includes a connector mounted on the second surface of the first substrate, the connector being electrically connected to the light emitting element and being capable of being electrically connected to an external power source.

30. The light emitting module according to claim 29, wherein: The opening and the connector are arranged at positions sandwiching the center of the first substrate when viewed from the second surface toward the first surface.

31. The light emitting module according to claim 29, wherein: The light emitting module further comprises: a first pad, disposed on the second surface of the first substrate and electrically connected to the connector; a second pad provided on the surface of the second substrate on which the light emitting element is mounted and electrically connected to the light emitting element; and A lead connects the first pad and the second pad.

32. The light emitting module according to claim 18 or 19, wherein: The first substrate is a glass epoxy substrate.

33. The light emitting module according to claim 18 or 19, wherein: The first substrate is formed with a through hole for screw-fixing with a fixed member.

34. The light emitting module according to claim 18 or 19, wherein: The second substrate includes metal or ceramics.

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