A method and system for testing heat dissipation function of a circuit board

Abstract

The present invention relates to a method and system for testing the heat dissipation function of a circuit board, the method comprising the following steps: (1) fixing the circuit board to a fixing unit; (2) turning on the power supply; (3) connecting the circuit board with a connecting unit; (4) heating the circuit board to a certain temperature by a heating module; (5) detecting that the heating temperature of the circuit board reaches a certain temperature by a detection module, and transmitting a signal; (6) the heat dissipation module receives the signal and starts working. The method and system for testing the heat dissipation function of a circuit board of the present invention can not only adjust the heating temperature, but also make the test safe and convenient, and also save time and labor, thereby greatly improving the test efficiency.

Description

[Technical field]

[0001] The present invention relates to the technical field of testing circuit boards, and in particular to a method and a system for testing the heat dissipation function of a circuit board. [Background technology]

[0002] Currently, production workshops need to test the heat dissipation function of circuit boards. The current testing method is: fix the circuit board on a fixture, use a hot air gun to heat the circuit board, and check the heat dissipation operation of the exhaust fan to confirm whether the heat dissipation function of the circuit board is normal. However, this testing method has the problems of uncontrollable heating temperature, unsafe and inconvenient testing, and time-consuming and labor-intensive.

[0003] In view of this, it is necessary to provide a method and system for testing the heat dissipation function of a circuit board to solve the problems of the current testing method, such as uncontrollable heating temperature, unsafe and inconvenient testing, and time-consuming and labor-intensive testing. [Summary of the invention]

[0004] The purpose of the present invention is to provide a method and system for testing the heat dissipation function of a circuit board, so as to solve the problems of the current testing method that the heating temperature cannot be adjusted, the test is unsafe, inconvenient, time-consuming and labor-intensive.

[0005] In order to achieve the above object, the present invention provides a method for testing the heat dissipation function of a circuit board, the method comprising the following steps:

[0006] (1) Fixing the circuit board to the fixing unit;

[0007] (2) Turn on the power supply;

[0008] (3) connecting the connection unit to the circuit board;

[0009] (4) The heating module heats the circuit board to a certain temperature;

[0010] (5) The detection module detects that the heating temperature of the circuit board reaches a certain temperature and transmits a signal;

[0011] (6) The heat dissipation module receives the signal and starts working.

[0012] Optionally, a thermistor is provided on the circuit board in step (1).

[0013] Optionally, the specific step of connecting the power supply in step (2) is that the power supply connects the connection circuits of the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

[0014] Optionally, in step (4), the specific step of the heating module heating the circuit board to a certain temperature is that the heating unit of the heating module heats the thermistor on the circuit board, and the control unit of the heating module controls the heating temperature of the thermistor on the circuit board to reach a certain temperature.

[0015] Optionally, the detection unit of the detection module in step (5) detects the heating temperature of the thermistor on the circuit board, and when the heating temperature reaches a certain temperature, the detection unit transmits a signal to the heat dissipation module.

[0016] The present invention also provides a system for testing the heat dissipation function of a circuit board, and the method for testing the heat dissipation function of a circuit board is applied, which comprises:

[0017] A power module, the power module comprising a power supply;

[0018] A switch module, the switch module is connected to the power module, the switch module comprises an opening unit and a closing unit, the opening unit is used to turn on the power, and the closing unit is used to turn off the power;

[0019] A processing module, the processing module is connected to the switch module, the processing module comprises a connecting unit and a fixing unit, the fixing unit is used to fix the circuit board, and the connecting unit is used to connect the connecting circuit of the thermistor on the circuit board;

[0020] A heating module, the heating module is connected to the processing module, the heating module comprises a heating unit and a control unit, the heating unit is used to heat the thermistor on the circuit board, and the control unit is used to control the heating temperature of the thermistor on the circuit board;

[0021] A detection module, the detection module is connected to the heating module, the detection module includes a detection unit, and the detection unit is used to detect whether the heating temperature of the thermistor on the circuit board reaches a certain temperature;

[0022] A heat dissipation module is connected to the detection module, and the heat dissipation module includes a heat dissipation unit, and the heat dissipation unit is used to reduce the temperature of the circuit board.

[0023] Optionally, a plurality of probes are provided on the connection unit, the probes are connected to thermistors on the circuit board, and the probes are conductive.

[0024] Optionally, a heater is provided on the heating unit, and a temperature controller is provided on the control unit, and the temperature controller is a digitally adjustable temperature controller.

[0025] Optionally, a temperature detector is provided on the detection unit, and an exhaust fan is provided on the heat dissipation unit.

[0026] Optionally, the system for testing the heat dissipation function of a circuit board further includes a power connection circuit, which connects the power module, the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

[0027] Compared with the prior art, the method and system for testing the heat dissipation function of a circuit board of the present invention connect the thermistor on the circuit board through a probe, and then control the heating temperature of the thermistor to a certain temperature through a heater and a temperature controller. When the temperature detector detects that the heating temperature reaches a certain temperature, the temperature detector transmits a signal to the exhaust fan, and finally the exhaust fan starts the heat dissipation operation after receiving the signal, which further indicates that the heat dissipation function of the circuit board is normal. By using the method and system for testing the heat dissipation function of a circuit board of the present invention, not only can the heating temperature be adjusted, the test is safe and convenient, but also time and labor are saved, and the test efficiency is greatly improved.

Brief Description of the Drawings

[0028] Figure 1 It is a schematic diagram of a method for testing the heat dissipation function of a circuit board according to the present invention.

[0029] Figure 2 It is a schematic diagram of a system for testing the heat dissipation function of a circuit board according to the present invention.

[0030] Figure 3 It is a schematic diagram of a method for testing the heat dissipation function of a circuit board of the present invention in a preferred embodiment. [Specific implementation method]

[0031] In order to further illustrate the technical means and effects adopted by the present invention, a detailed description is given below in conjunction with a preferred embodiment of the present invention and its accompanying drawings.

[0032] See also Figure 1 and Figure 2 As shown, Figure 1 is a schematic diagram of a method for testing the heat dissipation function of a circuit board according to the present invention, Figure 2 Schematic diagram of a system for testing the heat dissipation function of a circuit board according to the present invention. The present invention provides a method for testing the heat dissipation function of a circuit board, the method comprising the following steps:

[0033] S110: Fixing the circuit board to the fixing unit;

[0034] S120: Turn on the power supply;

[0035] S130: The connecting unit connects the circuit board;

[0036] S140: The heating module heats the circuit board to a certain temperature;

[0037] S150: The detection module detects that the heating temperature of the circuit board reaches a certain temperature and transmits a signal;

[0038] S160: The heat dissipation module receives the signal and starts working.

[0039] Wherein, in the step S110, a thermistor is provided on the circuit board.

[0040] The specific step of turning on the power in step S120 is that the power is turned on the connection circuits of the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

[0041] Among them, the specific steps of the heating module heating the circuit board to a certain temperature in step S140 are that the heating unit of the heating module heats the thermistor on the circuit board, and the control unit of the heating module controls the heating temperature of the thermistor on the circuit board to reach a certain temperature.

[0042] Wherein, in the step S150, the detection unit of the detection module detects the heating temperature of the thermistor on the circuit board, and when the heating temperature reaches a certain temperature, the detection unit transmits a signal to the heat dissipation module.

[0043] The present invention also provides a system 100 for testing the heat dissipation function of a circuit board, which uses the above method for testing the heat dissipation function of a circuit board, and includes:

[0044] A power module 110, wherein the power module 110 includes a power supply 111, and the power supply 111 is used for supplying power;

[0045] A switch module 120, wherein the switch module 120 is connected to the power module 110, and the switch module 120 includes an opening unit 121 and a closing unit 122, wherein the opening unit 121 is used to open the power supply 111, and the closing unit 122 is used to close the power supply 111;

[0046] A processing module 130, wherein the processing module 130 is connected to the switch module 120, and the processing module 130 includes a connecting unit 131 and a fixing unit 132, wherein the fixing unit 132 is used to fix the circuit board, and the connecting unit 131 is used to connect the connecting circuit of the thermistor on the circuit board;

[0047] A heating module 140, wherein the heating module 140 is connected to the processing module 130, and the heating module 140 includes a heating unit 141 and a control unit 142, wherein the heating unit 141 is used to heat the thermistor on the circuit board, and the control unit 142 is used to control the heating temperature of the thermistor on the circuit board;

[0048] A detection module 150, wherein the detection module 150 is connected to the heating module 140, and the detection module 150 includes a detection unit 151, and the detection unit 151 is used to detect whether the heating temperature of the thermistor on the circuit board reaches a certain temperature;

[0049] The heat dissipation module 160 is connected to the detection module 150 . The heat dissipation module 160 includes a heat dissipation unit 161 . The heat dissipation unit 161 is used to reduce the temperature of the circuit board.

[0050] The connection unit 131 is provided with a plurality of probes, the probes are connected to the thermistors on the circuit board, the probes are conductive, and the probes are used to connect the connection circuits of the thermistors on the circuit board.

[0051] Among them, a heater is arranged on the heating unit 141, and a temperature controller is arranged on the control unit 142. The temperature controller is a digitally adjustable temperature controller. The heater is used to heat the thermistor. The digitally adjustable temperature controller is used to regulate the heating temperature and make the heating temperature of the thermistor on the circuit board reach a certain set temperature.

[0052] Among them, a temperature detector is set on the detection unit 151, and an exhaust fan is set on the heat dissipation unit 161. The temperature detector is used to detect the heating temperature of the thermistor, and the exhaust fan is used to dissipate heat. When the temperature detector detects that the heating temperature of the thermistor reaches a certain temperature, a signal is transmitted to the exhaust fan, and the exhaust fan starts the heat dissipation operation, which indicates that the heat dissipation function of the circuit board is normal.

[0053] Among them, the system 100 for testing the heat dissipation function of a circuit board also includes a power connection circuit (not shown in the figure), and the power connection circuit (not shown in the figure) connects the power module, the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

[0054] See also Figure 3 As shown, Figure 3 is a schematic diagram of a method for testing the heat dissipation function of a circuit board of the present invention in a preferred embodiment. The steps of the method for testing the heat dissipation function of a circuit board of the present invention in a preferred embodiment are:

[0055] S210: Fixing the circuit board to the fixing unit;

[0056] S220: Turn on the power supply;

[0057] S230: Connect the thermistor on the circuit board by energizing the probe;

[0058] S240: using a heater and a temperature controller to heat and control the thermistor to a certain temperature, which is 45 degrees Celsius;

[0059] S250: When the temperature detector detects that the heating temperature of the thermistor reaches 45 degrees Celsius, it transmits a signal;

[0060] S260: The exhaust fan receives the signal and starts cooling operation.

[0061] The specific step of turning on the power in step S220 is that the power is turned on the connection circuits of the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

[0062] Wherein, the probe in step S230 is conductive.

[0063] Wherein, the temperature controller in step S240 is a digitally adjustable temperature controller, and the digitally adjustable temperature controller can adjust the heating temperature of the thermistor and set the heating temperature to a certain temperature.

[0064] Compared with the prior art, the method for testing the heat dissipation function of a circuit board of the present invention and the system 100 thereof connect the thermistor on the circuit board through a probe, and then control the heating temperature of the thermistor to a certain temperature through a heater and a temperature controller. When the temperature detector detects that the heating temperature reaches a certain temperature, the temperature detector transmits a signal to the exhaust fan, and finally the exhaust fan starts the heat dissipation operation after receiving the signal, which further indicates that the heat dissipation function of the circuit board is normal. By using the method for testing the heat dissipation function of a circuit board of the present invention and the system 100 thereof, not only the heating temperature can be adjusted, the test is safe and convenient, but also time and labor are saved, and the test efficiency is greatly improved.

[0065] It should be pointed out that the present invention is not limited to the above-mentioned implementation modes, and any simple modifications, equivalent changes and modifications made to the above-mentioned embodiments by any technician familiar with the profession based on the technical solution of the present invention all fall within the protection scope of the present invention.

Claims

1. A method for testing the heat dissipation function of a circuit board, characterized in that: The following steps are involved: (1) Fix the circuit board to the fixing unit; (2) Turn on the power supply; (3) The connection unit is connected to the circuit board; (4) The heating unit of the heating module heats the thermistor on the circuit board, and the control unit of the heating module controls the heating temperature of the thermistor on the circuit board to reach a certain temperature; (5) The detection module detects that the heating temperature of the circuit board reaches a certain temperature and transmits a signal; (6) The heat dissipation module receives the signal and starts working.

2. The method for testing the heat dissipation function of a circuit board according to claim 1, characterized in that: In the step (1), a thermistor is provided on the circuit board.

3. The method for testing the heat dissipation function of a circuit board according to claim 1, characterized in that: The specific step of turning on the power in step (2) is to turn on the power switch module, the processing module, the heating module, the detection module and the connection circuit of the heat dissipation module.

4. The method for testing the heat dissipation function of a circuit board according to claim 1, characterized in that: In the step (5), the detection unit of the detection module detects the heating temperature of the thermistor on the circuit board. When the heating temperature reaches a certain temperature, the detection unit transmits a signal to the heat dissipation module.

5. A system for testing the heat dissipation function of a circuit board, using the above method for testing the heat dissipation function of a circuit board, characterized in that: include: A power module, the power module comprising a power supply; A switch module, the switch module is connected to the power module, the switch module comprises an opening unit and a closing unit, the opening unit is used to turn on the power, and the closing unit is used to turn off the power; A processing module, the processing module is connected to the switch module, the processing module comprises a connecting unit and a fixing unit, the fixing unit is used to fix the circuit board, and the connecting unit is used to connect the connecting circuit of the thermistor on the circuit board; A heating module, the heating module is connected to the processing module, the heating module comprises a heating unit and a control unit, the heating unit is used to heat the thermistor on the circuit board, and the control unit is used to control the heating temperature of the thermistor on the circuit board; A detection module, the detection module is connected to the heating module, the detection module includes a detection unit, and the detection unit is used to detect whether the heating temperature of the thermistor on the circuit board reaches a certain temperature; A heat dissipation module is connected to the detection module, and the heat dissipation module includes a heat dissipation unit, and the heat dissipation unit is used to reduce the temperature of the circuit board.

6. The system for testing the heat dissipation function of a circuit board according to claim 5, characterized in that: A plurality of probes are arranged on the connection unit, the probes are connected to the thermistors on the circuit board, and the probes are conductive.

7. The system for testing the heat dissipation function of a circuit board according to claim 5, characterized in that: A heater is arranged on the heating unit, and a temperature controller is arranged on the control unit. The temperature controller is a digitally adjustable temperature controller.

8. The system for testing the heat dissipation function of a circuit board according to claim 5, characterized in that: The detection unit is provided with a temperature detector, and the heat dissipation unit is provided with an exhaust fan.

9. The system for testing the heat dissipation function of a circuit board according to claim 5, characterized in that: The system for testing the heat dissipation function of a circuit board also includes a power connection circuit, which connects the power module, the switch module, the processing module, the heating module, the detection module and the heat dissipation module.

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