A left and right double-station circuit board hot-melt pressing equipment

Abstract

The invention discloses a left-right double-station circuit board hot-melt pressing device, which includes a frame, a left pressing station, a right pressing station, and a loading and unloading station are arranged on the frame, a conveying slide is fixed on the frame, a first material loading hot-pressing mechanism and a second material loading hot-pressing mechanism are arranged on the conveying slide, a left lower pressing hot-melt mechanism and a right lower pressing hot-melt mechanism are fixed on the frame, the first material loading hot-pressing mechanism is used to take a circuit board from the loading and unloading station and transmit it to the left lower pressing hot-melt mechanism, and the circuit board on the first material loading hot-pressing mechanism is hot-melt pressed by the cooperation of the left lower pressing hot-melt mechanism and the first material loading hot-pressing mechanism, the second material loading hot-pressing mechanism is used to take a circuit board from the loading and unloading station and transmit it to the right lower pressing hot-melt mechanism, and the circuit board on the second material loading hot-pressing mechanism is hot-melt pressed by the cooperation of the right lower pressing hot-melt mechanism and the second material loading hot-pressing mechanism. The invention can ensure production efficiency, improve product yield and improve processing accuracy.

Description

Technical Field

[0001] The invention relates to circuit board processing equipment, in particular to a left-right double-station circuit board hot-melt pressing equipment. Background Art

[0002] At present, in the circuit board industry, the hot melt riveting equipment for pressing multi-layer boards generally has a hot pressing processing mechanism and a loading and unloading mechanism. In actual applications, each hot pressing processing mechanism generally corresponds to a loading and unloading mechanism, and there are problems such as low efficiency during the execution process. In addition, a drawer-type loading and unloading method can also be adopted, that is, by setting up upper and lower loading and unloading mechanisms, and coordinating the lifting and lowering movement of the hot pressing processing mechanism to complete the hot melt pressing. Although this drawer-type loading and unloading method can improve the loading and unloading efficiency, there is a problem of wear of the mechanical moving mechanism, and the foreign matter and lubricating oil generated during the movement are easy to fall on the product, resulting in many cases of product scrapping. In addition, in order to realize the alternating movement of the upper and lower tables, the actuator where the hot melt head is located needs to be lifted and lowered as a whole, resulting in the product processing accuracy difficult to meet the ideal requirements. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a left-right double-station circuit board hot-melt pressing device that can ensure production efficiency, improve product yield and improve processing accuracy in view of the shortcomings of the existing technology.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions.

[0005] A left-right double-station circuit board hot-melt pressing device comprises a frame, a left pressing station and a right pressing station are arranged on the frame, a loading and unloading station is formed between the left pressing station and the right pressing station, a conveying slide is fixed on the frame, the conveying slide passes through the left pressing station, the loading and unloading station and the right pressing station in sequence, a first material loading hot-pressing mechanism and a second material loading hot-pressing mechanism are arranged on the conveying slide, a left lower pressing hot-melt mechanism and a right lower pressing hot-melt mechanism are fixed on the frame, The first loading and hot pressing mechanism is used to take the circuit board from the loading and unloading station and transfer it to the lower left hot melt mechanism, and the circuit board on the first loading and hot pressing mechanism is hot melt pressed by the cooperation of the lower left hot melt mechanism and the first loading and hot pressing mechanism. The second loading and hot pressing mechanism is used to take the circuit board from the loading and unloading station and transfer it to the lower right hot melt mechanism, and the circuit board on the second loading and hot pressing mechanism is hot melt pressed by the cooperation of the lower right hot melt mechanism and the second loading and hot pressing mechanism.

[0006] Preferably, a left bracket and a right bracket are fixed on the frame, the left lower pressure hot melt mechanism is fixed on the left bracket, and the right lower pressure hot melt mechanism is fixed on the right bracket.

[0007] Preferably, the first material loading and hot pressing mechanism is fixedly connected to the second material loading and hot pressing mechanism so that the first material loading and hot pressing mechanism and the second material loading and hot pressing mechanism move synchronously.

[0008] Preferably, the left lower hot melt mechanism includes a top plate, on which a first transverse adjustment slide rail and a first longitudinal adjustment slide rail are fixed, the first transverse adjustment slide rail is provided with a first transverse translation upright plate and the two are slidably connected, the first longitudinal adjustment slide rail is provided with a first longitudinal translation upright plate and the two are slidably connected, and a plurality of downwardly arranged upper hot melt mechanisms are respectively fixed on the first transverse translation upright plate and the first longitudinal adjustment slide rail, a pre-pressing lifting mechanism is fixed on the top plate, a pre-pressing plate is fixed at the lifting end of the pre-pressing lifting mechanism, a plurality of upper notches are provided on the pre-pressing plate, and the upper notches are aligned one by one with the upper hot melt mechanism, when the first loading hot pressing mechanism transfers the circuit board to the bottom of the left lower hot melt mechanism, the pre-pressing lifting mechanism drives the pre-pressing plate to descend and pre-press the circuit board, and then the upper hot melt mechanism performs hot-melt pressing on the circuit board.

[0009] Preferably, the upper hot melt mechanism includes an upper hot melt cylinder and an upper hot melt head, the upper hot melt cylinder is fixedly connected to the first transverse translation vertical plate or the first longitudinal adjustment slide rail, the upper hot melt head is aligned with the upper slot, and the upper hot melt head can pass through the upper slot.

[0010] Preferably, the top plate is a "X"-shaped top plate.

[0011] Preferably, the pre-pressure lifting mechanism is fixed at the center of the top plate.

[0012] Preferably, a "cross"-shaped connecting plate is fixed to the lower end of the pre-pressing lifting mechanism, and the bottom of the connecting plate is fixedly connected to the pre-pressing plate via a plurality of columns.

[0013] Preferably, two optical bars extending upward are fixed on the connecting plate, two sliding sleeves are fixed on the top plate, the two optical bars pass through the two sliding sleeves respectively, and the optical bars are slidably connected to the sliding sleeves.

[0014] Preferably, the structure of the right lower pressure hot melt mechanism is the same as the structure of the left lower pressure hot melt mechanism.

[0015] In the left-right double-station circuit board hot-melt pressing equipment disclosed in the present invention, the first loading hot-pressing mechanism and the second loading hot-pressing mechanism can be used for loading and unloading materials, and can also cooperate with the left lower pressing hot-melt mechanism and the right lower pressing hot-melt mechanism to complete hot-pressing, that is, when the first loading hot-pressing mechanism is loading and unloading materials, the second loading hot-pressing mechanism can perform hot-melt pressing operations at the right pressing station, and when the second loading hot-pressing mechanism is loading and unloading materials, the first loading hot-pressing mechanism can perform hot-melt pressing operations at the left pressing station. Compared with the prior art, the present invention better guarantees production efficiency. At the same time, compared with the drawer-type processing method, the present invention can effectively reduce wear and avoid oil pollution, thereby ensuring product yield and improving processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional diagram of the hot-melt pressing device of the present invention;

[0017] Figure 2 A top view of the hot melt pressing device of the present invention;

[0018] Figure 3 It is a side view of the hot melt pressing device of the present invention;

[0019] Figure 4 The structure of the first material loading and hot pressing mechanism, the second material loading and hot pressing mechanism and the frame Figure 1 ;

[0020] Figure 5 The structure of the first material loading and hot pressing mechanism, the second material loading and hot pressing mechanism and the frame Figure 2 ;

[0021] Figure 6 The structure of the first material loading hot pressing mechanism and the second material loading hot pressing mechanism Figure 1 ;

[0022] Figure 7 The structure of the first material loading hot pressing mechanism and the second material loading hot pressing mechanism Figure 2 ;

[0023] Figure 8 is an exploded view of the first material loading and hot pressing mechanism;

[0024] Fig. 9 It is a structural diagram of the left lower pressure hot-melt mechanism and the left bracket;

[0025] Fig.10 The structure of the left lower pressure hot melt mechanism Figure 1 ;

[0026] Fig.11 The structure of the left lower pressure hot melt mechanism Figure 2 ;

[0027] Fig.12This is an exploded view of the lower left pressure hot melt mechanism. DETAILED DESCRIPTION

[0028] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments.

[0029] Embodiment 1

[0030] Combination Figures 1 to 12 As shown, this embodiment proposes a left-right double-station circuit board hot-melt pressing device, which includes a frame 1, on which a left pressing station 10 and a right pressing station 11 are provided, and a loading and unloading station 12 is formed between the left pressing station 10 and the right pressing station 11, and a conveying slide 100 is fixed on the frame 1, and the conveying slide 100 sequentially passes through the left pressing station 10, the loading and unloading station 12 and the right pressing station 11, and a first material loading hot-pressing mechanism 2 and a second material loading hot-pressing mechanism 3 are provided on the conveying slide 100, and a left lower pressing hot-melt mechanism 15 is fixed on the frame 1. and the right lower pressing hot melt mechanism 16, the first loading hot pressing mechanism 2 is used to take the circuit board from the loading and unloading station 12 and transfer it to the left lower pressing hot melt mechanism 15, and the circuit board on the first loading hot pressing mechanism 2 is hot-melt pressed by the cooperation of the left lower pressing hot melt mechanism 15 and the first loading hot pressing mechanism 2, the second loading hot pressing mechanism 3 is used to take the circuit board from the loading and unloading station 12 and transfer it to the right lower pressing hot melt mechanism 16, and the circuit board on the second loading hot pressing mechanism 3 is hot-melt pressed by the cooperation of the right lower pressing hot melt mechanism 16 and the second loading hot pressing mechanism 3.

[0031] In the above-mentioned equipment, the first loading hot pressing mechanism 2 and the second loading hot pressing mechanism 3 can be used for loading and unloading materials, and can also cooperate with the left lower pressing hot melt mechanism 15 and the right lower pressing hot melt mechanism 16 to complete hot pressing, that is, when the first loading hot pressing mechanism 2 is loading and unloading materials, the second loading hot pressing mechanism 3 can perform hot melt pressing operations at the right pressing station 11, and when the second loading hot pressing mechanism 3 is loading and unloading materials, the first loading hot pressing mechanism 2 can perform hot melt pressing operations at the left pressing station 10. Compared with the prior art, the present invention better guarantees production efficiency. At the same time, compared with the drawer-type processing method, the present invention can effectively reduce wear and avoid oil pollution, thereby ensuring product yield and improving processing accuracy.

[0032] In order to play a supporting and fixing role, in this embodiment, a left bracket 13 and a right bracket 14 are fixed to the frame 1, the left lower pressure hot melt mechanism 15 is fixed to the left bracket 13, and the right lower pressure hot melt mechanism 16 is fixed to the right bracket 14.

[0033] Furthermore, the first material loading and hot pressing mechanism 2 is fixedly connected to the second material loading and hot pressing mechanism 3 so that the first material loading and hot pressing mechanism 2 and the second material loading and hot pressing mechanism 3 move synchronously.

[0034] In order to realize the downward hot-melt operation, in this embodiment, the left downward hot-melt mechanism 15 includes a top plate 150, on which a first transverse adjustment rail 151 and a first longitudinal adjustment rail 152 are fixed, the first transverse adjustment rail 151 is provided with a first transverse translation vertical plate 153 and the two are slidably connected, the first longitudinal adjustment rail 152 is provided with a first longitudinal translation vertical plate 154 and the two are slidably connected, and the first transverse translation vertical plate 153 and the first longitudinal adjustment rail 152 are respectively fixed with a plurality of upper hot-melt mechanisms 1 arranged downward. 55, a pre-pressing lifting mechanism 156 is fixed on the top plate 150, and a pre-pressing plate 157 is fixed to the lifting end of the pre-pressing lifting mechanism 156, and a plurality of upper notches 158 are opened on the pre-pressing plate 157, and the upper notches 158 are aligned one by one with the upper hot-melt mechanism 155. When the first loading hot-pressing mechanism 2 transfers the circuit board to the bottom of the left lower hot-melt mechanism 15, the pre-pressing lifting mechanism 156 drives the pre-pressing plate 157 to descend and pre-press the circuit board, and then the upper hot-melt mechanism 155 performs hot-melt pressing on the circuit board.

[0035] As a preferred embodiment, the upper hot melt mechanism 155 includes an upper hot melt cylinder 1550 and an upper hot melt head 1551. The upper hot melt cylinder 1550 is fixedly connected to the first transverse translation vertical plate 153 or the first longitudinal adjustment slide rail 152. The upper hot melt head 1551 is aligned with the upper slot 158, and the upper hot melt head 1551 can pass through the upper slot 158.

[0036] In this embodiment, the top plate 150 is a “X”-shaped top plate. The pre-pressing lifting mechanism 156 is fixed at the center of the top plate 150 .

[0037] Correspondingly, a “X”-shaped connecting plate 159 is fixed to the lower end of the pre-pressing lifting mechanism 156 , and the bottom of the connecting plate 159 is fixedly connected to the pre-pressing plate 157 via a plurality of columns 1590 .

[0038] In order to achieve reliable lifting and lowering, in this embodiment, two upwardly extending optical bars 1591 are fixed on the connecting plate 159, and two sliding sleeves 1500 are fixed on the top plate 150. The two optical bars 1591 pass through the two sliding sleeves 1500 respectively, and the optical bars 1591 are slidably connected to the sliding sleeves 1500.

[0039] Furthermore, the structure of the right lower pressure hot melt mechanism 16 is the same as the structure of the left lower pressure hot melt mechanism 15 .

[0040] Embodiment 2

[0041] In actual applications, for circuit board hot melt pressing equipment, its loading and unloading mechanism generally realizes loading and unloading one-to-one with the hot melt pressing mechanism. This loading and unloading method is inefficient. In addition, how to perform hot melt pressing processing while loading and unloading to ensure production efficiency and processing accuracy is a technical problem that needs to be urgently solved in the existing technology.

[0042] In this regard, this embodiment proposes a double-station lateral loading and unloading mechanism for circuit board hot-melt pressing equipment, combined with Figures 3 to 8 As shown, the hot melt pressing equipment includes a frame 1, on which a left pressing station 10 and a right pressing station 11 are provided, and a loading and unloading station 12 is formed between the left pressing station 10 and the right pressing station 11, and the double-station transverse loading and unloading mechanism includes a conveying rail 100, and the conveying rail 100 is fixed on the frame 1, and a first transverse platform 20 and a second transverse platform 30 distributed on the left and right are provided on the conveying rail 100, and the first transverse platform 20 is fixedly connected to the second transverse platform 30, and the first transverse platform 20 and the second transverse platform 30 are fixedly connected. 0 are both slidably connected to the conveying slide rail 100, a first carrier plate 21 for placing circuit boards is fixed on the first transverse moving platform 20, and a second carrier plate 31 for placing circuit boards is fixed on the second transverse moving platform 30. When the first transverse moving platform 20 is translated to the left pressing station 10 and hot-melt pressing is performed, the second transverse moving platform 30 is located at the loading and unloading station 12 for loading and unloading. When the first transverse moving platform 20 is translated to the loading and unloading station 12 for loading and unloading, the second transverse moving platform 30 is located at the right pressing station 11 for hot-melt pressing.

[0043] In the above-mentioned mechanism, a first transverse moving platform 20 and a second transverse moving platform 30 that move synchronously are simultaneously arranged on the conveying slide rail 100. During the movement of the two transverse moving platforms, when the first transverse moving platform 20 is translated to the left pressing station 10, hot melt pressing processing is performed. At the same time, the second transverse moving platform 30 is located at the loading and unloading station 12 for loading and unloading. When the first transverse moving platform 20 is translated to the loading and unloading station 12, loading and unloading are performed. At the same time, the second transverse moving platform 30 is located at the right pressing station 11 for hot melt pressing processing. Based on the above structure, it can be seen that the present invention preferably sets two pressing stations on the frame 1, and uses two synchronously moving transverse platforms to transport the circuit board. Compared with the one-to-one loading and unloading method, the present invention greatly improves the processing efficiency, and the present invention adopts a transverse method to transmit circuit board materials. Compared with the drawer-type loading and unloading method, the present invention can avoid debris and oil pollution to the product, thereby ensuring the product yield. In addition, the first transverse platform 20 and the second transverse platform 30 in the present invention are in the same horizontal position, and the downward hot melt mechanism does not need to rise or fall as a whole during the execution process, which not only simplifies the action process, but also avoids the overall movement of the downward hot melt mechanism affecting the processing accuracy, and better meets the production requirements.

[0044] In order to fix the first transverse moving platform 20 and the second transverse moving platform 30 to each other, the present embodiment includes an intermediate platform 22 , and the intermediate platform 22 is fixed between the first transverse moving platform 20 and the second transverse moving platform 30 .

[0045] As a preferred embodiment, the first material loading plate 21 is located above the first transverse platform 20 and there is a preset distance between the two.

[0046] Correspondingly, the second material loading plate 31 is located above the second transverse platform 30 and there is a preset distance between the two.

[0047] In order to achieve reliable lateral movement, in this embodiment, two conveying slide rails 100 are fixed on the frame 1, and four first slides 22 are fixed to the bottom of the first lateral movement platform 20. The four first slides 22 are respectively arranged on the two conveying slide rails 100, and the first slides 22 are slidably matched with the conveying slide rails 100.

[0048] Furthermore, four second slides 32 are fixed to the bottom of the second transverse platform 30 . The four second slides 32 are respectively disposed on two conveying rails 100 , and the second slides 32 are slidably matched with the conveying rails 100 .

[0049] In order to facilitate the transverse movement of the first transverse movement platform 20 and the second transverse movement platform 30, in this embodiment, a pulley support 23 is fixed to the bottom of the first transverse movement platform 20, and a pulley 24 is provided on the pulley support 23. A driving motor is installed on the frame 1, and the driving motor and the pulley 24 are connected by a belt. The driving motor drives the pulley 24 to rotate forward and reversely through the belt, thereby driving the first transverse movement platform 20 and the second transverse movement platform 30 to reciprocate along the conveying slide rail 100.

[0050] Embodiment 3

[0051] In actual applications, the transverse platform mechanism of the circuit board hot melt pressing equipment generally only has the function of placing the circuit board material, and notches are opened on the platform to facilitate the up and down hot pressing actions. However, due to the different shapes and sizes of the circuit boards and the influence of manual material placement, it is difficult to ensure that the multi-layer circuit boards are aligned with each other. Therefore, how to ensure the accurate positioning of the circuit boards, thereby improving the processing accuracy and product yield, is a technical problem that needs to be urgently solved in the existing technology.

[0052] In this regard, this embodiment proposes a lifting hot melt alignment mechanism for a circuit board hot melt pressing device, combined with Figures 3 to 10 As shown, it includes a first transverse platform 20, a "cross"-shaped support plate 200 is fixed above the first transverse platform 20, and there is a preset distance between the support plate 200 and the first transverse platform 20, a first material loading plate 21 is fixed on the support plate 200, a second transverse adjustment rail 201 and a second longitudinal adjustment rail 202 are fixed on the first transverse platform 20, a second transverse translation vertical plate 203 is provided on the second transverse adjustment rail 201 and the two are slidably connected, a second longitudinal translation vertical plate 204 is provided on the second longitudinal adjustment rail 202, and the second transverse translation vertical plate 203 and the second transverse translation vertical plate 204 are respectively A plurality of upwardly disposed lower hot-melt mechanisms 205 are fixed thereto, a plurality of lower notches 206 are provided on the first loading plate 21, the lower hot-melt mechanisms 205 are aligned one by one with the lower notches 206, four slide grooves 210 are provided on the support plate 200, the four slide grooves 210 are distributed in a "cross" shape, a slider 211 is provided in the slide groove 210 and the two are slidably connected, a vertically disposed limit rod 212 is fixed on the slider 211, four limit slots 213 of preset lengths are provided on the first loading plate 21, the limit slots 213 are aligned one by one with the slide grooves 210, the limit rod 212 passes through the limit slot 213 and the two are slidably connected.

[0053] In the above structure, by adjusting the horizontal positions of the second transverse translation upright plate 203 and the second longitudinal translation upright plate 204, the hot pressing positions of the multiple lower hot melt mechanisms 205 can be adjusted. On this basis, the present invention respectively sets sliders 211 in the four slide grooves 210 of the support plate 200, and the position of the limit rod 212 is adjusted by adjusting the position of the slider. The four limit rods 212 can be used to limit the circuit board to the corresponding position, and can also ensure that the multi-layer circuit boards are aligned with each other, thereby improving the processing accuracy and product yield, and better meeting the production requirements.

[0054] In order to make the slider 211 cooperate better with the slide groove 210 and prevent the slider 211 from jumping out, in this embodiment, the slide groove 210 is a slide groove with an inverted "T"-shaped cross section, and the slider 211 is a slider with an inverted "T"-shaped cross section.

[0055] In order to further restrict the slider 211 so that the slider 211 can move smoothly, in this embodiment, a square plate 214 is formed on the top of the slider 211, and a step groove 215 is opened at the top opening of the slide groove 210. The square plate 214 is clamped in the step groove 215 and the two are slidably connected, and the limit rod 212 is fixed on the square plate 214.

[0056] As a preferred embodiment, the lower hot melt mechanism 205 includes a lower hot melt support block 2050 and a lower hot melt head 2051, the lower hot melt head 2051 is fixed to the top of the lower hot melt support block 2050, and the lower hot melt support block 2050 is fixedly connected to the second transverse translation upright plate 203 or the second longitudinal translation upright plate 204.

[0057] The relative position of the lower hot melt head 2051 and the first carrier plate 21 in this embodiment is fixed, specifically, the lower hot melt head 2051 is inserted into the lower notch 206, and the top surface of the lower hot melt head 2051 is flush with the top surface of the first carrier plate 21. In this structure, only the hot melt mechanism located at the top needs to perform the hot pressing movement.

[0058] In order to better support the support plate 200 , in this embodiment, four U-shaped frames 207 are fixed on the first transverse moving platform 20 , and the support plate 200 is fixed on the four U-shaped frames 207 .

[0059] As a preferred embodiment, at least two ejection cylinders 208 are fixed to the bottom of the support plate 200, and the driving end of the ejection cylinder 208 is provided with an ejector rod 209 that can pass through the first carrier plate 21. The ejection cylinder 208 drives the ejector rod 209 to move up and down, thereby applying an ejection force to the circuit board placed on the first carrier plate 21. The function of the ejection cylinder 208 and the ejector rod 209 is that after the hot melt pressing process is performed, the circuit board can be lifted up by the cooperation of the ejection cylinder 208 and the ejector rod 209, so as to facilitate the removal of the circuit board.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the technical scope of the present invention should be included in the scope of protection of the present invention.

Claims

1. A left and right double-station circuit board hot-melt pressing equipment, characterized in that: The invention comprises a frame (1), wherein a left pressing station (10) and a right pressing station (11) are provided on the frame (1), a loading and unloading station (12) is formed between the left pressing station (10) and the right pressing station (11), a conveying slide rail (100) is fixed on the frame (1), and the conveying slide rail (100) sequentially passes through the left pressing station (10), the loading and unloading station (12) and the right pressing station (11), a first material loading hot pressing mechanism (2) and a second material loading hot pressing mechanism (3) are provided on the conveying slide rail (100), and a left lower pressing hot melting mechanism (15) and a right lower pressing hot melting mechanism (16) are fixed on the frame (1). 16), the first material loading hot pressing mechanism (2) is used to take the circuit board from the material loading and unloading station (12) and transfer it to the left lower pressing hot melting mechanism (15), and the circuit board on the first material loading hot pressing mechanism (2) is hot-melted and pressed by the cooperation of the left lower pressing hot melting mechanism (15) and the first material loading hot pressing mechanism (2), and the second material loading hot pressing mechanism (3) is used to take the circuit board from the material loading and unloading station (12) and transfer it to the right lower pressing hot melting mechanism (16), and the circuit board on the second material loading hot pressing mechanism (3) is hot-melted and pressed by the cooperation of the right lower pressing hot melting mechanism (16) and the second material loading hot pressing mechanism (3); A left bracket (13) and a right bracket (14) are fixed on the frame (1), the left lower pressure hot melt mechanism (15) is fixed on the left bracket (13), and the right lower pressure hot melt mechanism (16) is fixed on the right bracket (14); The first material loading and hot pressing mechanism (2) is fixedly connected to the second material loading and hot pressing mechanism (3) so that the first material loading and hot pressing mechanism (2) and the second material loading and hot pressing mechanism (3) move synchronously; The left lower pressure hot melt mechanism (15) comprises a top plate (150), a first transverse adjustment slide rail (151) and a first longitudinal adjustment slide rail (152) are fixed on the top plate (150), a first transverse translation vertical plate (153) is provided on the first transverse adjustment slide rail (151) and the two are slidably connected, a first longitudinal translation vertical plate (154) is provided on the first longitudinal adjustment slide rail (152) and the two are slidably connected, a plurality of upper hot melt mechanisms (155) arranged downward are respectively fixed on the first transverse translation vertical plate (153) and the first longitudinal adjustment slide rail (152), and the top plate (150) is provided with a plurality of upper hot melt mechanisms (155) arranged downward. 50), a pre-pressing lifting mechanism (156) is fixed on the lifting end of the pre-pressing lifting mechanism (156), a pre-pressing plate (157) is fixed on the pre-pressing plate (157), a plurality of upper notches (158) are provided on the pre-pressing plate (157), and the upper notches (158) are aligned one by one with the upper hot-melt mechanism (155). When the first material loading hot-pressing mechanism (2) transfers the circuit board to the bottom of the left lower hot-melt mechanism (15), the pre-pressing lifting mechanism (156) drives the pre-pressing plate (157) to descend and pre-press the circuit board, and then the upper hot-melt mechanism (155) performs hot-melt pressing on the circuit board.

2. The left-right double-station circuit board hot-melt pressing equipment according to claim 1, characterized in that: The upper hot melt mechanism (155) includes an upper hot melt cylinder (1550) and an upper hot melt head (1551); the upper hot melt cylinder (1550) is fixedly connected to the first transverse translation vertical plate (153) or the first longitudinal adjustment slide rail (152); the upper hot melt head (1551) is aligned with the upper slot (158), and the upper hot melt head (1551) can pass through the upper slot (158).

3. The left-right double-station circuit board hot-melt pressing equipment according to claim 1, characterized in that: The top plate (150) is a "X"-shaped top plate.

4. The left-right double-station circuit board hot-melt pressing equipment according to claim 1, characterized in that: The pre-pressing lifting mechanism (156) is fixed at the center of the top plate (150).

5. The left-right double-station circuit board hot-melt pressing equipment according to claim 1, characterized in that: A "X"-shaped connecting plate (159) is fixed to the lower end of the pre-pressing lifting mechanism (156), and the bottom of the connecting plate (159) is fixedly connected to the pre-pressing plate (157) via a plurality of columns (1590).

6. The left-right double-station circuit board hot-melt pressing equipment as claimed in claim 5, characterized in that: Two upwardly extending optical bars (1591) are fixed on the connecting plate (159), and two sliding sleeves (1500) are fixed on the top plate (150). The two optical bars (1591) pass through the two sliding sleeves (1500) respectively, and the optical bars (1591) are slidably connected to the sliding sleeves (1500).

7. The left-right double-station circuit board hot-melt pressing equipment according to claim 1, characterized in that: The structure of the right lower pressure hot-melt mechanism (16) is the same as that of the left lower pressure hot-melt mechanism (15).

Images