A mechanism and method for preventing edge collapse during silicon wafer transmission

Abstract

The present invention belongs to the technical field of solar silicon wafer separation, and in particular relates to a mechanism for preventing edge collapse during silicon wafer transmission, comprising a transmission motor, a rotating shaft, a transmission motor driving wheel, a silicon wafer water absorption plate, a transmission motor driven wheel, a supporting wheel, a transmission belt, a left-side spray nozzle, a right-side spray nozzle, a water spray pump, a water absorption pipe inlet, a water absorption pump, a controller, an in-position sensor and a bubbling mechanism. The present invention provides a mechanism for preventing edge collapse during silicon wafer transmission, which can make two silicon wafers separated in the air without contact when being disengaged during transmission, reduce the edge collapse rate caused by the silicon wafer transmission process, and can also improve the silicon wafer yield rate and silicon wafer separation effect.

Description

Technical Field

[0001] The invention belongs to the technical field of solar silicon wafer slicing, and in particular relates to a mechanism and method for preventing edge collapse during silicon wafer transmission. Background Art

[0002] At present, in the solar photovoltaic or semiconductor industry, it is necessary to cut the rod-shaped raw materials into sheets of a certain thickness, and then load the sheets into the silicon wafer fixture device, separate the silicon wafers one by one through a specific water spray nozzle underwater, and then absorb the silicon wafers through water absorption negative pressure, and use the belt conveyor mechanism to convey the silicon wafers one by one, and finally load them into the silicon wafer basket. However, after the existing equipment is sliced ​​by the slicing mechanism, during the process of conveying the silicon wafers by the belt, the front and rear silicon wafers will have friction when they are separated, and the friction will have a chance to cause the head of one silicon wafer to collide with the tail of another silicon wafer, thereby causing edge collapse, reducing the silicon wafer yield rate, and causing losses to silicon wafer manufacturers. Summary of the invention

[0003] The main purpose of the present invention is to solve the problem in the prior art that after solar silicon wafers are sliced, two silicon wafers are separated from each other by a belt conveyor and have edge collapse. A mechanism is provided to prevent edge collapse during silicon wafer transmission. The mechanism can separate the two silicon wafers in the air without contact when they are separated from each other during transmission, thereby reducing the edge collapse rate caused by the silicon wafer transmission process and improving the silicon wafer yield and silicon wafer separation effect.

[0004] The technical problem solved by the present invention is achieved by the following technical scheme: a mechanism for preventing edge collapse during silicon wafer transmission, comprising a transmission motor, a rotating shaft, a transmission motor driving wheel, a silicon wafer water absorption plate, a transmission motor driven wheel, a support wheel, a transmission belt, a left-side spray nozzle, a right-side spray nozzle, a water spray pump, a water absorption pipe inlet, a water absorption pump, a controller, an in-position sensor and a bubbling mechanism, wherein the transmission motor driving wheel, the silicon wafer water absorption plate and the transmission motor driven wheel are sequentially arranged on the rotating shaft of the transmission motor, four support wheels are symmetrically installed on the left and right sides of the silicon wafer water absorption plate, and the transmission motor driving wheel, the silicon wafer water absorption plate and the silicon wafer water absorption plate are symmetrically installed on the left and right sides of the silicon wafer water absorption plate. The wheel and the two supporting wheels at its lower part are provided with a conveyor belt, the driven wheel of the transmission motor and the two supporting wheels at its lower part are provided with a conveyor belt, the left and right spray heads are symmetrically provided on the left and right sides of the front of the silicon wafer water absorption plate, the left and right spray heads are both connected to a water spray pump, a water suction pipe inlet is provided at the silicon wafer water absorption plate at the rear side of the rotating shaft, the water suction pipe inlet is connected to a water suction pump, the water spray pump and the water suction pump are both electrically connected to a controller, the controller is electrically connected to a position sensor and a bubbling mechanism, and the bubbling mechanism is provided below the left and right spray heads;

[0005] The bubbling mechanism comprises a bubbling tube, a bubbling air outlet, a bubbling gas inlet and a regulating valve. The bubbling air outlet is arranged on the upper side of the bubbling tube, the bubbling gas inlet is arranged on the rear side of the bubbling tube, and the regulating valve is installed on the bubbling gas inlet.

[0006] Furthermore, at least one bubbling outlet hole is provided on the upper side of the bubbling tube, and the bubbling outlet hole is in a cylindrical shape.

[0007] Furthermore, left and right spray nozzles are symmetrically arranged on the left and right sides of the front of the silicon wafer water absorption plate through nuts, and the water spray pipe inlets of the left and right spray nozzles are connected to the water spray pipe of the water spray pump, and multiple water spray holes are arranged on the left and right spray nozzles.

[0008] Furthermore, the water absorption pipe inlet on the silicon wafer water absorption plate is connected to a water absorption pump through a water absorption pipe, and the number of supporting wheels on the left and right sides of the silicon wafer water absorption plate is the same and is at least four.

[0009] Furthermore, the conveying motor is mounted on a motor bracket, a water absorption plate fixing shaft is provided on the motor bracket, and the water absorption plate fixing shaft is mounted at the silicon wafer water absorption plate on the front side of the rotating shaft.

[0010] A method for preventing edge collapse during silicon wafer transfer as described above is characterized by comprising the following steps:

[0011] Step 1: The controller turns on the water suction pump, which pumps water through the water suction pipe inlet to generate negative pressure, so that the front silicon wafer is closely attached to the silicon wafer water absorption plate and the bottom of the conveyor belt;

[0012] Step 2: The controller turns on the conveying motor, and the conveying motor drives the conveying motor driving wheel and the conveying motor driven wheel to rotate through the rotating shaft, so that the front silicon wafer under the conveyor belt moves forward to the in-position sensor, and the conveying motor stops; at this time, the tail of the front silicon wafer and the head of the rear silicon wafer both reach the position between the left and right spray nozzles;

[0013] Step 3: The controller turns on the water pump, and the water in the water pump is sprayed from the left and right nozzles to directly act on the junction of the front silicon wafer and the rear silicon wafer, so that the rear of the front silicon wafer floats up and the head of the rear silicon wafer is pressed down, so that the front silicon wafer and the rear silicon wafer are completely separated without contact;

[0014] Step 4: The controller turns on the bubbling mechanism, and the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles. The bubbles cause the front silicon wafer to float up, further separating the front silicon wafer and the rear silicon wafer completely without contact.

[0015] Further, in step 4, the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and the bubbles cause the front silicon wafer to float up, further comprising:

[0016] The insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and at least one bubbling outlet hole on the bubbling tube generates bubbles to cause the front silicon wafer to float up.

[0017] Further, in step 3, water in the water pump is sprayed from the left spray nozzle and the right spray nozzle to directly act on the head and tail junction of the front silicon wafer and the rear silicon wafer, further comprising:

[0018] The water in the water pump is transported to the water pipe inlet through the water pipe and sprayed out from multiple water spray holes on the left and right spray nozzles, directly acting on the head and tail junction of the front silicon wafer and the rear silicon wafer.

[0019] Further, in step 1, the water suction pump pumps water through the water suction pipe inlet to generate negative pressure, further comprising,

[0020] The suction pump draws water through the suction pipe through the suction pipe inlet to generate negative pressure.

[0021] Furthermore, in step 2, the transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft, further comprising:

[0022] The transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft. At the same time, the water absorption plate fixing shaft on the motor bracket stabilizes the front part of the silicon wafer water absorption plate.

[0023] The beneficial effects of the present invention are:

[0024] 1. The water suction pump draws water through the water suction pipe inlet to generate negative pressure, so that the front silicon wafer is closely attached to the bottom of the silicon wafer water absorption plate. When the transmission motor drives the front silicon wafer under the conveyor belt forward through the transmission motor driving wheel and the transmission motor driven wheel, the front silicon wafer is more stably adsorbed under the silicon wafer water absorption plate to avoid friction and collision with the rear silicon wafer when the front silicon wafer moves forward, which can reduce the edge collapse rate caused by the silicon wafer transmission process, and can also improve the silicon wafer yield and silicon wafer separation effect.

[0025] 2. Multiple water spray holes of the left-facing nozzles and the right-facing nozzles simultaneously spray high-speed water flow directly onto the junction of the front silicon wafer and the rear silicon wafer, causing the front silicon wafer to float up and the rear silicon wafer to sink, thereby facilitating the complete separation of the front silicon wafer and the rear silicon wafer and improving the silicon wafer separation effect; at the same time, the bubbling holes of the bubbling mechanism emit air to produce bubbles, which cause the front silicon wafer to float up, thereby separating the front silicon wafer and the rear silicon wafer completely without contact, thus avoiding the problem of edge collapse caused by contact and friction between the front silicon wafer and the rear silicon wafer during transportation, thereby improving the silicon wafer yield and silicon wafer separation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The present invention is a schematic structural diagram of a mechanism for preventing edge collapse during silicon wafer transmission.

[0027] Figure 2 It is a schematic structural diagram of the silicon wafer water absorption plate part of the present invention.

[0028] 1. Transmission motor 2. Rotating shaft 3. Transmission motor driving wheel

[0029] 4. Silicon wafer water absorption plate 5. Transmission motor driven wheel 6. Support wheel

[0030] 7. Conveyor belt 8. Left spray nozzle 9. Right spray nozzle

[0031] 10. Spray pump 11. Suction pipe inlet 12. Suction pump

[0032] 13. Controller 14. In-position sensor 15. Bubble mechanism

[0033] 16. Bubble tube 17. Bubble outlet 18. Bubble gas inlet

[0034] 19. Regulating valve 20. Nut 21. Water spray pipe inlet

[0035] 22. Water spray pipe 23. Water suction pipe 24. Motor bracket

[0036] 25. Water absorption plate fixed axis 26. Front silicon wafer 27. Back silicon wafer DETAILED DESCRIPTION

[0037] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] like Figure 1-Figure 2 As shown, a mechanism for preventing edge collapse during silicon wafer transmission provided by the present invention comprises a transmission motor 1, a rotating shaft 2, a transmission motor driving wheel 3, a silicon wafer water absorption plate 4, a transmission motor driven wheel 5, a supporting wheel 6, a transmission belt 7, a left-side spray nozzle 8, a right-side spray nozzle 9, a water spray pump 10, a water absorption pipe inlet 11, a water absorption pump 12, a controller 13, an in-position sensor 14 and a bubbling mechanism 15. The transmission motor driving wheel 3, the silicon wafer water absorption plate 4, and the transmission motor driven wheel 5 are sequentially arranged on the rotating shaft 2 of the transmission motor 1. Four supporting wheels 6 are symmetrically installed on the left and right sides of the silicon wafer water absorption plate 4. The transmission motor driving wheel 3 and the two supporting wheels 6 below it are provided with a transmission belt 7. The transmission motor driven wheel 5 and the two supporting wheels 6 below it are provided with a transmission belt 7. The left and right spray heads 8 and 9 are symmetrically arranged on the left and right sides of the front of the water plate 4. The left and right spray heads 8 and 9 are both connected to a water spray pump 10. A water suction pipe inlet 11 is arranged at the silicon wafer water absorption plate 4 on the rear side of the rotating shaft 2. The water suction pipe inlet 11 is connected to a water suction pump 12. The water spray pump 10 and the water suction pump 12 are both electrically connected to a controller 13. The controller 13 is electrically connected to a position sensor 14 and a bubbling mechanism 15. The bubbling mechanism 15 is arranged below the left and right spray heads 8 and 9. The bubbling mechanism 15 includes a bubbling tube 16, a bubbling air outlet 17, a bubbling gas inlet 18 and a regulating valve 19. The bubbling air outlet 17 is arranged on the upper side of the bubbling tube 16, and the bubbling gas inlet 18 is arranged on the rear side of the bubbling tube 16. The regulating valve 19 is installed on the bubbling gas inlet 18. Among them, the controller 13 adopts a PLC controller 13.

[0041] At least one bubbling outlet hole 17 is disposed on the upper side of the bubbling tube 16 , and the bubbling outlet hole 17 is cylindrical in shape.

[0042] A left-side spray nozzle 8 and a right-side spray nozzle 9 are symmetrically arranged on the left and right sides of the front of the silicon wafer water absorption plate 4 through nuts 20. The water spray pipe inlets 21 of the left-side spray nozzle 8 and the right-side spray nozzle 9 are both connected to the water spray pipe 22 of the water spray pump 10, and a plurality of water spray holes are arranged on the left-side spray nozzle 8 and the right-side spray nozzle 9.

[0043] The water absorption pipe inlet 11 on the silicon wafer water absorption plate 4 is connected to the water absorption pump 12 through the water absorption pipe 23. The number of the supporting wheels 6 on the left and right sides of the silicon wafer water absorption plate 4 is the same and at least four.

[0044] The conveying motor 1 is mounted on a motor bracket 24 , and a water absorbing plate fixing shaft 25 is provided on the motor bracket 24 . The water absorbing plate fixing shaft 25 is mounted on the silicon wafer water absorbing plate 4 on the front side of the rotating shaft 2 .

[0045] Example

[0046] First, after the silicon wafers are sliced ​​in the water, the controller 13 turns on the water spray pump 10, and the water in the water spray pump 10 is sprayed from the left spray nozzles 8 and the right spray nozzles 9 to the silicon wafers. At this time, a stack of silicon wafers in the silicon wafer tray floats from the water under the pressure of the water spray, so that the top silicon wafer, that is, the front silicon wafer 26, floats and sticks to the bottom of the conveyor belt 7 on both sides of the silicon wafer water absorption plate 4; secondly, the controller 13 turns on the water suction pump 12, and the water suction pump 12 pumps water through the water suction pipe inlet 11 to generate negative pressure on the front silicon wafer 26, so that the front silicon wafer 26 is tightly attached to the bottom of the silicon wafer water absorption plate 4; then, the controller 13 turns on the conveying motor 1, and the conveying motor 1 drives the conveying motor driving wheel 3 and the conveying motor driven wheel 5 to rotate through the rotating shaft 2, so that the front silicon wafer 26 under the two conveyor belts 7 moves forward to the in-place sensor 14 At this point, the conveying motor 1 is stopped, and at the same time, the tail of the front silicon wafer 26 and the head of the rear silicon wafer 27 both reach the position between the left-facing nozzle 8 and the right-facing nozzle 9, and the multiple water spray holes of the left-facing nozzle 8 and the right-facing nozzle 9 spray high-speed water flow directly onto the junction of the front silicon wafer 26 and the rear silicon wafer 27, so that the front silicon wafer 26 floats up and the rear silicon wafer 27 sinks, which facilitates the complete contactless separation of the front silicon wafer 26 and the rear silicon wafer 27; finally, the controller 13 turns on the bubbling mechanism 15, and the insoluble air entering through the bubbling gas inlet 18 is discharged from the bubbling outlet 17 on the bubbling tube 16 to generate bubbles, and the rising effect of the bubbles causes the front silicon wafer 26 to float up, preventing the front silicon wafer 26 from shaking up and down, further enabling the complete contactless separation of the front silicon wafer 26 and the rear silicon wafer 27.

[0047] A method for preventing edge collapse during silicon wafer transfer as described above is characterized by comprising the following steps:

[0048] Step 1: The controller turns on the water suction pump, which pumps water through the water suction pipe inlet to generate negative pressure, so that the front silicon wafer is closely attached to the silicon wafer water absorption plate and under the conveyor belt.

[0049] In step 1, the water suction pump pumps water through the water suction pipe inlet to generate negative pressure, further comprising:

[0050] The suction pump draws water through the suction pipe through the suction pipe inlet to generate negative pressure.

[0051] Step 2: The controller turns on the conveying motor, and the conveying motor drives the conveying motor driving wheel and the conveying motor driven wheel to rotate through the rotating shaft, so that the front silicon wafer under the conveyor belt moves forward to the in-position sensor, and the conveying motor stops; at this time, the tail of the front silicon wafer and the head of the rear silicon wafer both arrive at the position between the left and right spray nozzles.

[0052] In step 2, the transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft, further comprising:

[0053] The transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft. At the same time, the water absorption plate fixing shaft on the motor bracket stabilizes the front part of the silicon wafer water absorption plate.

[0054] Step 3. The controller turns on the water pump. Water in the water pump is sprayed out from the left and right nozzles to directly act on the junction of the front and rear silicon wafers, so that the tail of the front silicon wafer floats up and the head of the rear silicon wafer is pressed down, thereby achieving complete contactless separation of the front and rear silicon wafers.

[0055] In step 3, water in the water pump is sprayed from the left and right spray nozzles to directly act on the head and tail junction of the front silicon wafer and the rear silicon wafer, further comprising:

[0056] The water in the water pump is transported to the water pipe inlet through the water pipe and sprayed out from multiple water spray holes on the left and right spray nozzles, directly acting on the head and tail junction of the front silicon wafer and the rear silicon wafer.

[0057] Step 4: The controller turns on the bubbling mechanism, and the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles. The bubbles cause the front silicon wafer to float up, further separating the front silicon wafer and the rear silicon wafer completely without contact.

[0058] In step 4, the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and the bubbles cause the front silicon wafer to float up, further comprising:

[0059] The insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and at least one bubbling outlet hole on the bubbling tube generates bubbles to cause the front silicon wafer to float up.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A mechanism for preventing edge collapse during silicon wafer transfer, characterized in that: It includes a transmission motor, a rotating shaft, a transmission motor driving wheel, a silicon wafer water absorption plate, a transmission motor driven wheel, a supporting wheel, a transmission belt, a left-side spray nozzle, a right-side spray nozzle, a water spray pump, a water absorption pipe inlet, a water absorption pump, a controller, an in-position sensor and a bubbling mechanism. The transmission motor driving wheel, the silicon wafer water absorption plate and the transmission motor driven wheel are sequentially arranged on the rotating shaft of the transmission motor. Four supporting wheels are symmetrically installed on the left and right sides of the silicon wafer water absorption plate. The transmission motor driving wheel and the two supporting wheels below it are provided with a transmission belt. A conveyor belt is arranged on the driven wheel of the transmission motor and the two supporting wheels at its lower part, a left-paired spray nozzle and a right-paired spray nozzle are symmetrically arranged on the left and right sides of the front of the silicon wafer water absorption plate, and the left-paired spray nozzle and the right-paired spray nozzle are both connected to a water spray pump, and a water suction pipe inlet is arranged at the silicon wafer water absorption plate at the rear side of the rotating shaft, and the water suction pipe inlet is connected to a water suction pump, and the water spray pump and the water suction pump are both electrically connected to a controller, and the controller is electrically connected to a position sensor and a bubbling mechanism, and the bubbling mechanism is arranged below the left-paired spray nozzle and the right-paired spray nozzle; The bubbling mechanism comprises a bubbling tube, a bubbling outlet hole, a bubbling gas inlet and a regulating valve, wherein the bubbling tube is provided with a bubbling outlet hole on the upper side, the bubbling gas inlet is provided on the rear side of the bubbling tube, and the bubbling gas inlet is installed with a regulating valve; At least one bubbling outlet hole is provided on the upper side of the bubbling tube, and the bubbling outlet hole is in a cylindrical shape; The left and right spray nozzles are symmetrically arranged on the left and right sides of the front of the silicon wafer water absorption plate through nuts, and the water spray pipe inlets of the left and right spray nozzles are connected to the water spray pipe of the water spray pump, and the left and right spray nozzles are both provided with a plurality of water spray holes; The water absorption pipe inlet on the silicon wafer water absorption plate is connected to a water absorption pump through a water absorption pipe, and the number of supporting wheels on the left and right sides of the silicon wafer water absorption plate is the same and is at least four.

2. The mechanism for preventing edge collapse during silicon wafer transfer according to claim 1, characterized in that: The conveying motor is installed on a motor bracket, and a water absorption plate fixing shaft is arranged on the motor bracket. The water absorption plate fixing shaft is installed at the silicon wafer water absorption plate on the front side of the rotating shaft.

3. A method for preventing edge collapse during silicon wafer transfer as claimed in claim 1, characterized in that: The following steps are involved: Step 1: The controller turns on the water suction pump, which pumps water through the water suction pipe inlet to generate negative pressure, so that the front silicon wafer is closely attached to the silicon wafer water absorption plate and the bottom of the conveyor belt; Step 2: The controller turns on the conveying motor, and the conveying motor drives the conveying motor driving wheel and the conveying motor driven wheel to rotate through the rotating shaft, so that the front silicon wafer under the conveyor belt moves forward to the in-position sensor, and the conveying motor stops; at this time, the tail of the front silicon wafer and the head of the rear silicon wafer both reach the position between the left and right spray nozzles; Step 3: The controller turns on the water pump, and the water in the water pump is sprayed from the left and right nozzles to directly act on the junction of the front silicon wafer and the rear silicon wafer, so that the rear of the front silicon wafer floats up and the head of the rear silicon wafer is pressed down, so that the front silicon wafer and the rear silicon wafer are completely separated without contact; Step 4: The controller turns on the bubbling mechanism, and the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles. The bubbles cause the front silicon wafer to float up, further separating the front silicon wafer and the rear silicon wafer completely without contact.

4. The method for preventing edge collapse during silicon wafer transfer according to claim 3, characterized in that: In step 4, the insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and the bubbles cause the front silicon wafer to float up, further comprising: The insoluble air entering the bubbling gas inlet is discharged from the bubbling outlet holes on the bubbling tube to generate bubbles, and at least one bubbling outlet hole on the bubbling tube generates bubbles to cause the front silicon wafer to float up.

5. The method for preventing edge collapse during silicon wafer transfer according to claim 3, characterized in that: In step 3, water in the water pump is sprayed from the left and right spray nozzles to directly act on the head and tail junction of the front silicon wafer and the rear silicon wafer, further comprising: The water in the water pump is transported to the water pipe inlet through the water pipe and sprayed out from multiple water spray holes on the left and right spray nozzles, directly acting on the head and tail junction of the front silicon wafer and the rear silicon wafer.

6. The method for preventing edge collapse during silicon wafer transfer according to claim 3, characterized in that: In step 1, the water suction pump pumps water through the water suction pipe inlet to generate negative pressure, further comprising: The suction pump draws water through the suction pipe through the suction pipe inlet to generate negative pressure.

7. The method for preventing edge collapse during silicon wafer transfer according to claim 3, characterized in that: In step 2, the transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft, further comprising: The transmission motor drives the transmission motor driving wheel and the transmission motor driven wheel to rotate through the rotating shaft. At the same time, the water absorption plate fixing shaft on the motor bracket stabilizes the front part of the silicon wafer water absorption plate.

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