Substrate processing equipment

Abstract

The present invention relates to a substrate processing device for processing a substrate using a processing liquid. One embodiment of the substrate processing device comprises: a support portion having a mounting surface for mounting a substrate in a horizontal posture; a processing tank for supplying a processing liquid to the substrate to process the substrate; a lifting portion for lifting and lowering the support portion to lower the substrate into the processing tank and to raise the substrate from the processing tank; a holding portion above the processing tank, holding the outer peripheral portion of the substrate supported by the support portion and receiving the substrate from the support portion; and a first nozzle for spraying gas onto the substrate held by the holding portion to dry the substrate.

Description

Technical Field

[0001] The invention relates to a substrate processing device for processing a substrate using a processing liquid. Background Art

[0002] As a method for forming wiring and bumps on substrates such as semiconductor wafers, electroplating is widely used because it is relatively cheap and has a short processing time. The following device is known, in which a substrate supplied from an upstream process is placed on a substrate holder and transported to a processing tank to plate the substrate. When the plating process is completed, the substrate holder is taken out of the processing tank and transported to a substrate loading and unloading position, and the substrate is taken out from the substrate holder. This series of processes is performed by driving a robot arm and a transport mechanism.

[0003] In addition, the substrate removed from the substrate holder after the plating process needs to be cleaned and dried. In the case where the substrate to be processed is a circular substrate, spin cleaning and drying based on SRD (Spin Rinse Dryer) is performed. However, the shape of the substrate will also change depending on the purpose of the product. In recent years, it has also been required to perform plating on large rectangular substrates. Therefore, the following device is proposed, which replaces the SRD with a roller-based horizontal conveying mechanism, maintains the horizontal posture of the substrate during the conveying process and performs cleaning and drying processes (for example, Patent Document 1).

[0004] Patent document 1: Japanese Patent Application Publication No. 2018-6404.

[0005] However, large and especially thin substrates are prone to bending and deformation. Therefore, in the cleaning and drying process before or after plating, if a horizontal conveying mechanism based on rollers is used, the substrate may interfere with the rollers and other structures during the conveying process, thereby hindering the normal conveying. In addition, such problems are not limited to rectangular substrates, but also occur when thin substrates are used. In addition, it is not limited to cleaning and drying processes, but also occurs in devices that use processing liquids to process thin substrates. Summary of the invention

[0006] The present invention has been made in view of the above circumstances, and one object of the present invention is to provide a substrate processing apparatus that can stably process even a thin substrate.

[0007] A certain aspect of the present invention is a substrate processing device. The substrate processing device comprises: a support portion having a placement surface for placing a substrate in a horizontal posture; a processing tank for supplying a processing liquid to the substrate to process the substrate; a lifting portion for lifting and lowering the support portion to lower the substrate into the processing tank and to raise the substrate from the processing tank; a holding portion above the processing tank, holding the outer peripheral portion of the substrate supported by the support portion and receiving the substrate from the support portion; and a first nozzle for spraying a gas onto the substrate held by the holding portion to dry the substrate.

[0008] According to the substrate processing apparatus of the present invention, even a thin substrate can be processed stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. 1 is a top view schematically showing a plating apparatus according to the first embodiment.

[0010] Figure 2 It is a perspective view showing the overall structure of the cleaning device.

[0011] Figure 3 It is a perspective view showing the structure of the cleaning unit.

[0012] Figure 4 It is a perspective view showing the structure of the cleaning unit.

[0013] Figure 5 It is a longitudinal sectional view showing the structure of the cleaning device.

[0014] Figure 6 It is a side view showing the structure and operation of the clamping mechanism.

[0015] Figure 7 It is a top view showing the structure of the support mechanism.

[0016] Figure 8 It is a diagram showing the structure and operation of the clamping mechanism.

[0017] Fig. 9 It is a diagram showing the structure and operation of the clamping mechanism.

[0018] Fig.10 It is a figure which shows the state at the time of drying process.

[0019] Fig.11 This is a flowchart showing the flow of the pre-cleaning process.

[0020] Fig.12 It is a figure which shows the control method in the pre-cleaning process.

[0021] Fig.13 It is a figure which shows the control method in the pre-cleaning process.

[0022] Fig.14 It is a cross-sectional view showing a clamping structure of a modified example.

[0023] Fig.15 It is a perspective view showing the structure of a cleaning unit according to the second embodiment.

[0024] Fig.16 This is a perspective view showing the operation of the cleaning unit during cleaning. DETAILED DESCRIPTION

[0025] One embodiment of the present invention is a substrate processing device for processing a substrate using a processing liquid. In this processing, the substrate may also be immersed in the processing liquid. Specifically, it may be a cleaning process in which the substrate is immersed in a cleaning liquid. It may also be a plating process in which the substrate is immersed in a plating liquid. It may also be a cooling process in which the substrate is immersed in cooling water. Alternatively, the processing liquid may be sprayed onto the surface of the substrate. After the processing based on the processing liquid, the substrate is dried. The substrate processing device includes a processing tank for a series of processing, a processing liquid supply unit, a processing liquid discharge unit, a support unit, a gripping unit, a lifting unit, and a first nozzle.

[0026] The treatment liquid supply unit supplies the treatment liquid to the treatment tank. When the substrate is treated by immersing it in the treatment liquid, an overflow tank for allowing the treatment liquid to overflow from the treatment tank may be provided in order to keep the treatment liquid clean. The overflowed treatment liquid may also be directly discarded. Alternatively, a circulation mechanism may be provided for purifying the overflowed treatment liquid by using a filter or the like and returning it to the treatment tank. When the treatment is completed, the supply of the treatment liquid is stopped, and the treatment liquid discharge unit discharges the treatment liquid from the treatment tank. When the substrate is treated by spraying the treatment liquid, a treatment liquid spray nozzle for spraying the treatment liquid onto the surface of the substrate is provided in the treatment tank.

[0027] In this embodiment, the substrate needs to be changed during a series of treatment processes, so the substrate is handed over between the support part and the holding part. The support part supports the substrate during the treatment based on the treatment liquid, and the holding part supports the substrate during the drying treatment. The support part receives the substrate above the treatment tank.

[0028] The support portion has a loading surface for loading the substrate in a horizontal position. The support portion includes a plurality of clamping portions (first clamping mechanisms) for stably maintaining the loading state of the thin substrate. The first clamping mechanism clamps the peripheral edge of the substrate between the support surface. Tension in the peripheral direction (outward) can also be applied to the substrate by the plurality of first clamping mechanisms. Thus, even a thin substrate will not bend and can be stably maintained.

[0029] When processing a substrate, the support portion on which the substrate is placed is lowered by the lifting portion. When the substrate is immersed in a treatment liquid for processing, the treatment liquid may be pre-stored in the treatment tank so that the substrate is lowered toward the treatment liquid. However, if this is done, bubbles are likely to adhere to the lower surface of the substrate. In addition, liquid splashing may occur, causing the treatment liquid to adhere to other structures, which may have a negative impact. Therefore, it is preferred to supply the treatment liquid after the substrate is lowered. In addition, it is preferred to supply the treatment liquid from below the lower surface of the substrate. In this way, bubbles can be efficiently removed by the flow of the treatment liquid during the rising process of the liquid level. The possibility of liquid splashing is low. The substrate may also be processed by a plurality of types of treatment liquids. In this case, the substrate may be held in the treatment tank, and the supply and discharge of each treatment liquid may be performed sequentially.

[0030] If the treatment based on the treatment liquid is completed, the support part is raised by the lifting part. Then, the substrate is handed over from the support part to the holding part. This is because it is difficult to dry the lower surface of the substrate when the substrate is placed on the support part. The holding part holds the outer periphery of the substrate so that the upper and lower surfaces of the substrate are open. The holding part can include a plurality of clamping parts (second clamping mechanisms). Tension in the peripheral direction (outward) can also be applied to the substrate by a plurality of second clamping mechanisms. The first nozzle sprays gas to the substrate horizontally held by the holding part to dry the substrate.

[0031] According to this method, the substrate can be placed on the mounting surface and raised and lowered while maintaining a horizontal posture, and the treatment based on the treatment liquid can be performed. Even when the substrate is handed over during the drying process, it is carried out while the substrate is placed on the mounting surface, so it is possible to stably switch from mounting to holding. Therefore, the substrate will not bend during a series of treatments and will not interfere with other structures. That is, even a thin substrate can be stably treated.

[0032] The supporting portion may also include a frame. A plurality of protrusions may also be provided on the upper surface of the frame, and the loading surface may be formed by the upper surfaces of these protrusions. The "frame" may also have a shape having only an outer frame, or may have a grid shape. In the latter case, one or more bridge portions are provided that span the outer frame of the frame. The presence or absence of the bridge portions and their number may be appropriately set according to the size of the substrate to be supported. The protrusions may be configured in coordination with the contactable area of ​​the substrate (non-assembly area such as circuits). With such a structure, most of the lower surface of the substrate may be opened to the processing liquid, and the processing liquid may be spread over the entire upper and lower surfaces of the substrate.

[0033] The substrate processing device is provided with a control unit for driving and controlling each part (each mechanism). After the substrate is transferred from the support unit to the holding unit, the control unit lowers the support unit, and dries the substrate by the first nozzle. At this time, even if the support unit has not reached the set descending position, the first nozzle can be driven in the stage of descending to a position where it does not interfere with the holding unit. Thus, the overall processing efficiency can be improved.

[0034] The processing liquid may be discharged from the processing tank before or after the support part rises. Furthermore, the support part may be lowered into the processing tank after the substrate is transferred from the support part to the holding part. Thus, the support part can be retreated by utilizing the free space in the processing tank. By discharging the used processing liquid in the processing tank in advance, the loading surface can be kept clean when the support part is retreated.

[0035] A second nozzle may be provided independently of the first nozzle to dry the support surface. Furthermore, the first nozzle may dry the substrate (first drying process) and the second nozzle may dry the support surface (second drying process) at the same time. By performing the two drying processes at the same time, the influence of liquid splashing caused by each drying process can be suppressed. For example, the drawback of the liquid splashing from the substrate caused by the first drying process wetting the support surface to be subjected to the second drying process can be suppressed. This is particularly effective when performing drying based on air supply.

[0036] Alternatively, the first drying process may be started during the descent of the support portion, and the second drying process may be started after the descent of the support portion is completed. That is, the drying of the substrate is more important than the placement surface, so the first drying process sometimes requires a longer processing time than the second drying process. In such a case, by starting the first drying process before the second drying process, the overall processing time can be shortened and efficiency can be achieved.

[0037] The substrate processing device includes a substrate conveying unit. The substrate conveying unit has a supporting surface for supporting the upper surface of the substrate. The substrate conveying unit holds the substrate in a horizontal position and transfers it to the loading surface of the supporting unit, and receives the substrate from the loading surface. The "supporting surface" may also be an "attraction surface" that can attract the upper surface of the substrate in a non-contact state. Alternatively, it may be an "attraction surface" that can contact and adsorb to the upper surface of the substrate. From the viewpoint of strictly maintaining the cleanliness of the substrate, it is preferred that the supporting surface is a non-contact type.

[0038] After the drying process, the control unit raises the support unit and transfers the substrate from the holding unit to the support unit. At this time, the substrate is placed on the mounting surface again to maintain a horizontal posture. In this way, the substrate supported on the mounting surface is received by the substrate conveying unit. With such a structure, the substrate can be transferred even without using a conveying roller or the like.

[0039] Hereinafter, examples that embody the present embodiment will be described with reference to the drawings. In the following examples and their modifications, substantially the same components are denoted by the same reference numerals, and their descriptions are appropriately omitted.

[0040] [First embodiment]

[0041] Figure 1 It is a top view schematically showing the plating apparatus according to the first embodiment.

[0042] The plating device 1 includes a substrate loading and unloading section 2, a plating processing section 4, and a control section 6. The plating device 1 of the present embodiment is a bump plating device for forming a protruding electrode (bump) on a substrate. A substrate transfer station 8 is provided in front of the substrate loading and unloading section 2, and a front cleaning section 10 and a rear cleaning section 12 are provided adjacent to the substrate transfer station 8. In addition, a device for transferring a substrate processed in an upstream process to the substrate transfer station 8 is provided in front of the plating device 1, but its description is omitted.

[0043] The substrate transfer table 8 carries a substrate W such as a semiconductor wafer in a horizontal posture. In the present embodiment, the substrate W is a relatively large thin substrate that is easily bent. In the present embodiment, a rectangular substrate of 500mm×500mm and a thickness of about 1mm is used as the substrate W, but the size, thickness, and shape are not limited thereto. The substrate W is a structure in which a copper seed layer is provided on the upper surface of the wafer, and a pattern of an anti-etching layer is formed thereon. If bubbles are present in the opening of the anti-etching layer when plating the substrate W, normal plating cannot be performed. In addition, if organic matter or the like is attached to the seed layer, normal plating may not be performed.

[0044] The pre-cleaning section 10 includes a cleaning device 14 for performing pre-cleaning to remove organic matter and the like attached to the surface of the substrate W before the plating process. The post-cleaning section 12 includes a cleaning device 16 for cleaning the substrate W removed from the substrate holder 24 after the plating process. A holder conveying mechanism 18 is provided in the range from the substrate loading and unloading section 2 to the plating processing section 4. The control section 6 controls the operation of each section.

[0045] The substrate loading and unloading section 2 includes a loading and unloading mechanism 20, a substrate conveying robot 22, and a moving mechanism 23. The substrate conveying robot 22 has a manipulator 22a. The substrate conveying robot 22 functions as a "substrate conveying section" and transfers the substrate W with the substrate transfer table 8, and transfers the substrate W with each mechanism. The manipulator 22a has a non-contact chuck for holding the substrate W in a horizontal position. In the present embodiment, a Bernoulli type is used as the non-contact chuck, but a cyclone type may also be used. In the case of maintaining the cleanliness of the substrate W, a contact-type adsorption pad (vacuum pad) may also be used.

[0046] The moving mechanism 23 moves the substrate transfer robot 22 according to the delivery position of the substrate W. The substrate transfer robot 22 moves to the vicinity of the pre-cleaning section 10 in the pre-cleaning step, and moves to the vicinity of the post-cleaning section 12 in the post-cleaning step.

[0047] A temporary storage box 25 for storing the substrate holder 24 is provided below the loading and unloading mechanism 20. The loading and unloading mechanism 20 loads and unloads the substrate W relative to the substrate holder 24. The holder conveying mechanism 18 includes a holding mechanism 26 for holding the substrate holder 24 and a conveying mechanism 28 for conveying the substrate holder 24 to each tank of the plating processing unit 4. The loading and unloading mechanism 20 also loads and unloads the substrate holder 24 relative to the holding mechanism 26.

[0048] The plating processing section 4 includes a pre-wetting tank 30, a pre-preg tank 32, a rinse tank 34, a spray tank 36, a rinse tank 38, and an overflow tank 40 in order from the substrate loading and unloading section 2 side. A plurality of rows of plating tanks 42 are provided inside the overflow tank 40. The pre-wetting tank 30 wets the substrate W by immersing it in degassed water, and the opening of the resist layer on the surface of the substrate can also be filled with degassed water. The pre-preg tank 32 removes the oxide film formed on the surface of the substrate W by etching with a chemical solution.

[0049] The rinse tanks 34 and 38 use deionized water to clean the surface of the substrate W. The rinse tank 34 performs water washing before the plating process, and the rinse tank 38 performs water washing after the plating process. The spray tank 36 drains the substrate W after washing. The plating liquid is stored in the plating tank 42. By immersing the substrate W in the plating tank 42, the plating liquid overflows to the overflow tank 40 and circulates, and plating can be performed. The plating process usually takes a long time compared with cleaning, drying and other processes. Therefore, a plurality of plating tanks 42 can be provided to perform plating processes on a plurality of substrates W at the same time.

[0050] The transport mechanism 28 is, for example, a linear motor type mechanism, and transports the substrate holder 24 to each tank of the plating processing unit 4. The transport mechanism 28 utilizes the time lag of the processing in each plating tank 42 to sequentially transport the substrate holder 24.

[0051] The control unit 6 is composed of a microcomputer and includes: a CPU that performs various calculations, a ROM that stores control programs, etc., a RAM that is used as a work area for data storage and program execution, a non-volatile memory that retains the stored content even after the power is turned off, an input / output interface, and a timer for timing, etc. In addition, in this embodiment, the control unit 6 drives and controls each mechanism, but a control unit may be provided for each mechanism. In this case, a coordinating control unit that coordinates the control units of each mechanism may also be provided.

[0052] With the above configuration, the plating apparatus 1 roughly performs the following operations.

[0053] First, the substrate conveying robot 22 takes out the substrate W to be plated from the substrate transfer station 8 and places it in the cleaning device 14. When the cleaning device 14 receives the substrate W, it performs a pre-cleaning process to remove organic matter, etc. The details of the cleaning process will be described later. When the pre-cleaning is completed, the substrate conveying robot 22 receives the substrate W from the cleaning device 14 and delivers it to the loading and unloading mechanism 20. The loading and unloading mechanism 20 places the substrate W on the substrate holding frame 24 and installs it on the holding mechanism 26.

[0054] The conveying mechanism 28 lifts the holding mechanism 26 to convey the substrate holder 24, and immerses the substrate W together with each substrate holder 24 in the pre-wetting tank 30. Thus, the pre-wetting treatment using degassed water is performed. In addition, in this embodiment, the degassed water is stored in the pre-wetting tank 30, but as long as it can replace the air in the resist layer opening on the substrate surface and perform the pre-wetting treatment in which the resist layer opening is also filled with liquid, it is not limited to this.

[0055] As will be described later, the pre-wetting tank 30 may not be provided as long as the pre-wetting process in the cleaning device 14 is sufficient.

[0056] The conveying mechanism 28 continues to take out the substrate holder 24 from the pre-wetting tank 30 and convey it, and immerses it in the pre-preg tank 32. The pre-preg tank 32 stores a chemical solution such as sulfuric acid and hydrochloric acid. In the case where an oxide film is generated on the seed layer (conductive layer) of the substrate W, it is removed by performing a pre-preg treatment based on the chemical solution. In this way, the clean metal surface of the seed layer can be exposed.

[0057] The conveying mechanism 28 continues to take out the substrate holder 24 from the prepreg tank 32 and convey it, and immerses it in the rinse tank 34. As a result, the chemical solution attached to the substrate W is washed away by the deionized water. The conveying mechanism 28 continues to immerse the substrate W in the remaining plating tank 42. In addition, in this embodiment, copper plating is performed in the plating process, but nickel plating, gold plating, and other plating can also be performed by changing the plating solution supplied to the plating tank 42.

[0058] The substrate W subjected to plating is cleaned in the rinse tank 38 and then drained in the blast tank 36. Then, it is transported to the loading and unloading mechanism 20. The loading and unloading mechanism 20 removes the substrate holder 24 from the gripping mechanism 26 and takes out the substrate W from the substrate holder 24. The substrate transport robot 22 receives the substrate W from the loading and unloading mechanism 20 and places it in the cleaning device 16. After receiving the substrate W, the cleaning device 16 performs a post-cleaning process.

[0059] Next, the structure and operation of the cleaning device 14 will be described in detail.

[0060] Figure 2 It is a perspective view showing the overall structure of the cleaning device 14 .

[0061] The cleaning device 14 includes a flat base 50, a cleaning unit 52 mounted on the base 50, a support mechanism 54 that supports the substrate W above the cleaning unit 52, and a drying mechanism 56 that dries the substrate W above the cleaning unit 52. The support mechanism 54 is a mechanism that supports the substrate W during the drying process and functions as a "gripping unit". The drying mechanism 56 is a mechanism that dries the substrate W.

[0062] Support columns 58 are erected at the four corners of the base 50, and a pair of guide members 60a and 60b (collectively referred to as "guide members 60" when they are not particularly distinguished) are provided so as to span the left and right support columns 58. The guide members 60a and 60b extend horizontally and are parallel to each other. The support mechanism 54 has a pair of holding units 62a and 62b (collectively referred to as "holding units 62" when they are not particularly distinguished) for holding the substrate W horizontally during the drying process. The holding unit 62a is suspended and held by the guide member 60a, and the holding unit 62b is suspended and held by the guide member 60b.

[0063] The holding unit 62 includes a support table 64 extending parallel to the guide member 60, and a pair of clamping mechanisms 66 disposed in the extending direction of the support table 64. The substrate W can be clamped from above and below and supported horizontally by the four clamping mechanisms 66 in total included in the pair of holding units 62. The details of the clamping mechanisms 66 will be described later.

[0064] The drying mechanism 56 is supported so as to be movable along a pair of guide members 60. A linear motor 68 for driving the drying mechanism 56 is provided on the upper surface of the guide member 60a. A guide rail 70 for guiding the driving of the drying mechanism 56 is provided on the upper surface of the guide member 60b. The drying mechanism 56 includes: a support table 72 suspended and held by a pair of guide members 60, and a pair of upper and lower blowers 74a, 74b (collectively referred to as "blowers 74" when they are not particularly distinguished) supported by the support table 72. The blowers 74a, 74b function as "first nozzles" and spray air from the upper and lower directions to the substrate W held horizontally during the drying process.

[0065] Figure 3 and Figure 4 are perspective views showing the structure of the cleaning unit 52. Figure 2 The cleaning unit 52 is removed and the substrate W is removed. Figure 3 Indicates the state where the support mechanism of the cleaning unit 52 is raised, Figure 4 Indicates a descending state.

[0066] like Figure 3As shown, the cleaning unit 52 includes: a housing 80 for accommodating the internal mechanism, a processing tank 82 disposed in the housing 80, a supply mechanism 84 for supplying cleaning liquid to the processing tank 82, a discharge mechanism 86 for discharging the cleaning liquid from the processing tank 82, a support mechanism 88 capable of supporting the substrate W in a horizontal posture, and a lifting mechanism 90 for lifting and lowering the support mechanism 88. The supply mechanism 84 functions as a "processing liquid supply unit", and the discharge mechanism 86 functions as a "processing liquid discharge unit". The support mechanism 88 functions as a "support unit", and the lifting mechanism 90 functions as a "lifting unit".

[0067] The processing tank 82 includes a cleaning tank 92 for supplying cleaning liquid and an overflow tank 94 for overflowing the cleaning liquid. A supply port 96 for the cleaning liquid is provided on the side wall of the cleaning tank 92 on the opposite side to the overflow tank 94. In the present embodiment, three horizontally long structures are provided as the supply ports 96. These supply ports 96 are positioned at a position lower than the lower surface of the substrate W when the support member 104 described later is lowered.

[0068] The supply mechanism 84 includes a supply pipe 98 connected to the supply port 96, and a control valve (supply valve and switching valve) (not shown) provided on the upstream side of the supply pipe 98. The switching valve switches which of the multiple types of cleaning liquids is supplied. In the present embodiment, three types of cleaning liquids are prepared, namely, degassed water, ozone water, and deionized water (DIW). The treatment liquid whose supply path is opened by the switching valve is supplied to the supply pipe 98, and is supplied to the cleaning tank 92 by opening the supply valve.

[0069] A discharge port 100 is provided at the center of the bottom of the cleaning tank 92. The discharge mechanism 86 includes a discharge pipe communicating with the discharge port 100 and a control valve (discharge valve) (not shown) provided on the discharge pipe. The processing liquid in the cleaning tank 92 is discharged by opening the discharge valve.

[0070] The lifting mechanism 90 includes lifting shafts 102 provided at four corners around the processing tank 82, and air cylinders (not shown) for lifting and lowering the lifting shafts 102. The supporting mechanism 88 includes a rectangular plate-shaped supporting member 104, and clamping mechanisms 106 disposed at four corners around the supporting member 104. The supporting member 104 and the clamping mechanisms 106 are lifted and lowered integrally by the lifting and lowering of the lifting shafts 102. The four clamping mechanisms 106 fix the substrate W to the supporting member 104 during the cleaning process. This prevents the position of the substrate W from being deviated by the water pressure of the cleaning liquid supplied to the cleaning tank 92.

[0071] The four clamping mechanisms 106 are supported by the four lifting shafts 102. The support member 104 supports the four corners of the four lifting shafts 102 to maintain a horizontal posture. Specifically, L-shaped hanging and holding members 105 are fixed to the top of each lifting shaft 102, and the four hanging and holding members 105 are connected to the four corners of the support member 104.

[0072] A plurality of protrusions 108 are provided along the grid shape on the upper surface of the support member 104. The substrate W is placed on these protrusions 108. The support member 104 and the clamping mechanism 106 will be described in detail later.

[0073] like Figure 4 As shown in FIG. 1 , a drying mechanism 110 is provided around the cleaning tank 92. The drying mechanism 110 is a mechanism for drying the mounting surface (protrusion 108) of the support member 104. In addition, in this embodiment, the drying of the substrate W (first drying process) and the drying process (second drying process) of the support member 104 are performed independently. By separating the substrate W from the support member 104, the entire upper and lower surfaces of the substrate W are efficiently dried. In addition, since the substrate W is mounted on the support member 104 again after drying, the mounting surface (protrusion 108) is dried first.

[0074] The drying mechanism 110 includes three rows of air nozzles 112 arranged near the front side and the back side of the cleaning tank 92. The air nozzles 112 function as "second nozzles". When the support member 104 is in a lowered state as shown in the figure, air can be uniformly sprayed from the six air nozzles 112 toward the plurality of protrusions 108 (refer to the double-dotted line), and moisture on the upper surface thereof can be removed. The angle of each air nozzle 112 is adjusted in this way.

[0075] In addition, the support member 104 can also be dried by blowing air from above using a blower. However, if the support member 104 is a frame and the protrusions 108 dispersedly arranged on the frame are the drying objects, it is not necessary to spray the layered air, which can be said to be inefficient. Therefore, in this embodiment, the air nozzle 112 is used for the drying mechanism 110. The details of the drying mechanism 110 will be described later.

[0076] Figure 5 is a longitudinal sectional view showing the structure of the cleaning device 14, and Figure 1 The cross section corresponds to the AA arrow direction. Figure 6 It is a side view showing the structure and operation of the clamping mechanism 66. Figure 6 (a) indicates the unclamped state, Figure 6 (b) indicates the clamped state.

[0077] like Figure 5As shown, a drain pipe 114 is provided in communication with the discharge port 100 of the cleaning tank 92. The processing liquid of the cleaning tank 92 is discharged through the drain pipe 114. In addition, a discharge port 116 and a drain pipe 118 are provided at the bottom of the overflow tank 94. The processing liquid overflowing from the cleaning tank 92 is discharged through the drain pipe 118.

[0078] The blower 74 has a slit-shaped nozzle and ejects compressed air in a thin layer. The nozzle of the blower 74a opens obliquely downward, and the nozzle of the blower 74b opens obliquely upward. The inclination angles of the two are substantially the same with respect to the horizontal direction.

[0079] The clamping mechanism 66 includes: a base 120 fixed to the support platform 64, a pair of upper and lower gripping parts 122 supported by the base 120, and an air cylinder 124 for driving the gripping part 122. The gripping part 122 includes: a T-shaped arm 126, and a clamping member 128 fixed to the front end of the arm 126. The base end of the arm 126 is connected to the base 120 so as to be rotatable. The clamping member 128 is a rod-shaped member. The front end of the arm 126 is formed in a U shape, and the clamping member 128 is provided in a manner spanning both ends thereof. A plurality of O-rings 130 (sealing rings) are provided along the length direction of the clamping member 128.

[0080] like Figure 6 As shown in (a), in the non-driven state of the clamping mechanism 66, the rod of the air cylinder 124 moves in and out. Therefore, the upper arm 126a rotates clockwise in the figure around the rotation axis 132a, and the lower arm 126b rotates counterclockwise in the figure around the rotation axis 132b. As a result, the clamping mechanism 66 becomes an open state (unclamped state).

[0081] On the other hand, Figure 6 As shown in (b), in the driving state of the clamping mechanism 66, the rod of the air cylinder 124 retreats. Therefore, the arm 126a rotates counterclockwise in the figure, and the arm 126b rotates clockwise in the figure. As a result, the substrate W is clamped (clamped state). In this clamped state, the upper and lower pairs of O-rings 130 clamp the outer periphery of the substrate W.

[0082] Figure 7 It is a plan view showing the structure of the support mechanism 88 . Figure 7 (a) shows a state where no substrate W is placed. Figure 7 (b) shows a state where a substrate W is placed.

[0083] like Figure 7As shown in (a), the support member 104 includes: a rectangular outer frame 140, a bridge portion 142 spanning the outer frame 140 to the left and right, and two bridge portions 144 spanning the front and back of the outer frame 140. The support member 104 is formed in a grid shape as a whole. The six empty areas surrounded by the outer frame 140 and the bridge portions 142 and 144 have a relatively large area, which promotes the circulation of the treatment liquid.

[0084] A plurality of protrusions 108 are disposed in a scattered manner on the upper surface of the support member 104. The protrusions 108 may be prism-shaped, cylindrical-shaped, or hemispherical-shaped. That is, a plurality of protrusions 108a are disposed along the peripheral edge of the outer frame 140, and a plurality of protrusions 108b are disposed along the length direction of the bridges 142 and 144. The protrusions 108b are smaller than the protrusions 108a.

[0085] On the other hand, Figure 7 As shown in (b), a band-shaped (grid-shaped) contactable area 148 is set on the lower surface of the substrate W in a manner corresponding to the arrangement of the plurality of protrusions 108. The contactable area 148 is an area that is allowed to be contacted for the purpose of conveying the substrate, for example, an area where circuits such as wiring and bumps are not assembled. The substrate W is placed on the plurality of protrusions 108 in its contactable area 148. That is, the assembled part of the substrate W is in a state of floating from the surface of the support member 104, and the cleaning liquid can flow over the entire surface reliably.

[0086] In addition, in the present embodiment, the same contactable region as that of the lower surface is formed also on the upper surface of the substrate W. Even if either of the two surfaces of the substrate W is placed on the supporting member 104, it can be cleaned and dried in the same manner.

[0087] Figure 8 and Fig. 9 It is a diagram showing the structure and operation of the clamping mechanism 106. Figure 8 (a) indicates the unclamped state, Figure 8 (b) indicates the clamped state. Fig. 9 (a) is a cross-sectional view showing the function and operation of the clamping mechanism 106 during washing and drying. Fig. 9 (b) Yes Fig. 9 (a) Enlarged view of part B.

[0088] like Figure 8 As shown in (a), the clamping mechanism 106 has an actuator 150 provided on the upper part of the lifting shaft 102, and an arm 152 driven by the actuator 150. The actuator 150 is composed of an air cylinder, and has a cylinder body 154, a support portion 156 provided on the cylinder body 154, and a piston rod 158 extending from the cylinder body 154.

[0089] The arm 152 has an L-shaped main body 160. The main body 160 is connected to the piston rod 158 via an L-shaped connecting member 162. One end of the connecting member 162 is fixed to the main body 160, and the center thereof is rotatably supported by the supporting portion 156. A slit 163 is provided at the other end of the connecting member 162, through which the front end of the piston rod 158 is inserted in a slidable manner.

[0090] If the piston rod 158 is driven in one direction by the actuator 150 to move in and out, the connecting member 162 rotates clockwise in the figure. As a result, the arm 152 moves in the clamping direction. Figure 8 As shown in (b), the front end of the arm 152 approaches the upper surface of the substrate W supported by the support member 104. If the piston rod 158 is driven in the other direction by the actuator 150 and moves backward, the connecting member 162 rotates counterclockwise in the figure. Figure 8 As shown in (a), the arm 152 moves in the unclamping direction.

[0091] like Fig. 9 As shown in (a), a fluid passage 164 is formed in the main body 160, which passes through from the front end to the rear end. A pipe joint 166 is provided at the rear end of the main body 160. A pipe (not shown) is connected to the pipe joint 166, and dry air (CDA) or deionized water (DIW) can be supplied to the fluid passage 164.

[0092] In this way, the arm 152 and the substrate W are in a non-contact state, but since the fluid is ejected from the front end of the main body 160, the fluid pressure acts as a clamping force, so that the substrate W can be clamped between the arm 152 and the support member 104. In this embodiment, deionized water is supplied to the fluid passage 164 while the support member 104 is lowered to the cleaning tank 92 and the substrate W is immersed in the processing liquid. On the other hand, dry air is supplied to the fluid passage 164 during the lifting and lowering of the support member 104 or in the raised position. That is, except when the clamping mechanism 106 opens the substrate W, an arbitrary fluid is ejected to press the substrate W against the support member 104. Thus, the substrate W is supported.

[0093] like Fig. 9 As shown in (b), an O-ring 168 (seal ring) is provided on the front end surface of the main body 160. This can prevent the front end from directly contacting the substrate W and being damaged even if the rotational momentum of the main body 160 is too large during the clamping operation.

[0094] Fig.10 It is a figure which shows the state at the time of drying process.

[0095] When the substrate W is dried, the drying mechanism 56 is driven while the substrate W is supported by the clamping mechanism 66. At this time, the drying mechanism 56 moves along the guide rail 70 as shown in the figure, and the blower 74 sprays air toward the substrate W. In this drying process, the substrate W is located between the blower 74a and the blower 74b. Therefore, the upper and lower surfaces thereof are efficiently dried by the two blowers.

[0096] In addition, during this period, the support member 104 retreats to the cleaning tank 92 where the discharge is completed, and the drying is performed by the drying mechanism 110. The water droplets attached to the protrusion 108 are removed by the air ejected from the air nozzle 112. In this way, the first drying process by the drying mechanism 56 and the second drying process by the drying mechanism 110 are performed together.

[0097] Next, the flow of cleaning control will be described.

[0098] Fig.11 This is a flowchart showing the flow of the pre-cleaning process. Fig.12 and Fig.13 The following are diagrams showing the control method in the pre-cleaning process. (a) to (d) of each diagram show the processing process. For convenience, only the supply valve 170, the discharge valve 172 and the switching valve 174 are shown in FIG. Fig.12 (a) is shown, and the description is omitted in other figures. Fig.11 , while appropriately referring to Fig.12 , Fig.13 While explaining.

[0099] At the start of the pre-cleaning process, the control unit 6 drives the lifting mechanism 90 and the substrate transfer robot 22 to load the substrate W onto the cleaning device 14 (S10). Fig.12 As shown in (a), the lifting mechanism 90 raises the support member 104 to the loading position. The substrate transport robot 22 holds and takes out the substrate W from the substrate transfer table 8 in a horizontal position and places it on the support member 104. In this embodiment, the robot arm 22a is located on the upper surface side of the substrate W to hold the substrate W. At this time, dry air is also supplied through the fluid passage 164, and the clamping mechanism 106 clamps the substrate W (S12). At this moment, the cleaning tank 92 is empty.

[0100] Next, the control unit 6 drives the lifting mechanism 90 while maintaining the clamped state of the substrate W, so that the support member 104 is lowered to the cleaning tank 92 (S14). Fig.12 As shown in (b), the substrate W is placed in the cleaning tank 92. Fig.12As shown in (c), the control unit 6 opens the supply valve 170 to supply degassed water to the cleaning tank 92, and performs the pre-wetting process while causing it to overflow (S16). At this time, the deionized water is supplied via the fluid passage 164, and the clamping mechanism 106 maintains the clamping state of the substrate W. As a result, the opening of the resist layer of the substrate W is filled with degassed water, and bubbles are removed. In this embodiment, the time of the pre-wetting process is set to 60 seconds. When the pre-wetting process is completed, the supply valve 170 is closed, and the discharge valve 172 is opened to drain water (S18).

[0101] Next, the control unit 6 operates the switching valve 174 to switch the processing liquid to ozone water. In addition, the discharge valve 172 is closed, the supply valve 170 is opened, and ozone water is supplied to the cleaning tank 92, and the cleaning process is performed while the ozone water overflows (S20). The opening of the resist layer of the substrate W is already filled with degassed water, so the degassed water is replaced by ozone water, and the organic matter attached to the surface of the substrate W is removed by the action of the ozone water, thereby improving the hydrophilicity. In this embodiment, the time of the cleaning process is set to 60 seconds. When the cleaning process is completed, the supply valve 170 is closed, and the discharge valve 172 is opened to drain water (S22).

[0102] Next, the control unit 6 operates the switching valve 174 to switch the treatment liquid to deionized water (DIW). In addition, regarding the discharge valve 172, the supply valve 170 is opened to supply deionized water to the cleaning tank 92, and the rinsing process is performed while the water overflows (S24). At this time, the deionized water is also supplied through the fluid passage 164 of the clamping mechanism 106. In this embodiment, the time of the rinsing process is set to 30 seconds. When the rinsing process is completed, the supply valve 170 is closed, and the discharge valve 172 is opened to drain the water (S26). The supply of deionized water through the fluid passage 164 is also stopped, and the supply is switched to dry air.

[0103] like Fig.12 As shown in (d), the control unit 6 drives the lifting mechanism 90 together with the drainage, so that the support member 104 rises to the drying position (S28). Then, the substrate W is transferred from the support mechanism 88 to the support mechanism 54 (S30). At this time, the clamping mechanism 66 clamps the substrate W, and the clamping of the clamping mechanism 106 is released. The supply of dry air through the fluid passage 164 is stopped. When the transfer of the substrate W is completed, Fig.13 As shown in (a), the support member 104 is lowered (S32). In this embodiment, the height of the support member 104 at this time is made consistent with the height during cleaning. In a modified example, the height may be different.

[0104] When the support member 104 retreats to the cleaning tank 92, the control unit 6 drives the drying mechanism 56 and the drying mechanism 110 at the same time (S34). Fig.13 As shown in (b), the blower 74 dries the substrate W, and the air nozzle 112 dries the support member 104 (protrusion 108). At this time, air is also supplied through the fluid passage 164 of the clamping mechanism 106. In this way, the first and second drying processes are performed simultaneously, thereby suppressing the influence of liquid splashing generated in each drying process. In this embodiment, the time of these drying processes is set to 30 seconds.

[0105] The blower 74 does not reciprocate the substrate W, but uses one-directional movement to end the drying process. When the one-directional movement is completed, the air blowing is stopped and the substrate returns to its original position. When the drying process is completed, the air supply through the fluid passage 164 is stopped. Fig.13 As shown in (c), the control unit 6 drives the lifting mechanism 90 to raise the support member 104 to the loading position (S36). Then, the substrate W is transferred from the support mechanism 54 to the support mechanism 88 (S38). After the substrate W is placed on the support member 104 again, the clamping of the clamping mechanism 66 is released.

[0106] like Fig.13 As shown in (d), the control unit 6 drives the substrate transport robot 22 to unload the substrate W (S40). The substrate transport robot 22 takes out the substrate W from the support member 104 and transports it to the loading and unloading mechanism 20. Then, the above-mentioned plating process is started.

[0107] After the plating process is completed, the substrate W is transported to the cleaning device 16 for post-cleaning. The structure and operation of the cleaning device 16 are substantially the same as those of the cleaning device 14, but the processing liquid supplied to the cleaning tank 92 is only deionized water (DIW). In the post-cleaning process, the components and particles of the plating solution that cannot be completely removed in the rinse tank 38 are removed from the substrate W.

[0108] As described above, according to this embodiment, the substrate W can be placed on the support member 104 and raised and lowered while maintaining a horizontal posture to perform a cleaning process. Since the transfer of the substrate W during the drying process is also performed while the substrate W is placed on the support member 104, the support method can be stably switched from placement to holding. Therefore, the substrate W will not bend during a series of processing processes and will not interfere with other structures. That is, even a large and thin substrate W can be stably processed.

[0109] In addition, by dispersing a plurality of protrusions 108 on the support member 104 and using the protrusions 108 as the mounting surface, most of the lower surface of the substrate W can be opened to the cleaning liquid, and the cleaning liquid can be spread over the entire upper and lower surfaces of the substrate W, thereby improving the cleaning effect.

[0110] In addition, since the support member 104 is retracted to the cleaning tank 92 when the substrate W is dried, there is no need to provide a separate retraction space for the support member 104. In addition, since the pre-wetting process using deaerated water, the cleaning process using ozone water, and the rinsing process using deionized water are performed in the cleaning tank 92, there is no need to provide a processing tank for each process. With such a structure, the entire cleaning device 14 can be space-saving.

[0111] Furthermore, since the substrate W is dried and the support member 104 (protrusion 108) is dried simultaneously, it is possible to suppress the disadvantage that liquid from the substrate W splashes and wets the protrusion 108. Since the support member 104 is dried in the cleaning tank 92, the splashed water droplets can stay in the cleaning tank 92 and be directly discharged from the discharge port 100. The structures outside the cleaning tank 92 will not be contaminated.

[0112] [Second embodiment]

[0113] Fig.15 It is a perspective view showing the structure of a cleaning unit according to the second embodiment.

[0114] This embodiment is different from the first embodiment in that the cleaning unit is not a type that immerses the substrate in the cleaning liquid, but a type that sprays the cleaning liquid onto the surface of the substrate (also called a "shower type"). The following description will focus on the differences from the first embodiment. In this embodiment, the same structure as the first embodiment can be applied unless otherwise specified.

[0115] In the cleaning unit 252 of the present embodiment, the housing 80 functions as a "processing tank 82 (cleaning tank 92)". The processing tank 82 is provided with a supply mechanism 284, a lifting mechanism 90 and a supporting mechanism 288. The supply mechanism 284 includes a first supply mechanism 211 and a second supply mechanism 212. The first supply mechanism 211 has a pair of movable supply pipes 214a, 214b (collectively referred to as "supply pipes 214" without special distinction). The supply pipes 214a, 214b have vertical rotation axes at two corners of the processing tank 82, respectively. These rotation axes are configured to be separated along a diagonal line of the processing tank 82.

[0116] The supply pipe 214 extends and protrudes from its rotation axis in the horizontal direction. The supply pipe 214 is located at the upper part of the processing tank 82. On the lower surface of the supply pipe 214, a plurality of nozzles 218 are provided along the extension direction thereof. The nozzles 218 function as "processing liquid injection nozzles". The cleaning liquid is supplied downward from the supply pipe 214. As shown in the figure, the supply pipe 214b is located at a higher position than the supply pipe 214a so that the supply pipes 214a and 214b do not interfere with each other when rotating.

[0117] The second supply mechanism 212 has a plurality of supply pipes 224 arranged in parallel at the bottom of the processing tank 82. A plurality of nozzles 228 are provided on the upper surface of the supply pipe 224 along the extending direction thereof. The nozzle 228 functions as a "processing liquid injection nozzle". The cleaning liquid is supplied upward from the supply pipe 224. An outlet (not shown) is provided on the bottom surface of the processing tank 82. The cleaning liquid supplied from the supply pipes 214 and 224 flows through the bottom surface of the processing tank 82 after cleaning the substrate and is discharged from the outlet.

[0118] The support mechanism 288 includes a rectangular plate-shaped support member 204 and clamping mechanisms 106 disposed at four corners around the support member 204. The support member 204 is formed in a grid shape with four empty areas. A plurality of protrusions 208 are provided on the upper surface of the support member 204 along the grid shape. Rod-shaped reinforcing members 206 are provided on two sides of the support member 204 so as to cross the protrusions 208. The substrate is placed on these protrusions 208.

[0119] Fig.16 It is a perspective view showing the operation of the cleaning unit 252 during cleaning.

[0120] If the substrate W is placed on the placement surface (protrusion 208) of the support member 204 and the cleaning unit 252 is driven while being clamped by the clamping mechanism 106, the supply pipe 214 rotates and the cleaning liquid is sprayed from the nozzle 218. The cleaning liquid is also sprayed from the nozzle 228 of the supply pipe 224 at the same time. Thus, the cleaning liquid is sprayed onto the upper and lower surfaces of the substrate W. At this time, the supply pipe 214 rotates about 90 degrees while spraying the cleaning liquid in a manner of scanning the upper surface of the substrate W (refer to the double-dotted arrow in the figure). In addition, the supply pipe 214 can also be repeatedly scanned to spray the cleaning liquid onto the substrate. In this case, since the cleaning liquid on the substrate is discharged in one direction, it is preferred to use the direction in which the supply pipe 214 is scanned as one direction. In addition, in order to improve the discharge of the cleaning liquid on the substrate surface, it is preferred to perform the cleaning process with the support member 204 slightly tilted from the horizontal.

[0121] According to this embodiment, although the cleaning method is different, the posture of the substrate W during cleaning (horizontal posture), the drying method, etc. are the same as those of the first embodiment. Therefore, the same effects as those of the first embodiment can be obtained.

[0122] As mentioned above, although the preferred embodiment of the present invention has been described, the present invention is not limited to this specific embodiment, and various modifications can be made within the scope of the technical idea of ​​the present invention.

[0123] Fig.14 It is a cross-sectional view showing a clamping structure of a modified example. Fig.14 (a) shows a first modification example, Fig.14 (b) shows a second modification example.

[0124] In the clamping mechanism of the above embodiment, Fig. 9 As shown in (b), an O-ring 168 is provided at the front end of the arm 152 to cope with the contact with the substrate W. In the first modified example, no O-ring is provided, and an expanded diameter portion 210 is provided at the front end of the arm 260. As a result, the area on which the fluid pressure acts in the substrate W can be increased, so the holding force based on the arm 260 can be improved. In this case, it is preferred that at least the front end of the arm 260 is made of a material with low hardness.

[0125] In the second modification, the fluid passage is not provided in the arm 262, and the front end thereof is spherical. In this modification, the supply of dry air and deionized water based on the clamping mechanism is not performed. The peripheral edge of the substrate W is clamped by the arm 262 and the support member 104. According to this modification, the contact area is suppressed to be small by making the arm 262 in a point contact state with the substrate W, thereby suppressing damage to the substrate W and minimizing contamination caused by contact. In this case, it is also preferable to make the material of at least the front end of the arm 262 low in hardness.

[0126] In the above embodiment, in the plating device 1, the pre-cleaning unit 10 and the plating treatment unit 4 are set in different areas. In a modified example, the function of the pre-cleaning unit 10 can also be incorporated into the plating treatment unit. Figure 1 In the shown plating treatment section 4, a pre-cleaning tank may be provided between the pre-wetting tank 30 and the pre-preg tank 32 to perform ozone water cleaning and rinsing treatment.

[0127] In the first embodiment described above, if Figure 7 As shown in (a), a grid shape (frame shape) is adopted in which the support member 104 is divided into six frame areas. The number of frame areas is not limited to six and can be appropriately set according to the configuration of the contactable area 148 set on the substrate W.

[0128] Although not described in the above embodiment, it is also possible that a plurality of types of replaceable supporting components can be prepared according to the type of substrate and can be loaded and unloaded in the cleaning unit. It is considered that the layout of the assembly area and the non-assembly area is different due to the type of substrate. The plurality of types of supporting components have a size, shape and layout of the protrusions corresponding to the non-assembly area (contactable area) of any substrate. With such a structure, it is possible to correspond to substrates of various sizes and assembly layouts.

[0129] Although not described in the above embodiment, it is also possible that after the cleaning of the substrate W in the upstream process, the presence or absence of ozone water cleaning in the pre-cleaning treatment is determined corresponding to the time until the substrate W is handed over to the plating device 1. Even if the substrate W is cleaned in the upstream process, sometimes with the passage of time, organic matter is attached again to the seed layer exposed in the opening of the resist layer of the substrate W. Therefore, specifically, the control unit (management unit) obtains the time information of cleaning the substrate W in the upstream process for each substrate W, and calculates the elapsed time until it is placed on the substrate handover station 8. It is also possible that ozone cleaning is performed if the elapsed time is more than the specified time, and ozone cleaning is omitted if it is less than the specified time. That is, the presence or absence of ozone water cleaning can also be determined based on the inferred pollution level of the substrate W. Alternatively, the time of ozone cleaning can also be changed according to the pollution level. Since excessive ozone cleaning may cause damage to the seed layer (conductive layer), it is preferable to set the optimal cleaning conditions like this.

[0130] Although not described in the first embodiment, when supplying the processing liquid to the cleaning tank 92, the substrate W may be slightly tilted at least before the substrate W is immersed. Figure 5 In the state shown, the movements of the four lifting shafts 102 are adjusted so that the support member 104 is tilted at a slight angle (eg, about 1 / 1000 to 1 / 100) relative to the horizontal plane. At this time, the overflow tank 94 side (right side) is lowered.

[0131] Thus, the substrate W is gradually immersed in the processing liquid from the right side to the left side. This means that the space between the lower surface of the substrate W and the liquid surface of the processing liquid gradually moves to the left side, that is, the air moves to the side opposite to the overflow groove 94. Thus, it is not easy for bubbles to flow into the overflow groove 94. That is, it is possible to prevent or suppress bubbles from being retained in the overflow groove 94 and reducing the efficiency of the overflow. In this case, the substrate W can be returned horizontally after the substrate W is fully immersed in the processing liquid. It can also be returned horizontally after the degassed water cleaning is completed.

[0132] According to the substrate processing apparatus including such a chucking mechanism, the chucking portion can be processed simultaneously with the processing of the substrate main body, thereby improving the efficiency of the entire substrate processing.

[0133] In addition, the present invention is not limited to the above-mentioned embodiments and variations, and the constituent elements can be deformed and concretized within the scope of the main purpose. Various inventions can also be formed by appropriately combining a plurality of constituent elements disclosed in the above-mentioned embodiments and variations. In addition, several constituent elements can also be deleted from all the constituent elements shown in the above-mentioned embodiments and variations.

[0134] Industrial Applicability

[0135] The present invention can be applied to a substrate processing device that processes a substrate using a processing liquid.

[0136] Description of Reference Numerals

[0137] 1…plating device; 2…substrate loading and unloading section; 4…plating processing section; 6…control section; 8…substrate transfer station; 10…front cleaning section; 12…rear cleaning section; 14…cleaning device; 16…cleaning device; 18…holder conveying mechanism; 20…loading and unloading mechanism; 22…substrate conveying robot; 23…moving mechanism; 24…substrate holder; 28…conveying mechanism; 30…pre-wetting tank; 32…pre-preg tank; 34…rinsing tank; 36…spray Blowing tank; 38 ... rinsing tank; 40 ... overflow tank; 42 ... coating tank; 52 ... cleaning unit; 54 ... supporting mechanism; 56 ... drying mechanism; 60 ... guiding member; 66 ... clamping mechanism; 74 ... blower; 82 ... processing tank; 84 ... supply mechanism; 86 ... discharge mechanism; 88 ... support mechanism; 90 ... lifting mechanism; 92 ... cleaning tank; 94 ... overflow tank; 96 ... supply port; 98 ... supply pipe; 100 ... discharge port; 102 ...lifting shaft; 104 ...support member; 106 ...clamping mechanism; 108 ...protrusion; 110 ...drying mechanism; 112 ...air nozzle; 114 ...discharge pipe; 116 ...discharge port; 118 ...discharge pipe; 122 ...holding part; 124 ...air cylinder; 126 ...arm; 128 ...clamping member; 130 ...O-ring; 148 ...contactable area; 150 ...actuator; 152 ...arm; 164 ...fluid passage; 168 …O-ring; 170…supply valve; 172…discharge valve; 174…switching valve; 204…support member; 208…protrusion; 210…enlarged diameter portion; 211…first supply mechanism; 212…second supply mechanism; 214…supply pipe; 218…nozzle; 224…supply pipe; 228…nozzle; 252…cleaning unit; 260…arm; 262…arm; 284…supply mechanism; 288…support mechanism; W…substrate.

Claims

1. A substrate processing device, comprising: A support portion having a placement surface for placing the substrate in a horizontal position; a processing tank, which is used to supply a processing liquid to the substrate on the mounting surface to process the substrate; A lifting part that lifts and lowers the support part in order to lower the substrate into the processing tank and to lift the substrate from the processing tank; a holding portion that holds an outer peripheral portion of the substrate supported by the supporting portion and receives the substrate from the supporting portion above the processing tank; and a first nozzle that sprays gas toward the substrate held by the holding portion to dry the substrate; The support portion comprises: a frame; and A plurality of protrusions protrude from the upper surface of the frame body and constitute the placement surface.

2. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus further includes a control unit. The control unit controls the lifting unit so as to lower the support unit after the holding unit holds the substrate.

3. The substrate processing apparatus according to claim 2, wherein: Also available: a treatment liquid supply unit that supplies the treatment liquid to the treatment tank; and a treatment liquid discharge unit that discharges the treatment liquid from the treatment tank, The control unit controls the processing liquid discharge unit so as to discharge the processing liquid in the processing tank before or after the support unit is raised.

4. The substrate processing apparatus according to claim 3, wherein: A second nozzle is further provided, the second nozzle spraying gas toward the placement surface of the support portion to dry the placement surface.

5. The substrate processing apparatus according to claim 4, wherein: The second nozzle dries the placement surface of the support portion that is lowered into the processing tank from which the processing liquid has been discharged.

6. The substrate processing apparatus according to claim 4 or 5, wherein: A substrate conveying unit is provided, the substrate conveying unit having a supporting surface for supporting the upper surface of a substrate, and the substrate is delivered to and received from the mounting surface of the supporting unit while maintaining the substrate in a horizontal posture. The control unit controls the lifting unit so that the support unit is lifted up after the placement surface is dried by the second nozzle, and the substrate held by the holding unit is supported by the placement surface of the support unit. The substrate transport unit receives the substrate supported by the placement surface.

7. The substrate processing apparatus according to any one of claims 3 to 5, wherein: The processing tank includes a substrate cleaning tank, The processing liquid supply unit sequentially supplies a plurality of types of cleaning liquids to the substrate cleaning tank.

8. The substrate processing apparatus according to claim 1 or 2, wherein: The process tank further includes a processing liquid spray nozzle for spraying the processing liquid onto the surface of the substrate supported by the support portion in the processing tank.

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