Electroplating device and electroplating method capable of controlling the amount of workpiece electricity

Abstract

The present invention discloses an electroplating device and an electroplating method for controllable workpiece power. The electroplating device includes an electroplating tank, an anode arranged in the electroplating tank, a rotating device arranged on the upper side of the electroplating tank, a hanger frame connected to the rotating device, a circuit control device, and a plurality of circuit board hangers arranged at the lower end of the hanger frame and extending into the electroplating tank. The circuit board hangers are provided with a plurality of hanging points, each hanging point is electrically connected to an electronic assembly switch, and each electronic assembly switch is electrically connected to the circuit control device through a rotating conductive ring. The above-mentioned electroplating device for controllable workpiece power configures the power threshold of each electronic assembly switch, obtains the cumulative power value detected by the electronic assembly switch in real time and determines whether it is less than the corresponding power threshold, and can accurately control the cumulative power value of the workpiece input to each hanging point through the electronic assembly switch, thereby improving the efficiency of electroplating the workpiece and greatly extending the service life.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and in particular to an electroplating device and an electroplating method capable of controlling the amount of electricity of a workpiece. Background Art

[0002] Electroplating is widely used in industrial production. For example, a workpiece is electroplated to add a layer of electroplating to its outer layer. The electroplating layer increases the corrosion resistance and waterproofness of the workpiece. Electroplating needs to be carried out in an electroplating tank. The electroplating solution is placed in the electroplating tank. The workpiece is placed on the electroplating rack and immersed in the electroplating solution for electroplating. The electroplating rack in the electroplating tank in industrial production is usually provided with multiple electroplating hanging points. If the same type of workpiece is placed in the electroplating tank, the electroplating hanging points in the electroplating tank may be vacant. In the electroplating process, the electroplated metal will be enriched on the electroplating hanging points, resulting in a shorter service life of the electroplating rack. In order to improve production efficiency and extend the service life of the electroplating rack, various types of workpieces can be placed in the electroplating tank for electroplating. At this time, the electroplating time and current required for the workpiece on each electroplating hanging point are different, and it is difficult to accurately control the electroplating time and current of each workpiece, resulting in a low yield when the workpiece is electroplated. Therefore, the electroplating device in the prior art method has the problem of being difficult to accurately control the electroplating time and current of each workpiece. Summary of the invention

[0003] The embodiments of the present invention provide an electroplating device and an electroplating method capable of controlling the electrical quantity of a workpiece, aiming to solve the problem that the electroplating device in the prior art method has difficulty in accurately controlling the electroplating time and current of each workpiece.

[0004] In a first aspect, an embodiment of the present invention provides an electroplating device capable of controlling the amount of electricity in a workpiece, wherein the electroplating device comprises an electroplating tank, an anode disposed in the electroplating tank, a rotating device disposed on the upper side of the electroplating tank, a hanger frame connected to the rotating device, a circuit control device, and a plurality of circuit board hangers disposed at the lower end of the hanger frame and extending into the electroplating tank;

[0005] The circuit board hanger is provided with a plurality of hanging points, each of which is electrically connected to an electronic assembly switch, and each of which is electrically connected to the circuit control device via a rotating conductive ring provided on the rotating device;

[0006] The anode is electrically connected to the circuit control device;

[0007] Each of the electronic assembly switches is used to detect the accumulated power value diverted to one of the hanging points corresponding to the electronic assembly switch, and to control the on / off of the circuit connected to the hanging point according to the control instruction issued by the circuit control device;

[0008] The circuit control device is used to supply power to each of the electronic assembly switches, obtain the accumulated power value detected by each of the electronic assembly switches, and issue corresponding control instructions to each of the electronic assembly switches.

[0009] The electroplating device with controllable workpiece electrical quantity, wherein the hanging point includes a hanging point support fixedly arranged on the circuit board hanger, a hanger connected to the hanging point support, and a hanging point power supply circuit arranged in the circuit board hanger, and each of the hanging point supports is electrically connected to a soldering pad arranged on the upper end of the circuit board hanger through one of the hanging point power supply circuits.

[0010] The electroplating device with controllable workpiece electrical quantity, wherein the circuit board hanger is provided with a packaging layer wrapping the circuit board hanger, and the end of the hanger passes through the packaging layer.

[0011] The electroplating device capable of controlling the amount of electricity in a workpiece, wherein the circuit control device comprises a control circuit board, a voltage-stabilizing power supply and a DC power supply;

[0012] The voltage-stabilized power supply is electrically connected to the control circuit board and the rotating conductive ring respectively, and the voltage-stabilized power supply is used to supply power to the control circuit board and each of the electronic assembly switches;

[0013] The control circuit board is electrically connected to each of the electronic assembly switches, and the control circuit board is used to issue control instructions and transmit them to each of the electronic assembly switches;

[0014] The DC power supply is electrically connected to the rotating conductive ring, and the DC power supply is used to output DC power to each of the electronic assembly switches;

[0015] The electronic assembly switch controls the on-off of the direct current output to the hanging point corresponding to the electronic assembly switch according to the control instruction issued by the control circuit board.

[0016] The electroplating device capable of controlling the amount of electricity in a workpiece, wherein the electronic assembly switch comprises a triode and an electricity detector;

[0017] The base of the transistor is connected to the control circuit board, the collector is connected to the DC power supply, and the emitter is connected to the input end of the power detector;

[0018] The output end of the power detector is connected to the hanging point, and the control instruction input end thereof is connected to the control circuit board.

[0019] The electroplating device with controllable workpiece electrical quantity, wherein the control circuit board is electrically connected to the DC power supply, and the control circuit board is used to issue current control instructions to the DC power supply to control the total current output by the DC power supply.

[0020] The electroplating device with controllable workpiece electrical quantity, wherein the positive pole of the DC power supply is electrically connected to the anode, and the negative pole thereof is electrically connected to the rotating conductive ring.

[0021] The electroplating device capable of controlling the amount of electricity in a workpiece, wherein the electroplating device further comprises a controller electrically connected to the control circuit board;

[0022] The controller is used for being operated by a user to output a corresponding control signal to the control circuit board.

[0023] The electroplating device with controllable workpiece electrical quantity, wherein the rotating device comprises a rotating shaft and a rotating motor arranged at the upper end of the rotating shaft and fixedly connected to the rotating shaft, and the rotating motor is electrically connected to the circuit control device.

[0024] In a second aspect, an embodiment of the present invention further provides a method for electroplating a workpiece with controllable electric charge, wherein the method for electroplating a workpiece with controllable electric charge is applied to a circuit control device in the above-mentioned electroplating device with controllable electric charge of the workpiece, and the method comprises:

[0025] If the workpiece power information input by the user is received, the power threshold of the electronic assembly switch corresponding to each hanging point is configured according to the power information of the hanging point in the workpiece power information;

[0026] Sending a control instruction to each of the electronic assembly switches to control the electronic assembly switch to conduct the circuit connected to the corresponding hanging point of the electronic assembly switch;

[0027] Real-time acquisition of the accumulated power value detected by each electronic assembly switch;

[0028] Determining whether the accumulated power value of each of the electronic assembly switches is less than the corresponding power threshold;

[0029] If the accumulated power value of the electronic assembly switch is not less than the corresponding power threshold, a control instruction is issued to the electronic assembly switch to control the electronic assembly switch to disconnect the circuit connected to the corresponding hanging point of the electronic assembly switch and stop obtaining the accumulated power value of the electronic assembly switch;

[0030] If the accumulated power value of the electronic assembly switch is less than the corresponding power threshold, return to the step of acquiring the accumulated power value detected by each electronic assembly switch in real time.

[0031] The embodiment of the present invention provides an electroplating device and an electroplating method for controllable workpiece power. The electroplating device includes an electroplating tank, an anode arranged in the electroplating tank, a rotating device arranged on the upper side of the electroplating tank, a hanger frame connected to the rotating device, a circuit control device, and a plurality of circuit board hangers arranged at the lower end of the hanger frame and extending into the electroplating tank. The circuit board hangers are provided with a plurality of hanging points, each hanging point is electrically connected to an electronic assembly switch, and each electronic assembly switch is electrically connected to the circuit control device through a rotating conductive ring. The above-mentioned electroplating device for controllable workpiece power configures the power threshold of each electronic assembly switch, obtains the cumulative power value detected by the electronic assembly switch in real time and determines whether it is less than the corresponding power threshold, and can accurately control the cumulative power value of the workpiece input to each hanging point through the electronic assembly switch, thereby improving the efficiency of electroplating the workpiece, thereby greatly improving the yield rate of electroplating the workpiece, and can also greatly extend the service life of the circuit board hanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0033] Figure 1 A structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention;

[0034] Figure 2 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention;

[0035] Figure 3 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention;

[0036] Figure 4 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention;

[0037] Figure 5 A circuit structure diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention;

[0038] Figure 6 A flow chart of a method for electroplating with controllable workpiece electrical quantity provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0041] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0042] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0043] The present invention provides an electroplating device capable of controlling the amount of electricity in a workpiece. Figures 1 to 5 , Figure 1 A structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention; Figure 2 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention; Figure 3 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention; Figure 4 A partial structural diagram of an electroplating device capable of controlling the amount of electricity in a workpiece provided by an embodiment of the present invention; Figure 5A circuit structure diagram of an electroplating device for controlling the amount of workpiece electricity provided in an embodiment of the present invention. As shown in the figure, the electroplating device includes an electroplating tank 1, an anode 2 disposed in the electroplating tank 1, a rotating device 3 disposed on the upper side of the electroplating tank 1, a hanger frame 4 connected to the rotating device 3, a circuit control device 6, and a plurality of circuit board hangers 5 disposed at the lower end of the hanger frame 4 and extending into the electroplating tank 1; the circuit board hanger 5 is provided with a plurality of hanging points 51, each of the hanging points 51 is electrically connected to an electronic assembly switch 52, and each of the electronic assembly switches 52 is connected to the circuit control device through a rotating conductive ring 31 disposed on the rotating device 3. 6 is electrically connected; the anode 2 is electrically connected to the circuit control device 6; each of the electronic assembly switches 52 is used to detect the accumulated power value diverted to a hanging point 51 corresponding to the electronic assembly switch 52, and to control the on-off of the circuit connected to the hanging point according to the control instruction issued by the circuit control device 6; the circuit control device 6 is used to supply power to each of the electronic assembly switches 52, obtain the accumulated power value detected by each of the electronic assembly switches 52, and issue corresponding control instructions to each of the electronic assembly switches 52. Specifically, the voltage value of the regulated power supply is 24V, and the regulated power supply can output AC power or DC power.

[0044] The metal quality of the electroplated layer on the workpiece is mainly related to the metal's price, density, atomic weight and cumulative electricity value. The metal's price, density and atomic weight are directly related to the electroplating solution. When the electroplating solution is determined, the metal quality of the electroplated layer of the workpiece in the same electroplating tank 1 is only related to the cumulative electricity value. For example, if the cation in the electroplating solution is metallic copper, the price of metallic copper is +2 and the density is 8.9g / cm 3 , the atomic weight is 63.5. The cumulative electricity value is related to the electroplating time of the workpiece and the current input to the workpiece. The cumulative electricity value = electroplating time × current. The cumulative electricity value can be expressed in ampere minutes. If the electroplating time is 1 minute and the current is constant at 1Am, the corresponding cumulative electricity value is 1 ampere minute. The electroplating time and current input to each hanging point 51 can be accurately controlled by the electronic assembly switch 52, that is, the cumulative electricity value can be accurately and independently controlled. Therefore, the efficiency of electroplating the workpiece can be improved, thereby greatly improving the yield of electroplating the workpiece, and avoiding the enrichment of the electroplated metal on the vacant hanging points 51, thereby greatly extending the service life of the circuit board hanger 5.

[0045] In a more specific embodiment, the hanging point 51 includes a hanging point support 511 fixedly arranged on the circuit board hanger 5, a hanger 512 connected to the hanging point support 511, and a hanging point power line 513 arranged in the circuit board hanger 5, and each of the hanging point supports 511 is electrically connected to a pad 514 arranged on the upper end of the circuit board hanger 5 through a hanging point power line 513. The pad 514 includes a plurality of soldering points, each of which is connected to a hanging point support 511 through a hanging point power line 513, and each of which is also connected to a corresponding electronic assembly switch 52.

[0046] In a more specific embodiment, the circuit board hanger 5 is provided with a packaging layer (not shown in the figure) that wraps the circuit board hanger, and the end of the hanger 512 passes through the packaging layer. The packaging layer can be made of corrosion-resistant materials such as silicone, resin, and ceramics. That is, the hanging point support 511 and the hanging point power line 513 set on the circuit board hanger 5 are both wrapped by the packaging layer, and the end of the hanger 512 passes through the packaging layer and extends out, so that the workpiece can be fixed to the end of the hanger 512. Since the plating solution in the plating tank 1 is usually acidic, alkaline or corrosive, the packaging layer can greatly improve the acid and alkali resistance, pollution resistance, oxidation resistance, aging resistance and corrosion resistance of the circuit board hanger 5, and prevent the packaging layer from being corroded by acid, alkali and other plating solutions, thereby greatly improving the service life of the circuit board hanger 5.

[0047] In a more specific embodiment, the circuit control device 6 includes a control circuit board 61, a voltage-stabilized power supply 62 and a DC power supply 63; the voltage-stabilized power supply 62 is electrically connected to the control circuit board 61 and the rotating conductive ring 31 respectively, and the voltage-stabilized power supply 62 is used to supply power to the control circuit board 61 and each of the electronic assembly switches 52; the control circuit board 61 is electrically connected to each of the electronic assembly switches 52, and the control circuit board 61 is used to issue a control instruction and transmit it to each of the electronic assembly switches 52; the DC power supply 63 is electrically connected to the rotating conductive ring 31, and the DC power supply 63 is used to output DC power to each of the electronic assembly switches 52; the electronic assembly switch 52 controls the DC power output to the hanging point 51 corresponding to the electronic assembly switch 52 according to the control instruction issued by the control circuit board 61. Among them, the positive electrode of the DC power supply 63 is electrically connected to the anode 2, and the negative electrode thereof is electrically connected to the rotating conductive ring 31. The rotating conductive ring 31 can transmit the current signal to the electronic assembly switch 52 while maintaining rotation.

[0048] In a more specific embodiment, the electronic assembly switch 51 includes a transistor Q and a power detector C; wherein the base of the transistor Q is connected to the control circuit board 61, the collector thereof is connected to the DC power supply 63, and the emitter thereof is connected to the input end of the power detector C; the output end of the power detector C is connected to the hanging point 51, and the control instruction input end thereof is connected to the control circuit board 61. Specifically, the power detector C outputs the accumulated power value detected to the control circuit board 61, and the control circuit board 61 determines the size between the accumulated power value and the set power threshold. If the accumulated power value is not less than the power threshold, a control instruction is immediately issued to the base of the transistor Q. The transistor Q receives the control instruction and disconnects the circuit connected to a hanging point corresponding to the transistor Q, thereby stopping the output current to the hanging point 51, that is, stopping the electroplating of the workpiece on the hanging point 51.

[0049] In a more specific embodiment, the control circuit board 61 is electrically connected to the DC power supply 63, and the control circuit board 61 is used to send a current control instruction to the DC power supply 63 to control the total current output by the DC power supply 63. Specifically, when the accumulated power value of a certain power detector C is not less than the corresponding power threshold, the control circuit board 61 sends a control instruction to control the transistor Q corresponding to the power detector C to disconnect the corresponding circuit connection, and at the same time, sends a control instruction to the DC power supply 63 to control the DC power supply 63 to subtract the DC current value flowing through the transistor Q, that is, to control the total current output by the DC power supply 63 to decrease, and the value of the total current reduction is equal to the DC current value flowing through the transistor Q.

[0050] In a more specific embodiment, the electroplating device further includes a controller 64 electrically connected to the control circuit board 61; the controller 64 is used for a user to operate to output a corresponding control signal to the control circuit board 61. The controller 64 can also be configured to output a control signal to the control circuit board 61. Specifically, the controller 64 can touch the display screen, and the user can operate on the touch display screen and input a corresponding control signal, and the touch display screen obtains the control signal and transmits it to the control circuit board 61. The control signal can be a signal containing workpiece power information.

[0051] In a more specific embodiment, the rotating device 3 includes a rotating shaft 32 and a rotating motor 33 disposed at the upper end of the rotating shaft 32 and fixedly connected to the rotating shaft 32, and the rotating motor 33 is electrically connected to the circuit control device 6. Specifically, the rotating motor 33 is connected to the control circuit board 61 and the voltage-stabilized power supply 62 in the circuit control device 6 at the same time, and the control circuit board 61 can send a control instruction to the rotating motor 33 to control the start and stop of the rotating motor 33, and at the same time, the rotating motor 33 can also be connected to the voltage-stabilized power supply 62, and the voltage-stabilized power supply 62 can supply power to the rotating motor 33.

[0052] The embodiment of the present invention also provides a method for electroplating a workpiece with controllable power, wherein the method for electroplating a workpiece with controllable power is applied to a circuit control device in the above-mentioned electroplating device with controllable power. Figure 6 , Figure 6 A flow chart of a method for electroplating a workpiece with controllable electrical quantity provided by an embodiment of the present invention. Figure 6 As shown, the method includes steps S110 to S150.

[0053] S110. If workpiece power information input by the user is received, the power threshold of the electronic assembly switch corresponding to each hanging point is configured according to the power information of the hanging point in the workpiece power information.

[0054] The workpiece power information may include power information of the workpiece corresponding to each hanging point, and the power threshold of the electronic assembly switch corresponding to each hanging point may be configured according to the power information of each workpiece in the workpiece power information.

[0055] S120, issuing a control instruction to each of the electronic assembly switches to control the electronic assembly switch to conduct the circuit connected to the corresponding hanging point of the electronic assembly switch.

[0056] Since each workpiece is in a state of being electroplated at this time, a control instruction can be sent to each electronic assembly switch to control each pair of corresponding circuits to be turned on.

[0057] S130, acquiring in real time the accumulated power value detected by each of the electronic assembly switches.

[0058] S140, determine whether the accumulated power value of each electronic assembly switch is less than the corresponding power threshold; S150, if the accumulated power value of the electronic assembly switch is not less than the corresponding power threshold, send a control instruction to the electronic assembly switch to control the electronic assembly switch to disconnect the circuit connected to the corresponding hanging point of the electronic assembly switch and stop obtaining the accumulated power value of the electronic assembly switch; if the accumulated power value of the electronic assembly switch is less than the corresponding power threshold, return to execute the step of obtaining the accumulated power value detected by each electronic assembly switch in real time.

[0059] In the electroplating device and electroplating method for controllable workpiece power provided in the embodiment of the present invention, the electroplating device includes an electroplating tank, an anode arranged in the electroplating tank, a rotating device arranged on the upper side of the electroplating tank, a hanger frame connected to the rotating device, a circuit control device, and a plurality of circuit board hangers arranged at the lower end of the hanger frame and extending into the electroplating tank, wherein the circuit board hangers are provided with a plurality of hanging points, each hanging point is electrically connected to an electronic assembly switch, and each electronic assembly switch is electrically connected to the circuit control device through a rotating conductive ring. The above-mentioned electroplating device for controllable workpiece power configures the power threshold of each electronic assembly switch, obtains the cumulative power value detected by the electronic assembly switch in real time and determines whether it is less than the corresponding power threshold, and can accurately control the cumulative power value of the workpiece input to each hanging point through the electronic assembly switch, thereby improving the efficiency of electroplating the workpiece, thereby greatly improving the yield rate of electroplating the workpiece, and can also greatly extend the service life of the circuit board hanger.

[0060] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for electroplating a workpiece with controllable electrical quantity, characterized in that: The method comprises: If the workpiece power information input by the user is received, the power threshold of the electronic assembly switch corresponding to each hanging point is configured according to the power information of the hanging point in the workpiece power information; Sending a control instruction to each of the electronic assembly switches to control the electronic assembly switch to conduct the circuit connected to the corresponding hanging point of the electronic assembly switch; Real-time acquisition of the accumulated power value detected by each electronic assembly switch; Determining whether the accumulated power value of each of the electronic assembly switches is less than the corresponding power threshold; If the accumulated power value of the electronic assembly switch is not less than the corresponding power threshold, a control instruction is issued to the electronic assembly switch to control the electronic assembly switch to disconnect the circuit connected to the corresponding hanging point of the electronic assembly switch and stop obtaining the accumulated power value of the electronic assembly switch; If the accumulated power value of the electronic assembly switch is less than the corresponding power threshold, return to the step of acquiring the accumulated power value detected by each electronic assembly switch in real time; The electroplating device used in the method includes: An electroplating tank, an anode disposed in the electroplating tank, a rotating device disposed on the upper side of the electroplating tank, a hanger frame connected to the rotating device, a circuit control device, and a plurality of circuit board hangers disposed at the lower end of the hanger frame and extending into the electroplating tank; The circuit board hanger is provided with a plurality of hanging points, each of which is electrically connected to an electronic assembly switch, and each of which is electrically connected to the circuit control device via a rotating conductive ring provided on the rotating device; The anode is electrically connected to the circuit control device; Each of the electronic assembly switches is used to detect the accumulated power value diverted to one of the hanging points corresponding to the electronic assembly switch, and to control the on / off of the circuit connected to the hanging point according to the control instruction issued by the circuit control device; The circuit control device is used to supply power to each of the electronic assembly switches, obtain the accumulated power value detected by each of the electronic assembly switches, and issue corresponding control instructions to each of the electronic assembly switches.

2. The electroplating method of controllable workpiece electric quantity according to claim 1, characterized in that: The hanging point includes a hanging point support fixedly set on the circuit board hanger, a hanging bracket connected to the hanging point support, and a hanging point power circuit set in the circuit board hanger. Each of the hanging point supports is electrically connected to a welding pad set at the upper end of the circuit board hanger through one of the hanging point power circuits.

3. The electroplating method of controllable workpiece electric quantity according to claim 2, characterized in that: The circuit board hanger is provided with a packaging layer that wraps the circuit board hanger, and the end of the hanger passes through the packaging layer.

4. The electroplating method for controllable workpiece electric quantity according to any one of claims 1 to 3, characterized in that: The circuit control device includes a control circuit board, a voltage-stabilized power supply and a DC power supply; The voltage-stabilized power supply is electrically connected to the control circuit board and the rotating conductive ring respectively, and the voltage-stabilized power supply is used to supply power to the control circuit board and each of the electronic assembly switches; The control circuit board is electrically connected to each of the electronic assembly switches, and the control circuit board is used to issue control instructions and transmit them to each of the electronic assembly switches; The DC power supply is electrically connected to the rotating conductive ring, and the DC power supply is used to output DC power to each of the electronic assembly switches; The electronic assembly switch controls the on-off of the direct current output to the hanging point corresponding to the electronic assembly switch according to the control instruction issued by the control circuit board.

5. The electroplating method with controllable workpiece electric quantity according to claim 4, characterized in that: The electronic assembly switch includes a triode and a power detector; The base of the triode is connected to the control circuit board, the collector is connected to the DC power supply, and the emitter is connected to the input end of the electrical quantity detector; The output end of the power detector is connected to the hanging point, and the control instruction input end thereof is connected to the control circuit board.

6. The electroplating method of controllable workpiece electric quantity according to claim 5, characterized in that: The control circuit board is electrically connected to the DC power supply, and the control circuit board is used to send a current control instruction to the DC power supply to control the total current output by the DC power supply.

7. The electroplating method of claim 6, wherein: The positive electrode of the DC power supply is electrically connected to the anode, and the negative electrode thereof is electrically connected to the rotating conductive ring.

8. The electroplating method of claim 7, wherein: The electroplating device also includes a controller electrically connected to the control circuit board; The controller is used for being operated by a user to output a corresponding control signal to the control circuit board.

9. The electroplating method with controllable workpiece electric quantity according to claim 8, characterized in that: The rotating device includes a rotating shaft and a rotating motor disposed at the upper end of the rotating shaft and fixedly connected to the rotating shaft, and the rotating motor is electrically connected to the circuit control device.

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