Liquid cooling device and electronic equipment

Abstract

The embodiment of the present invention relates to the technical field of heat dissipation of electronic equipment, and discloses a liquid cooling device and equipment, including: a cooling substrate, a first sealing cover plate and a first sealing tube; the cooling substrate is used to contact with the heat dissipation device to be cooled to cool the heat dissipation device; the first sealing cover plate is fixed on the cooling substrate, and together with the cooling substrate, forms a first sealed cavity; the first sealing tube is fixed on the first sealing cover plate, and is connected to the first sealed cavity, and the first sealing tube and the first sealed cavity together form a liquid cooling channel for conveying liquid cooling medium; the second sealing cover plate is fixed on the cooling substrate, and the first sealing cover plate cover is arranged inside; the second sealing tube is fixed on the second sealing cover plate, and the second sealing cover plate and the second sealing tube together form a second sealed cavity, and the liquid cooling channel is located in the second sealed cavity. The liquid cooling device provided by the present invention has excellent sealing performance, eliminates the reliability problem caused by water leakage in the first sealed cavity, and improves the safety of the liquid cooling device.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of heat dissipation of electronic equipment, and in particular to a liquid cooling device and electronic equipment. Background Art

[0002] At present, with the rapid development of electronic products, the power consumption of electronic devices is getting higher and higher. Due to the continuous increase in the power consumption of single chips, the current air cooling technology has reached the heat dissipation limit. Therefore, it is necessary to develop a new generation of liquid cooling technology to solve the heat dissipation problem of high-power chips. For example, the core component CPU in electronic devices is mainly responsible for the operation and calculation of electronic devices. It has a large workload and can easily generate a lot of heat, which will slow down the operation of electronic devices. In severe cases, it may even burn the CPU. Therefore, a radiator is needed to cool the CPU of the electronic device. Most of the CPU radiators on the market are air-cooled. With the continuous increase in CPU power consumption, the current air cooling technology can no longer solve the CPU heat dissipation problem. It is necessary to further develop liquid cooling technology, such as cold plate liquid cooling technology, to cope with the heat dissipation of high-power CPUs.

[0003] However, if the sealing of the water pipe joint of the water-cooled CPU cold plate is not good enough, the coolant will easily leak at the joint, and the welds or seams of the CPU cold plate itself also have the risk of liquid leakage. Once the coolant leaks, it will devastatingly damage the electronic equipment, greatly increase the economic loss of the user, and is not conducive to large-scale promotion and use. Therefore, it is necessary to provide a new liquid cooling device to solve the above problems. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a liquid cooling device and equipment, which have excellent sealing performance, eliminate the reliability problem caused by water leakage in the first sealing cavity, and thus improve the safety of the liquid cooling device.

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a liquid cooling device, comprising:

[0006] A first sealing body, the first sealing body comprises a cooling substrate, a first sealing cover plate and a first sealing tube; the cooling substrate is used to contact the device to be dissipated heat so as to cool the device to be dissipated heat; the first sealing cover plate is fixed on the cooling substrate and forms a first sealing cavity together with the cooling substrate; the first sealing tube is fixed on the first sealing cover plate and communicates with the first sealing cavity, and the first sealing tube and the first sealing cavity together form a liquid cooling channel for conveying liquid cooling medium; a second sealing body, the second sealing body comprises a second sealing cover plate with a receiving space and a second sealing tube, the second sealing cover plate is fixed on the cooling substrate and the first sealing cover plate is covered therein; the second sealing tube is fixed on the second sealing cover plate, the second sealing cover plate and the second sealing tube together form a second sealing cavity, and the liquid cooling channel is located in the second sealing cavity.

[0007] In addition, the second sealing cover plate includes: an upper plate located on the side of the first sealing cover plate away from the cooling substrate, a side plate that is jointly surrounded by the upper plate to form the receiving space, and an abutment plate that is bent and extended from the edge of the side plate away from the upper plate toward a direction away from the first sealing cover plate; the liquid cooling device also includes an adhesive portion, and the abutment plate is fixedly connected to the cooling substrate via the adhesive portion. Through the arrangement of this structure, the contact area between the second sealing cover plate and the cooling substrate can be increased, so that the second sealing cover plate can be stably fixed on the cooling substrate.

[0008] In addition, the abutment plate is provided with a first screw hole, the cooling substrate is provided with a second screw hole, and the first screw hole is directly opposite to the second screw hole; the liquid cooling device further includes a screw, and the screw is fixed in the first screw hole and the second screw hole. Through the arrangement of this structure, the second sealing cover plate and the cooling substrate can be fixed more firmly, thereby further improving the stability of the liquid cooling device.

[0009] In addition, the liquid cooling device further comprises a liquid leakage sensor, which is arranged in the second sealed cavity and outside the liquid cooling channel, and is used to send an alarm message when sensing the presence of liquid in the second sealed cavity. In this way, an alarm message can be sent in time when the first sealed body leaks, thereby further improving the safety and reliability of the liquid cooling device.

[0010] In addition, the second sealing tube is provided with an opening, and the liquid leakage sensor extends out of the second sealing cavity through the opening to connect with an external circuit board; the liquid cooling device also includes a sealing part, which is used to seal the opening. By providing the sealing part to seal the opening, that is, the sealing part seals the joint between the liquid leakage sensor and the opening, so that the leaked liquid will not flow out of the joint, thereby further improving the safety of the liquid cooling device.

[0011] In addition, the second sealed tube is connected to the receiving space and has an opening connected to the outside, and the liquid in the second sealed cavity is discharged to the outside through the opening. With this structural arrangement, the second sealed tube can be used as a drain pipe to discharge the liquid in the second sealed cavity, thereby improving the practicality of the liquid cooling device.

[0012] In addition, the second sealing tube is a first hose, and the first hose and the second sealing cover plate are reinforced by a first preset method, and the first preset method includes welding fixation and / or sealing part fixation. Through the setting of this structure, the second sealing cover plate and the second sealing tube can be fixed more stably.

[0013] In addition, the second sealing tube is a hard tube, and the hard tube and the second sealing cover plate are reinforced by a second preset method, and the second preset method includes one or more of welding fixation, sealing part fixation, screw fixation or riveting fixation.

[0014] In addition, the first sealing tube includes a joint and a second hose, one end of the joint is fixed on the first sealing cover plate, the other end of the joint is provided with a limiting portion, and the second hose is fixedly connected to the joint via the limiting portion; wherein the limiting portion is a hollow conical protrusion extending from the end of the joint away from the first sealing cover plate and in a direction away from the first sealing cover plate; the size of the hollow conical protrusion close to the first sealing cover plate is larger than the size of the hollow conical protrusion away from the first sealing cover plate. Through the setting of this structure, the hose and the joint are more firmly combined, the hose is prevented from falling off, and the reliability of the liquid cooling device is improved.

[0015] An embodiment of the present invention further provides a device, including an electronic device and the above-mentioned liquid cooling device, wherein the liquid cooling device is used to contact the device to be cooled so as to cool the device to be cooled.

[0016] Compared with the related art, the embodiment of the present invention realizes heat dissipation and cooling of the heat dissipation device and the heat dissipation device itself by setting a first sealing body; by setting a second sealing body, since the second sealing cover plate and the second sealing tube jointly form a second sealed cavity, even if part of the liquid-cooling medium leaks from the first sealing body, the liquid-cooling medium will not contact the heat dissipation device or other electronic devices, but will be contained in the second sealed cavity, thereby avoiding damage to the heat dissipation device or other electronic devices due to contact with the liquid-cooling medium, thereby improving the safety of the liquid cooling device; in addition, the second sealing cover plate covers the first sealing cover plate, and the liquid cooling channel is located in the second sealed cavity, that is, no matter where the liquid leaks at the first sealing body, it can be ensured that the leaked liquid is contained in the second sealed cavity, so that the liquid cooling device has excellent sealing performance, and the safety of the liquid cooling device is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0018] Figure 1 It is a structural schematic diagram of a liquid-cooled cold plate in the prior art;

[0019] Figure 2 It is another structural schematic diagram of a liquid-cooled cold plate in the prior art;

[0020] Figure 3 is a schematic structural diagram of a liquid cooling device according to a first embodiment of the present invention;

[0021] Figure 4 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present invention;

[0022] Figure 5 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present invention;

[0023] Figure 6 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present invention;

[0024] Figure 7 is another structural schematic diagram of the liquid cooling device according to the first embodiment of the present invention;

[0025] Figure 8 is a schematic structural diagram of a position limiting portion according to a first embodiment of the present invention;

[0026] Fig. 9 is a schematic structural diagram of a liquid cooling device and a CPU chip according to a first embodiment of the present invention;

[0027] Fig.10 is a top view of a liquid cooling device and a plurality of CPU chips according to a first embodiment of the present invention;

[0028] Fig.11 is a schematic structural diagram of a liquid cooling device and a memory according to a first embodiment of the present invention;

[0029] Fig.12 1 is a schematic structural diagram of a memory and a portion of a first sealing body according to a first embodiment of the present invention. Specific embodiments

[0031] The cold plate liquid cooling device consists of two parts: a cold plate and a pipeline. The cold plate and the pipeline are assembled together by welding (hard pipe) or clamping (soft pipe). There is liquid (usually pure water) inside the cold plate. There are currently two main design schemes for server liquid cooling cold plates. However, it is difficult to effectively prevent liquid leakage, and therefore it is difficult to ensure that electronic devices will not be damaged.

[0032] Analysis of the first server liquid cooling cold plate design: see Figure 1 , the cold plate bottom plate is welded to the cold plate upper cover, the joint is welded to the cold plate upper cover, and the hose is set on the joint. It is not difficult to find that in the above scheme, there is a risk of leakage at the weld between the cold plate bottom plate and the cold plate upper cover, the weld between the joint and the cold plate upper cover, and the connection between the hose and the joint. When leakage occurs, the liquid will directly flow to the electronic devices inside the chassis, causing damage to the electronic devices.

[0033] Analysis of the second server liquid cooling cold plate design: see Figure 2 The cold plate bottom plate and the cold plate upper cover are sealed by an O-ring, the joint and the cold plate upper cover are welded, and the hose is set on the joint. In the above scheme, there is a risk of leakage at the joint between the cold plate bottom plate and the cold plate upper cover, the weld between the joint and the cold plate upper cover, and the connection between the hose and the joint. When leakage occurs, the liquid will directly flow to the electronic devices inside the chassis, causing damage to the electronic devices.

[0034] From the above analysis, it can be seen that the causes of damage to electronic devices include: the liquid in the liquid cooling device will directly flow onto the electronic devices after leakage; there are multiple locations in the liquid cooling device where there is a risk of leakage.

[0035] To this end, an embodiment of the present invention provides a liquid cooling device, which, by providing a second sealing body, ensures that even if part of the liquid cooling medium leaks from the first sealing body, the liquid cooling medium will not contact the device to be cooled or other electronic devices, but will be contained in the second sealed cavity; in addition, the second sealing cover plate covers the first sealing cover plate, and the liquid cooling channel is located in the second sealed cavity. No matter where the liquid leaks at the first sealing body, it can be ensured that the leaked liquid is contained in the second sealed cavity, so that the liquid cooling device has excellent sealing performance, and the safety of the liquid cooling device is further improved.

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the embodiments of the present invention, many technical details are provided to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can be implemented.

[0037] The first embodiment of the present invention relates to a liquid cooling device, the specific structure of which is as follows Figure 3 As shown, including:

[0038] A first sealed body 1, the first sealed body 1 includes a cooling substrate 11, a first sealed cover plate 12 and a first sealed tube 13; the cooling substrate 11 is used to contact with the heat dissipation device to be cooled; the first sealed cover plate 12 is fixed on the cooling substrate 11, and together with the cooling substrate 11, forms a first sealed cavity 10; the first sealed tube 13 is fixed on the first sealed cover plate 12, and is connected to the first sealed cavity 10, and the first sealed tube 13 and the first sealed cavity 10 together form a liquid cooling channel for conveying liquid cooling medium; a second sealed body 2, the second sealed body 2 includes a second sealed cover plate 21 and a second sealed tube 22, the second sealed cover plate 21 is fixed on the cooling substrate 11, and the first sealed cover plate 12 is covered therein; the second sealed tube 22 is fixed on the second sealed cover plate 21, and the second sealed cover plate 21 and the second sealed tube 22 together form a second sealed cavity 20, and the liquid cooling channel is located in the second sealed cavity 20.

[0039] Specifically, in this embodiment, the materials of the first sealing cover plate 12 and the second sealing cover plate 21 can be the same or different. For example, the first sealing cover plate 12 and the second sealing cover plate 21 are both made of plastic, or the first sealing cover plate 12 is made of plastic and the second sealing cover plate 21 is made of metal. This embodiment does not specifically limit the materials of the first sealing cover plate 12 and the second sealing cover plate 21.

[0040] It should be noted that the device to be cooled may refer to integrated circuit boards such as CPUs and GPUs in electronic devices, and the electronic devices include but are not limited to IT products (such as servers, storage devices) and communication equipment.

[0041] It can be understood that the liquid cooling channel described in this embodiment is located in the second sealed cavity 20, and it can be regarded that the second sealed cavity 20 surrounds the liquid cooling channel.

[0042] Compared with the related art, the embodiment of the present invention realizes heat dissipation and cooling of the heat dissipation device and the device itself by setting a first sealing body 1; by setting a second sealing body 2, since the second sealing cover plate 21 and the second sealing tube 22 jointly form a second sealed cavity 20, even if part of the liquid-cooling medium leaks from the first sealing body 1, the liquid-cooling medium will not contact the heat dissipation device or other electronic devices, but will be contained in the second sealed cavity 20, thereby avoiding damage to the heat dissipation device or other electronic devices due to contact with the liquid-cooling medium, thereby improving the safety of the liquid cooling device 100; in addition, the second sealing cover plate 21 covers the first sealing cover plate 12, and the liquid cooling channel is located in the second sealed cavity 20, that is, no matter where the liquid leaks from the first sealing body 1, it can be ensured that the leaked liquid is contained in the second sealed cavity 20, so that the liquid cooling device 100 has excellent sealing performance, further improving the safety of the liquid cooling device 100.

[0043] See also Figure 4 , the second sealing cover plate 21 includes: an upper plate 211 located on the side of the first sealing cover plate 12 away from the cooling substrate 11, a side plate 212 that is jointly enclosed with the upper plate 211 to form a receiving space, and an abutment plate 213 that is bent and extended from the edge of the side plate 212 away from the upper plate 211 in a direction away from the first sealing cover plate 12; the liquid cooling device 100 also includes an adhesive portion 3, and the abutment plate 213 is fixedly connected to the cooling substrate 11 via the adhesive portion 3. Through the setting of this structure, the contact area between the second sealing cover plate 21 and the cooling substrate 11 can be increased, so that the second sealing cover plate 21 can be stably fixed on the cooling substrate 11. It can be understood that this embodiment does not specifically limit the contact area between the second sealing cover plate 21 and the cooling substrate 11, and can be set according to actual needs.

[0044] It is worth mentioning that the material of the adhesive part 3 in this embodiment is preferably pressure-sensitive adhesive, which is a type of adhesive that is sensitive to pressure. Generally, the peeling force of the pressure-sensitive adhesive (the peeling force exhibited after the adhesive tape and the adhered surface are pressurized and adhered) is less than the cohesive force of the adhesive (the force between the pressure-sensitive adhesive molecules) and the adhesive base force (the adhesion between the adhesive and the substrate), so that the pressure-sensitive adhesive will not debond during use.

[0045] See also Figure 5, a first screw hole 2130 is formed on the contact plate 213, a second screw hole 110 is formed on the cooling substrate 11, and the first screw hole 2130 is directly opposite to the second screw hole 110; the liquid cooling device 100 further includes a screw (not shown), which is fixed in the first screw hole 2130 and the second screw hole 110. With this structural arrangement, the second sealing cover plate 21 and the cooling substrate 11 can be more firmly fixed, thereby further improving the stability of the liquid cooling device 100.

[0046] It should be noted that Figure 3 The screw shown is one. In practical applications, the number of screws can be multiple (such as two, three, four...), and the multiple screws can be arranged at equal intervals around the side plate 212 to further improve the stability of the liquid cooling device 100.

[0047] See also Figure 6 The liquid cooling device 100 further includes a liquid leakage sensor 5, which is disposed in the second sealed cavity 20 and outside the liquid cooling channel. The liquid leakage sensor 5 is used to send an alarm message when the liquid is sensed in the second sealed cavity 20.

[0048] Specifically, the liquid leakage sensor 5 in this embodiment is in the shape of a rope. The rope-shaped liquid leakage sensor 5 can be set at any position inside the second sealed cavity 20 and outside the liquid cooling channel. For example, the liquid leakage sensor 5 is wrapped around each connection of the first sealed body 1 to ensure that when liquid leakage occurs at any position of the first sealed body 1, the liquid leakage sensor 5 can sense the liquid in time and issue an alarm message in time, thereby further improving the safety and reliability of the liquid cooling device 100.

[0049] Furthermore, Figure 6 The second sealing tube 22 shown is provided with an opening 220, and the liquid leakage sensor 5 partially extends out of the second sealing cavity 20 through the opening 220 to connect with the external circuit board; the liquid cooling device 100 also includes a sealing portion (not shown in the figure), which is used to seal the opening 220. It can be understood that after the liquid leakage sensor 5 passes through the opening 220, there may be a seam between the liquid leakage sensor 5 and the opening 220, causing the leaked liquid to flow out of the seam, thereby causing the heat dissipation device to be damaged due to contact with the liquid. By providing a sealing portion to seal the opening 220, that is, the sealing portion seals the seam between the liquid leakage sensor 5 and the opening 220, so that the leaked liquid will not flow out of the seam, thereby further improving the safety of the liquid cooling device 100.

[0050] It should be noted that, in this embodiment, the materials of the sealing part and the adhesive part 3 can be the same or different. For example, the sealing part can be OCA glue, etc. This embodiment does not specifically limit the materials of the sealing part and the adhesive part 3.

[0051] It should also be noted that the sealing part in this embodiment can be a sealant, a sealing ring, or other sealing structures. In other words, this embodiment does not specifically limit the shape and structure of the sealing part, and can be set according to actual needs, only ensuring that the leaked liquid does not flow out from the joint between the liquid leakage sensor 5 and the opening 220.

[0052] It is worth mentioning that the liquid leakage sensor plug of the liquid leakage sensor 5 can be directly used in conjunction with the socket on the PCB circuit board without setting up an additional socket, thereby minimizing the space required for the liquid cooling device 100 while achieving the normal operation of the liquid leakage sensor 5.

[0053] Please also see Figures 3 to 6 In this embodiment, the second sealed tube 22 has an opening communicating with the outside, and the liquid in the second sealed cavity 20 is discharged to the outside through the opening. With this structural arrangement, the second sealed tube 21 can be used as a drain pipe to discharge the liquid in the second sealed cavity 20, thereby improving the practicality of the liquid cooling device 100.

[0054] Preferably, the second sealing tube 22 in this embodiment is a first hose, and the first hose and the second sealing cover plate 21 are reinforced via a first preset method, wherein the first preset method includes welding fixation and / or sealing part fixation. Through the setting of such a structure, the second sealing cover plate 21 and the second sealing tube 22 can be fixed more stably. It should be noted that by setting the second sealing tube as the first hose, since the hose has a certain tensile property, it can ensure that the opening of the second sealing tube 22 is connected to the outside, thereby ensuring that the liquid in the second sealing cavity 20 can be discharged through the second sealing tube 22.

[0055] Preferably, the second sealing tube 22 in this embodiment is a hard tube, and the hard tube and the second sealing cover plate 21 are reinforced via a second preset method, and the second preset method includes one or more of welding fixation, sealing portion fixation, screw fixation or riveting fixation. Through the setting of this structure, the second sealing cover plate 21 and the second sealing tube 22 can be fixed more stably. It should be noted that the material of the second sealing tube 22 can be the same as or different from the material of the second sealing cover plate 21, such as the second sealing tube 22 and the second sealing cover plate 21 are both made of plastic, or the second sealing cover plate 21 is made of plastic and the second sealing tube 22 is made of metal. By setting the second sealing tube 22 as a hard tube, the bonding strength between the second sealing cover plate 21 and the second sealing tube 22 can be enhanced, and the stability of the liquid cooling device 100 can be further improved.

[0056] Please also see Figures 7 and 8The first sealing tube 12 includes a joint 121 and a hose 122 . One end of the joint 121 is fixed on the first sealing cover plate 11 . The other end of the joint 121 is provided with a limiting portion 7 . The hose 122 is fixedly connected to the joint 121 via the limiting portion 7 .

[0057] Specifically, Figure 7 The joint 121 shown includes a first joint 1211 and a second joint 1212; one end of the first joint 1211 is fixed to the first sealing cover plate 12 by welding or sealing, and the other end of the first joint 1211 is provided with a first threaded portion 1211A; one end of the second joint 1212 is provided with a second threaded portion 1212A that cooperates with the first threaded portion 1211A, and the other end of the second joint 1212 is provided with a limiting portion 1212B, and the first threaded portion 1211A and the second threaded portion 1212A cooperate with each other to fix the first joint 1211 and the second joint 1212 to each other. Through the setting of this structure, the combination between the first joint 1211 and the second joint 1212, and the second joint 1212 and the hose 122 is more stable, and the liquid flowing in the liquid cooling channel is prevented from leaking from the connection between the first joint 1211 and the second joint 1212, and the second joint 1212 and the hose 122, thereby improving the safety of the liquid cooling device 100.

[0058] Furthermore, Figure 8 The limiting portion 7 shown is a hollow conical protrusion extending from the end of the joint 121 away from the first sealing cover plate 12 and in a direction away from the first sealing cover plate 12; the size of the hollow conical protrusion close to the first sealing cover plate 12 is larger than the size of the hollow conical protrusion away from the first sealing cover plate 12. Through the arrangement of this structure, the hose 122 and the joint 121 are more firmly combined, the hose 122 is prevented from falling off, and the reliability of the liquid cooling device 100 is improved.

[0059] It is worth noting that the hollow conical protrusion in this embodiment can be a hollow conical protrusion, which can make the hose 122 easier to connect to the joint 121, reducing the difficulty of manufacturing the liquid cooling device 100; the hollow conical protrusion can also be a hollow pyramidal protrusion, which can make it difficult for the hose 122 to have relative displacement with the joint 121 after the hose 122 is sleeved on the joint 121, further avoiding the hose 122 from falling off, and improving the reliability of the liquid cooling device 100.

[0060] For ease of understanding, the assembly process of the liquid cooling device 100 of this embodiment is described in detail below:

[0061] (1) The first sealing cover plate 12 is welded to the cooling substrate 11 , and then the first joint 1211 is welded to the first sealing cover plate 12 (the first joint 1211 has a first threaded portion 1211A at one end away from the first sealing cover plate 12 ).

[0062] (2) The second sealing cover plate 21 is fixed to the cooling substrate 11 (after providing the adhesive portion 3 on the contact plate 213 and fixing it with screws).

[0063] (3) The second joint 1212 is connected and fixed to the first joint 1211 (through the first threaded portion 1211A and the second threaded portion 1212A cooperating with each other).

[0064] (4) Connect the hose 122 to the second joint 1212.

[0065] (5) Connect the second sealing tube 22 to the second sealing cover plate 21 to complete the assembly of the liquid cooling device 100.

[0066] It is worth mentioning that the purpose of setting the first joint 1211 and the second joint 1212 in the present embodiment is: the receiving space of the second sealing cover plate 21 is relatively small, and setting the first joint 1211 too long will increase the difficulty of installing the second sealing cover plate 21 (the first joint 1211 is located in the receiving space to facilitate the installation of the second sealing cover plate 21), and the first joint 1211 is set shorter, which will cause the hose 122 to be unstable. Therefore, by additionally setting the second joint 1212, one end of the second joint 1212 is tightly fixed to the first joint 1211 through a thread, and the other end of the second joint 1212 is tightly fixed to the hose 122 through the limiting portion 7, so that the installation difficulty of the liquid cooling device 100 is reduced, and the combination between the first joint 1211 and the second joint 1212, and the second joint 1212 and the hose 122 is more stable, thereby improving the safety of the liquid cooling device 100.

[0067] It should be noted that the present embodiment does not specifically limit the number of connectors 121 , and for example, only one connector may be provided, which can be provided according to actual needs.

[0068] See also Fig. 9 , is a schematic diagram of the structure in which the liquid cooling device 100 of this embodiment is installed on a CPU chip. Fig. 9 The CPU chip shown is arranged on a PCB circuit board, and the cooling substrate 11 contacts the side of the CPU chip away from the PCB circuit board. A PCB socket is also arranged on the PCB circuit board, and the plug of the liquid leakage sensor 5 can be used in conjunction with the PCB socket.

[0069] See also Fig.10 , for a server system with 2 CPU chips, Fig.10The system layout diagram of the first sealing body and the second sealing body is given. Fig.10 It can be seen that the second sealing body fully seals the position where liquid may leak in the first sealing body, and the hose of the second sealing body extends to the outside of the chassis. The end of the hose of the second sealing body outside the chassis is open, so it can be used as a drain. A quick connector is installed at the end of the hose of the first sealing cavity, and the quick connector can be connected to a water storage device (not shown) to realize the circulation of water in the liquid cooling channel.

[0070] See also Fig.11 , is a schematic diagram of the structure in which the liquid cooling device 100 of this embodiment is installed on the memory. Fig.11 The memory shown is arranged on a PCB circuit board, the thermal pad contacts the side of the memory away from the PCB circuit board, the cooling substrate 11 contacts the side of the thermal pad away from the memory, and a PCB socket is also provided on the PCB circuit board, and the plug of the liquid leakage sensor 5 can be used in conjunction with the PCB socket.

[0071] Please see further Fig.12 , is a schematic diagram of the structure of the memory and part of the first sealing body. The heat of the memory chip is transferred to the memory heat conducting plate through the memory heat conducting pad, and the memory heat conducting plate then transfers the heat to the cooling substrate 11 through the heat conducting pad.

[0072] A second embodiment of the present invention relates to an apparatus, comprising: a component to be cooled, and the liquid cooling device in the above embodiment, wherein the liquid cooling device is used to contact the component to be cooled so as to cool the component to be cooled.

[0073] It is understandable that the equipment described in this embodiment includes but is not limited to IT products (such as servers, storage devices), communication equipment, and electrical equipment / power equipment that can use liquid cooling devices.

[0074] Those skilled in the art will appreciate that the above embodiments are specific embodiments for implementing the present invention, and that in actual applications, various changes may be made in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A liquid cooling device, characterized in that: include: A first sealing body, the first sealing body comprising a cooling substrate, a first sealing cover plate and a first sealing tube; The cooling substrate is used to contact with the heat dissipation device to cool the heat dissipation device; the first sealing cover plate is fixed on the cooling substrate and forms a first sealing cavity together with the cooling substrate; the first sealing tube is fixed on the first sealing cover plate and communicates with the first sealing cavity, and the first sealing tube and the first sealing cavity together form a liquid cooling channel for conveying liquid cooling medium; a second sealing body, the second sealing body comprising a second sealing cover plate having a receiving space and a second sealing tube, the second sealing cover plate being fixed on the cooling substrate and the first sealing cover plate being covered therein; the second sealing tube being fixed on the second sealing cover plate, the second sealing cover plate and the second sealing tube jointly forming a second sealing cavity, the liquid cooling channel being located in the second sealing cavity, and the second sealing cavity surrounding the liquid cooling channel; The liquid cooling device is installed on the component to be cooled, and the component to be cooled is arranged on a circuit board.

2. The liquid cooling device according to claim 1, characterized in that: The second sealing cover plate comprises: an upper plate located on a side of the first sealing cover plate away from the cooling substrate, a side plate which is jointly arranged with the upper plate to form the receiving space, and an abutment plate which is bent and extended from an edge of the side plate away from the upper plate toward a direction away from the first sealing cover plate; The liquid cooling device further comprises an adhesive portion, and the abutment plate and the cooling substrate are fixedly connected via the adhesive portion.

3. The liquid cooling device according to claim 2, characterized in that: The abutting plate is provided with a first screw hole, the cooling substrate is provided with a second screw hole, and the first screw hole is directly opposite to the second screw hole; The liquid cooling device also includes screws, and the screws are fixed in the first screw holes and the second screw holes.

4. The liquid cooling device according to claim 1, characterized in that: The liquid cooling device further includes a liquid leakage sensor, which is disposed in the second sealed cavity and outside the liquid cooling channel, and is used for sending an alarm message when the liquid is sensed to exist in the second sealed cavity.

5. The liquid cooling device according to claim 4, characterized in that: The second sealing tube is provided with an opening, and the liquid leakage sensor extends out of the second sealing cavity through the opening to be connected to an external circuit board; The liquid cooling device further includes a sealing portion, and the sealing portion is used to seal the opening.

6. The liquid cooling device according to any one of claims 1 to 5, characterized in that: The second sealing tube is communicated with the receiving space and has an opening communicated with the outside, and the liquid in the second sealing cavity is discharged to the outside through the opening.

7. The liquid cooling device according to any one of claims 1 to 5, characterized in that: The second sealing tube is a first hose, and the first hose and the second sealing cover plate are reinforced by a first preset method, and the first preset method includes welding fixation and / or sealing part fixation.

8. The liquid cooling device according to any one of claims 1 to 5, characterized in that: The second sealing tube is a hard tube, and the hard tube and the second sealing cover plate are reinforced by a second preset method, and the second preset method includes one or more of welding fixation, sealing part fixation, screw fixation or riveting fixation.

9. The liquid cooling device according to claim 1, characterized in that: The first sealing tube includes a joint and a second hose, one end of the joint is fixed on the first sealing cover plate, the other end of the joint is provided with a limiting portion, and the second hose is fixedly connected to the joint via the limiting portion; Wherein, the limiting portion is a hollow conical protrusion extending from the end of the joint away from the first sealing cover plate and in a direction away from the first sealing cover plate; the size of the hollow conical protrusion close to the first sealing cover plate is larger than the size of the hollow conical protrusion away from the first sealing cover plate.

10. An electronic device, characterized in that: include: A device to be cooled, a liquid cooling device as claimed in any one of claims 1 to 9, wherein the liquid cooling device is used to contact the device to be cooled so as to cool the device to be cooled.

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