A semiconductor component long-term testing device and testing method thereof

Abstract

The present invention discloses a semiconductor component long-term testing device and a testing method thereof, comprising a workbench, an x-axis sliding mechanism arranged on the workbench, a loading mechanism and a unloading mechanism arranged on the x-axis sliding mechanism; the loading mechanism comprises a first frame, a y-axis sliding mechanism arranged on the first frame, a second frame arranged on the y-axis sliding mechanism, a clamping assembly and a z-axis sliding mechanism arranged on the second frame, and a suction mechanism arranged on the z-axis sliding mechanism; a plurality of test fixtures are arranged in a rectangular array on the workbench. The semiconductor component long-term testing device automatically completes the automatic assembly test and post-test transfer of semiconductor components through the loading mechanism and the unloading mechanism; the component clamp has an automatic clamping function, and the switching of the component clamp between the open assembly state and the locked clamping state is automatically controlled by the clamping assembly to cooperate with the installation or unloading of semiconductor components.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor performance testing equipment, and in particular to a semiconductor element long-time testing device and a testing method thereof. Background Art

[0002] In the production and manufacturing of semiconductors, in order to ensure the performance reliability of certain types of semiconductor components, it is necessary to test the semiconductor components of this type for a long time, and wait for them to pass the test before packaging. Since these semiconductor components need to be placed on a special test fixture for a long time, in order to ensure that the semiconductor components and the connection probes of the test fixture are in good contact during the long test, the test fixture generally adopts a press-fit method. Press-fit test fixtures require manual placement of semiconductor components, so the production efficiency is low, and the manual placement of semiconductor components also has a certain impact on the quality of semiconductor components.

[0003] It can be seen that the existing technology still needs to be improved and enhanced. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a semiconductor component long-term testing device and a testing method thereof, aiming to use a loading mechanism and an unloading mechanism to automatically install or unload semiconductor components on a test fixture to improve production efficiency; and to automatically switch the component clamp from a locked clamping state to an open mounting state through an opening clamping assembly to cooperate with the installation or unloading of semiconductor components.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A semiconductor element long-term testing device comprises a workbench, an x-axis sliding mechanism arranged on the workbench, a loading mechanism and a unloading mechanism arranged on the x-axis sliding mechanism; the loading mechanism comprises a first frame, a y-axis sliding mechanism arranged on the first frame, a second frame arranged on the y-axis sliding mechanism, a clamping assembly and a z-axis sliding mechanism arranged on the second frame, and a suction mechanism arranged on the z-axis sliding mechanism; the first frame moves left and right on the x-axis sliding mechanism, the y-axis sliding mechanism drives the second frame to move forward and backward, and the z-axis sliding mechanism drives the suction mechanism to move up and down; a plurality of test fixtures are arranged on the workbench in a rectangular array, each test fixture comprises a test base, a test circuit element arranged on the test base, and a component clamp, the component clamp has an open mounting state and a locked clamp state, the clamping assembly is used to switch the component clamp from the locked clamp state to the open mounting state, so that the suction mechanism can install the semiconductor element on the test fixture; the unloading mechanism is used to transfer the semiconductor element on the test fixture.

[0007] The component clamp includes two clamping jaws symmetrically arranged on the test base, each clamping jaw includes a clamping part, a connecting part and a bent foot part which are sequentially connected from top to bottom, the connecting part is rotatably connected to the test base, and an elastic component is installed on the test base for driving the clamping parts of the two clamping jaws to approach each other.

[0008] The clamping assembly includes a clamping mounting plate, a z-axis slide plate slidably connected to the clamping mounting plate, and a linear drive for driving the z-axis slide plate to move up and down. The z-axis slide plate is provided with two arms corresponding to the positions of the clamping jaws, and an unlocker is provided at the bottom of each arm. The unlocker is used to press the bent foot portion of the clamping jaws to move the clamping parts of the two clamping jaws away from each other.

[0009] The unlocking device comprises an unlocking support with a lower concave cavity, a support shaft horizontally arranged in the lower concave cavity, and a plurality of pressure wheels rotatably sleeved on the support shaft.

[0010] The z-axis slide is provided with an in-position trigger block, the clamping mounting plate is provided with a first sensor bracket, the first sensor bracket is provided with a photoelectric switch vertically upward, and the in-position trigger block is used to trigger the photoelectric switch.

[0011] The suction mechanism includes a suction mounting seat, a sleeve vertically arranged on the suction mounting seat, and a guide seat arranged at the bottom of the sleeve. The sleeve is provided with an axial through hole with a non-circular cross-section, and an inner shaft adapted to the shape of the axial through hole is inserted into the axial through hole. The bottom of the inner shaft extends downwardly out of the axial through hole and is connected to a suction cup mounting seat. A suction cup is provided at the bottom of the suction cup mounting seat. A buffer spring is sleeved on the inner shaft, and the buffer spring is located between the suction cup mounting seat and the guide seat. A limit spring is provided on the top of the inner shaft. An axial channel is provided on the inner shaft, and the bottom end of the axial channel is connected to the suction cup, and the top end of the axial channel is connected to an air nozzle.

[0012] The top of the inner shaft is sleeved with a ring located above the retaining ring, the top of the ring is provided with a trigger edge, the suction mounting seat is provided with a second sensor bracket, the second sensor bracket is provided with a through-beam type photoelectric sensor, and the trigger edge is used to block the light path of the through-beam type photoelectric sensor.

[0013] The test base includes a base body and pillars arranged at the bottom corners of the base body, a circuit element installation cavity is arranged in the middle of the base body, and the test circuit element includes a test circuit board arranged in the circuit element installation cavity, a component positioning seat arranged on the top of the test circuit board, and a plug arranged at the bottom of the test circuit board; the middle part of the component positioning seat is recessed downward to form a positioning groove for semiconductor elements to be embedded, and a plurality of connection probes are arranged in the positioning groove, which are vertically upward and electrically connected to the test circuit board.

[0014] The loading mechanism has the same structure as the unloading mechanism, and a tray for placing defective products is placed on the working seat.

[0015] A testing method based on the semiconductor component long-time testing device, wherein the test fixtures are provided with N pieces, and the test fixtures are arranged in a rectangular array, each test fixture represents a test station, and all test fixtures are marked with test station numbers one by one in a row and from left to right manner, the first test station is numbered 1, and the last test station is numbered N, and the duration of the long-time test required for each semiconductor component is t1. Before preparing for the test, all test fixtures on the workbench are in a waiting state; the testing steps are as follows:

[0016] S001: the feeding mechanism starts to work, the suction mechanism on the feeding mechanism moves to the top of the feeding position under the driving of the x-axis sliding mechanism and the y-axis sliding mechanism, the z-axis sliding mechanism of the feeding mechanism drives the suction mechanism to move vertically downward, so that the suction mechanism sucks the semiconductor component, and the z-axis sliding mechanism drives the suction mechanism to reset;

[0017] S002: The suction mechanism on the feeding mechanism moves to the top of the test fixture of the No. 1 test station under the drive of the x-axis sliding mechanism and the y-axis sliding mechanism, and the clamping assembly on the feeding mechanism switches the component clamp on the test fixture from the locked clamping state to the open mounting state, and the z-axis sliding mechanism of the feeding mechanism drives the suction mechanism to move vertically downward, so that the suction mechanism can install the semiconductor component on the test base; at the same time, the clamping assembly disconnects the contact with the component clamp, so that the component clamp switches from the open mounting state to the locked clamping state, and the test circuit element on the test fixture forms a test electrical connection with the semiconductor element, and the test fixture starts to perform a long-term performance test on the semiconductor element, and the suction mechanism releases the semiconductor element, and the z-axis sliding mechanism drives the suction mechanism to reset;

[0018] S003: The loading mechanism repeats the working methods of the above steps S001 and S002, and moves the semiconductor components to the corresponding test fixtures in the order of the test station numbers to implement long-term performance testing, until the last test station starts to perform long-term performance testing. At this time, the loading mechanism has worked for a long time from the beginning to the present, t2, t2 ≥ t1; at this time, the semiconductor components on the No. 1 test station have completed the long-term performance test;

[0019] S004: The unloading mechanism unloads the semiconductor component on the No. 1 test station and moves the semiconductor component to a suitable position according to the test result; then the loading mechanism re-loads the test fixture on the No. 1 test station for testing;

[0020] S005: The unloading mechanism and the loading mechanism cyclically repeat the working mode of S004 above, that is, the unloading mechanism unloads the semiconductor components on the next test station in the order of the test station numbers, and moves the semiconductor components to the appropriate position according to the test results. The test station currently unloaded by the unloading mechanism is in a waiting state; then the loading mechanism immediately loads the test fixture on this test station for testing.

[0021] Beneficial effects:

[0022] Compared with the prior art, the semiconductor component long-term testing device provided by the present invention has the following advantages: 1. The loading mechanism and the unloading mechanism, in cooperation with the x-axis sliding mechanism, the y-axis sliding mechanism and the z-axis sliding mechanism, can flexibly drive the suction mechanism to move horizontally and vertically, automatically completing the automatic assembly test and post-test transfer of semiconductor components, saving transportation labor and eliminating the problems caused by manual transportation of semiconductor components; 2. The component clamp has an automatic clamping function, which automatically controls the switching of the component clamp between the open assembly state and the locked clamping state through the opening clamping assembly, ensuring that the semiconductor is in a state of being assembled and locked during long-term testing. The connection probes of the components and the test fixture have good contact and the test reliability is high; 3. When the loading mechanism loads all the test stations on the workbench one by one to realize long-term testing, the semiconductor component on the first test station has just completed the long-term test, and then the unloading mechanism transfers the semiconductor components that have completed the test in order of the test stations. Every time the unloading mechanism transfers a semiconductor component on a test station, the loading mechanism immediately installs a semiconductor component to be tested on the test station to be worked, thus forming a regular and compact test loading and unloading arrangement, which greatly reduces the waiting time for loading at each test station and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram of a semiconductor component long-time testing device provided by the present invention.

[0024] Figure 2 It is a schematic diagram of the clamping assembly and the suction mechanism on the loading mechanism moving to the top of the test fixture.

[0025] Figure 3 It is a three-dimensional diagram of the feeding mechanism.

[0026] Figure 4 A three-dimensional image of a semiconductor component mounted on a test fixture.

[0027] Figure 5 The schematic diagram of the test fixture is shown in Figure 2.

[0028] Figure 6 It is a three-dimensional diagram of the suction mechanism.

[0029] Figure 7Schematic diagram of the internal structure of the suction mechanism.

[0030] Figure 8 It is a schematic diagram of the cooperation between the inner shaft and the guide seat.

[0031] Main component symbol description: 1- workbench, 2-x-axis sliding mechanism, 3- loading mechanism, 4- unloading mechanism, 41- first frame, 42-y-axis sliding mechanism, 43- second frame, 44-z-axis sliding mechanism, 5- clamping assembly, 51- clamping mounting plate, 52-z-axis slide plate, 53- linear drive, 54- arm, 55- unlocker, 551- unlocking support, 552- support shaft, 553- pressure wheel, 56- in-position trigger block, 57- first sensor bracket, 58- photoelectric switch, 6- suction mechanism, 61- suction mounting seat, 62- bushing, 63- guide seat, 64- axial passage Hole, 65-inner shaft, 66-suction cup mounting seat, 67-suction cup, 68-buffer spring, 69-limiting retaining spring, 60-air nozzle, 7-test fixture, 71-test base, 711-seat body, 712-pillar, 721-test circuit board, 722-component positioning seat, 723-plug, 724-positioning groove, 725-connecting probe, 73-component clamp, 731-clamping claw, 7311-clamping part, 7312-connecting part, 7313-bent foot part, 74-elastic member, 81-ring, 82-trigger surround, 83-second sensor bracket, 84-reciprocating photoelectric sensor. DETAILED DESCRIPTION

[0032] The present invention provides a semiconductor component long-time testing device and a testing method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the scope of protection of the present invention.

[0033] Herein, the extending direction of the x-axis is the left-right direction, the extending direction of the y-axis is the front-back direction, and the extending direction of the z-axis is the up-down direction.

[0034] See also Figure 1-Figure 7The present invention provides a semiconductor element long-term testing device, comprising a workbench 1, an x-axis sliding mechanism 2 arranged on the workbench 1, a loading mechanism 3 and a unloading mechanism 4 arranged on the x-axis sliding mechanism 2; the loading mechanism 3 comprises a first frame 41, a y-axis sliding mechanism 42 arranged on the first frame 41, a second frame 43 arranged on the y-axis sliding mechanism 42, a clamping assembly 5 and a z-axis sliding mechanism 44 arranged on the second frame 43, and a suction mechanism 6 arranged on the z-axis sliding mechanism 44; the first frame 41 moves left and right on the x-axis sliding mechanism 2, and the y-axis sliding mechanism 42 drives the second frame 43 moves back and forth, and the z-axis sliding mechanism 44 drives the suction mechanism 6 to move up and down; a plurality of test fixtures 7 are arranged in a rectangular array on the workbench 1, and each test fixture 7 includes a test base 71, a test circuit component arranged on the test base 71, and a component clamp 73, and the component clamp 73 has an open installation state and a locked clamp state. The clamping assembly 5 is used to switch the component clamp 73 from the locked clamp state to the open installation state, so that the suction mechanism 6 can install the semiconductor component 10 on the test fixture 7; the unloading mechanism 4 is used to transfer the semiconductor component 10 on the test fixture 7.

[0035] The following provides a test method based on a long-term test device for semiconductor components. In order to facilitate the control system to form the control execution logic, the test fixture 7 is provided with N pieces. The test fixtures 7 are arranged in a rectangular array. Each test fixture 7 represents a test station. All test fixtures 7 are marked with test station numbers one by one in a row and from left to right manner, that is, the first test station is numbered 1, and the last test station is numbered N. The duration of the long-term test required for each semiconductor component is t1. It should be noted that the duration of the long-term test is within the range of 30 minutes to one hour, that is, 30min<t1<1h. Before preparing for the test, all test fixtures 7 on the workbench 1 are in a waiting state; the test steps are as follows:

[0036] S001: the feeding mechanism 3 starts to work, the suction mechanism 6 on the feeding mechanism 3 moves to the top of the feeding position under the driving of the x-axis sliding mechanism 2 and the y-axis sliding mechanism 42, the z-axis sliding mechanism 44 of the feeding mechanism 3 drives the suction mechanism 6 to move vertically downward, so that the suction mechanism 6 sucks the semiconductor element 10, and the z-axis sliding mechanism 44 drives the suction mechanism 6 to reset;

[0037] S002: The suction mechanism 6 on the feeding mechanism 3 is driven by the x-axis sliding mechanism 2 and the y-axis sliding mechanism 42 to move above the test fixture 7 of the test station No. 1, and the clamping assembly 5 on the feeding mechanism 3 switches the component clamp 73 on the test fixture 7 from the locked clamping state to the open mounting state, and the z-axis sliding mechanism 44 of the feeding mechanism 3 drives the suction mechanism 6 to move vertically downward, so that the suction mechanism 6 can install the semiconductor component 10 on the test base 71; at the same time, the clamping assembly 5 disconnects the contact with the component clamp 73, so that the component clamp 73 is switched from the open mounting state to the locked clamping state, and the test circuit element on the test fixture 7 forms a test electrical connection with the semiconductor element 10, and the test fixture 7 starts to perform a long-term performance test on the semiconductor element 10, and the suction mechanism 6 releases the semiconductor element 10, and the z-axis sliding mechanism 44 drives the suction mechanism 6 to reset;

[0038] S003: the loading mechanism 3 repeats the working mode of the above steps S001 and S002, and moves the semiconductor components to the corresponding test fixture 7 in the order of the test station numbers to implement long-term performance testing, until the last test station starts to perform long-term performance testing. At this time, the loading mechanism 3 has worked for a long time from the beginning to the present, t2, t2 ≥ t1; at this time, the semiconductor components on the test station No. 1 have completed the long-term performance test;

[0039] S004: the unloading mechanism 4 unloads the semiconductor component on the test station No. 1 and moves the semiconductor component to a suitable position according to the test result; then the loading mechanism 3 re-loads the test fixture 7 on the test station No. 1 for testing;

[0040] S005: The unloading mechanism 4 and the loading mechanism 3 cyclically repeat the working mode of S004, that is, the unloading mechanism 4 unloads the semiconductor components on the next test station in the order of the test station numbers, and moves the semiconductor components to the appropriate position according to the test results. The test station currently unloaded by the unloading mechanism 4 is in a waiting state; then the loading mechanism 3 immediately performs loading test on the test fixture 7 on this test station.

[0041] In order to further perform reliability tests on semiconductor components, a first short-time rapid testing device 91 is provided upstream of the semiconductor long-time testing device, and a second short-time rapid testing device 92 is provided downstream of the semiconductor long-time testing device. Semiconductor components that are determined to be qualified products after being tested by the first short-time rapid testing device 91 will be transported to the long-time testing device through the loading mechanism 3, and the unloading mechanism will place the qualified products of the long-time test into the second short-time rapid testing device 92. It should be noted that only part of the test fixture is schematically drawn on the workbench.

[0042] Compared with the prior art, the semiconductor component long-term testing device provided by the present invention has the following advantages: 1. The loading mechanism 3 and the unloading mechanism 4, in cooperation with the x-axis sliding mechanism 2, the y-axis sliding mechanism 42 and the z-axis sliding mechanism 44, can flexibly drive the suction mechanism 6 to move horizontally and vertically, automatically completing the automatic assembly test and post-test transfer of semiconductor components, saving transportation labor and eliminating the problems caused by manual transportation of semiconductor components; 2. The component clamp 73 has an automatic clamping function, and the opening and closing components 5 automatically control the switching of the component clamp 73 between the open assembly state and the locked clamping state, ensuring that the semiconductor components are assembled and tested automatically during the long-term testing process. The conductor element has good contact with the connecting probe 725 of the test fixture 7, and the test reliability is high; 3. When the loading mechanism 3 loads all the test stations on the workbench 1 one by one to realize long-term testing, the semiconductor element on the first test station has just completed the long-term test, and then the unloading mechanism 4 transfers the semiconductor elements that have completed the test in sequence according to the test stations. Every time the unloading mechanism 4 transfers a semiconductor element on a test station, the loading mechanism 3 immediately installs a semiconductor element to be tested on the test station to be worked, thereby forming a regular and compact test loading and unloading arrangement, which greatly reduces the waiting time for loading at each test station and improves production efficiency.

[0043] Specifically, the component clamp 73 includes two clamping jaws 731 symmetrically arranged on the test base 71, each clamping jaw 731 includes a clamping part 7311, a connecting part 7312 and a bent leg part 7313 which are sequentially connected from top to bottom, the connecting part 7312 is rotatably connected to the test base 71, and an elastic member 74 for driving the clamping parts 7311 of the two clamping jaws 731 to approach each other is installed on the test base 71. It should be noted that the clamping part 7311, the connecting part 7312 and the bent leg part 7313 on the clamping jaw 731 are integrally formed, and the bent leg part 7313 is bent outward and protrudes to form an L shape.

[0044] Two elastic members 74 are provided and are adapted to be connected with two clamping jaws 731. The elastic member 74 is preferably a spring, one end of which is mounted on the test base 71, and the other end is mounted on the inner side of the bent leg portion 7313. In the natural state, due to the elastic force of the spring, the spring pushes the bent leg portion 7313 of the clamping jaw 731 away from the test base 71, while the clamping part 7311 of the clamping jaw 731 is close to the center of the test base 71, that is, in the natural state, the two clamping jaws 731 of the component clamp 73 are in the locked clamping state. The opening clamp assembly 5 can overcome the spring elastic force by pressing the bent leg portion 7313 of the clamping jaw 731, so that it moves in the direction close to the test base 71, while the clamping part 7311 of the clamping jaw 731 moves in the direction away from the test base 71, so that the component clamp 73 switches from the locked clamping state to the open mounting state, thereby preventing the component clamp 73 from interfering with the semiconductor component being mounted on the test fixture 7. When the clamping assembly 5 releases the pressure on the clamping jaw 731, the elastic force of the spring drives the clamping portion 7311 and the bent foot portion 7313 of the clamping jaw 731 to reset, and the elastic force of the spring is converted into the clamping force of the clamping jaw 731. The clamping portions 7311 of the two clamping jaws 731 jointly clamp the semiconductor element to ensure good contact between the device and the connecting probe 725 of the test fixture 7 during long-term testing.

[0045] In order to increase the clamping friction and ensure the rigid contact between the clamping part 7311 of the clamping jaw 731 and the semiconductor element, a rubber block 730 is provided on the inner side surface of the two clamping parts 7311, and a transversely arranged T-shaped slot is provided on the clamping part 7311. One end of the rubber block 730 is a clamping plane, and the other end is a connector adapted to be connected to the T-shaped slot, and the rubber block and the clamping part 7311 are inseparable.

[0046] In this embodiment, the clamping assembly 5 includes a clamping mounting plate 51 installed on the second frame 43, a z-axis slide plate 52 slidably connected to the clamping mounting plate 51, and a linear drive 53 for driving the z-axis slide plate 52 to move up and down, and the z-axis slide plate 52 is provided with two support arms 54 corresponding to the position of the clamping jaws 731, and an unlocker 55 is provided at the bottom of each support arm 54.

[0047] In fact, the output end of the linear drive 53 is arranged downward and is drivingly connected to the z-axis slide 52. In order to ensure smooth movement of the z-axis slide 52, a vertically extending guide rail is provided on the clamping mounting plate 51, and the z-axis slide 52 is slidably connected to the guide rail via a slider. When the component clamp 73 is to be opened, the linear drive 53 drives the z-axis slide 52 to move downward, and the unlocker 55 on the arm 54 presses the bent foot portion 7313 of the clamp 731, overcoming the elastic force of the elastic member 74, causing the clamp 731 to swing, and then the clamping parts 7311 of the two clamps 731 move away from each other and open outward, and the component clamp 73 is switched from the locked clamp state to the opened assembly state.

[0048] Furthermore, the unlocker 55 includes an unlocking support 551 with a lower concave cavity, a support shaft 552 horizontally arranged in the lower concave cavity, and a plurality of pressure wheels 553 rotatably sleeved on the support shaft 552. When the pressure wheel 553 presses down the bent foot portion 7313 of the clamping jaw 731, the contact point between the pressure wheel 553 and the bent foot portion 7313 will change accordingly due to the swing of the clamping jaw 731, thereby generating friction force, and at this time, the friction force can be converted into a rotation driving force of the pressure wheel 553, reducing the friction force affecting the pressure effect of the pressure wheel 553, and ensuring that the two clamping jaws 731 are opened more smoothly and reliably.

[0049] Preferably, the z-axis slide plate 52 is provided with an in-position trigger block 56, the clamping mounting plate 51 is provided with a first sensor bracket 57, the first sensor bracket 57 is provided with a photoelectric switch 58 vertically upward, and the in-position trigger block 56 is used to trigger the photoelectric switch 58. When the component clamp 73 on the test fixture 7 is opened, when the linear driver 53 drives the z-axis slide plate 52 to move downward, the z-axis slide plate 52 drives the in-position trigger block 56 to move downward together, and the in-position trigger block 56 gradually approaches the photoelectric switch 58. When the in-position trigger block 56 blocks the optical path of the photoelectric switch 58, the photoelectric switch 58 feeds back the system to the control system, so that the control system controls the linear driver 53 to stop working, indicating that the unlocker 55 has moved into position, ensuring that the component clamp 73 switches from the locked clamping state to the open mounting state, and then the control system further controls the movement of the z-axis sliding mechanism 44 and the suction mechanism to ensure the smooth placement of the semiconductor workpiece.

[0050] Specifically, the suction mechanism 6 includes a suction mounting seat 61 installed on the z-axis sliding mechanism 44, a sleeve 62 vertically fixed on the suction mounting seat 61, and a guide seat 63 arranged at the bottom of the sleeve 62. The sleeve 62 is provided with an axial through hole 64 with a non-circular cross section, and an inner shaft 65 adapted to the shape of the axial through hole 64 is inserted into the axial through hole 64. The bottom of the inner shaft 65 extends downward from the axial through hole 64 and is connected to a suction cup mounting seat 66. The bottom of the suction cup mounting seat 66 is provided with a suction cup 67, and a buffer spring is sleeved on the inner shaft 65. Spring 68, the buffer spring 68 is located between the suction cup mounting seat 66 and the guide seat 63, and a limit spring 69 is provided on the top of the inner shaft 65. The limit spring 69 limits the maximum downward extension distance of the inner shaft 65 to prevent the inner shaft 65 from slipping off the sleeve 62. An axial channel is provided on the inner shaft 65, and the bottom end of the axial channel is connected to the suction cup 67. The top end of the axial channel is connected to an air nozzle 60, and the air nozzle 60 is connected to the vacuum generator through an air pipe. The control system controls the opening or closing of the vacuum generator so that the suction cup 67 has the ability to suck and unload materials under negative pressure.

[0051] The inner shaft 65 is inserted into the axial through hole 64 of the sleeve 62 to form a clearance fit, so that the inner shaft 65 can move in the vertical direction; since the cross-sections of the axial through hole 64 and the inner shaft 65 are non-circular, the inner shaft 65 will not rotate relative to the sleeve 62. When the semiconductor element 10 is actually sucked, the z-axis sliding mechanism 44 drives the sucking mechanism to move downward, and the suction cup 67 presses downward on the top surface of the semiconductor element 10. When the suction cup 67 contacts the semiconductor element 10, a certain rigid impact force will be generated. At this time, the buffer spring 68 will buffer and absorb part of the rigid impact force to prevent the rigid impact force from causing damage to the semiconductor element and the inner shaft 65. In addition, in order to ensure that the suction cup 67 on the suction mechanism is in close contact with the top surface of the semiconductor element to form good air tightness, the suction cup 67 needs to exert a downward pressing force on the semiconductor element. When the suction cup 67 is in close contact with the semiconductor element 10, the semiconductor element 10 blocks the suction cup 67 from continuing to move downward, and the suction mounting seat 61 and the sleeve 62 continue to move downward relative to the inner shaft 65, so that the buffer spring 68 will be gradually compressed. At this time, the thrust of the buffer spring 68 pushes the suction cup mounting seat 66 and the suction cup 67 to press the top surface of the semiconductor element, and negative pressure is formed in the axial channel of the inner shaft 65, so that the semiconductor element 10 can be successfully sucked.

[0052] Similarly, when the semiconductor component 10 is actually installed on the test fixture 7, the z-axis sliding mechanism 44 drives the suction mechanism 6 to move downward, and a certain rigid impact force will be generated when the semiconductor component 10 contacts the test fixture 7. At this time, the buffer spring 68 will buffer and absorb part of the rigid impact force to prevent the rigid impact force from damaging the semiconductor component and the test circuit component. In addition, when the semiconductor component 10 is loaded into the test fixture 7, the semiconductor component 10 blocks the suction cup 67 from continuing to move downward, and the suction mounting seat 61 and the sleeve 62 continue to move downward relative to the inner shaft 65, so that the spring will gradually compress. At this time, the thrust of the buffer spring 68 pushes the semiconductor component to press the test fixture 7, ensuring that the electrodes of the semiconductor component form an effective electrical connection with the test circuit components, and then the component clamp 73 clamps the semiconductor component 10, ensuring that the semiconductor component and the connection probe 725 of the test fixture 7 are in good contact during long-term testing, and the test process is reliable.

[0053] Preferably, the suction cup mounting seat 66 is inverted U-shaped, that is, two stabilizing pressure arms 661 are formed on both sides of the suction cup 67, and soft rubber pads are also provided at the bottom of the two stabilizing pressure arms. When the suction cup 67 absorbs the semiconductor element 10, the two stabilizing pressure arms are pressed against the top surface of the semiconductor element 10 together, which can better press the semiconductor element on the one hand, and ensure that the semiconductor element is horizontal after being sucked up, and will not tilt, which is convenient for subsequent installation. When the semiconductor element 10 is installed on the test fixture 7, the two stabilizing pressure arms 10 also provide uniform pressing force on the semiconductor element, ensuring that the semiconductor element is in good contact with the test fixture 7.

[0054] like Figure 8 As shown, for the convenience of processing, the above-mentioned axial through hole 64 is a waist-shaped through hole, and the cross-section of the inner shaft 65 is a hollow square.

[0055] Furthermore, the top of the inner shaft 65 is sleeved with a collar 81 located above the retaining spring, and the top of the collar 81 is provided with a triggering edge 82. The suction mounting seat 61 is provided with a second sensor bracket 83, and the second sensor bracket 83 is provided with a through-beam photoelectric sensor 84. The triggering edge 82 is used to block the optical path of the through-beam photoelectric sensor 84. When the suction cup mounting seat 66 and the suction cup 67 press the semiconductor element, the suction mounting seat 61 and the sleeve 62 move downward relative to the inner shaft 65, driving the through-beam photoelectric sensor 84 on the second sensor bracket 83 to move downward, so that the triggering edge 82 extends between the transmitting end and the receiving end of the through-beam photoelectric sensor 84, thereby blocking the optical path transmission between the transmitting end and the receiving end, and the through-beam photoelectric sensor 84 feeds back a signal to the control system, indicating that the suction mounting seat 61 has moved into place, and the z-axis sliding mechanism 44 stops working.

[0056] Preferably, the test fixture 7 is detachably connected to the workbench 1, and each test station of the workbench 1 is preset with a mounting hole and a socket. The workbench 1 is provided with a circuit control panel inside, and the socket is arranged on the circuit control panel. The test base 71 includes a base body 711 and pillars 712 arranged at the bottom corners of the base body 711, and the pillars 712 are adapted to be installed with the mounting holes on the workbench 1. The middle part of the base body 711 is provided with a circuit element installation cavity, and the test circuit element includes a test circuit board 721 arranged in the circuit element installation cavity, and a test circuit board 721 arranged in the test circuit board 721. A component positioning seat 722 is provided on the top of the test circuit board 721, and a plug 723 is provided on the bottom of the test circuit board 721; the plug 723 is inserted into the socket to realize electrical connection, and the middle part of the component positioning seat 722 is recessed downward to form a positioning groove 724 for the semiconductor component to be embedded, and a plurality of connection probes 725 are provided in the positioning groove 724, which are vertically facing upward and electrically connected to the test circuit board 721. When the semiconductor component 10 is installed in the positioning groove 724, the electrodes of the semiconductor component are electrically connected to the connection probes 725, thereby starting a long-term test.

[0057] In this embodiment, the loading mechanism 3 has the same structure as the unloading mechanism 4, and the working principle is also the same. The specific structure of the unloading mechanism 4 will not be repeated here. After the semiconductor components have been tested for a long time, the control system will mark the semiconductor components as qualified products after a long time test and unqualified products after a long time test. The x-axis sliding mechanism 2 cooperates with the unloading mechanism 4 to transfer the qualified products after a long time test to the downstream short-time rapid test fixture 7 for further performance testing, while the unqualified products after a long time test are transferred to the unqualified product placement tray 93 placed on the workbench 1.

[0058] The x-axis sliding mechanism 2, y-axis sliding mechanism 42, z-axis sliding mechanism 44 and linear drive 53 can all be pneumatic push rods, electric push rods, hydraulic push rods, linear modules, linear modules, screw mechanisms, etc. Their main function is to provide an output end for linear motion, and they can all be purchased directly from the market.

[0059] The x-axis sliding mechanism 912, y-axis sliding mechanism 33, z-axis sliding mechanism 721, x-axis moving module 21, y-axis moving module 22 and z-axis moving module 23 can all be linear modules, straight-line modules, screw mechanisms, etc. Their main function is to provide an output end for linear motion, and they can all be purchased directly from the market.

[0060] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0061] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0062] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the protection scope of the present invention.

Claims

1. A semiconductor component long-term testing device, characterized in that: It comprises a workbench, an x-axis sliding mechanism arranged on the workbench, a loading mechanism and an unloading mechanism arranged on the x-axis sliding mechanism; the loading mechanism comprises a first frame, a y-axis sliding mechanism arranged on the first frame, a second frame arranged on the y-axis sliding mechanism, a clamping assembly and a z-axis sliding mechanism arranged on the second frame, and a suction mechanism arranged on the z-axis sliding mechanism; the first frame moves left and right on the x-axis sliding mechanism, the y-axis sliding mechanism drives the second frame to move forward and backward, and the z-axis sliding mechanism drives the suction mechanism to move up and down; a plurality of test fixtures are arranged on the workbench in a rectangular array, each test fixture comprises a test base, a test circuit element arranged on the test base, and a component clamp, the component clamp has an open mounting state and a locked clamp state, the clamping assembly is used to switch the component clamp from the locked clamp state to the open mounting state, so that the suction mechanism can install the semiconductor element on the test fixture; The unloading mechanism is used to transfer the semiconductor components on the test fixture.

2. The semiconductor device long time testing device according to claim 1, characterized in that: The component clamp includes two clamping jaws symmetrically arranged on the test base, each clamping jaw includes a clamping part, a connecting part and a bent foot part which are sequentially connected from top to bottom, the connecting part is rotatably connected to the test base, and an elastic component is installed on the test base for driving the clamping parts of the two clamping jaws to approach each other.

3. The semiconductor device long time testing device according to claim 2, characterized in that: The clamping assembly includes a clamping mounting plate, a z-axis slide plate slidably connected to the clamping mounting plate, and a linear drive for driving the z-axis slide plate to move up and down. The z-axis slide plate is provided with two arms corresponding to the positions of the clamping jaws, and an unlocker is provided at the bottom of each arm. The unlocker is used to press the bent foot portion of the clamping jaws to move the clamping parts of the two clamping jaws away from each other.

4. The semiconductor device long time testing device according to claim 3, characterized in that: The unlocking device comprises an unlocking support with a lower concave cavity, a support shaft horizontally arranged in the lower concave cavity, and a plurality of pressure wheels rotatably sleeved on the support shaft.

5. The semiconductor device long time testing device according to claim 4, characterized in that: The z-axis slide is provided with an in-position trigger block, the clamping mounting plate is provided with a first sensor bracket, the first sensor bracket is provided with a photoelectric switch vertically upward, and the in-position trigger block is used to trigger the photoelectric switch.

6. The semiconductor device long time testing device according to claim 1, characterized in that: The suction mechanism includes a suction mounting seat, a sleeve vertically arranged on the suction mounting seat, and a guide seat arranged at the bottom of the sleeve. The sleeve is provided with an axial through hole with a non-circular cross-section, and an inner shaft adapted to the shape of the axial through hole is inserted into the axial through hole. The bottom of the inner shaft extends downwardly out of the axial through hole and is connected to a suction cup mounting seat. A suction cup is provided at the bottom of the suction cup mounting seat. A buffer spring is sleeved on the inner shaft, and the buffer spring is located between the suction cup mounting seat and the guide seat. A limit spring is provided on the top of the inner shaft. An axial channel is provided on the inner shaft, and the bottom end of the axial channel is connected to the suction cup, and the top end of the axial channel is connected to an air nozzle.

7. The semiconductor device long time testing device according to claim 6, characterized in that: The top of the inner shaft is sleeved with a ring located above the retaining ring, the top of the ring is provided with a trigger edge, the suction mounting seat is provided with a second sensor bracket, the second sensor bracket is provided with a through-beam type photoelectric sensor, and the trigger edge is used to block the light path of the through-beam type photoelectric sensor.

8. The semiconductor device long time testing device according to claim 1, characterized in that: The test base includes a base body and pillars arranged at the bottom corners of the base body, a circuit element installation cavity is arranged in the middle of the base body, and the test circuit element includes a test circuit board arranged in the circuit element installation cavity, a component positioning seat arranged on the top of the test circuit board, and a plug arranged at the bottom of the test circuit board; the middle part of the component positioning seat is recessed downward to form a positioning groove for semiconductor elements to be embedded, and a plurality of connection probes are arranged in the positioning groove, which are vertically upward and electrically connected to the test circuit board.

9. The semiconductor device long time testing device according to claim 1, characterized in that: The loading mechanism has the same structure as the unloading mechanism, and a tray for placing defective products is placed on the workbench.

10. A testing method based on the semiconductor element long-time testing device according to any one of claims 1 to 9, characterized in that: The test fixtures are provided with N pieces, and the test fixtures are arranged in a rectangular array. Each test fixture represents a test station. All test fixtures are marked with test station numbers one by one in a row and from left to right manner. The first test station is numbered 1, and the last test station is numbered N. The time required for the long-term test of each semiconductor component is t1. Before preparing for the test, all test fixtures on the workbench are in a waiting state; The test steps are as follows: S001: the feeding mechanism starts to work, the suction mechanism on the feeding mechanism moves to the top of the feeding position under the driving of the x-axis sliding mechanism and the y-axis sliding mechanism, the z-axis sliding mechanism of the feeding mechanism drives the suction mechanism to move vertically downward, so that the suction mechanism sucks the semiconductor component, and the z-axis sliding mechanism drives the suction mechanism to reset; S002: The suction mechanism on the feeding mechanism moves to the top of the test fixture of the No. 1 test station under the drive of the x-axis sliding mechanism and the y-axis sliding mechanism, and the clamping assembly on the feeding mechanism switches the component clamp on the test fixture from the locked clamping state to the open mounting state, and the z-axis sliding mechanism of the feeding mechanism drives the suction mechanism to move vertically downward, so that the suction mechanism can install the semiconductor component on the test base; at the same time, the clamping assembly disconnects the contact with the component clamp, so that the component clamp switches from the open mounting state to the locked clamping state, and the test circuit element on the test fixture forms a test electrical connection with the semiconductor element, and the test fixture starts to perform a long-term performance test on the semiconductor element, and the suction mechanism releases the semiconductor element, and the z-axis sliding mechanism drives the suction mechanism to reset; S003: The loading mechanism repeats the working methods of the above steps S001 and S002, and moves the semiconductor components to the corresponding test fixtures in the order of the test station numbers to implement long-term performance testing, until the last test station starts to perform long-term performance testing. At this time, the loading mechanism has worked for a long time from the beginning to the present, t2, t2 ≥ t1; at this time, the semiconductor components on the No. 1 test station have completed the long-term performance test; S004: The unloading mechanism unloads the semiconductor component on the No. 1 test station and moves the semiconductor component to a suitable position according to the test result; then the loading mechanism re-loads the test fixture on the No. 1 test station for testing; S005: The unloading mechanism and the loading mechanism cyclically repeat the working mode of S004 above, that is, the unloading mechanism unloads the semiconductor components on the next test station in the order of the test station numbers, and moves the semiconductor components to the appropriate position according to the test results. The test station currently unloaded by the unloading mechanism is in a waiting state; then the loading mechanism immediately loads the test fixture on this test station for testing.

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