Display substrate and display device

Abstract

The embodiment of the present invention discloses a display substrate and a display device, which relate to the field of display technology and are used to improve the packaging effect and improve the yield of the display substrate and the display device. The display substrate includes: a backplane, a baffle wall arranged on one side of the backplane and located in the peripheral area, and an encapsulation layer arranged on the side of the baffle wall away from the backplane. The backplane includes a substrate. The baffle wall includes a first baffle wall and a second baffle wall located on the side of the first baffle wall close to the display area. The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer stacked in sequence. Among them, the orthographic projection of the organic layer on the backplane is located within the orthographic projection range of the second baffle wall on the backplane. The orthographic projection of the second baffle wall on the backplane is located within the orthographic projection range of the second inorganic layer on the backplane. The spacing between the surface of the first baffle wall on one side close to the substrate and the substrate is smaller than the spacing between the surface of the second baffle wall on one side close to the substrate and the substrate. The display substrate and the display device provided by the embodiment of the present invention are used for image display.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) has been widely used in the display field due to its advantages such as self-luminescence, low driving voltage, high luminous efficiency, fast response speed and flexible display. Summary of the invention

[0003] An object of the embodiments of the present invention is to provide a display substrate and a display device, which are used to improve the packaging effect and increase the yield of the display substrate and the display device.

[0004] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0005] On the one hand, an embodiment of the present invention provides a display substrate. The display substrate has a display area and a peripheral area. The display substrate includes: a backplane, a plurality of retaining walls arranged on one side of the backplane and located in the peripheral area, and an encapsulation layer arranged on a side of the plurality of retaining walls away from the backplane. The backplane includes a substrate. The plurality of retaining walls include at least one first retaining wall, and at least one second retaining wall located on a side of the first retaining wall close to the display area. The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer stacked in sequence. The orthographic projection of the organic layer on the backplane is located within the orthographic projection range of the second retaining wall on the backplane. The orthographic projection of the second retaining wall on the backplane is located within the orthographic projection range of the second inorganic layer on the backplane. The spacing between the surface of the first retaining wall on one side close to the substrate and the substrate is smaller than the spacing between the surface of the second retaining wall on one side close to the substrate and the substrate.

[0006] The display substrate provided by some embodiments of the present invention, by setting a first blocking wall and a second blocking wall, makes the second blocking wall closer to the display area than the first blocking wall, and can use the second blocking wall to block the organic solution used to form the organic layer, so that the organic solution stops leveling before the second blocking wall, so that the orthographic projection of the organic layer on the back panel is located within the orthographic projection range of the second blocking wall on the back panel, and the orthographic projection of the second blocking wall on the back panel is located within the orthographic projection range of the second inorganic layer on the back panel, so that the second inorganic layer can completely cover the organic layer, avoiding water and / or oxygen from corroding the light-emitting device through the organic layer, thereby ensuring the packaging effect, avoiding packaging failure, and effectively improving the yield of the display substrate.

[0007] Moreover, after the organic solution stops leveling in front of the second retaining wall by using the second retaining wall, the portion of the organic layer located between the display area and the second retaining wall can have a larger slope and smaller size, and the surface of the portion of the encapsulation layer located in the display area away from the substrate can be flatter. In this way, when the display substrate is applied to a display device, and the display device includes a touch structure, the error of etching the metal film used to form the touch signal line in the touch structure can be reduced, thereby avoiding metal residue, and further avoiding the situation where metal connection between adjacent touch signal lines due to metal residue occurs, and short circuit occurs after power is turned on, effectively improving the yield of the display device.

[0008] In some embodiments, the first retaining wall includes a plurality of first retaining wall patterns stacked in sequence, and the second retaining wall includes a second retaining wall pattern.

[0009] In some embodiments, the backplane includes a substrate, a pixel driving circuit layer, a planar layer, and a pixel defining layer stacked in sequence. Among the plurality of first retaining wall patterns, one first retaining wall pattern is disposed in the same layer as the planar layer, another first retaining wall pattern is disposed in the same layer as the pixel defining layer, and the second retaining wall pattern is disposed in the same layer as the pixel defining layer.

[0010] In some embodiments, a retaining wall includes: a plurality of first subsections extending along a first direction, a plurality of second subsections extending along a second direction, and a plurality of third subsections connecting adjacent first subsections and second subsections, wherein the intersection of the extension lines of adjacent first subsections and second subsections is located outside the boundary of the retaining wall.

[0011] In some embodiments, the orthographic projections of the plurality of first sub-portions and the plurality of second sub-portions on the back plate are straight lines; and the orthographic projections of the plurality of third sub-portions on the back plate are rounded corners.

[0012] In some embodiments, the width of the third subsection is greater than the width of the first subsection. The width of the third subsection is greater than the width of the second subsection.

[0013] In some embodiments, the width of the first subsection is equal to the width of the second subsection.

[0014] In some embodiments, the spacing between the third subsections of two adjacent retaining walls is greater than the spacing between the first subsections of two adjacent retaining walls. The spacing between the third subsections of two adjacent retaining walls is greater than the spacing between the second subsections of two adjacent retaining walls.

[0015] In some embodiments, a distance between the first sub-portion of the second retaining wall and the display area is greater than a distance between the second sub-portion of the second retaining wall and the display area.

[0016] In some embodiments, when the number of the first retaining walls and the number of the second retaining walls are plural, the spacing between adjacent first retaining walls and the second retaining walls is greater than the spacing between two adjacent first retaining walls. The spacing between adjacent first retaining walls and the second retaining walls is greater than the spacing between two adjacent second retaining walls.

[0017] In some embodiments, the distance between two adjacent first retaining walls ranges from 10 μm to 90 μm, the distance between two adjacent second retaining walls ranges from 10 μm to 90 μm, and the distance between two adjacent first retaining walls and second retaining walls ranges from 100 μm to 300 μm.

[0018] In some embodiments, the ratio of the distance between two adjacent second retaining walls to the width of the second retaining wall is in a range of 1:9 to 9:1.

[0019] In some embodiments, a distance between a surface of the second retaining wall away from the back plate and the back plate is smaller than a distance between a surface of the first retaining wall away from the back plate and the back plate.

[0020] In some embodiments, when there are multiple second retaining walls, among two adjacent second retaining walls, relative to the back panel, the surface of a second retaining wall close to the display area on the side away from the back panel is lower than the surface of a second retaining wall away from the display area on the side away from the back panel, or the two are level.

[0021] In some embodiments, when there are multiple first retaining walls, among two adjacent first retaining walls, relative to the back panel, a surface of a first retaining wall close to the display area on a side away from the back panel is lower than a surface of a first retaining wall away from the display area on a side away from the back panel.

[0022] In some embodiments, the display substrate further comprises: a plurality of light-emitting devices located between the backplane and the encapsulation layer and located in the display area. The light-emitting devices comprise an anode, a light-emitting layer and a cathode stacked in sequence. The display substrate further comprises: a power line arranged in the same layer as the anode, and the power line is in direct contact with the second retaining wall.

[0023] In some embodiments, among the multiple first barrier wall patterns, when one first barrier wall pattern is arranged on the same layer as the flat layer and another first barrier wall pattern is arranged on the same layer as the pixel defining layer, the power line extends through the area where the second barrier wall is located to the area where part of the first barrier wall is located, and is inserted between the one first barrier wall pattern and the other first barrier wall pattern.

[0024] In another aspect, an embodiment of the present invention provides a display device, which includes: a display substrate as described in any of the above embodiments.

[0025] In some embodiments, the display device further includes: a touch structure disposed on a side of the packaging layer away from the backplane. The touch structure includes a touch electrode layer and a plurality of touch signal lines. The peripheral area of ​​the display substrate further includes a binding area. The touch electrode layer is located in the display area of ​​the display substrate. One end of the touch signal line is electrically connected to the touch electrode layer. The other end of the touch signal line extends across a plurality of retaining walls of the display substrate to the binding area.

[0026] The display substrate included in the above-mentioned display device has the same structure and beneficial technical effects as the display substrates provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual sizes of the products involved in the embodiments of the present disclosure.

[0028] Figure 1 is a structural diagram of a display device according to some embodiments of the present invention;

[0029] Figure 2 is a structural diagram of a display substrate according to some embodiments of the present invention;

[0030] Figure 3 is a structural diagram of another display substrate according to some embodiments of the present invention;

[0031] Figure 4 is a structural diagram of another display substrate according to some embodiments of the present invention;

[0032] Figure 5 A structural diagram of a retaining wall according to some embodiments of the present invention;

[0033] Figure 6 is a structural diagram of another display device according to some embodiments of the present invention;

[0034] Figure 7 is a structural diagram of another display device according to some embodiments of the present invention;

[0035] Figure 8 for Figure 6A cross-sectional view of the display device along the AA' direction;

[0036] Fig. 9 for Figure 6 Another cross-sectional view of the display device along line AA' is shown. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0039] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0040] When describing some embodiments, the term "connected" and its derivative expressions may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0041] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0042] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0043] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0044] As used herein, "about" or "approximately" includes the stated value and the average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0045] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0046] The display substrate in the related art includes a backplane, a light emitting device, a baffle wall and a packaging structure. The packaging structure is located on a side of the light emitting device and the baffle wall away from the backplane, and the packaging structure includes a first inorganic layer, an organic layer and a second inorganic layer stacked in sequence.

[0047] Based on the properties of the above-mentioned organic layer materials, inkjet printing technology is generally used to prepare the organic layer. In the process of preparing and forming the organic layer, the organic solution (used to form the organic layer) easily flows to the retaining wall. Considering the production accuracy and alignment accuracy when the second inorganic layer is subsequently produced, the second inorganic layer may not be able to completely cover the organic layer, and thus cannot completely cover the retaining wall. In this case, water and / or oxygen can enter the interior of the display substrate through the retaining wall, corrode the light-emitting device, and reduce the life of the light-emitting device, that is, cause the package to fail.

[0048] Based on this, an embodiment of the present invention provides a display device 1000, such as Figure 1 shown.

[0049] In some examples, the display device 1000 may be any device that displays, whether in motion (e.g., video) or stationary (e.g., still images), and whether textual or graphic. More specifically, it is contemplated that the embodiments described may be implemented in or associated with a variety of electronic devices, such as, but not limited to, mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, global positioning system (GPS) receivers / navigators, cameras, moving picture experts group 4 (MP4) video players, video cameras, game consoles, watches, clocks, calculators, television monitors, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation instruments, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0050] In some examples, such as Figure 1 As shown, the display device 1000 includes a display substrate 100 .

[0051] Exemplarily, the display device 1000 may further include a frame, a source driver chip, an FPC (Flexible Printed Circuit), a PCB (Printed Circuit Board), or other electronic accessories.

[0052] In some examples, such as Figure 5 , Figure 6 and Figure 7 As shown, the display substrate 100 has a display area AA and a peripheral area SS.

[0053] The display area AA may have a variety of shapes, which are not limited in the present invention and may be configured according to actual needs. For example, the display area AA may have an elliptical shape, a trapezoidal shape, or a rectangular shape.

[0054] The positional relationship between the peripheral area SS and the display area AA is not unique. For example, the peripheral area SS may be located on one side of the display area AA, on both sides of the display area AA, on three sides of the display area AA, or surround the display area AA.

[0055] For example, Figure 6 and Figure 7The peripheral area SS of the display substrate 100 shown in the figure further includes a binding area B. The position of the binding area B in the peripheral area SS can be selected and set according to actual needs.

[0056] In some examples, such as Figure 6 and Figure 7 As shown, the display device 1000 further includes: a touch control structure 200 disposed on one side of the display substrate 100, the touch control structure 200 includes a touch control electrode layer 21 and a plurality of touch control signal lines 22. The touch control electrode layer 21 is located in the display area AA.

[0057] There are various types of the touch electrode layer 21 , which can be selected according to actual needs.

[0058] In some examples, such as Figure 6 As shown, the type of the touch electrode layer 21 is FMLOC (Flexible Multi-Layer On Cell, a flexible multi-layer structure is made on the packaging layer 3 of the display substrate 100). For details about the packaging layer 3, please refer to the following description, which will not be repeated here.

[0059] For example, Figure 6 , Figure 8 and Fig. 9 As shown, the touch electrode layer 21 includes: a plurality of first touch electrodes 211 extending along the second direction Y. Each first touch electrode 211 includes a plurality of first touch sub-electrodes 2111 connected in series. For example, each first touch electrode 211 is an integrated structure.

[0060] Optional, such as Figure 6 , Figure 8 and Fig. 9 As shown, the touch electrode layer 21 further includes: multiple rows of second touch electrodes 212 and multiple columns of metal bridges 2122. Each row of second touch sub-electrodes 212 includes multiple second touch sub-electrodes 2121 spaced apart along the first direction X. In each row of second touch sub-electrodes 2121, any two adjacent second touch sub-electrodes 2121 are electrically connected to one metal bridge 2122 in a corresponding column of metal bridges 2122 through vias, so that the multiple rows of second touch sub-electrodes 2121 and the multiple metal bridges 2122 constitute multiple second touch electrodes 212.

[0061] The first direction X and the second direction Y intersect, and the size of the angle between the two is related to the shape of the display area AA.

[0062] For example, when the display area AA is rectangular, the first direction X refers to a direction parallel to one of two adjacent sides in the border of the rectangular display area, and the second direction Y refers to a direction parallel to the other of the two adjacent sides in the border of the rectangular display area. At this time, the first direction X and the second direction Y are perpendicular to each other.

[0063] For another example, when the display area AA is prism-shaped, the first direction X refers to a direction parallel to one of two adjacent sides in the boundary of the prism-shaped display area, and the second direction Y refers to a direction parallel to the other of the two adjacent sides in the boundary of the prism-shaped display area. In this case, the angle between the first direction X and the second direction Y is less than 90°.

[0064] Based on this, the plurality of touch signal lines 22 may include a plurality of first sub-touch signal lines 221 and a plurality of second sub-touch signal lines 222. One end of a first sub-touch signal line 221 is electrically connected to a first touch electrode 211, and the other end thereof passes through the peripheral area SS and extends to the binding area B. One end of a second sub-touch signal line 222 is electrically connected to a second touch electrode 212, and the other end thereof passes through the peripheral area SS and extends to the binding area B.

[0065] Optionally, the plurality of touch signal lines 22 and the metal bridges 2122 in the touch electrode layer 21 are arranged in the same layer.

[0066] It should be noted that the "same layer" mentioned in this article refers to a layer structure formed by using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask template through a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses. In this way, the above-mentioned multiple touch signal lines 22 and the metal bridges 2122 in the touch electrode layer 21 can be simultaneously formed in a single patterning process, which is conducive to simplifying the preparation process of the display substrate 100.

[0067] In other examples, such as Figure 7 As shown, the type of the touch electrode layer 21 is FSLOC (Flexible Single Layer On Cell, a flexible single layer structure is made on the encapsulation layer 3 of the display substrate 100 ).

[0068] Exemplarily, the touch electrode layer 21 includes: a plurality of third touch electrodes 213 extending along the second direction Y and arranged at intervals.

[0069] Based on this, one end of one of the plurality of touch signal lines 22 is electrically connected to one of the third touch electrodes 213 , and the other end thereof extends to the binding area B through the peripheral area SS.

[0070] Optionally, the plurality of touch signal lines 22 and the plurality of third touch electrodes 213 in the touch electrode layer 21 are disposed in the same layer. In this way, the plurality of touch signal lines 22 and the plurality of third touch electrodes 213 in the touch electrode layer 21 can be simultaneously formed in one patterning process, which is conducive to simplifying the manufacturing process of the display substrate 100.

[0071] The structure of the display substrate 100 is schematically described below by taking an example in which the display area AA is in a rectangular shape and the peripheral area SS is disposed around the display area AA.

[0072] It should be noted that, when the display area AA is rectangular, the first direction X refers to a direction parallel to the short side of the rectangular display area boundary, and the second direction Y refers to a direction parallel to the long side of the rectangular display area boundary.

[0073] In some examples, such as Figure 2 As shown, the display substrate 100 includes: a back plate 1 .

[0074] For example, Figure 2 As shown, the backplane 1 may include a substrate 10 , a pixel driving circuit layer 11 , a planar layer 12 , and a pixel defining layer 13 which are stacked in sequence.

[0075] The structure of the substrate 10 includes various structures, which can be selected and set according to actual needs.

[0076] For example, the substrate 10 may be a rigid substrate. The rigid substrate may be, for example, a glass substrate or a PMMA (Polymethyl methacrylate) substrate. In this case, the display substrate 100 may be a rigid display substrate.

[0077] For another example, the substrate 10 may be a flexible substrate. The flexible substrate may be, for example, a PET (Polyethyleneterephthalate) substrate, a PEN (Polyethylene naphthalate twoformic acid glycol ester) substrate, or a PI (Polyimide) substrate. In this case, the display substrate 100 may be a flexible display substrate.

[0078] For example, Figure 2As shown, the pixel driving circuit layer 11 includes a gate conductive layer 111 , a gate insulating layer 112 , an active layer 113 , an interlayer insulating layer 114 and a first source-drain conductive layer 115 which are stacked in sequence.

[0079] For example, Figure 2 As shown, the gate conductive layer 111 includes a plurality of gate electrodes 1111, the active layer 113 includes a plurality of active patterns 1131, and the first source-drain conductive layer 115 includes a plurality of source electrodes 1151 and a plurality of drain electrodes 1152. Among them, a corresponding active pattern 1131, a gate electrode 1111, a source electrode 1151 and a drain electrode 1152 can constitute a transistor, and a plurality of transistors can constitute a pixel driving circuit P. The pixel driving circuit layer 111 can include a plurality of pixel driving circuits P. Figure 2 As shown, in the present invention, one transistor is used to represent one pixel driving circuit P.

[0080] For example, Figure 4 The pixel driving circuit layer 11 may further include a second source-drain conductive layer 116 located at a side of the first source-drain conductive layer 115 away from the substrate. The second source-drain conductive layer 116 may include a plurality of connection portions 1161 .

[0081] In some examples, such as Figure 2 As shown, the display substrate 100 further includes: a plurality of light emitting devices 2 located on a side of the planar layer 12 away from the substrate 10 and located in the display area AA. The light emitting devices 2 may be, for example, OLEDs.

[0082] Exemplarily, the light emitting device 2 includes an anode 2a, a light emitting layer 2b and a cathode 2c which are stacked in sequence.

[0083] For example, the anode 2a of the light emitting device 2 is disposed on a surface of the planar layer 12 that is away from the substrate 10. The anode 2a of one light emitting device 2 may be electrically connected to one pixel driving circuit P through the planar layer 12.

[0084] In the case where the pixel driving circuit layer 11 further includes the second source-drain conductive layer 116 , the anode 2 a of one light emitting device 2 may be electrically connected to one pixel driving circuit P through one connecting portion 1161 .

[0085] For example, the structure of the anode 2a may be a composite structure composed of a transparent conductive oxide film / metal film / transparent conductive oxide film stacked in sequence, wherein the material of the transparent conductive oxide film is, for example, any one of ITO (Indiumtin oxide) and IZO (Indium zinc oxide), and the material of the metal film is, for example, any one of gold (Au), silver (Ag), nickel (Ni) and platinum (Pt).

[0086] For another example, the structure of the anode 2a may also be a single-layer structure, and the material of the single-layer structure may be any one of ITO, IZO, Au, Ag, Ni, and Pt.

[0087] Exemplarily, the pixel defining layer 13 has a plurality of openings. One opening exposes a portion of an anode 2a. At least a portion of a light-emitting layer 2b is located in one opening and is electrically connected to the corresponding anode 2a. That is, each light-emitting layer 2b is electrically connected to the corresponding anode 2a through a portion or the entirety of the light-emitting layer 2b located in the corresponding opening.

[0088] Here, the configuration of the light-emitting layer 2b is related to the preparation process of the light-emitting layer 2b.

[0089] For example, when the light-emitting layer 2 b is formed by an evaporation process, a portion of the light-emitting layer 2 b may be located in the corresponding opening, and another portion may overlap the pixel defining layer 13 around the opening.

[0090] When the light emitting layer 2b is formed by inkjet printing technology, the light emitting layer 2b is entirely located in the corresponding openings.

[0091] For example, Figure 2 As shown, the cathode 2c is located on the side of the pixel defining layer 13 away from the substrate 10. The cathodes 2c of the light emitting devices may be electrically connected to each other to form an integrated structure.

[0092] For example, the material of the cathode 2c may be any one of aluminum (Al), silver (Ag) and magnesium (Mg), or any one of a magnesium-silver alloy and an aluminum-lithium alloy.

[0093] Of course, the light-emitting device 2 may further include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer disposed between the anode 2a and the light-emitting layer 2b, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer disposed between the cathode 2c and the light-emitting layer 2b.

[0094] By setting at least one of a hole injection layer, a hole transport layer, and an electron blocking layer between the anode 2a and the light-emitting layer 2b of the light-emitting device 2, and setting at least one of an electron injection layer, an electron transport layer, and a hole blocking layer between the cathode 2c and the light-emitting layer 2b of the light-emitting device 2, the luminous efficiency of the light-emitting device 2 can be improved.

[0095] In some examples, such as Figure 2 As shown, the display substrate 100 further includes: an encapsulation layer 3 disposed on a side of the light emitting device 2 away from the back plate 1 . Based on this, the plurality of light emitting devices 2 are located between the back plate 1 and the encapsulation layer 3 .

[0096] For example, Figure 2As shown, the encapsulation layer 3 includes a first inorganic layer 31 , an organic layer 32 and a second inorganic layer 33 which are stacked in sequence.

[0097] The first inorganic layer 31 and the second inorganic layer 33 play the main role of blocking water and / or oxygen from invading the light-emitting device 2, and the organic layer 32 plays the role of auxiliary packaging and planarization. That is, the flatter the surface of the organic layer 32 on the side away from the substrate 10, the flatter the surface of the encapsulation layer 3 on the side away from the substrate 10.

[0098] Exemplarily, the first inorganic layer 31 and the second inorganic layer 33 can be made of inorganic materials such as nitride, oxide, oxynitride, nitrate, carbide or any combination thereof. The organic layer 32 can be made of materials such as acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene, etc.

[0099] In some examples, such as Figure 2 As shown, the display substrate 100 further includes: a plurality of retaining walls 4 disposed on one side of the back plate 1 and located in the peripheral area SS. The plurality of retaining walls 4 include at least one first retaining wall 4a and at least one second retaining wall 4b located on one side of the first retaining wall 4a close to the display area AA.

[0100] It should be pointed out that the encapsulation layer 3 is located on the side of the retaining wall 4 away from the back plate 1 .

[0101] The present invention does not limit the number of the first retaining wall 4a and the second retaining wall 4b, and the number can be selected according to actual needs.

[0102] For example, Figure 2 As shown, the distance between the substrate 10 and the side surface of the first retaining wall 4 a close to the substrate 10 is smaller than the distance between the substrate 10 and the side surface of the second retaining wall 4 b close to the substrate 10 .

[0103] It should be noted that, in the process of preparing the display substrate 100, the film layers included in the display substrate 100 are formed in sequence, which means that a portion of the first retaining wall 4a is prepared and formed before the second retaining wall 4b, and the thickness of the first retaining wall 4a can be greater than the thickness of the second retaining wall 4b.

[0104] Exemplarily, the number of the first retaining walls 4a ranges from 1 to 5, and the number of the second retaining walls 4b ranges from 1 to 10.

[0105] In some examples, the orthographic projection of the organic layer 32 on the backplane 1 is located within the orthographic projection range of a second retaining wall 4b on the backplane 1. The orthographic projection of a second retaining wall 4b on the backplane 1 is located within the orthographic projection range of the second inorganic layer 33 on the backplane 1.

[0106] Exemplarily, when there are multiple second retaining walls 4 b , the orthographic projection of the organic layer 4 b on the backplane 1 is located within the orthographic projection range of a second retaining wall 4 b among the multiple second retaining walls 4 b .

[0107] The present invention does not limit the projection relationship between the second inorganic layer 33 and the first retaining wall 4a, and can be selected according to actual needs. For example, the orthographic projection of the second inorganic layer 33 on the back plate 1 can be located within the orthographic projection range of the first retaining wall 4a on the back plate 1; or, the orthographic projection of the first retaining wall 4a on the back plate 1 is located within the orthographic projection range of the second inorganic layer 33 on the back plate 1.

[0108] It should be noted that the second barrier wall 4 b may be used to block the flow of the organic solution used to form the organic layer 32 from the display area AA to the peripheral area SS.

[0109] Since the second retaining wall 4b is closer to the display area (that is, closer to the light-emitting device 2) than the first retaining wall 4a, when preparing the organic layer 32, the organic solution can stop leveling before the second retaining wall 4b, so that the slope of the side of the prepared organic layer 32 is larger, and the surface of the side of the organic layer 32 away from the substrate 10 is closer to the surface parallel to the substrate 10, that is, flatter, thereby making the surface of the side of the encapsulation layer 3 away from the substrate 10 flatter.

[0110] Moreover, since the orthographic projection of the organic layer 32 on the back panel 1 is located within the orthographic projection range of a second retaining wall 4b on the back panel 1, and the orthographic projection of a second retaining wall 4b on the back panel 1 is located within the orthographic projection range of the second inorganic layer 33 on the back panel 1, it can be ensured that the orthographic projection of the organic layer 32 on the back panel 1 is located within the orthographic projection range of the second inorganic layer 33 on the back panel 1, that is, it can be ensured that the second inorganic layer 33 completely covers the organic layer 32, preventing water and / or oxygen from entering the interior of the display substrate 100 through the organic layer 32 to corrode the light-emitting device 2, thereby ensuring the encapsulation effect of the encapsulation layer 3 and avoiding encapsulation failure.

[0111] In the related art, when the organic layer is prepared by inkjet printing technology, the leveling boundary of the organic solution cannot be effectively controlled after the shrinking process, which causes the organic solution to easily overflow to the retaining wall, so that the portion of the encapsulation structure located in the display area and close to the display area and the portion located between the display area boundary and the retaining wall have a slope, and the slope is small and the size is large. Figure 2 and Figure 8 As shown by the dotted line in .

[0112] By setting the second retaining wall 4b, the organic solution can stop leveling before the second retaining wall 4b, so that the surface of the part of the organic layer 32 located in the display area AA and close to the display area AA away from the back panel 1 is a flat surface, and the part of the organic layer 32 located between the display area AA and the second retaining wall 4b has a larger slope and a smaller size.

[0113] In this way, when the display substrate 100 is applied to the display device 1000, and the display device 1000 includes the touch structure 200, as shown in FIG. Figure 8 or Fig. 9 As shown, in the process of preparing the touch signal line 22 of the touch structure 200 on the surface of the packaging layer 3 on the side away from the substrate 10, it can be ensured that the touch electrode layer 21 in the touch structure 200 is located on the side of the flat part of the packaging layer 3 (that is, the part located in the display area) away from the back panel 1, and in the process of etching the metal film used to form the touch signal line 22 (for example, using a photolithography process), it can be ensured that the photoresist located in the corresponding position of the frame area SS is completely removed, thereby avoiding the occurrence of metal residues, thereby avoiding the existence of metal connections between adjacent touch signal lines 22 due to the metal residues and the occurrence of short circuits after power-on.

[0114] In addition, the present invention can increase the width of the second retaining wall 4b, and when there are multiple second retaining walls 4b, the spacing between adjacent second retaining walls 4b can also be increased, so that the difficulty of etching the portion of the metal film used to form the touch signal line 22 corresponding to the second retaining wall 4b can be reduced, and metal residue can be further avoided. Of course, the present invention can also appropriately reduce the width of the first retaining wall 4a, and when there are multiple first retaining walls 4a, the spacing between two adjacent first retaining walls 4a can be appropriately reduced, thereby saving materials and reducing process difficulty.

[0115] Therefore, the display substrate 100 provided by some embodiments of the present invention, by setting the first retaining wall 4a and the second retaining wall 4b, makes the second retaining wall 4b closer to the display area AA than the first retaining wall 4a, and can use the second retaining wall 4b to block the organic solution used to form the organic layer 32, so that the organic solution stops leveling before the second retaining wall 4b, so that the orthographic projection of the organic layer 32 on the back plate 1 is located within the orthographic projection range of the second retaining wall 4b on the back plate 1, and the orthographic projection of the second retaining wall 4b on the back plate 1 is located within the orthographic projection range of the second inorganic layer 33 on the back plate 1, so that the second inorganic layer 33 can completely cover the organic layer 32, and prevent water and / or oxygen from corroding the light-emitting device 2 through the organic layer 32, thereby ensuring the packaging effect, avoiding packaging failure, and effectively improving the yield of the display substrate 100.

[0116] Moreover, after the organic solution stops leveling in front of the second retaining wall 4b by using the second retaining wall 4b, the portion of the organic layer 32 located between the display area AA and the second retaining wall 4b can have a larger slope and smaller size, and the surface of the portion of the encapsulation layer 3 located in the display area AA away from the substrate 10 can be flatter. In this way, when the display substrate 100 is applied to the display device 1000, and the display device 1000 includes a touch structure 200, the error of etching the metal film used to form the touch signal line 22 in the touch structure 200 can be reduced, thereby avoiding metal residue, and further avoiding the situation where metal connection between adjacent touch signal lines 22 due to metal residue occurs, and short circuit occurs after power is turned on, effectively improving the yield of the display device 1000.

[0117] The present invention does not limit the specific structures of the first retaining wall 4a and the second retaining wall 4b, and they can be configured according to actual needs.

[0118] In some examples, such as Figure 2 As shown, the first retaining wall 4a includes a plurality of first retaining wall patterns stacked in sequence, and the second retaining wall 4b includes a second retaining wall pattern, wherein one first retaining wall pattern corresponds to one film layer, and one second retaining wall pattern corresponds to one film layer.

[0119] That is to say, the number of film layers corresponding to the first retaining wall 4a is greater than the number of film layers corresponding to the second retaining wall 4b.

[0120] In some examples, such as Figure 2 As shown, among the multiple first retaining wall patterns included in the first retaining wall 4a, one first retaining wall pattern is disposed in the same layer as the planar layer 12, and another first retaining wall pattern is disposed in the same layer as the pixel defining layer 13. In this way, the one first retaining wall pattern and the planar layer 12 can be simultaneously formed in one patterning process, and the other first retaining wall pattern and the pixel defining layer 13 can be simultaneously formed in one patterning process, which is conducive to simplifying the preparation process of the display substrate 100.

[0121] For example, Figure 4As shown, in the case where the pixel driving circuit layer 11 also includes the second source-drain conductive layer 116, the planar layer 12 includes a first sub-planar layer 121 located between the first source-drain conductive layer 115 and the second source-drain conductive layer 116 and a second sub-planar layer 122 located on the side of the second source-drain conductive layer 116 away from the substrate 10. At this time, in the case where the first retaining wall 4a includes two first retaining wall patterns, one of the first retaining wall patterns is arranged in the same layer with the first sub-planar layer 121 or the second sub-planar layer 122, and the other first retaining wall pattern is arranged in the same layer with the pixel defining layer 13. In the case where the first retaining wall 4a includes three first retaining wall patterns, one of the first retaining wall patterns is arranged in the same layer with the first sub-planar layer 121 (not shown in the figure), another first retaining wall pattern is arranged in the same layer with the second sub-planar layer 122, and the third first retaining wall pattern is arranged in the same layer with the pixel defining layer 13.

[0122] In some examples, such as Figure 2 , Figure 3 and Figure 4 As shown, the second retaining wall pattern (ie, the second retaining wall 4b) is disposed in the same layer as the pixel defining layer 13. In this way, the second retaining wall 4b and the pixel defining layer 13 can be simultaneously formed in one patterning process, which is conducive to simplifying the preparation process of the display substrate 100.

[0123] In some examples, such as Figure 5 As shown, the retaining wall 4 includes: a plurality of first sub-sections 41 extending along the first direction X, a plurality of second sub-sections 42 extending along the second direction Y, and a plurality of third sub-sections 43 connecting adjacent first sub-sections 41 and second sub-sections 42. The intersection O of the extension lines of the adjacent first sub-sections 41 and second sub-sections 42 is located outside the boundary of the retaining wall 4. In this way, the stress concentration phenomenon in the third sub-section 43 of the retaining wall 4 can be avoided, thereby ensuring the stability of the retaining wall 4 structure.

[0124] Here, the number of the first sub-sections 41, the number of the second sub-sections 42 and the number of the third sub-sections 43 are related to the orthographic projection shape of the retaining wall 4 on the back plate. The present invention does not limit the number of each sub-section, and the specific setting can be selected according to actual needs.

[0125] Exemplarily, the orthographic projection shape of the retaining wall 4 on the back plate 1 is approximately rectangular.

[0126] At this time, each retaining wall 4 includes two first sub-sections 41 extending along the first direction X, two second sub-sections 42 extending along the second direction, and four third sub-sections 43. Each third sub-section 43 is connected to the adjacent first sub-section 41 and second sub-section 42.

[0127] Exemplarily, the orthographic projection shape of the retaining wall 4 on the back plate 1 is approximately in the shape of a Chinese character "concave".

[0128] At this time, each retaining wall 4 includes four first sub-sections 41 extending along the first direction X, four second sub-sections 42 extending along the second direction Y, and eight third sub-sections 43. Each third sub-section 43 is connected to adjacent first sub-sections 41 and second sub-sections 42.

[0129] The present invention does not limit the orthographic projection shapes of the first sub-section 41 , the second sub-section 42 and the third sub-section 43 on the back plate 1 , and they can be selected according to actual needs.

[0130] Optionally, the orthographic projection shapes of the plurality of first sub-sections 41 on the back plate 1 are the same. Alternatively, the orthographic projection shapes of the plurality of second sub-sections 42 on the back plate 1 are the same. Alternatively, the orthographic projection shapes of the plurality of third sub-sections 43 on the back plate 1 are the same.

[0131] Exemplarily, the orthographic projections of the plurality of first sub-portions 41 and the plurality of second sub-portions 42 on the back plate 1 are straight lines, and the orthographic projections of the plurality of third sub-portions 42 on the back plate 1 are rounded corners.

[0132] At this time, the orthographic projection shape of the retaining wall 4 on the back plate 1 is approximately rectangular. By setting the orthographic projection shapes of the first sub-section 41, the second sub-section 42 and the third sub-section 43 on the back plate 1, it is helpful to reduce the process difficulty of preparing and forming the retaining wall 4, and it is also helpful to improve the structural stability of the retaining wall 4.

[0133] It should be noted that, at a microscopic level, each sub-section itself has a relatively small width, and the present invention only ignores the width of each sub-section when describing the projection shape of each sub-section. Moreover, the width of each sub-section mentioned in the present invention refers to the minimum distance between the inner boundary (i.e., the boundary close to the display area AA side) and the outer boundary (i.e., the boundary away from the display area AA side) of each sub-section in the orthographic projection on the back plate 1.

[0134] It can be understood that the retaining wall 4 includes a first retaining wall 4a and a second retaining wall 4b, and the retaining wall 4 includes a first sub-section 41, a second sub-section 42 and a third sub-section 43, which means that the first retaining wall 4a includes a first sub-section 41a, a second sub-section 42a and a third sub-section 43a, and the second retaining wall 4b also includes a first sub-section 41b, a second sub-section 42b and a third sub-section 43b.

[0135] In some examples, the width c of the third subsection 43 of the retaining wall 4 is greater than the width a of the first subsection 41 of the retaining wall 4 , and the width c of the third subsection 43 of the retaining wall 4 is greater than the width b of the second subsection 42 of the retaining wall 4 .

[0136] That is, the width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width a1 of the first sub-portion 41a of the first retaining wall 4a. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width a2 of the first sub-portion 41b of the second retaining wall 4b. The width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width b1 of the second sub-portion 42a of the first retaining wall 4a. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width b2 of the second sub-portion 42b of the second retaining wall 4b.

[0137] In addition, for example, the width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width a2 of the first sub-portion 41b of the second retaining wall 4b. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width a1 of the first sub-portion 41a of the first retaining wall 4a. The width c1 of the third sub-portion 43a of the first retaining wall 4a is greater than the width b2 of the second sub-portion 42b of the second retaining wall 4b. The width c2 of the third sub-portion 43b of the second retaining wall 4b is greater than the width b1 of the second sub-portion 42a of the first retaining wall 4a.

[0138] In the process of preparing the cathode 2c of the light-emitting device 2, due to the inevitable process error, the portion of the cathode 2c corresponding to the third sub-portion 43 may be exposed. By increasing the width of the third sub-portion 43, so that the width of the third sub-portion 43 is greater than the width of the first sub-portion 41, and the width of the third sub-portion 43 is greater than the width of the second sub-portion 42, the probability of the first inorganic layer 31 directly contacting the exposed cathode 2c at the position corresponding to the third sub-portion 43 can be reduced, thereby avoiding the problem of film separation caused by direct contact between the first inorganic layer 31 and the cathode 2c, and improving the yield of the display substrate 100 and the display device 1000 used therein.

[0139] On this basis, the present invention does not limit the size relationship between a and b, the size relationship between a1 and a2, the size relationship between b1 and b2, and the size relationship between c1 and c2, and can be set according to actual needs.

[0140] In some examples, the width a of the first sub-portion 41 of the retaining wall 4 is equal to the width b of the second sub-portion 42 of the retaining wall 4 .

[0141] That is, a1 equals b1, and a2 equals b2.

[0142] Furthermore, for example, a1 is greater than b2, b1 is greater than a2, a1 is greater than a2, b1 is greater than b2, and c1 is greater than c2.

[0143] By setting the width a1 of the first sub-portion 41a of the first retaining wall 4a and the width b1 of the second sub-portion 42a of the first retaining wall 4a to be equal, and setting the width a2 of the first sub-portion 41b of the second retaining wall 4b and the width b2 of the second sub-portion 42b of the second retaining wall 4b to be equal, the process difficulty of preparing the first retaining wall 4a can be reduced, and the process difficulty of preparing the second retaining wall 4b can be reduced.

[0144] When the width a of the first sub-section 41, the width b of the second sub-section 42 and the width c of the third sub-section 43 of the retaining wall 4 satisfy the above-mentioned size relationship, the specific values ​​of the width a of the first sub-section 41, the width b of the second sub-section 42 and the width c of the third sub-section 43 can be selected according to actual needs, depending on the process capabilities and the size of the frame.

[0145] The width of the first sub-portion 41 may be in the range of 10 μm≤a<90 μm, the width of the second sub-portion 42 may be in the range of 10 μm≤a<90 μm, and the width of the third sub-portion 43 may be in the range of 10 μm<a≤90 μm.

[0146] For example, the width a of the first sub-portion 41 may be 10 μm, 30 μm, 50 μm, 70 μm or 89 μm, the width b of the second sub-portion 42 may be 10 μm, 30 μm, 50 μm, 70 μm or 89 μm, and the width c of the third sub-portion 43 may be 11 μm, 32 μm, 53 μm, 74 μm or 90 μm.

[0147] Optionally, the width of the first sub-portion 41 of the first retaining wall 4a is 40 μm, the width of the second sub-portion 42 of the first retaining wall 4a is 40 μm, and the width of the third sub-portion 43 of the first retaining wall 4a is 42 μm, 43 μm, 45 μm or 48 μm.

[0148] Optionally, the width of the first sub-portion 41 of the second retaining wall 4b is 30 μm, the width of the second sub-portion 42 of the second retaining wall 4b is 30 μm, and the width of the third sub-portion 43 of the second retaining wall 4b is 40 μm, 41 μm or 42 μm.

[0149] In some examples, such as Figure 5 As shown, the distance between the third subsections 43 of two adjacent retaining walls 4 is greater than the distance between the first subsections 41 of two adjacent retaining walls 4. The distance between the third subsections 43 of two adjacent retaining walls 4 is greater than the distance between the second subsections 42 of two adjacent retaining walls 4.

[0150] It should be noted that the “spacing” mentioned in this article refers to the minimum distance between the outer boundary of one of the two adjacent retaining walls 4 close to the display area AA in the orthographic projection on the back panel 1, and the inner boundary of the other retaining wall 4 away from the display area AA in the orthographic projection on the back panel 1.

[0151] In addition, “the third subsection 43 of two adjacent retaining walls 4” refers to the third subsection 43 of two adjacent retaining walls 4 that is in the same orientation relative to the display area AA. “The second subsection 42 of two adjacent retaining walls 4” refers to the second subsection 42 of two adjacent retaining walls 4 that is in the same orientation relative to the display area AA. “The first subsection 41 of two adjacent retaining walls 4” refers to the first subsection 41 of two adjacent retaining walls 4 that is in the same orientation relative to the display area AA.

[0152] It should also be noted that the above-mentioned "two adjacent retaining walls 4" include adjacent first retaining walls 4a and second retaining walls 4b. In the case where the number of first retaining walls 4a is multiple, the "two adjacent retaining walls 4" may include two adjacent first retaining walls 4a. In the case where the number of second retaining walls 4b is multiple, the "two adjacent retaining walls 4" may include two adjacent second retaining walls 4b.

[0153] Exemplarily, the spacing between the third subsections 43 of the two adjacent retaining walls 4 is greater than the spacing between the first subsections 41 of the two adjacent retaining walls 4, which may mean that the spacing between the third subsections 43a of the adjacent first retaining wall 4a and the third subsections 43b of the adjacent second retaining wall 4b is greater than the spacing between the first subsections 41a of the adjacent first retaining wall 4a and the first subsections 41b of the adjacent second retaining wall 4b, the spacing between the third subsections 43a of the two adjacent first retaining walls 4a is greater than the spacing between the first subsections 41a of the two adjacent first retaining walls 4a, or the spacing between the third subsections 43b of the two adjacent second retaining walls 4b is greater than the spacing between the first subsections 41b of the two adjacent second retaining walls 4b.

[0154] Exemplarily, the spacing between the third subsections 43 of the two adjacent retaining walls 4 is greater than the spacing between the second subsections 42 of the two adjacent retaining walls 4, which may mean that the spacing between the third subsections 43a of the adjacent first retaining wall 4a and the third subsections 43b of the adjacent second retaining wall 4b is greater than the spacing between the second subsections 42a of the adjacent first retaining wall 4a and the second subsections 42b of the adjacent second retaining wall 4b, the spacing between the third subsections 43a of the two adjacent first retaining walls 4a is greater than the spacing between the second subsections 42a of the two adjacent first retaining walls 4a, or the spacing between the third subsections 43b of the two adjacent second retaining walls 4b is greater than the spacing between the second subsections 42b of the two adjacent second retaining walls 4b.

[0155] The beneficial effects of the above structure are the same as the beneficial effects of the width of the third sub-section 43 being greater than the width of the first sub-section 41 and the width of the third sub-section 43 being greater than the width of the second sub-section 42 , and will not be repeated here.

[0156] On this basis, the present invention does not limit the size relationship between the spacing between the first sub-sections 41a of two adjacent first retaining walls 4a and the spacing between the first sub-sections 41b of two adjacent second retaining walls 4b, and the size relationship between the spacing between the second sub-sections 42a of two adjacent first retaining walls 4a and the spacing between the second sub-sections 42b of two adjacent second retaining walls 4b, and can be selected according to actual needs.

[0157] For example, the spacing between the first subsections 41a of adjacent first retaining walls 4a is equal to the spacing between the first subsections 41a of adjacent second retaining walls 4b, and the spacing between the second subsections 42a of adjacent first retaining walls 4a is equal to the spacing between the second subsections 42b of adjacent second retaining walls 4b. This helps to reduce the difficulty of the process.

[0158] In some examples, such as Figure 5 As shown, the distance between the first sub-portion 41b of the second retaining wall 4b and the display area AA is greater than the distance between the second sub-portion 42b of the second retaining wall 4b and the display area AA.

[0159] In this way, there is a larger usable space between the first sub-portion 41 b of the display substrate 100 and the display area AA, which facilitates the arrangement of more other structures.

[0160] Exemplarily, the distance between the first sub-portion 41b of the second retaining wall 4b and the display area AA is 3970 μm, and the distance between the second sub-portion 42b of the second retaining wall 4b and the display area AA is 2970 μm or 2750 μm.

[0161] In addition, illustratively, the distance between the third sub-portion 43b of the second retaining wall 4b and the display area AA is greater than the distance between the first sub-portion 41b of the second retaining wall 4b and the display area AA, and greater than the distance between the second sub-portion 42b of the second retaining wall 4b and the display area AA.

[0162] For example, the distance between a certain position of the third sub-portion 43b of the second retaining wall 4b and the display area AA is 4656 μm, 4678 μm, 4820 μm or 5000 μm.

[0163] In some examples, such as Figure 5 As shown, when the number of first retaining walls 4a and the number of second retaining walls 4b are multiple, the spacing between adjacent first retaining walls 4a and second retaining walls 4b is greater than the spacing between two adjacent first retaining walls 4a. The spacing between adjacent first retaining walls 4a and second retaining walls 4b is greater than the spacing between two adjacent second retaining walls 4b.

[0164] In the process of preparing the encapsulation layer 3, it can be known from the above content that since the display substrate 100 has the second retaining wall 4b, the organic layer 32 can stop leveling before the second retaining wall 4b, so the distance between the adjacent first retaining wall 4a and the second retaining wall 4b can be used to reflect the encapsulation boundary of the encapsulation layer 3 in the peripheral area SS. By making the first retaining wall 4a and the second retaining wall 4b have a larger distance, more process margin can be provided for the preparation of the second inorganic layer 33, so that not only can the second inorganic layer 33 be ensured to completely cover the organic layer 32, but also the boundary position of the encapsulation layer 3 in the peripheral area SS can be conveniently controlled, thereby providing an accurate reference position for subsequent processes.

[0165] The spacing between two adjacent first retaining walls 4a, the spacing between two adjacent second retaining walls 4b, and the spacing between adjacent first retaining walls 4a and second retaining walls 4b can be selected according to actual needs, depending on the process capability and the size of the frame.

[0166] Exemplarily, the interval between two adjacent first retaining walls 4a and the interval between two adjacent second retaining walls 4b may both range from 10 μm to 90 μm, and the interval between adjacent first retaining walls 4a and second retaining walls 4b may range from 100 μm to 300 μm.

[0167] For example, the spacing between two adjacent first retaining walls 4a is 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm or 90μm; the spacing between two adjacent second retaining walls 4b is 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm or 90μm; the spacing between adjacent first retaining walls 4a and second retaining walls 4b is 100μm, 150μm, 200μm, 250μm or 300μm.

[0168] Optionally, the spacing between the first sub-portions 41a of two adjacent first retaining walls 4a is 40 μm, the spacing between the second sub-portions 42a of two adjacent first retaining walls 4a is 40 μm, and the spacing between the third sub-portions 43a of two adjacent first retaining walls 4a is 42 μm, 43 μm, 45 μm or 48 μm.

[0169] Optionally, the spacing between the first sub-portions 41b of two adjacent second retaining walls 4b is 30 μm, the spacing between the second sub-portions 42b of two adjacent second retaining walls 4b is 30 μm, and the spacing between the third sub-portions 43b of two adjacent second retaining walls 4b is 40 μm, 41 μm or 42 μm.

[0170] Optionally, the spacing between the first subsection 41a of the adjacent first retaining wall 4a and the first subsection 41b of the adjacent second retaining wall 4b is 150 μm. The spacing between the second subsection 42a of the adjacent first retaining wall 4a and the second subsection 42b of the adjacent second retaining wall 4b is 150 μm. The spacing between the third subsection 43a of the adjacent first retaining wall 4a and the third subsection 43b of the adjacent second retaining wall 4b is 155 μm, 158 μm, 160 μm or 162 μm.

[0171] It should be pointed out that there is no limitation on the size relationship between the distance between two adjacent first retaining walls 4a and the distance between two adjacent second retaining walls 4b, and they can be selected according to actual needs.

[0172] Exemplarily, the distance between two adjacent first retaining walls 4a is equal to the distance between two adjacent second retaining walls 4b.

[0173] The present invention does not limit the ratio of the distance between two adjacent second retaining walls 4b to the width of the second retaining wall 4b, and the ratio can be selected according to actual needs.

[0174] In some examples, the ratio of the distance between two adjacent second retaining walls 4b to the width of the second retaining wall 4b is in a range of 1:9 to 9:1.

[0175] Exemplarily, the ratio of the interval between two adjacent second retaining walls 4b to the width of the second retaining wall 4b may be 1:9, 1:3, 1:1, 5:3, 6:1 or 9:1.

[0176] Wherein, when the spacing between two adjacent second retaining walls 4b is 10 μm and the width of the second retaining wall 4b is 90 μm, the ratio of the spacing between two adjacent second retaining walls 4b to the width of the second retaining wall 4b is 1:9. When the spacing between two adjacent second retaining walls 4b is 90 μm and the width of the second retaining wall 4b is 10 μm, the ratio of the spacing between two adjacent second retaining walls 4b to the width of the second retaining wall 4b is 9:1.

[0177] In some examples, such as Figure 2 As shown, the distance h between the surface of the second retaining wall 4 b away from the substrate 10 and the substrate 10 is smaller than the distance H between the surface of the first retaining wall 4 a away from the substrate 10 and the substrate 10 .

[0178] Based on the above structure, it can be ensured that in some extreme cases, the organic solution can stop flowing before the first retaining wall 31, thereby reducing the probability of packaging failure.

[0179] In some examples, when there are multiple second retaining walls 4b, among two adjacent second retaining walls 4b, relative to the back panel 1, the surface of a second retaining wall 4b close to the display area AA away from the back panel 1 is lower than the surface of a second retaining wall 4b away from the display area AA away from the back panel 1, or the two are level.

[0180] Based on the above structure, the organic solution can be effectively prevented from continuing to flow toward the frame area SS, thereby ensuring that the organic layer 32 can be located on the side of the second retaining wall 4 b close to the display area AA.

[0181] In some examples, such as Figure 2 As shown, when there are multiple first retaining walls 4a, among two adjacent first retaining walls 4a, relative to the back panel 1, the surface of a first retaining wall 4a close to the display area AA away from the back panel 1 is lower than the surface of a first retaining wall 4a away from the display area AA away from the back panel 1.

[0182] Based on the above structure, the difficulty of the organic solution passing over the first retaining wall 4a can be increased, thereby further ensuring that, in some extreme cases, the organic solution can stop flowing before the first retaining wall 4a, thereby reducing the probability of packaging failure.

[0183] In some examples, such as Figure 3 As shown, the display substrate 100 further includes: a power line VSS arranged in the same layer as the anode 2a.

[0184] In this way, the anode 2 a and the power line VSS can be simultaneously formed in one patterning process, which is beneficial to simplifying the manufacturing process of the display substrate 100 .

[0185] Here, if Figure 3 As shown, the power line VSS and the anode 2a are separated by the pixel defining layer 13, and there is no electrical connection between the power line VSS and the anode 2a. The cathode 2c can be connected to the power line VSS, so that the power line VSS provides a common voltage to the cathode 2c.

[0186] For example, Figure 3 As shown, the power line VSS is in direct contact with the second barrier rib 4b.

[0187] Since the power line VSS is disposed in the same layer as the anode 2a, and the second retaining wall 4b is disposed in the same layer as the pixel defining layer 13, the power line VSS is formed earlier than the second retaining wall 4b. The power line VSS may be located between the second retaining wall 4b and the back plate 1, and a portion of the surface of the power line VSS away from the back plate 1 may be in direct contact with a portion of the surface of the second retaining wall 4b close to the back plate 1.

[0188] In some examples, such as Figure 3As shown, among the above-mentioned multiple first barrier wall patterns, when one first barrier wall pattern is arranged on the same layer as the flat layer 12, and another first barrier wall pattern is arranged on the same layer as the pixel defining layer 13, the power line VSS can extend through the area where the second barrier wall 4b is located to the area where part of the first barrier wall 4a is located, and be inserted between the above-mentioned first barrier wall pattern and the other first barrier wall pattern.

[0189] Since the planar layer 12 is formed earlier than the power line VSS, and the power line VSS is formed earlier than the pixel defining layer 13, after the power line VSS is led out to the peripheral area SS, the power line VSS can pass through the area between the second retaining wall 4b and the back plate 1 and extend between one first retaining wall pattern and another first retaining wall pattern in the first retaining wall 4a.

[0190] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that: The display substrate has a display area and a peripheral area; the display substrate includes: A backplane, including a substrate; A plurality of retaining walls are disposed on one side of the back plate and located in the peripheral area; the plurality of retaining walls include at least one first retaining wall and at least one second retaining wall located on a side of the first retaining wall close to the display area; and An encapsulation layer is arranged on a side of the plurality of retaining walls away from the back plate; the encapsulation layer comprises a first inorganic layer, an organic layer, and a second inorganic layer which are stacked in sequence; Wherein, the orthographic projection of the organic layer on the backplane is located within the orthographic projection range of the second retaining wall on the backplane; The orthographic projection of the second retaining wall on the back plate is located within the orthographic projection range of the second inorganic layer on the back plate; The distance between a surface of one side of the first retaining wall close to the substrate and the substrate is smaller than the distance between a surface of one side of the second retaining wall close to the substrate and the substrate; A retaining wall comprises: a plurality of first sub-sections extending along a first direction, a plurality of second sub-sections extending along a second direction and a plurality of third sub-sections connecting adjacent first sub-sections and second sub-sections; the intersection of the extension lines of adjacent first sub-sections and second sub-sections is located outside the boundary of the retaining wall.

2. The display substrate according to claim 1, characterized in that: The first retaining wall includes a plurality of first retaining wall patterns stacked in sequence, and the second retaining wall includes a second retaining wall pattern.

3. The display substrate according to claim 2, characterized in that: The backplane comprises a substrate, a pixel driving circuit layer, a flat layer and a pixel defining layer which are stacked in sequence; Among the plurality of first retaining wall patterns, one first retaining wall pattern is disposed in the same layer as the planar layer, and another first retaining wall pattern is disposed in the same layer as the pixel defining layer; The second retaining wall pattern is disposed on the same layer as the pixel defining layer.

4. The display substrate according to claim 1, characterized in that: The orthographic projections of the plurality of first sub-portions and the plurality of second sub-portions on the back plate are straight lines; and the orthographic projections of the plurality of third sub-portions on the back plate are rounded corners.

5. The display substrate according to claim 1, characterized in that: The width of the third sub-portion is greater than the width of the first sub-portion; The width of the third sub-portion is greater than the width of the second sub-portion.

6. The display substrate according to claim 5, characterized in that: The width of the first sub-portion is equal to the width of the second sub-portion.

7. The display substrate according to claim 1, characterized in that: The distance between the third sub-sections of two adjacent retaining walls is greater than the distance between the first sub-sections of two adjacent retaining walls; The distance between the third sub-sections of two adjacent retaining walls is greater than the distance between the second sub-sections of two adjacent retaining walls.

8. The display substrate according to claim 1, characterized in that: The distance between the first sub-portion of the second retaining wall and the display area is greater than the distance between the second sub-portion of the second retaining wall and the display area.

9. The display substrate according to claim 1, characterized in that: When the number of the first retaining walls and the number of the second retaining walls are plural, The distance between adjacent first retaining walls and second retaining walls is greater than the distance between two adjacent first retaining walls; The distance between adjacent first retaining walls and second retaining walls is greater than the distance between two adjacent second retaining walls.

10. The display substrate according to claim 9, characterized in that: The distance between two adjacent first retaining walls ranges from 10 μm to 90 μm; The distance between two adjacent second retaining walls ranges from 10 μm to 90 μm; The distance between adjacent first retaining walls and adjacent second retaining walls ranges from 100 μm to 300 μm.

11. The display substrate according to claim 9, characterized in that: The ratio of the distance between two adjacent second retaining walls to the width of the second retaining wall is in a range of 1:9 to 9:

1.

12. The display substrate according to claim 1, characterized in that: A distance between a surface of the second retaining wall away from the back plate and the back plate is smaller than a distance between a surface of the first retaining wall away from the back plate and the back plate.

13. The display substrate according to claim 1, characterized in that: When there are multiple second retaining walls, Of the two adjacent second retaining walls, relative to the back plate, a surface of a second retaining wall close to the display area away from the back plate is lower than a surface of a second retaining wall away from the display area away from the back plate, or both are level.

14. The display substrate according to claim 1, characterized in that: When there are multiple first retaining walls, Of the two adjacent first retaining walls, relative to the back plate, a surface of a first retaining wall close to the display area on a side away from the back plate is lower than a surface of a first retaining wall away from the display area on a side away from the back plate.

15. The display substrate according to any one of claims 1 to 14, characterized in that: The display substrate further comprises: a plurality of light emitting devices located between the backplane and the encapsulation layer and located in the display area; the light emitting devices comprise an anode, a light emitting layer and a cathode which are sequentially stacked; Wherein, the display substrate further comprises: a power line arranged in the same layer as the anode, and the power line is in direct contact with the second retaining wall.

16. The display substrate according to claim 15, characterized in that: The backplane comprises a substrate, a pixel driving circuit layer, a flat layer and a pixel defining layer which are stacked in sequence; Among the multiple first barrier wall patterns, when one first barrier wall pattern is arranged on the same layer as the flat layer and another first barrier wall pattern is arranged on the same layer as the pixel defining layer, the power line extends through the area where the second barrier wall is located to the area where part of the first barrier wall is located, and is inserted between the one first barrier wall pattern and the other first barrier wall pattern.

17. A display device, characterized in that: include: The display substrate according to any one of claims 1 to 16.

18. The display device according to claim 17, characterized in that: The display device further includes: A touch control structure is arranged on a side of the packaging layer away from the back plate; the touch control structure comprises a touch control electrode layer and a plurality of touch control signal lines; The peripheral area of ​​the display substrate also includes a binding area; Wherein, the touch electrode layer is located in the display area of ​​the display substrate; One end of the touch signal line is electrically connected to the touch electrode layer; The other end of the touch signal line crosses over a plurality of retaining walls of the display substrate and extends to the binding area.

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